JP4377258B2 - Component mounting inspection method and circuit board inspection apparatus - Google Patents

Description

  The present invention relates to a component mounting inspection method for inspecting circuit component mounting quality and a circuit board inspection apparatus for inspecting a circuit board according to the component mounting inspection method.

  As this type of circuit board inspection apparatus, the applicant has disclosed a circuit board inspection apparatus for inspecting the presence / absence of mounting of circuit components (mounting quality) using a component presence / absence detection probe in Japanese Patent Laid-Open No. 7-72210. . In this case, as shown in FIG. 3 of the publication, the component presence / absence detection probe includes a first probe pin 20, a second probe pin 21, a front holding member 22, and a rear holding member 23. Both probe pins 20 and 21 are urged in a direction protruding from the holding members 22 and 23 by urging means 25 and 26. Further, the second probe pin 21 and the front holding member 22 are provided with contact portions b1 and b2 that are short-circuited when the tip portion of the first probe pin 20 is not in contact with the circuit component.

When inspecting whether or not a circuit component is mounted using this circuit board inspection apparatus, first, the circuit component to be inspected on the circuit board (toward the part where the circuit component should be mounted) is firstly viewed from above. Lower the presence / absence detection probe. At this time, when the component presence / absence detection probe is further lowered after the tip of the first probe pin 20 contacts the surface of the circuit component, the first probe pin 20 slides with respect to the front holding member 22 and the second Slide the probe pin 21. As a result, as shown in FIG. 3B of the same publication, the contact portions b1 and b2 are in a non-contact state, and the resistance value between the contact portions b1 and b2 that has been short-circuited before the slide is a large value. Become. Therefore, in this circuit board inspection apparatus, the component presence / absence detection probe is lowered while measuring the resistance value between the contact portions b1 and b2, and based on the descending amount of the component presence / absence detection probe until the resistance value changes, The height at which the tip of the first probe pin 20 contacts the inspection object (the surface of the circuit component or the circuit board) is specified. Next, it is inspected whether or not the circuit component is mounted by comparing the height with a reference value for inspection.
JP-A-7-72210 (page 3-5, Fig. 1-3)

  However, the circuit board inspection apparatus disclosed by the applicant has the following problems to be improved. That is, in this circuit board inspection device, the tip of the first probe pin 20 contacts the object to be inspected based on the descending amount of the component presence / absence detection probe up to the time when the resistance value between the contact portions b1 and b2 changes. The height is specified. In this case, a mechanical configuration such as the contact portions b1 and b2 may cause dust adhesion and contact wear when used repeatedly over a long period of time. As a result, although the first probe pin 20 is not in contact with a circuit component or the like, a large resistance value is measured, and the height at which the tip of the first probe pin 20 contacts the object to be inspected. May be measured incorrectly. Therefore, in the circuit board device disclosed by the applicant, prior to lowering the component presence / absence detection probe toward the circuit component, in order to avoid erroneous determination due to contact wear or the like, the contact portion b1, A pre-inspection is performed to determine whether or not b2 is in a short circuit state. For this reason, the preliminary inspection performed prior to the start of the inspection of the circuit board is complicated, and it is preferable to improve this point. In this circuit board inspection apparatus, the component presence / absence detection probe is further lowered from the state in which the tip of the first probe pin 20 is in contact with the object to be inspected to inspect whether or not the circuit component is mounted (mounting presence / absence). Therefore, since the tip of the first probe pin 20 is pressed against the circuit component or the circuit board with a certain amount of force, the upper surface of the circuit component or the board surface of the circuit board may be damaged. Is preferred.

  On the other hand, JP 2002-13916 A discloses a pair of discrimination sensors 10 (first sensor 11 and second sensor 12) that irradiates sensor light toward the electronic component 20 and reflects the reflected light reflected by the electronic component 20. ), A component discriminating device that inspects whether or not the electronic component 20 is mounted (difference in component shape) based on the received light state is disclosed. According to this component discriminating apparatus, unlike the configuration for inspecting the mounting quality of circuit components using an electrical measurement probe having a mechanical contact, there is no misclassification due to contact wear and the like, and The mounting quality can be inspected in a non-contact state with respect to the electronic component 20 (without damaging the electronic component 20). However, since the first sensor 11 and the second sensor 12 are more expensive than the electrical measurement probe, there is a problem that it is difficult to reduce the manufacturing cost of the component identification device.

  The present invention has been made in view of such a problem to be improved, and avoids a rise in the manufacturing cost of a circuit board inspection apparatus and damage to an inspection object, while avoiding damage to a circuit object without using mechanical contacts. The main object is to provide a component mounting inspection method and a circuit board inspection apparatus capable of inspecting mounting quality.

In order to achieve the above object, the component mounting inspection method according to claim 1 is for electrical measurement in which a tip is positioned at a predetermined position close to a mounting space in which each circuit component to be inspected is mounted on a circuit board. The electrical parameter for measuring between the probe and the reference electrode is measured, and the tip part is positioned at each predetermined position in either one of the normal mounting state and the non-mounting state of the circuit component. the electrical parameters for between the probe and the reference electrode as a reference value for the respective circuit components, said each circuit component based on said reference value of the electrical parameters and the circuit components described above measured When inspecting whether or not the mounting is good, the position immediately before the tip part comes into contact with the circuit component to be mounted is set as the predetermined position . Note that “inspection of mounting quality” in this specification is different in type from circuit component mounting presence / absence, mounting position quality (presence / absence of misalignment), mounting posture quality, and circuit component to be mounted. Various inspections such as mounting / non-mounting of circuit components to be performed are included.

  A component mounting inspection method according to a second aspect is the component mounting inspection method according to the first aspect, wherein a position facing the upper surface of the circuit component to be mounted in the mounting space is the predetermined position.

A component mounting inspection method according to a third aspect is the component mounting inspection method according to the first or second aspect , wherein a capacitance between the electrical measurement probe and the reference electrode is measured as the electrical parameter.

5. The circuit board inspection apparatus according to claim 4 , wherein the electrical measurement probe, a probe moving mechanism that moves the electrical measurement probe, and a measurement unit that measures electrical parameters between the electrical measurement probe and the reference electrode. And a control unit that controls the probe moving mechanism and inspects whether or not the circuit component is mounted based on the electrical parameter, and is close to a mounting space in which each circuit component to be inspected on the circuit board is to be mounted The electrical parameters between the electrical measurement probe and the reference electrode, each of which stores a predetermined position to be stored and the distal end portion positioned at each predetermined position , which is in a normal mounting state or a non-mounting state of the circuit component or a value measured in one state and a storage unit that stores as a reference value for the respective circuit components, wherein the control unit The probe moving mechanism is controlled to a is positioned at the predetermined position for each circuit component stored the electrical measurement probe in the storage unit, the electrical parameters in the respective predetermined positions relative to the measuring section And measuring the mounting quality of each circuit component based on the measured electrical parameter and the reference value for each circuit component, and the circuit component to which the tip portion should be mounted The position immediately before contact is set as the predetermined position.

The circuit board inspection apparatus according to claim 5 is the circuit board inspection apparatus according to claim 4 , wherein the control unit sets the position facing the upper surface of the circuit component to be mounted in the mounting space as the predetermined position. The electrical measurement probe is moved with respect to the probe moving mechanism.

Circuit board inspection apparatus according to claim 6, wherein, in the circuit board inspection apparatus according to claim 4 or 5, wherein said measuring unit, the electrical parameters of the electrostatic capacitance between the reference electrode and the electrical measurement probe Measure as

5. The component mounting inspection method according to claim 1, and the circuit board inspection apparatus according to claim 4 , wherein electrical parameters between an electrical measurement probe having a tip portion positioned at a predetermined position on the circuit board and a reference electrode are provided. And the reference value are compared, and the mounting quality of the circuit component is inspected based on the difference. At this time, when the value measured in the normal mounting state of the circuit component is used as the reference value, the measured electrical parameter is equal to the reference value (the measured electrical parameter is equal to or substantially equal to the reference value). When equal: As an example, when it is within the range of ± 10%, it is determined that the circuit component to be inspected is mounted, and when the electrical parameter is not equal to the reference value, the circuit component is not mounted. Determine. In addition, when using the value measured when the circuit component is not mounted as the reference value, it is determined that the circuit component to be inspected is mounted when the measured electrical parameter is not equal to the reference value, and the electrical It is determined that the parameter is not mounted when the reference value is equal to the circuit component. Therefore, since there is no mechanical contact for inspecting whether or not the circuit component is mounted, it is possible to avoid erroneous determination due to dust adhesion or contact wear. As a result, prior inspection for inspecting the quality of the inspection probe prior to the start of the inspection can be made unnecessary, so that the mounting quality of the circuit components can be inspected quickly. In addition, since it is possible to inspect whether the circuit component is mounted correctly without bringing the tip of the electrical measurement probe into contact with the top surface of the circuit component or the substrate surface of the circuit board, the circuit component or the circuit board is damaged, and electrical The quality of the circuit board can be inspected without damaging the measurement probe. Furthermore, since it is possible to inspect the mounting quality of circuit components with a simple configuration as compared with an inspection apparatus employing an optical sensor, the manufacturing cost of the circuit board inspection apparatus can be sufficiently reduced. Further, in this component mounting inspection method and this circuit board inspection apparatus, the position immediately before the tip of the electrical measurement probe contacts the circuit component is inspected as a predetermined position. Therefore, the electrical parameter (for example, stray capacitance) between the electrical measurement probe and the reference electrode becomes a large value by the amount that the distance from the reference electrode of the circuit component is shortened when the circuit component is normally mounted. It is possible to increase the amount of difference in measurement results depending on whether or not circuit components are mounted. Thereby, it is possible to accurately inspect whether or not the circuit component is mounted without causing damage to the circuit component and the circuit board or damaging the electric measurement probe.

Further, in the component mounting inspection method according to claim 2 and the circuit board inspection device according to claim 5 , the probe for electrical measurement in which the tip is positioned at a position facing the upper surface of the circuit component to be mounted in the mounting space. The circuit component is inspected for quality based on the electrical parameters between the reference electrode and the reference electrode. Therefore, for example, unlike the inspection method and inspection apparatus in which the tip of the electrical measurement probe is positioned on the side of the circuit component to be inspected, even when the space between adjacent circuit components is narrow, The tip of the electrical measurement probe can be positioned in the vicinity (predetermined position) of the circuit component without making contact with the circuit component. As a result, the quality of the circuit board can be inspected without causing damage to the circuit components and damage to the electrical measurement probe.

Further, the component mounting inspection method according to claim 3, wherein, and the circuit board inspection apparatus according to claim 6 measures the electrostatic capacitance between the reference electrode and the electric measurement probe as an electrical parameter in the present invention compared To do. Thereby, it is possible to accurately and easily inspect whether or not the circuit components are mounted correctly.

  The best mode of a component mounting inspection method and a circuit board inspection apparatus according to the present invention will be described below with reference to the accompanying drawings.

  First, the configuration of the circuit board inspection apparatus 1 according to the present invention will be described with reference to the drawings.

  A circuit board inspection apparatus 1 illustrated in FIG. 1 is an apparatus that performs various electrical inspections on a circuit board B to be inspected, and includes electrical measurement probes 2 and 3, probe moving mechanisms 5 a and 5 b, a measurement unit 6, A control unit 7, a RAM 8 and a ROM 9 are provided. Electrical measurement probes (hereinafter also referred to as “probes”) 2 and 3 are shock-absorbing one-needle type contact probes, and are electrically connected to the measuring unit 6 as shown in FIG. The probe pins 2a and 3a are attached to the moving mechanisms 5a and 5b via the probe fixture 4 (see FIG. 1), and the probe pins 2a and 3a are slidably held in the directions of arrows Z1 and Z2 (advanced and retracted). Holding parts 2b and 3b are provided. In the probes 2 and 3, probe pins 2a and 3a are urged in the directions of arrows Z1 by coil springs built in the holding portions 2b and 3b, respectively. Probe moving mechanisms (hereinafter also referred to as “moving mechanisms”) 5 a and 5 b move the probes 2 and 3 up and down and left and right under the control of the control unit 7, so that the tip portions of the probe pins 2 a and 3 a The circuit board B to be inspected on B is moved to a mounting position (hereinafter also referred to as “inspection position”) where the circuit board B to be inspected is to be mounted.

  The measurement unit 6 outputs an AC signal for measurement as an inspection signal to the circuit board B through the probes 2 and 3 under the control of the control unit 7, and the probe 2 and, for example, a conductor pattern Ba on the circuit board B, etc. The capacitance (an example of an electrical parameter in the present invention) is measured between (see 3 and 4). Specifically, the measurement unit 6 measures the phase difference between the phase of the output measurement AC signal voltage and the phase of the current flowing through the circuit board B and the conductor pattern Ba, and for measurement. The capacitance between the probe 2 and the conductor pattern Ba is measured based on the voltage of the AC signal, the current of the AC signal for measurement, and the measured phase difference. In this case, the conductor pattern Ba is an example of the reference electrode in the present invention. As shown in FIG. 4, the electrode part Pa of the circuit component P mounted on the circuit board B is connected and the inner layer pattern is interposed. It is connected to the conductor pattern Bb. The control unit 7 controls the operations of the moving mechanisms 5 a and 5 b and the measurement unit 6. In addition, the control unit 7 measures the capacitance at the mounting position where the circuit component P should be mounted and stores it in the RAM 8, and inspects whether or not the circuit component P is mounted based on the capacitance stored in the RAM 8. The inspection process to be executed is executed.

  The RAM 8 corresponds to a storage unit in the present invention, and a mounting space in which the circuit component P to be inspected is mounted on the circuit board B (a space indicated by a broken line in FIG. 3, in other words, a circuit component P to be mounted). ) And a reference value for the inspection position and the capacitance output from the measuring unit 6 are stored. In this case, as shown in FIG. 3, the reference value is a distance (high) from the substrate surface to the upper surface of the circuit component P for the circuit substrate B to be inspected and the circuit component P is not mounted. A) It is created by measuring the electrostatic capacitance between the probe 2 (probe pin 2a) having the tip located at the position D separated from the substrate surface by Lp or more and the conductor pattern Ba. Further, the position D is an example of a predetermined position in the present invention, and in this circuit board inspection apparatus 1, the board surface is slightly longer than the distance Lp from the board surface of the circuit board B to the upper surface of the circuit component P. (A position where the tip of the probe pin 2a faces the upper surface of the circuit component P and is very close to the upper surface). That is, the position D is defined as a position immediately before contacting the upper surface of the circuit component P when the probe 2 is brought close (down) from above the circuit component P. The ROM 9 stores an operation program of the control unit 7 and the like.

  Next, a method for inspecting the circuit board B by the circuit board inspection apparatus 1 will be described with reference to the drawings. Note that the reference value for inspection is assumed to be previously absorbed from the circuit board B in which the circuit component P is not mounted and stored in the RAM 8.

  First, the circuit board B to be inspected is set at the inspection position with the surface (board surface) on which the circuit component P is mounted facing the front side (upward). Next, the control part 7 moves the probe 3 by controlling the moving mechanism 5b, for example, and makes the front-end | tip part of the probe pin 3a contact the conductor pattern Bb. Next, the control unit 7 controls the moving mechanism 5a, so that the control unit 7 is defined in advance at a position separated in a predetermined direction with respect to the inspection position (measurement point) where the circuit component P to be inspected is to be mounted. The probe 2 is moved to a position (in this example, above the measurement point). When the circuit board B is inspected in the horizontal direction, the probe 2 is positioned at a position separated in the horizontal direction as a predetermined direction with respect to the measurement point. Next, the control unit 7 controls the moving mechanism 5a to lower the probe 2 toward the substrate surface to a height where the tip of the probe pin 2a is located at the position D. Subsequently, the control unit 7 causes the measurement unit 6 to measure the capacitance and stores the measurement result in the RAM 8.

  At this time, as shown in FIG. 3, in a state where the circuit component P is not mounted on the circuit board B (non-mounted state), the stray capacitance C1 corresponding to the distance between the tip of the probe pin 2a and the conductor pattern Ba. Is measured by the measuring unit 6. Since the stray capacitance C1 is equal to or equal to the reference value (equal value or almost equal value, for example, within a range of ± 10%), the control unit 7 outputs the measurement result output from the measurement unit 6. (The above stray capacitance C1) is compared with the reference value stored in the RAM 8, and it is determined that the values are equal, and it is determined that the circuit component P is not mounted at the inspection position (inspection) ) On the other hand, as shown in FIG. 4, when the circuit component P is normally mounted on the circuit board B (normal mounting state), the stray capacitance C1 according to the distance between the tip of the probe pin 2a and the conductor pattern Ba. At the same time, the measurement unit 6 measures the capacitance to which the stray capacitance C2 or the like corresponding to the distance between the tip of the probe pin 2a and the electrode part Pa is added. This electrostatic capacity is larger than the reference value by the amount of stray capacitance C2 and the like. Therefore, the control unit 7 compares the measurement result (capacitance) output from the measurement unit 6 with the reference value stored in the RAM 8, and determines that the measurement result is a larger value. Then, it is determined (inspected) that the circuit component P is mounted at the inspection position.

  Thereafter, the control unit 7 also measures other measurement points on the circuit board B in a state where the probe 2 is positioned at the position D by controlling the moving mechanisms 5a and 5b and the probe 3 is in contact with the conductor pattern. The unit 6 is made to measure the capacitance. Further, the control unit 7 compares the measurement result of the measurement unit 6 with the reference value for each inspection position to determine that the circuit component P is in the non-mounted state when the two values are equal to each other. When the measurement result of the unit 6 is larger than the reference value, it is determined that the circuit component P is in a normal mounting state. The quality of the circuit board B is determined by inspecting all the inspection positions for the quality of mounting of the circuit component P based on the measurement of the capacitance and the comparison with the reference value.

  As described above, according to the circuit board inspection apparatus 1 and the inspection method by the circuit board inspection apparatus 1, a predetermined position on the circuit board B (in this example, a position close to the mounting space of the circuit component P to be inspected). In this case, the circuit component P is inspected for good or bad on the basis of the capacitance between the probe 2 and the conductor pattern Ba, the tip of which is positioned at a distance Lp from the substrate surface). Since there is no mechanical contact for inspecting the quality of mounting the component P, it is possible to avoid erroneous determination due to dust adhesion and contact wear. Therefore, prior inspection for inspecting the quality of the inspection probe prior to the start of inspection can be made unnecessary, so that the mounting quality of the circuit components can be quickly inspected. In addition, since it is possible to inspect whether or not the circuit component P is mounted without bringing the tip of the probe 2 (probe pin 2a) into contact with the upper surface of the circuit component P or the substrate surface of the circuit board B, the circuit component P or the circuit board The quality of the circuit board B can be inspected without damaging B and damaging the probe 2. Furthermore, since the mounting quality of the circuit component P can be inspected with a simple configuration as compared with an inspection apparatus employing an optical sensor, the manufacturing cost of the circuit board inspection apparatus can be sufficiently reduced.

  Further, according to the circuit board inspection apparatus 1 and the inspection method by the circuit board inspection apparatus 1, the tip is located at a position separated from the substrate surface by a distance Lp or more from the substrate surface of the circuit board B to the upper surface of the circuit component P. The tip of the electrical measurement probe is positioned, for example, on the side of the circuit component P by inspecting whether or not the circuit component P is mounted based on the capacitance between the probe 2 where the portion is positioned and the conductor pattern Ba. Unlike the inspection method and inspection apparatus for inspecting, the tip of the probe 2 is connected to the circuit component without contacting the other circuit component P or the like even when the space between the adjacent circuit components P and P is narrow. In the vicinity (predetermined position). As a result, the quality of the circuit board B can be inspected without causing damage to the circuit component P or damage to the probe 2.

  Further, according to the circuit board inspection apparatus 1 and the inspection method by the circuit board inspection apparatus 1, the circuit pin inspection is performed with the position D immediately before the tip of the probe pin 2a contacts the upper surface of the circuit component P as a predetermined position. When the component P is normally mounted, the stray capacitance C2 between the probe 2 and the electrode portion Pa becomes larger as the distance from the electrode portion Pa of the circuit component P becomes shorter. As a result, the circuit component P is mounted. The amount of difference in the measurement results due to pass / fail can be increased. Therefore, it is possible to accurately inspect whether or not the circuit component P is mounted without causing damage to the circuit component P and the circuit board B or damaging the probe 2. In this case, the mounting quality of the circuit component P is accurately and easily inspected by measuring and comparing the capacitance between the conductor pattern Ba (reference electrode) and the probe 2 as an electrical parameter in the present invention. Can do.

  In addition, this invention is not limited to said method and said structure. For example, the example in which the capacitance is measured and compared as an electrical parameter in the present invention has been described, but a measurement signal as an inspection signal is output to the circuit board B via the probe 2 and the electrode part (electrode). Then, the voltage value of the output measurement signal, the current value of the output measurement signal, and the impedance calculated based on the voltage value and the current value are measured and compared as electrical parameters. can do.

  In the above example, the probe 3 is brought into contact with the conductor pattern Bb, and the conductor pattern Ba (conductor pattern to which the electrode part Pa of the circuit component P is connected) connected to the conductor pattern Bb through the inner layer pattern is recorded. Although the capacitance is measured as a reference electrode in the invention, the reference electrode in the present invention is not limited to the conductor pattern to which the circuit component to be inspected is connected, and is connected to the circuit component to be inspected. A conductor pattern that is not present can be used as a reference electrode. In this case, as an example, it is preferable to use a relatively large conductor pattern such as a power supply pattern or a ground pattern as a reference electrode. Further, in the above example, the value (capacitance) absorbed by the circuit component P from the non-mounted circuit board B is used as the reference value, but the circuit component P is mounted normally (in the normal mounted state). ) A value absorbed from a non-defective circuit board B can also be used as a reference value. In this case, it is determined that the circuit component P is in the normal mounting state when the measurement result of the measurement unit 6 is equal to the reference value, and the circuit component P is in the non-mounted state when the measurement result is different from the reference value. It is determined that the mounting state is abnormal. Further, in the circuit board inspection apparatus 1 described above, the probe 2 is lowered from above with respect to the circuit component P, and the tip portion of the probe pin 2a is positioned at the position D (position immediately before the tip portion contacts the upper surface of the circuit component P). However, the present invention is not limited to this, and the substrate surface of the circuit board B from the side of the circuit component P (toward the mounting space of the circuit component P) is not limited to this. , Or the probe 2 approaches the substrate surface of the circuit board B from above, and the tip of the probe pin 2a approaches the side surface of the circuit component P (immediately before contact). ) The capacitance can also be measured in a state where the probe 2 is located at the position.

  Further, in the circuit board inspection apparatus 1 described above, the probes 2 and 3 having the needle-like probe pins 2a and 3a having sharp tips are used. However, the configuration of the electrical measurement probe in the present invention is limited to this. Not. For example, as in the electric measurement probe 12 shown in FIG. 5, a columnar probe pin 12a having a flat tip is arranged to be slidable in the directions of arrows Z1 and Z2 with respect to the holding portion 2b. Can do. According to this configuration, since the area of the portion facing the reference electrode in the electrical measurement probe 12 is large, electrical parameters such as capacitance can be measured stably and accurately. In this case, the means for urging the probe pins 2a, 3a and 12a in the probes 2, 3 and 12 is not limited to the coil spring. For example, the probe pins 2a, 3a and 12a slide with respect to the holding portions 2b and 3b. It is also possible to employ a so-called air cushion structure in which the gas in the sealed space is compressed. Further, like the electrical measurement probe 22 shown in FIG. 6, it is formed in a plate spring shape as a whole, and the distal end portion 22a and the proximal end portion 22b are elastically deformed, so that the distal end portion 22a is deformed relative to the proximal end portion 22b. Thus, it is possible to adopt a configuration that moves relatively upward. According to this configuration, since there is no mechanical movable part, electrical parameters such as capacitance can be measured more accurately without causing erroneous measurement due to wear of the movable part.

It is a block diagram which shows the structure of the circuit board inspection apparatus 1 which concerns on embodiment of this invention. 4 is a side view showing the configuration of probes 2 and 3. FIG. FIG. 5 is a conceptual diagram showing the positional relationship between the probes 2 and 3 and the circuit board B and the capacitance measured by the measuring unit 6 when the circuit component P is not mounted. FIG. 5 is a conceptual diagram showing the positional relationship between the probes 2 and 3 and the circuit board B and the capacitance measured by the measuring unit 6 when the circuit component P is normally mounted. 3 is a side view showing the configuration of the probe 12. FIG. 3 is a side view showing the configuration of a probe 22. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Circuit board inspection apparatus 2, 3, 12, 22 Electrical measurement probe 2a, 3a, 12a Probe pin 2b, 3b Holding part 4 Probe fixture 5a, 5b Probe moving mechanism 6 Measuring part 7 Control part 8 RAM
9 ROM
22a distal end portion 22b base end portion B circuit board Ba, Bb conductor pattern C1, C2 stray capacitance D position Lp distance P circuit component Pa electrode portion

Claims (6)

Measuring an electrical parameter between a reference electrode and an electrical measurement probe having a tip positioned at a predetermined position close to a mounting space in which each circuit component to be inspected on a circuit board is to be mounted; the said electrical parameter of between normal mounted state and the electrical measuring probe and the reference electrode said to position the distal end portion to each predetermined position in one of the states of the non-mounting state of the circuit components each As a reference value for the circuit component, the tip portion should be mounted when the mounting quality of each circuit component is inspected based on the measured electrical parameter and the reference value for each circuit component . A component mounting inspection method in which a position immediately before contact with the circuit component is the predetermined position .   The component mounting inspection method according to claim 1, wherein a position facing the upper surface of the circuit component to be mounted in the mounting space is the predetermined position. Component mounting inspection method according to claim 1 or 2, wherein measuring the capacitance as the electrical parameter between the reference electrode and the electrical measurement probe. An electric measurement probe, a probe moving mechanism for moving the electric measurement probe, a measuring unit for measuring an electrical parameter between the electric measurement probe and a reference electrode, and controlling the probe moving mechanism A control unit that inspects whether or not circuit components are mounted based on electrical parameters, and stores a predetermined position close to a mounting space in which each circuit component to be inspected is mounted on the circuit board, and each predetermined position. the electrical measured values in one of the states of the parameter a be in normal mounting state and the non-mounted state of the circuit components for between the electrical measurement probe and the reference electrode was positioned a tip A storage unit that stores the reference value for each circuit component ;
Wherein the control unit, the said controls the probe movement mechanism is stored the electrical measurement probe in the storage unit is positioned at the predetermined position for each circuit component, each of the predetermined position with respect to the measuring section said electrical parameter is measured, as well as inspect the implementation quality of each circuit component based on said reference value of the electrical parameters and the respective circuit component is the measurement, the tip portion is mounted in the A circuit board inspection apparatus in which a position immediately before contact with a power circuit component is the predetermined position . 5. The circuit board inspection according to claim 4 , wherein the control unit moves the probe for electric measurement with respect to the probe moving mechanism with the position facing the upper surface of the circuit component to be mounted in the mounting space as the predetermined position. apparatus. The circuit board inspection apparatus according to claim 4 , wherein the measurement unit measures a capacitance between the electrical measurement probe and the reference electrode as the electrical parameter.

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