JP2007279034A - Inspection device for flat panel display element test, and manufacturing method therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inspection device for a flat panel display element test, allowing various probe arrangements in response to a tendency of forming micro-finely a pad electrode of a flat panel display element, and capable of preventing a malfunction caused by short circuiting between the adjacent probes, and a method of manufacturing the inspection device without requiring manual work. <P>SOLUTION: The inspection device includes a substrate 100, a body 118 arranged on the substrate, the plurality of probes 115 projected extendedly from both sides of the body, and a probe chips 122 arranged in lower ends of the probes projected extendedly from one side face of the body. The each probe is coated with an insulating film. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an inspection apparatus for a flat panel display element test and a manufacturing method thereof.

  Generally, a flat panel display (FPD) includes a liquid crystal display (LCD), a plasma display panel (PDP), a field emission display (FED), and the like. Are known. Such a flat panel display element has a pad electrode for applying a signal, and a flat panel display element test is performed by using a probe capable of determining the presence or absence of a defect by applying an electric signal to the pad electrode.

  Here, the probe for flat panel display test includes a needle type manufactured by hand only (Needle type), a blade type manufactured by a combination of new technology and manual operation, and a film type ( film type) and MEMS type (MEMS type) using MEMS (Micro Electro Mechanical System) technology.

  The needle type probe has a step of bending a straight tungsten beam, a step of applying an adhesive to a reinforcing plate, and a coordinate position of a contact surface contacting a pad electrode requiring inspection and a contact surface contacting a signal transfer device. In order to match, the position is physically corrected, and the position-corrected inspection probe is cleaned. However, since such a series of processes is all performed manually, it takes a long time to manufacture, resulting in a high defect rate and a complicated process, resulting in reduced productivity.

  The blade type probe is manufactured from the steps of manufacturing a frame in which the blade is inserted, manufacturing the blade, inserting the blade, and covering a cover on the upper surface of the frame in which the blade is inserted. . However, some of these processes are still performed manually, and the manufacturing cost is particularly high.

  The MEMS type probe includes a step of manufacturing an inspection probe beam on the sacrificial layer, a step of removing the sacrificial layer, a step of covering the protective probe with the inspection probe, and a step of correcting the position of the inspection probe. It is manufactured from the stage of removing the noise generation factor. However, such a probe is known to have poor electrical and mechanical properties. In addition to the decrease in accuracy due to noise generation, there is a risk that probes that must be separated from each other may contact each other and short-circuit.

For example, Patent Document 1 discloses an invention relating to “a probe for inspecting a flat panel display element and a manufacturing method thereof”.
Special table 2006-507512

  The present invention is intended to solve the above-described problems, and its purpose is to enable various probe arrangements corresponding to the trend of miniaturization of pad electrodes of flat panel display elements, and between adjacent probes. An object of the present invention is to provide an inspection apparatus for testing a flat panel display element that can prevent malfunction due to a short circuit.

  Another object of the present invention is to provide a method for manufacturing the inspection apparatus for the flat panel display element test without manual operation.

In order to achieve the above object, an inspection apparatus for testing a flat panel display device according to an embodiment of the present invention includes a substrate, a body disposed on the substrate, and projecting on both side surfaces of the body. A plurality of probes, and a probe tip disposed at a lower end of a probe protruding from one side of the body among the probes.
The substrate is a silicon substrate.
The body is made of a ceramic material.
The probe to which the probe tip is attached is preferably coated with an insulating film.
In this invention, you may further provide the protrusion pin arrange | positioned at the upper end of the probe to which the said probe tip is not attached.

To achieve the above object, an inspection apparatus for testing a flat panel display device according to another embodiment of the present invention includes a first substrate, a first body disposed on the first substrate, and the first substrate. A plurality of first probes protruding from both side surfaces of one body, and a first probe tip disposed at a lower end of the first probe protruding from one side of the first body among the first probes. A second body attached to a lower portion of the first substrate; a second substrate disposed on the lower portion of the second body; and a plurality of second probes protruding from both side surfaces of the second body. And a second probe tip disposed at a lower end of the second probe protruding from one side surface of the second body among the second probes.
Preferably, the first probe tip and the second probe tip are arranged so as to be shifted from each other so as not to overlap in the vertical direction.

