JPH0656779U - Inspection equipment for printed circuit boards, etc. - Google Patents

Inspection equipment for printed circuit boards, etc.

Info

Publication number
JPH0656779U
JPH0656779U JP9568691U JP9568691U JPH0656779U JP H0656779 U JPH0656779 U JP H0656779U JP 9568691 U JP9568691 U JP 9568691U JP 9568691 U JP9568691 U JP 9568691U JP H0656779 U JPH0656779 U JP H0656779U
Authority
JP
Japan
Prior art keywords
small
hole
insulating plate
column portion
diameter column
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9568691U
Other languages
Japanese (ja)
Inventor
光夫 南
Original Assignee
株式会社モリモト
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社モリモト filed Critical 株式会社モリモト
Priority to JP9568691U priority Critical patent/JPH0656779U/en
Publication of JPH0656779U publication Critical patent/JPH0656779U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】 【目的】 プローブピンにおけるスリーブをなくすこと
で、接続端子のピッチ間隔が0.2mm以下という極小ピ
ッチ検査を可能とする。 【構成】 プローブピン10は、上下対称形の一対のコ
ンタクトピン11とこれを電気的接続しているコイルス
プリング12とから構成され、該プローブピン10は絶
縁板20に穿設され、かつスルーホールメッキ22の処
理がなされた極小貫通孔21及び絶縁板20の上下面に
重合取り付けのガイド板30の貫通孔31内にそのコン
タクトピン上部を突出せしめ、かつ貫通孔31と絶縁板
極小貫通孔21との段部32でコンタクトピン11が抜
け出ないようにして遊挿され、上部コンタクトピン11
に基板100が電気的接触し、下部コンタクトピン11
が測定手段と導通の基板パターン42と電気的接触して
基板100等の回路動作が検査される。
(57) [Abstract] [Purpose] By eliminating the sleeve on the probe pin, it is possible to perform extremely small pitch inspection with a pitch interval of the connection terminals of 0.2 mm or less. The probe pin 10 includes a pair of vertically symmetrical contact pins 11 and a coil spring 12 electrically connecting the contact pins 11. The probe pin 10 is formed in an insulating plate 20 and has a through hole. The contact pin upper portion is projected into the through hole 31 of the guide plate 30 superposed on the upper and lower surfaces of the extremely small through hole 21 and the insulating plate 20 which have been subjected to the plating 22, and the through hole 31 and the extremely small insulating plate through hole 21. The contact pin 11 is loosely inserted in the step portion 32 with the upper contact pin 11 so as not to come out.
The substrate 100 makes electrical contact with the lower contact pin 11
Is electrically contacted with the board pattern 42 which is electrically connected to the measuring means, and the circuit operation of the board 100 or the like is inspected.

Description

【考案の詳細な説明】[Detailed description of the device]

【0001】[0001]

【産業上の利用分野】[Industrial applications]

本考案は、プリント基板等の回路動作の検査装置に関し、更に詳しくは、プリ ント基板およびIC、LCD等の極小ピッチ検査に最適な装置に関する。 The present invention relates to a circuit operation inspection device for a printed circuit board or the like, and more particularly to a device optimal for a very small pitch inspection of a printed circuit board or IC, LCD or the like.

【0002】[0002]

【従来の技術とその問題点】[Prior art and its problems]

周知のように、半導体集積回路(IC)は出現当初その接続端子として2.5 4mmピッチを持つ所謂デュアルインラインパッケージとして提供され、これら を搭載してより上位の電子回路機能体を得るため、通常印刷回路配線板上にIC を始めとする回路部品を搭載接続してプリント基板とし、高機能の電子機器等に おける制御回路を構成していた。したがって、これらの配線板等の接続端子部材 に電気的接触させて、各種の試験や検査を実行するためのプローブピンもまた2 .54mmピッチ格子に対応するものが主体であった。 As is well known, a semiconductor integrated circuit (IC) is initially provided as a so-called dual in-line package having a 2.54 mm pitch as its connection terminal, and is usually mounted in order to obtain a higher-order electronic circuit function body. On the printed circuit wiring board, circuit components such as ICs are mounted and connected to form a printed circuit board, which constitutes a control circuit in high-performance electronic equipment. Therefore, probe pins for making various tests and inspections by making electrical contact with the connection terminal members such as these wiring boards are also referred to in 2. Most of them corresponded to a 54 mm pitch grating.

【0003】 しかしながら、近年のように半導体とその利用分野における諸技術の発展に伴 い、ICが次第に高速化、高集積化されると共に、その接続端子も細小化されて プリント基板における高密度化実装、高信頼化の要求が益々強まって、搭載部品 の高密度化の一例として表面実装部品による接続端子のピッチ間隔が2.54m m→1.27mm→0.635mmと狭くなって小形化、チップ化が進行し、プ リント基板における導体パターン幅、パターン間隔も極小化するようになってき ておりこの接続端子のピッチ間隔の極小化に伴い、プローブピンも製作可能な限 り極小化が求められている。However, along with the recent development of semiconductors and various technologies in the fields of use thereof, ICs have been progressively increased in speed and integration, and their connection terminals have been miniaturized to increase the density of printed circuit boards. As demands for mounting and high reliability have increased more and more, as an example of increasing the density of mounted components, the pitch of the connection terminals by surface mounting components is narrowed from 2.54 mm → 1.27 mm → 0.635 mm, and miniaturization, As the number of chips has progressed, the conductor pattern width and pattern interval on the printed circuit board have also been minimized.With the minimization of the pitch interval of the connection terminals, the minimization of probe pins is also required. Has been.

【0004】 ところで、従来この種プローブピンとしては、スリーブを使用したものがある が、スリーブの外径には限界があり、スリープの外径は2.54mm→1.27 mm→0.635mmに対応して例えば0.8mm→0.4mm→0.2mmが 必然的に期待され、極小ピッチに対応させようとすると、製作が極めて困難で、 コスト高になるという問題点があった。By the way, there is a conventional probe pin using a sleeve, but the outer diameter of the sleeve is limited, and the outer diameter of the sleep is 2.54 mm → 1.27 mm → 0.635 mm. Correspondingly, for example, 0.8 mm → 0.4 mm → 0.2 mm is expected, and when it is attempted to cope with a very small pitch, there is a problem that the manufacturing is extremely difficult and the cost becomes high.

【0005】 また、プローブカード及び鋼線の弾性を利用した極小ピッチの検査フィクチャ ーも存するがこれはストロークが非常に小さく(0.2〜0.3mm)、そのた め製品によっては検査が極めて困難であるという問題点があった。There is also an extremely small-pitch inspection fixture that uses the elasticity of the probe card and steel wire, but this has a very small stroke (0.2 to 0.3 mm), so inspection is extremely difficult depending on the product. There was a problem that it was difficult.

【0006】 本考案は、このような従来の技術が有する問題点に鑑みなされたもので、その 目的とするところは、接続端子のピッチ間隔が0.2mm以下という極小ピッチ 検査に充分に対応できるプリント基板等の検査装置を提供することにある。The present invention has been made in view of the problems of the conventional technique, and an object of the present invention is to sufficiently cope with an extremely small pitch inspection in which the pitch of the connection terminals is 0.2 mm or less. It is to provide an inspection device for a printed circuit board or the like.

【0007】[0007]

【問題点を解決するための手段】[Means for solving problems]

