JP2002048833A - Circuit board inspecting device - Google Patents
Circuit board inspecting deviceInfo
- Publication number
- JP2002048833A JP2002048833A JP2000233824A JP2000233824A JP2002048833A JP 2002048833 A JP2002048833 A JP 2002048833A JP 2000233824 A JP2000233824 A JP 2000233824A JP 2000233824 A JP2000233824 A JP 2000233824A JP 2002048833 A JP2002048833 A JP 2002048833A
- Authority
- JP
- Japan
- Prior art keywords
- contact
- probes
- circuit board
- constant current
- conductor pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Tests Of Electronic Circuits (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Measurement Of Resistance Or Impedance (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、例えば、四端子法
によって測定された測定値に基づいて検査対象の導体パ
ターンについての電気的検査を行う回路基板検査装置に
関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board inspection apparatus for performing an electrical inspection on a conductor pattern to be inspected based on a measurement value measured by, for example, a four-terminal method.
【0002】[0002]
【従来の技術】例えば検査対象の回路基板に形成された
導体パターンの断線を検査する場合、その導体パターン
の両端点間に測定用の定電流を供給することによってそ
の両端点間の電圧を測定し、その電圧値と定電流の電流
値とで求めた抵抗値に基づいて断線を検査する。この際
には、定電流供給用の一対のコンタクトプローブ(以
下、「プローブ」ともいう)を両端点にそれぞれ接触さ
せると共に電圧測定用の一対のプローブを両端点にそれ
ぞれ接触させ、その状態において、四端子法によって抵
抗値を測定する。この場合、四端子法による測定を行う
ためには、定電流供給用のプローブと電圧測定用のプロ
ーブとの各先端部同士を、直接的に接触させずに、でき
る限り接近させた状態で導体パターンにそれぞれ接触さ
せる必要がある。その一方、近年製造される回路基板で
は、ファインピッチ化が進んでいるため、測定対象の導
体パターンは、非常に狭幅に形成されている。したがっ
て、定電流供給用のプローブと電圧測定用のプローブと
の両者を狭幅の導体パターンに同時に接触させるために
は、両プローブの先端部を至近距離で並設させて保持す
る必要がある。2. Description of the Related Art For example, when inspecting a disconnection of a conductor pattern formed on a circuit board to be inspected, a voltage between the both ends is measured by supplying a constant current for measurement between both ends of the conductor pattern. Then, the disconnection is inspected based on the resistance value obtained from the voltage value and the constant current value. In this case, a pair of contact probes for supplying a constant current (hereinafter, also referred to as “probes”) are respectively brought into contact with both end points, and a pair of voltage measurement probes are brought into contact with both end points. The resistance is measured by the four probe method. In this case, in order to perform measurement by the four-terminal method, the tips of the constant current supply probe and the voltage measurement probe should not be in direct contact with each other, but should be as close as possible to each other. Each must be in contact with the pattern. On the other hand, in a circuit board manufactured in recent years, since the fine pitch has been advanced, the conductor pattern to be measured has a very narrow width. Therefore, in order to simultaneously contact both the constant current supply probe and the voltage measurement probe with the narrow conductor pattern, it is necessary to hold the tips of both probes side by side at a close distance.
【0003】この種の四端子法による抵抗値測定を可能
に構成された装置として、図4に示す回路基板検査装置
31が従来から知られている。この回路基板検査装置3
1は、プローブ保持具3,3(図3参照)を介してプロ
ーブ移動機構2a,2bに取り付けられたプローブ4a
〜4dと、プローブ4a〜4dを用いて四端子法による
電圧測定を実行する測定部35と、プローブ移動機構2
a,2bに対する駆動制御および測定部35に対する測
定制御を実行する制御部36とを備えている。この場
合、プローブ4a,4bおよびプローブ4c,4dは、
図3(a)に示すように、その先端部同士が、互いに接
触せず、かつ至近近距離に並設された状態でプローブ保
持具3によって保持されている。また、測定部35は、
プローブ4a,4dを介して導体パターンに測定用の直
流定電流を供給する定電流源41と、プローブ4b,4
cによって検出された導体パターンの両端点間電圧を測
定する電圧計42とを備えている。As an apparatus configured to be able to measure the resistance value by the four-terminal method of this type, a circuit board inspection apparatus 31 shown in FIG. 4 is conventionally known. This circuit board inspection device 3
Reference numeral 1 denotes a probe 4a attached to probe moving mechanisms 2a, 2b via probe holders 3, 3 (see FIG. 3).
-4d, a measuring unit 35 for performing voltage measurement by the four-terminal method using the probes 4a-4d, and the probe moving mechanism 2
and a control unit 36 for executing drive control for a and 2b and measurement control for the measurement unit 35. In this case, the probes 4a and 4b and the probes 4c and 4d
As shown in FIG. 3A, the tip portions are held by the probe holder 3 in a state where they are not in contact with each other and are juxtaposed at a close distance. In addition, the measuring unit 35
A constant current source 41 for supplying a DC constant current for measurement to the conductor pattern via the probes 4a and 4d;
and a voltmeter 42 for measuring a voltage between both end points of the conductor pattern detected by c.
【0004】この回路基板検査装置31を用いた回路基
板Pの良否判別に際しては、まず、プローブ移動機構2
a,2bが、制御部36の制御下でプローブ4a,4b
およびプローブ4c,4dを移動させて測定対象の導体
パターンの各端点にそれぞれ接触させる。次に、定電流
源41が、制御部36の制御下でプローブ4a,4dを
介して導体パターンに直流定電流を供給し、電圧計42
が、プローブ4b,4cによって検出された導体パター
ンの両端点間電圧を測定する。次いで、制御部36が、
定電流源41から供給される直流電流の電流値と、電圧
計42によって測定された電圧とに基づいて両導体パタ
ーンの両端点間の抵抗値を演算し、所定のしきい値と比
較することにより、その導体パターンの断線を判別す
る。In order to determine the quality of the circuit board P using the circuit board inspection apparatus 31, first, the probe moving mechanism 2
The probes 4a and 4b are controlled by the control unit 36.
Then, the probes 4c and 4d are moved to make contact with the respective end points of the conductor pattern to be measured. Next, the constant current source 41 supplies a DC constant current to the conductor pattern via the probes 4a and 4d under the control of the control unit 36, and the voltmeter 42
Measures the voltage between both ends of the conductor pattern detected by the probes 4b and 4c. Next, the control unit 36
Calculating a resistance value between both ends of both conductor patterns based on a current value of a DC current supplied from the constant current source 41 and a voltage measured by the voltmeter 42, and comparing the calculated value with a predetermined threshold value; Thus, the disconnection of the conductor pattern is determined.
【0005】[0005]
【発明が解決しようとする課題】ところが、従来の回路
基板検査装置31には、以下の問題点がある。すなわ
ち、従来の回路基板検査装置31では、回路基板Pの電
気的検査に際して四端子法による測定を実行するため
に、プローブ4a,4bおよびプローブ4c,4dの先
端部同士を互いに接触させず、かつ至近距離に並設させ
ている。しかし、例えば、図3(a)に示すように、プ
ローブ4a,4b間(または4c,4d間)に半田屑な
どの導電性の異物Xが付着した場合や、同図(b)に示
すように、度重なるプロービングに起因してプローブ4
a,4b(または4c,4d)の各先端部が折れ曲がっ
て互いに接触する状態に至った場合には、異物Xの抵抗
成分やプローブ4a,4b(または4c,4d)間の接
触抵抗成分が測定誤差となる。したがって、四端子法に
よる測定を正しく行うことができないため、導体パター
ンについての断線検査の信頼性が低下するという問題が
発生する。However, the conventional circuit board inspection apparatus 31 has the following problems. That is, in the conventional circuit board inspection apparatus 31, in order to perform measurement by the four-terminal method at the time of electrical inspection of the circuit board P, the tips of the probes 4a, 4b and the probes 4c, 4d are not brought into contact with each other, and They are juxtaposed at a close distance. However, for example, as shown in FIG. 3A, a case where a conductive foreign matter X such as solder dust adheres between the probes 4a and 4b (or between 4c and 4d), or as shown in FIG. In addition, due to repeated probing, probe 4
When the tips of a and 4b (or 4c and 4d) are bent and come into contact with each other, the resistance component of the foreign matter X and the contact resistance component between the probes 4a and 4b (or 4c and 4d) are measured. It becomes an error. Therefore, since the measurement by the four-terminal method cannot be performed correctly, there arises a problem that the reliability of the disconnection inspection for the conductor pattern is reduced.
【0006】本発明は、かかる問題点に鑑みてなされた
ものであり、コンタクトプローブを用いて測定された電
圧に基づく回路基板検査の信頼性を高めることが可能な
回路基板検査装置を提供することを主目的とする。SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and provides a circuit board inspection apparatus capable of improving the reliability of a circuit board inspection based on a voltage measured using a contact probe. The main purpose is.
【0007】[0007]
【課題を解決するための手段】上記目的を達成すべく請
求項1記載の回路基板検査装置は、検査対象の導体パタ
ーンに接触する接触側端部同士が互いに非接触状態で接
近して並設された第1および第2のコンタクトプローブ
と、導体パターンに接触する接触側端部同士が互いに非
接触状態で接近して並設された第3および第4のコンタ
クトプローブと、第1および第4のコンタクトプローブ
を介して導体パターンに測定用の定電流を供給した状態
で第2および第3のコンタクトプローブ間の電圧を測定
する測定部と、測定部の測定結果に基づいて導体パター
ンについての電気的検査を実行する制御部とを備えた回
路基板検査装置であって、測定部は、並設された両コン
タクトプローブ間に定電流を供給した状態で両コンタク
トプローブ間の電圧を測定し、制御部は、測定部によっ
て測定された電圧に基づいて両コンタクトプローブに対
する絶縁検査を行うことを特徴とする。According to a first aspect of the present invention, there is provided a circuit board inspection apparatus in which contact-side ends contacting a conductor pattern to be inspected are closely juxtaposed in a non-contact state. The first and second contact probes, the third and fourth contact probes in which the contact-side end portions that come into contact with the conductor pattern approach each other in a non-contact state, and the first and fourth contact probes. A measuring unit for measuring a voltage between the second and third contact probes while a constant current for measurement is supplied to the conductor pattern via the contact probe, and an electric power for the conductor pattern based on the measurement result of the measuring unit. And a control unit for performing a dynamic inspection, wherein the measuring unit supplies a constant current between the two contact probes arranged side by side and supplies a voltage between the two contact probes. The measured, the control unit is characterized by performing the insulation test for both a contact probe based on the voltage measured by the measurement unit.
【0008】請求項2記載の回路基板検査装置は、請求
項1記載の回路基板検査装置において、測定部は、交流
定電流を定電流として供給することを特徴とする。According to a second aspect of the present invention, in the circuit board inspecting apparatus according to the first aspect, the measuring section supplies an alternating constant current as a constant current.
【0009】請求項3記載の回路基板検査装置は、請求
項1または2記載の回路基板検査装置において、第1お
よび第2のコンタクトプローブと、第3および第4のコ
ンタクトプローブとを検査対象の導体パターン向けてそ
れぞれ移動させるプローブ移動機構を備え、測定部は、
プローブ移動機構によって移動させられている状態の両
コンタクトプローブ間の電圧を測定し、制御部は、移動
させられている状態の両コンタクトプローブに対して絶
縁検査を行うことを特徴とする。According to a third aspect of the present invention, there is provided the circuit board inspection apparatus according to the first or second aspect, wherein the first and second contact probes and the third and fourth contact probes are inspected. Providing a probe moving mechanism for moving each toward the conductor pattern, the measuring unit,
It is characterized in that a voltage between the two contact probes being moved by the probe moving mechanism is measured, and the control unit performs an insulation test on the two contact probes being moved.
【0010】[0010]
【発明の実施の形態】以下、添付図面を参照して、本発
明に係る回路基板検査装置の好適な発明の実施の形態に
ついて説明する。なお、従来の回路基板検査装置31と
同一の構成要素については同一の符号を付して重複した
説明を省略する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A preferred embodiment of a circuit board inspection apparatus according to the present invention will be described below with reference to the accompanying drawings. Note that the same components as those of the conventional circuit board inspection apparatus 31 are denoted by the same reference numerals, and redundant description will be omitted.
【0011】最初に、本発明における回路基板検査装置
1の構成について、図1〜3を参照して説明する。First, the configuration of the circuit board inspection apparatus 1 according to the present invention will be described with reference to FIGS.
【0012】回路基板検査装置1は、図1に示すよう
に、プローブ移動機構2a,2b、プローブ4a〜4
d、測定部5および制御部6を備えている。プローブ移
動機構2a,2bは、制御部6の制御下でプローブ4
a,4bおよびプローブ4c,4dを測定対象の導体パ
ターンに向けて移動させる。この場合、図3に示すよう
に、プローブ移動機構2aには、プローブ4a,4bが
プローブ保持具3を介して取り付けられ、プローブ移動
機構2bには、プローブ4c,4dがプローブ保持具3
を介して取り付けられている。プローブ4a〜4dは、
例えば、ピン状の接触型金属プローブで構成され、本発
明における第1〜第4のコンタクトプローブをそれぞれ
構成する。また、プローブ4a,4b(および4c,4
d)は、同図(a)に示すように、その先端部同士が互
いに接触しないで至近距離に位置するように並設された
状態でプローブ保持具3によって保持されている。測定
部5は、図2に示すように、例えば測定用の交流定電流
を供給する定電流源11と、両プローブ4b,4c間の
電圧を測定する電圧計12と、制御部6の制御下で定電
流源11および電圧計12に対してプローブ4a〜4d
を選択的に接続するスイッチ13〜16とを備えて構成
されている。制御部6は、プローブ移動機構2a,2b
に対する駆動制御のほか、測定部5内の定電流源11か
ら供給される交流定電流の電流値、および電圧計12に
よって測定された電圧値に基づいての抵抗値またはイン
ピーダンス値の演算処理などを実行する。As shown in FIG. 1, the circuit board inspection apparatus 1 includes probe moving mechanisms 2a and 2b, and probes 4a to 4a.
d, a measuring unit 5 and a control unit 6. The probe moving mechanism 2a, 2b controls the probe 4 under the control of the control unit 6.
a, 4b and the probes 4c, 4d are moved toward the conductor pattern to be measured. In this case, as shown in FIG. 3, the probes 4a and 4b are attached to the probe moving mechanism 2a via the probe holder 3, and the probes 4c and 4d are attached to the probe moving mechanism 2b.
Attached through. The probes 4a to 4d
For example, it is constituted by a pin-shaped contact-type metal probe, and constitutes the first to fourth contact probes in the present invention. The probes 4a and 4b (and 4c and 4c)
d) is held by the probe holder 3 in a state where the tip portions are juxtaposed so as not to contact each other and to be located at a close distance as shown in FIG. As shown in FIG. 2, the measuring unit 5 includes, for example, a constant current source 11 that supplies an AC constant current for measurement, a voltmeter 12 that measures a voltage between the probes 4 b and 4 c, and a control unit 6 that controls the voltage. Probe 4a to 4d for constant current source 11 and voltmeter 12
, And switches 13 to 16 for selectively connecting. The control unit 6 includes the probe moving mechanisms 2a and 2b
In addition to the drive control for the current, a calculation process of a resistance value or an impedance value based on the current value of the AC constant current supplied from the constant current source 11 in the measurement unit 5 and the voltage value measured by the voltmeter 12 is performed. Execute.
【0013】次に、回路基板検査装置1による回路基板
Pの検査方法について、各図を参照して説明する。Next, a method of inspecting the circuit board P by the circuit board inspection apparatus 1 will be described with reference to the drawings.
【0014】この回路基板検査装置1では、検査対象の
回路基板Pについての電気的検査に先立って、プローブ
4a,4b間、およびプローブ4c,4d間の絶縁状態
を検査する。具体的には、制御部6は、スイッチ13〜
16を切替制御することにより、各d接点を各a接点に
それぞれ接続する。これにより、定電流源11および電
圧計12の両者がプローブ4a,4bにそれぞれ接続さ
れる。次に、制御部6は、定電流源11に対して測定用
の交流定電流を供給させると共に、電圧計12に対して
プローブ4a,4b間の電圧を測定させる。この場合、
両プローブ4a,4bが至近距離で並設されているた
め、交流的には、両者間に静電容量が接続されていると
みなすことができる。したがって、絶縁状態が正常のと
きには、両プローブ4a,4b間のインピーダンスは、
例えば、10kΩ〜数十kΩの範囲内となる。In the circuit board inspection apparatus 1, prior to the electrical inspection of the circuit board P to be inspected, the insulation state between the probes 4a and 4b and between the probes 4c and 4d is inspected. Specifically, the control unit 6 includes the switches 13 to
By controlling the switching of No. 16, each d contact is connected to each a contact. Thereby, both the constant current source 11 and the voltmeter 12 are connected to the probes 4a and 4b, respectively. Next, the control unit 6 controls the constant current source 11 to supply an AC constant current for measurement and causes the voltmeter 12 to measure the voltage between the probes 4a and 4b. in this case,
Since the two probes 4a and 4b are arranged side by side at a close distance, it can be considered that the capacitance is connected between the two in terms of AC. Therefore, when the insulation state is normal, the impedance between both probes 4a and 4b is
For example, it is in the range of 10 kΩ to several tens kΩ.
【0015】このため、図3(a)に示すように、プロ
ーブ4a,4b間に異物Xが付着している場合や、同図
(b)に示すように、プローブ4a,4bの先端部同士
が接触している場合には、両プローブ4a,4b間が短
絡するため、電圧計12による測定値は、低インピーダ
ンスとなる。したがって、制御部6は、その測定値と、
絶縁不良検出用の第1しきい値(例えば5kΩ)とを比
較し、その測定値が第1しきい値よりも低い値のときに
は、プローブ4a,4b間に絶縁不良が発生しているも
のと判別する。For this reason, as shown in FIG. 3A, when the foreign matter X is attached between the probes 4a and 4b, or as shown in FIG. Are in contact with each other, the two probes 4a and 4b are short-circuited, so that the value measured by the voltmeter 12 has a low impedance. Therefore, the control unit 6 calculates the measured value,
Comparison is made with a first threshold value (for example, 5 kΩ) for detecting insulation failure, and when the measured value is lower than the first threshold value, it is determined that insulation failure has occurred between the probes 4a and 4b. Determine.
【0016】一方、両プローブ4a,4bに絶縁不良が
発生していない場合であっても、両プローブ4a,4b
と測定部5との間の接続ケーブルが断線していることも
ある。かかる場合には、回路基板Pに対するすべての電
気的検査を正常に行うことが不可能となる。したがっ
て、制御部6は、上記の測定値と、ケーブル断線検出用
の第2しきい値(例えば100kΩ)とを比較する。断
線しているときには、その測定値が第2しきい値よりも
高い値になるため、かかる場合には、制御部6は、接続
ケーブルに断線が発生していると判別する。On the other hand, even if insulation failure does not occur in both probes 4a, 4b, both probes 4a, 4b
The connection cable between the sensor and the measuring unit 5 may be broken. In such a case, it becomes impossible to perform all electrical tests on the circuit board P normally. Therefore, the control unit 6 compares the measured value with a second threshold value (for example, 100 kΩ) for detecting cable disconnection. When a disconnection occurs, the measured value becomes higher than the second threshold value. In such a case, the control unit 6 determines that the connection cable is disconnected.
【0017】次いで、制御部6は、スイッチ13〜16
を切替制御することにより、各d接点を各c接点にそれ
ぞれ接続し、プローブ4a,4bに対する検査と同様に
して、プローブ4c,4dに対しても絶縁不良およびケ
ーブル断線の有無を検査する。この後、プローブ4a,
4bまたはプローブ4c,4dに絶縁不良やケーブルの
断線が発生していると判別したときには、回路基板Pに
対する電気的検査を終了すると共に図外の表示部に異常
を報知させる。Next, the control unit 6 includes the switches 13 to 16
, The respective d contacts are respectively connected to the respective c contacts, and the probes 4c and 4d are also inspected for the presence of insulation failure and the presence of cable disconnection in the same manner as the inspection for the probes 4a and 4b. Thereafter, the probes 4a,
When it is determined that the insulation failure or the disconnection of the cable has occurred in the probe 4b or the probes 4c and 4d, the electrical inspection of the circuit board P is finished and the display unit (not shown) is notified of the abnormality.
【0018】一方、絶縁不良やケーブルの断線が発生し
てないと判別したときには、制御部6は、プローブ移動
機構2a,2bを駆動制御することにより、各プローブ
4a〜4dを検査対象の導体パターンに移動させる。同
時に、制御部6は、各プローブ4a〜4dの移動中にお
いて、スイッチ13〜16を切替制御することにより、
各d接点を各b接点にそれぞれ接続する。これにより、
定電流源11がプローブ4a,4dに接続され、かつ、
電圧計12がプローブ4b,4cに接続される。次い
で、制御部6は、プローブ移動機構2a,2bを駆動制
御することにより、例えば、1つの導体パターンの一端
にプローブ4a,4bを接触させ、かつその導体パター
ンの他端にプローブ4c,4dを接触させる。On the other hand, when it is determined that no insulation failure or cable break has occurred, the control section 6 controls the driving of the probe moving mechanisms 2a and 2b to cause each of the probes 4a to 4d to carry the conductor pattern to be inspected. Move to At the same time, the control unit 6 controls the switches 13 to 16 during the movement of the probes 4a to 4d,
Each d contact is connected to each b contact. This allows
A constant current source 11 is connected to the probes 4a and 4d, and
A voltmeter 12 is connected to the probes 4b and 4c. Next, the control unit 6 drives and controls the probe moving mechanisms 2a and 2b, for example, to bring the probes 4a and 4b into contact with one end of one conductor pattern and to connect the probes 4c and 4d to the other end of the conductor pattern. Make contact.
【0019】続いて、制御部6は、検査対象の導体パタ
ーンの両端点間の抵抗値を四端子法に従って測定する。
次いで、制御部6は、その抵抗値と、所定の上下しきい
値(例えば上しきい値が1Ωで下しきい値が10mΩ)
とを比較し、その抵抗値が上下しきい値の範囲内のとき
には、導体パターンが正常と判別し、上下しきい値の範
囲外のときには、異常が生じていると判別する。引き続
き、制御部6は、プローブ移動機構2a,2bを駆動制
御してプローブ4a〜4dを次の検査対象の導体パター
ンに向けて移動させる都度、その移動中に、上記した絶
縁不良およびケーブル断線の有無を検査し、以後、導体
パターンの抵抗検査と、絶縁不良およびケーブル断線の
有無検査を繰り返す。次いで、制御部6は、すべての導
体パターンについての電気的検査を終了したときに、回
路基板Pの良否を判別し、これにより、その回路基板P
についての検査が完了する。Subsequently, the control unit 6 measures a resistance value between both end points of the conductor pattern to be inspected according to a four-terminal method.
Next, the control unit 6 determines the resistance value and a predetermined upper and lower threshold value (for example, the upper threshold value is 1Ω and the lower threshold value is 10 mΩ).
When the resistance value is within the range of the upper and lower thresholds, it is determined that the conductor pattern is normal, and when the resistance is out of the range of the upper and lower thresholds, it is determined that an abnormality has occurred. Subsequently, each time the control unit 6 drives and controls the probe moving mechanisms 2a and 2b to move the probes 4a to 4d toward the next conductor pattern to be inspected, the control unit 6 detects the above-described insulation failure and cable disconnection during the movement. The presence / absence is inspected, and thereafter, the inspection of the resistance of the conductor pattern and the inspection of the presence / absence of insulation failure and cable disconnection are repeated. Next, when the electrical inspection of all the conductor patterns is completed, the control unit 6 determines the quality of the circuit board P, and thereby, the circuit board P
The inspection for is completed.
【0020】このように、この回路基板検査装置1によ
れば、定電圧供給用のプローブ4a(または4d)と、
電圧測定用のプローブ4b(または4c)との間の絶縁
検査、およびケーブル断線検査を行うことにより、測定
条件の良否を予め判別することができる。したがって、
四端子法による抵抗値の測定時には、測定条件の異常に
起因する誤った測定を回避することができるため、回路
基板検査の信頼性を高めることができる。また、プロー
ブ移動機構2a,2bによって各プローブ4a〜4dが
移動させられている時間を利用して絶縁検査等を行うこ
とにより、絶縁検査等に要する検査時間を実質的に無視
できるため、検査時間の長時間化を回避することができ
る。As described above, according to the circuit board inspection apparatus 1, the probe 4a (or 4d) for supplying a constant voltage,
By performing an insulation test with the voltage measurement probe 4b (or 4c) and a cable disconnection test, it is possible to determine in advance whether the measurement conditions are satisfactory. Therefore,
When the resistance value is measured by the four-terminal method, erroneous measurement due to abnormal measurement conditions can be avoided, so that the reliability of circuit board inspection can be improved. Further, by performing an insulation test or the like using the time during which the probes 4a to 4d are moved by the probe moving mechanisms 2a and 2b, the test time required for the insulation test or the like can be substantially ignored. Can be avoided.
【0021】なお、本発明は、上記した本発明の実施の
形態に示した構成に限定されない。例えば、本発明の実
施の形態では、交流定電流を用いて絶縁検査等を行う例
について説明したが、交流定電流に代えて直流定電流を
供給して絶縁検査等を行うこともできる。ただし、接続
ケーブルの断線検査を行うことができる点で、交流定電
流を用いるのが好ましい。また、本発明の実施の形態で
は、スイッチ13〜16の切替制御によって、絶縁検査
等と、導体パターンの断線検査とを切り替える例につい
て説明したが、スキャナ装置や他の電気的切替手段を用
いて、プローブ4a〜4dと定電流源11および電圧計
12との接続を切り替える構成を採用することもでき
る。The present invention is not limited to the configuration shown in the above-described embodiment of the present invention. For example, in the embodiment of the present invention, an example in which an insulation test or the like is performed using an AC constant current has been described. However, an insulation test or the like can be performed by supplying a DC constant current instead of the AC constant current. However, it is preferable to use an AC constant current in that the disconnection inspection of the connection cable can be performed. Further, in the embodiment of the present invention, an example has been described in which an insulation test or the like and a disconnection test of a conductor pattern are switched by switching control of the switches 13 to 16, but a scanner device or another electrical switching unit is used. Alternatively, a configuration in which the connection between the probes 4a to 4d and the constant current source 11 and the voltmeter 12 is switched may be employed.
【0022】さらに、本発明の実施の形態では、導体パ
ターンに対する実際の検査開始前、およびプローブ4a
〜4dの各移動時間中に、両検査プローブについての絶
縁検査等をそれぞれ行う例について説明したが、本発明
は、これに限定されず、測定開始前、移動中、1枚の回
路基板について1回、一日に1回、1週間に1回、また
はオペレータによって指示された時点など、任意の時点
で行わせるように構成することができる。また、本発明
の実施の形態では、両プローブ間に絶縁異常が発生して
いるときに、異常を表示する例について説明したが、本
発明は、これに限定されず、例えば、音による報知や、
別途用意された予備プローブへの自動交換などを行い得
る構成を採用することができる。この場合、プローブを
自動交換する構成を採用することにより、回路基板検査
装置を無人化することができ、測定作業を中断すること
なく、検査作業を連続的に進めることができる。また、
回路基板についての検査内容は、四端子法による検査や
断線検査に限らず、接触型プローブを用いて行う得る各
種検査内容を対象とすることができる。Further, in the embodiment of the present invention, before the actual inspection of the conductor pattern is started, and the probe 4a
4 to 4d, the example in which the insulation inspection and the like for both the inspection probes are performed during each movement time has been described. However, the present invention is not limited to this. It can be configured to be performed at any time, such as once a day, once a day, once a week, or at a time specified by an operator. Further, in the embodiment of the present invention, an example has been described in which an abnormality is displayed when an insulation abnormality has occurred between both probes. However, the present invention is not limited to this. ,
It is possible to adopt a configuration in which automatic replacement with a separately prepared spare probe or the like can be performed. In this case, by adopting a configuration in which the probe is automatically replaced, the circuit board inspection apparatus can be unmanned, and the inspection operation can be continuously performed without interrupting the measurement operation. Also,
The inspection content of the circuit board is not limited to the inspection by the four-terminal method and the disconnection inspection, but may be various inspection content obtained by using a contact probe.
【0023】[0023]
【発明の効果】以上のように、請求項1記載の回路基板
検査装置によれば、制御部が、測定部によって測定され
た第1および第2のコンタクトプローブ間の電圧、並び
に第2および第4のコンタクトプローブ間の電圧に基づ
いて両コンタクトプローブに対する絶縁検査を行うこと
により、コンタクトプローブの絶縁不良に起因する誤っ
た検査を未然に防止することができ、これにより、回路
基板検査の信頼性を向上させることができる。As described above, according to the circuit board inspection apparatus of the first aspect, the control unit controls the voltage between the first and second contact probes measured by the measurement unit and the second and the second contact probes. By performing an insulation test on both contact probes based on the voltage between the contact probes of No. 4, it is possible to prevent an erroneous test due to insulation failure of the contact probes beforehand, thereby improving the reliability of the circuit board inspection. Can be improved.
【0024】また、請求項2記載の回路基板検査装置に
よれば、測定部が交流定電流を用いて両コンタクトプロ
ーブに対する絶縁検査を行うことにより、コンタクトプ
ローブの絶縁に加えて、接続ケーブルの断線をも含めた
測定条件の良否を予め検査することができる結果、回路
基板検査の信頼性をさらに高めることができる。Further, according to the circuit board inspection apparatus of the present invention, the measuring section performs an insulation inspection on both contact probes by using an AC constant current, so that in addition to insulation of the contact probes, disconnection of the connection cable. As a result, the reliability of the circuit board inspection can be further improved.
【0025】さらに、請求項3記載の回路基板検査装置
によれば、制御部が、移動させられている状態のコンタ
クトプローブに対して絶縁検査を行うことにより、コン
タクトプローブの移動時間を有効に利用することができ
るため、検査時間の長時間化を回避しつつ回路基板検査
の信頼性を向上させることができる。Further, according to the circuit board inspection apparatus of the third aspect, the control unit performs the insulation inspection on the contact probe in the state of being moved, thereby effectively utilizing the moving time of the contact probe. Therefore, it is possible to improve the reliability of the circuit board inspection while avoiding an increase in the inspection time.
【図1】本発明の実施の形態に係る回路基板検査装置1
の構成を示すブロック図である。FIG. 1 is a circuit board inspection apparatus 1 according to an embodiment of the present invention.
FIG. 3 is a block diagram showing the configuration of FIG.
【図2】回路基板検査装置1における測定部5の構成を
示す回路図である。FIG. 2 is a circuit diagram showing a configuration of a measuring unit 5 in the circuit board inspection device 1.
【図3】定電流供給用のプローブ4a(4d)および電
圧測定用のプローブ4b(4c)の側面図である。FIG. 3 is a side view of a constant current supply probe 4a (4d) and a voltage measurement probe 4b (4c).
【図4】従来の回路基板検査装置31の構成を示すブロ
ック図である。FIG. 4 is a block diagram showing a configuration of a conventional circuit board inspection device 31.
1 回路基板検査装置 2a,2b プローブ移動機構 4a〜4d プローブ 5 測定部 6 制御部 11 定電流源 12 電圧計 13〜16 スイッチ P 回路基板 DESCRIPTION OF SYMBOLS 1 Circuit board inspection apparatus 2a, 2b Probe moving mechanism 4a-4d Probe 5 Measuring part 6 Control part 11 Constant current source 12 Voltmeter 13-16 Switch P Circuit board
フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) H05K 3/00 G01R 31/28 K Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat II (Reference) H05K 3/00 G01R 31/28 K
Claims (3)
側端部同士が互いに非接触状態で接近して並設された第
1および第2のコンタクトプローブと、導体パターンに
接触する接触側端部同士が互いに非接触状態で接近して
並設された第3および第4のコンタクトプローブと、前
記第1および前記第4のコンタクトプローブを介して前
記導体パターンに測定用の定電流を供給した状態で前記
第2および前記第3のコンタクトプローブ間の電圧を測
定する測定部と、当該測定部の測定結果に基づいて前記
導体パターンについての電気的検査を実行する制御部と
を備えた回路基板検査装置であって、 前記測定部は、前記並設された前記両コンタクトプロー
ブ間に定電流を供給した状態で当該両コンタクトプロー
ブ間の電圧を測定し、前記制御部は、前記測定部によっ
て測定された電圧に基づいて前記両コンタクトプローブ
に対する絶縁検査を行うことを特徴とする回路基板検査
装置。1. A first and a second contact probe, wherein contact-side ends contacting a conductor pattern to be inspected are arranged side by side in close proximity to each other in a non-contact state, and contact-side ends contacting the conductor pattern. Third and fourth contact probes arranged side by side in close proximity to each other in a non-contact state, and a state in which a constant current for measurement is supplied to the conductor pattern via the first and fourth contact probes Circuit board inspection, comprising: a measurement unit that measures a voltage between the second and third contact probes; and a control unit that performs an electrical inspection on the conductor pattern based on a measurement result of the measurement unit. The device, wherein the measuring unit measures a voltage between the two contact probes in a state where a constant current is supplied between the two contact probes arranged in parallel. The circuit board inspection device which is characterized in that an insulation test on the two contact probe based on the measured voltage by the measuring unit.
として供給することを特徴とする請求項1記載の回路基
板検査装置。2. The circuit board inspection apparatus according to claim 1, wherein the measuring section supplies an AC constant current as the constant current.
ブと、前記第3および第4のコンタクトプローブとを検
査対象の導体パターン向けてそれぞれ移動させるプロー
ブ移動機構を備え、前記測定部は、前記プローブ移動機
構によって移動させられている状態の前記両コンタクト
プローブ間の電圧を測定し、前記制御部は、前記移動さ
せられている状態の前記両コンタクトプローブに対して
前記絶縁検査を行うことを特徴とする請求項1または2
記載の回路基板検査装置。3. A probe moving mechanism for moving the first and second contact probes and the third and fourth contact probes toward a conductor pattern to be inspected, respectively, wherein the measuring unit comprises: A voltage between the two contact probes being moved by a moving mechanism is measured, and the control unit performs the insulation test on the two contact probes being moved. Claim 1 or 2
A circuit board inspection apparatus as described in the above.
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JP2000233824A JP4607295B2 (en) | 2000-08-02 | 2000-08-02 | Circuit board inspection equipment |
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JP2000233824A JP4607295B2 (en) | 2000-08-02 | 2000-08-02 | Circuit board inspection equipment |
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JP2002048833A true JP2002048833A (en) | 2002-02-15 |
JP4607295B2 JP4607295B2 (en) | 2011-01-05 |
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