JP3164087B2 - Chip-shaped electronic component holder and chip-shaped electronic component electrode forming method using the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip-shaped electronic component holder and a method for forming an electrode of the chip-shaped electronic component using the same. More particularly, the present invention relates to a conductive material for forming an electrode at an intermediate portion of the chip-shaped electronic component. The present invention relates to an improvement in the form of a chip-shaped electronic component holder used when applying a conductive paste.

[0002]

2. Description of the Related Art FIG. 6 is a perspective view showing the appearance of a chip-shaped electronic component 1 which is of interest to the present invention.

A chip-shaped electronic component 1 shown in FIG. 6 includes end surface electrodes 2 formed on opposing end surfaces, and has a predetermined width on opposing side surfaces 3 and across each side surface 3. Are provided with side electrodes 4 formed respectively.

The end face electrode 2 and the side face electrode 4 are formed by applying a conductive paste to a predetermined region of the chip-shaped electronic component 1 and baking it.

[0005] The end surface electrode 2 is a chip-shaped electronic component 1.
Has an adjacent surface extension 5 that extends to a part of the adjacent surface adjacent to each of the end surfaces. Similarly, the side surface electrode 4 has an adjacent surface extension 6 extending to a part of the adjacent surface adjacent to each side surface 3 of the chip-shaped electronic component 1. These adjacent surface extensions 5 and 6 serve to improve the solderability when the chip-shaped electronic component 1 is mounted on a wiring board (not shown).

The chip-like electronic component 1 having such an appearance constitutes, for example, a three-terminal capacitor, an LC composite EMI filter, etc., and although not shown, includes circuit elements such as inductors and / or capacitors therein. Has formed.

In the chip-shaped electronic component 1 shown in FIG. 6, one of the side-surface electrodes 4 is formed on each side surface 3. However, depending on the type of the chip-shaped electronic component, two or more are formed. Sometimes.

In this specification, the term "chip-shaped electronic component" refers not only to a chip-shaped electronic component as a finished product, but also to a half-chip in which the end face electrode 2 or the side face electrode 4 is not yet formed. In some cases, it refers to chip-shaped electronic components as products.

A side electrode 4 is formed during the manufacture of the above-described chip-shaped electronic component 1. A method of forming such a side electrode 4 will be described with reference to FIGS. Methods are known.

FIG. 7 shows a chip-shaped electronic component holder 7 for holding a plurality of chip-shaped electronic components 1 on which side electrodes 4 are to be formed, and a conductivity to be provided for forming the side electrodes 4. FIG. 3 is a perspective view showing a paste table 9 for holding a paste 8 separated from each other. FIG. 8 is an enlarged view showing a state in which the holder 7 and the paste table 9 are brought close to each other with a cross section along the line VIII-VIII in FIG. 7, and FIG. 9 is along the line IX-IX in FIG. It is a figure which expands and shows the state which made the holder 7 and the paste stand 9 mutually approach with a cross section.

The holder 7 has a flat plate shape as a whole, and receives the plurality of chip-shaped electronic components 1 one by one with the side surface 3 of each chip-shaped electronic component 1 exposed. A plurality of holding holes 10 are provided so as to be distributed in rows and columns in a planar manner.

The holder 7 includes a holder main body 11 made of an elastic material such as an elastomer or rubber, and a core material 12 embedded in the holder main body 11 to reinforce the holder main body 11 and made of a rigid body such as stainless steel. And The above-described holding hole 10 is formed in a portion of the holder main body 11, and the core 12 has a plate-like bone portion provided with a through hole so as to pass around the holding hole 10.

Each holding hole 10 has a plane dimension slightly smaller than the cross-sectional dimension of each chip-shaped electronic component 1 received therein, and as shown by an arrow 13 in FIG. Each inserted chip-shaped electronic component 1
Are elastically held by the inner peripheral surface of each holding hole 10.

The paste table 9 is made of an elastic material such as an elastomer or rubber. The paste table 9 is provided with a conductive paste 8 to be applied to a region of a predetermined width on the side surface 3 of each chip-shaped electronic component 1 held in the holding hole 10 of the holder 7 and crossing the side surface 3. A plurality of filled grooves 14 are provided. Each groove 14
The plurality of holding holes 10 extend in the arrangement direction.

