JP2004340661A - Manufacturing method of probe unit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To manufacture a probe unit for forming a probe having improved electrical connectivity with an electrode by a simple process. <P>SOLUTION: A method for manufacturing the probe unit 1 having a plurality of probes 20 and a support section 30 for supporting the plurality of probes 20 includes a patterning process for forming a resist 12 having a plurality of openings 14 on the surface of a substrate 10 made of metal, and a plating process for forming the probes 20 on the surface of the substrate 10 including a rough face region exposed from each opening 14 by plating. The resist 12 for forming the probes 20 is formed on the surface of the substrate 10 having a rough face region formed by irregularities that are finer than the pitch of the probes 20, and the substrate 10 is removed after forming the probes 20 at the opening 14 of the resist 12. Then, irregularities at the rough face region of the substrate 10 are transferred to the surface of the probes 20, and a plurality of projections having a finer pitch than that of the the probes 20 can be formed at each of the probes 20. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for manufacturing a probe unit for inspecting electrical characteristics of an electronic device such as a semiconductor integrated circuit and a liquid crystal panel.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, there has been known a probe unit in which a protrusion that contacts an electrode of an electronic device protrudes from a side surface of a probe (for example, Patent Documents 1, 2, and 3). By forming a protruding part on the probe that locally contacts the electrode of the electronic device as a specimen, it is easy to remove the oxide film formed on the electrode surface during the inspection, and the probe and the electrode are securely connected electrically Then, the specimen can be tested.
[0003]
[Patent Document 1]
JP-A-10-221369 [Patent Document 2]
JP-A-10-221370 [Patent Document 3]
JP-A-10-185950
[Problems to be solved by the invention]
However, as disclosed in Patent Documents 1, 2, and 3, in order to control the shape of each protrusion formed on a probe at the time of manufacturing, a resist that defines an arrangement of a plurality of probes is patterned. In addition, a plurality of steps must be added to form the projection, which complicates the manufacturing process. For example, according to the method disclosed in Patent Document 1, a step of patterning a second resist for forming a protrusion on each probe and removing the resist is added. In addition, according to the method disclosed in Patent Document 2, a step of inserting a tungsten ball for forming a protrusion in each probe into each opening of the resist is added. According to the method disclosed in Patent Document 3, a step of forming a groove-shaped corroded portion by soft-etching the edge of the opening of the resist is added.
[0005]
When the process for forming the probe becomes complicated, the manufacturing cost increases and the yield decreases. Further, in order to control the shape of each protrusion formed on each probe by resist patterning, patterning must be performed at a resolution equal to or higher than the patterning resolution of the probe. Increasing the resolution of patterning requires new capital investment, which leads to an increase in manufacturing costs.
[0006]
The present invention has been made to solve these problems, and an object of the present invention is to provide a method of manufacturing a probe unit that forms a probe having good electrical connectivity with electrodes in a simple process. And
[0007]
[Means for Solving the Problems]
In order to achieve the above object, a method for manufacturing a probe unit according to the present invention is a method for manufacturing a probe unit including a plurality of probes and a support portion that supports the plurality of probes, the method comprising: A patterning step of forming a resist having a plurality of openings thereon on the surface of the substrate, and forming a probe by plating on the surface of the substrate including at least a part of a rough surface region exposed from each of the openings; And a plating step. By forming a protruding portion on each probe, the electrical connectivity between the electrode and the probe can be improved. In addition, it is easy to form finer irregularities than the probe on the surface of the substrate unless the shapes of the irregularities are individually controlled. After forming a resist on the surface of the substrate where a rough surface area having finer irregularities than the pitch of the probe is exposed from the opening, and forming a probe on the rough surface area exposed from the opening of the resist, Is removed, the unevenness of the rough surface region of the substrate is transferred to the surface of the probe, and a plurality of protrusions finer than the pitch of the probe can be formed on each probe.
