KR101262950B1 - Apparatus and method for crack detection of contact unit of electronic device - Google Patents

Abstract

PURPOSE: An apparatus and a method for detecting cracks in the contact unit of an electronic device are provided to repetitively perform a filtering process by using lock-in algorithm and to accurately detecting the crack of a connection part. CONSTITUTION: An apparatus and a method for detecting cracks in the contact unit of an electronic device supplies vibration having predetermined frequency and waveform to a first test object and a second object. A vibration detection part(120) includes a vibration sensor sensing the vibration. A sensing part(130) measures a vibration value including frequency and waveform transmitted from the vibration detection part. A resistance value measurement part(140) measures the resistance value of a contact part. A calculation part(150) filters the generation of a repetitive pattern by using the vibration value and the resistance value. [Reference numerals] (130) Sensing part; (150) Calculation part; (160) Control part; (170) Output part; (180) Power supply part

Description

Apparatus and method for detecting cracks in contact points of electronic devices {APPARATUS AND METHOD FOR CRACK DETECTION OF CONTACT UNIT OF ELECTRONIC DEVICE}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a crack detection apparatus and method, and more particularly, to a contact crack detection apparatus and method of an electronic device for detecting a crack state of a contact between a PCB or a package made of solder in an electronic device.

In recent portable electronic devices, it is becoming increasingly important to detect micro cracks, particularly on connections in semiconductor packages or on packages and printed circuit board (PCB) connection sites.

The reason why micro crack detection is important in portable electronic devices is that due to their small size, the integration of semiconductors and electric circuits is increasing, and thus warpage and distortion due to heat generation occur more frequently than general electronic devices. This is because the likelihood of defects is gradually increased due to the use shock caused by carrying.

These microcracks increase as time passes, causing electronic device defects and shortening the lifespan of the product.It is a factor that repeats the normal and abnormal operation of the electronic device. It is a major factor in reducing reliability.

12 is an exemplary view of a contact portion of a general semiconductor package used in an electronic device, and FIG. 13 is an illustration of a poor contact state of a general semiconductor package.

As shown in FIG. 12, the contacts of the package are arranged on the back or side of the package to be in contact with another package or PCB, with recent packages tending to place the contacts on the back of the package to achieve high integration. .

In addition, as shown in FIG. 13, when a problem occurs in a package, a contact state of a contact part is often a problem, which is caused by cracking in a solder ball due to cold soldering or the lifting of the solder ball itself. Most contact failures are caused.

However, it is not easy to detect such an abnormal contact state of the solder ball to prevent malfunction of the electronic device in advance or to detect it early before the electronic device becomes defective.

Conventional methods for identifying the contact state of a contact part include image analysis through a camera or visual inspection through the naked eye. However, in this case, the contact is detected only when the contact part is completely destroyed and the image analysis or visually discernible state is reached. Since this is possible, the effectiveness is not large.

In particular, in recent packages, such a visual detection method is difficult to utilize when the contact is already completed due to the contact portion disposed on the rear surface.

In addition, very minute cracks are generated in the contacts, which are impossible to detect by vision inspection, but the detection of the connection parts of the contacts that are likely to transition to a state that causes malfunction in the electronic device is further less effective.

In addition, another conventional method for identifying a contact state of a contact part has been a method of detecting by contact measuring method (typically, resistance change observation). However, minute cracks have a small change in resistance value and It is common to lose discrimination by force.

That is, in order to identify the contact state by the above-described contact measurement method, the package must be mounted on the socket of the jig and the inspection is performed. When the socket is mounted on the socket, the crack of the connection site where the defect is caused by the pressing pressure of the socket is recovered. Changes in state often occurred, so we couldn't pinpoint the state of contact.

For these reasons, the contact measurement method can distinguish whether the contact state is normal or completely destroyed for a predetermined connection site, but the effectiveness of identification of the connection site where the minute crack has occurred is very small.

Therefore, the contact measurement method can identify the large change in the resistance value only in the part where the crack state is large or the connection part of the contact part is completely broken, and as for the connection part where the micro crack state occurs as described above, There was no discernment of detection.

In addition, the conventional methods of identifying the contact state can only determine whether the connection part of the inspection object is in a normal state or a bad state, and does not provide information on the exact degree of cracking or the progress of the crack, thereby detecting the crack. After that, it was very difficult to take action on the connection site or post-process the electronic device.

