JP2004333332A - Probe unit and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a prove unit and its manufacturing method which prevents a probe from dropping from electrodes of a sample under test. <P>SOLUTION: The probe unit comprises a base 20 and a comb-like probe sheet having a plurality of probes 10 connected at their base ends in one body by the base 20. The probe 10 is expanded at the top end 12 and this expanding prevents the probe 10 from dropping from the top face of an electrode 50 of a sample 5 under test. The top ends of the plurality of probes 10 are made uneven along the arranging line of the probes 10 to allow the top end 12 of the probe 10 to be expanded, without increasing the pitch of the center axial line of each probe 10. This allows the minimum gap between the adjacent probes 10 to be reduced in their arranging direction. Thus the availability is raised for the sample 5 having a plurality of thin and long electrodes 50 like parallel lines, without reducing the pitch of each probe 10. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a probe unit for inspecting electrical characteristics of an electronic device such as a semiconductor integrated circuit and a liquid crystal panel, and a method for manufacturing the same.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, there has been known a method of inspecting electrical characteristics of an electronic device by simultaneously contacting a tip portion of a comb-shaped conductor with a plurality of electrodes of the electronic device.
Patent Document 1 describes an inspection method using a comb-shaped conductor made of silicon. In the comb-shaped conductor described in Patent Document 1, the probes are arranged in a comb-tooth shape at a pitch smaller than the pitch of the electrodes of the sample. By arranging the probes at a pitch considerably smaller than the pitch of the electrodes of the sample, a plurality of samples having different electrode pitches can be handled by one type of probe unit, and the versatility is improved.
[0003]
In Patent Document 2, all probes are simultaneously brought into contact with two-dimensionally arranged sample electrodes by using a plurality of conductors arranged in a comb shape at a pitch narrower than the pitch of the sample electrodes. A method of inspecting the electrical characteristics of a specimen by performing the test is disclosed.
[0004]
Patent Literatures 3, 4, and 5 describe an inspection method using a comb-shaped conductor in which probes having irregular tips are arranged in a comb-tooth shape. The comb-shaped conductor probes described in Patent Documents 3, 4, and 5 are arranged so as to correspond one-to-one with the electrodes of the specimen.
[0005]
[Patent Document 1]
JP-A-58-83271
[0006]
[Patent Document 2]
JP-A-10-274662
[0007]
[Patent Document 3]
JP-A-7-199219
[0008]
[Patent Document 4]
JP-A-10-206646
[0009]
[Patent Document 5]
JP-A-10-288629
[0010]
[Problems to be solved by the invention]
However, the comb-shaped conductors described in Patent Literatures 1 and 2 require a fine probe having a pitch smaller than the pitch of the electrodes of the sample, so that the manufacturing cost of the probe unit increases and the yield decreases. There's a problem.
[0011]
In the inspection methods described in Patent Documents 3, 4, and 5, in order to make the probe and the sample correspond one-to-one, the probe arranged on the conductor and the electrode of the sample must be aligned with high accuracy. Further, when the probe is overdriven, the probe may fall off from the top surface of the electrode. In particular, a flexible printed board, a TAB board, a liquid crystal board, a glass epoxy board, and the like have a large overdrive because of large irregularities and undulations on the board surface, so that the possibility of the probe falling off from the top surface of the electrode increases. . Further, when the probe becomes fine, the pressure acting on the sample electrode and the probe when overdriven is reduced, so that it is difficult to reliably contact the sample electrode and the probe. Further, as the probe becomes finer, the electric resistance of the probe increases.
[0012]
The present invention has been made to solve these problems, and an object of the present invention is to provide a probe unit capable of preventing a probe from dropping off from a top surface of an electrode of a specimen and a method of manufacturing the same.
[0013]
[Means for Solving the Problems]
In order to achieve the above object, a probe unit according to the present invention is a probe unit including a comb-shaped probe sheet having a base and a plurality of probes each having a base end integrally connected with the base, It is characterized in that the probe is widened at the tip. By widening the tip of the probe, the probe can be prevented from dropping off from the top surface of the sample electrode.
[0014]
Further, in the probe unit according to the present invention, the tips of the plurality of probes are made irregular in the arrangement direction of the plurality of probes, so that the pitch of the center axis of each probe (hereinafter, the pitch of the center axis of each probe is simply referred to as the pitch of the probe) ) Can be widened without increasing the size of the probe. For this reason, the minimum distance in the arrangement direction of adjacent probes can be reduced. Therefore, versatility can be improved without reducing the pitch of each probe for a sample provided with a plurality of electrodes elongated in parallel lines. Note that the state in which the tips of the plurality of probes are irregular in the arrangement direction of the plurality of probes refers to a state in which at least a part of a virtual line connecting the tips of the probes in the shortest distance is zigzag.
[0015]
Further, in the probe unit according to the present invention, by forming the dome-shaped protrusion at the tip of the probe, the dome-shaped protrusion can be brought into contact with the electrode of the specimen. Then, the electrode of the specimen can be prevented from being roughened by the tip of the probe.
[0016]
Further, in the probe unit according to the present invention, by stacking a plurality of probe sheets so that the probes do not overlap each other, a probe unit in which probes are arranged at a pitch smaller than the pitch of the probes on each probe sheet can be configured.
