JP5474392B2 - Circuit board inspection apparatus and circuit board inspection method - Google Patents

Description

  The present invention relates to a circuit board inspection apparatus and a circuit board inspection method for inspecting the conduction state of each conductor pattern and the insulation state between each conductor pattern on a circuit board.

  As this type of circuit board inspection apparatus, a circuit board inspection apparatus disclosed in Japanese Patent Laid-Open No. 2001-66351 is known. This circuit board inspection apparatus includes a fixture and a connection measurement unit, and is configured to be able to perform a continuity inspection of each conductor pattern (land pattern) on the circuit board and an insulation inspection between the conductor patterns. In this case, the fixture is a gap between a lower fixture in which a plurality of probe pins corresponding to each conductor pattern of the circuit board are formed to protrude on the upper surface and each electronic component mounted on the other surface of the circuit board. Correspondingly, a plurality of contact pins are formed on the lower surface of the contact pin, and the upper fixture is moved up and down by an elevating mechanism. In this circuit board inspection apparatus, the probe board of the lower fixture is brought into contact with each conductor pattern by sandwiching the circuit board between the lower fixture and the upper fixture, and a predetermined probe pin from the signal source. In a state where the signal is supplied, a continuity test of each conductor pattern and an insulation test between the conductor patterns are performed based on a signal input by the connection measuring unit via the probe pin. In this case, in this type of circuit board inspection apparatus, generally, a connection process for connecting a signal source or a connection measuring unit and a probe pin is executed to supply a signal to one conductor pattern, and in that state, Conduct a continuity test on the conductor pattern. At that time, the connection process is repeatedly executed by the number of the conductor patterns, and the continuity inspection is performed on all the conductor patterns. Further, in this type of circuit board inspection apparatus, generally, the above connection process is executed to supply a signal between a pair of conductor patterns, and in that state, a continuity inspection is performed on the pair of conductor patterns. Then, the connection process is repeated for the number of combinations of the pair of conductor patterns, and the insulation inspection is performed for all combinations.

JP 2001-66351 A (page 3-5, FIG. 1)

  However, the conventional circuit board inspection apparatus including the circuit board inspection apparatus described above has the following problems. That is, in the conventional circuit board inspection apparatus, the connection process is repeatedly executed for the number of conductor patterns to perform continuity inspection for all the conductor patterns, and the connection process is repeated for the number of combinations of a pair of conductor patterns. Insulation inspection is performed for all combinations. On the other hand, a scanner device having a plurality of switches is generally used for the connection process. In this case, the connection processing using this scanner requires a predetermined time for operating the switch. Therefore, in the conventional circuit board inspection apparatus that executes the connection processing by the number of conductor patterns and the number of combinations of a pair of conductor patterns, the time required for the connection processing when inspecting a circuit board having a large number of conductor patterns. As a result, there is a problem that it is difficult to improve inspection efficiency.

  The present invention has been made in view of the problems to be improved, and a main object of the present invention is to provide a circuit board inspection apparatus and a circuit board inspection method capable of improving the inspection efficiency for a circuit board having a large number of conductor patterns. And

In order to achieve the above object, a circuit board inspection apparatus according to claim 1, further comprising an inspection unit for inspecting a conduction state of each conductor pattern and an insulation state between the conductor patterns in a circuit board having a plurality of conductor patterns. A circuit board inspection apparatus comprising: a first power supply unit that outputs a first voltage signal for inspection; and a second power supply unit that outputs a second voltage signal having a voltage value different from that of the first voltage signal. The inspection unit sequentially performs the conduction state inspection and the insulation state inspection on the pair of conductor patterns selected from the conductor patterns on the circuit board while changing the combination of the pair of conductor patterns. When executing, the first voltage signal is supplied to one end of one of the pair of conductor patterns and one end of the other of the pair of conductor patterns On the other hand, in a state where the second voltage signal is supplied, the conduction state of the one conductor pattern is inspected based on the voltage value of the other end of the one conductor pattern and the voltage value of the first voltage signal. A second continuity test for inspecting a continuity state of the other conductor pattern based on a voltage value of the other end of the other conductor pattern and a voltage value of the second voltage signal , Insulation inspection for inspecting the insulation state between the pair of conductor patterns based on the current value of the current flowing between the pair of conductor patterns is performed in parallel .

The circuit board inspection method according to claim 2 is a circuit board inspection method for inspecting a conduction state of each conductor pattern and an insulation state between each conductor pattern in a circuit board having a plurality of conductor patterns, When sequentially performing the inspection of the conduction state and the inspection of the insulation state for a pair of the conductor patterns selected from the conductor patterns on the circuit board while changing the combination of the pair of conductor patterns, A first voltage signal is supplied to one end of one of the pair of conductor patterns, and a second voltage signal having a voltage value different from that of the first voltage signal is supplied to one end of the other of the pair of conductor patterns. In this state, based on the voltage value of the other end of the one conductor pattern and the voltage value of the first voltage signal A first continuity test for checking the conduction state of square conductor pattern, the conductive state of the other conductor patterns on the basis of the voltage value of the voltage value and the second voltage signal of the other end of the other conductor pattern The second continuity test to be inspected and the insulation test to inspect the insulation state between the pair of conductor patterns based on the value of the current flowing between the pair of conductor patterns are executed in parallel.

According to the circuit board inspection apparatus according to claim 1 and the circuit board inspection method according to claim 2, the first voltage signal is supplied to one end of one of the pair of conductor patterns and the other of the pair of conductor patterns. in the state that supplies a second voltage signal to one end portion, to inspect the first and continuity test and a second continuity test to check the continuity of both the conductor pattern, an insulating state between the two conductor patterns insulation in By performing the inspection in parallel , for example, in the state where the connection process for connecting the power supply unit or the measurement unit and the probe is performed once, three inspections (two continuity state inspections and one insulation state state) Inspection) can be performed. Therefore, according to the circuit board inspection apparatus and the circuit board inspection method, compared to the conventional circuit board inspection apparatus that needs to execute the connection process by the number of the conductor patterns and the number of combinations of the pair of conductor patterns. As a result, it is possible to reduce the number of connection processes required to perform each inspection on all conductor patterns and all combinations, and as a result, the inspection efficiency when inspecting a circuit board having many conductor patterns is sufficient. Can be improved.

Also, the inspection of the inspection and insulated conductive state for a pair of conductor pattern selected from among the conductor pattern in the circuitry substrate by sequentially executed while changing the combination of a pair of conductor patterns, all conductors Since each inspection for the pattern and all combinations can be performed with a simple configuration including, for example, three measurement units, an increase in cost of the circuit board inspection apparatus can be suppressed to a low level.

1 is a configuration diagram showing a configuration of a circuit board inspection device 1. FIG. 1 is a configuration diagram showing a configuration of a circuit board 100. FIG. It is explanatory drawing explaining the circuit board inspection method using the circuit board inspection apparatus. 5 is a flowchart of an inspection process 50.

  Embodiments of a circuit board inspection apparatus and a circuit board inspection method according to the present invention will be described below with reference to the accompanying drawings.

  First, the configuration of the circuit board inspection apparatus 1 will be described. The circuit board inspection apparatus 1 shown in FIG. 1 has, for example, continuity of each conductor pattern P in the circuit board 100 having a plurality of conductor patterns P1 to P12 (see FIG. 2; hereinafter, also referred to as “conductor pattern P” when not distinguished). The state and the insulation state between each conductor pattern P are configured to be inspectable. Specifically, as shown in FIG. 1, the circuit board inspection apparatus 1 includes a substrate holding unit 2, a probe unit 3, a moving mechanism 4, and a main body unit 5.

