JPS6482540A - Prober - Google Patents
ProberInfo
- Publication number
- JPS6482540A JPS6482540A JP24035887A JP24035887A JPS6482540A JP S6482540 A JPS6482540 A JP S6482540A JP 24035887 A JP24035887 A JP 24035887A JP 24035887 A JP24035887 A JP 24035887A JP S6482540 A JPS6482540 A JP S6482540A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- probing
- positioning means
- center
- inspected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Tests Of Electronic Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
PURPOSE:To enable the contact operation of a body to be inspected and a probing needle after the body to be inspected is positioned, and to conduct accurate inspection by providing an inspecting section for a probing device with the positioning means of the body to be inspected. CONSTITUTION:A wafer 2 is introduced to a pre-alignment section 16 by vacuum forceps from a wafer cassette 3 for a rotor section 4. The wafer 2 fed to a base plate 7 through a crank 25 is carried just under a probing card 5 for an inspecting section 6. A positioning means 8 is moved to the center of a probing needle 5a group in the probing card 5, and the positioning means 8 is positioned so that the center of the positioning means 8 and the center of the probing needle 5a group coincide. The wafer 2 is shifted in the X-axis direction and the Y-axis direction by the base plate 7 to the fixed positioning means 8, brought into contact with the probing needle 5a, and conducted with an external tester 28, thus detecting a crossing distance. Half the distance represents the central axis of the wafer. When the center of the wafer 2 is acquired, the size of a semiconductor is also set.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62240358A JPH07111990B2 (en) | 1987-09-24 | 1987-09-24 | PROBE METHOD AND DEVICE THEREOF |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62240358A JPH07111990B2 (en) | 1987-09-24 | 1987-09-24 | PROBE METHOD AND DEVICE THEREOF |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6482540A true JPS6482540A (en) | 1989-03-28 |
JPH07111990B2 JPH07111990B2 (en) | 1995-11-29 |
Family
ID=17058301
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62240358A Expired - Lifetime JPH07111990B2 (en) | 1987-09-24 | 1987-09-24 | PROBE METHOD AND DEVICE THEREOF |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH07111990B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03270039A (en) * | 1990-03-19 | 1991-12-02 | Tokyo Electron Ltd | Inspection device |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003068808A (en) * | 2001-08-27 | 2003-03-07 | Tokyo Seimitsu Co Ltd | Probing method and probing device |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS595641A (en) * | 1982-07-02 | 1984-01-12 | Hitachi Ltd | Prober |
JPS60194535A (en) * | 1984-02-22 | 1985-10-03 | ケイエルエイ・インストラメンツ・コ−ポレ−シヨン | Device for electrically controlling wafer inspecting unit |
-
1987
- 1987-09-24 JP JP62240358A patent/JPH07111990B2/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS595641A (en) * | 1982-07-02 | 1984-01-12 | Hitachi Ltd | Prober |
JPS60194535A (en) * | 1984-02-22 | 1985-10-03 | ケイエルエイ・インストラメンツ・コ−ポレ−シヨン | Device for electrically controlling wafer inspecting unit |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03270039A (en) * | 1990-03-19 | 1991-12-02 | Tokyo Electron Ltd | Inspection device |
Also Published As
Publication number | Publication date |
---|---|
JPH07111990B2 (en) | 1995-11-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
EXPY | Cancellation because of completion of term |