[0017]
Further, in the probe unit according to the present invention, by setting the minimum distance d between the probes in the arrangement direction to be d ≦ 0, the probe unit can be used for a continuity test of a specimen having electrodes arranged at an arbitrary pitch.
[0018]
Further, in the probe unit according to the present invention, the probe can be suppressed from being worn by covering the contact portion of the probe with the specimen with a metal film harder than the base material.
Further, in the probe unit according to the present invention, the electrical resistance of the probe can be reduced by covering the contact portion of the probe with the specimen with a metal film having a smaller volume resistivity than the base material.
[0019]
In order to achieve the above object, a method of manufacturing a probe unit according to the present invention includes a patterning step of forming a resist having an opening on the surface of a sacrificial layer made of metal, and forming the probe sheet in the opening by plating. And a step of removing the resist, and a step of removing the sacrificial layer. With this method, a fine probe can be formed with high dimensional accuracy.
[0020]
Further, in the method of manufacturing a probe unit according to the present invention, by forming the through hole in the base, the time for performing the step of removing the sacrificial film can be reduced. Further, the efficiency can be further improved by providing a plurality of through holes. In addition, by forming a through hole for positioning separately or in the base so that it can be shared, high positional accuracy can be ensured.
[0021]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0022]
<Configuration of probe unit>
First, a basic configuration of a probe unit according to an embodiment of the present invention will be described.
1 and 33 are plan views showing the correspondence between the probe unit 1 and the specimen 5 according to one embodiment of the present invention.
[0023]
As shown in FIG. 1 and FIG. 33, the probe unit 1 includes a probe sheet in which a plurality of probes 10 are arranged and each base end 14 of the probes 10 is integrally connected at a base 20. As shown in FIGS. 1A, 1B, and 1C, when the pitch of the probes 10 is set so that the plurality of probes 10 are in contact with one electrode 50, the pitch of the various electrodes 50 of the sample 5 is Versatility. In addition, the smaller the pitch of the probe 10 is, the higher the versatility with respect to the pitch of the electrode 50 is. Further, since the individual probes 10 can be deformed independently of the other probes 10, the probes 10 can be surely brought into contact with each of the electrodes 50 even with respect to the plurality of electrodes 50 having an undulating arrangement. The probe 10 can be reliably brought into contact with the electrode 50 having unevenness on the surface. Further, since the plurality of probes 10 contact one electrode 50, the probe 10 and the electrode 50 are connected with a large contact area. Therefore, the electrical connection between the probe unit 1 and the sample 5 is ensured.
[0024]
The plurality of probes 10 are alternately arranged such that the tip portions are formed thicker than other portions, and the probes 10 are formed linearly with the same width from the base end to the tip portion. The circular tip 12 is arranged at a position farther from the base 20 in the longitudinal direction of the probe 10 than the tip 12 of the linear probe 10. That is, the distal ends 12 of the probes 10 are arranged in two rows in the direction in which the probes 10 are arranged. By making the positions of the tips 12 of the probes 10 uneven and increasing the width of the tips 12 of the probes 10, the minimum distance between the probes in the probe arrangement direction can be obtained without increasing the pitch between the center axes of the probes 10. The distance d can be reduced. When the probe unit 1 is used for a specimen 5 in which a plurality of elongated electrodes 50 are arranged in parallel, the versatility with respect to the pitch of the electrodes 50 increases as the minimum distance d between the probes in the probe arrangement direction decreases. , D = 0, it is possible to correspond to any pitch. Further, d <0 may be set. Since the versatility with respect to the pitch of the electrodes 50 can be increased without reducing the pitch between the central axes of the probes 10, the manufacturing cost of the probe unit 1 can be reduced and the yield can be increased. In addition, if the pitch between the center axes of the probes 10 is not reduced and the probe 10 is not miniaturized, the contact pressure between the probe 10 and the electrode 50 can be increased, so that the probe 10 and the electrode 50 are reliably conducted. be able to. In addition, even if the probe 10 is deformed in the inspection process and the pitch of the probe 10 is shifted or becomes large, if d <0, conduction to the electrode 50 can be ensured.
[0025]
The probe sheet is made of a conductive material and has a thickness of 5 μm to 100 μm, a length of 200 μm, and a width of 12 μm to 100 μm. A contact portion of the probe with the specimen 5, that is, a tip portion of the probe may be coated with a metal harder than a base material of the probe. By covering the contact portion of the probe with the specimen 5 with a metal film harder than the base material, the wear of the probe can be suppressed. Further, the tip of the probe may be coated with a metal having a smaller volume resistivity than the base material.
The electrical resistance of the probe can be reduced by covering the contact portion of the probe with the specimen 5 with a metal film having a smaller volume resistivity than the base material.
[0026]
Hereinafter, a specific configuration of the probe unit according to the embodiment of the present invention will be described in detail.
[0027]
(First configuration)
In the first configuration shown in FIGS. 2A, 2B, and 2C, the probe unit 1 includes a probe 10 having a tip portion 12 that is formed thicker and circular than other portions of the probe 10, and a base unit. It is composed of a probe sheet in which a plurality of linear probes 10 continuously formed in the same width from the end 14 to the distal end portion 12 are alternately arranged. The circular tip 12 is arranged at a position farther from the base 20 in the longitudinal direction of the probe 10 than the tip 12 of the linear probe 10. The two types of probes 10 are integrally connected at a base 20.
