JPS58100439A - Prober - Google Patents

Abstract

PURPOSE:To obtain favorable precision of the position at a prober by a method wherein probe terminals are formed by performing chemical etching to an epoxy glass material. CONSTITUTION:The probe terminals 2 of a probe card 1 for inspection consisting of the epoxy glass material are cut according to chemical etching to form the prescribed pattern, the tip sides are bent downward, the fellow bent parts are fixed mutually by a fixing ring 3 having the square ring type plane form. A copper plating layer 4 is formed as the conductive layer on the back side of the probe terminal 2, and the tip part is formed in a projection type as the terminal part 7 for the inspection to come in contact with a matter to be inspected, the electrode pad of a semiconductor pellet 6 on a supporting base 5, for example. The tip sides of the probe terminals 2 are extended in a hole 8 of the probe card 1, and the opposite sides are connected to connectors through printed wirings 9 provided at every probe terminal 2 in a large number.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a propper that can perform proving with high precision.

In general, for example integrated circuits (ICs) and large-scale integration (9)
2. Description of the Related Art In the manufacturing process of semiconductor devices such as LSI circuits (LSI), probing is performed on electrode pads on a semiconductor wafer using a blower 7 to test electrical characteristics.

In this case, conventionally, a glow 2 in which a number of tungsten needles are arranged at the tips of a glass epoxy substrate is used, and inspection is performed by bringing the tips of the needles into contact with electrode pads.

However, in the case of such a conventional processor, the positioning accuracy of the needle is very poor, so there are problems in that the inspection time is long and the inspection accuracy is also reduced.

In particular, as LSIs and other devices become smaller and have more pins, it has become extremely difficult to make accurate contact between the needle of the PCB and the electrode pad. Put it away.

SUMMARY OF THE INVENTION An object of the present invention is to provide a prober that can solve the problem of interlayer points in the prior art and perform highly accurate probing.

In order to achieve this purpose, the blow 7 according to the present invention performs probing using a conductive plating layer formed on the back surface of a probe terminal cut into a predetermined pattern.
The tip of the conductive plating layer is formed as a test terminal part, and the probe terminal pattern is preferably formed by chemical etching.

Hereinafter, the present invention will be explained according to an embodiment shown in the drawings.

FIG. 1 is a schematic perspective view showing an entire embodiment of a prober according to the present invention, and FIG. 2 is a partial sectional view of the probe terminal portion thereof.

In this embodiment, the test probe terminals 2 of the probe card 1 are made of glass epoxy material, and are formed in a predetermined pattern to match the pattern (not shown) of the circuit to be tested. In this case, pattern formation is performed by chemical etching in this embodiment. As a result, the probe terminal 2 of this embodiment has very good positional accuracy and can accurately blow into electrode pads with minute circuit configurations.

After each probe terminal 2 is cut into a predetermined pattern by chemical etching, the tip side is bent downward as shown in FIG. They are being chased by each other.

A copper plating layer 4 is formed as a conductive layer on the back side of the probe terminal 2. The tip of this copper plating layer 4 is
An object to be inspected, for example, a bovine conductor pellet 6 on a supporting pace 5
The test terminal portion 7 is formed in a protruding shape as the test terminal portion 7 that comes into contact with the electrode pad.

This test terminal portion 7 is produced by growing steel on the tip of the probe terminal 2 by plating.

As shown in FIG. 1, the tip of the probe terminal 2 extends into the hole 8 of the probe card 1, and the opposite end is connected to a connector (not shown) via a large number of printed wiring 9 provided for each probe terminal 2. .

In this embodiment, since the probe terminal 2 is formed by chemically etching the glass epoxy material, the positional accuracy of the probe terminal 2 is determined by the etching accuracy, and extremely good positional accuracy can be obtained. Moreover,
The test terminal portion 7 is formed by growing steel by plating, and is integrated with the probe terminal 2 and the copper plating layer 4 formed on the back side thereof.

Therefore, this embodiment can perform very accurate probing.

It should be noted that Akira Hongo is not limited to the above embodiments, and other probe materials, metal materials, etc. may be used.
Other variations are also possible.

As explained above, according to the present invention, accurate blobbing can be obtained with extremely high precision.

[Brief explanation of drawings]

FIG. 15 is a schematic perspective view of an embodiment of the prober according to the present invention, and FIG. 2 is a partial sectional view of the probe terminal portion. 1... Probe card, 2... Probe terminal, 3...
... Fixed ring, 4... Copper plating layer, 5... Support base, 6... Cattle conductor pellet, 7... Terminal part for inspection, 8... Hole, 9... Printed wiring. Figure 1

Claims (1)

[Claims] 1. A probe terminal comprising a probe terminal formed and glued in accordance with the pattern of the object to be inspected, and a conductive plating layer formed on the back surface of each probe terminal and having an inspection terminal portion grown at the tip. property. 2. The prober according to claim 1, wherein the pattern of the probe terminal is formed by chemical etching. 3. The prober according to claim 1 or 2, wherein the conductive plating layer is a copper plating layer.