JP2002319798A - Device for cutting lead of electronic part and method of detecting wear of cutting edge - Google Patents
Device for cutting lead of electronic part and method of detecting wear of cutting edgeInfo
- Publication number
- JP2002319798A JP2002319798A JP2001124183A JP2001124183A JP2002319798A JP 2002319798 A JP2002319798 A JP 2002319798A JP 2001124183 A JP2001124183 A JP 2001124183A JP 2001124183 A JP2001124183 A JP 2001124183A JP 2002319798 A JP2002319798 A JP 2002319798A
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- Japan
- Prior art keywords
- lead
- cutting
- electronic component
- blade
- electronic part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、電子部品のリー
ドを所定の長さに切断する電子部品リード切断装置およ
び電子部品リード切断装置における切断刃摩耗検出方法
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component lead cutting device for cutting leads of an electronic component to a predetermined length, and a cutting blade wear detecting method in the electronic component lead cutting device.
【０００２】[0002]
【従来の技術】従来、電子部品リード切断装置では、例
えば、特開平０７−１５１８４号公報に示されるよう
に、リード付き電子部品のリードを切断する際の切断刃
摩耗による不良電子部品の削減を目的としており、切断
刃摩耗の検出が重要な要素の１つとなっている。2. Description of the Related Art Conventionally, in an electronic component lead cutting apparatus, for example, as disclosed in Japanese Patent Application Laid-Open No. 07-15184, reduction of defective electronic components due to wear of a cutting blade when cutting leads of electronic components with leads is disclosed. The detection of cutting blade wear is one of the important factors.
【０００３】図３は、従来の電子部品リード切断装置の
正面図であり、上述した公報の図１を参照番号を変更し
て転載したものである。図３に示す電子部品リード切断
装置は、可動刃１３ａ，１３ｂと固定刃１４ａ，１４ｂ
とひずみゲージ１８ａ，１８ｂを備える。１１は電子部
品であり、１２ａ，１２ｂは電子部品１１に付属するリ
ードである。FIG. 3 is a front view of a conventional electronic component lead cutting apparatus, which is obtained by reprinting FIG. 1 of the above-mentioned publication with reference numbers changed. The electronic component lead cutting device shown in FIG. 3 includes movable blades 13a and 13b and fixed blades 14a and 14b.
And strain gauges 18a and 18b. Reference numeral 11 denotes an electronic component, and reference numerals 12a and 12b denote leads attached to the electronic component 11.
【０００４】次に動作を説明する。電子部品１１のリー
ド１２ａ，１２ｂは、固定刃１４ａ，１４ｂに可動刃１
３ａ，１３ｂを押圧してリード１２ａ，１２ｂを切断加
工する。Next, the operation will be described. The leads 12a, 12b of the electronic component 11 are fixed blades 14a, 14b on the movable blade 1
3a and 13b are pressed to cut the leads 12a and 12b.
【０００５】この時、固定刃１４ａ，１４ｂに貼り付け
られたひずみゲージ１８ａ，１８ｂの出力が、あらかじ
め設定されたリード１２ａ，１２ｂの線形、材質などに
よるしきい値を超えた場合に、切断刃の摩耗として検出
し、切断刃の交換時期を決定する手法が採用されてい
る。[0005] At this time, when the output of the strain gauges 18a, 18b attached to the fixed blades 14a, 14b exceeds a preset threshold value based on the linearity or material of the leads 12a, 12b, the cutting blades are cut. Is used to detect the wear of the cutting blade and determine the time to replace the cutting blade.
【０００６】[0006]
【発明が解決しようとする課題】上述した公報に記載の
電子部品リード切断装置では、切断時に可動刃と固定刃
の機械的なひずみを計測しているに過ぎず、切断による
部品不良を検出することができず、したがって、実際に
発生した部品不良を削減することが難しいという問題が
ある。In the electronic component lead cutting device described in the above-mentioned publication, only the mechanical strain of the movable blade and the fixed blade is measured at the time of cutting, and a component defect due to the cutting is detected. Therefore, there is a problem that it is difficult to reduce the actually generated component failure.
【０００７】また、上述した公報に記載の装置では、切
断時における応力を金属である切断刃の変形量により検
出するため、ダイヤモンドなどの変形しづらい材質を切
断刃に用いた場合、ひずみゲージによる検出は困難であ
り、切断刃の材質を自由に選べないという問題がある。Further, in the apparatus described in the above-mentioned publication, since the stress at the time of cutting is detected by the deformation amount of the cutting blade which is a metal, when a material such as diamond which is difficult to deform is used for the cutting blade, a strain gauge is used. Detection is difficult and there is a problem that the material of the cutting blade cannot be freely selected.