[0028]
(Second configuration)
The second configuration shown in FIGS. 3A, 3B, and 3C differs from the first configuration in the shape of the distal end 12 of the probe 10 and the point that the through hole 22 is formed in the base 20. ing. Specifically, an L-shaped tip 12 is formed on the probe 10 instead of the circular tip 12 of the first configuration. The base 20 has a plurality of circular through holes 22 formed by punching or the like.
[0029]
(Third configuration)
The third configuration shown in FIGS. 4A, 4B, and 4C differs from the second configuration in that the shape of the distal end portion 12 of the probe 10 and the positioning hole 24 is formed in the base portion 20. ing. Specifically, a rectangular tip 12 is formed on the probe 10 instead of the L-shaped tip 12 of the second configuration. In addition to the through hole 22, two positioning holes 24 for positioning the probe unit 1 on the probe base are formed in the base portion 20. One of the positioning holes 24 is circular and is used to determine the x and y positions of the probe unit 1, and the other is a square with rounded corners and is used to determine the angle θ. The positioning hole may be, for example, one rectangular through-hole as long as x, y, and θ of the probe unit 1 can be determined.
[0030]
(Fourth configuration)
In the fourth configuration shown in FIGS. 5A, 5B, and 5C, a plurality of probes 10 each having a distal end portion 12 formed in a rectangle that is thicker and thicker than other portions of the probe 10 are used. Are alternately shifted one by one in the arrangement direction of the probes 10, and are arranged in two rows in a staggered manner. The base 20 has a plurality of circular through holes 22 formed by punching or the like. The base 20 further has two rectangular positioning holes 24 for positioning the probe unit 1 on the probe base. One is square and the other is rectangular.
[0031]
(Fifth configuration)
In the fifth configuration shown in FIGS. 6A, 6B, and 6C, the probe unit 1 has a probe in which two types of probes 10 having large and small rectangular tips 12 are alternately arranged. Consists of sheets. The probes 10 are arranged such that the large tip 12 is located farther from the base 20 in the longitudinal direction of the probe 10 than the small tip 12. Each of the large and small tip portions 12 is formed thicker than the other portions of the probe 10. The neck 26 of each probe 10 is formed thinner than the body 18. The lengths of the body portions 18 of the two types of probes 10 are the same. The configuration of the base 20 conforms to the third configuration.
[0032]
(Sixth configuration)
In the sixth configuration shown in FIGS. 7A, 7B, and 7C, the probe unit 1 has two types of probes 10 having large and small elliptical tips 12, which are alternately arranged. Consists of a probe sheet. The probes 10 are alternately arranged such that the large distal ends 12 are located farther from the base 20 in the longitudinal direction of the probe 10 than the small distal ends 12. Each of the large and small tip portions 12 is formed thicker than the other portions of the probe 10. The neck portion 16 is formed to be the thinnest, and the body portion 18 is gradually widened from the neck portion 16 toward the base end portion 14. The configuration of the base 20 conforms to the third configuration.
[0033]
(Seventh configuration)
In the seventh configuration shown in FIGS. 8A, 8B, and 8C, the shape of the distal end portion 12 of the probe 10 is different from the third configuration. Specifically, trapezoidal tips 12 are arranged in place of the rectangular tips 12 of the third configuration. The trapezoidal tips 12 are alternately inverted one by one.
[0034]
(Eighth configuration)
The eighth configuration shown in FIGS. 9A, 9B, and 9C differs from the fourth configuration in the method of arranging the probes 10 and the shape of the positioning holes 24 in the base 20. Specifically, a plurality of probes 10 each having a rectangular tip 12 are staggered in three rows by shifting the positions of the tips 12 one by one in the arrangement direction of the probes 10. One of the two positioning holes 24 of the base 20 is formed in a circular shape, and the other is formed in a square shape with rounded corners.
[0035]
(Ninth configuration)
In the ninth configuration shown in FIGS. 10A, 10B, and 10C, the first probe sheet on which the probes 10 each having the tip 12 formed in a circular shape that is thicker than other portions of the probe is arranged. 2 and a second probe sheet 3 on which linear probes 10 are arranged are vertically stacked. The first probe sheet 2 is arranged at the upper part and the second probe sheet 3 is arranged at the lower part so that the probes 10 of the first probe sheet 2 and the probes 10 of the second probe sheet 3 do not overlap. The probes 10 of the first probe sheet 2 are formed longer than the probes 10 of the second probe sheet 3. The bases 20 of the probe sheets 2 and 3 are configured according to the third configuration, respectively, and are stacked so that the positions of the through holes 22 and the positioning holes 24 are aligned.
[0036]
(Tenth configuration)
In the tenth configuration shown in FIGS. 11A, 11B, and 11C, the shape of the distal end portion 12 of the probe 10 of the first probe sheet 2 is different from the ninth configuration. Specifically, instead of the circular tip 12 of the ninth configuration, a rectangular tip 12 is formed on the probe 10 of the first probe sheet 2.