この目的のため、本考案は、絶縁板に植設のプロープピンをプリント基板等に 電気的接触させて該プリント基板等の回路動作を検査する装置において、前記プ ローブピン10は、先端接触部13を有する断面円形の小径柱部14と該小径柱 部14と同軸状の断面円形の大径柱部16及び小径嵌入柱部18を有する一対の コンタクトピン11が、上下対称形にして、かつその各小径嵌入柱部18、18 に対するコイルスプリング12の両端部の圧入をもって電気的接続されて構成さ れると共に、該プローブピン10は、前記絶縁板20に穿設され、かつスルーホ ールメッキ22の処理が施された極小貫通孔21内にその上下の小径柱部14を 突出せしめた状態で遊挿され、前記絶縁板20の上下面には、その貫通孔31を 介して前記小径柱部14を突出せしめ、かつ該貫通孔31と前記絶縁板20の極 小貫通孔21との段部32で前記小径柱部14と大径柱部16との段部15が係 止せられて抜け出ないようにされたガイド板30が取り外し可能に重合取り付け られ、更に前記プローブピン10のいずれか一方の先端接触部13が、回路動作 の測定手段と電気的接続の基板40と電気的接触状態にある構成を特徴とするも のである。 To this end, the present invention provides an apparatus for inspecting the circuit operation of a printed circuit board or the like by electrically contacting a probe pin implanted in an insulating plate with the printed circuit board or the like. A pair of contact pins 11 having a small-diameter column portion 14 having a circular cross-section, a large-diameter column portion 16 having a circular cross-section coaxial with the small-diameter column portion 14, and a small-diameter fitting column portion 18 are vertically symmetrical and The probe pin 10 is electrically connected by press-fitting both ends of the coil spring 12 into the small-diameter fitting column parts 18, 18, and the probe pin 10 is formed in the insulating plate 20 and processed by through-hole plating 22. The small-diameter column portions 14 above and below are inserted into the formed minimal through-holes 21 in a loosened state, and the small-diameter column portions 14 are inserted into the upper and lower surfaces of the insulating plate 20 through the through-holes 31. The portion 14 is projected, and the step portion 15 of the small-diameter column portion 14 and the large-diameter column portion 16 is locked by the step portion 32 of the through hole 31 and the minimum through hole 21 of the insulating plate 20 and is pulled out. A guide plate 30 that is not removed is removably superposed and attached, and the tip contact portion 13 of either one of the probe pins 10 is brought into electrical contact with the circuit operation measuring means and the electrical connection substrate 40. It is characterized by a certain configuration.

【0008】[0008]

【実施例】【Example】

本考案の実施例を図面に基づきその作用と共に説明すると、図1は本案装置の 一例での一部を断面して示す拡大部分図、図2はプローブピンの一部を省略して 示す正面図で、これら図において、プローブピン10は、上下対称形の一対のコ ンタクトピン11がコイルスプリング12を介して電気的接続され、従来のプロ ーブピンにおいては不可欠であったスリーブを不要とした構造になっている。更 に説明すると、一対のコンタクトピン11は、図3及び図4に示されているよう に、先端接触部13を有する断面円形の小径柱部14と、段部15を介して該小 径柱部14と同軸状に一体に設けられた断面円形の大径柱部16と、段部17を 介して該大径柱部16と一体に設けられた断面円形の小径嵌入柱部18を有し該 一対のコンタクトピン11はベリリュウム−銅合金にて製作され、その表面は金 メッキ処理が施されている。なお、先端接触部13は本実施例においては先鋭状 となっているが、これに限定されず、その形状は平坦状である等任意である。そ して、一対のコンタクトピン11は、上下対称形にして、かつピアノ線製のコイ ルスプリング12の両端部に小径嵌入柱部18が圧入されることによって電気的 接続されている。 An embodiment of the present invention will be described together with its operation based on the drawings. FIG. 1 is an enlarged partial view showing a part of an example of the device of the present invention in section, and FIG. 2 is a front view showing a part of a probe pin omitted. In these figures, the probe pin 10 has a structure in which a pair of vertically symmetrical contact pins 11 are electrically connected via a coil spring 12, and a sleeve which is indispensable in a conventional probe pin is unnecessary. ing. More specifically, as shown in FIGS. 3 and 4, the pair of contact pins 11 includes a small diameter column portion 14 having a circular cross section having a tip contact portion 13 and a small diameter column portion via a step portion 15. A large-diameter column portion 16 having a circular cross-section which is integrally provided coaxially with the portion 14 and a small-diameter fitting column portion 18 having a circular cross-section which is integrally provided with the large-diameter column portion 16 via a step portion 17. The pair of contact pins 11 are made of beryllium-copper alloy, and their surfaces are plated with gold. Although the tip contact portion 13 has a sharpened shape in this embodiment, the shape is not limited to this and the shape is arbitrary such as a flat shape. The pair of contact pins 11 are vertically symmetrical and are electrically connected by press-fitting the small-diameter insertion pillar portions 18 at both ends of the coil spring 12 made of piano wire.