【０００８】さらに、上述した公報に記載の装置では、
切断刃の摩耗を検出するひずみゲージが切断刃に直接貼
り付けられているため、たとえ刃が摩耗して交換するに
しても容易に再取り付けすることができない。また、ひ
ずみゲージの取り付け場所は同位置でなければ最初の設
定と比較することはできず、メンテナンスが困難とな
る。Further, in the device described in the above-mentioned publication,
Since the strain gauge for detecting wear of the cutting blade is directly attached to the cutting blade, even if the blade is worn and replaced, it cannot be easily reinstalled. If the strain gauge is not installed at the same position, it cannot be compared with the initial setting, and maintenance becomes difficult.
【０００９】この発明の目的のは、部品不良が検出可能
な電子部品リード切断装置および切断刃摩耗検出方法を
提供することにある。An object of the present invention is to provide an electronic component lead cutting device and a cutting blade wear detecting method capable of detecting a component defect.
【００１０】この発明の他の目的は、切断刃の材質に依
存しない電子部品リード切断装置および切断刃摩耗検出
方法を提供することにある。It is another object of the present invention to provide an electronic component lead cutting device and a cutting blade wear detecting method which do not depend on the material of the cutting blade.
【００１１】この発明の他の目的は、切断刃の摩耗・破
損時にも交換が可能で切断刃の材質に依存しない電子部
品リード切断装置および切断刃摩耗検出方法を提供する
ことにある。Another object of the present invention is to provide an electronic component lead cutting device and a cutting blade wear detecting method which can be replaced even when the cutting blade is worn or broken and which does not depend on the material of the cutting blade.
【００１２】[0012]
【課題を解決するための手段】この発明による電子部品
リード切断装置は、切断する刃が摩耗した場合に、切断
による製品不良を検出する手段を提供するものである。
より具体的には、リード付き電子部品のリードを切断す
るための上刃および下刃と、前記電子部品を支持するた
めの支持台とを備え、前記支持台に前記電子部品を支持
して前記上刃および下刃により前記リードを所定の長さ
に切断する電子部品リード切断装置において、前記上刃
と接触することのない電極をさらに備え、前記上刃と下
刃による前記リードの切断後に、前記リードに前記電極
を押し当てて前記電子部品の電気抵抗値を測定し、あら
かじめ測定した良品の抵抗値と測定値との比較をするこ
とにより不良電子部品を検出するものである。SUMMARY OF THE INVENTION An electronic component lead cutting apparatus according to the present invention provides means for detecting a product defect due to cutting when a cutting blade is worn.
More specifically, an upper blade and a lower blade for cutting the lead of the electronic component with a lead, and a support for supporting the electronic component, the support for supporting the electronic component on the support, the In an electronic component lead cutting device that cuts the lead to a predetermined length by an upper blade and a lower blade, further comprising an electrode that does not contact the upper blade, after cutting the lead by the upper blade and the lower blade, The electric resistance of the electronic component is measured by pressing the electrode against the lead, and a defective electronic component is detected by comparing the measured resistance with the resistance of a good product measured in advance.
【００１３】この発明では、電子部品のリードへ直接電
極を押し当て抵抗値を計測しているため、切断刃の摩耗
等の問題を直接検出することができる。In the present invention, since the resistance is measured by directly pressing the electrode against the lead of the electronic component, it is possible to directly detect a problem such as wear of the cutting blade.
【００１４】また、この発明では、切断する機構と部品
不良検出を分離してあるため、切断で何らかの問題が発
生した場合を検出することができ、製品不良を後工程に
流すことはない。Further, according to the present invention, since the mechanism for cutting and the detection of a component defect are separated from each other, it is possible to detect the occurrence of any problem in the cutting, and the product defect does not flow to the subsequent process.
【００１５】[0015]
【発明の実施の形態】次に、この発明の実施の形態につ
いて図面を参照して説明する。Next, an embodiment of the present invention will be described with reference to the drawings.
【００１６】図１は、この発明の実施の形態である電子
部品リード切断装置の要部の正面図である。FIG. 1 is a front view of a main part of an electronic component lead cutting apparatus according to an embodiment of the present invention.
