JPH03270039A - Inspection device - Google Patents

Abstract

PURPOSE:To position a substrate positively and enable electrical contacts having high precision, and to improve the high precision of inspection and the high efficiency of inspection by conducting positioning to the substrate by a positioning means again when the inclination of the substrate is detected by an inclination detecting means when the substrate is positioned. CONSTITUTION:A work 3 transferred is shifted onto work shifting pins 19 lifted from the inspection section 10 side. The tip sections of the work shifting pins 19 are inserted into positioning holes formed at the four corners of a support boat 8 in the work 3 at that time, thus positioning the work 3. When the work 3 is made to abut against only a contact sensor 41a mounted to a holding section 41 at that time, the positive positioning of the work 3 is decided. When the work 3 is made to abut against either of contact sensors 41b, on the contrary, imperfect positioning is decided because the work 3 is supported under an inclined state. Positioning by the work shifting pins 19 is performed again at that time.

Description

[Detailed description of the invention] [Purpose of the invention] (Industrial application field) The present invention relates to an inspection device for a subject.

(Prior Art) In the manufacturing process of various semiconductor devices using IC chips, etc., there is generally a probe test (-next inspection) performed at the stage when a large number of IC chips, etc. are formed on a semiconductor wafer, and, for example, A final test (secondary inspection) is conducted after packaging and commercialization.

By the way, QFP is a product in which IC chips, LSI chips (hereinafter referred to as chips), etc. are individually packaged.

In the secondary inspection of semiconductor devices represented by SOP, we use an inspection device (I
C handler), a so-called universal handler, etc. have been developed, and efforts are being made to shorten the number of inspection steps and improve inspection accuracy.

However, in recent years in the semiconductor field, in order to cope with the speeding up of various inspection processes, multiple functional chips are mounted on a multilayer ceramic substrate with internal wiring to create a modular chip array. Since the direct use of semiconductor modules as a semiconductor module is gradually increasing, there is a strong desire to support such secondary inspection of semiconductor modules.

Such secondary inspections of semiconductor modules include inspections of the bonding conditions of individual chips, wiring conditions within multilayer ceramic substrates, and inspections of the operating characteristics of the module, as well as the basic performance and human labor of each chip. Although it is also necessary to test the operating characteristics during the intermediate process from output to output, it is not sufficient to handle individual chips with different functions and standards (number of electrode pads, electrode pad arrangement, etc.).

(Problems to be Solved by the Invention) As mentioned above, a comprehensive inspection of a semiconductor module in which multiple chips of standard holes are mounted on a substrate with internal wiring and is made possible to operate as a module is required. In order to improve inspection accuracy, it is essential to electrically contact the probe bottle with the electrode pad of the chip with high precision, and it is necessary to develop a semiconductor module inspection device that satisfies such requirements. Highly desired.

The present invention was made to address these issues, and by reliably positioning the board, it is possible to make highly accurate electrical contact and improve high inspection accuracy and high inspection efficiency. The purpose is to provide an inspection device that can perform the following tasks.

[Structure of the Invention] (Means for Solving the Problems) In order to achieve the above object, the inspection device of the present invention performs inspection by bringing the inspection terminal into contact with the electrode terminals of a plurality of objects to be inspected provided on the substrate. In an apparatus for performing this, there is a transport means for holding a board set at a predetermined position and transporting the board to a position to be inspected, and after positioning the board by moving the board transported by the transport means, the transport means a positioning means for transferring the board from the substrate to the position to be inspected; a tilt detecting means for detecting the tilt of the board when the board is positioned by the positioning means; and a tilt detecting means for detecting the tilt of the board by the tilt detecting means. and a positioning control means for causing the positioning means to reposition the substrate when the positioning means is located.

(Function) In the inspection apparatus of the present invention, the positioning means moves and positions the substrate transported by the transport means, and then transfers the substrate from the transport means to a position to be inspected. At this time, if the tilt detection means detects the tilt of the board when the positioning means is positioning the board, the positioning control means causes the positioning means to reposition the board. Positioning can be performed reliably.

(Example) Hereinafter, an example of the present invention will be described with reference to the drawings.

1 and 2 are diagrams schematically showing the configuration of a semiconductor inspection apparatus according to an embodiment of the present invention, in which the apparatus main body 1 includes a workpiece 3 in which a semiconductor module 2 is in a state where it can be transported and inspected. A test section 10 that performs a predetermined test and a plurality of test contact terminals corresponding to a plurality of semiconductor elements (hereinafter referred to as chips) mounted on the semiconductor module 2 are accommodated, and these are replaced and aligned. Contact terminal supply section 2
It is composed of o.