[0037]
(Eleventh configuration)
In the eleventh configuration shown in FIGS. 12A, 12B, and 12C, the shape of the tip 12 of the probe 10 of the first probe sheet 2 is different from the ninth and tenth configurations. Specifically, a trapezoidal tip 12 is formed on the probe 10 of the first probe sheet 2 instead of the circular tip 12 of the ninth configuration or the rectangular tip 12 of the tenth configuration. Further, as shown in FIG. 12A, the tip portions 12 of the trapezoid are formed upside down every other.
[0038]
(Twelfth configuration)
In the twelfth configuration shown in FIGS. 13A, 13B, and 13C, the first configuration in which the probes 10 each having the distal end portion 12 formed in a rectangle that is thicker than the other portions of the probe 10 is arranged. The probe sheet 2, the second probe sheet 3, and the third probe sheet 4 are sequentially stacked. The respective probes 10 of the respective probe sheets 2, 3, 4 are arranged so as not to overlap. The probe 10 of the first probe sheet 2 arranged at the uppermost layer is the longest, the probe 10 of the second probe sheet 3 arranged at the middle is the longest, and the probe 10 of the third probe seed 4 at the bottom layer is the shortest. Have been. The bases 20 of the probe sheets 2, 3, and 4 are each configured according to the third configuration, and are stacked so that the positions of the through holes 22 and the positioning holes 24 are aligned.
[0039]
According to the ninth to twelfth configurations, a plurality of probe sheets having the probes 10 widened at the distal end portion 12 are stacked so that the probes 10 of the respective probe sheets do not overlap each other, so that one probe sheet can be used. The probe unit 1 in which probes are arranged at a pitch smaller than the pitch of the probes can be configured. Therefore, it is not necessary to arrange the probes 10 of each probe sheet at a fine pitch, so that the manufacturing cost can be reduced and the yield can be improved.
[0040]
(Thirteenth configuration)
In the thirteenth configuration shown in FIG. 14, the probe unit 1 is composed of a probe sheet in which a dome-shaped protrusion 30 is formed on the entire top surface of the circular tip 12 formed on each probe 10. The tips 12 of the probes 10 are arranged irregularly in the arrangement direction of the probes 10.
[0041]
(14th configuration)
In the fourteenth configuration shown in FIG. 15, the probe unit 1 is configured such that the distal end 12 of each probe 10 is formed in an elliptical shape, and a dome-shaped protrusion 30 is formed on the top surface of the elliptical distal end 12 in the length direction. It consists of a plurality of probe sheets formed in the width direction. The tips 12 of the probes 10 are arranged irregularly in the arrangement direction of the probes 10.
[0042]
(Fifteenth configuration)
The fifteenth configuration shown in FIG. 16 differs from the fourteenth configuration in the shape and arrangement method of the protrusions 30. Specifically, on the top surface of the elliptical tip portion 12 of each probe 10, a plurality of semicylindrical protrusions 30 are formed in the arrangement direction of the probes 10.
[0043]
(Sixteenth configuration)
The sixteenth configuration shown in FIG. 17 differs from the fourteenth configuration in the method of arranging the protrusions 30. Specifically, a plurality of dome-shaped protrusions 30 are arranged not on the entire top surface of the distal end portion 12 of the probe 10 but intensively on both ends of the distal end portion 12. This prevents the tip 12 of the probe 10 from falling off the electrode 50 of the sample 5.
[0044]
(Seventeenth configuration)
The seventeenth configuration shown in FIG. 18 differs from the sixteenth configuration in the method of arranging the protrusions 30. Specifically, three dome-shaped protrusions 30 are arranged on the top surface of the tip 12 of each probe 10 so as to form a triangle. According to this arrangement method, similarly to the sixteenth configuration, it is possible to prevent the distal end portion 12 of the probe 10 from falling off from the electrode 50 of the sample 5.
[0045]
(Eighteenth configuration)
The eighteenth configuration shown in FIG. 19 differs from the sixteenth configuration in the shape of the projection 30. Specifically, instead of the dome-shaped protrusion 30 of the eighteenth configuration, the tub-shaped protrusions 30 are arranged at both ends of the distal end portion 12 of the probe 10. According to this arrangement method, similarly to the sixteenth and seventeenth configurations, the probe 10 can be prevented from falling off from the electrode 50.
[0046]
According to the fourteenth to eighteenth configurations, the curved surface of the projection 30 can be brought into contact with the electrode 50 of the sample 5 by forming the dome-shaped or semicylindrical projection 30 at the tip end portion 12. There is an advantage of not damaging 50.
[0047]
(19th configuration)
In the nineteenth configuration shown in FIG. 20, four probe sheets connect the respective probes 10 to each other inward, and constitute a square probe unit 1 having a through hole on the inside. Two positioning holes 24 are formed at four corners of the probe unit 1, respectively. In FIG. 20, illustration of a tip portion formed thicker than other portions is omitted.
[0048]
FIG. 21 is a diagram showing a state in which the probe unit 1 of the present embodiment and the conventional probe unit 6 are brought into contact with the electrode 50 of the sample 5. FIG. 21A is a plan view showing a state in which the conventional probe unit 6 is brought into contact with the electrode 50 of the sample 5, and FIG. 21B is a sectional view taken along line aa of FIG. FIG. 21C is a plan view showing a state in which the probe unit 1 of the present embodiment is brought into contact with the electrode 50 of the sample 5, and FIG. 21D is a sectional view taken along the line bb of FIG. 21C. FIG. 21E is a cross-sectional view taken along line cc of FIG. 21C. In this figure, the probe unit 1 according to the fourth configuration is illustrated, and the illustration of the through holes 22 and the positioning holes 24 is omitted.
