JP5323502B2 - Substrate inspection apparatus and substrate inspection method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To accurately carry out an inspection while reducing the inspection time. <P>SOLUTION: A measurement process is carried out such that a capacitance C1 between an inspection point Pb and an inspection point Pc is measured, while respectively bringing probes 5a-5d to be in contact with inspection points Pa-Pd specified on a conductor pattern 11 and a conductor pattern 12. Then, a measurement process is carried out such that a capacitance Ca between the probes 5b, 5c to be brought to contact with the inspection points Pb, Pc in the measurement process is measured, while mutually connecting the probes 5a, 5b and mutually connecting the probes 5c, 5d among the probes 5a-5d being out of contact with the inspection points Pa-Pd. Next, a calculation process is carried out such that an inter-inspection point capacitance between the inspection points Pb, Pc is calculated by subtracting the capacitance Ca from the capacitance C1, thereby inspecting whether a circuit board 100 is good or bad, based on the inter-inspection point capacitance and an inspection reference value. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention relates to a substrate inspection apparatus and a substrate inspection method for inspecting a substrate to be inspected based on the capacitance between inspection points and the capacitance of a mounted capacitor.

  As this type of board inspection apparatus, the applicant applies a pair of inspection probes to predetermined two of the inspection points defined on the circuit board to be inspected (hereinafter also referred to as “inspection target board”). A circuit board inspection device (hereinafter referred to as “substrate inspection device”) that measures the capacitance between both inspection points in a contact state and inspects an inspection target substrate based on the measured capacitance and a reference value for inspection. (Also referred to as JP-A-2002-14134). This board inspection apparatus includes a pair of contact-type inspection probes and a measurement unit that measures the capacitance between two inspection points using both inspection probes. When inspecting a substrate to be inspected by the substrate inspection apparatus, first, both inspection probes are brought into contact with inspection points defined on the conductor pattern. Next, the measurement unit supplies an AC signal for inspection between both inspection probes and measures the current value and current phase of the AC current for inspection flowing between both inspection probes. The capacitance between the two inspection points is measured based on the voltage value, the measured current value, the voltage phase of the supplied AC signal for inspection and the phase difference between the measured current phases. Subsequently, the quality of the conductor pattern at both inspection points is inspected based on the measured capacitance and, for example, the inspection reference value defined based on the setting data of the inspection target substrate.

  In this case, during the above measurement process in the substrate inspection apparatus disclosed by the applicant, not only the capacitance between the two inspection points on the inspection target substrate, but also the inter-probe capacitance between the two inspection probes, Capacitance including various capacitances (hereinafter also referred to as “device-side capacitance”) such as inter-cable capacitance between the signal cables connecting the inspection probes to the measurement unit, respectively. Measured. For this reason, even if a defect occurs between the two inspection points, a defect occurs between the inspection points when the apparatus-side capacitance is large or when the capacitance between the inspection points is small. Otherwise there is a risk of being inspected by mistake. Therefore, as an example, the applicant supplies an AC signal for inspection between the inspection probes in a state where the pair of inspection probes are separated from the inspection target substrate (both inspection points), and the apparatus side electrostatic The capacitance is measured and the device-side capacitance is subtracted from the capacitance measured according to the above measurement method to calculate the capacitance between the two inspection points. Based on the calculation result and the reference value for inspection The inspection method that inspects the quality between both inspection points is adopted.

JP 2002-14134 (page 3-4, FIG. 4)

  However, the substrate inspection apparatus disclosed by the applicant has the following problems to be improved. That is, these substrate inspection apparatuses employ a configuration in which a pair of inspection probes are moved to contact with an inspection point to be measured each time the capacitance between the inspection points is measured. For this reason, in these substrate inspection apparatuses, when inspecting a substrate to be inspected having a large number of inspection points, the total time required to move both inspection probes is long, so that one substrate to be inspected is inspected. It has been difficult to shorten the time required for this. On the other hand, the applicant, in order to solve the above problems when inspecting an inspection target substrate having a large number of inspection points, has a number of inspection probes in contact with each inspection point on the inspection target substrate, A substrate inspection apparatus configured to measure capacitance by switching and connecting arbitrary inspection probes sequentially to a measurement unit has been proposed.

  Specifically, as shown in FIG. 8, the circuit board inspection apparatus 1x proposed by the applicant is referred to as a plurality of inspection probes 5ax, 5bx (hereinafter referred to as “inspection probe 5x” when not distinguished from each other). ) And a connection switching unit (not shown) for switching and connecting each of the inspection probes 5x to a measurement unit (not shown). In the figure, in order to facilitate understanding of the circuit board inspection apparatus 1x proposed by the applicant, the inspection points Pax to Pdx (hereinafter referred to as the following) on the conductor patterns 11x to 13x formed on the circuit board 100x. Although only four of “inspection points Px” are illustrated when not distinguished, only four of the inspection probes 5ax to 5dx among the plurality of inspection probes 5x are illustrated. There are more inspection points Px on the circuit board 100x, and the circuit board inspection apparatus 1x includes tens to thousands of inspection probes 5x according to the number of inspection points Px. Has been.

  When the circuit board 100x is inspected by the circuit board inspection apparatus 1x, the inspection probes 5x are first brought into contact with the inspection points Px of the conductor patterns 11x, 12x,. In this state, for example, when measuring the electrostatic capacitance between the conductor patterns 11x and 12x mutually connected by the electronic component 21x (between the inspection points Pax and Pbx), the connection switching unit detects the inspection probes 5ax and 5bx. Is connected to the measurement unit, and the other inspection probes 5cx and 5dx are separated from the measurement unit. Next, the capacitance C1x between the inspection points Pax and Pbx is measured in a state in which the measurement unit supplies the inspection AC signal between the inspection probes 5ax and 5bx. For example, when measuring the capacitance between the conductor patterns 12x and 13x connected to each other by the electronic component 22x (between the inspection points Pcx and Pdx), the connection switching unit measures the inspection probes 5cx and 5dx. The other inspection probes 5ax and 5bx are disconnected from the measurement unit. Next, the capacitance C2x between the inspection points Pcx and Pdx is measured in a state in which the measurement unit supplies the inspection AC signal between the inspection probes 5cx and 5dx.

  In this case, the capacitance C1x measured by the above method includes not only the capacitance between the inspection points Pax and Pbx on the circuit board 100x, but also the aforementioned device-side capacitance. Similarly, the capacitance C2x measured by the above method includes not only the capacitance between the inspection points Pcx and Pdx on the circuit board 100x but also the device-side capacitance. Therefore, in the state where each inspection probe 5x is separated from the circuit board 100x (each inspection point Px), the electrostatic capacitance Cax between the inspection probes 5ax and 5bx and the electrostatic capacitance between the inspection probes 5cx and 5dx. The capacitance Cbx is measured, and a value obtained by subtracting the capacitance Cax from the capacitance C1x is acquired as an original capacitance between the inspection points Pax and Pbx, and the capacitance Cbx is obtained from the capacitance C2x. A value obtained by subtracting the capacitance Cbx is acquired as the original capacitance between the inspection points Pcx and Pdx. After that, based on the acquired capacitance and the reference value for inspection, it is inspected whether the electronic components 21x and 22x have a connection failure (such as terminal floating) or a product difference.

  However, the above inspection method using the circuit board inspection apparatus 1x may still cause an erroneous inspection result. Specifically, the capacitance C1x measured during the above-described inspection processing is not only the capacitance Cax between the inspection probes 5ax and 5bx, but actually, for example, a conductor with respect to the inspection probe 5bx. The value includes the capacitance Ccx between the inspection probe 5cx and the inspection probe 5ax connected via the pattern 12x. Similarly, the capacitance C2x is not only connected to the capacitance Cbx between the inspection probes 5cx and 5dx, but is actually connected to the inspection probe 5cx via the conductor pattern 12x, for example. The value includes the capacitance Cdx between the inspection probe 5bx and the inspection probe 5dx.

  In this case, the signal cable for connecting each inspection probe 5x and the measurement unit to each other is long, and this signal cable is provided between the inspection probe 5x and the measurement unit in order to avoid catching during the inspection process. They are in a bundled state. Therefore, due to the above-described electrostatic capacitances Ccx and Cdx being relatively large values, the electrostatic capacitance Cax was subtracted from the electrostatic capacitance C1x, or the electrostatic capacitance Cbx was subtracted from the electrostatic capacitance C2x. It is difficult to obtain an accurate capacitance that eliminates the influence of the device-side capacitance. For this reason, in the circuit board inspection apparatus 1x described above, there is a possibility of erroneously inspecting whether or not the electronic components 21x, 22x and the like are defective in connection or different, and it is preferable to improve this point.

  The present invention has been made in view of the problems to be improved, and has as its main object to provide a substrate inspection apparatus and a substrate inspection method capable of accurately inspecting a substrate to be inspected while shortening the inspection time. To do.

In order to achieve the above object, a substrate inspection apparatus according to claim 1, wherein a plurality of inspection probes respectively attached to a probe attachment portion corresponding to positions of a plurality of inspection points defined on a substrate to be inspected, a measuring unit for measuring the capacitance between the respective inspection point with the respective inspection probe, a connection switching unit that switches the connection to said measuring portion of the inspection probe, said measuring unit and the connection switching section And a control unit that inspects the inspection target substrate based on the capacitance measured by the measurement unit, wherein the control unit is configured to control the first in the inspection target substrate. Each inspection probe is brought into contact with the plurality of inspection points defined on the conductor pattern, and on the second conductor pattern on the inspection target substrate. In a state where the inspection probes are in contact with the plurality of inspection points that are determined, the measurement unit is controlled, and the first inspection point of the inspection points on the first conductor pattern is controlled. And a first measurement process for measuring a first capacitance between second inspection points of the respective inspection points on the second conductor pattern, and controlling the connection switching unit, The inspection probes which are brought into contact with the inspection points on the first conductor pattern among the inspection probes in a non-contact state with respect to the inspection points are connected to each other and the second In the state where the inspection probes that are brought into contact with the inspection points on the conductor pattern are connected to each other, the measurement unit is controlled to perform the first measurement process. A second measurement process for measuring a second capacitance between the inspection probe brought into contact with the first inspection point and the inspection probe brought into contact with the second inspection point; And calculating the inter-inspection point capacity between the first inspection point and the second inspection point by subtracting the second electrostatic capacity from the electrostatic capacity between the inspection points. The quality of the substrate to be inspected is inspected based on the capacity and the reference value for inspection.

  The substrate inspection apparatus according to claim 2 is the substrate inspection apparatus according to claim 1, wherein the control unit is configured to detect the first conductor pattern and the second conductor pattern during the second measurement process. Each inspection probe brought into contact with each inspection point on any conductor pattern is connected to any one of the conductor patterns via an electronic component having a lower impedance than a predetermined specified value. The second capacitance is measured in a state where the inspection probes that are brought into contact with the inspection points on the three conductor patterns are connected to each other.

  Furthermore, the substrate inspection apparatus according to claim 3 is the substrate inspection apparatus according to claim 1 or 2, wherein the control unit is connected to a guard potential during the first measurement process during the second measurement process. The second capacitance is measured in a state where the inspection probe is connected to the guard potential.

The substrate inspection method according to claim 4, wherein the said respective test point with a plurality of test probes mounted respectively on the probe mounting portion corresponding to the positions of the plurality of test points specified in the inspection target substrate A substrate inspection method for measuring a capacitance between the plurality of the first conductive patterns on the substrate to be inspected, and inspecting the substrate to be inspected based on the capacitance. Each of the inspection probes is brought into contact with an inspection point, and each of the inspection probes is in contact with a plurality of the inspection points defined on the second conductor pattern on the inspection target substrate. The first inspection point among the respective inspection points on the conductor pattern and the inspection point among the respective inspection points on the second conductor pattern A first measurement process for measuring a first capacitance between two inspection points; and on the first conductor pattern of the inspection probes in a non-contact state with respect to the inspection points. In the state where the inspection probes to be brought into contact with the inspection points are connected to each other and the inspection probes to be brought into contact with the inspection points on the second conductor pattern are connected to each other Measuring a second capacitance between the inspection probe brought into contact with the first inspection point and the inspection probe brought into contact with the second inspection point during the first measurement process; A measurement process and a capacitance between inspection points between the first inspection point and the second inspection point are calculated by subtracting the second capacitance from the first capacitance. Run the arithmetic processing, to check the quality of the inspection target board based on between the test point capacity and test reference value.

  In the substrate inspection apparatus according to claim 1 and the substrate inspection method according to claim 4, each inspection probe is provided at each inspection point on the first conductor pattern and each inspection point on the second conductor pattern on the inspection target substrate. The first inspection point between the first inspection point of each inspection point on the first conductor pattern and the second inspection point of each inspection point on the second conductor pattern in the contact state, respectively. First inspection processing for measuring capacitance, and each inspection probe to be brought into contact with each inspection point on the first conductor pattern among the inspection probes in a non-contact state with respect to each inspection point In a state where the inspection probes that are connected to each other and are brought into contact with the respective inspection points on the second conductor pattern are connected to each other, A second measurement process for measuring a second capacitance between the inspection probe brought into contact with the second inspection point and the inspection probe brought into contact with the second inspection point; Substrate to be inspected based on the inter-inspection point capacitance and the inspection reference value by performing a calculation process for calculating the inter-inspection point capacitance between the first inspection point and the second inspection point by subtracting the capacitance. Inspect the quality.

  Therefore, according to the board inspection apparatus according to claim 1 and the board inspection method according to claim 4, the first conductor pattern is not used during the inspection between the first conductor pattern and the second conductor pattern. The inspection probe connected to the same potential as the first inspection point, and the second inspection point via the second conductor pattern that is not used during the inspection between the first conductor pattern and the second conductor pattern. The accurate second capacitance including the device-side capacitance caused by the presence of the inspection probe connected to the same potential can be acquired by the second measurement process. Therefore, according to the substrate inspection apparatus according to claim 1 and the substrate inspection method according to claim 4, the first measurement is performed in a state where a plurality of inspection probes are in contact with each inspection point on the inspection target substrate. The first conductor is obtained by subtracting the second capacitance from the first capacitance measured by the first measurement process during the calculation process while shortening the inspection time by executing the process. As a result of obtaining an accurate inter-inspection point capacitance between the pattern and the second conductor pattern (between the first inspection point and the second inspection point), the accurate inter-inspection point capacitance and the inspection reference Based on the value, it is possible to accurately inspect between the first conductor pattern and the second conductor pattern (between the first inspection point and the second inspection point).

  Moreover, according to the board | substrate inspection apparatus of Claim 2, at the time of a 2nd measurement process, each contact | abutted with respect to each test | inspection point on any conductor pattern of a 1st conductor pattern and a 2nd conductor pattern An inspection probe and each inspection probe to be brought into contact with each inspection point on the third conductor pattern connected to one of the conductor patterns via an electronic component having a lower impedance than a predetermined specified value; The third conductor pattern connected to either the first conductor pattern or the second conductor pattern via the low-impedance electronic component by measuring the second capacitance in the state of being connected to each other An accurate second capacitance including the device-side capacitance caused by the presence of the inspection probe brought into contact with each inspection point above is obtained by the second measurement process. It can be. For this reason, according to the substrate inspection apparatus of the second aspect, the first capacitance is subtracted from the first capacitance measured by the first measurement process at the time of the calculation process, so that the first As a result of obtaining an accurate inter-inspection point capacitance between the conductor pattern and the second conductive pattern (between the first inspection point and the second inspection point), the accurate inter-inspection point capacitance and the inspection It is possible to accurately inspect between the first conductor pattern and the second conductor pattern (between the first inspection point and the second inspection point) based on the reference value.

  Furthermore, according to the substrate inspection apparatus of the third aspect, in the second measurement process, the second electrostatic test is performed in a state where the inspection probe connected to the guard potential is connected to the guard potential during the first measurement process. By measuring the capacitance, an accurate second capacitance including the device-side capacitance caused by the presence of the inspection probe connected to the guard potential during the first measurement processing is obtained in the second measurement processing. Can be obtained by: For this reason, according to the substrate inspection apparatus of the third aspect, the first capacitance is subtracted from the first capacitance measured by the first measurement process at the time of the calculation process, so that the first As a result of obtaining an accurate inter-inspection point capacitance between the conductor pattern and the second conductive pattern (between the first inspection point and the second inspection point), the accurate inter-inspection point capacitance and the inspection It is possible to accurately inspect between the first conductor pattern and the second conductor pattern (between the first inspection point and the second inspection point) based on the reference value.

1 is a block diagram showing a configuration of a circuit board inspection device 1. FIG. It is explanatory drawing of the state which is measuring the electrostatic capacitance C1 between test | inspection points Pb and Pc using the test probes 5b and 5c. In a state where the inspection probes 5a and 5b are connected to each other by the connection switching unit 6 and the inspection probes 5c and 5d are connected to each other, the electrostatic capacitance between the inspection probes 5a and 5b and the inspection probes 5c and 5d It is explanatory drawing which shows the state which is measuring capacity | capacitance Ca. It is explanatory drawing of the state which is measuring the electrostatic capacitance C2 between test | inspection points Pb and Pc using the test probes 5b and 5c. In the state where the inspection probes 5a and 5b are connected to each other by the connection switching unit 6 and the inspection probes 5c to 5f are connected to each other, the electrostatic capacitance between the inspection probes 5a and 5b and the inspection probes 5c to 5f It is explanatory drawing which shows the state which is measuring capacity | capacitance Cb. It is explanatory drawing of the state which is measuring the electrostatic capacitance C3 between test | inspection points Pb and Pc using the probes 5b and 5c for test | inspection. When the inspection probes 5a and 5b are connected to each other by the connection switching unit 6, they are connected to the H potential of the measurement unit 7, and when the inspection probes 5c and 5d are connected to each other, they are connected to the L potential of the measurement unit 7. In addition, in the state where the inspection probes 5e and 5f are connected to each other, they are connected to the G potential of the measurement unit 7, and in this state, the capacitance Cc1 between the inspection probes 5a and 5b and the inspection probes 5c and 5d FIG. 6 is an explanatory diagram showing a state in which a capacitance Cc, which is a combined capacitance including the capacitance Cc2 between the inspection probes 5a and 5b and the inspection probes 5e and 5f, is measured. It is explanatory drawing which shows the state which contacted each test | inspection probe 5x of the circuit board test | inspection apparatus 1x which the applicant has proposed with test | inspection points Pax-Pdx on the conductor patterns 11x, 12x, and 13x, respectively.

  Embodiments of a substrate inspection apparatus and a substrate inspection method according to the present invention will be described below with reference to the accompanying drawings.

  First, the configuration of the circuit board inspection apparatus 1 will be described with reference to FIG.

  A circuit board inspection apparatus 1 shown in FIG. 1 is an example of a board inspection apparatus according to the present invention. As described later, according to the substrate inspection method according to the present invention, a circuit board 100 (an example of a substrate to be inspected in the present invention). ) Is configured to be electrically inspectable. Specifically, the circuit board inspection apparatus 1 includes a substrate holding part 2, a moving mechanism 3, a probe mounting part 4, inspection probes 5a to 5n (an example of a plurality of inspection probes in the present invention: Also referred to as “inspection probe 5”), a connection switching unit 6, a measurement unit 7, a control unit 8, and a storage unit 9. In this case, as shown in FIGS. 2 to 7, the circuit board 100 is formed with a plurality of conductor patterns such as conductor patterns 11 to 18 (hereinafter also referred to as “conductor pattern 10” when not distinguished), and an electronic component. Various electronic components such as 21 to 24 are mounted and configured.

  The board holding unit 2 is configured to hold the circuit board 100 to be inspected at the inspection position. The moving mechanism 3 moves each probe mounting part 4 to or from the circuit board 100 by moving the probe mounting part 4 under the control of the control part 8. In this case, the probe mounting portion 4 is configured in a jig shape, and a plurality of inspection probes 5a to 5n are implanted therein. Each inspection probe 5 is a contact type probe, and each inspection point Pa, Pb... (Hereinafter referred to as “inspection point P” when not distinguished from each other) defined on the circuit board 100 (each conductor pattern 10). Corresponding to the positions of the probe mounting portions 4. Thereby, in this circuit board inspection apparatus 1, each inspection probe 5 contacts each inspection point P on the circuit board 100 by the moving mechanism 3 moving the probe mounting portion 4 in the approaching direction with respect to the circuit board 100. As a result, when the single circuit board 100 is inspected, the electrical inspection for each inspection point P can be executed only by moving the probe mounting portion 4 once. The connection switching unit 6 switches the connection of the inspection probes 5 to the measurement unit 7 and the connection between the inspection probes 5 according to the control of the control unit 8.

  The measurement unit 7 includes an AC signal source (voltage source: as an example, a constant voltage source that supplies a constant voltage) that supplies an AC signal for inspection having a voltage value defined in advance between the inspection probes 5, a predetermined voltage A current measuring device that measures a current value and a current phase of an alternating current flowing between the inspection probes 5 and a calculation unit that calculates a capacitance based on a measurement result and the like are provided. In this case, the calculation unit calculates the capacitance based on the voltage value of the AC signal for inspection, the measured current value, and the voltage phase of the AC signal for inspection and the phase difference between the measured current phases. The control unit 8 comprehensively controls the circuit board inspection apparatus 1. Specifically, the control unit 8 controls the moving mechanism 3 to move the probe mounting unit 4 so that each inspection probe 5 is brought into contact with or separated from each inspection point P. The control unit 8 controls the connection switching unit 6 to switch the connection of the inspection probes 5 to the measurement unit 7 and the connection between the inspection probes 5. Further, the control unit 8 calculates the capacitance between the inspection points P (capacity between inspection points) based on the measured value such as the capacitance measured by the measuring unit 7 as described later. The processing is executed and the quality of the circuit board 100 is inspected based on the calculation result and the inspection reference data (inspection reference value in the present invention). The storage unit 9 stores inspection procedure data, inspection reference data defined based on design data of the circuit board 100, calculation results of the control unit 8, operation programs of the control unit 8, and the like.

  Next, a method for inspecting the circuit board 100 by the circuit board inspection apparatus 1 will be described with reference to the drawings.

  First, the circuit board 100 is held by the board holding part 2 in a state where the formation surface of each conductor pattern 10 is directed upward. Next, when an operation start is instructed by operating an operation unit (not shown), the control unit 8 starts an inspection process for the circuit board 100 according to the inspection procedure data stored in the storage unit 9. In order to facilitate understanding of the present invention, inspection between the inspection point Pb on the conductor pattern 11 and the inspection point Pc on the conductor pattern 12 in the circuit board 100 (see FIGS. 2 and 3), circuit board 100 between the inspection point Pb on the conductor pattern 13 and the inspection point Pc on the conductor pattern 14 (see FIGS. 4 and 5), and on the inspection point Pb and the conductor pattern 17 on the conductor pattern 16 in the circuit board 100. Three cases of inspection with respect to the inspection point Pc (see FIGS. 6 and 7) will be described below as an example. In practice, the first measurement process in the present invention is continuously performed between all the inspection points P on the circuit board 100, and the second process corresponding to each first measurement process is continuously performed. The capacity between inspection points for each inspection point P and P is calculated by executing the arithmetic processing in the present invention after that. In order to facilitate understanding of the present invention, the above 3 In the following description, the first measurement process, the second measurement process, and the calculation process are executed in this order for each case.

  First, as shown in FIG. 2, in the inspection between the inspection point Pb on the conductor pattern 11 and the inspection point Pc on the conductor pattern 12, the connection switching unit 6 controls the inspection probe 5 b under the control of the control unit 8. , 5c are connected to the measuring unit 7, and the measuring unit 7 supplies an AC signal for inspection via the inspection probes 5b, 5c to provide a capacitance C1 between the inspection points Pb, Pc (the first in the present invention). 1 (an example of the capacitance of 1) is measured (an example of the first measurement process in the present invention). At this time, the inspection probe 5a is connected to the same potential as the inspection probe 5b and the inspection probe 5d in accordance with the connection state (see FIG. 3) of each inspection probe 5 at the time of the second measurement process described later. The capacitance C1 between the inspection points Pb and Pc may be measured in a state where is connected to the same potential as the inspection probe 5c.

  In this case, in the circuit board inspection apparatus 1, as described above, all inspection probes 5 are brought into contact with the inspection points P on the respective conductor patterns 10 when the circuit board 100 is inspected. For this reason, as shown in the figure, the inspection point Pa on the conductor pattern 11 in contact with the inspection probe 5b is brought into contact with the inspection probe 5a that is not used during the inspection between the inspection points Pb and Pc. The inspection point Pd on the conductor pattern 12 with which the inspection probe 5c is brought into contact is brought into contact with an inspection probe 5d that is not used during the inspection between the inspection points Pb and Pc. In the figure, both of the conductor patterns 11 and 12 correspond to the first conductor pattern, and both of the conductor patterns 11 and 12 correspond to the second conductor pattern. On the other hand, an example is shown in which the first measurement process in the present invention is executed in a state where two inspection probes 5 are in contact with each other.

  At this time, the device-side capacitance included in the capacitance C1 measured during the measurement process described above is the inter-probe capacitance between the inspection probes 5b and 5c connected to the measurement unit 7, Capacitance Ca including inter-cable capacitance between the signal cables connecting the inspection probes 5b and 5c to the measurement unit 7 and various other capacitances. Therefore, like the circuit board inspection apparatus 1x proposed by the applicant, the inter-probe capacitance between the capacitance C1 and the inspection probes 5b and 5c, and the inspection probes 5b and 5c and the measurement unit Even if only the inter-cable capacity between the signal cables connected to 7 is subtracted, it is difficult to obtain an accurate inter-inspection point capacity between the inspection points Pb and Pc. Therefore, the circuit board inspection apparatus 1 executes the second measurement process according to the present invention, and acquires the capacitance Ca as the device-side capacitance to be subtracted from the capacitance C1 according to the following method. .

  First, as shown in FIG. 3, the control unit 8 controls the moving mechanism 3 to separate the inspection probes 5 from the circuit board 100 (in this example, inspection points Pa to Pd on the conductor patterns 11 and 12). (Make contactless state) Next, the control unit 8 controls the connection switching unit 6 so that the two inspection probes 5a and 5b brought into contact with the inspection points Pa and Pb on the conductor pattern 11 when the capacitance C1 is measured are mutually connected. And two inspection probes 5c and 5d brought into contact with the inspection points Pc and Pd on the conductor pattern 12 are connected to each other. At this time, the connection part 6a in the connection switching part 6 functions in the same manner as the conductor pattern 11 in the first measurement process, and the connection part 6b in the connection switching part 6 is the first measurement. It functions in the same manner as the conductor pattern 12 at the time of processing, and the inspection probes 5a and 5b and the inspection probes 5c and 5d are connected to the measuring unit 7, respectively.

  Subsequently, the control unit 8 controls the measurement unit 7 so that the capacitance Ca between the inspection probes 5a and 5b and the inspection probes 5c and 5d (an example of the second capacitance in the present invention: (Capacitor on the device side) is measured (an example of a second measurement process in the present invention). At this time, the inter-probe capacitance between the inspection probes 5b and 5c, and the interprobe capacitance between the inspection probe 5a and the inspection probe 5c connected to the inspection probe 5b via the connection portion 6a. Capacitance, inter-probe capacitance between the inspection probe 5d and the inspection probe 5b connected to the inspection probe 5c via the connection portion 6b, and connection to the inspection probe 5b via the connection portion 6a The inter-probe capacitance between the inspection probe 5a and the inspection probe 5d connected to the inspection probe 5c through the connection portion 6b, and the inspection probe 5 and the measurement unit 7 are The electrostatic capacitance including the inter-cable capacitance between the connected signal cables is measured as the electrostatic capacitance Ca.

  In addition, although the example which performs the 2nd process in this invention after the 1st measurement process in this invention was demonstrated, this invention is not limited to this, The 2nd measurement process (above-mentioned electrostatic in the present invention) You may perform the 1st process (measurement of said electrostatic capacitance C1) in this invention after the measurement of the capacity | capacitance Ca. Then, the control part 8 starts the arithmetic processing in this invention. Specifically, the control unit 8 obtains a value obtained by subtracting the capacitance Ca measured by the second measurement process from the capacitance C1 measured by the first measurement process between the inspection points Pb and Pc. Calculated as the capacity between inspection points. Thus, an accurate inter-inspection point capacitance that does not include the device-side capacitance (capacitance between inspection points from which the influence of the device-side capacitance is eliminated) is acquired.

  Next, the control unit 8 inspects the quality between the inspection points Pb and Pc based on the calculated inter-inspection point capacity and the inspection reference data stored in the storage unit 9. Specifically, when the capacity between the inspection points is within the allowable range corresponding to the inspection reference data, the inspection points Pb and Pc are inspected to be normal (the electronic component 21 has no connection failure or product difference). When the capacity between the inspection points is larger than the allowable range corresponding to the inspection reference data, there is an abnormality between the inspection points Pb and Pc (the electronic component 21 has a different product or the conductor patterns 11 and 12). If the capacitance between inspection points is smaller than the allowable range corresponding to the inspection reference data, the inspection point Pb, Inspection between Pc is abnormal (there is a difference in the electronic component 21 or there is a possibility that one of the conductor patterns 11 and 12 is broken) Amount when substantially zero, examining the short between the conductive patterns 11 and 12 has occurred. Thus, the inspection regarding the quality between the inspection points Pb and Pc on the conductor patterns 11 and 12 is completed.

  On the other hand, as shown in FIG. 4, in the inspection between the inspection point Pb on the conductor pattern 13 and the inspection point Pc on the conductor pattern 14, the connection switching unit 6 controls the inspection probe 5 b under the control of the control unit 8. , 5c are connected to the measuring unit 7, and the measuring unit 7 supplies an inspection AC signal via the inspection probes 5b, 5c to thereby detect the electrostatic capacitance C2 between the inspection points Pb, Pc (the first in the present invention). 1 is measured (another example of the first measurement process in the present invention). At this time, the inspection probe 5a is connected to the same potential as the inspection probe 5b and the inspection probe 5d in accordance with the connection state (see FIG. 5) of each inspection probe 5 at the time of the second measurement process described later. The capacitance C2 between the inspection points Pb and Pc may be measured in a state where ˜5f is connected to the same potential as the inspection probe 5c.

  4 and 5, in order to facilitate understanding of the following description, six inspection probes 5 to be used are illustrated as inspection probes 5 a to 5 f and 6 on the conductor patterns 13 to 15. Although two inspection points P are illustrated as inspection points Pa to Pf, actually, the inspection probes 5a to 5d shown in both drawings are between the inspection points Pb and Pc on the conductor patterns 11 and 12 described above. The inspection probe 5 is different from the inspection probes 5a to 5d used for the inspection, and the inspection points Pa to Pd shown in both figures are the inspection points Pa to Pd on the conductor patterns 11 and 12, respectively. Are different inspection points P. In this case, the conductor pattern 14 is connected to the conductor pattern 15 (“third conductor” in the present invention) via an electronic component 23 having an impedance lower than a specified value (as an example, an electronic component having an absolute value of impedance of 100Ω or less). An example of “pattern” is connected. In the circuit board inspection apparatus 1, as described above, all the inspection probes 5 are brought into contact with the inspection points P on the conductor patterns 10 when the circuit board 100 is inspected.

  For this reason, as shown in the figure, the inspection point Pa on the conductor pattern 13 in contact with the inspection probe 5b is brought into contact with the inspection probe 5a that is not used at the time of inspection between the inspection points Pb and Pc. The inspection point Pd on the conductor pattern 14 with which the inspection probe 5c is brought into contact is brought into contact with the inspection probe 5d that is not used at the time of inspection between the inspection points Pb and Pc, and further via the low-impedance electronic component 23. The inspection points Pe and Pf of the conductor pattern 15 connected to the conductor pattern 14 (an example of a conductor pattern having substantially the same potential as the conductor pattern 14 at the time of inspection due to the low impedance of the electronic component 23) Inspection probes 5e and 5f that are not used at the time of inspection between the points Pb and Pc are brought into contact with each other.In this case, in the figure, both of the conductor patterns 13 and 14 correspond to the first conductor pattern, and both of the conductor patterns 13 and 14 correspond to the second conductor pattern, respectively. FIG. 2 shows an example in which the first measurement process according to the present invention is executed in a state where two inspection probes 5 are brought into contact with each other and two inspection probes 5 are brought into contact with the conductor pattern 15. Show.

  At this time, the device-side capacitance included in the capacitance C2 measured at the time of the above measurement processing is the inter-probe capacitance between the inspection probes 5b and 5c connected to the measurement unit 7, The capacitance Cb includes the inter-cable capacitance between the signal cables connecting the inspection probes 5b and 5c to the measuring unit 7, and other various capacitances. Therefore, as in the circuit board inspection apparatus 1x proposed by the applicant, the inter-probe capacitance between the capacitance C2 and the inspection probes 5b and 5c, and the inspection probes 5b and 5c and the measurement unit Even if only the inter-cable capacity between the signal cables connected to 7 is subtracted, it is difficult to obtain an accurate inter-inspection point capacity between the inspection points Pb and Pc. Therefore, the circuit board inspection apparatus 1 executes the second measurement process according to the present invention, and acquires the capacitance Cb as the device-side capacitance to be subtracted from the capacitance C2 according to the following method. .

  First, as shown in FIG. 5, the control unit 8 controls the moving mechanism 3 to separate the inspection probes 5 from the circuit board 100 (in this example, inspection points Pa to Pf on the conductor patterns 13 to 15). (Make contactless state) Next, the control unit 8 controls the connection switching unit 6 so that the two inspection probes 5a and 5b brought into contact with the inspection points Pa and Pb on the conductor pattern 13 in the measurement of the capacitance C2 are mutually connected. And four inspection probes 5c to 5f brought into contact with the inspection points Pc to Pf on the conductor patterns 14 and 15 are connected to each other. At this time, the connection portion 6a in the connection switching portion 6 functions in the same manner as the conductor pattern 13 in the first measurement processing, and the connection portion 6b in the connection switching portion 6 is in the first measurement processing. The connection portion 6c in the connection switching unit 6 functions as a low impedance component in the same manner as the electronic component 23 in the first measurement process, and the connection switching unit 6 The internal connection portion 6d functions in the same manner as the conductor pattern 15 in the first measurement process, and the inspection probes 5a and 5b and the inspection probes 5c to 5f are connected to the measurement portion 7, respectively. .

  Subsequently, the control unit 8 controls the measurement unit 7 so that the capacitance Cb between the inspection probes 5a and 5b and the inspection probes 5c to 5f (the other capacitance of the second capacitance in the present invention). One example: device side capacitance) is measured (another example of the second measurement process in the present invention). At this time, the inter-probe capacitance between the inspection probes 5b and 5c, and the interprobe capacitance between the inspection probe 5a and the inspection probe 5c connected to the inspection probe 5b via the connection portion 6a. Capacitance, inter-probe capacitance between the inspection probe 5d and the inspection probe 5b connected to the inspection probe 5c via the connection portion 6b, and connection to the inspection probe 5b via the connection portion 6a The inter-probe capacitance between the inspection probe 5a and the inspection probe 5d connected to the inspection probe 5c via the connection portion 6b, via the inspection probe 5b and the connection portions 6b and 6c The inter-probe capacitance between the inspection probe 5e connected to the inspection probe 5c, connected to the inspection probe 5c via the inspection probe 5b and the connection portions 6b to 6d. The inter-probe capacitance between the inspection probe 5f and the inspection probe 5a connected to the inspection probe 5b via the connection portion 6a and connected to the inspection probe 5c via the connection portions 6b and 6c. The inter-probe capacitance between the inspection probe 5e and the inspection probe 5a connected to the inspection probe 5b via the connection portion 6a and connected to the inspection probe 5c via the connection portions 6b to 6d Capacitance including inter-probe capacitance between the inspection probe 5f and the inter-cable capacitance between signal cables connecting the inspection probe 5 and the measuring unit 7 Is measured as the capacitance Cb.

  Then, the control part 8 starts the arithmetic processing in this invention. Specifically, the control unit 8 obtains a value obtained by subtracting the capacitance Cb measured by the second measurement process from the capacitance C2 measured by the first measurement process between the inspection points Pb and Pc. Calculated as the capacity between inspection points. Thus, an accurate inter-inspection point capacitance that does not include the device-side capacitance (capacitance between inspection points from which the influence of the device-side capacitance is eliminated) is acquired. Next, the control unit 8 inspects the quality between the inspection points Pb and Pc based on the calculated inter-inspection point capacity and the inspection reference data stored in the storage unit 9. Thus, the inspection regarding the quality between the inspection points Pb and Pc on the conductor patterns 13 and 14 is completed.

  On the other hand, for example, when there is a conductor pattern that should be insulated from the conductor pattern in the vicinity of the conductor pattern to be inspected, or connected to the conductor pattern to be inspected via a high impedance electronic component. When there is a conductor pattern, the inspection accuracy can be improved by measuring the capacitance between inspection points in a state where the above-described conductor pattern other than the conductor pattern to be inspected is connected to the guard potential. Specifically, as an example, as shown in FIG. 6, when inspecting between the inspection point Pb on the conductor pattern 16 and the inspection point Pc on the conductor pattern 17, the conductor is located very close to the conductor pattern 17. When there is a conductor pattern 18 to be insulated from the pattern 17, an inspection probe (in the figure, inspection points Pe and Pf) in contact with inspection points (in the figure, inspection points Pe and Pf). In the example, the inspection probes 5e and 5f) are connected to a guard potential (G potential).

  More specifically, the control unit 8 controls the connection switching unit 6 to connect the inspection probe 5b to the H potential in the measurement unit 7 and, for example, connect the inspection probe 5c to the L potential in the measurement unit 7. And the inspection probe 5e is connected to the G potential in the measurement unit 7. Note that the inspection probe 5e can be connected to the ground potential instead of the G potential. In this case, the measurement unit 7 includes a constant voltage source as an AC signal source for supplying an AC signal for inspection (supplying a constant voltage as an AC signal for inspection). Are connected to have the same potential as the L potential. On the other hand, when the measurement unit 7 adopts a configuration having a constant current source as an AC signal source that supplies an AC signal for inspection (configuration that supplies a constant current as an AC signal for inspection), the G potential is The connection is made to be the same potential as the H potential. Next, the control unit 8 controls the measurement unit 7 to supply the inspection AC signal via the inspection probes 5b and 5c, and at the same time, the capacitance C3 between the inspection points Pb and Pc (first in the present invention). (Another example of the electrostatic capacity) is measured (a further example of the first measurement process in the present invention). At this time, as an example, the measuring unit 7 applies a constant voltage between the inspection points Pb and Pc, and measures the current value of the current flowing between the inspection probes 5b and 5c at that time to measure the capacitance. C3 is calculated.

  At this time, the inspection probe 5a is connected to the same potential as the inspection probe 5b in accordance with the connection state (see FIG. 7) of each inspection probe 5 at the time of the second measurement process to be described later. May be connected to the same potential as the inspection probe 5c, and the capacitance C3 between the inspection points Pb and Pc may be measured in a state where the inspection probe 5f is connected to the same potential as the inspection probe 5e. 6 and 7, in order to facilitate understanding of the following description, the six inspection probes 5 to be used are illustrated as inspection probes 5a to 5f and 6 on the conductor patterns 16 to 18. Although two inspection points P are illustrated as inspection points Pa to Pf, actually, the inspection probes 5a to 5d shown in both drawings are between the inspection points Pb and Pc on the conductor patterns 11 and 12 described above. The inspection probe 5 is different from the inspection probes 5a to 5d used at the time of inspection or inspection between the inspection points Pb and Pc on the conductor patterns 13 and 14, and the inspection point Pa shown in both figures. ~ Pd are inspection points P different from the inspection points Pa to Pd on the conductor patterns 11 and 12 and the inspection points Pa to Pf on the conductor patterns 13 to 15. There.

  At this time, in the circuit board inspection apparatus 1, as described above, all the inspection probes 5 are brought into contact with the inspection points P on the respective conductor patterns 10 when the circuit board 100 is inspected. For this reason, as shown in FIG. 6, the inspection probe 5a that is not used at the time of inspection between the inspection points Pb and Pc is brought into contact with the inspection point Pa on the conductor pattern 16 in contact with the inspection probe 5b. The inspection point Pd on the conductor pattern 17 in contact with the inspection probe 5c is brought into contact with the inspection probe 5d that is not used at the time of inspection between the inspection points Pb and Pc. The inspection probe 5f is brought into contact with the inspection point Pf on the conductor pattern 18 with which the inspection probe 5e to be connected is in contact. In this case, in the figure, both of the conductor patterns 16 and 17 correspond to the first conductor pattern, and both of the conductor patterns 16 and 17 correspond to the second conductor pattern. Two inspection probes 5 are brought into contact with each other, and two inspection probes 5 connected to the G potential are brought into contact with a conductor pattern 18 corresponding to the fourth conductor pattern in the present invention. The example which the 1st measurement process in this invention is performed in a state is shown in figure.

  At this time, the device-side capacitance included in the capacitance C3 measured during the measurement process is the inter-probe capacitance between the inspection probes 5b and 5c connected to the measurement unit 7, Capacitance Cc including inter-cable capacitance between the signal cables connecting the inspection probes 5b and 5c to the measurement unit 7, and other capacitances Cc1 and Cc2 and the like. Therefore, like the circuit board inspection apparatus 1x proposed by the applicant, the inter-probe capacitance between the capacitance C3 and the inspection probes 5b and 5c, and the inspection probes 5b and 5c and the measurement unit Even if only the inter-cable capacity between the signal cables connected to 7 is subtracted, it is difficult to obtain an accurate inter-inspection point capacity between the inspection points Pb and Pc. Therefore, the circuit board inspection apparatus 1 executes the second measurement process according to the present invention, and acquires the capacitance Cc as the device-side capacitance to be subtracted from the capacitance C3 according to the following method. .

  First, as shown in FIG. 7, the control unit 8 controls the moving mechanism 3 to separate the inspection probes 5 from the circuit board 100 (in this example, inspection points Pa to Pf on the conductor patterns 16 to 18). Let Next, the control unit 8 controls the connection switching unit 6 so that the two inspection probes 5a and 5b brought into contact with the inspection points Pa and Pb on the conductor pattern 16 in the measurement of the capacitance C3 are mutually connected. And two inspection probes 5c and 5d that are in contact with the inspection points Pc and Pd on the conductor pattern 17 are connected to each other and are in contact with the inspection points Pe and Pf on the conductor pattern 18. Two inspection probes 5e and 5f are connected to each other.

  At this time, the connection portion 6a in the connection switching portion 6 functions in the same manner as the conductor pattern 16 in the first measurement processing, and the connection portion 6b in the connection switching portion 6 is in the first measurement processing. The connecting portion 6d in the connection switching portion 6 functions in the same manner as the conductor pattern 18 in the first measurement process, and the inspection probes 5a, 5b, inspection The probes 5c and 5d for inspection and the probes 5e and 5f for inspection are connected to the measuring unit 7, respectively. Further, the measuring unit 7 connects the inspection probes 5a and 5b to the H potential, connects the inspection probes 5c and 5d to the L potential, and connects the inspection probes 5e and 5f to the G potential in accordance with the control of the measurement unit 7. Connect to potential. As a result, the inspection probes 5c and 5d connected to the L potential and the inspection probes 5e and 5f connected to the G potential have the same potential.

  Subsequently, the control unit 8 controls the measurement unit 7 so that the capacitance Cc1 between the inspection probes 5a and 5b and the inspection probes 5c and 5d, and the inspection probes 5a and 5b and the inspection probe 5e. , 5f, and capacitance Cc (another example of the second capacitance in the present invention: device-side capacitance), which is a combined capacitance with the capacitance Cc2 (the present invention). Still another example of the second measurement process in FIG. At this time, the inter-probe capacitance between the inspection probes 5b and 5c, and the interprobe capacitance between the inspection probe 5a and the inspection probe 5c connected to the inspection probe 5b via the connection portion 6a. Capacitance, inter-probe capacitance between the inspection probe 5d and the inspection probe 5b connected to the inspection probe 5c via the connection portion 6b, and connection to the inspection probe 5b via the connection portion 6a The inter-probe capacitance between the inspection probe 5a and the inspection probe 5d connected to the inspection probe 5c via the connection portion 6b, and between the inspection probe 5b and the inspection probe 5e Inter-probe capacitance, inter-probe capacitance between the inspection probe 5b and the inspection probe 5f, inspection probe connected to the inspection probe 5b via the connecting portion 6a inter-probe capacitance between a and the inspection probe 5e, inter-probe capacitance between the inspection probe 5a and the inspection probe 5f connected to the inspection probe 5b via the connection portion 6a, The capacitance including the inter-cable capacitance between the signal cables connecting the inspection probe 5 and the measuring unit 7 is measured as the capacitance Cc.

  Then, the control part 8 starts the arithmetic processing in this invention. Specifically, the control unit 8 obtains a value obtained by subtracting the capacitance Cc measured by the second measurement process from the capacitance C3 measured by the first measurement process between the inspection points Pb and Pc. Calculated as the capacity between inspection points. Thus, an accurate inter-inspection point capacitance that does not include the device-side capacitance (capacitance between inspection points from which the influence of the device-side capacitance is eliminated) is acquired. Next, the control unit 8 inspects the quality between the inspection points Pb and Pc based on the calculated inter-inspection point capacity and the inspection reference data stored in the storage unit 9. Thus, the inspection regarding the quality between the inspection points Pb and Pc on the conductor patterns 16 and 17 is completed.

  As described above, in the circuit board inspection apparatus 1 and the board inspection method by the circuit board inspection apparatus 1, the inspection points Pa and Pb on the conductor pattern 11 and the inspection points Pc and Pd on the conductor pattern 12 in the circuit board 100. A first measurement process for measuring the capacitance C1 between the inspection point Pb on the conductor pattern 11 and the inspection point Pc on the conductor pattern 12 in a state where the inspection probes 5a to 5d are in contact with each other; The inspection probes 5a and 5b that are brought into contact with the inspection points Pa and Pb on the conductor pattern 11 among the inspection probes 5a to 5d in a non-contact state with respect to the inspection points Pa to Pd are connected to each other. And each inspection probe 5c, 5d brought into contact with each inspection point Pc, Pd on the conductor pattern 12 In a state where they are connected to each other, a second capacitance Ca is measured between the inspection probe 5b brought into contact with the inspection point Pb and the inspection probe 5c brought into contact with the inspection point Pc during the first measurement process. The measurement processing and the calculation processing for subtracting the capacitance Ca from the capacitance C1 to calculate the capacitance between the inspection points Pb and the inspection points Pc are performed, and the capacitance between the inspection points and the reference value for inspection Based on the above, the quality of the circuit board 100 (the quality between the inspection points Pb and Pc) is inspected.

  Therefore, according to the circuit board inspection apparatus 1 and the board inspection method by the circuit board inspection apparatus 1, although not used at the time of inspection between the conductor patterns 11 and 12 (at the time of inspection between the inspection points Pb and Pc). During inspection between the inspection probe 5a connected to the same potential as the inspection probe 5b (inspection point Pb) via the conductor pattern 11 and between the conductor patterns 11 and 12 (at inspection between the inspection points Pb and Pc) Although not used, accurate device-side electrostatic capacitance including device-side capacitance caused by the presence of the inspection probe 5d connected to the same potential as the inspection probe 5c (inspection point Pc) via the conductor pattern 12 is used. The capacity (capacitance Ca in this example) can be acquired by the second measurement process. Therefore, according to the circuit board inspection apparatus 1 and the board inspection method by the circuit board inspection apparatus 1, a plurality of inspection probes 5a to 5d are brought into contact with the inspection points Pa to Pd on the circuit board 100. In the state, the first measurement process according to the present invention is executed to shorten the inspection time, and the capacitance C1 measured by the first measurement process during the calculation process according to the present invention is used as the above-described capacitance. By subtracting Ca, an accurate inter-inspection point capacity between the conductor patterns 11 and 12 (between the inspection points Pb and Pc) can be obtained. As a result, the accurate inter-inspection point capacity and the inspection reference data Therefore, the quality of the electronic component 21 between the conductor patterns 11 and 12 (between the inspection points Pb and Pc) can be accurately inspected.

  Further, according to the circuit board inspection apparatus 1 and the board inspection method by the circuit board inspection apparatus 1, at the time of the second measurement process in the present invention, for each inspection point on any one of the conductor patterns 13, 14. Each inspection probe to be brought into contact (in this example, each inspection probe 5c, 5d to be brought into contact with each inspection point Pc, Pd on the conductor pattern 14) and any one of the above-described conductor patterns. In a state in which the inspection probes 5e and 5f brought into contact with the inspection points Pe and Pf on the conductor pattern 15 connected via the electronic component 23 having a lower impedance than the specified value are connected to each other. By measuring the capacitance Cb, the inspection point on the conductor pattern 15 connected to the conductor pattern 14 via the low impedance electronic component 23 is measured. The accurate device side capacitance (capacitance Cb in this example) including the capacitance between the inspection probes 5e and 5f and the inspection probes 5a and 5b brought into contact with the contacts Pe and Pf It can be acquired by the measurement process 2. Therefore, according to the circuit board inspection apparatus 1 and the board inspection method by the circuit board inspection apparatus 1, the above-described capacitance Cb is calculated from the capacitance C2 measured by the first measurement process during the arithmetic processing in the present invention. As a result of obtaining the accurate inter-inspection point capacitance between the conductor patterns 13 and 14 (between the inspection points Pb and Pc), the accurate inter-inspection point capacitance and the inspection reference data are obtained. Based on this, it is possible to accurately inspect the quality of the electronic component 22 between the conductor patterns 13 and 14 (between the inspection points Pb and Pc).