【0009】 図1に示されているように、プローブピン10は絶縁板20に穿設された極小 (0.13〜0.16mm)の貫通孔21内にその上下コンタクトピン11にお ける小径柱部14を突出せしめ水状態で遊挿されている。極小貫通孔21は電気 抵抗値を下げるためスルーホールメッキ22が施され、該スルーホールメッキ2 2により孔21は従来のプローブピンにおけるスリーブの役目をする。なお、極 小貫通孔21は特に図示しないが、格子状に多数穿設されて、スルーホールメッ キ22が施され、その各々にプローブピン10が遊挿されている。As shown in FIG. 1, the probe pin 10 has a small diameter (0.13 to 0.16 mm) in the through hole 21 formed in the insulating plate 20 and a small diameter in the upper and lower contact pins 11. The column portion 14 is projected so that it is loosely inserted in a water state. The minimum through hole 21 is plated with a through hole 22 to reduce the electric resistance value, and the hole 21 functions as a sleeve in a conventional probe pin by the through hole plating 22. It should be noted that, although not particularly shown, the minimum through-holes 21 are formed in large numbers in a grid pattern and are provided with through-hole marks 22, and the probe pins 10 are loosely inserted in each of them.

【0010】 絶縁板20の上下面には、その各貫通孔31を介してプローブピン10の小径 柱部14を突出せしめ、かつ該貫通孔31と絶縁板20の極小貫通孔21との段 部32でプローブピン10における各コンタクトピン11の小径柱部14と大径 柱部16との浚部15が係止せられて抜け出ないようになされたガイド板30が ネジ及びノックピン(図示せず)により取り外し可能として重合取り付けられ、 該ガイド板30によって前記したように、プローブピン10の抜け止めと、ガイ ド板30の取り外しによりプローブピン10の交換またはコンタクトピン11の 交換等ができるようになっている。On the upper and lower surfaces of the insulating plate 20, the small-diameter column portion 14 of the probe pin 10 is projected through the respective through holes 31, and the step portion between the through hole 31 and the extremely small through hole 21 of the insulating plate 20. At 32, the guide plate 30 in which the dredging portion 15 of the small diameter column portion 14 and the large diameter column portion 16 of each contact pin 11 of the probe pin 10 is locked so as not to come out is secured by screws and knock pins (not shown). The guide plate 30 is detachably mounted so that the probe pin 10 can be prevented from coming off and the guide plate 30 can be removed to replace the probe pin 10 or the contact pin 11 as described above. There is.

【0011】 プローブピンにおける一方(本実施例では下側)のコンタクトピン11の下方 には、その先端接触部13が僅かに入る極小貫通孔41と該貫通孔41からその 下面に亘るパターン42を有し、更に該パターン42とリード線(図示しない) を介して回路測定手段(図示しない)と電気的接続された基板40が設けられ、 コンタクトピン11の先端接触部13が貫通孔パターン42と電気的接触するこ とにより回路動作測定手段と電気的接続がなされるようになっている。Below the contact pin 11 on one side (the lower side in this embodiment) of the probe pin, there is a minimal through hole 41 into which the tip contact portion 13 slightly enters and a pattern 42 extending from the through hole 41 to the lower surface thereof. Further provided is a substrate 40 which is electrically connected to a circuit measuring means (not shown) through the pattern 42 and a lead wire (not shown), and the tip contact portion 13 of the contact pin 11 is formed as a through hole pattern 42. By making electrical contact, the circuit operation measuring means is electrically connected.