[0008]
Further, in the probe unit manufacturing method according to the present invention, the substrate is made of a metal plate having a thickness of 100 μm or less. By setting the thickness of the substrate to 100 μm or less, the substrate can be removed from the probe in a short time.
Furthermore, the method of manufacturing a probe unit according to the present invention is characterized in that the method further includes, before the patterning step, a roughening step of roughening the surface of the substrate by etching. By forming micro-pitch irregularities on the surface of the substrate by etching, it is possible to form protrusions with a pitch of, for example, several μm on each probe.
[0009]
Further, the method of manufacturing a probe unit according to the present invention is characterized in that the method further includes, before the patterning step, a roughening step of roughening the surface of the substrate by sputtering. By forming micro-pitch irregularities on the surface of the substrate by sputtering, it is possible to form protrusions with a pitch of, for example, several μm on each probe.
[0010]
Further, the method of manufacturing a probe unit according to the present invention is characterized in that the method further includes, before the patterning step, a roughening step of roughening the surface of the substrate by microblasting. By forming micro-pitch irregularities on the surface of the substrate by micro-blasting, it is possible to form protrusions with a pitch of, for example, several μm on each probe.
[0011]
Further, in the probe unit manufacturing method according to the present invention, the rough surface region has such a roughness that a plurality of concave portions are arranged in each of the openings in the longitudinal direction and the lateral direction of the probe. By arranging a plurality of protrusions arranged in the longitudinal direction and the lateral direction of the probe on each probe, electrical connectivity between the probe and the electrode can be improved.
[0012]
In order to achieve the above object, a method for manufacturing a probe unit according to the present invention is a method for manufacturing a probe unit including a plurality of probes and a support portion that supports the plurality of probes, the method comprising: A patterning step of forming a resist having a plurality of openings thereon, a plating step of forming a probe in each of the openings by plating, and a roughening step of roughening the surfaces of the plurality of probes. Features. By forming protrusions on each probe in the roughening step, electrical connectivity between the electrodes and the probes can be improved. In addition, in the roughening step, since each shape of the unevenness is not individually controlled, it is easy to form finer unevenness than the probe on the surface of the substrate.
[0013]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(First embodiment)
FIG. 1 is a sectional view showing a method of manufacturing a probe unit 1 according to a first embodiment of the present invention.
[0014]
First, as shown in FIG. 1 (A), one surface of a substrate 10 made of metal is roughened by etching or the like, and a rough surface on the surface of which a large number of irregularities are arranged in both a length direction and a width direction. Form an area. The substrate 10 is made of a generally inexpensive metal plate such as a copper plate or an aluminum plate having a thickness of 100 μm or less. By setting the thickness of the substrate 10 to 100 μm or less, the substrate 10 can be easily removed in a short time in a later process.
[0015]
Next, as shown in FIG. 1B, a resist 12 is applied to the surface of the substrate 10 which has been roughened, exposed and developed, so that the resist 12 has an opening 14 at a portion corresponding to the probe. Is patterned.
Next, as shown in FIG. 1C, a probe 20 is formed in the opening 14 of the resist 12 by plating. For example, nickel-tungsten or the like is used for the probe 20. The pitch of the central axis of the probe 20 is, for example, 20 to 100 μm.
[0016]
Next, as shown in FIG. 1D, the resist 12 is removed.
Next, as shown in FIG. 1 (E), the support portion 30 is fixed to the surface of the probe 20 other than the tip portion with an adhesive or the like.
Next, as shown in FIG. 1 (F), when the substrate 10 is removed from the probe 20 by selective etching or dissolution by heating, the projections and depressions of the rough surface region of the substrate 10 are transferred to form a plurality of protrusions. The probe unit 1 having the probe 20 obtained is obtained. When the selective etching is used, it is preferable to use a copper substrate 10 having a high selective etching property with respect to the probe 20 made of nickel-tungsten or the like.