A work loader portion 30 for loading and unloading the workpiece 3 is removably installed at the end of the apparatus main body 1 on the inspection section 10 side. Also, on the device main body 1,
Work loader part 30, inspection part 10. A workpiece transport mechanism 40 and a contact terminal moving mechanism 50 are mounted, which are movable along the parallel direction (hereinafter referred to as the X direction) of the contact terminal supply section 2 .

As shown in FIG. 3, the workpiece 3 is provided with a semiconductor module 2 configured by bonding a plurality of, for example, 36 chips 2a onto a multilayer ceramic substrate 2b having internal wiring.

At the bottom of the semiconductor module 2, a socket 4 and a socket board 5 are arranged, which are electrically connected to individual output pins (not shown).

Further, on the outer peripheral side of the semiconductor module 2, a presser plate 6 and an O-ring 7 are formed to be liquid-tight.

Between the semiconductor module 2 and the socket board 5, there are 4
A support board 8 having positioning holes 8a provided at corners is arranged.

The inspection section 10 has a tank outer wall 11a that is protruded from the upper surface side of the inspection section base 11 which is in contact with the base 1a of the apparatus main body 1.
It also has a liquid tank 13 formed by the cypress inner wall 11b, the mounting table 12, and the workpiece 3 itself with a seal made of, for example, neoprene rubber. Work 3 is clamp 14
It is tightly fixed to the workpiece mounting table 12 so as to form a liquid-tight seal. In addition, inside the inspection unit base 11,
A discharge pipe 16a for the non-conductive inert liquid 15 and a discharge pipe 16b for replacing the workpiece are provided. Further, below the opening of the mouth-shaped workpiece mounting table 12, a workpiece set base unit 17 and a lower alignment camera 18a are provided.
, 18b are placed side by side. Further, the mounting table 12 is provided with a workpiece transfer bin 19 that can be raised and lowered to transfer the workpiece 3 between the workpiece transport mechanism 40 and the workpiece mounting table 12.

Further, the contact terminal supply unit 20 includes a plurality of bin blocks 21
The contact terminal moving machine ttM 50 is configured with a plurality of, for example, nine, bin block changers 22 that individually hold the bin blocks 21, and a bin block correction camera 23 that confirms the position of the bin blocks 21 passed to the contact terminal moving machine ttM 50 side.

The bin block changer 22 includes a bin block 21
It is composed of a holding part 24 that holds the holding part 24, and a cylinder mechanism 25, for example, that raises this holding part 24 toward the contact terminal moving mechanism 50 side, and it individually raises the bottle blocks 21 to be used according to the inspection program. , is supplied to the contact terminal moving mechanism 50.

The work loader part 30 includes a loader part base 31 having a workpiece passing hole 31a which is removably arranged with respect to the base 1a of the apparatus main body 1, and a workpiece exchange position and the workpiece passing hole while accommodating the workpiece 3. The workpiece setting table 32 is configured to be movable between the workpiece set table 32 and the lower position of the workpiece transport mechanism 31a, and a workpiece lifting mechanism 33 that transfers the workpiece 3 to the workpiece transport mechanism 40. In addition, the upper surface of the loader partial base 31 is
It is flush with the upper surface of the base 1a of the apparatus main body 1, and on the upper surface of the loader partial base 31 and the base 1a of the apparatus main body 1, there are stage guides 30a, l connected in the X direction.
b is provided.

The work transport mechanism 40 includes the stage guide 30a,
lb along the X direction, and has a holding part 41 that holds the workpiece 3 lifted by the workpiece lifting mechanism 33.

This holding portion 41 is constituted by a pair of claws 42 that support the lower surface of the workpiece 3 and are movable back and forth in the X direction.

Further, as shown in FIG. 4, for example, this holding portion 41 is configured such that contact sensors 41a and 41b are provided on a surface opposite to the surface on which the chip 2a of the semiconductor module 2 is mounted.

The contact sensors 41a and 41b are arranged such that the contact sensor 41a contacts the center of the support board 8, and the contact sensor 41b contacts the corner of the support board 8.

Then, the workpiece transfer bin 19 of the workpiece mounting table 12 rises and fits into the positioning hole 8a, and when the workpiece 3 is positioned, each contact sensor 41a to the support board 8
Alternatively, the inclination of the workpiece 3 is detected by contact of 41b.

The above-mentioned contact terminal moving machine +M 50 is an X
stage 5], a mouth-shaped Y step 52 having a similar opening area disposed on the X stage, and an X stage 5 disposed within the openings of the X stage 51 and Y step 52. ing.

A measuring section 56 having a chuck section 54 and an upper alignment camera 55 is installed on the X stage 5]. Note that the chuck portion 54 is rotatable by a θ drive mechanism (not shown).