Korea Patent Registration No. 10-0207004

An object of the present invention for improving the above problems is to provide a vibration including a frequency and a waveform within a predetermined effective range to the connection portion, and to measure the resistance value to perform repeated pattern filtering to detect the resistance value and vibration The present invention provides a method and apparatus for detecting cracks in contact portions of electronic devices, which analyze patterns of values and output them in correspondence with crack-related information.

Another object of the embodiment of the present invention for improving the above-mentioned problem is to perform repeated pattern filtering using a lock-in algorithm to output in an accurate pattern that is different from each other according to the crack state of the connection site. An apparatus and method for detecting contact cracks in an electronic device are provided.

Another object of the embodiments of the present invention for improving the above-mentioned problems is to accurately measure vibration values and resistance values at high speed, and to detect and detect amplification patterns according to contact states, thereby minimizing fine crack states that cannot be generally measured. It is to provide an apparatus and method for detecting cracks in contact portions of an electronic device to accurately identify using even patterns.

Contact crack detection device of the electronic device according to an embodiment of the present invention for achieving the above object is a first inspection that is a printed circuit board (PCB) or package (PCB) used in the electronic device and interconnected through one or more contacts A device for detecting cracks in the contact portion between a sieve and a second test body which is a PCB or a package, the apparatus comprising: providing at least one of the first test body and the second test body with a vibration having a frequency and waveform within a preset effective range; A vibration unit including a vibration unit, a vibration detection unit having a vibration detection sensor for detecting the vibration, a sensing unit measuring a vibration value including the frequency and waveform transmitted from the vibration detection unit, while the vibration is provided, the contact unit A resistance value measuring unit for measuring a resistance value, the vibration value including the vibration value including the frequency and waveform and the resistance value measured A control unit that separates or outputs that can express different cracking conditions identified according to the above by using a resistance value that is set based on a result of an operation in the operating section and resistance value and the repetitive pattern filter for filtering the repeated pattern generating crack judgment.

The operation unit may use a lock-in algorithm to filter a repetitive pattern in which the change in resistance due to the variation of vibration varies irregularly finely according to the type of crack.

The controller may classify and output the types of cracks by using at least four measured resistance values and calculation results of pattern filtering.

At this time, the control unit is a crack state of the connection site, the crack state is a normal state without a crack, a crack state in which the whole crack, a complete fracture state in which the connection is broken and a contact state different from the crack state, only a part of the crack is generated It is preferable to distinguish one of the fine crack states.

The resistance value measuring unit may use a 4-wire method as a method of measuring the resistance value.

Contact crack detection method of an electronic device according to another embodiment of the present invention for achieving the above object is a first inspection that is a printed circuit board (PCB) or package (PCB) used in the electronic device and interconnected through one or more contacts A contact part crack detection method of a device for detecting a crack of the contact part between a sieve and a second test object which is a PCB or a package, the vibration part comprising: a frequency within an effective range preset to at least one of the first test object and the second test object; Providing a vibration having a waveform, Vibration sensing unit for detecting the vibration, Sensing unit for measuring a vibration value including the frequency and waveform transmitted from the vibration sensing unit, Resistance value measurement unit provided by the vibration Measuring the resistance value of the contact portion, wherein the calculation unit includes the vibration value and the frequency and waveform measurement. Filtering the repetitive pattern generation using the vibration value and the resistance value by receiving the resistance value, and the controller classifying the resistance value and the calculation result of the repetitive pattern filtering according to a predetermined crack determination or different crack state Outputting the expression to be recognizable.

In the performing of pattern filtering, it is preferable that the operation unit filters a repetitive pattern in which a change relation of resistance due to a change in vibration is irregularly finely changed according to the type of crack using a lock-in algorithm.

The crack-related information outputting step may be performed by dividing the type of the crack by using the resistance value measured by at least four or more and the calculation result of the pattern filtering.

In this case, the step of outputting the crack-related information is different from the crack state of the control unit, in which the control unit determines the crack state of the connection part in a normal state without cracks, a crack state in which a crack occurs overall, a complete fracture state in which a connection is broken, and the crack state. It is preferable to classify as one of the fine crack states in which only part of the cracks occur as the contact state.

The resistance value measuring step may include a 4-wire method as the resistance value measuring unit measuring the resistance value.

An apparatus and method for detecting contact cracks of an electronic device according to an embodiment of the present invention provide a vibration including a frequency and a waveform within a preset effective range at a connection portion, and detect the resistance by performing repeated pattern filtering by measuring a resistance value. By analyzing the pattern of the resistance value and the vibration value, it is possible to output in correspondence with the crack-related information, thereby greatly improving the detection discrimination ability of the defective state of the contact portion.

Device crack detection device and method of the electronic device according to an embodiment of the present invention by performing a repeated pattern filtering using a lock-in Algorithm accurate pattern that is different from each other according to the crack state of the connection site It is effective to improve the classification accuracy of the degree of cracking of the connection site by outputting.

Apparatus crack detection device and method of the electronic device according to an embodiment of the present invention can not be accurately identified by the method of measuring the vibration value and the resistance value at high speed and by measuring the amplification pattern according to the contact state in general. Even fine cracks can be accurately identified by using patterns, so that the degree of cracking at the connection site can be classified to a very precise degree.

1 is a block diagram of a contact crack detection device of an electronic device according to an embodiment of the present invention.
2 is a configuration diagram illustrating a contact crack detection apparatus of an electronic device according to an embodiment of the present disclosure.
3 is a contact state in a steady state according to an embodiment of the present invention.
4 is a contact portion in a fine crack state according to an embodiment of the present invention.
5 is a contact in a crack state according to an embodiment of the present invention.
6 is a contact in a completely destroyed state according to an embodiment of the present invention.
7 is a graph showing the results of the resistance and the pattern filtering in the steady state according to an embodiment of the present invention.
8 is a graph showing the results of the resistance value and pattern filtering of the micro-cracks state according to an embodiment of the present invention.
Figure 9 is a graph showing the results of the resistance value and pattern filtering of the crack state according to an embodiment of the present invention.
10 is a graph showing the results of the resistance value and the pattern filtering in the state of complete destruction according to an embodiment of the present invention.
11 is a flow chart of a contact crack detection method of an electronic device according to an embodiment of the present invention.
12 is an illustration of a contact of a typical package.
Figure 13 is an illustration of a poor contact state of a typical package.

BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features and advantages of the invention will become more apparent from the following detailed description of the present invention when taken in conjunction with the accompanying drawings.

1 is a block diagram of a contact crack detection device 100 of an electronic device according to an embodiment of the present invention.

Referring to FIG. 1, the contact crack detection device 100 of an electronic device according to an embodiment of the present invention is a printed circuit board (PCB) or a package that is used in an electronic device and interconnected through at least one contact part. 1 is a device for detecting a crack in the contact portion between the test specimen and the second test specimen, which is a PCB or a package, wherein at least one of the first test specimen and the second test specimen is subjected to vibration having a frequency and waveform within a preset effective range. Providing a vibration unit 110, a vibration detection unit 120 having a vibration detection sensor for detecting the vibration, a sensing unit for measuring the vibration value including the frequency and waveform transmitted from the vibration detection unit 120 130, while the vibration is provided, the resistance value measuring unit 140 for measuring the resistance value of the contact portion, receiving the vibration value including the frequency and waveform and the resistance value measured The calculation unit 150 for filtering the repetitive pattern generation by using the vibration value and the resistance value and the result of the calculation of the resistance value and the repetitive pattern filtering are classified according to a predetermined crack determination or outputted in an expression capable of checking different crack states. The controller 160 is included.

The contact crack detection device 100 of an electronic device according to an embodiment of the present invention is a device capable of accurately detecting even micro cracks by detecting a change in resistance generated by an external vibration as described above.

In addition, the contact crack detection device 100 of the electronic device according to an embodiment of the present invention is a device for detecting a poor contact between the PCB, between the package or between the PCB and the package which is an important cause of malfunction of the electronic device, The package means a semiconductor package.

In addition, the contact crack detection apparatus 100 of the electronic device according to an embodiment of the present disclosure may separate the function from the controller 160 to process the output of the crack related information in the output unit 170.

On the other hand, the contact portion means a connection site that the first test body and the second test body contact, means a connection site included in one or more of the first test body or the second test body, more details In particular, it refers to a connection part of the first test body and the second test body that is soldered (Soldering) including the solder ball and has an electrical connection property.

In a preferred embodiment, the vibrator 110 preferably includes a small vibration motor or a small vibrator, and the small vibration motor or the small vibrator contacts the first test body or the second test body to directly generate vibration. It is desirable to provide.

In addition, the vibration detection unit 120 also includes a vibration detection sensor to measure the vibration provided by the vibration unit 110 by the vibration detection sensor is in direct contact with the first or second test body. It is preferable.

The sensing unit 130 measures the vibration value, wherein the measured vibration value includes one or more of the frequency or waveform of the vibration and precisely measures the vibration value including the frequency or waveform measured by the vibration detection sensor. Sense it.

The calculation unit 150 corresponds to a frequency or waveform of a vibration that is variable within an effective range and the resistance value measured at high speed precisely, and repeats pattern filtering according to the variable of the frequency or waveform to preset reference. Create a pattern according to.

The contact crack detection device 100 of the electronic device according to an embodiment of the present disclosure may use a lock-in algorithm as a preferred embodiment of the pattern filtering and pattern generation.

In addition, the contact crack detection device 100 of the electronic device according to an embodiment of the present invention increases the detection discrimination force for a contact state of a predetermined connection part by pattern filtering and pattern generation of vibration values and resistance values measured at high speed, and cracks. The state can be accurately determined, and even the contact state which is difficult to detect by the conventional method due to the occurrence of minute cracks through the classification of the pattern can be detected.

As such, the contact crack detection device 100 of an electronic device according to an embodiment of the present invention provides a vibration including a frequency and a waveform within a preset effective range at a connection portion and measures resistance to perform repeated pattern filtering. That is, it applies vibration and detects the pattern of the resistance value and vibration value detected through pattern filtering using the variability of the vibration and minute resistance difference, and outputs it in correspondence with the crack-related information and outputs the detection discrimination power of the defective state of the contact part. Very improve.

2 is an operation configuration diagram of the contact crack detection device 100 of the electronic device according to an embodiment of the present invention.

Referring to FIG. 2, the contact crack detecting apparatus 100 of an electronic device according to an embodiment of the present disclosure may be the first test body 2 or the second test body 3 as the vibrator 110 as described above. ) Can be used a small high speed vibration motor or vibrator.

The vibrator 110 may include a power supply unit 180 that provides power.

In addition, as described above, the vibration detection unit 120 includes a vibration sensor 120 (Vibration sensor) in contact with the test object (2 or 3) that the vibration unit 110 is in contact with the vibration measurement unit 120 to measure the vibration. can do.

As illustrated, the resistance measurement unit 140 includes a digital volt meter (141, a digital volt meter) and a current supply unit 145 and a 4-wire method (5: 4-Wire Method). It is possible to measure the resistance value precisely.

Referring to the operation of the contact crack detection device 100 of the electronic device according to an embodiment of the present invention.

The vibration unit 110 applies a vibration having a frequency and waveform continuously variable within a predetermined effective range to the test body 2, and collects the vibration value generated from the vibration from the vibration sensor 120 The sensing unit 130 senses and simultaneously measures the resistance value corresponding to the variable vibration by using the four-wire method 5 described above in the resistance value measuring unit 140 at high speed.

The reason why the vibration value (frequency or waveform) provided by the vibrator 110 is variable is that even though it is a very precise vibrator, the physical error range of the vibrator 110 itself or between the vibrator 110 and the test object 2 This is because vibration errors occur within the effective range due to various reasons such as contact state.

As described above, the resistance value measuring unit 140 may use a 4-wire method (5-wire method) as a method of measuring the resistance value. The 4-wire method 5 is basically a fixed resistor. In order to accurately measure the resistance value of, in particular, the embodiment provides a fixed current from the current supply unit 145 and the resistance according to the vibration through the voltage value measured using the digital volt meter 141. In calculating the change in value, it is applied to obtain the value that excludes the distortion caused by contact resistance or cable connection for measurement.

This is because distortion of the resistance value by the measuring cable for sensing is also a factor that cannot be ignored because the resistance value due to the vibration provided at high speed must be measured very precisely.

Thus, by using the four-wire method (5), the resistance value measuring unit 140 can accurately measure the actual resistance value excluding distortion due to the internal resistance of the cable for resistance value measurement is measured resistance The reliability of the value can be increased.

On the other hand, the calculation unit 150 of the contact crack detection device 100 of the electronic device according to an embodiment of the present invention performs pattern filtering in response to a vibration value varying the resistance value measured by the resistance value measuring unit 140. To perform.

As a preferred embodiment of the pattern filtering, the lock-in algorithm described above may be applied. The lock-in algorithm is basically a case in which a precision required by various noises in measuring a micro signal cannot be obtained. This algorithm is used to obtain a desired signal in a noisy environment.

That is, the lock-in algorithm detects a minute measurement result according to a specific repetitive external change, and is a kind of high-dimensional filter algorithm that removes a result value other than the repetitive external change.

At this time, in the present invention, the vibration value measured using the high-dimensional filtering technique of the lock-in algorithm and the change of the resistance value precisely measured at high speed through the 4-wire method (5) are cracked through pattern analysis using pattern filtering. Understand the condition.

According to a preferred embodiment, the operation unit 150 filters a repetitive pattern in which a change in resistance change due to vibration variation is irregularly finely changed according to the type of crack using a lock-in algorithm.

In particular, the contact crack detection device 100 of the electronic device according to an embodiment of the present invention, in addition to the original purpose of the lock-in algorithm used to amplify and obtain a desired signal when there is actually a much larger noise than the measured signal. In addition, it is used to filter patterns from vibration values and resistance values according to the degree of cracking of the contact state, and amplifies it into a desired signal to extract noise generated by cracking as a desired signal.

Through pattern filtering, such as a lock-in algorithm, the contact crack detection apparatus 100 of the electronic device according to an embodiment of the present invention can accurately identify a minute crack state according to the degree of crack progression of the contact part.

In addition, the control unit 160 of the contact crack detection device 100 of the electronic device according to an embodiment of the present invention is connected to the connection part including the solder ball 1 of the test object through the pattern analysis of the result of pattern filtering. After determining the contact state with respect to the crack-related information according to a predetermined criterion, the crack-related information may be output to the user through the output unit 170.

In addition, for example, the controller 160 may control the operation speed of the operation unit 150, the measurement accuracy setting of the sensing unit 130, and the operation unit 150, such as the operation control of the digital volt meter 141. Various operations of the sensing unit 130 and the digital volt meter 141 may be controlled.

As described above, the contact crack detection device 100 of the electronic device according to an embodiment of the present invention performs repeated pattern filtering using a lock-in algorithm to perform mutual filtering according to the crack state of the connection site. The output can be output in different, accurate patterns, which greatly improves the accuracy of the classification of cracks at the joints.

3 is a contact portion in a normal state according to an embodiment of the present invention, Figure 4 is a contact portion in a fine crack state according to an embodiment of the present invention, Figure 5 is a contact portion in a crack state according to an embodiment of the present invention 6 is a contact part in a completely destroyed state according to an embodiment of the present invention, and FIGS. 3 to 6 are views of the first test body 2 and the second test body 3 including the solder balls 1. The enlarged state of contact is shown.

Referring to FIG. 3, when the connection portion of the contact portion is in a normal state, there is no crack in the solder ball 1, so that a very stable connection state can be maintained electrically.

Referring to FIG. 4, in the case where the contact portion of the contact portion is in a fine crack state, a crack 8 has occurred in a part of the contact portion, which is not visually confirmed or a change in resistance value is not found even by a general resistance measurement. Fine cracks are generated inside or outside the solder ball 1, so that the electrical contact state becomes unstable in the future, which may cause malfunction or failure of the electronic device.

That is, the above-described micro crack state can maintain the electrical connection state as the resistance measurement in the normal way is not different from the normal state, but it is a problem in the contact state when the crack progresses due to time or external impact. Means a state that can occur.

Referring to FIG. 5, when the connection portion of the contact portion is in a crack state, a crack 8 is generated in the entire contact portion, and a state in which stable electrical connectivity cannot be guaranteed.

Referring to FIG. 6, in the case where the contact portion of the contact portion is completely destroyed, the contact portion is broken (8), which means a state in which electrical connection is disconnected.

In FIGS. 3 to 6, the connection portion of the contact portion has been described with reference to the crack 8 state of the solder ball 1, but a poor contact between a part of the test bodies 2 and 3 and the solder ball 1 is shown. It may be configured to classify the contact state through the pattern filtering according to an embodiment of the present invention, and to output it as the corresponding crack-related information through the pattern analysis.

On the other hand, as a preferred embodiment, the control unit 160 of the contact crack detection device 100 of the electronic device according to an embodiment of the present invention by using the calculation result of the resistance value and the pattern filtering measured at least four or more The type of crack can be classified and output.