【００１７】図１に示す電子部品リード切断装置には、
左右に１つずつ上刃２ａ，２ｂが設けられており、上刃
２ａ，２ｂは、図示しない上下動するガイドに固定され
ている。下刃４ａは、上刃２ａに対向して設けられてお
り、下刃４ｂは、上刃２ｂに対向して設けられている。
また、上刃２ａ，２ｂは、図示しない駆動源に接続さ
れ、左右とも同時に上下動を行うことができる。The electronic component lead cutting device shown in FIG.
Upper blades 2a and 2b are provided on the left and right, respectively, and the upper blades 2a and 2b are fixed to a vertically moving guide (not shown). The lower blade 4a is provided to face the upper blade 2a, and the lower blade 4b is provided to face the upper blade 2b.
The upper blades 2a and 2b are connected to a drive source (not shown), and can move up and down simultaneously on the left and right.
【００１８】上刃２ａ，２ｂの内側には、上刃２ａ，２
ｂとは接触せずに電極１ａ，１ｂが取りつけられてい
る。電極１ａ，１ｂは、支持台３に対向して設けられて
おり、支持台３に適宜必要な力で押しつけ動作が可能で
ある。また、支持台３は絶縁体である。Inside the upper blades 2a, 2b, there are upper blades 2a, 2b.
The electrodes 1a and 1b are attached without contact with the electrode b. The electrodes 1a and 1b are provided to face the support 3 and can be pressed against the support 3 with a necessary force. The support 3 is an insulator.
【００１９】次に、この発明の実施の形態の動作につい
て説明する。Next, the operation of the embodiment of the present invention will be described.
【００２０】まず、支持台３上にリード付き電子部品６
をセットする。上刃２ａ，２ｂは、図示しない駆動源に
より下降し、リード付き電子部品６のリード７ａ，７ｂ
を押圧する。この上刃２ａ，２ｂによる押圧と下刃４
ａ，４ｂとによって、リード付き電子部品６のリード７
ａ，７ｂは切断される。この時、上刃２ａ，２ｂと下刃
４ａ，４ｂによる加工と同時期に電極１ａ，１ｂが電子
部品６のリード７ａ，７ｂを支持台３と挟むように下降
する。First, the electronic component 6 with leads is placed on the support 3.
Is set. The upper blades 2a, 2b are lowered by a drive source (not shown), and the leads 7a, 7b of the electronic component 6 with leads are moved.
Press. The pressing by the upper blades 2a and 2b and the lower blade 4
a, 4b, the lead 7 of the leaded electronic component 6
a and 7b are cut. At this time, the electrodes 1a and 1b descend so as to sandwich the leads 7a and 7b of the electronic component 6 with the support 3 at the same time as the processing by the upper blades 2a and 2b and the lower blades 4a and 4b.
【００２１】切断によるリード７ａ，７ｂの余剰部分
は、切断屑５ａ，５ｂとなり、電子部品６に所定の寸法
のリードを残してリード切断が完了する。Excess portions of the leads 7a, 7b resulting from the cutting become cutting chips 5a, 5b, and the lead cutting is completed while leaving the leads of a predetermined size on the electronic component 6.
【００２２】切断後は、まず、上刃２ａ，２ｂのみを上
昇させ、電極１ａ，１ｂは、支持台３との間に電子部品
６のリードを所定の圧力で挟んだ状態のままとしておい
て、電子部品６の抵抗値を測定する。測定後は電極１
ａ，１ｂが上昇待機する。After cutting, first, only the upper blades 2a and 2b are raised, and the electrodes 1a and 1b are kept in a state where the lead of the electronic component 6 is sandwiched between the electrodes 1a and 1b at a predetermined pressure. Then, the resistance value of the electronic component 6 is measured. After measurement, electrode 1
a and 1b are on standby.
【００２３】良品と不良品の判断は、予め測定された良
品の測定値と検査対象である電子部品の測定値とを比較
して行う。測定値との比較は、予め測定された良品の測
定値に対し、ある一定範囲を良品とし、一定範囲を超え
るものを不良品として判断する。The determination of a good product or a defective product is made by comparing a measured value of a good product measured in advance with a measured value of an electronic component to be inspected. In comparison with the measured value, a certain range of the measured value of the non-defective product measured in advance is determined as a non-defective product, and a value exceeding the predetermined range is determined as a defective product.