Thus, the holder 7 in which the chip-shaped electronic component 1 is inserted in each holding hole 10 is prepared, and the paste table 9 in which the conductive paste 8 is filled in the groove 14 is prepared. After that, the holder 7 and the paste table 9
Are relatively close to each other as shown by an arrow 15 in FIG. As a result, as shown in FIGS. 8 and 9, the conductive paste 8 in the groove 14 is
Is transferred onto the side surface 3.

After the conductive paste 8 to be the side electrode 4 is applied to one side surface 3 of each chip-shaped electronic component 1 as described above, the holder 7 and the paste base 9 are separated from each other, and After drying the applied conductive paste 8, the same process is repeated for the other side surface 3. Thereafter, each chip-shaped electronic component 1 is taken out of the holder 7 and a baking step of the conductive paste 8 is performed.
Thereby, the side surface electrode 4 is formed as shown in FIG.

Although not shown, the end face electrode 2 is different from the holder 7 in the size and shape of the holding hole, but the conductive paste is applied using a holder having a similar form. In addition, the order of performing the step of applying the conductive paste for the end face electrode 2 and the step of applying the conductive paste 8 for the side face electrode 4 may be performed in any order. Each baking process of the conductive paste for the end face electrode 2 and the conductive paste 8 for the side face electrode 4 is performed simultaneously.

[0018]

As described above with reference to FIG. 6, the end face electrode 2 and the side face electrode 4 are respectively
It has adjacent surface extensions 5 and 6. For example, with respect to the side surface electrode 4, in order to form the adjacent surface extension 6, when the conductive paste 8 is transferred from the paste base 9, the conductive paste is so formed as to reach from the side surface 3 to part of the adjacent surface. 8 must be transcribed. To make this possible, first, the chip-like electronic component 1 held by the holder 7 must be in a state where the side surface 3 is located at a position protruding from the opening surface of the holding hole 10.
When transferring the conductive paste 8 in the groove 14 of the paste table 9 to the chip-shaped electronic component 1,
The holder 7 and the paste table 9 must be brought close to each other to such an extent that the parts on both sides of 4 are pressed against the chip-shaped electronic component 1 and are elastically deformed.

As a result, as shown in FIG.
In some cases, the conductive paste 8 may adhere to a region adjacent to each holding hole 10. Such adhesion of the conductive paste 8 on the holder 7 hinders the next use of the holder 7, so that it is necessary to wipe it off after each use, and the work for that is relatively difficult. It is troublesome. Further, as described above, since the holder main body 11 of the holder 7 is made of, for example, an elastomer or rubber, it is deteriorated by a solvent or the like contained in the conductive paste 8 and shortens the life of the holder 7.

In order to avoid the above-described problem, it is conceivable to increase the degree of protrusion of the side surface 3 from the opening surface of the holding hole 10. Since both sides 3 have such a thickness that they can be exposed, and it is considered that the conductive paste 8 can be applied to each of the two sides 3 while being held by the holder. As described above, increasing the degree of protrusion of the side surface 3 from the opening surface of the holding hole 10 means reducing the thickness of the holder 7.

However, when the thickness of the holder 7 is reduced, the strength of the holder 7 itself becomes insufficient,
When the holding power of the chip-shaped electronic component 1 in the holding hole 10 becomes insufficient or the production of the holder 7 becomes difficult, the thickness is at most 0.
It can be thinned only to about 6 mm to 0.8 mm. Such a limitation on reducing the thickness of the holder 7 also leads to a limit on the size of the chip-shaped electronic component 1 that can be held by the holder 7 while sufficiently increasing the degree of protrusion of the side surface 3. More specifically, the dimension measured in the thickness direction of the holder 7 in the chip-shaped electronic component 1 needs to have a dimension of at least about 1.0 mm to 1.2 mm at a minimum, In the case of the small chip-shaped electronic component 1 having only a small size, it is substantially impossible to prevent the holder 7 from being stained by the conductive paste 7.

When a conductive paste for forming the end surface electrode 2 is applied, the chip-shaped electronic component 1 is held by a holder. Due to the larger dimensions between the sides 3, the problem as caused in connection with the side electrodes 4 described above is less serious.

Accordingly, an object of the present invention is to provide a holder for a chip-shaped electronic component and a chip-shaped electronic component using the same, which can solve the problems encountered when applying a conductive paste for forming side electrodes as described above. An object of the present invention is to provide an electrode forming method.

[0024]

SUMMARY OF THE INVENTION The present invention is first directed to a chip-shaped electronic component holder. The holder has a flat plate shape as a whole, and a plurality of holding holes for receiving each of the plurality of chip-shaped electronic components one by one in a state where a specific side surface of each chip-shaped electronic component is exposed. Each holding hole is provided so as to be distributed, and at least an inner peripheral surface of the holding hole is formed of an elastic material so that each chip-shaped electronic component is elastically held therebetween. The holder applies a conductive paste for forming an electrode to a region of a predetermined width on at least a specific side surface of each chip-shaped electronic component held in each holding hole and at least across the side surface. Used when

In such a chip-shaped electronic component holder, in order to solve the above-mentioned technical problem, in a region adjacent to each holding hole, a direction transverse to a conductive paste to be applied to form an electrode. Is provided with a concave portion having a width wider than the width of the conductive paste application region.

In the holder according to the present invention, preferably, the plurality of holding holes are arranged in a direction crossing the conductive paste, and the concave portions extend so as to connect adjacent holding holes.

Preferably, each holding hole is formed with a through-hole penetrating the chip-shaped electronic component holder in the thickness direction, whereby each chip-shaped electronic component held in each holding hole is formed by the aforementioned Both the specific side and the opposite side are exposed.

More preferably, the concave portion is provided so as to penetrate the chip-shaped electronic component holder in the thickness direction.

The holder preferably includes a holder body formed of an elastic material and forming a holding hole, and a rigid core material embedded in the holder body so as to reinforce the holder body.

The present invention is also directed to a method for forming an electrode of a chip-shaped electronic component using the holder for a chip-shaped electronic component as described above.

In this method of forming electrodes for a chip-shaped electronic component, a step of preparing a holder for a chip-shaped electronic component as described above, and exposing a specific side surface of each chip-shaped electronic component in each holding hole of the holder. So that it is in the state
A step of inserting these chip-shaped electronic components, and a process of inserting the chip-shaped electronic components onto an exposed specific side surface of each chip-shaped electronic component held in the holding hole of the holder and in a region of a predetermined width at least crossing the side surface. A step of preparing a paste base made of an elastic material having a groove filled with a conductive paste to be formed, and a holder and a paste holding a chip-shaped electronic component while making the recess of the holder face the groove of the paste base. A step of transferring the conductive paste in the groove onto a specific side surface of the chip-like electronic component while bringing the conductive paste in the groove relatively close to the base, thereby preventing the conductive paste in the groove from attaching to the holder; Is performed.

The holder prepared in the above-described electrode forming method has the following configuration, that is, as described above, a plurality of holding holes are arranged in a direction crossing the conductive paste, and the concave portions are adjacent to each other. In the case of a configuration extending so as to connect the holding holes, a paste base having a groove extending in the arrangement direction of the plurality of holding holes can be used.

[0033] In the electrode forming method according to the present invention, preferably, the step of inserting the chip-shaped electronic component includes:
The step of transferring the conductive paste is performed such that a specific side surface of each chip-shaped electronic component is located at a position protruding from an opening surface of each holding hole. The conductive paste is transferred so as to reach a part of the adjacent surface.

[0034]

1 to 4 illustrate an embodiment of the present invention. Here, FIG.
2 is a plan view showing a chip-shaped electronic component holder 21, FIG. 2 is a plan view showing a core material 22 provided in the holder 21 alone, and FIG. 3 is an enlarged view of a part of the holder 21. FIG. 4 is a perspective view, and FIG. 4 is a cross-sectional view taken along line IV-IV of FIG. 3 and corresponds to FIG. 9 described above.

The chip-like electronic component 1 and the paste table 9 prepared in this embodiment are substantially the same as those described above with reference to FIGS.
Regarding the chip-shaped electronic component 1 and the paste table 9, the above-mentioned reference numerals are used as they are.

As in the case of the conventional holder 7 described above, the holder 21 has a flat plate shape as a whole, and the holder 21 has the side surface 3 of each chip-shaped electronic component 1 exposed. A plurality of holding holes 23 for receiving the plurality of chip-shaped electronic components 1 one by one are provided so as to form a row and a column and be distributed in a plane.

The holder 21 has a holder body 24 made of an elastic material such as an elastomer or rubber.
And the holder body 2 so as to reinforce the holder body 24.
4 and a core material 22 made of a rigid body such as stainless steel. The holding hole 23 is formed in a part of the holder main body 24. As shown in FIG. 2, the core member 22 has a frame portion 25 constituting an outer peripheral portion of the holder 21 and a plate-like bone portion 26 provided with a through hole so as to pass around each holding hole 23. ing.

As described above, since the holding holes 23 are formed in the portion of the holder body 24 made of an elastic material, the inner peripheral surface of each holding hole 23 is made of an elastic material. Each holding hole 23 has a plane dimension slightly smaller than the cross-sectional dimension of the chip-shaped electronic component 1 inserted therein, as shown in FIG. 3, for example.
Each holding hole 23 has a structure for elastically holding each chip-shaped electronic component 1.

As shown in FIG. 6, such a holder 21 is provided on a side surface 3 of each chip-shaped electronic component 1 held in each holding hole 23 and in a region having a predetermined width across the side surface 3. It is used when applying a conductive paste 8 for forming the side electrode 4. At this time, the conductive paste 8
A concave portion 27 is provided in a region adjacent to each holding hole 23 of the holder 21 in order to prevent the conductive paste 8 from being undesirably attached to the holder 21. The concave portion 27 is located at an extended portion in a direction transverse to the conductive paste 8 to be applied to form the side electrode 4, and has a width wider than a width of a region where the side electrode 4 is to be formed.

In this embodiment, a plurality of holding holes 23
However, the recesses 27 are arranged in a direction crossing the conductive paste 8 as described above, and the recesses 27 extend so as to connect the adjacent holding holes 23.

In this embodiment, each holding hole 23 is formed with a through hole penetrating through the holder 21 in the thickness direction, whereby each chip-shaped electronic component 1 held in each holding hole 23 is The two opposing side surfaces 3 are both exposed. The recess 27 is provided so as to penetrate the holder 21 in the thickness direction.

In this embodiment, only a part of the bone portion 26 of the core 22 is left in the recess 27 provided so as to penetrate the holder 21 in the thickness direction.
2, so that the reinforcing effect of the holder main body 24 by the second member 2 is not diminished.

The chip-like electronic component 1 exposed as described above while being held by the holder 21
Each of the two side surfaces 3 is located at a position protruding from each opening surface of the holding hole 23.

After each chip-shaped electronic component 1 is inserted into each holding hole 23 in this manner, the holder 21 and the paste table 9 are moved relative to each other while the concave portion 27 of the holder 21 and the groove 14 of the paste table 9 face each other. Close proximity is performed. Thereby, the conductive paste 8 in the groove 14 is transferred onto the side surface 3 of the chip-shaped electronic component 1 and the adjacent surface thereof.
At this time, even if the groove 14 extends in the direction in which the plurality of holding holes 23 are arranged, the conductive paste 8 in the groove 14 at a position that does not face the side surface 3 of the chip-shaped electronic component 1 is as shown in FIG. As shown, since the conductive paste 8 is located in the concave portion 27, the conductive paste 8 does not adhere to the holder 21.

After the conductive paste 8 serving as the side electrode 4 is applied to the one side surface 3 of the chip-shaped electronic component 1 and the adjacent surface thereof, the conductive paste 8 is dried. Thereafter, the holder 21 is turned over to form the side electrode 4 on the other side surface 3 and the adjacent surface of the chip-shaped electronic component 1 while being held by the same holder 21, and the same steps as described above are repeated. It is. In addition, the drying process of the conductive paste 8 may be performed by applying the conductive paste 8 on both side surfaces 3 of the chip-shaped electronic component 1 and then simultaneously performing the conductive paste 8 on the both side surfaces 3. Good.

Next, the end face electrode 2 of the chip-shaped electronic component 1
In the case where the conductive paste has not been applied yet, the step of applying the conductive paste is performed. Then, finally, the chip-shaped electronic component 1 is taken out from the holder 21 or the holder used for forming the end face electrode 2, is subjected to a baking process, and as shown in FIG. The chip-shaped electronic component 1 on which the electrodes 4 are formed is obtained.

In the holder 21 described above, the core material 22
A part of the bone portion 26 is exposed in the concave portion 27, but the bone portion 26 may be covered with a material constituting the holder main body 24 to such an extent that the formation of the concave portion 27 is not hindered.

The core material 2 provided in the holder 21 described above
2 has a bone portion 26 shaped to pass around each of the holding holes 23, as shown in FIG. 2, but a plurality of holding holes arranged like a core material 22a shown in FIG. 23-1
Bone portion 2 shaped so as to surround the row as one
6a may be provided.

The holder 21 according to the embodiment shown in the drawings.
Since the plurality of holding holes 23 are arranged in a direction crossing the conductive paste 8 to be applied for forming the side electrode 4, the concave portions 27 connect the adjacent holding holes 23 with each other. Although extended, depending on the arrangement of the plurality of holding holes, it may be sufficient that the recess is formed only in a region adjacent to each holding hole.

In the illustrated embodiment, the holding holes 23
Is formed with a through-hole penetrating the holder 21 in the thickness direction, whereby each chip-shaped electronic component 1 held in each holding hole 23 exposes both side surfaces 3 facing each other. The holding hole may be formed, for example, with a concave portion having a bottom.

In the illustrated embodiment, the recess 27 is
Although provided so as to penetrate the holder 21 in the thickness direction,
This may also be provided in a state with a bottom.

In the illustrated embodiment, as shown in FIG. 6, one side electrode 4 is formed on each side 3 of the chip-shaped electronic component 1, but two or more side electrodes are formed. The present invention can be applied to the case of forming. Further, in the illustrated embodiment, the side surface electrode 4 has a simple band shape crossing the side surface 3, but may have another shape as long as it crosses at least the side surface 3.

[0053]

As described above, according to the present invention, in the holder for a chip-shaped electronic component, a region adjacent to each holding hole and crossing the conductive paste to be applied to form an electrode. Is provided with a recess having a width wider than the width of the electrode, so that even if a conductive paste is applied across the side surface of the chip-shaped electronic component, the holder is contaminated by the conductive paste. There is no.

Therefore, the work of wiping the conductive paste undesirably adhered to the holder is not required, and the electrodes of the chip-shaped electronic component can be formed efficiently, and the life of the holder is extended. can do.

Further, while preventing the conductive paste from being undesirably adhered to the holder by the concave portion, the conductive paste is provided so as to reach from the specific side surface of the chip-shaped electronic component to a part of the adjacent surface adjacent to the side surface. Since the paste can be satisfactorily transferred from the paste table, an electrode having excellent solderability can be reliably formed.

Further, even when a chip-shaped electronic component having a small size is handled, the conductive paste can be prevented from being attached by the concave portion while the thickness of the holder is sufficiently maintained. Therefore, it is possible to handle small-sized chip-shaped electronic components without being bothered by contamination by the conductive paste.

In the holder for a chip-shaped electronic component according to the present invention, each holding hole is formed with a through-hole penetrating in the thickness direction, whereby each chip-shaped electronic component held in each holding hole faces each other. When both side surfaces are exposed, a conductive paste for forming electrodes can be applied to both opposing side surfaces of the chip-shaped electronic component while being held by the holder. Therefore, the conductive paste can be applied to each side surface of the chip-shaped electronic component without the step of transferring the chip-shaped electronic component to another holder, and the efficiency of electrode formation can be improved.

When the recess is provided so as to penetrate the holder in the thickness direction, even if the holder has a small thickness, the recess for reliably preventing the conductive paste from being undesirably adhered can be reliably formed. Can be provided.

[Brief description of the drawings]

FIG. 1 is a plan view showing a chip-shaped electronic component holder 21 according to an embodiment of the present invention.

FIG. 2 is a plan view showing only a core member 22 provided in a holder 21 shown in FIG.

FIG. 3 is an enlarged perspective view showing a part of a holder 21 shown in FIG. 1, showing a state where the chip-shaped electronic component 1 is inserted into a holding hole 23.

FIG. 4 is an enlarged view showing a state in which the holder 21 and the paste table 9 are brought close to each other with a cross section taken along line IV-IV in FIG. 3;

FIG. 5 is a view corresponding to FIG. 2, and is a plan view showing a core material 22a provided in a holder according to another embodiment of the present invention.

FIG. 6 shows a chip-shaped electronic component 1 of interest to the present invention.
FIG.

FIG. 7 shows a holder 7 for explaining a conventional electrode forming method.
FIG. 2 is a perspective view showing the paste table 9 and the paste table 9 separated from each other.