At this time, the control unit 160 is a part of the crack state of the connection site as the normal state without the crack, the crack state in which the crack as a whole, the complete fracture state in which the connection is broken and the contact state different from the crack state only a part It is preferable to classify as one of the micro-cracks state in which the cracks occurred.

FIG. 7 is a graph illustrating a resistance value 6 in a steady state and a result 7 through pattern filtering according to an embodiment of the present invention, and FIG. 8 is a resistance in a micro crack state according to an embodiment of the present invention. FIG. 9 is a graph showing a value 6 and a result 7 through pattern filtering, and FIG. 9 shows a resistance value 6 in a crack state and a result 7 through pattern filtering according to an embodiment of the present invention. 10 is a graph illustrating a resistance value 6 in a completely destroyed state and a result 7 through pattern filtering according to an embodiment of the present invention. In FIG. 7 to FIG. 10, a thick line is measured at high speed. One resistance value (6), with a thin line showing the resultant value (7) through pattern filtering.

Referring to FIG. 7, in the normal state according to an embodiment of the present disclosure, the resistance value 6 of the contact portion is continuously output while maintaining the actual contact resistance value within a predetermined range, and the result value 7 according to the pattern filtering. ) Is almost straight.

Referring to FIG. 8, in the micro-crack state according to an embodiment of the present invention, the resistance value 6 of the contact portion continuously outputs the actual contact resistance value similar to the normal state, while the result value according to the pattern filtering. (7) converges to a specific value that differs from the steady state value in at least some intervals.

Referring to FIG. 9, in a crack state according to an embodiment of the present invention, the resistance value 6 of the contact portion and the resultant value 7 according to the pattern filtering show similar waveforms over time.

Referring to FIG. 10, in the complete destruction state, the resistance value 6 of the contact portion outputs a value in a range similar to the maximum value of the digital volt meter in at least a portion, whereas the pattern filtering is performed. The resulting value 7 keeps a straight line almost in a range similar to the steady state.

As described above, in the embodiment of the present invention, the contact state of the contact portion is divided into four types including a fine crack state according to the crack state of the solder ball, but it is further extended to correspond to the progress of the crack state according to a predetermined standard. Of course, four or more are possible through pattern filtering and pattern analysis corresponding to the feature.

As such, the contact crack detection device 100 of the electronic device according to an embodiment of the present invention may accurately identify the vibration value and the resistance value at high speed by precisely measuring the amplification pattern according to the contact state and generally measuring the detection pattern. Even micro cracks that cannot be identified can be accurately identified using patterns, so the degree of cracking at the connection site can be classified and identified.

11 is a flowchart illustrating a method of detecting contact cracks of an electronic device according to an embodiment of the present disclosure.

Referring to FIG. 11, a contact crack detection method of an electronic device according to an embodiment of the present invention is used for an electronic device and is connected to a printed circuit board (PCB) or interconnected through a contact including one or more solder balls. A contact part crack detection method of the apparatus 100 for detecting a crack of the contact part between a first inspector that is a package and a second inspector that is a package or a package, wherein the vibrator 110 includes the first inspector and the first inspector. 2 providing a vibration having a frequency and a waveform within a predetermined effective range to at least one of the test object (S10), the vibration detecting unit 120 detects the vibration (S20), the sensing unit 130 Measuring a vibration value including the frequency and the waveform transmitted from the vibration detection unit 120 (S20), the resistance value measuring unit 140 measures the resistance value of the contact portion while the vibration is provided Step S30, operation The unit 150 receives the vibration value including the frequency and the waveform and the resistance value measured, and filters the repetitive pattern generation using the vibration value and the resistance value (S40) and the controller 160. And dividing the resistance value and the calculation result of the repetitive pattern filtering according to a predetermined crack determination or outputting the expression in a representation capable of confirming different crack states (S50).

The pattern filtering step (S40) is performed by the calculation unit 150 using a lock-in algorithm to determine a repetitive pattern in which the change in resistance due to the variation of vibration is irregularly finely changed according to the type of crack. It is desirable to filter.

In the crack-related information output step (S50), the control unit 160 may classify and output the types of cracks by using at least four measured resistance values and calculation results of pattern filtering.

At this time, the crack-related information output step (S50) is characterized in that the control unit 160 determines the type of the crack, the crack state of the connection site in the normal state without cracks, the crack state in which the crack as a whole, the complete destruction state in which the connection is broken And a fine crack state in which only part of the cracks are generated as a contact state different from the crack state.