According to another aspect of the present invention, there is provided a method of manufacturing an inspection apparatus for testing a flat panel display device using a first mask film pattern on a substrate. Forming a seed layer on the substrate having the groove formed thereon, forming a first plating mold having an opening exposing the groove on the seed layer, and Forming a probe and a probe tip in an opening defined by one plating mold; removing the first plating mold; and exposing the seed layer and the probe exposed by removing the first plating mold. Forming a second plating mold having an opening that exposes a central portion of the probe coated with the insulating film on the resultant structure on which the insulating film is formed; and Second Forming a body in an opening defined by a plating mold; forming a second mask film pattern aligned with the body under the substrate; and using the second mask film pattern as an etching mask Removing both exposed portions of the substrate and the insulating film by performing the etching so that the probe and the probe chip are exposed, and removing the second mask film pattern. .
The first mask film pattern and the second mask film pattern may be formed of a photoresist film.
The first plating mold and the second plating mold can be formed of a photoresist film.
The insulating film may be formed of a polymer insulating material.
The body can be formed of ceramic.
The step of forming the probe and the probe tip can be performed using an electroplating method.

According to another aspect of the present invention, there is provided a method of manufacturing an inspection apparatus for testing a flat panel display device for forming a probe chip using a first mask film pattern on a substrate. Forming a groove; forming a seed layer on the substrate on which the groove is formed; forming a first plating mold having an opening exposing the groove on the seed layer; Forming a probe and a probe tip in an opening defined by the first plating mold, forming a second mask film pattern on the first plating mold and the probe, and using the second mask film pattern Forming a protruding pin on a partial surface of the probe; sequentially removing the second mask film pattern and the first plating mold; and a seed exposed by removing the first plating mold. And forming a third mask film pattern covering the protruding pins on a partial surface of the probe, forming an insulating film on an exposed surface exposed by the third mask film pattern, and the insulating film Forming a second plating mold that exposes a central portion of the probe coated with the insulating film together with the third mask film pattern, and the third mask film pattern and the second plating. Forming a body in an opening limited by a mold; forming a fourth mask film pattern aligned with the body under the substrate; and etching using the fourth mask film pattern as an etching mask. Removing both exposed portions of the substrate and the insulating film to expose the probe and the probe chip; and removing the fourth mask film pattern. Characterized in that it comprises the steps of, a.
The first to fourth mask film patterns may be formed of a photoresist film.
The first plating mold and the second plating mold can be formed of a photoresist film.

According to another aspect of the present invention, there is provided a method of manufacturing an inspection apparatus for testing a flat panel display device, wherein a first body is disposed on a first substrate, and the first body is provided. A plurality of first probes protrude from both side surfaces of the first probe, and a first probe tip is disposed at a lower end of the first probe protruding from one side of the first body among the first probes. Forming a first structure, a second body is disposed on the second substrate, a plurality of second probes projecting from both side surfaces of the second body, and the second probe includes: Forming a second structure in which a second probe tip is disposed at a lower end of a second probe protruding from one side of the second body; a bottom surface of the first substrate; and an upper surface of the second body. And a step of adhering To.
Preferably, the first probe and the second probe are arranged so as to be shifted from each other so as not to overlap in the vertical direction.

According to the inspection apparatus for flat panel display device test and the manufacturing method thereof according to the present invention, the following advantages can be obtained.
First, since the semiconductor manufacturing process can be applied instead of the conventional manual work, the defect rate that can occur in the manufacturing process is reduced, and mass production becomes possible.
Second, since the probe tip is disposed on the lower surface of the probe, it is possible to improve electrical and mechanical characteristics, and to minimize the scrub marks left on the pads of the flat panel display element during inspection. It becomes possible.
Thirdly, since the probe to which the probe tip is attached is coated with an insulating film, a signal short circuit does not occur even when adjacent probes contact each other, and it is possible to suppress malfunction due to a signal short circuit during inspection. .
Fourth, by forming the probe using the first plating mold having a sufficient thickness, it is not necessary to perform additional etching for securing the probe thickness in the related art.
Fifth, by forming a protruding pin at one end of the probe, the inspection drive integrated circuit can be manufactured in one piece, which can effectively eliminate the noise generated in the subsequent stage and facilitate the inspection device and the signal transfer device. It becomes possible to attach and detach.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the following examples are given to illustrate the present invention and are not intended to limit the scope of the present invention. Therefore, the present invention can be implemented in various ways within the scope of the present invention.

  1 to 8 are perspective views for explaining an inspection apparatus and a manufacturing method thereof for a flat panel display device test according to an embodiment of the present invention.