  Further, according to the circuit board inspection apparatus 1 and the substrate inspection method by the circuit board inspection apparatus 1, during the second measurement process in the present invention, for inspection to be connected to the guard potential during the first measurement process in the present invention. By measuring the capacitance Cc in a state where the probes 5e and 5f are connected to the guard potential, the apparatus-side static caused by the presence of the inspection probes 5e and 5f connected to the guard potential during the first measurement process is measured. The accurate device-side capacitance (capacitance Cc in this example) including the capacitance can be acquired by the second measurement process. Therefore, according to the circuit board inspection apparatus 1 and the board inspection method by the circuit board inspection apparatus 1, the above-described capacitance Cc is calculated from the capacitance C3 measured by the first measurement process during the arithmetic processing in the present invention. As a result of obtaining the accurate inter-inspection point capacity between the conductor patterns 16 and 17 (between the inspection points Pb and Pc), the accurate inter-inspection point capacity and the inspection reference data are obtained. Based on this, it is possible to accurately inspect the quality of the electronic component 24 between the conductor patterns 16 and 17 (between the inspection points Pb and Pc).

  The present invention is not limited to the configuration of the circuit board inspection apparatus 1 described above or the inspection method of the circuit board 100. For example, although the circuit board 100 in which each conductor pattern 10 is formed on the surface and the circuit board 100 in which the electronic components 21 to 24 are disposed on the surface have been described as examples of the inspection target substrate, each conductor pattern 10 When a circuit board (not shown) formed on both front and back surfaces and a circuit board on which the electronic components 21 to 24 are formed on the inner layer are inspected as a substrate to be inspected, the same method as the above-described substrate inspection method Can be adopted. Moreover, although the example which test | inspects the circuit board 100 in which the 1st conductor pattern and the 2nd conductor pattern in this invention were mutually connected via the electronic component was demonstrated as a test object board | substrate, the 1st conductor pattern and the 1st A circuit board in which the two conductor patterns are insulated from each other (a circuit board in which no electronic component exists between the two conductor patterns: a bare board or the like) can be inspected as an inspection target board.

  Further, in the inspection between the inspection point Pb on the conductor pattern 16 and the inspection point Pc on the conductor pattern 17, there is a conductor pattern 18 that should be insulated from the conductor pattern 17 in the immediate vicinity of the conductor pattern 17. Sometimes (see FIG. 6), inspection probes (inspection probes 5e and 5f in the example of the figure) that are brought into contact with the inspection points on the conductor pattern 18 (inspection points Pe and Pf in the example of the figure). In the example shown in the figure, the inspection probes 5e and 5f are connected to the guard potential (G potential) during the first measurement process in the present invention. A series of measurement processes can be executed without doing so. When the inspection probes 5e and 5f are not connected to the guard potential (G potential) during the first measurement process, the inspection probes 5e and 5f are guarded even during the second measurement process according to the present invention. By measuring the second capacitance without being connected to the potential (G potential), it is possible to obtain an accurate capacitance between inspection points at the time of arithmetic processing in the present invention.

DESCRIPTION OF SYMBOLS 1 Circuit board inspection apparatus 3 Moving mechanism 4 Probe attachment part 5a-5n Inspection probe 6 Connection switching part 6a-6d Connection part 7 Measuring part 8 Control part 9 Memory | storage part 11-18 Conductive pattern 21-24 Electronic component 100 Circuit board C1 ~ C3, Ca ~ Cc, Cc1, Cc2 Capacitance Pa ~ Pf Inspection point

Claims (4)

A plurality of test probes mounted respectively on the probe mounting portion corresponding to the positions of the plurality of test points specified in the inspection target board, the electrostatic between each test point using the respective inspection probe A measurement unit that measures capacitance, a connection switching unit that switches connection of each inspection probe to the measurement unit, and controls the measurement unit and the connection switching unit and controls the capacitance measured by the measurement unit. A substrate inspection apparatus comprising a control unit for inspecting an inspection target substrate based on
The controller is configured to bring the inspection probes into contact with the plurality of inspection points defined on the first conductor pattern on the inspection target substrate and to be defined on the second conductor pattern on the inspection target substrate. In the state where the inspection probes are in contact with the plurality of inspection points, respectively, the measurement unit is controlled, and the first inspection point of the inspection points on the first conductor pattern and the A first measurement process for measuring a first capacitance between second inspection points among the respective inspection points on the second conductor pattern; Each of the above-described inspection pro- cesses brought into contact with each of the inspection points on the first conductor pattern of the inspection probes in a non-contact state with respect to the point. In a state where the inspection probes that are connected to each other and are brought into contact with the inspection points on the second conductor pattern are connected to each other, the measurement unit is controlled to control the first A second measurement process for measuring a second capacitance between the inspection probe to be brought into contact with the first inspection point and the inspection probe to be brought into contact with the second inspection point during the measurement process; A calculation process for calculating a capacitance between inspection points between the first inspection point and the second inspection point by subtracting the second capacitance from the first capacitance; A board inspection apparatus that inspects the quality of the board to be inspected based on a capacity between inspection points and a reference value for inspection.   In the second measurement processing, the control unit is configured to contact each inspection point on the conductor pattern of either the first conductor pattern or the second conductor pattern. And each of the inspection probes to be brought into contact with each of the inspection points on the third conductor pattern connected to one of the conductor patterns via an electronic component having an impedance lower than a predetermined specified value. The substrate inspection apparatus according to claim 1, wherein the second capacitance is measured in a state where the two are connected to each other.   In the second measurement process, the control unit measures the second capacitance in a state in which the inspection probe to be connected to the guard potential is connected to the guard potential in the first measurement process. The substrate inspection apparatus according to claim 1 or 2. The capacitance between each inspection point is measured using a plurality of inspection probes respectively attached to the probe mounting portions corresponding to the positions of the plurality of inspection points defined on the inspection target substrate , A substrate inspection method for inspecting a substrate to be inspected based on capacitance,
The inspection probes are brought into contact with the plurality of inspection points defined on the first conductor pattern on the inspection target substrate, and the plurality of inspections defined on the second conductor pattern on the inspection target substrate. Among the inspection points on the first conductor pattern and the inspection points on the second conductor pattern in a state where the inspection probes are in contact with the points, respectively. A first measurement process for measuring a first capacitance between the second inspection points, and the first conductor pattern of the inspection probes in a non-contact state with respect to the inspection points. The inspection probes to be brought into contact with the inspection points above are connected to each other and the inspection points on the second conductor pattern are connected to each other. In the state where the inspection probes to be brought into contact with each other are connected to each other, they are brought into contact with the inspection probe and the second inspection point which are brought into contact with the first inspection point during the first measurement process. A second measurement process for measuring a second capacitance between the inspection probes; and subtracting the second capacitance from the first capacitance to obtain the first inspection point and the first A substrate inspection method that performs a calculation process for calculating a capacitance between inspection points between two inspection points, and inspects the quality of the inspection target substrate based on the capacitance between inspection points and the reference value for inspection.

Images