In addition, in the resistance measurement step S30, the resistance measurement unit 140 may use a 4-wire method as a measurement method of the resistance value.

The foregoing embodiments and advantages are merely exemplary and are not to be construed as limiting the present invention. However, the present invention is not limited to the above-described embodiments, and various changes and modifications may be made by those skilled in the art without departing from the scope of the present invention. .

1: Solder Ball
2,3: PCB (Printed Circuit Board) or Package
5: 4 wire 6: resistance value
7: Analysis result using pattern filtering 8, 9: Crack state
100: contact crack detection device of the electronic device 110: vibration part
120: vibration detection unit 130: sensing unit
140: resistance measurement unit
141: Digital Volt Meter (DVM)
150: calculator 160: controller
170: output unit 180: power supply unit

Claims (10)

An apparatus for detecting a crack in a contact portion between a first test body, which is a printed circuit board (PCB) or a package, and a second test body, which is a PCB or a package, interconnected through at least one contact,
A vibrator configured to provide a vibration having a frequency and a waveform within a preset effective range to at least one of the first and second test bodies;
A vibration detecting unit having a vibration detecting sensor detecting the vibration;
A sensing unit measuring a vibration value including the frequency and a waveform transmitted from the vibration sensing unit;
A resistance value measuring unit measuring a resistance value of the contact unit while the vibration is provided;
An operation unit which receives the vibration value including the frequency and the waveform and the resistance value measured and filters repetitive pattern generation using the vibration value and the resistance value; And
And a controller for dividing the resistance value and the result of the repetitive pattern filtering according to a predetermined crack determination or outputting a different crack state.
The method of claim 1, wherein the operation unit
An apparatus for detecting cracks in contact parts of an electronic device, comprising using a lock-in algorithm to filter a repetitive pattern in which a change in resistance due to a change in vibration varies irregularly according to the type of crack.
The apparatus of claim 1, wherein the control unit
A crack detection device for an electronic device, characterized in that the type of crack is classified and output using a result of calculation of resistance values measured at least four or more and pattern filtering.
The method of claim 3, wherein the control unit
The crack may be classified into a crack state of the connection part as one of a normal state without cracks, a crack state as a whole, a crack state in which the connection is broken, and a micro crack state in which only part of the cracks occurs as a contact state different from the crack state. Contact crack detection device of the electronic device, characterized in that the classification.
The method of claim 1, wherein the resistance measurement unit
A contact crack detection device for an electronic device, characterized by using a 4-wire method as a measuring method of the resistance value.
Contact crack detection of a device for detecting a crack in the contact portion between a first test specimen, which is a printed circuit board (PCB) or a package, and a second test specimen, which is a PCB or a package, which is used in an electronic device and interconnected through one or more contacts. In the method,
a) a vibrating unit providing a vibration having a frequency and a waveform within a preset effective range to at least one of the first and second specimens;
b) a vibration sensing unit to detect the vibration;
c) a sensing unit measuring a vibration value including the frequency and the waveform transmitted from the vibration sensing unit;
d) measuring the resistance value of the contact portion while the resistance value measuring unit is provided with the vibration;
e) receiving, by the calculation unit, a vibration value including the frequency and the waveform and the resistance value measured, and filtering repetitive pattern generation using the vibration value and the resistance value; and
and f) outputting, by the controller, the calculation result of the resistance value and the repetitive pattern filtering according to a predetermined crack determination or in a representation capable of confirming a different crack state.
The method of claim 6, wherein step e)
The calculation unit uses a lock-in algorithm to detect a contact crack of an electronic device, characterized in that for filtering a repetitive pattern in which a change in resistance change due to vibration variation is irregularly finely changed according to the type of crack. Way.
The method of claim 6, wherein step f)
The control unit crack detection method of the electronic device, characterized in that for outputting the type of crack by using the resistance value and the result of the calculation of the pattern filtering measured at least four or more.
The method of claim 8, wherein f)
The control unit may be configured to determine the type of the crack as a normal state without cracks, a crack state as a whole, a crack state in which the connection is broken, and a crack state in which only a part of the cracks is in contact with the crack state. Contact crack detection method of an electronic device, characterized in that divided into one of the states.
The method of claim 6, wherein step d)
And the resistance measurement unit uses a 4-wire method as a measurement method of the resistance value.

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