[0017]
The above is the method of manufacturing the probe unit 1.
In the above-described manufacturing method, the substrate 10 is removed from the probe 20 after the support unit 30 that supports the probe 20 is attached to the probe 20, but the substrate 10 is supported without attaching the support unit 30 to the probe 20. It may be 30.
[0018]
In the present manufacturing method, the entire area of the substrate 10 corresponding to the projection forming area of the probe 20 is roughened.
FIGS. 2A and 2B are plan views illustrating an example of a rough surface region formed on the substrate 10.
[0019]
In the case of FIG. 2A, the rough surface area a is formed in a continuous area including the entire vicinity of the tips of the plurality of probes 20 formed on the substrate 10. In the case of FIG. 2B, a rough surface region a is formed at each of the tip portions of the plurality of probes 20 formed on the substrate 10. In any case, before the substrate 10 is roughened, a portion of the substrate 10 which is not roughened is first masked with a resist or the like to expose only the roughened region a, and then the exposed portion of the substrate 10 is roughened. To form a rough surface region a. In this manner, the surface of the corresponding substrate 10 is roughened so that the probe 20 has a projection at least at the tip portion, that is, the contact portion with the electrode of the specimen, to form the rough surface region a. Of course, the entire surface of the substrate 10 may be the rough surface region a.
[0020]
The probe 20 is formed on the substrate 10 including the rough surface region a, and has a surface on which the uneven shape of the rough surface region a is transferred.
FIG. 3 is a cross-sectional view showing the relationship between the transfer of the unevenness of the substrate 10 and the probe 20. FIG. 3A is a diagram illustrating a substrate 10 having a roughened surface by etching, microblasting, or the like, and a probe 20 formed on the substrate 10. FIG. 3B is a diagram showing a substrate 10 having a roughened surface by sputtering, printing, or the like, and a probe 20 formed on the substrate 10. FIG. 3C is a diagram showing a substrate 10 having a roughened surface by mechanical processing such as punching, and a probe 20 formed on the substrate 10.
[0021]
As shown in FIG. 3A, a plurality of bowl-shaped concave portions are arranged in the rough surface region a of the substrate 10 processed by etching, micro blasting, or the like. Therefore, the probe 20 to which the irregularities of the rough surface area a are transferred has a plurality of dome-shaped protrusions. In the case of roughening by etching or microblasting, the pitch of the irregularities is 1 to 5 μm.
[0022]
On the other hand, the substrate 10 shown in FIG. 3B is subjected to processing such as sputtering a metal of the same type as the metal constituting the substrate 10 or printing a metal paste that can be removed later by etching, heating, or the like. Thereby, a rough surface area a having a plurality of dome-shaped protrusions is formed. As a result, the probe 20 to which the irregularities of the rough surface region a are transferred has a plurality of spire-shaped protrusions. In the case of roughening by sputtering, the pitch of the unevenness is 1 to 5 μm. In the case of roughening by printing, irregularities that are slightly rougher than sputtering are formed.
[0023]
Further, as shown in FIG. 3C, for example, a plurality of dome-shaped protrusions may be formed on the surface of the substrate 10 by performing punching from the back surface of the substrate 10 to perform rough surface processing. Also in this case, similarly to the case of FIGS. 3A and 3B, the probe 20 to which the shape of the rough surface area a is transferred can be formed, that is, it has a plurality of bowl-shaped concave portions and plateau-shaped protrusions. A probe 20 can be formed.
[0024]
As described above, fine irregularities can be formed on the substrate 10 by simple rough surface processing such as etching, microblasting, sputtering, printing, and machining. Of course, without performing these roughening steps, a commercially available metal plate having a roughened surface such as a roughened copper foil for PCB may be used as the substrate 10. The metal plate is generally inexpensive, and can be easily subjected to rough surface processing such as etching, micro blasting, sputtering, printing, and machining described above. Suitable for use as.