  First, as shown in FIG. 1, a first mask film pattern 102 is formed on a substrate 100. The substrate 100 may be a silicon substrate. The first mask film pattern 102 can be formed by an exposure and development process using a photoresist film. The first mask film pattern 102 has an opening 104, and a part of the surface of the substrate 100, that is, the surface of a part where a groove (described later) is formed is exposed through the opening 104. Thereafter, etching is performed using the first mask film pattern 102 as an etching mask, and grooves 106 having a certain depth are formed in the exposed portion of the substrate 100 as shown in FIG. Although only two grooves 106 are shown in the drawing, the number of grooves 106 is the same as the number of probes of the inspection apparatus. After the trench 106 is formed, the first mask film pattern 102 is removed.

  Subsequently, as shown in FIG. 3, the metal seed layer 108 is formed on the substrate 100 having the grooves 106, and the first plating mold 110 is formed thereon. The first plating mold 110 can be formed by an exposure and development process using a photoresist film. The first plating mold 110 is for probe formation and has an opening 112 that exposes a region where the probe is formed. The number of openings 112 is also the same as the number of probes, and one groove 106 overlaps each opening 112. The first plating mold 110 made of a photoresist film is formed to have a sufficient height about the probe thickness, and therefore it is not necessary to perform additional etching for securing the existing probe thickness.

  Thereafter, as shown in FIG. 4, the probe 114 is formed by electroplating using the seed layer 108 exposed through the opening (112 in FIG. 3) of the first plating mold 110. At this time, a probe tip (not shown) is formed in the groove (106 in FIG. 2). After forming the probe 114 together with the probe tip, the first plating mold 110 is removed. Then, as shown in FIG. 5, the entire structure on the substrate 100 is coated with an insulating film 109. The insulating film 109 may be an oxide film or a nitride film, and may be a polymer insulating material film.

  Subsequently, as shown in FIG. 6, a second plating mold 116 is formed on the insulating film 109. The second plating mold 116 can also be formed by an exposure and development process using a photoresist film. The second plating mold 116 is for forming a body 118 and has an opening for exposing a region where the body 118 is formed. Thereafter, the body 118 is formed by embedding a body material, for example, ceramic, in the opening formed by the second plating mold 116.

  Thereafter, as shown in FIG. 7, the second plating mold (116 in FIG. 6) is removed. By removing the second plating mold 116, the insulating film 109 and the probe 115 covered with the insulating film are exposed on the top. Subsequently, a second mask film pattern 120 is formed on the back surface of the substrate 100. The second mask film pattern 120 is disposed so as to overlap the body 118, whereby a part of the back surface of the substrate 100 is exposed.

  Thereafter, as shown in FIG. 8, the exposed portion of the substrate 100 is removed by etching using the second mask film pattern 120 as an etching mask, and the exposed portion of the insulating film 109 exposed by the removal of the substrate 100 is continued. Removed. Thereafter, the second mask film pattern 120 is removed. As a result, as shown in the figure, a frame having a structure in which the substrate 100, the insulating film 109, and the body 118 are sequentially stacked is formed, and the probe 115 covered with the insulating film 109 is exposed from both sides of the frame to the outside. I will be struck. The probe tip 122 is disposed on the lower surface of any one of the probes 115 extending from both side surfaces of the frame, that is, in the direction in which the substrate 100 is disposed. The probe 115 on which the probe tip 122 is not arranged is connected to an electric signal transfer device (not shown) for applying an electric signal for inspection during a flat panel display element test.

  According to such an inspection apparatus, since the probe chip 122 is disposed at the lower end of the probe 115, accurate contact can be made even if the pad of the flat panel display element to be inspected is finely positioned. it can. In addition, since the probe 115 is coated with an insulating film, an electrical short circuit does not occur even when adjacent probes 115 come into contact with each other, and high reliability can be ensured.

  9 to 16 are perspective views for explaining an inspection apparatus for a flat panel display device test and a method for manufacturing the same according to another embodiment of the present invention.

  As shown in FIG. 16, the inspection apparatus according to the present embodiment is different from the above-described embodiment in that the protruding pin 206 is disposed at the end of the conductive probe 114 in addition to the probe tip 122. Specifically, by performing the steps described with reference to FIGS. 1 to 4, the probe 114 limited by the opening (112 in FIG. 3) of the first plating mold 110 is formed. A probe tip (not shown) is formed in (106 in FIG. 2).

