JPS6482540A - Prober - Google Patents

Prober

Info

Publication number
JPS6482540A
JPS6482540A JP24035887A JP24035887A JPS6482540A JP S6482540 A JPS6482540 A JP S6482540A JP 24035887 A JP24035887 A JP 24035887A JP 24035887 A JP24035887 A JP 24035887A JP S6482540 A JPS6482540 A JP S6482540A
Authority
JP
Japan
Prior art keywords
wafer
probing
positioning means
center
inspected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP24035887A
Other languages
Japanese (ja)
Other versions
JPH07111990B2 (en
Inventor
Itaru Takao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP62240358A priority Critical patent/JPH07111990B2/en
Publication of JPS6482540A publication Critical patent/JPS6482540A/en
Publication of JPH07111990B2 publication Critical patent/JPH07111990B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

PURPOSE:To enable the contact operation of a body to be inspected and a probing needle after the body to be inspected is positioned, and to conduct accurate inspection by providing an inspecting section for a probing device with the positioning means of the body to be inspected. CONSTITUTION:A wafer 2 is introduced to a pre-alignment section 16 by vacuum forceps from a wafer cassette 3 for a rotor section 4. The wafer 2 fed to a base plate 7 through a crank 25 is carried just under a probing card 5 for an inspecting section 6. A positioning means 8 is moved to the center of a probing needle 5a group in the probing card 5, and the positioning means 8 is positioned so that the center of the positioning means 8 and the center of the probing needle 5a group coincide. The wafer 2 is shifted in the X-axis direction and the Y-axis direction by the base plate 7 to the fixed positioning means 8, brought into contact with the probing needle 5a, and conducted with an external tester 28, thus detecting a crossing distance. Half the distance represents the central axis of the wafer. When the center of the wafer 2 is acquired, the size of a semiconductor is also set.
JP62240358A 1987-09-24 1987-09-24 PROBE METHOD AND DEVICE THEREOF Expired - Lifetime JPH07111990B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62240358A JPH07111990B2 (en) 1987-09-24 1987-09-24 PROBE METHOD AND DEVICE THEREOF

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62240358A JPH07111990B2 (en) 1987-09-24 1987-09-24 PROBE METHOD AND DEVICE THEREOF

Publications (2)

Publication Number Publication Date
JPS6482540A true JPS6482540A (en) 1989-03-28
JPH07111990B2 JPH07111990B2 (en) 1995-11-29

Family

ID=17058301

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62240358A Expired - Lifetime JPH07111990B2 (en) 1987-09-24 1987-09-24 PROBE METHOD AND DEVICE THEREOF

Country Status (1)

Country Link
JP (1) JPH07111990B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03270039A (en) * 1990-03-19 1991-12-02 Tokyo Electron Ltd Inspection device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003068808A (en) * 2001-08-27 2003-03-07 Tokyo Seimitsu Co Ltd Probing method and probing device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS595641A (en) * 1982-07-02 1984-01-12 Hitachi Ltd Prober
JPS60194535A (en) * 1984-02-22 1985-10-03 ケイエルエイ・インストラメンツ・コ−ポレ−シヨン Device for electrically controlling wafer inspecting unit

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS595641A (en) * 1982-07-02 1984-01-12 Hitachi Ltd Prober
JPS60194535A (en) * 1984-02-22 1985-10-03 ケイエルエイ・インストラメンツ・コ−ポレ−シヨン Device for electrically controlling wafer inspecting unit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03270039A (en) * 1990-03-19 1991-12-02 Tokyo Electron Ltd Inspection device

Also Published As

Publication number Publication date
JPH07111990B2 (en) 1995-11-29

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Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term