[0025]
FIG. 4 is a view showing an SEM photograph of the probe 20 of the probe unit 1 manufactured based on the above-described manufacturing method. FIG. 4A is a diagram illustrating the probe 20 having a plurality of dome-shaped protrusions manufactured based on the relationship between the transfer of the unevenness of the substrate 10 and the probe 20 illustrated in FIG. FIG. 4B is a diagram showing the probe 20 having a plurality of spire-shaped protrusions manufactured based on the relationship between the transfer of the unevenness of the substrate 10 and the probe 20 shown in FIG. 3B.
[0026]
As shown in FIGS. 4A and 4B, the surface of the probe 20 to which the irregularities of the rough surface region a of the substrate 10 are transferred has irregularities very finer than the probe pitch in both the length direction and the width direction. Are arranged in a sponge shape.
FIG. 5 is a perspective view showing a continuity test method using the probe unit 1 manufactured based on the above-described manufacturing method.
[0027]
As shown in FIG. 5, in the continuity test using the probe unit 1, first, the probe 20 is brought into contact with the electrode 40 of the sample to perform overdrive, and the probe 20 is moved in the direction of the arrow to scrub the electrode 40. Then, the oxide film on the surface of the electrode 40 is shaved by the protrusion of the probe 20, and the electrical connection between the electrode 40 and the probe 20 is secured. At this time, shavings of the oxide film generated by shaving the surface of the electrode 40 are entangled with a sponge-like surface formed by fine irregularities of the probe 20.
[0028]
According to the present embodiment, by transferring the unevenness of the rough surface area a of the substrate 10 to the probe 20, a fine equipment of about 1 μm or less, which requires a new capital investment, is required to realize a projection by lithography. A plurality of protruding portions can be easily formed on the probe 20, and the manufacturing cost can be reduced. By using the substrate 10 that has been roughened by simple processing or a commercially available substrate 10 that has been previously roughened, it is not necessary to increase the number of extra steps for forming the protruding portion of the probe 20. By controlling the location of the rough surface region a formed on the substrate 10, a protrusion can be locally formed at an arbitrary location of the probe 20. The shape of the projections of the probe 20 can be changed by changing the shape of the irregularities in the rough surface region a by the method of rough surface processing. By arranging a plurality of fine protrusions on each probe 20 to form a sponge-like surface, the electrical connection between the probe 20 and the sample electrode 40 is ensured, and the oxide film of the electrode 40 is removed. Shavings generated on the sponge-like surface can be entangled with the sponge-like surface, thereby preventing contamination of the electrode 40 due to the shavings.
[0029]
(Second embodiment)
FIG. 6 is a sectional view illustrating a method of manufacturing the probe unit 2 according to the second embodiment of the present invention.
First, as shown in FIG. 6A, a resist 12 is applied on a substrate 10 made of metal, exposed and developed, and the resist 12 is patterned into a shape having an opening 14 in a portion where a probe 20 is formed. As the substrate 10, similarly to the first embodiment, a generally inexpensive metal plate such as a copper plate or an aluminum plate having a thickness that can be easily removed is used.
[0030]
Next, as shown in FIG. 6B, a probe 20 is formed in the opening 14 of the resist 12 by plating. For example, nickel-tungsten or the like is used for the probe 20. The pitch of the probe 20 is, for example, 20 to 100 μm.
Next, as shown in FIG. 6C1, the surfaces of the resist 12 and the probe 20 are roughened by etching or the like.
[0031]
Next, as shown in FIG. 6D1, the resist 12 is removed.
Next, as shown in FIG. 6 (E1), the support portion 30 is fixed to a surface other than the tip portion of the probe 20 with an adhesive or the like.
Finally, as shown in FIG. 6F, the substrate 10 is removed from the probe 20 by selective etching or heating.
