KR102643374B1 - Handler for testing semiconductor - Google Patents

Abstract

The present invention relates to a handler for semiconductor device testing that supports testing of semiconductor devices.
The handler for semiconductor device testing according to the present invention includes a loading table located between a loading plate or unloading plate and a test site; a first pick and place device that moves a semiconductor device to be tested from a customer tray placed on the loading plate to the loading table or moves a semiconductor device that has been tested from the loading table to a customer tray placed on the unloading plate; and a second pick and place device that moves semiconductor devices to be tested from the loading table to the test site or moves semiconductor devices that have completed testing from the test site to customer trays on the plurality of unloading tables. Includes.
According to the present invention, processing capacity is increased by quickly processing the logistics of semiconductor devices with short test times and minimizing tester preparation time despite the short test time.

Description

Handler for semiconductor device testing {HANDLER FOR TESTING SEMICONDUCTOR}

*The present invention relates to a handler for semiconductor device testing used when testing semiconductor devices.

A handler for semiconductor device testing (hereinafter referred to as 'handler') is equipment that electrically connects semiconductor devices manufactured through a certain manufacturing process to a tester and then classifies the semiconductor devices according to the test results.

Handlers can be manufactured in a variety of shapes to optimize the type of semiconductor device to be tested. Among such various types of handlers, technology related to the handler related to the present invention is disclosed through patent documents such as Korean Patent Publication No. 10-2002-0053406, 10-2014-0125465, and Japanese Patent Publication No. 2011-247908. .

The above conventional technologies have a structure in which a plurality of semiconductor devices held by a connection device (also known as an index head, device feeder, or compression device) are electrically contacted to a test socket at a test site at the same time. That is, the connection device grasps the semiconductor device from the loading side, moves it to the test site, and then pressurizes it to electrically connect the semiconductor device to the tester side. And when the test is completed, in order to electrically connect new semiconductor devices to be tested next to the tester side, it is necessary to move the tested semiconductor devices to the unloading side and then take the preparation time to hold the semiconductor devices to be tested from the loading side. Just do it. Of course, the tester will be shut down during this preparation time.

Meanwhile, testing of semiconductor devices can have either a fairly long test time or a very short test time of around 20 seconds, depending on the type.

In the case of a fairly long test time, the tester's operation rate is good even if there is some preparation time, but in the case of a very short test time, the tester's operation rate drops significantly because the preparation time is relatively long compared to the test time. Moreover, because the connecting device is equipped with a picker that can grip or release the semiconductor device, it has a complex structure and its weight increases, which reduces controllability and mobility, so preparation time has to be longer. And as the tester's operation rate decreases, the processing capacity naturally decreases, and this problem becomes more prominent as the tester's performance improves.

Therefore, there have been concerns about increasing the operation rate of the tester even when the test time is very short, and the present invention was also derived from these concerns.

The present invention is intended to provide a technology that can minimize preparation time by reducing the function of the connection device and enables history management of each semiconductor device.

A handler for semiconductor device testing according to the present invention to achieve the above object includes at least one loading stacker that accommodates a customer tray loaded with semiconductor devices to be tested; At least one loading plate on which customer trays from the loading stacker are placed; A plurality of unloading plates on which customer trays are placed for loading tested semiconductor devices; a loading table positioned between the at least one loading plate or the at least one unloading plate and a test site; A first device for moving a semiconductor device to be tested from a customer tray placed on the at least one loading plate to the loading table or moving a semiconductor device for which testing has been completed from the loading table to a customer tray placed on the at least one unloading plate. pick and place device; a second pick and place device that moves semiconductor devices to be tested from the loading table to the test site, or moves semiconductor devices that have been tested from the test site to a customer tray on the at least one unloading plate; a connecting device that electrically connects the semiconductor device placed on the test site to the tester by the second pick and place device; At least two unloading stackers accommodating customer trays loaded with test-completed semiconductor devices from the at least one unloading plate; and a control device that controls the first pick and place device, the second pick and place device, and the connecting device; Includes.

The loading table includes a first loading portion on which semiconductor devices to be tested coming from the loading plate by the first pick and place device are loaded; and a second loading portion where tested semiconductor devices coming from the test site are loaded by the second pick and place device. It includes, wherein the first pick and place device moves the semiconductor elements loaded on the second loading portion to the at least one unloading plate, and the second pick and place device moves the semiconductor devices loaded on the first loading portion. is moved to the test site, and the first loading portion and the second loading portion are divided into different areas.

The first pick and place device includes a first picker portion for grasping a semiconductor device to be tested from a customer tray placed on the loading plate and moving it to the first loading portion; and a second picker portion for gripping the semiconductor device for which testing has been completed in the second loading portion and moving it to a customer tray placed on the unloading plate. It includes, and the first picker part and the second picker part are divided into different areas.

The second pick and place device includes a first picker portion for grasping a semiconductor device to be tested in the first loading portion and moving it to the test site; and a second picker part for holding the semiconductor device that has been tested at the test site and moving it to the second loading part; It includes, and the first picker part and the second picker part are divided into different areas.

The control device holds the semiconductor device in the test site by the second picker portion while holding the semiconductor device in the first loading portion by the first picker portion, and then holds the semiconductor device in the test site by the first picker portion. The second pick and place device is controlled to place the gripped semiconductor device on the test site and then move the gripped semiconductor device from the test site to the second loading portion by the second picker portion. .

The loading table further includes a buffer portion on which semiconductor devices that need to be separated are loaded.

a moving device that moves the loading table between a first position adjacent to the loading plate or the at least one unloading plate and a second position adjacent to the test site; It further includes.

an identification device that identifies semiconductor devices loaded on the loading table at a predetermined point along the path along which the loading table moves by the moving device in order to manage information for each individual semiconductor device; It further includes.

The test site has (M A dog is provided.

The four test windows are arranged in two rows, top, bottom, left, and right, and one semiconductor device is electrically connected to the tester through one test window.

The test site, the loading table, and the second pick and place device are provided in plural numbers, the plurality of second pick and place devices operate independently of each other, and the semiconductor element is moved between the one test site and one loading table. is exclusively handled by a second pick and place device.

a plurality of moving devices respectively moving the plurality of loading tables between a first position adjacent to the loading plate or the at least one unloading plate and a second position adjacent to the plurality of test sites; It further includes, wherein at least one moving device among the plurality of moving devices moves at least one loading table among the plurality of loading tables in both left and right directions and forward and backward directions.

Buffer table for heating semiconductor elements or loading socket cleaning devices; has more

According to the present invention, the following effects are achieved.

First, by separating the functions of gripping, releasing, and moving semiconductor devices from the connection device, preparation time is reduced and processing capacity is improved.

Second, because the second pick and place device is separated from the connection device, it is lightweight, improving controllability and mobility.

Third, it becomes possible to manage the history of each semiconductor device.

1 is a conceptual plan view of a handler for testing semiconductor devices according to an embodiment of the present invention.
Figure 2 shows a schematic structure of the test site in the handler of Figure 1.
Figure 3 is a plan view of the loading table applied to the handler of Figure 1.
FIG. 4 is a reference diagram for explaining the operation of the mobile device applied to the handler of FIG. 1.
Figure 5 is a schematic diagram of a first pick and place device applied to the handler of Figure 1;
FIG. 6 is a schematic diagram of a second pick and place device applied to the handler of FIG. 1.
FIG. 7 is a configuration diagram of a control device applied to the handler of FIG. 1.

Hereinafter, preferred embodiments according to the present invention will be described, but for brevity of explanation, known or overlapping descriptions will be omitted or compressed as much as possible.

Figure 1 is a conceptual plan configuration diagram of a handler 100 (hereinafter abbreviated as 'handler') for testing semiconductor devices according to an embodiment of the present invention.

As shown in Figure 1, the handler according to the present invention includes three loading stackers (LS), two loading plates 110, four unloading plates 120, four loading tables 130, and four moving devices ( 141 to 144), 4 identification devices 150, buffer table (BT), first pick and place device 160, 4 second pick and place devices 170, 16 connection devices 180, 3 un It includes a loading stacker (US), a transfer device (TA), and a control device (CA).

Before explaining each of the above configurations, the test site (TS) of the handler 100 will first be described. The handler 100 in FIG. 1 has a total of four test sites (TS) at the rear.

Four test sites (TS) are located in a row at the rear and have the same structure. Figure 2 shows the schematic structure of one test site (TS). As shown in Figure 2, the test site (TS) has four test windows (TW) arranged in two upper and lower tiers and two left and right rows. The test window (TW) is provided to electrically connect the semiconductor device to the tester. The tester's test socket (S) is connected through each test window (TW). Therefore, a total of four semiconductor devices can be tested at one test site (TS). That is, the four semiconductor elements are placed on the four test sockets (S) each connected through the four test windows (TW) by the second pick and place device 170, and the four connection devices 180 are connected to each other. By pressurizing the semiconductor device in charge toward the test socket (S), the semiconductor device and the tester are electrically connected.

As above, in the handler 100 according to the present invention, the loading and unloading sides are arranged in the front, and four test sites (TS) are arranged side by side in the rear. Therefore, all four test sites (TS) are arranged side by side in the rear. Therefore, it is optimized for replacement of parts at the test site (TS), regular or frequent inspection, and repair when a problem occurs. Furthermore, depending on the implementation, each test site (TS) is equipped with a drawer-style structure that can be moved back and forth, and adding a locking device for stability greatly increases the convenience of after-sales service such as replacement of parts. In particular, considering that test sockets are frequently replaced depending on the type of semiconductor device to be tested, the test site (TS) is arranged in a row at the rear, greatly improving the convenience of work.

In addition, each of the four test sites (TS) has two tiers and two rows of test windows (TW), so that the left and right width of the equipment can be reduced to about half compared to the test windows (TW) being arranged long in one tier. In addition, by arranging the test window (TW) in multiple stages, the movement distance of the four second pick and place devices 170 in the left and right directions can be reduced, so the movement time of the second pick and place device 170 is saved accordingly. speed can be secured.

Of course, in this embodiment, the test window (TW) is provided in 2 tiers and 2 rows, but depending on the work environment or design conditions, the test window (TW) can be provided in M rows and N rows in one test site (TS). When M and N are preferably natural numbers greater than 1.

Next, each of the components mentioned above will be explained.

Three loading stackers (LS) are provided on the left front and accommodate customer trays loaded with semiconductor devices to be tested. Depending on the implementation, it is sufficient to have one or more loading stackers (LS).

Two loading plates 110 are provided on the right side of the loading stacker (LS), and customer trays from the loading stacker (LS) are placed. Depending on the implementation, one or three or more loading plates (LS) may be provided.

Four unloading plates 120 are provided side by side on the right side of the loading plate 110, and a customer tray is placed for loading the semiconductor devices for which testing has been completed. Since semiconductor devices for which testing has been completed must be classified according to test results, it is desirable to have at least one unloading plate 120. If only one is provided, it is necessary to place the customer tray somewhere else for sorting, or to classify and load the semiconductor devices for which testing has been completed by dividing the area of the customer tray placed on one unloading plate.

The four loading tables 130 are located between the two loading plates 110 and four unloading plates 120 at the front and four test sites (TS) at the rear. These four loading tables 130 have a first loading portion 131, a second loading portion 132, and a buffer portion 133 that are divided into different areas as shown in FIG. 3.

The first loading portion 131 is loaded with semiconductor devices to be tested coming from a customer tray placed on the loading plate 110 by the first pick and place device 160.

The second loading portion 132 is loaded with semiconductor devices that have completed testing from the test site TS by the second pick and place device 170.

In the buffer portion 133, a small number of semiconductor devices with different characteristics for characteristic testing are loaded, or semiconductor devices that are determined to be defective and need to be classified for a while are loaded. In addition, the buffer portion 133 may be used to load semiconductor devices to be temporarily put on hold in situations where there is a shortage of space on the loading side or a lack of space on the unloading side in the logistics flow, and the first loading portion 131 and the second loading portion The portion 132 alone may be used to secure insufficient loading area in situations where it is difficult to handle the loading of semiconductor devices.

In other words, the buffer portion can be used to load semiconductor devices that need to be processed separately.

The first loading portion 131, the second loading portion 132, and the buffer portion 133 as described above are provided with loading grooves 130a in which semiconductor devices can be loaded.

Of course, the loading table 130 is also provided in a corresponding number depending on how many test sites (TS) exist.

The four moving devices 141 to 144 each move the loading table 130 to a first position (P ₁ ) adjacent to the loading plate 110 or the unloading plate 120 and a first position adjacent to the test site (TS). Move between 2 positions (P ₂ , posterior to the first position). At this time, as shown in FIG. 4, the two moving devices 141 and 144 at both left and right ends move the loading table 130 in both the left and right directions and the forward and backward directions, and the remaining two moving devices in between move them. The devices 142 and 143 move the loading table 130 in charge only in the forward and backward directions. The reason for this is to prevent mutual interference between the four second pick and place devices 170 targeting the four loading tables 130. For this purpose, even when the buffer table (BT) is not provided, the gap between the two middle loading tables 130 provided between the two loading tables 130 on both left and right sides is longer than the gap between the remaining loading tables 130. It is preferable that they are spaced apart at a wide interval (A). For reference, when the two moving devices 141 and 144 on both ends move the loading table 130 from the first position (P ₁ ) to the second position (P ₂ ), the loading table 130 uses the identification device 150. ), _the loading table 130 _is moved in an "ㄴ" shape (see solid line) to pass under Since the loading table 130 does not need to pass below the identification device 150, it can also be preferably implemented to move diagonally (see dotted line) to save time.

The identification device 150 is provided to manage information for each individual semiconductor device and may be configured with a camera. And for this purpose, an identification code must be printed on the top surface of the semiconductor device. Of course, it is preferable that the identification device 150 is provided above the loading table 130 at a predetermined point on the movement path of the loading table 130 moved by the moving devices 141 to 144.

One buffer table (BT) is provided between the two loading tables 130 on the left and the two loading tables 130 on the right. Depending on the implementation, this buffer table (BT) may be provided to heat the semiconductor device before moving it to the loading table 130, or may be provided to load a socket cleaning device for cleaning the test socket (S). . If it is provided for the purpose of heating a semiconductor device, a heater (H) is provided in the buffer table (BT). Likewise, one or more buffer tables (BT) may be provided as needed.

The first pick and place device 160 moves the semiconductor device to be tested from the customer tray placed on the loading plate 110 to the first loading portion 131 of the loading table 130 at the first position (P ₁ ). Alternatively, semiconductor devices for which testing has been completed are sorted according to test results from the second loading portion 132 of the loading table 130 and moved to customer trays placed on the unloading plates 120. To this end, the first pick and place device 160 includes a first picker portion 161 and a second picker portion 162 divided into different left and right areas as shown in FIG. 5.

The first picker part 161 grasps the semiconductor device to be tested from the customer tray on the loading plate 110 and moves it to the first loading part 131 of the loading table 130 at the first position (P ₁ ). It is provided for this purpose and has 8 pickers (P) arranged in a 2 ㅧ 4 matrix that can adsorb and hold semiconductor devices or release them.

The second picker part 162 picks up the tested semiconductor device from the second loading part 132 of the loading table 130 at the first position (P ₁ ) and places it on the customer tray placed on the unloading plate 120. It is provided for movement and has 8 pickers (P) arranged in a 2 ㅧ 4 matrix that can adsorb and hold semiconductor devices or release them.

Of course, the first pick and place device 160 includes a left and right mover 163 for moving the first picker part 161 and the second picker part 162 in the left and right directions, and a back and forth mover 164 for moving the first picker part 161 and the second picker part 162 in the left and right directions. ), has a vertical mover 165 for lifting and lowering in the vertical direction. Here, the vertical mover 165 not only has a lifting distance for holding the semiconductor device from the loading table 130 or loading it on the loading table 130, but also has a first-stage test window (TW) and a second-stage test window (TW). It is equipped to secure the lifting distance to enable work on TW).

For reference, it may be sufficient for the first picker part 161 and the second picker part 162 to have one or more pickers (P) depending on the needs of the equipment.

The four second pick and place devices 170 move the semiconductor device to be tested from the first loading portion 131 of the loading table 130 at the second position (P ₂ ) to the test site (TS), or The semiconductor device for which testing has been completed is moved from the test site (TS) to the second loading portion 132 of the loading table 130. To this end, the second pick and place device 170 includes a first picker portion 171 and a second picker portion 172 divided into different left and right areas as shown in FIG. 6.

The first picker portion 171 is provided to hold the semiconductor device to be tested in the first loading portion 131 of the loading table 130 at the second position (P ₂ ) and move it to the test site (TS). , It has two pickers (P) that can adsorb and grip semiconductor devices or release the grip.

The second picker part 172 is provided to hold the semiconductor device for which testing has been completed at the test site (TS) and move it to the second loading part 132 of the loading table 130 at the second position (P ₂ ). , It has two pickers (P) that can adsorb and grip semiconductor devices or release the grip.

*Similarly, the second pick and place device 170 also includes a left and right mover 173 for moving the first picker part 171 and the second picker part 172 in the left and right directions, and a front and rear mover for moving the first picker part 171 and the second picker part 172 in the left and right directions ( 174), and has a vertical mover 175 for lifting and lowering in the vertical direction.

It may be enough for the first picker part 171 and the second picker part 172 of the second pick and place device 170 to have one or more pickers (P) depending on the needs of the equipment.

In addition, one second pick and place device 170 is exclusively responsible for the movement of semiconductor devices between one test site (TS) and one loading table 130. Accordingly, the four second pick and place devices 170 can operate independently of each other to individually move the semiconductor elements.

For reference, the spacing between semiconductor devices in the above customer tray, the spacing between semiconductor devices in the loading table 130, and the spacing between semiconductor devices in the test site (TS) may all be different. For this purpose, as is well known, the first pick and place device 160 and the second pick and place device 170 are preferably configured to vary the spacing between the pickers (P).

As shown in FIG. 2, 16 connection devices 180 are arranged in four test sites (TS) so that one connection device 180 can be positioned in the vertical direction in one test window (TW). Each connection device 180 presses downward the semiconductor device placed in the test socket (S) exposed upward through the test window (TW), thereby enabling the semiconductor device to be electrically connected to the tester.

The three unloading stackers (US) accommodate customer trays loaded with semiconductor devices for which testing has been completed from the unloading plate 120 on the left. Two or more such unloading stackers (US) may be provided as needed.

The transfer device (TA) is responsible for the movement of customer trays between the loading stacker (LS), loading plate 110, unloading plate 120, and unloading stacker (US).

The control device (CA) includes four moving devices 141 to 144, an identification device 150, a first pick and place device 160, four second pick and place devices 170, 16 connecting devices 180, and Controls the operation of the transfer device (TA). Here, the control device (CA) reads the identification code identified or photographed by the identification device 150, and then adds the test results to the existing history of the semiconductor device previously stored for each identified semiconductor device to form a database. It also performs tasks. For this purpose, the control device (CA) includes a confirmation unit (CA1), a storage unit (CA2), and a communication unit (CA3) as shown in the configuration diagram of FIG. 7.

The confirmation unit CA1 analyzes the identification code recognized by the identification device 150 and verifies the identifier for each semiconductor device and information about the corresponding semiconductor device.

The storage unit (CA2) stores the identifier and information for each semiconductor device confirmed in the verification unit (CA1) or stores information about test results from the tester.

The communication unit CA3 is provided to transmit identifiers and information for each semiconductor element stored or to be stored in the storage unit CA2 to the tester or to receive information from the tester.

Meanwhile, a 2D barcode can be used as an identification code. This identification code contains information about the identifier for the semiconductor device and the production conditions when producing the semiconductor device, and is printed on the semiconductor device by the manufacturer that produces the semiconductor device. Therefore, any form of media must be interpreted as a barcode if it contains information about the identifier for the semiconductor device and the production conditions when producing the semiconductor device.

Next, the operation of the handler 100 having the above-described configuration will be described. Here, since the test sites (TS), the loading tables 130, and the second pick and place devices 170 have the same configuration, for brevity of explanation, one test site (TS) , description of other parts is replaced by explaining only one loading table 130 and one second pick and place device 170.

The customer tray is moved from the loading stacker (LS) to the loading plate 110 by the transfer device (TA).

The first pick and place device 160 uses the first picker portion 161 to place the semiconductor device to be tested from the customer tray placed on the loading plate 110 onto the first pick and place of the loading table 130 at the first position (P ₁ ). 1 Move to the loading part (131).

The moving devices 141 to 144 move the loading table 130 to the second position (P ₂ ), and in this process, the identification device 150 individually identifies the semiconductor devices in order to manage the history of each semiconductor device. Identify. And the control device (CA) adds test information for the semiconductor devices individually recognized through identification information to the existing history of the semiconductor devices and records them in a separate database. In addition, in this process, the first pick and place device 160 is preferably implemented to wait after holding the semiconductor device to be tested from the customer tray placed on the loading plate 110 with the first picker portion 161.

When the loading table 130 is moved to the second position (P ₂ ), the second pick and place device 170 moves 2 from the first loading portion 131 of the loading table 130 using the first picker portion 171. After holding the semiconductor devices, wait in front of the test site (TS). At this time, the loading table 130 moves again to the first position (P ₁ ) and receives the semiconductor devices to be tested, previously held by the first pick and place device 160, into the first loading portion 131 and then places them in the first loading portion 131. You can move to position 2 (P ₂ ) and wait.

Later, in the four test windows (TW) of the test site (TS), the test of the previously placed semiconductor devices will be completed, and in response, the second pick and place device 170 will, for example, test the bottom two whose tests were completed first. After the two semiconductor devices for which testing has been completed in the windows TW are held by the second picker portion 172, the semiconductor devices held by the first picker portion 171 are placed in the two test windows TW. Then, the two semiconductor elements held by the second picker part 172 are moved to the second loading part 132 of the loading table 130, and the two semiconductor elements are held by the first picker part 171, and then the remaining semiconductor elements are moved to the second loading part 132 of the loading table 130. Work is also performed on the two test windows (TW) at the top. At this time as well, the loading table 130 moves to the first position (P ₁ ) as much as time allows, hands over the semiconductor device for which the test has been completed to the first pick and place device 160, and tests the semiconductor device from the first pick and place device 160. You can receive the semiconductor device that needs to be made. That is, the moving devices 141 to 144 are positioned at the first position (P ₁ ) and the second position (P) within an optimal situation that does not reduce the operation rate of the tester in supplying or recovering semiconductor devices to the test site (TS). ₂ ) It is desirable to implement the loading table 130 to move between the two.

Of course, when a semiconductor device is placed in the test socket (S) that the connection devices 180 are in charge of, they immediately electrically connect the semiconductor device to the test socket (S) so that a test on the semiconductor device can be performed.

In addition, the second pick and place device 170 uses the second picker portion 172 to hold the tested semiconductor device from the second loading portion 132 of the loading table 130 at the first position (P ₁ ). After that, it is moved to the customer tray on the unloading plate (120).

And when the customer tray in the unloading plate 120 is filled, the transfer device (TA) moves the customer tray to the unloading stacker (US), and the empty customer tray in the loading plate 110 is placed on the unloading plate ( 120).

As above, the loading table 130 has a first loading portion 131 and a second loading portion 132, and the first pick and place device 160 and the second pick and place device 170 also have a first picker portion ( By having 161 and 171 and second picker portions 162 and 172, the moving distance between the first pick and place device 160 and the second pick and place device 170 is minimized. Accordingly, the first pick and place device 160 and the second pick and place device 170 supply semiconductor devices to the loading table 130 or retrieve semiconductor devices from the loading table 130 by the time saving the moving distance. Since it can wait in a pre-prepared state, the time that the loading table 130 is waiting at the first position (P ₁ ) or the second position (P ₂ ) can also be minimized. Therefore, after recovering the existing semiconductor devices that have been tested at the test site (TS), all preliminary work to supply new semiconductor devices to be tested at the test site (T)S can be done while the existing semiconductor devices are being tested. do. Therefore, the second pick and place device 170 can always stand by in an optimal state, ready to retrieve or supply semiconductor devices from the test site (TS) at any moment. As a result, the time it takes for the connection device 180 to release the pressure of the existing semiconductor device at the end of the test and then pressurize the new semiconductor device can be minimized, ultimately maximizing the operation rate of the tester. .

In the above operation example, the case where the second pick and place device 170 grasps only two semiconductor devices from the loading table 130 at the second position (P ₂ ) using the first picker portion 171 has been described. Depending on the control, at the start of the operation or when all test windows (TW) of the test site (TW) are empty, both the first picker part 171 and the second picker part 172 are used to select the second position (P ₂ ), four semiconductor devices can be held at the same time from the loading table 130, and the above-described operation example can be followed from that point on.

For reference, when it is necessary to heat the semiconductor device, the first pick and place device 160 first moves the semiconductor device to the buffer table (BT). Accordingly, when the semiconductor elements are heated by the heater (H) of the buffer table (BT), the first pick and place device 160 moves the heated semiconductor elements from the buffer table (BT) to the first loading portion of the loading table 130. Move to (131). And the rest of the operation is done the same as mentioned above.

*In addition, heating of the semiconductor device may be necessary even during a short period of time during which the semiconductor device is moved while loaded on the loading table 130, and for this purpose, a heater is additionally installed in the buffer portion 133 of the loading table 130. In this case, the first pick and place device 160 loads the semiconductor device into the buffer portion 133.

Of course, if both the buffer table (BT) and the buffer portion 133 of the loading table 130 are capable of heating the semiconductor device, both may be used or may be used selectively depending on the type of temperature condition at the time of testing. will be.

Meanwhile, the first pick and place device 160 is socketed out due to a defect in the test socket (S), so the semiconductor device corresponding to the test socket (S) must be placed on standby, or the semiconductor device that needs to be retested must be placed on standby. The task of loading semiconductor devices that must be separately classified for predetermined reasons, such as having to be sorted, into the buffer portion 133 of the loading table 130 is also performed.

Furthermore, in cases where it is necessary to clean the test socket (S), such as in a situation where foreign matter such as dust is attached to the test socket (S) and the socket is out, the first pick and place device 160 is moved from the buffer table (BT) to the socket. The cleaning device is grasped and moved to the first loading portion 131 of the loading table 130 at the first position (P ₁ ). Then, when the loading table 130 moves to the second position (P ₂ ), the second pick and place device 170 moves the socket cleaning device in the first loading portion 131 to the test socket (S). Then, the connection device 180 presses the socket cleaning device, which has an adhesive material on its lower surface, downward, causing foreign substances in the test socket (S) to stick to the socket cleaning device. Of course, when the pressure on the socket cleaning device is released, the socket cleaning device moves to the buffer table (BT) by the operation of the second pick and place device 170, the moving devices 141 to 144, and the first pick and place device 160. is relocated to

As described above, the specific description of the present invention has been made by way of examples with reference to the accompanying drawings. However, since the above-described embodiments are only explained by referring to preferred examples of the present invention, the present invention is limited to the above-described embodiments. It should not be understood as limited, and the scope of rights of the present invention should be understood in terms of the claims described later and their equivalent concepts.