【００２４】例えば、連続的な切断作業により切断刃が
磨耗した場合、リード切断時の切れが悪くなり、電子部
品のリードに引張応力が発生し、電子部品が破壊され、
抵抗値が上がるため、電子部品の不良が判断できる。For example, when the cutting blade is worn by continuous cutting work, the cutting at the time of cutting the lead becomes poor, a tensile stress is generated in the lead of the electronic component, and the electronic component is destroyed.
Since the resistance value increases, it is possible to determine whether the electronic component is defective.
【００２５】また、この実施の形態では、上刃２ａ，２
ｂを上下動させるガイドの不良や切断するリード上にゴ
ミが存在したり、はんだ不良の場合にも抵抗値が変動す
るため、電子部品の不良を判断することが可能である。In this embodiment, the upper blades 2a, 2a
Since the resistance value fluctuates even in the case of a defect in the guide for moving b up and down, dust on the lead to be cut, or a solder defect, it is possible to determine a defect in the electronic component.
【００２６】また、不良品である場合は、信号を発生さ
せ、作業者に警告したり、良品と区別して、後工程へは
流れないようにすることもできる。In the case of a defective product, a signal can be generated to warn an operator or to discriminate the non-defective product from the subsequent process.
【００２７】なお、上述した実施の形態では、上刃を２
つに分けて設けたが、１つのブロックとして設けること
もできる。また、リードが左右１本ずつの電子部品につ
いて述べたが、リードが多数設けられた電子部品にも適
用することが可能である。その際、１本のリードに対し
１刃としても良いし、数本のリードを纏めて切断するブ
ロックとすることもできる。また、同様にリードが複数
設けられた電子部品において、電極を複数設けて、順次
測定することもできるし、同時に数ヶ所の測定を行うこ
ともできる。In the above-described embodiment, the upper blade is
Although they are provided separately, they may be provided as one block. In addition, although the electronic component having one lead on each side has been described, the present invention can also be applied to an electronic component having many leads. In this case, one lead may be used for one blade, or a block for cutting several leads together may be used. Similarly, in an electronic component provided with a plurality of leads, a plurality of electrodes can be provided and measurement can be performed sequentially, or measurement can be performed at several places at the same time.
【００２８】上述したように、この実施の形態は、切断
刃の摩耗等による製品不良の検出が可能である。リード
を切断した後のリードへ直接電極を押し当てるため、切
断刃の摩耗のみならず、上下のガイドの不良、あるいは
異物混入等の問題があった場合を検出することができ、
不良を作り出すことはない。As described above, in this embodiment, it is possible to detect a defective product due to wear of the cutting blade or the like. Since the electrode is directly pressed against the lead after cutting the lead, it is possible to detect not only the wear of the cutting blade, but also the problem of a defect in the upper and lower guides or foreign matter mixing,
It does not create defects.
【００２９】また、切断刃の材質に依らず製品不良を検
出できる。切断する上刃２ａ，２ｂと下刃４ａ、４ｂに
特別な加工や別部品の取り付けをすることなく、不良検
出電極を別に設けてあるため、切断する刃の影響を受け
ることはない。Further, a product defect can be detected regardless of the material of the cutting blade. Since the defective detection electrodes are separately provided without special processing or attachment of separate parts to the upper blades 2a, 2b and the lower blades 4a, 4b to be cut, there is no influence of the cutting blade.
【００３０】さらに、電極１ａ、１ｂが、切断する刃に
依存していないため刃の摩耗による交換が容易であり、
メンテナンスが容易である。Furthermore, since the electrodes 1a and 1b do not depend on the blade to be cut, replacement by wear of the blade is easy,
Easy maintenance.
【００３１】次に、この発明の他の実施の形態について
説明する。Next, another embodiment of the present invention will be described.
【００３２】図２は、この発明の他の実施の形態である
電子部品リード切断装置の要部の正面図である。図２に
示す電子部品リード切断装置は、電極を簡単に交換可能
なプローブ１ａ’、１ｂ’とし、また、下刃の構造を下
刃と支持台に区別することなく、絶縁体もしくはメッキ
等により絶縁体とした支持台３’を下刃となり得るよう
加工したものである。FIG. 2 is a front view of a main part of an electronic component lead cutting apparatus according to another embodiment of the present invention. The electronic component lead cutting device shown in FIG. 2 is a probe 1a ', 1b' whose electrodes can be easily replaced, and the structure of the lower blade is made of an insulator or plating without distinguishing between the lower blade and the support base. The support 3 ', which is an insulator, is processed so that it can be a lower blade.