[0032]
The steps shown in FIGS. 6 (C2), (D2) and (E2) may be performed instead of the steps of FIGS. 6 (C1), (D1) and (E1). In this case, after the step of FIG. 6B, the resist 12 is first removed as shown in FIG. 6C2. Next, as shown in FIG. 6 (D2), the surface of the probe 20 and the exposed surface of the substrate 10 are roughened by etching or the like. Next, as shown in FIG. 6 (E2), after fixing the support 30 to the probe 20, the process of FIG. 6 (F) is performed.
[0033]
As described above, in the second embodiment, the probe unit 20 having the probe 20 having a plurality of protrusions formed on the surface thereof is formed by roughening the probe 20 itself without using the substrate 10 having the roughened surface. It is a method of manufacturing. According to such a method, a plurality of protrusions having a fine pitch can be easily formed on the probe 20.
[0034]
Note that, in the present embodiment and the modified example, it is possible to use an unevenness formed on the surface facing the substrate so that the oxide film can be shaved or the shaved oxide film can be entangled. However, by supporting the substrate side after peeling the substrate, the surface of the probe opposite to the substrate contact surface may be used. For example, in the case of the embodiment shown in FIG. 1, after forming a portion to be a probe by providing irregularities on the base member side on the substrate side, irregularities can also be formed on the side opposite to the surface in contact with the base member. The irregularities on the side opposite to the surface in contact with the base member are slightly smoother than the contact surface on which the irregularities of the substrate are transferred as they are. For this reason, in some cases, the effect (multi-contact, prevention of electrode damage) described above is better than using the unevenness provided on the base member as it is.
[Brief description of the drawings]
FIG. 1 is a sectional view illustrating a method of manufacturing a probe unit according to a first embodiment of the present invention.
FIG. 2 is a plan view showing an example of a rough surface region formed on a substrate by the method of manufacturing a probe unit according to the first embodiment of the present invention.
FIG. 3 is a cross-sectional view illustrating a relationship between a substrate and the transfer of irregularities of a probe in the method of manufacturing a probe unit according to the first embodiment of the present invention.
FIG. 4 is a view showing an SEM photograph of a probe formed in the method of manufacturing a probe unit according to the first embodiment of the present invention.
FIG. 5 is a perspective view illustrating a continuity test method using the probe unit manufactured by the method for manufacturing a probe unit according to the first embodiment of the present invention.
FIG. 6 is a sectional view illustrating a method of manufacturing a probe unit according to a second embodiment of the present invention.
[Explanation of symbols]
1, 2 probe unit 10 substrate 12 resist 14 opening 20 probe 30 support 40 electrode a rough surface area

Claims (7)

A method for manufacturing a probe unit including a plurality of probes and a support unit that supports the plurality of probes,
A resist having a plurality of openings on the surface of the substrate made of metal, a patterning step of forming on the surface of the substrate,
A plating step of forming a probe by plating on the surface of the substrate including at least a part of the rough surface area exposed from each of the openings,
A method for manufacturing a probe unit, comprising: The method according to claim 1, wherein the substrate is formed of a metal plate having a thickness of 100 μm or less. 3. The method according to claim 1, further comprising a roughening step of performing a roughening process on the surface of the substrate by etching before the patterning step. 3. The method according to claim 1, further comprising a roughening step of roughening a surface of the substrate by sputtering before the patterning step. 3. The method according to claim 1, further comprising a roughening step of roughening a surface of the substrate by microblasting before the patterning step. 4. 6. The rough surface area according to claim 1, wherein the rough surface region has such a roughness that a plurality of concave portions are arranged in each of the openings in the longitudinal direction and the lateral direction of the probe. Method of manufacturing probe unit. A method for manufacturing a probe unit including a plurality of probes and a support unit that supports the plurality of probes,
A patterning step of forming a resist having a plurality of openings on the surface of the metal substrate,
A plating step of forming a probe in each opening by plating;
A roughening step of roughening the surface of the plurality of probes,
A method for manufacturing a probe unit, comprising:

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