  Thereafter, as shown in FIG. 9, a second mask film pattern 202 is formed on the resultant product shown in FIG. The second mask film pattern 202 can also be formed by an exposure and development process using a photoresist film. The second mask film pattern 202 has an opening 204, and a part of the surface of the probe 114, that is, the surface of the part where the protruding pin is formed is exposed by the opening 204.

  After that, as shown in FIG. 10, protruding pins 206 are formed to embed the opening 204 by electroplating using an exposed surface of the probe 114 exposed by the opening 204 as a seed layer.

  Thereafter, the second mask film pattern 202 and the first plating mold 110 are sequentially removed. As a result, as shown in FIG. 11, the seed layer 108 is disposed on the substrate 100, and the probe 114 is disposed on the seed layer 108. A protruding pin 206 is disposed on the upper surface of one end of the probe 114, and a probe tip (not shown) is disposed on the lower surface of the other end of the probe 114, although not shown.

  Thereafter, as shown in FIG. 12, the seed layer 108 is removed to expose a partial surface of the substrate 100. Then, a third mask film pattern 208 that covers the exposed surface of the substrate 100 and a part of the probe 114 is formed. The third mask film pattern 208 can also be formed by an exposure and development process using a photoresist film. The protruding pin (206 in FIG. 11) of the probe 114 is covered by the third mask film pattern 208.

  Thereafter, as shown in FIG. 13, an insulating film is coated on a portion exposed by the third mask film pattern 208, that is, on a partial surface of the substrate 100 and a partial surface of the probe 114. As a result, the insulating film 109 is formed on the substrate 100, and the insulated probe 210 is formed on the insulating film 109. The insulating film 109 may be an oxide film, a nitride film, or a polymer insulating material film.

  Thereafter, as shown in FIG. 14, a second plating mold 116 is formed on the insulating film 109. The second plating mold 116 can also be formed by an exposure and development process using a photoresist film. The second plating mold 116 is for forming the body 118 together with the third mask film pattern 208, and has an opening that exposes a region where the body 118 is formed. Here, the central portion of the probe (210 in FIG. 13) is exposed through the opening. Subsequently, the body 118 is formed by embedding a body material, for example, ceramic, in the opening formed by the second plating mold 116.

  Thereafter, as shown in FIG. 15, the second plating mold (116 in FIG. 14) and the third mask film pattern (208 in FIG. 14) are removed. Since the second plating mold 116 and the third mask film pattern 208 are formed of a photoresist film, they can be simultaneously removed by a normal strip process. Since the second plating mold 116 and the third mask film pattern 208 are removed, the probes 114 and 210 extending from both sides of the body 118 are exposed at the upper part. The probe 114 has conductivity, and the probe 115 has a structure covered with an insulating film. The conductive probe 114 has a protruding pin 206 disposed on the upper surface, and a probe tip (not shown) is disposed on the lower surface of the probe 115 covered with an insulating film, although not shown. Subsequently, a fourth mask film pattern 120 is formed on the back surface of the substrate 100. The fourth mask film pattern 120 is disposed so as to overlap the body 118, thereby exposing a part of the back surface of the substrate 100.

  Thereafter, as shown in FIG. 16, the exposed portion of the substrate 100 is removed by etching using the fourth mask film pattern 120 as an etching mask, and then the exposed portion of the insulating film 109 exposed by removing the substrate 100 is also removed. . Thereafter, the second mask film pattern 120 is removed. As a result, as shown in the figure, a frame having a structure in which the substrate 100, the insulating film 109, and the body 118 are sequentially laminated is formed, and conductive probes and insulated probes 210 are formed on both sides of the body 118. Each projectes. The probe tip 122 is disposed in the lower surface of the insulated probe 210, that is, in the direction in which the substrate 100 is disposed. On the other hand, the protruding pins 206 are arranged on the upper surface of the conductive probe 114, that is, in the direction opposite to the direction in which the substrate 100 is arranged. The protruding pins 206 are connected to an electric signal transfer device (not shown) that applies an electric signal for inspection during a flat panel display element test.

  FIG. 17 is a view for explaining an inspection apparatus and a manufacturing method thereof for a flat panel display device test according to still another embodiment of the present invention.