【００３３】この発明の第２の実施形態は、第１の実施
の形態の効果に加えて、電極の摩耗に対して交換が容易
となり、下刃と支持台が一体となって部品点数が減り、
コスト低減を図ることができる。According to the second embodiment of the present invention, in addition to the effects of the first embodiment, replacement with respect to electrode wear is facilitated, and the lower blade and the support stand are integrated to reduce the number of parts. ,
Cost can be reduced.
【００３４】なお、この発明は、上述した各実施の形態
に限定されず、この発明の技術思想の範囲内において、
各実施の形態は適宜変更され得ることは明らかである。It should be noted that the present invention is not limited to the embodiments described above, and within the scope of the technical idea of the present invention,
It is obvious that each embodiment can be appropriately changed.
【００３５】[0035]
【発明の効果】以上説明したように、この発明は、切断
刃の摩耗等による製品不良の検出が可能である。リード
を切断した後のリードへ直接電極を押し当てるため、切
断刃の摩耗、上下のガイドあるいは異物混入等の問題が
あった場合を検出することができ、不良が後工程に流出
することはない。As described above, according to the present invention, it is possible to detect a defective product due to wear of the cutting blade or the like. Since the electrode is directly pressed against the lead after cutting the lead, it is possible to detect the case where there is a problem such as wear of the cutting blade, upper / lower guide or foreign matter entry, and no defect flows out to the subsequent process. .
【００３６】また、この発明は、切断する刃に特別な加
工や別部品の取り付けをすることなく、不良検出電極を
別に設けており、切断する刃の影響を受けることはない
ため、切断刃の材質に依らず製品不良を検出できる。Further, according to the present invention, the defect detecting electrode is provided separately without special processing or attaching a separate part to the blade to be cut, and is not affected by the cutting blade. Product defects can be detected regardless of the material.
【００３７】さらに、この発明は、電気抵抗を測定する
電極が、切断する刃に依存していないため、刃の摩耗に
よる交換が容易であり、メンテナンスが容易である。Further, according to the present invention, since the electrode for measuring the electric resistance does not depend on the blade to be cut, the electrode is easily replaced due to the wear of the blade, and the maintenance is easy.
【図１】この発明の実施の形態である電子部品リード切
断装置の要部の正面図である。FIG. 1 is a front view of a main part of an electronic component lead cutting device according to an embodiment of the present invention.
【図２】この発明の他の実施の形態である電子部品リー
ド切断装置の要部の正面図である。FIG. 2 is a front view of a main part of an electronic component lead cutting device according to another embodiment of the present invention.
【図３】従来の電子部品リード切断装置の正面図であ
る。FIG. 3 is a front view of a conventional electronic component lead cutting device.
１ａ，１ｂ，１ａ’，１ｂ’ 電極 ２ａ，２ｂ 上刃 ３，３’ 支持台 ４ａ，４ｂ 下刃 ５ａ，５ｂ 切断屑 ６ 電子部品 ７ａ，７ｂ リード 1a, 1b, 1a ', 1b' Electrode 2a, 2b Upper blade 3, 3 'Support 4a, 4b Lower blade 5a, 5b Cutting waste 6 Electronic components 7a, 7b Lead
Claims (6)
めの上刃および下刃と、前記電子部品を支持するための
支持台とを備え、前記支持台に前記電子部品を支持して
前記上刃および下刃により前記リードを所定の長さに切
断する電子部品リード切断装置において、 前記上刃と接触することのない電極をさらに備え、前記
上刃と下刃による前記リードの切断後に、前記リードに
前記電極を押し当てて前記電子部品の電気抵抗値を測定
し、あらかじめ測定した良品の抵抗値と測定値との比較
をすることにより不良電子部品を検出することを特徴と
する電子部品リード切断装置。An upper blade and a lower blade for cutting a lead of an electronic component with a lead; and a support table for supporting the electronic component. An electronic component lead cutting device that cuts the lead to a predetermined length with a blade and a lower blade, further comprising an electrode that does not come into contact with the upper blade, after cutting the lead by the upper blade and the lower blade, An electronic component lead for measuring an electric resistance value of the electronic component by pressing the electrode against a lead, and detecting a defective electronic component by comparing a measured value with a resistance value of a good product measured in advance. Cutting device.
とを一体とすることを特徴とする請求項１に記載の電子
部品リード切断装置。2. The electronic component lead cutting apparatus according to claim 1, wherein the lower blade is an insulator and the lower blade and the support are integrated.