8 is an enlarged view showing a state in which the holder 7 and the paste table 9 are brought close to each other with a cross section along the line VIII-VIII in FIG. 7;

FIG. 9 is an enlarged view showing a cross section taken along line IX-IX of FIG. 7 in a state where the holder 7 and the paste table 9 are brought close to each other.

FIG. 10 is a plan view of a holder 7 for describing a problem to be solved by the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Chip-shaped electronic component 3 Side surface 4 Side electrode 6 Adjacent surface extension 8 Conductive paste 9 Paste stand 21 Chip-shaped electronic component holder 22, 22a Core material 23 Holding hole 24 Holder main body 27 Depression

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H01G 4/00-4/40 H01G 13/00-13/06

Claims (8)

(57) [Claims] 1. A plurality of holding holes for receiving a plurality of chip-shaped electronic components one by one in a state where a specific side surface of each chip-shaped electronic component is exposed. Each of the holding holes has a structure in which at least the inner peripheral surface is formed of an elastic material to elastically hold each chip-shaped electronic component. A chip-shaped electronic component used for applying a conductive paste for forming an electrode to a region of a predetermined width on at least the specific side surface of each of the chip-shaped electronic components held at the side and at least across the side surface; A component holder, wherein a width wider than the predetermined width is provided in a region adjacent to each of the holding holes and extending in a transverse direction of a conductive paste to be applied to form the electrode. Wherein the recess having is provided, the chip-like electronic component holder. 2. The holding hole according to claim 1, wherein the plurality of holding holes are arranged in a direction transverse to the conductive paste, and the concave portions extend so as to connect the adjacent holding holes. For chip-shaped electronic components. 3. Each of the holding holes is formed with a through hole penetrating the chip-like electronic component holder in the thickness direction, whereby each of the chip-like electronic components held in each of the holding holes is 3. The chip-shaped electronic component holder according to claim 1, wherein both the specific side surface and the side surface facing in the opposite direction are exposed. 4. The holder for a chip-shaped electronic component according to claim 3, wherein the recess is provided so as to penetrate the holder for a chip-shaped electronic component in a thickness direction. 5. The holder according to claim 1, further comprising: a holder main body formed of an elastic material forming the holding hole; and a rigid core material embedded in the holder main body to reinforce the holder main body. The chip-shaped electronic component holder according to any one of the above. 6. A step of preparing the chip-shaped electronic component holder according to claim 1, wherein: in each of the holding holes of the chip-shaped electronic component holder, a specific one of the chip-shaped electronic components is provided. Inserting these chip-shaped electronic components so that the side surfaces are exposed, and on the specific side surface of each of the chip-shaped electronic components held in the holding holes of the chip-shaped electronic component holder. A step of preparing a paste base made of an elastic material having a groove filled with a conductive paste to be applied to a region of a predetermined width at least crossing the side surface; and the concave portion of the chip-shaped electronic component holder. The holder for the chip-shaped electronic component holding the chip-shaped electronic component and the paste base are relatively close to each other while facing the groove of the paste base with the paste base. Transferring the conductive paste in the groove onto the specific side surface of the chip-shaped electronic component while preventing the conductive paste in the groove from adhering to the chip-shaped electronic component holder. And a method of forming an electrode of a chip-shaped electronic component. 7. A step of preparing the chip-shaped electronic component holder according to claim 2, wherein a specific side surface of each chip-shaped electronic component is exposed in each of the holding holes of the chip-shaped electronic component holder. Inserting these chip-shaped electronic components so as to be in a state, on the specific side surface of each of the chip-shaped electronic components held in the holding hole of the chip-shaped electronic component holder, A step of preparing a paste table made of an elastic material, having a groove filled with a conductive paste to be applied to at least an area having a predetermined width and extending in the direction in which the plurality of holding holes are arranged; The chip-shaped electronic component holder holding the chip-shaped electronic component and the paste table are aligned with the concave portion of the electronic component holder facing the groove of the paste table. The conductive paste in the groove while preventing the conductive paste in the groove from adhering to the chip-like electronic component holder. Transferring to a specific side surface. 8. The step of inserting the chip-shaped electronic component is performed so that the specific side surface of each of the chip-shaped electronic components is located at a position protruding from an opening surface of each of the holding holes, and The step of transferring paste is performed so as to transfer the conductive paste so as to reach from the specific side surface of the chip-shaped electronic component to a part of an adjacent surface adjacent to the side surface. 8. The electrode forming method for a chip-shaped electronic component according to 7.