JP3974389B2 - Manufacturing method of contact type probe - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a semiconductor chip, contact professional for electrical inspection to the display device or a circuit board or the like - about Bed of preparation.
[0002]
[Prior art and its problems]
Connection terminals such as semiconductor chips, display elements, and circuit boards have a narrow pitch and an increased number of terminals. In the conventional probe, a pin having a needle-like tip is fixed to a predetermined position on a plate serving as a support by press-fitting or bonding. When dealing with a pitch narrower than the diameter of the pin, it is necessary to arrange in a plurality of rows, and high-precision positioning is required. Furthermore, since the pins are arranged one by one, there is a problem that the manufacturing time and cost increase with the increase in the number of pins.
[0003]
Accordingly, the present invention is narrow high definition pin corresponding to the pitch terminal can be positioned accurately formed, contact which can be formed collectively regardless of the number of pins pro - providing a blanking process for producing To do.
[0004]
[Means for Solving the Problems]
In the present invention, a high-definition metal column to be a contact terminal is formed with high positional accuracy by an additive method, an insulating resin is formed on the formed metal column by an electrodeposition method, and insulation is performed by a dry etching method or a wet etching method. By removing a part of the resin and projecting only the tip of the metal column, a contact probe corresponding to a narrow pitch and multiple pins is formed.
[0005]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 is a manufacturing process diagram of a contact probe according to an embodiment of the present invention.
First, as shown in FIG. 1A, for example, a required lead-out wiring 2 is formed on the insulating base substrate 1 by a subtractive method or an additive method.
[0006]
Next, a plating mask 3 for forming a metal pillar to be a contact terminal is formed at the tip of the lead-out wiring 2 as shown in FIG. 2B, and then the other of the lead-out lines 2 is shown in FIG. The metal pillar 4 is formed by plating a metal such as copper or nickel.
Thereafter, by forming the resin layer 5 on the surface of the metal column 4 by the electrodeposition method while leaving the plating mask 3, the formation of the insulating resin layer to be formed later can be given directionality.
Therefore, as shown in FIG. 4 (4), after the plating mask 3 is removed, the insulating resin layer 6 is formed on the lead-out wiring 2 and the metal pillar 4 by the electrodeposition method.
[0007]
Thereafter, as shown in FIG. 5 (5), a predetermined amount of the surface of the insulating resin layer 6 is removed together with the resin layer 5 by a dry etching method such as oxygen plasma or a wet etching method using a chemical solution such as strong alkali. Project the part.
[0008]
【The invention's effect】
According to the present invention, since a multi-pin contact probe corresponding to a narrow pitch can be formed with low cost and high accuracy, it can be suitably used for probing to a high-density terminal.
[0009]
In addition, since the periphery of the metal column that becomes the probe is reinforced with an insulating resin layer to increase the rigidity, even when the metal columns are formed minutely and densely, the probe can be prevented from being damaged at the time of contact.
[Brief description of the drawings]
FIG. 1 is a manufacturing process diagram of a contact probe showing an embodiment of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Insulation base base material 2 Lead-out wiring 3 Plating mask 4 Metal pillar 5 Resin layer 6 Insulating resin layer

Claims (1)

Pull the plating mask is formed on the tip of the wire, then plated with metal to form a metal pillar by supplying current from the other lead lines, on the surface of the metal pillar formed while the plating means leaving the plating mask A resin layer is formed by electrodeposition, the plating mask is removed, an insulating resin layer is formed on the lead- out wiring and the metal pillar by electrodeposition, and then a dry etching method such as oxygen plasma or a chemical solution such as strong alkali is used. By removing a predetermined amount of the surface of the insulating resin layer by the used wet etching method, only the tip of the metal column that becomes a contact portion is protruded from the insulating resin layer, and the insulating resin layer is integrated with the metal column. A manufacturing method of a contact type probe formed to increase the rigidity of the metal column .

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