する請求項１または２に記載の電子部品リード切断装
置。3. The electronic component lead cutting device according to claim 1, wherein the electrode is replaceable.
を発生することを特徴とする請求項１〜３のいずれかに
記載の電子部品リード切断装置。4. The electronic component lead cutting device according to claim 1, wherein a signal is generated when the measured value exceeds a predetermined range.
めの上刃および下刃と、前記電子部品を支持するための
支持台とを備え、前記支持台に前記電子部品を支持して
前記上刃および下刃により前記リードを所定の長さに切
断する電子部品リード切断装置の切断刃摩耗検出方法で
あって、前記上刃と下刃による前記リードの切断後に、
前記上刃と接触することのない電極を前記リードに押し
当てて前記電子部品の電気抵抗値を測定し、あらかじめ
測定した良品の抵抗値と測定値との比較をすることによ
り切断刃の摩耗を検出することを特徴とする電子部品リ
ード切断装置の切断刃摩耗検出方法。5. An electronic device with a lead, comprising: an upper blade and a lower blade for cutting a lead of an electronic component with a lead; and a support table for supporting the electronic component. A cutting blade wear detection method of an electronic component lead cutting device that cuts the lead to a predetermined length by a blade and a lower blade, wherein after cutting the lead by the upper blade and the lower blade,
The electrode that does not come into contact with the upper blade is pressed against the lead to measure the electric resistance value of the electronic component, and the wear of the cutting blade is reduced by comparing the resistance value of a good product measured in advance with the measured value. A cutting blade wear detection method for an electronic component lead cutting device, comprising:
を発生することを特徴とする請求項５に記載の電子部品
リード切断装置の切断刃摩耗検出方法。6. The method according to claim 5, wherein a signal is generated when the measured value exceeds a predetermined range.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001124183A JP4626084B2 (en) | 2001-04-23 | 2001-04-23 | Electronic component lead cutting device and cutting blade wear detection method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001124183A JP4626084B2 (en) | 2001-04-23 | 2001-04-23 | Electronic component lead cutting device and cutting blade wear detection method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002319798A true JP2002319798A (en) | 2002-10-31 |
| JP4626084B2 JP4626084B2 (en) | 2011-02-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108296394A (en) * | 2018-03-23 | 2018-07-20 | 上海元电子有限公司 | Pin disconnecting device |
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|---|---|---|---|---|
| JPS55140282U (en) * | 1979-03-28 | 1980-10-06 | ||
| JPS6167299A (en) * | 1984-09-10 | 1986-04-07 | 日立電子エンジニアリング株式会社 | Punching and containing device of electronic part |
| JPH01131472A (en) * | 1987-11-17 | 1989-05-24 | Tokyo Electron Ltd | Inspection instrument for circuit board |
| JPH01129820U (en) * | 1988-02-26 | 1989-09-04 | ||
| JPH0374808A (en) * | 1989-08-16 | 1991-03-29 | Matsushita Electric Ind Co Ltd | Method of welding lead wire of resistor |
| JPH0372980U (en) * | 1989-11-14 | 1991-07-23 | ||
| JPH0656779U (en) * | 1991-10-25 | 1994-08-05 | 株式会社モリモト | Inspection equipment for printed circuit boards, etc. |
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2001
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Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55140282U (en) * | 1979-03-28 | 1980-10-06 | ||
| JPS6167299A (en) * | 1984-09-10 | 1986-04-07 | 日立電子エンジニアリング株式会社 | Punching and containing device of electronic part |
| JPH01131472A (en) * | 1987-11-17 | 1989-05-24 | Tokyo Electron Ltd | Inspection instrument for circuit board |
| JPH01129820U (en) * | 1988-02-26 | 1989-09-04 | ||
| JPH0374808A (en) * | 1989-08-16 | 1991-03-29 | Matsushita Electric Ind Co Ltd | Method of welding lead wire of resistor |
| JPH0372980U (en) * | 1989-11-14 | 1991-07-23 | ||
| JPH0656779U (en) * | 1991-10-25 | 1994-08-05 | 株式会社モリモト | Inspection equipment for printed circuit boards, etc. |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108296394A (en) * | 2018-03-23 | 2018-07-20 | 上海元电子有限公司 | Pin disconnecting device |
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| Publication number | Publication date |
|---|---|
| JP4626084B2 (en) | 2011-02-02 |
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