  Referring to FIG. 17, the inspection apparatus according to this embodiment is different from the above-described embodiment in that it has a multilayer structure instead of a single layer structure. Specifically, in the inspection apparatus of this embodiment, the upper first inspection apparatus 300 and the lower second inspection apparatus 400 are attached to each other. The first inspection apparatus 300 has a structure in which a first body 118a is stacked on a first substrate 100a with a first insulating film 109a interposed. An insulated first probe 210a protrudes from one side of the first body 118a, and a conductive first probe 114a protrudes from the other side of the first body 118a. A first probe tip 122a is disposed on the lower surface of the insulated first probe 210a, and a first protruding pin 206a is disposed on the upper surface of the conductive first probe 114a. Similarly, an insulated second probe 210b projects from one side of the second body 118b, and a conductive second probe 114b projects from the other side of the second body 118b. A second probe tip 122b is disposed on the lower surface of the insulated second probe 210b, and a second protruding pin 206b is disposed on the upper surface of the conductive second probe 114b.

  The first inspection device 300 and the second inspection device 400 are joined by an adhesive 500 interposed between the lower surface of the first substrate 100a and the upper surface of the second body 118b. In this case, the first probe tip 122a and the second probe tip 122b are arranged in a structure that does not stack in the vertical direction, that is, a structure that is shifted from each other. As described above, the first probe tip 122a and the second probe tip 122b having a multilayer structure are arranged so as to be shifted from each other, thereby reducing the number of probe tips and the inspectable pitch.

  Although the present invention has been described in detail above with reference to preferred embodiments, the present invention is not limited to the above embodiments, and those who have ordinary knowledge in the field within the technical idea of the present invention. Naturally, various modifications are possible.

It is a figure for demonstrating the inspection apparatus for the flat panel display element test by Example 1, and its manufacturing method. It is a figure for demonstrating the inspection apparatus for the flat panel display element test by Example 1, and its manufacturing method. It is a figure for demonstrating the inspection apparatus for the flat panel display element test by Example 1, and its manufacturing method. It is a figure for demonstrating the inspection apparatus for the flat panel display element test by Example 1, and its manufacturing method. It is a figure for demonstrating the inspection apparatus for the flat panel display element test by Example 1, and its manufacturing method. It is a figure for demonstrating the inspection apparatus for the flat panel display element test by Example 1, and its manufacturing method. It is a figure for demonstrating the inspection apparatus for the flat panel display element test by Example 1, and its manufacturing method. It is a figure for demonstrating the inspection apparatus for the flat panel display element test by Example 1, and its manufacturing method. It is a figure for demonstrating the test | inspection apparatus for the flat panel display element test by Example 2, and its manufacturing method. It is a figure for demonstrating the test | inspection apparatus for the flat panel display element test by Example 2, and its manufacturing method. It is a figure for demonstrating the test | inspection apparatus for the flat panel display element test by Example 2, and its manufacturing method. It is a figure for demonstrating the test | inspection apparatus for the flat panel display element test by Example 2, and its manufacturing method. It is a figure for demonstrating the test | inspection apparatus for the flat panel display element test by Example 2, and its manufacturing method. It is a figure for demonstrating the test | inspection apparatus for the flat panel display element test by Example 2, and its manufacturing method. It is a figure for demonstrating the test | inspection apparatus for the flat panel display element test by Example 2, and its manufacturing method. It is a figure for demonstrating the test | inspection apparatus for the flat panel display element test by Example 2, and its manufacturing method. It is a figure for demonstrating the inspection apparatus for the flat panel display element test by Example 3, and its manufacturing method.

Explanation of symbols

100 substrate 100a first substrate 102 first mask film pattern 104 opening 114a first probe 106 groove 108 metal seed layer 118a first body 109 insulating film 109a first insulating film 110 first plating mold 112 opening 114 probe 114b second Probe 115 Probe 116 Second plating mold 118 Body 118b Second body 120 Second mask film pattern 122 Probe chip 122b Second probe chip 122a First probe chip 202 Second mask film pattern 204 Opening 206 Projection pin 206a First projection pin 206b Second protruding pin 208 Third mask film pattern 210 Probe 210a First probe 210b Second probe 300 First inspection device 400 Second inspection device 500 Adhesive

Claims (18)

A substrate,
A body disposed on the substrate;
A plurality of probes protruding from both sides of the body;
Among the probes, a probe tip disposed at the lower end of a probe protruding from one side of the body,
An inspection apparatus for testing a flat panel display element.   The inspection apparatus for testing a flat panel display device according to claim 1, wherein the substrate is a silicon substrate.   The inspection apparatus for testing a flat panel display device according to claim 1, wherein the body is made of a ceramic material.   The inspection apparatus for testing a flat panel display device according to claim 1, wherein the probe to which the probe chip is attached is coated with an insulating film.   The inspection apparatus for testing a flat panel display device according to claim 1, further comprising a protruding pin disposed at an upper end of the probe to which the probe tip is not attached. A first substrate;
A first body disposed on the first substrate;
A plurality of first probes protruding from both side surfaces of the first body;
A first probe tip disposed at a lower end of a first probe protruding from one side of the first body of the first probes;
A second body attached to a lower portion of the first substrate;
A second substrate disposed under the second body;
A plurality of second probes protruding from both side surfaces of the second body;
A second probe tip disposed at a lower end of a second probe protruding from one side surface of the second body among the second probes;
An inspection apparatus for testing a flat panel display element.   The inspection apparatus for testing a flat panel display device according to claim 6, wherein the first probe tip and the second probe tip are arranged so as to be shifted from each other so as not to overlap each other in the vertical direction. Forming a groove for forming a probe chip on the substrate using the first mask film pattern;
Forming a seed layer on the grooved substrate;
Forming a first plating mold having an opening exposing the groove on the seed layer;
Forming a probe and a probe tip in an opening defined by the first plating mold;
Removing the first plating mold;
Forming an insulating film on the exposed surface of the seed layer and the probe exposed by removing the first plating mold; and
Forming a second plating mold having an opening for exposing a central portion of the probe coated with the insulating film on the resultant structure formed with the insulating film;
Forming a body in the opening defined by the second plating mold;
Forming a second mask film pattern aligned with the body under the substrate;
Removing both exposed portions of the substrate and the insulating film by etching using the second mask film pattern as an etching mask so that the probe and the probe chip are exposed; and
Removing the second mask film pattern;
The manufacturing method of the test | inspection apparatus for a flat panel display element test characterized by including these.   The method of claim 8, wherein the first mask film pattern and the second mask film pattern are formed of a photoresist film.   9. The method of manufacturing an inspection apparatus for a flat panel display device test according to claim 8, wherein the first plating mold and the second plating mold are formed of a photoresist film.   The method of claim 8, wherein the insulating film is formed of a polymer insulating material.   The method according to claim 8, wherein the body is made of ceramic.   The method according to claim 8, wherein the forming of the probe and the probe tip is performed using an electroplating method. Forming a groove for forming a probe chip on the substrate using the first mask film pattern;
Forming a seed layer on the grooved substrate;
Forming a first plating mold having an opening exposing the groove on the seed layer;
Forming a probe and a probe tip in an opening defined by the first plating mold;
Forming a second mask film pattern on the first plating mold and the probe;
Forming a projecting pin on a partial surface of the probe using the second mask film pattern;
Sequentially removing the second mask layer pattern and the first plating mold;
Forming a third mask film pattern covering the protruding pins on a part of the seed layer and the probe exposed by removing the first plating mold;
Forming an insulating film on an exposed surface exposed by the third mask film pattern;
Forming a second plating mold on the resultant structure on which the insulating film is formed to expose a central portion of the probe coated with the insulating film together with the third mask film pattern;
Forming a body in the opening defined by the third mask film pattern and the second plating mold;
Forming a fourth mask film pattern aligned with the body under the substrate;
Removing both exposed portions of the substrate and the insulating film by etching using the fourth mask film pattern as an etching mask so that the probe and the probe chip are exposed; and
Removing the fourth mask film pattern;
The manufacturing method of the test | inspection apparatus for a flat panel display element test characterized by including these.   The method of claim 14, wherein the first to fourth mask film patterns are formed of a photoresist film.   The method according to claim 14, wherein the first plating mold and the second plating mold are formed of a photoresist film. A first body is disposed on the first substrate, and a plurality of first probes protrude from both side surfaces of the first body, and one of the first probes protrudes from one side of the first body. Forming a first structure in which a first probe tip is disposed at a lower end of the first probe to be arranged;
A second body is disposed on the second substrate, a plurality of second probes projecting from both side surfaces of the second body, and one of the second probes projecting from one side of the second body. Forming a second structure in which the second probe tip is disposed at the lower end of the second probe,
Attaching the bottom surface of the first substrate and the top surface of the second body;
The manufacturing method of the test | inspection apparatus for a flat panel display element test characterized by including these.   The method of claim 17, wherein the first probe and the second probe are arranged so as to be shifted from each other so as not to overlap in the vertical direction. .