100: Handler for semiconductor device testing
LS: Loading stacker
110: loading plate
120: Unloading plate
130: loading table
131: first loading part 132: second loading part
133: buffer part
141 to 144: moving device
150: identification device
160: first pick and place device
161: first picker part 162: second picker part
170: second pick and place device
171: first picker part 172: second picker part
180: Connector
US: Unloading stacker
TS: Test site
TW: Test window

Claims (8)

At least one loading stacker that accommodates a customer tray loaded with semiconductor devices to be tested;
At least one loading plate on which customer trays from the loading stacker are placed;
At least one unloading plate on which a customer tray for loading tested semiconductor devices is placed;
a loading table positioned between the at least one loading plate or the at least one unloading plate and a test site;
a moving device that moves the loading table between a first position adjacent to the loading plate or the unloading plate and a second position adjacent to the test site;
A first device for moving a semiconductor device to be tested from a customer tray placed on the at least one loading plate to the loading table or moving a semiconductor device for which testing has been completed from the loading table to a customer tray placed on the at least one unloading plate. pick and place device;
a second pick and place device for moving a semiconductor device to be tested from the loading table to the test site or moving a semiconductor device that has been tested from the test site to the loading table;
a connecting device that electrically connects the semiconductor device placed on the test site to the tester by the second pick and place device;
At least two unloading stackers accommodating customer trays loaded with test-completed semiconductor devices from the at least one unloading plate;
an identification device that identifies semiconductor devices loaded on the loading table at a predetermined point along the path along which the loading table moves by the moving device in order to manage information for each individual semiconductor device; and
a control device that controls the mobile device, the first pick and place device, the second pick and place device, and the connecting device; Including,
When moving the loading table from the first position to the second position, the moving device moves the loading table so that it passes below the identification device, and moves the loading table from the second position to the first position. When moving, move the loading table so that it does not pass below the identification device.
Handler for semiconductor device testing. delete delete According to clause 1,
The path by which the moving device moves the loading table from the first position to the second position and the path by which the moving device moves the loading table from the second position to the first position are different.
Handler for semiconductor device testing. According to claim 1 or 4,
The moving device moves the loading table in an “L” shape when moving the loading table from the first position to the second position, and moves the loading table in a diagonal direction when moving the loading table from the second position to the first position. moving
Handler for semiconductor device testing. At least one loading stacker that accommodates a customer tray loaded with semiconductor devices to be tested;
At least one loading plate on which customer trays from the loading stacker are placed;
At least one unloading plate on which a customer tray is placed for loading tested semiconductor devices;
a loading table located between the loading plate or the at least one unloading plate and a test site;
A first device for moving a semiconductor device to be tested from a customer tray placed on the at least one loading plate to the loading table or moving a semiconductor device for which testing has been completed from the loading table to a customer tray placed on the at least one unloading plate. pick and place device;
a second pick and place device for moving a semiconductor device to be tested from the loading table to the test site or moving a semiconductor device that has been tested from the test site to the loading table;
a connecting device that electrically connects the semiconductor device placed on the test site to the tester by the second pick and place device;
At least two unloading stackers accommodating customer trays loaded with test-completed semiconductor devices from the at least one unloading plate; and
a control device that controls the first pick and place device, the second pick and place device, and the connecting device; Includes,
There are multiple test sites,
The plurality of test sites are arranged in a row behind the loading plate and the unloading plate.
Handler for semiconductor device testing. delete According to clause 6,
Each of the plurality of test sites has multiple test windows.
Handler for semiconductor device testing.