The measuring section 56 is provided with a non-conductive inert liquid introduction pipe 57 that is close to the chuck section 54 and connected to a cooling mechanism (not shown). Further, a touch plate is arranged on the upper part of the chuck part 54, and the pin block 21 and the tester are electrically connected by this touch plate.

Regarding the inspection procedure in the semiconductor measuring device with the above configuration,
This will be explained below with reference to FIG.

First, the work 3 is placed in the work accommodating portion 32a of the work setting table 32 in the work loader part 30, and the work setting table 32 is driven to move the work 3 to the delivery position above the work lifting mechanism 33. . Next, the lifting table 33a of the workpiece lifting mechanism 33
While positioning the workpiece 3, the workpiece 3 is raised to the position of the holding part 41 of the workpiece transport mechanism 40. After confirming that the workpiece 3 has risen, the workpiece 3 is lifted by the pair of pawls 42 of the holding part 41.
is retained.

Next, the work transport mechanism 40 is driven to transport the work 3 to the work transfer position above the work mounting table 12 of the inspection section 10. At this time, the contact terminal moving mechanism 50 moves toward the contact terminal supply section.

The workpiece 3 transported to the workpiece delivery position is inspected by the inspection section 10
The workpiece is transferred onto the workpiece transfer pin 19 raised from the side. At this time, the tip of one workpiece transfer pin is pushed into positioning holes provided at the four corners of the support board 8 for the workpiece 3, and the workpiece 3 is positioned.

At this time, if the workpiece 3 contacts only the contact sensor 41a provided on the holding part 41, it is determined that the workpiece 3 has been reliably positioned. On the other hand, when the workpiece 3 comes into contact with any of the contact sensors 41b, it is determined that the positioning of the workpiece 3 is incomplete because the workpiece 3 is supported in an inclined state.

In this way, if it is determined that the positioning is incomplete, repositioning is performed using one workpiece transfer bin.

After this, the workpiece transfer bin 19 is lowered and the workpiece transfer bin 19 is lowered.
A workpiece 3 is placed on the workpiece 2 and fixed liquid-tightly to the workpiece mounting table 12 by a clamp 14.
Electrical connection is made between the socket/soto board 5 and the work set base uni-soto 17 on the inspection section 10 side.

After the inspection is completed by the workpiece transfer bin 19, the workpiece 3 is transferred by the workpiece transport mechanism 40 that has been moved above the inspection section 10. Then, the work transport mechanism 40 is moved to the work loader part 30 to unload the work 3, and the series of inspection steps is completed.

In this way, in the semiconductor flFI fixing device of this embodiment, when the workpiece transported by the workpiece transport mechanism is positioned by the workpiece transfer bin, the inclination of the workpiece is determined by the contact sensor provided in the holding part of the workpiece transport mechanism. Detection is made so that reliable positioning can be performed.

[Effects of the Invention] As explained above, according to the semiconductor inspection device of the present invention, it is possible to reliably position the object to be inspected (thereby enabling highly accurate electrical contact, and achieving high inspection accuracy and high inspection efficiency). can be improved.

[Brief explanation of drawings]

1 and 2 are diagrams schematically showing the configuration of a semiconductor measuring device according to an embodiment of the present invention, and FIG.
A cross-sectional view showing a workpiece in which a semiconductor module to be inspected is fixed to a main device so that it can be transported and inspected. Figure 4 shows the installation state of a contact sensor that detects the inclination when positioning the workpiece. Figure 5 (a)
-(c) are diagrams for explaining the inspection procedure. DESCRIPTION OF SYMBOLS 1... Device body, 1a... Base, 2... Semiconductor module, 2a... Chip, 2b... Multilayer ceramic substrate, 3... Work, 4... Socket, 5...
・Socket board, 8...Support board, 8a...
・Positioning hole, 10... Inspection section, 11... Inspection section base, 12... Workpiece mounting table, 13... Liquid tank, 14.
... Clamp, 15 ... Non-conductive inert liquid, 19.
...Work transfer bin, 20...Contact terminal supply section, 21
... Pin block, 30 ... Work loader part, 4
0... Workpiece conveyance mechanism, 41... Holding section, 42...
- Pawls, 41a, 41b...contact sensor, 50...contact terminal moving mechanism,

Claims (1)

[Claims] In an apparatus that performs an inspection by bringing a test terminal into contact with the electrode terminals of a plurality of objects to be inspected provided on a board, the board is held at a predetermined position and the board is moved toward the position to be tested. a conveyance means for conveying; a positioning means for positioning the substrate by moving the substrate conveyed by the conveyance means; and a positioning means for transferring the substrate from the conveyance means to the position to be inspected; When
A tilt detecting means for detecting the tilt of the board, and a positioning control means for causing the positioning means to reposition the board when the tilt of the board is detected by the tilt detecting means. An inspection device featuring: