TW201131178A - Inspecting device, manufacturing device, inspecting method and manufacturing method for wiring board - Google Patents

Inspecting device, manufacturing device, inspecting method and manufacturing method for wiring board Download PDF

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Publication number
TW201131178A
TW201131178A TW99136411A TW99136411A TW201131178A TW 201131178 A TW201131178 A TW 201131178A TW 99136411 A TW99136411 A TW 99136411A TW 99136411 A TW99136411 A TW 99136411A TW 201131178 A TW201131178 A TW 201131178A
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TW
Taiwan
Prior art keywords
wiring board
inspection
jig
defective
unit
Prior art date
Application number
TW99136411A
Other languages
Chinese (zh)
Other versions
TWI472779B (en
Inventor
Hironobu Okumura
Original Assignee
Ngk Spark Plug Co
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Filing date
Publication date
Priority to JP2009246827A priority Critical patent/JP2011095002A/en
Application filed by Ngk Spark Plug Co filed Critical Ngk Spark Plug Co
Publication of TW201131178A publication Critical patent/TW201131178A/en
Application granted granted Critical
Publication of TWI472779B publication Critical patent/TWI472779B/en

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Abstract

An objective is to provide an inspecting device, a manufacturing device, an inspecting method and a manufacturing method for a wiring board capable of enhancing accuracy in inspection. The inspecting device and the manufacturing device for the wiring board comprises: a plurality of jigs where wiring boards are arranged as objects to be inspected; an inspecting portion, performing electrical inspection on the wiring boards arranged on the jigs and determining whether the wiring boards are good or not; a transferring portion, provided with the plurality of jigs and intermittently transferring the jigs to the inspecting portion in sequence; a re-arranging mechanism, re-arranging the wiring board, which is determined defective according to an inspection result of the inspection portion, on another jig which is different from the jig on which the wiring board is arranged when performing the inspection.

Description

[Technical Field] The present invention relates to an inspection apparatus, a manufacturing apparatus, an inspection method, and a manufacturing method of a wiring board in which an electric circuit is formed on a main surface of a substrate such as a printed wiring board, and more particularly An inspection device, a manufacturing device, an inspection method, and a manufacturing method for an automated wiring board. [Prior Art] As the wiring board such as a printed wiring board is miniaturized, automation of testing (inspection) of the wiring board is promoted. A device for arranging the substrate fixtures on the rotary table along the circumference, and arranging the inspection machine according to the type of inspection on the peripheral portion of the rotary table, and rotating the rotary table for sequential inspection, as an automated wiring substrate inspection Method and apparatus (for example, refer to Patent Document 1). In the inspection apparatus described in Patent Document 1, the loading machine carries the printed wiring board into the substrate jig, and the printed wiring board on the substrate jig is sequentially transferred to the conduction inspection machine, the electric quantity inspection machine, and the appearance in response to the rotation of the rotary table. Each of the inspection machines individually inspects the printed wiring board. In such a test apparatus, it is known that the printed wiring board to be inspected is small, and as the thickness of the wiring is reduced, the inspection accuracy is deteriorated or the inspection yield is lowered. Here, referring to Figs. 6 to 8 , a mechanism in which a failure occurs in an inspection apparatus in which a plurality of wiring boards are arranged on a turntable and sequentially inspected is examined. As shown in FIG. 6 and FIG. 7 , in the inspection apparatus in which a plurality of wirings 201131178 are arranged on a rotating table and sequentially inspected, the fixture 133 that holds the wiring board includes, for example, a holding portion 136 that is recessed. The holding portion 136 has a spring member 137 inside. As a result, the wiring board ΡΙ3 is detachably fixed to the holding portion 136. The conductor pattern 形成 is formed on the surface of the wiring board, and the inspection unit 134 checks the conduction state of the conductor pattern 。. The inspection unit 134 has a probe 134a for conduction inspection, and a contact pin 134b (contact pins 134bi and 134b2) is disposed at an end of the probe 134a. The contact pin 134b is, for example, a case where the size of the wiring board is about 22 mm in length or width, or 45 [mm] x 22 [mm], and about 2000 pairs are disposed at the end of the probe 134a. Further, the contact pin 134b of the probe 134a was brought into contact with the wiring board Pm for about 1 second, and the conduction test of each wiring pattern was performed therebetween. Here, the mechanical precision of the structure of the jig 133 or the positional accuracy of the wiring substrate Ρ13χ held by the holding portion 136 of the jig 133 is determined by the relationship between the thickness of the probe used for inspection and the width of the conductor pattern Μ. Become a problem. As shown in FIG. 8, for example, when the width of the conductor pattern Μ is 7 5 //m, and the width of the contact pins 134bi & 134b2 of the probe is 50#m, the conductor pattern Μ and the contact pins 13 4b, and 134b2 The overlapping portion d becomes about 20 to 30, and even if a slight deviation occurs, the contact pin or 134b2 is deviated from the conductor pattern Μ. On the other hand, if the holding portion 136 of the jig 133 is not precisely fixed by using the spring member 137 or the like, the accuracy error can be reduced, and it takes time to carry in/out the wiring board ,, resulting in the use of the rotary table. 201131178 The benefits of the inspection device for sequential inspection are halved. [PRIOR ART DOCUMENT] [Patent Document 1] [Patent Document 1] JP-A-2002-340962 SUMMARY OF THE INVENTION [Problems to be Solved by the Invention] As described above, the wiring board is known as the inspection apparatus described in Patent Document 1. In the inspection apparatus, the manufacturing apparatus, the inspection method, and the manufacturing, there is a problem that the accuracy of the inspection target is affected by the accuracy of the inspection when the inspection object is placed on the rotary table or the like. In particular, when the size of the object is reduced, the width of the wiring line is made fine, and the external terminal is small, the area is small, and the machine that holds the inspection object when the inspection object is moved into the jig is placed, and the jig is accurately held. The problem of the accuracy is remarkable, and the inspection accuracy is deteriorated. Furthermore, there is a problem that the inspection yield is lowered due to the deterioration of the inspection. The present invention has been made to solve such a problem, and the object is to suppress the improvement. The inspection device, the manufacturing device, the inspection method, and the manufacturing method of the substrate, which are capable of improving the accuracy of the inspection object and the precision of the object to be inspected, and which can improve the inspection accuracy, are the means for solving the problem. In order to solve the problem, the wiring board inspection apparatus according to an aspect of the present invention includes: a plurality of jigs, a arranging plate to be inspected, and an inspection unit for inspecting the position of the wiring substrate disposed on the jig ΰ) Change the position of the ring to check the fine for a check line of the inspection line base line 201131178 gas check to determine the good or bad; transfer department, A plurality of the jigs are provided, and the jig is intermittently transferred to the inspection unit in a stepwise manner; and the re-arrangement mechanism is used to re-arrange the wiring substrate which is determined to be defective by the inspection result of the inspection unit, and the inspection unit. The fixtures are configured on different fixtures. Moreover, the apparatus for manufacturing a wiring board according to another aspect of the present invention includes: an electric ore processing unit that forms a solder bump on the wiring board; and a plurality of jigs in which the solder bump is formed by the plating processing unit; The wiring board; the inspection unit performs electrical inspection on the wiring board disposed on the jig to determine whether it is good or bad; and the transfer unit is provided with a plurality of the jigs and the jig is intermittently directed to the inspection unit. In the relocation mechanism, the wiring board which is determined to be a defective product by the inspection result of the inspection unit is placed again on the jig different from the jig disposed at the time of the inspection; the component mounting portion is inspected by the inspection unit. As a result, it was determined that the wafer component was mounted on the wiring board of the good product. Further, a method of manufacturing a wiring board according to another aspect of the present invention includes: forming a solder bump on a wiring substrate; and arranging a wiring board on which a solder bump is formed in a plurality of jigs; In the third determination project, the wiring board placed on the jig is sequentially inspected for electrical inspection to determine whether it is good or bad. The second determination project is to re-arrange the wiring board that is determined to be defective by the first determination project. In the jig in which the jig disposed at the time of the inspection is different, the wiring board placed on the jig again is inspected to determine whether it is good or bad; the wafer mounting project is subjected to the first determination project or the second determination project. It is judged that the wiring base 201131178 of the good product is mounted on the board. Moreover, in the method of manufacturing a wiring board according to another aspect of the present invention, the wiring board to be inspected is disposed in a plurality of jigs; and the first determination project is directed to the wiring substrate disposed on the jig In the second determination, the wiring board which is determined to be a defective product by the first determination project is placed again on the jig different from the jig mounted at the time of the inspection, and then re-arranged. The wiring board on the jig is inspected to determine the quality of the wiring board, and the wiring board which is judged to be good by the first determination project or the second determination project is carried out. [Effect of the Invention] According to the present invention, it is possible to provide an inspection apparatus, a manufacturing apparatus, an inspection method, and a manufacturing method of a wiring board capable of improving inspection accuracy. [Embodiment] Hereinafter, a device for manufacturing a wiring board according to an embodiment of the present invention will be described with reference to the drawings. The manufacturing apparatus of the wiring board of the present embodiment realizes a process of forming a conductor pattern layer on a substrate, and a process of arranging and connecting a predetermined component to the conductor pattern layer, and having a conductor pattern on the wiring substrate between the two projects. The project of poor open circuit (poor conduction). As shown in FIG. 1 , the manufacturing apparatus 1 of the wiring board of the present embodiment includes a pattern forming apparatus 10 in which a conductor pattern or a solder bump is formed on a wiring board, and a wiring board on which the conductor pattern is formed is placed. In the case of the inspection of the wiring board on which the conductor pattern is formed, the inspection apparatus 30 for determining the quality of the wiring board is placed, and the good product carrying tray 40 of the wiring board which is judged to be a good product by the inspection result is placed; The defective product carrying tray 45 of the wiring board of the good product, and the component mounting device 50 in which the wafer component is placed on the wiring board of the good product and wired. In addition, the inspection device 30 includes an inspection unit 34 that checks the quality of the conductor pattern formed on the wiring board in accordance with the conduction state, etc., and arranges the jig 33 for holding the wiring board and the jig 33 toward the inspection unit. The rotary table 32 that is intermittently transferred in sequence, the carry-in machine 31 that carries the wiring board from the loading tray 20 toward the jig 33 of the turntable 32, and the wiring substrate that has finished the inspection are carried out from the jig 33 of the turntable 32 toward the good product. The unloader 35 carried out by the tray 40 or the defective product carry-out tray 45 is used. The pattern forming apparatus 10 forms a predetermined pattern on the surface of the substrate, and forms a plating film on the pattern to form a conductor pattern, a solder bump, or the like. For example, the pattern forming apparatus 10 is configured to appropriately combine the openings of the substrate on which the conductor film of copper or the like is formed, the pattern formation (mask formation), the plating treatment, the etching treatment, the chemical treatment, and the solder bump formation. A wiring substrate is formed. In the present embodiment, a manufacturing apparatus for forming a conductor pattern on a substrate may be a device using a pattern forming method other than plating. The conductor pattern formed on the wiring board may be a multilayer substrate if at least the surface has an exposed portion. The loading tray 20 is a storage container in which a wiring board of a wiring board is placed, and the wiring substrate is formed with a conductor pattern 201131178 formed by the pattern forming apparatus 10. The wiring board on which the conductor pattern is formed is transferred from the pattern forming apparatus 1 to the loading tray 20 through a horizontal multi-joint robot arm (SCARA ROBOT) or the like. The inspection unit 34 is connected to the tester to check whether or not the conductor pattern formed on the wiring board is defective in conduction. The inspection unit 34 checks the conduction state of the designated position in response to the conductor pattern on the wiring board to determine whether it is good or bad. The turntable 32 is provided with an inspection table for holding the jig 33 of the wiring board, and the wiring board held by the jig 33 is sequentially transferred to the inspection device 34. When the turntable 32 is intermittently transferred to the inspection unit 34 in order, the rotary table 32 may be in the form of a belt conveyor or the like. The carry-in machine 3 1, for example, a horizontal multi-joint robot arm, carries the wiring board from the loading tray 20 toward the jig 3 3 of the turntable 32. The good carry-out tray 40 and the defective product carry-out tray 4 are the storage containers of the wiring boards on which the good and defective products are placed in the printed circuit board, which is the inspection. The carry-out machine 35 is, for example, a horizontal multi-joint robot. The wiring board that has been inspected is carried out from the jig 3 3 of the turntable 3 2 toward the good product carry-out tray 40 or the defective product carry-out tray 45. Further, the carry-out machine 35 also has a function of rearranging the wiring board which is determined to be a defective product by the inspection result, and the jig 33 which is different from the jig 33 disposed at the time of inspection. In the component mounting device 205, the wafer mounting device or the wiring project is performed on the wiring substrate on which the conductor pattern is formed, and the wafer substrate is mounted on the substrate for the good product. Wiring substrate. -10-201131178 Next, the inspection apparatus 30 in the apparatus for manufacturing a wiring board of the present embodiment will be described in detail with reference to Fig. 2 . The turntable 32 has a disk shape and is configured to be rotatable by a drive mechanism (not shown). The jigs 33a to 33h are arranged along the peripheral edge portion on the surface of the turntable 32, and the jigs 33a to 33h are sequentially intermittently transferred to the inspection portion 34 by the rotation of the turntable 32. The jigs 33a to 33h have a configuration in which the holding portions 36a to 36h having a recessed shape are formed, and the wiring board P can be placed. In the second drawing, the wiring boards P3a to p3f are mounted on the holding portions 36a to 36f of the tools 33a to 33f. The holding portions 36a to 36h have a configuration in which the wiring board P can be attached and detached by, for example, a spring member. The jigs 33a to 33h are sequentially transferred to the inspection unit 34 one by one in accordance with the rotation of the rotary table 32. For example, when the inspection of the wiring board P3d placed on the jig 33d to be inspected by the inspection unit 34 is completed in the second drawing, the turntable 32 will place the next wiring board P3 to be inspected. The jig 33c is transported to the inspection unit 34. In other words, when the inspection by the inspection unit 34 is completed (for example, about 1 second), the rotary table 3 2 is rotated, and the jig 33 is sequentially transported to the inspection unit 34, and the wiring board P is sequentially inspected. The carry-in machine 31 has arms 31a and 31b that are coupled to each other, and a holding mechanism 31c that is provided at the front end portion of the arm 31b and holds the wiring board. The loading machine 31 drives the arms 31a and 31b in response to an instruction signal from the control unit 55, and the holding mechanism 31c grasps the wiring board and moves it, and the 201131178 treats the wiring board from the loading tray 20 toward the rotating table 32. With 33 transfer. The loading tray 20 is provided with a wiring board on which the conductor pattern forming operation is completed in the previous stage of the project. In the second drawing, the wiring board P2 is placed on the housing portion 21 provided in the loading tray 20. Case. The unloading machine 35 is provided with arms 35a and 35b that are connected to each other, and a holding mechanism 35c that is provided at the front end portion of the arm 35b and holds the wiring board. The unloading machine 35 drives the arms 35a and 35b in response to an instruction signal from the control unit 55, and the holding mechanism 35c grasps the wiring board and moves it, thereby moving the wiring board from the jig 33 on the turntable 32 to the good product. The tray 40 or the defective product carry-out tray 45 is carried out. In the same manner as the loading tray 20, the good product carrying tray 40 has a wiring board on which the inspection unit 34 determines that it is a good product. In the case of the accommodating portion 41 provided in the good product carrying tray 4, it is determined that the wiring board Pw which is a good product is placed on the accommodating portion 41 provided in the good product carrying tray. The defective product carry-out tray 45 has the same shape as the loading tray 20 and includes a temporary portion 46 and a defective product storage portion 47. The temporary storage unit 46 is a storage area in which the inspection unit 34 determines that the wiring board of the defective product is temporarily placed. In the inspection apparatus 30 of the present embodiment, for example, when the inspection unit 34 determines that the wiring board p3f is a defective product, the unloader 35 carries out the wiring board p3f from the holding unit 36f of the jig 33f toward the temporary unit 46. Then, after the rotating table 32 is rotated and the wiring board is carried out from the holding portion 36e of the jig 33e, the unloading machine 35 reloads the wiring board P" accommodated in the temporary portion 46 into the holding portion 36e of the jig 33e. In the figure, the inspection unit 34 determines that the wiring board p46 which is a defective product is placed on the temporary portion 46. That is, the unloading unit 35 determines that the inspection unit 34 is The wiring board of the defective product is temporarily placed in the temporary portion 46, and is placed in a jig that is different from the jig that is held when the defective product is determined to be defective. This operation (relocation operation) cancels the holding portion of the jig 33. The difference in shape between the 36 and the wiring board P (phase) or the position error when the loading unit 31 carries the wiring board P. The carry-out unit 5 repeats the number of times the rearrangement operation of the wiring board P is repeated. In the case where the wiring board that is determined to be a defective product is placed on a different jig again and re-inspected (re-inspection is performed once), it is determined that it is a defective product even if it is placed on a different jig. The wiring board is again placed in different fixtures The re-inspection (re-inspection of the total of two times) is carried out. The defective product accommodating unit 47 receives the wiring board that has been determined to be a defective product by the re-arrangement operation for a predetermined number of times by the unloading machine 35 as a final defective product. In the second embodiment, the wiring board Pu that has been determined to be defective by the inspection unit 34 and is determined to be a defective product after being placed in the defective product storage unit 47 after being subjected to the relocation operation for a predetermined number of times is displayed. The control unit 55 is connected to the loading mechanism 31, the inspection unit 34, the unloader 35, and the rotation mechanism (not shown) of the rotary table 32, and transmits control signals to the loading unit 31. The control unit 55 is based on the loading timing of the loading machine 31 and the unloading machine. The relocation operation of the wiring board that is determined to be a defective product is controlled by the carry-out timing and the inspection unit 34. -13- 201131178 Next, the manufacturing apparatus of the wiring device according to the present embodiment will be described with reference to FIGS. 1 to 3 In the pattern forming apparatus 10, a predetermined wiring pattern is formed on the wiring board P, and a conductor layer of the wiring pattern is formed by a plating process or the like (step 60. Hereinafter, "S60" is used. Call). The wiring board P on which the conductor pattern is formed is placed on the accommodating portion 21 of the loading tray 20 by a horizontal multi-joint robot arm (not shown). When the wiring board P is placed on all of the storage units, the loading tray 20 is transferred to the vicinity of the loading point IN of the inspection apparatus 30 (S61). The control unit 55 monitors the jig 33 on the turntable 32 by a sensor or the like (not shown), and determines whether or not the holding portion 36 of the jig 33 at the loading point IN holds the wiring board P (the wiring board P is held). In the case where the jig 33) (S62) is located in the holding portion 36 (the holding portion 36a) of the jig 3 3 (for example, the jig 3 3 a ) at the loading point IN, there is no vacancy (the wiring board p is placed) In the case of "No" in S62, the control unit 55 instructs the loading machine 31 to perform the loading standby of the wiring board (component: PKG), and the loading machine 31 waits for the loading operation of the wiring board P (S63). After that, the control unit 55 rotates the turntable 3 by a predetermined amount, and then sends the jig 33 (the jig 33c) on which the wiring board P (the wiring board p3) to be inspected is placed to the inspection unit 34 (S64). The control unit 55 determines whether or not the wiring board p is located on the jig 33h of the loading point IN which is renewed by the rotation of the rotary table 32. (S62) -14- 201131178 Holding unit 3 of the jig 3 3 of the loading point IN When there is a vacancy (for example, the holding portion 3 6 h : S 6 2 YES), the control unit 5 5 instructs the carry-in machine 3 1 to carry in the wiring board, and the carry-in machine 1 1 to connect the wiring board P (for example, the wiring board P2) The holding unit 36 (for example, the wiring board p3b) is placed on the holding unit 36 (for example, the holding unit 36h). The jig 33 (for example, the jig 33b) is sent to the inspection unit 34 (S66). The inspection unit 34 checks the wiring board P held by the holding unit 36 of the jig 33 conveyed by the rotation of the turntable 32 (first Judgment item: S67) The inspection unit 34 determines whether the wiring board P is good or bad based on the inspection result, and sends the determination result to the control unit 55. At this time, the inspection unit 34 can control both the inspection result and the determination result. The part 5 5 is sent out, and the inspection result can be sent directly to the control unit 55. The control unit 5 5 determines itself. Thereafter, the inspection by the inspection unit 34 is performed interactively with the rotation of the rotary table 32. Here, the control unit 5 uses a sensor or the like (not shown), except for the rotary table. In addition to the jig 33 on the 32, the state of the temporary portion 46 is also monitored (S68). The wiring board P is not placed on the temporary portion 46 (NO in S68), and the jig placed at the carry-out point OUT is placed. When the wiring board P on the 33 is inspected by the inspection unit 34 and the result is judged to be good (YES in S69), the control unit 5 instructs the carry-out machine 35 to carry out as a good product, and the carry-out unit 5 5 carries the arm 3 5 a And the wiring board P placed on the jig 3 3 is carried out to the good carry-out tray 40 (S70). On the other hand, the wiring board P is not placed on the temporary portion 46 (-15- of S68) 201131178 "No") and the wiring board placed on the jig 3 of the 搬u T in the removal position is judged to be defective by the result of inspection by the inspection unit 34 ("No" of s 6 9)' The control unit 5 5 instructs the carry-out unit 35 to perform rearrangement as a defective product. The unloader 35 is a wiring board placed on the jig 33. When the wiring board ρ is inspected by the inspection unit 34 for more than a predetermined number of times, the unloading machine 35 carries the wiring board P toward the defective product storage unit 47. When the wiring board P on which the wiring board p is placed (Yes in S68) and placed on the jig 33 of the carry-out point OUT is judged to be good by the inspection result of the inspection unit 34 (Yes in S72) The control unit 55 instructs the carry-out machine 35 to carry out the relocation of the wiring board P placed on the temporary portion 46 as a good product. The unloading machine 35 carries out the wiring board P placed on the jig 33 to the good product carrying tray 40 (S73), and carries out the good product, and carries the wiring board P placed on the temporary portion 46 into the vacant space. The holding portion 36 of the jig 33 (S74). Figure 4 shows the construction of steps 73 and 74. In the figure, the wiring board P3f held by the holding portion 36f of the jig 33f is a good product, and the wiring board Pu held by the holding portion 36g of the jig 33g is placed in the temporary position. In the unit 46, the unloading machine 35 carries out the good wiring board P3f to the accommodating part 41 of the good product carrying-out tray 40, and arranges the wiring board p46 which is a defective product in the holding part of the jig 3 3f. In other words, the wiring board P which is determined to be defective is relocated to the jig 33 which is different from the jig 33 held during the inspection (this example is the next jig). In the case of the wiring board P on which the wiring board P is placed (Yes in S68), the wiring board P placed on the jig 33 located at the carry-out point OUT is inspected by the inspection unit 34. In the case of a defective product (NO in S72), the control unit 55 instructs the carry-out machine 35 to carry out the unloading as a defective product and to rearrange the wiring board P placed on the temporary portion 46. The unloading machine 35 exchanges the wiring board P placed on the jig 33 with the wiring board P placed on the temporary portion 46 (S75). At this time, the wiring board P is inspected by the inspection unit 34 as will be described later. When the number of times exceeds the specified number of times, the unloading machine 35 carries the wiring board P out to the defective product accommodating portion 47. Figure 5 is a diagram showing the construction of step 75. In the figure, the wiring board P3f held by the holding portion 36f of the jig 3 3f is determined to be defective, and the wiring board held by the holding portion 36g of the jig 33g is placed as a defective product at the time of inspection. In the temporary storage unit 46, the unloading machine 35 carries out the wiring board P 3 f which is determined to be a defective product toward the temporary portion 46, and rearranges the wiring board p46 which has just been determined to be a defective product in the jig 33f. Holding portion 36f. In other words, the wiring board P placed on the temporary portion 46 and the wiring board p held by the jig 33 are exchanged, and are placed in a jig 33 different from the jig 33 held at the time of inspection. The engineering from step 68 to step 75 is performed every time the rotary table 32 performs the rotation operation. The control unit 55 also monitors whether or not all of the wiring boards P (S76)' have been inspected (NO in S76), and repeats the process after the wiring board P of the step 62 is carried. In the process of the process from the step 62 to the step 75, the inspection unit 34 determines that the wiring board P of the good product is carried out toward the good product carry-out tray 40, and the wiring board P which is determined to be defective is The temporary portion 46 is moved out. In addition, the wiring board P carried out to the temporary portion 46 is in the next cycle (S6 6 ), and the inspection unit 34 performs the re-inspection (the second determination item: S67), and the good product is carried out (S70, S73). In the case of a defective product, the temporary placement unit 46 moves out and reconfigures (S71, S75). According to the above-mentioned items, the inspection unit 34 determines that the wiring board P of the defective product is temporarily moved toward the temporary portion 46, and is again disposed in the jig 3 3 different from the jig 3 at the time of inspection. In other words, the wiring board that has been determined to be a defective product is inspected by the inspection unit 34 a plurality of times while the holding conditions of the jig and the holding portion are changed. This is to reduce the defect judgment caused by the positional accuracy of the jig 33 or the holding portion 36, and to improve the accuracy of the wiring board. The number of times the wiring board P is inspected (the number of times the wiring board receives the rearrangement operation) is set in advance by the control unit 55, and the control unit 55 is the wiring board P held by the jig 33 of the turntable 32 and the corresponding wiring board P. The number of relocations is assigned to manage correspondingly. In other words, in the steps 71 and 75, when the wiring board p is inspected for more than a predetermined number of times and is judged to be defective, the unloading unit 35 carries the wiring board P toward the defective product storage unit 47. When the inspection of all the wiring boards P is completed (Yes in S76) or the wiring board P is accommodated in all the housing portions 41 of the good product carry-out tray 40, the good product carry-out tray 18 is not completed. - 201131178 The 40 is carried out toward the component mounting device 50 via a horizontal multi-joint robot (not shown) (S77). The component mounting device 205 completes the wiring substrate by disposing and connecting the wafer component or the terminal on the wiring of the wiring substrate P which is determined to be good (S78). As described above, according to the manufacturing apparatus of the wiring board of the present embodiment, since the inspection accuracy in the middle of the engineering can be improved, the product yield can be improved. Here, the number of times of rearrangement of the wiring substrate P is determined depending on the quality of the yield. The size of the temporary portion 46 (the amount of the wiring substrate that can be accommodated) is determined based on the average number of times of rearrangement of each wiring substrate. In the manufacturing apparatus and inspection apparatus of the wiring board of the embodiment shown in FIG. 1 and FIG. 2, the wiring board which determines the defective product is rearranged and re-inspected by changing the condition of the jig, so that the conventional method can be reduced. Bad judgment caused by the accuracy error that occurred. Further, the present invention is not limited to the above-described embodiments, and constituent elements may be modified and embodied in the scope of the gist of the invention in the implementation stage. Further, various inventions can be formed by appropriately combining a plurality of constituent elements disclosed in the above embodiments. For example, several constituent elements can be deleted from all the constituent elements shown in the embodiment. Further, the constituent elements in the different embodiments may be combined as appropriate. [Industrial Applicable Price] The present invention can be utilized in an electronic machine manufacturing industry. [Simple description of the map]
S -19-201131178 FIG. 1 is a block diagram showing a configuration of a device for manufacturing a wiring board according to an embodiment. FIG. 2 is a view showing a configuration of an inspection device for a wiring board according to an embodiment. The flow chart of the operation of the manufacturing apparatus and the inspection apparatus of the wiring board shown in Fig. 1 and Fig. 2 is the fifth diagram of the operation of the inspection apparatus of the wiring board shown in Fig. 2 Fig. 6 is a diagram showing the operation of the inspection apparatus of the wiring board shown in Fig. 2, and Fig. 7 is a diagram showing the configuration of the fixture of the inspection apparatus of the general wiring board. A diagram of the inspection of the wiring board inspection device. Figure 8 is a diagram of m /•*VN showing the inspection device using a general wiring board for inspection. [Main component symbol description] 1 Manufacturing apparatus 10 Pattern forming apparatus 20 Loading tray 30 Inspection apparatus 31 Loading machine 31 a, 3 1b Arm-20- 201131178 3 1c Holding mechanism 32 Rotating table 33 Fixture 3 3 a~ 33h Fixture 34 inspection unit 35 carry-out machine 35a' 35b arm 35c holding mechanism 3 6 a to 36h holding unit 40 good product carrying tray 41 accommodating portion 45 defective product carrying tray 46 temporary portion 47 defective product accommodating portion 50 component mounting device P 3 a ~ p3f Wiring board IN Loading position OUT Moving out point - 21 -

Claims (1)

  1. 201131178 VII. Patent application scope: 1. An inspection apparatus for a wiring board, comprising: a plurality of jigs, wherein a wiring board to be inspected is disposed; and an inspection unit that electrically conducts the wiring board disposed on the jig The inspection unit is provided with a plurality of the jigs, and the jig is intermittently transferred to the inspection unit in sequence; and the re-arrangement mechanism determines that the inspection result by the inspection unit is a defective product. The wiring board is again placed on a jig different from the jig disposed at the time of the above inspection. 2. The inspection apparatus of the wiring board according to the first aspect of the invention, wherein the relocation mechanism includes: a substrate temporary portion in which a wiring board that is determined to be defective by the inspection unit is temporarily disposed; The inspection unit determines that the wiring board of the defective product is carried out from the jig and is disposed in the substrate temporary portion, and the loading unit, and the wiring unit that is determined to be defective by the inspection unit and disposed in the substrate temporary portion is placed again. It is different from the jig that is configured during the above electrical inspection. 3. The inspection apparatus of the wiring board according to the second aspect of the invention, wherein the relocation mechanism further includes a substrate arrangement portion for final arrangement of the wiring substrate determined by the inspection unit as defective product-22-201131178, and is subjected to the inspection When it is determined that the wiring board of the defective product is determined to be a defective product by the predetermined number of times or more, the above-mentioned carrying-out mechanism carries out the wiring board which is determined to be a defective product over the predetermined number of times to the substrate arrangement portion. 4. A device for manufacturing a wiring board, comprising: a plating processing unit for forming a solder bump on a wiring substrate; and a plurality of jigs, wherein a wiring substrate on which a solder bump is formed by the plating processing portion is disposed; The unit is electrically inspected for the wiring board disposed on the jig to determine whether it is good or bad; the transfer unit is provided with a plurality of the jigs, and the jig is intermittently transferred to the inspection unit in sequence: The device re-arranges the wiring substrate 'determined as a defective product by the inspection result of the inspection unit to the above inspection A fixture configured when a different jig; parts mounting portion "determines the inspection result by the inspection unit is mounted on the wiring substrate wafer yield of parts. 5. A method of manufacturing a wiring board, comprising: forming a solder dot on a wiring substrate by a dot forming process; and disposing a wiring substrate on which a solder bump is formed in a plurality of -23 - 201131178 In the first determination project, the wiring board disposed on the jig is sequentially inspected for electrical inspection to determine whether it is good or bad. The second determination project is to re-determine the wiring substrate that is determined to be defective by the first determination project. In the jig that is different from the jig disposed at the time of the inspection, the wiring board placed on the jig again is inspected to determine whether it is good or bad; and the wafer mounting process is subjected to the first determination project or the aforementioned In the second determination project, it is determined that the wafer component is mounted on the wiring board of the good product. 6. The method of manufacturing a wiring board according to the fifth aspect of the invention, wherein the second determination system includes: carrying out a project, and transferring a wiring board determined to be a defective product by the first determination item to a substrate temporary portion; In the arrangement, the wiring board which is determined to be a defective product by the first determination project and transferred to the substrate temporary portion is placed again on a jig different from the jig disposed during the electrical inspection; and the determination project is The wiring board placed on the jig again by the above-described relocation process is electrically inspected to determine whether it is good or bad. 7. A method of inspecting a wiring board, comprising: arranging a wiring board to be placed on a plurality of jigs; and the first determining project sequentially performs a wiring board disposed on the jig -24-201131178 The second determination project is placed on the jig that is different from the jig mounted at the time of the inspection, and is placed on the jig that is different from the jig mounted at the time of the inspection. The wiring board that has been placed on the jig again is inspected to determine the quality of the wiring board, and the wiring board that has been judged to be good by the first determination project or the second determination project is carried out. -25-
TW99136411A 2009-10-27 2010-10-26 Inspecting device,manufacturing device,inspecting method and manufacturing method for wiring board TWI472779B (en)

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TWI497091B (en) * 2013-10-03 2015-08-21
CN112449495A (en) * 2019-08-27 2021-03-05 南通深南电路有限公司 Drilling detection method and drilling detection equipment

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JP5818524B2 (en) * 2011-06-16 2015-11-18 日置電機株式会社 Inspection device and inspection system

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JP3492793B2 (en) * 1994-12-28 2004-02-03 株式会社アドバンテスト Retest method for IC tester handler
JPH0943313A (en) * 1995-07-27 1997-02-14 Sony Corp Semiconductor test method
JP3008867B2 (en) * 1996-12-03 2000-02-14 日本電気株式会社 Semiconductor test apparatus and test method
JP4929532B2 (en) * 2001-05-11 2012-05-09 イビデン株式会社 Inspection method and inspection apparatus for printed wiring board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI497091B (en) * 2013-10-03 2015-08-21
CN112449495A (en) * 2019-08-27 2021-03-05 南通深南电路有限公司 Drilling detection method and drilling detection equipment

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