[0049]
As shown in FIG. 21, even when the pitch of the probe of the probe unit does not match the pitch of the electrode 50 of the sample 5, the probe unit 1 of the present embodiment has the The contact area with the electrode 50 can be improved as compared with the conventional probe unit 6. The electrode 50 of the sample 5 is made of Au-plated Cu wiring or the like. However, the Cu wiring is generally wet-etched, so that the line width is liable to vary, as shown in FIGS. 21 (B), (D) and (E). It may taper towards the top as shown. Since the probe unit 1 of this embodiment has a large contact area with the electrode 50, the probe unit 1 can surely contact the thin electrode 50 as shown in FIGS. Even if the distance is increased, the contact state is stably maintained without dropping from the wiring unlike the conventional probe unit 6.
In addition, by arranging the tip portions 12 of the plurality of probes 10 so as to be shifted in the direction in which the plurality of probes 10 are arranged, not only the electrodes 50 arranged one-dimensionally as shown in FIG. A plurality of probes 10 can be contacted simultaneously.
[0050]
<Method of manufacturing probe unit>
Hereinafter, an embodiment of the method of manufacturing the probe unit 1 will be described.
[0051]
(First manufacturing method)
FIG. 22 and FIG. 23 are views showing the first manufacturing method. FIGS. 22 (A1) to (A4) and FIGS. 23 (A5) to (A7) are plan views, and FIGS. 22 (B1) to (B4) and FIGS. 23 (B5) to (B7) are FIGS. 22 (A1). FIG. 4 is a cross-sectional view corresponding to a cross section taken along line aa of FIG.
[0052]
First, as shown in FIGS. 22A1 and 22B1, a sacrificial layer 72 made of metal is formed on one entire surface of the substrate 70. Specifically, the sacrificial layer 72 is formed by, for example, sputtering copper or the like.
Next, as shown in FIGS. 22 (A2) and (B2), a plating seed layer 74 serving as a base of the probe 10 is formed on the sacrificial layer 72. For example, Ti or Ni—Fe is used for the plating seed layer 74. For the purpose of improving the adhesion of the plating seed layer, Ni or Ni-Fe may be sputtered after sputtering Ti.
[0053]
Next, as shown in FIGS. 22 (A3) and (B3), a photoresist is applied on the plating seed layer 74, exposed using a mask having a predetermined shape, developed, and an opening 76 is formed in a portion to be plated. Is formed.
Next, as shown in FIGS. 22A and 22B, the plating layer 80 serving as the probe 10 and the base 20 is formed by plating the plating seed layer 74 exposed from the opening 76. The material used for plating is, for example, Ni-Fe.
[0054]
Next, as shown in FIGS. 23A5 and 23B5, the resist film 78 is removed using a chemical such as NMP (N-methyl-2-pyrrolidone).
Next, as shown in FIGS. 23A and 23B, the plating seed layer 74 exposed by removing the resist film 78 is removed by, for example, milling.
[0055]
Next, as shown in FIGS. 23A and 23B, the sacrificial layer 72 between the plating seed layer 74 and the substrate 70 is removed. For example, when the sacrifice layer 72 is made of copper, the sacrifice layer 72 is dissolved using an etching solution that dissolves copper. By dissolving the sacrificial layer 72, the substrate 70 is peeled off, and the probe unit 1 including the plating seed layer 74 and the plating layer 80 is obtained.
[0056]
In the present manufacturing method, if a step of forming the through hole 22 in the base 20 is added, the time for removing the sacrificial layer 72 can be reduced. Further, a metal layer may be further formed on the plating layer 80 at least at a contact portion of the probe 10 with the electrode 50, that is, a region including the tip 12 of the probe 10.
[0057]
FIG. 24 is a diagram illustrating a manufacturing method in which a step of further forming a metal layer 82 on the plating layer 80 is added. 24 (A1) and (A2) are plan views, and FIGS. 24 (B1) and (B2) are cross-sectional views corresponding to the cross section taken along line AA of FIG. 22 (A1).
After the steps of FIGS. 22 (A4) and (B4), as shown in FIGS. 24 (A1) and (B1), a metal having a lower volume efficiency than the plating layer 80, or a metal harder than the plating layer 80 is plated. By plating on the upper surface, the metal layer 82 is formed on the plating layer 80. For example, Au, Au-Cu, or the like is used for a metal having lower volume efficiency than the plating layer 80, and Pd, Rh, or the like is used for a metal harder than the plating layer 80.
[0058]
Next, by performing the steps of FIGS. 23 (A5) and (B5) and FIGS. 23 (A6) and (B6), as shown in FIGS. 24 (A2) and (B2), the plating seed layer 74 and the plating layer 80 are formed. And a probe unit 1 including the metal layer 82.
In the manufacturing method shown in FIG. 24, the metal layer 82 is formed on the entire surface of the plating layer 80. However, the metal layer 82 may be formed at least on the contact portion of the probe 10 with the electrode 50.