【0012】 本案装置は以上の構成であって、これの使用は、図1に示されているように、 電子素子を実装した基板100等を上方より水平に落し入れて、基板100等の 電子素子のリード端子101等をプローブピン10における上方のコンタクトピ ン11の先端接触部13に電気的接触させると共に、下方のコンタクトピン11 の先端接触部13を基板40の孔パターン42に電気的接触させて、電子素子と 測定手段とを導通させ、電子素子の回路動作の検査を行う。The device of the present invention has the above-described configuration. To use the device, as shown in FIG. 1, the substrate 100 or the like on which the electronic element is mounted is dropped horizontally from above and the electronic device such as the substrate 100 or the like is dropped. The lead terminal 101 of the element is electrically contacted with the tip contact portion 13 of the upper contact pin 11 of the probe pin 10, and the tip contact portion 13 of the lower contact pin 11 is electrically contacted with the hole pattern 42 of the substrate 40. Then, the electronic element and the measuring means are electrically connected to each other to inspect the circuit operation of the electronic element.

【0013】[0013]

【考案の効果】[Effect of device]

しかして、本考案によれば、プローブピンは従来不可欠であったスリーブが不 要となるばかりか、ストロークは上下のコンタクトピンを連結しているコイルス プリングによって約1.0〜2.0mmまで可能となり、従来のプローブピンで は検査不可能であった接続端子のピッチ間隔が0.2mm以下という極小ピッチ 検査に充分に対応できるものである。 Thus, according to the present invention, the probe pin does not need the sleeve which has been indispensable in the past, and the stroke can be up to about 1.0 to 2.0 mm by the coil spring that connects the upper and lower contact pins. Thus, it is possible to sufficiently cope with a very small pitch inspection in which the pitch interval of the connection terminals is 0.2 mm or less, which cannot be inspected by the conventional probe pin.

【図面の簡単な説明】[Brief description of drawings]

【図1】本考案に係る検査装置の一例での一部を断面し
て示す拡大部分図である。
FIG. 1 is an enlarged partial view showing a partial cross section of an example of an inspection apparatus according to the present invention.

【図2】プローブピンの一部を省略して示す正面図であ
る。
FIG. 2 is a front view showing a probe pin with a part thereof omitted.

【図3】コンタクトピンの正面図である。FIG. 3 is a front view of a contact pin.

【図4】コンタクトピンの拡大平面図である。FIG. 4 is an enlarged plan view of a contact pin.

【符号の説明】[Explanation of symbols]

10 プローブピン 11 一対のコンタクトピン 12 コイルスプリング 13 先端接触部 14 小径柱部 15 段部 16 大径柱部 18 小径嵌入柱部 20 絶縁板 21 極小貫通孔 22 スルーホールメッキ 30 ガイド板 31 貫通孔 32 段部 40 基板 10 probe pin 11 pair of contact pins 12 coil spring 13 tip contact part 14 small diameter column part 15 step part 16 large diameter column part 18 small diameter fitting column part 20 insulating plate 21 extremely small through hole 22 through hole plating 30 guide plate 31 through hole 32 Step 40 board

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】 絶縁板に植設のプローブピンをプリント
基板等に電気的接触させて該プリント基板等の回路動作
を検査する装置において、 前記プローブピン(10)は、先端接触部(13)を有
する断面円形の小径柱部(14)と該小径柱部(14)
と同軸状の断面円形の大径柱部(16)及び小径嵌入柱
部(18)を有する一対のコンタクトピン(11)が、
上下対称形にしてかつその各小径嵌入柱部(18)、
(18)に対するコイルスプリング(12)の両端部の
圧入をもって電気的接続されて構成されると共に、該プ
ローブピン(10)は前記絶縁板(20)に穿設され、
かつスルーホールメッキ(22)の処理が施された極小
貫通孔(21)内にその上下の小径柱部(14)を突出
せしめた状態で遊挿され、前記絶縁板(20)の上下面
には、その各貫通孔(31)を介して前記小径柱部(1
4)を突出せしめ、かつ該貫通孔(31)と前記絶縁板
(20)の極小貫通孔(21)との段部(32)で前記
小径柱部(14)と大径柱部(16)との段部(15)
が係止せられて抜け出ないようにされたガイド板(3
0)が取り外し可能に重合取り付けられ、更に前記プロ
ーブピン(10)のいずれか一方の先端接触部(13)
が回路動作の測定手段と電気的接続の基板(40)と電
気的接触状態にある構成を特徴とするプリント基板等の
検査装置。
1. An apparatus for inspecting circuit operation of a printed circuit board or the like by electrically contacting probe pins embedded in an insulating plate with the printed circuit board or the like, wherein the probe pin (10) has a tip contact portion (13). Small-diameter column portion (14) having a circular cross section and the small-diameter column portion (14)
A pair of contact pins (11) having a large-diameter column portion (16) and a small-diameter fitting column portion (18) coaxial with and having a circular cross section,
Vertical symmetry and each small diameter fitting pillar portion (18),
The coil spring (12) is press-fitted into both ends of the coil spring (12) and electrically connected to the coil spring (12), and the probe pin (10) is formed in the insulating plate (20).
In addition, the small-diameter column portions (14) above and below are projected into the extremely small through-holes (21) that have been subjected to the through-hole plating (22), and are loosely inserted to the upper and lower surfaces of the insulating plate (20). Through the through holes (31) thereof, the small-diameter column portion (1
4) is projected, and the small diameter column portion (14) and the large diameter column portion (16) are formed by the step portion (32) between the through hole (31) and the extremely small through hole (21) of the insulating plate (20). Step with (15)
The guide plate (3
0) is detachably attached to the probe pin, and the tip contact portion (13) of any one of the probe pins (10) is further attached.
An apparatus for inspecting a printed circuit board or the like, characterized in that is in electrical contact with a circuit operation measuring means and an electrically connected board (40).
JP9568691U 1991-10-25 1991-10-25 Inspection equipment for printed circuit boards, etc. Pending JPH0656779U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9568691U JPH0656779U (en) 1991-10-25 1991-10-25 Inspection equipment for printed circuit boards, etc.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9568691U JPH0656779U (en) 1991-10-25 1991-10-25 Inspection equipment for printed circuit boards, etc.

Publications (1)

Publication Number Publication Date
JPH0656779U true JPH0656779U (en) 1994-08-05

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ID=14144376

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9568691U Pending JPH0656779U (en) 1991-10-25 1991-10-25 Inspection equipment for printed circuit boards, etc.

Country Status (1)

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JP (1) JPH0656779U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002319798A (en) * 2001-04-23 2002-10-31 Nec Corp Device for cutting lead of electronic part and method of detecting wear of cutting edge
JP2006317412A (en) * 2005-05-16 2006-11-24 Totoku Electric Co Ltd Probing stylus having insulating film, and manufacturing method thereof
WO2014021194A1 (en) * 2012-08-01 2014-02-06 日本電子材料株式会社 Guide plate for probe guard and probe guard provided with same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5666768A (en) * 1979-11-02 1981-06-05 Hitachi Ltd Tool for in-circuit tester
JPH02257075A (en) * 1989-03-08 1990-10-17 Rika Denshi Kogyo Kk Test head of inspection device for wiring board

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5666768A (en) * 1979-11-02 1981-06-05 Hitachi Ltd Tool for in-circuit tester
JPH02257075A (en) * 1989-03-08 1990-10-17 Rika Denshi Kogyo Kk Test head of inspection device for wiring board

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002319798A (en) * 2001-04-23 2002-10-31 Nec Corp Device for cutting lead of electronic part and method of detecting wear of cutting edge
JP4626084B2 (en) * 2001-04-23 2011-02-02 日本電気株式会社 Electronic component lead cutting device and cutting blade wear detection method
JP2006317412A (en) * 2005-05-16 2006-11-24 Totoku Electric Co Ltd Probing stylus having insulating film, and manufacturing method thereof
WO2014021194A1 (en) * 2012-08-01 2014-02-06 日本電子材料株式会社 Guide plate for probe guard and probe guard provided with same
JP2014032020A (en) * 2012-08-01 2014-02-20 Japan Electronic Materials Corp Guide plate for probe card and probe card comprising the same
KR20150037939A (en) * 2012-08-01 2015-04-08 일본전자재료(주) Guide plate for probe guard and probe guard provided with same
US9535096B2 (en) 2012-08-01 2017-01-03 Japan Electronic Materials Corporation Guide plate for a probe card and probe card provided with same
US9841438B2 (en) 2012-08-01 2017-12-12 Japan Electronic Materials Corporation Guide plate for a probe card and probe card provided with same

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