[0059]
(Second manufacturing method)
FIG. 25 to FIG. 27 are views showing the second manufacturing method. FIGS. 25 (A1) to 25 (A4), FIGS. 26 (A5) to 26 (A8), 27 (A9) and 27 (A10) are plan views. FIGS. 25 (B1) to 25 (B4), FIGS. 26 (B5) to 26 (B8), 27 (B9) and 27 (B10) correspond to the cross section taken along the line AA of FIG. 25 (A1). It is sectional drawing.
[0060]
First, as shown in FIGS. 25A1 and 25B1, a sacrificial layer 72 made of metal is formed on one entire surface of the substrate 70. For example, the sacrificial layer 72 is formed by sputtering copper or the like.
Next, as shown in FIGS. 25 (A2) and (B2), a protrusion forming sacrificial film 84 for forming the protrusion 30 of the distal end portion 12 of the probe 10 is formed on the sacrificial layer 72. Specifically, for example, a photoresist is applied to the upper surface of the sacrificial layer 72, prebaked, exposed using a mask having a predetermined shape, and then developed, so that the sacrificial portion formed in the shape of the projecting portion 30 is formed. A film 84 is formed. In addition to the photoresist, for example, a low-melting glass such as PSG, BSG, or BPSG, or a low-melting metal such as Pb, Sn, or In is used for the protrusion-forming sacrificial film 84.
[0061]
Next, as shown in FIGS. 25 (A3) and (B3), the projection-forming sacrificial film 84 is softened and then hardened after flowing, so that the projection-forming sacrificial film 84 is formed into a dome shape having a smooth spherical surface. . Specifically, for example, the sacrificial film 84 is softened and hardened by baking. Before baking, the softening point can be lowered by irradiating at least the portion of the sacrificial film 84 to be softened with UV light having a longer wavelength than i-line.
[0062]
Next, as shown in FIGS. 25 (A4), (B4), FIGS. 26 (A5), (B5) to FIGS. 26 (A8), (B8) and FIGS. 27 (A9), (B9), the first The steps of FIGS. 22 (A2) and (B2) to FIGS. 23 (A7) and (B7) are performed according to the manufacturing method.
Finally, as shown in FIGS. 27A and 27B, the protrusion-forming sacrificial film 84 is removed using a chemical such as NMP (N-methyl-2-pyrrolidone).
[0063]
By using the second manufacturing method, it is possible to manufacture the probe unit 1 having the probe 10 in which the protrusion 30 is formed at the distal end portion 12 as in the thirteenth to eighteenth configurations.
[0064]
<Example of using probe unit>
Hereinafter, a usage example of the probe unit 1 will be described.
[0065]
(First usage example)
FIG. 28 is a cross-sectional view showing a first usage example.
In the first usage example shown in FIG. 28, the probe unit 1 is fixed to the probe base 40 by joining the base 20 to the probe base 40, positioning the end at the end thereof, and locking the fixture with the fixture 42. When the positioning hole 24 is not provided in the base 20 as in the first and second configurations, the probe unit 1 is positioned on the probe base 40 by a method of positioning at the end of the base 20, and the base is fixed by the holding plate 43. The probe unit 1 is connected to a copper wire or a flexible printed wiring board (not shown), and further connected to an electric circuit of an inspection apparatus main body (not shown). When the flexible printed wiring board is lowered by the elevating function of the inspection apparatus main body, the tip 12 of the probe 10 is pressed against the electrode 50 of the sample 5. When the probe base 40 is made of a conductive material such as a metal, the wiring may be taken out via the probe base.
[0066]
(Second use example)
FIG. 29 is a cross-sectional view showing a second usage example.
The second use example shown in FIG. 29 differs from the first use example in the method of positioning the base 20. Specifically, the present invention is applied to the case where the positioning hole 24 is provided in the base 20 as in the third to twelfth configurations and the nineteenth configuration. First, the probe unit 1 is fixed to the probe base 40 by the fixture 42 of the base 20. After being set at the position, the fixture 42 is locked in the positioning hole 24, and the probe unit 1 is fixed to the probe base 40 by the pressing plate 43. With such a configuration, the position adjustment after the replacement of the probe unit becomes unnecessary, so that the stopping time of the inspection apparatus can be reduced, and the throughput can be increased.
[0067]
(Third use example)
FIG. 30 is a cross-sectional view showing a third usage example.
In the third usage example shown in FIG. 30, the probe unit 1 is arranged between the upper and lower probe bases 40a and 40b, and the fixture 42 is fastened to the positioning holes 24 to connect the probe unit 1 to the probe bases 40a and 40b. By pressing down, the probe unit 1 is fixed inside the probe base 40 and the probe 10 is bent. In particular, in the case of the integrated probe shown in FIG. 20, the relative position accuracy of the probe unit 1 can be improved by bending the base 20 and the probe 10. This usage example is applied to the probe unit 1 having the positioning hole 24 in the base 20 as in the third to twelfth configurations and the nineteenth configuration. The method for electrical connection to the test apparatus main body and the method for testing a sample using the lifting / lowering function of the test apparatus main body conform to the first use example.
[0068]
(Fourth usage example)
FIG. 31 is a cross-sectional view showing a fourth usage example.
In the fourth usage example shown in FIG. 31, the independent wiring type probe unit 7 is further used in addition to the connection type probe unit 1 of the present example having the probe sheet in which the probe 10 is connected at the base 20. The connection type probe unit 1 and the independent wiring type probe unit 7 are respectively fixed to the probe base 40 and further fixed to the printed wiring board 44 to form a plurality of probe cards 8. The connection type probe unit 1 is connected to the printed wiring board 44 by the electric wiring 46, and the independent wiring type probe unit 7 is connected to the printed wiring board 44 by the flexible printed wiring board 48. The connection type probe unit 1 and the independent wiring type probe unit 7 can be raised and lowered independently of each other. As shown in FIG. 31A, if both the connection type probe unit 1 and the independent wiring type probe unit 7 are brought into contact with the electrode 50 of the sample 5 and energized, the disconnection test of the sample 5 can be performed. As shown in FIG. 31 (B), when the connection type probe unit 1 is raised to separate the probe 10 from the electrode 50 and energized while only the independent wiring type probe unit 7 is in contact, short-circuit inspection of the sample 5 can be performed. It can be carried out.
[0069]
(Fifth usage example)
FIG. 32 is a sectional view showing a fifth usage example.
The fifth usage example shown in FIG. 32 is different from the fourth usage example in that one probe card 8 is configured by the connection type probe unit 1 and the independent wiring type probe unit 7. Specifically, one probe card 8 is configured by fixing the respective probe units 1 and 7 fixed to the probe base 40 to one and the same printed wiring board 44. By providing both the probe units 1 and 7 on one probe card 8, the probe units 1 and 7 simultaneously move up and down. As shown in FIG. 32 (A), by changing the heights of the tips of the probes of the probe units 1 and 7, power is supplied while the probe units 1 and 7 are both in contact with the electrode 50 of the sample 5. The disconnection test of the specimen 5 can be performed. Further, as shown in FIG. 32 (B), if only the probe unit 7 is brought into contact with the electrode 50 of the sample 5 and energized, the short-circuit test of the sample 5 can be performed.
[0070]
According to the probe unit 1 of the present embodiment, since the probe 10 is widened at the distal end portion 12, the contact area of the sample 5 with the electrode 50 can be increased, and the probe 10 can be prevented from falling off from the electrode 50. Thus, the specimen 5 can be reliably tested.
By arranging the tips of the plurality of probes 10 so as to be shifted in the arrangement direction of the plurality of probes 10, the width of the tip 12 of the probe 10 can be increased without increasing the pitch between the center axes of the probes 10. For this reason, the minimum distance in the arrangement direction of adjacent probes can be reduced. Therefore, versatility can be improved for a sample in which a plurality of elongated electrodes are provided in parallel without reducing the pitch of the central axis of each probe 10.
[0071]
By laminating a plurality of probe sheets each having a probe 10 formed at a pitch larger than the electrode pitch by widening at the distal end portion 12 so that the probes 10 of the respective probe sheets do not overlap each other, the probe 10 in one probe sheet is stacked. The probe unit 1 in which probes are arranged at a pitch smaller than the pitch of the electrodes, that is, at a pitch equal to or smaller than the electrode pitch can be configured. Accordingly, it is not necessary to reduce the pitch of the probes 10 in one probe sheet, so that the manufacturing cost can be reduced and the yield can be improved. Furthermore, since it is not necessary to make the pitch of the probe 10 fine, the wiring resistance of the probe 10 can be reduced, and the contact area with the electrode 50 can be improved. Inspection is easy.
[0072]
By forming the protruding portion 30 having a curved surface on the distal end portion 12 of the probe 10, the curved surface of the protruding portion 30 can be brought into contact with the electrode 50, and the electrode 50 is prevented from being damaged by the distal end portion 12 of the probe 10. it can.
Further, according to the manufacturing method of this embodiment, the fine probe 10 can be formed with high accuracy.
[Brief description of the drawings]
FIG. 1 is a plan view showing a correspondence between a probe unit 1 and a specimen 5 according to an embodiment of the present invention.
2A is a plan view showing a first configuration of a probe unit according to an embodiment of the present invention, FIG. 2B is a cross-sectional view taken along line aa of FIG. 2A, and FIG. It is a line sectional view (C).
3A is a plan view showing a second configuration of the probe unit according to the embodiment of the present invention, FIG. 3B is a cross-sectional view taken along the line aa of FIG. 3A, and FIG. It is a line sectional view (C).
4A is a plan view showing a third configuration of the probe unit according to the embodiment of the present invention, FIG. 4B is a sectional view taken along line aa of FIG. 4A, and FIG. It is a line sectional view (C).
5A is a plan view showing a fourth configuration of the probe unit according to the embodiment of the present invention, FIG. 5B is a sectional view taken along line aa of FIG. 5A, and FIG. It is a line sectional view (C).
6A is a plan view showing a fifth configuration of the probe unit according to the embodiment of the present invention, FIG. 6B is a cross-sectional view taken along line aa of FIG. 6A, and FIG. It is a line sectional view (C).
7A is a plan view showing a sixth configuration of the probe unit according to the embodiment of the present invention, FIG. 7B is a cross-sectional view taken along the line aa of FIG. 7A, and FIG. It is a line sectional view (C).
8A is a plan view illustrating a seventh configuration of the probe unit according to the embodiment of the present invention, FIG. 8B is a cross-sectional view taken along line aa of FIG. 8A, and FIG. It is a line sectional view (C).
9A is a plan view showing an eighth configuration of the probe unit according to the embodiment of the present invention, FIG. 9B is a cross-sectional view taken along line aa of FIG. 9A, and FIG. It is a line sectional view (C).
10A is a plan view showing a ninth configuration of a probe unit according to an embodiment of the present invention, FIG. 10B is a cross-sectional view taken along line aa of FIG. 10A, and FIG. It is a line sectional view (C).
11A is a plan view showing a tenth configuration of a probe unit according to an embodiment of the present invention, FIG. 11B is a cross-sectional view taken along line aa of FIG. 11A, and FIG. It is a line sectional view (C).
12A is a plan view showing an eleventh configuration of a probe unit according to an embodiment of the present invention, FIG. 12B is a cross-sectional view taken along line aa of FIG. 12A, and FIG. It is a line sectional view (C).
13A is a plan view showing a twelfth configuration of the probe unit according to the embodiment of the present invention, FIG. 13B is a cross-sectional view taken along line aa of FIG. 13A, and FIG. It is a line sectional view (C).
FIG. 14 is a perspective view showing a thirteenth configuration of the probe unit according to the embodiment of the present invention.
FIG. 15 is a perspective view showing a fourteenth configuration of the probe unit according to the embodiment of the present invention.
FIG. 16 is a perspective view showing a fifteenth configuration of the probe unit according to the embodiment of the present invention.
FIG. 17 is a perspective view showing a sixteenth configuration of the probe unit according to the embodiment of the present invention.
FIG. 18 is a perspective view showing a seventeenth configuration of the probe unit according to the embodiment of the present invention.
FIG. 19 is a perspective view showing an eighteenth configuration of the probe unit according to the embodiment of the present invention.
FIG. 20 is a plan view showing a nineteenth configuration of the probe unit according to the embodiment of the present invention.
21A is a plan view showing a conventional contact state between a probe unit and a sample, FIG. 21B is a cross-sectional view taken along line aa of FIG. 21A, and FIG. 21C is a plan view showing the contact state, FIG. 21C is a sectional view taken along line bb of FIG. 21C, and FIG. 21C is a sectional view taken along line cc of FIG. 21C.
FIG. 22 is a plan view (A) and a cross-sectional view (B) showing a first method of manufacturing a probe unit according to an embodiment of the present invention.
FIG. 23 is a plan view (A) and a cross-sectional view (B) showing a first method of manufacturing a probe unit according to an embodiment of the present invention.
FIGS. 24A and 24B are a plan view and a sectional view showing a first method for manufacturing a probe unit according to an embodiment of the present invention; FIGS.
FIG. 25 is a plan view (A) and a cross-sectional view (B) showing a second method of manufacturing the probe unit according to the embodiment of the present invention.
FIGS. 26A and 26B are a plan view and a cross-sectional view showing a second method for manufacturing a probe unit according to an embodiment of the present invention.
FIG. 27 is a plan view (A) and a cross-sectional view (B) showing a second method for manufacturing a probe unit according to an embodiment of the present invention.
FIG. 28 is a sectional view showing a first usage example of the probe unit according to the embodiment of the present invention.
FIG. 29 is a sectional view showing a second use example of the probe unit according to the embodiment of the present invention.
FIG. 30 is a sectional view showing a third use example of the probe unit according to the embodiment of the present invention.
FIG. 31 is a sectional view showing a fourth usage example of the probe unit according to the embodiment of the present invention.
FIG. 32 is a sectional view showing a fifth usage example of the probe unit according to the embodiment of the present invention.
FIG. 33 is a plan view showing the correspondence between the probe unit 1 and the sample 5 according to one embodiment of the present invention.
[Explanation of symbols]
1, 6 probe unit
2 First probe sheet
3 Second probe sheet
4 Third probe sheet
5 samples
10, 60 probes
12 Tip
14 Base end
20 base
22 through hole
30 protrusion
50 electrodes
72 Sacrificial layer
76 opening
78 Resist film
80 Plating layer

Claims (7)

A probe unit including a base portion and a comb-shaped probe sheet having a plurality of probes whose base ends are integrally connected at the base portion,
A probe unit, wherein the probe has a widened end portion. The probe unit according to claim 1, wherein tips of the plurality of probes are irregular in an arrangement direction of the plurality of probes. The probe unit according to claim 1, further comprising a dome-shaped protrusion at a tip end of the probe. The probe unit according to any one of claims 1 to 3, wherein a plurality of the probe sheets are stacked so that the probes do not overlap with each other. The probe unit according to claim 1, wherein a minimum distance d between the probes in the arrangement direction is d ≦ 0. The probe unit according to claim 1, wherein a plurality of through holes are formed in the base. Patterning step of forming a resist having an opening on the surface of the sacrificial layer made of metal,
A plating step of forming the probe sheet in the opening by plating;
Removing the resist;
The method according to claim 1, further comprising: removing the sacrificial layer.

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