  The substrate holding unit 2 includes a holding plate and a clamp mechanism (not shown) that is attached to the holding plate and sandwiches and fixes the end portion of the circuit board 100 so as to hold the circuit board 100. ing. The probe unit 3 includes a plurality of probe pins 41 and is configured as a jig. In this case, in the probe unit 3, the number of probe pins 41 and the arrangement pattern are defined according to the position of the end H (see FIG. 2) of each conductor pattern P of the circuit board 100. The moving mechanism 4 performs probing of the probe pin 41 by moving the probe unit 3 according to the control of the control unit 15.

  As shown in FIG. 1, the main unit 5 includes a scanner unit 11, a first power supply unit 12a, a second power supply unit 12b, a first measurement unit 13a, a second measurement unit 13b, a third measurement unit 13c, a storage unit 14, and A control unit 15 is provided. The scanner unit 11 includes a plurality of switches (not shown), and switches each switch to an on state or an off state according to the control of the control unit 15, whereby the probe pin 41 in the probe unit 3 and the first A connection / disconnection process for connecting / disconnecting the power supply unit 12a, the second power supply unit 12b, the first measurement unit 13a, the second measurement unit 13b, and the third measurement unit 13c is performed.

  As shown in FIG. 1, the first power supply unit 12 a outputs a first voltage signal Sv <b> 1 (for example, a DC voltage whose voltage value is known) according to the control of the control unit 15. In this case, the low potential side (minus electrode side) of the first power supply unit 12 a is connected to the reference potential (ground potential), and the high potential side (plus electrode side) of the first power supply unit 12 a is connected via the scanner unit 11. To the probe pin 41 (see FIG. 3). As shown in the figure, the second power supply unit 12b outputs a second voltage signal Sv2 (for example, a DC voltage whose voltage value is known) under the control of the control unit 15. In this case, the low potential side (minus electrode side) of the second power supply unit 12 b is connected to the reference potential (ground potential), and the high potential side (plus electrode side) of the second power supply unit 12 b is connected via the scanner unit 11. Connected to the third measuring unit 13c (see FIG. 4). In the circuit board inspection apparatus 1, the voltage value of the second voltage signal Sv2 is lower than the voltage value of the first voltage signal Sv1 (that is, the voltage values of the first voltage signal Sv1 and the second voltage signal Sv2 are mutually different). Different values). In the following description, when the first voltage signal Sv1 and the second voltage signal Sv2 are not distinguished, they are also referred to as “voltage signal Sv”.

  In the inspection process 50 (see FIG. 4) executed by the control unit 15, the first measurement unit 13a and the second measurement unit 13b are configured to have one end H (the other end) in the conductor pattern P as shown in FIG. The other end H (corresponding to one end) of the conductor pattern P is connected to the probe unit 3 via the probe pin 41 (hereinafter also referred to as “end H2”). The voltage value of the end portion H2 when the voltage signal Sv is supplied to the portion H1) is also measured. As shown in FIG. 3, the third measurement unit 13 c is connected to the probe pin 41 and the second power supply unit 12 b via the scanner unit 11 and connected to each end H <b> 1 of the pair of conductor patterns P in the inspection process 50. The current value of the current flowing between the two conductor patterns P when the first voltage signal Sv1 and the second voltage signal Sv2 are supplied is measured.

  The storage unit 14 stores conductor pattern data Dc and reference value data Ds used in the inspection process 50. In this case, the conductor pattern data Dc includes information that can specify the number and arrangement position of each conductor pattern P of the circuit board 100. In addition, the reference value data Ds indicates information indicating the reference value Vs used for determining the quality of the conductive state of the conductor pattern P and the reference value Rs used for determining the quality of the insulation state between the conductor patterns in the inspection process 50. It contains information.

  The control unit 15 controls each component constituting the moving mechanism 4 and the main body unit 5 in accordance with an operation signal output from an operation unit (not shown). Specifically, the control unit 15 controls the movement (probing) of the probe unit 3 by the moving mechanism 4. Further, the control unit 15 controls the output of the voltage signal Sv by the first power supply unit 12a and the second power supply unit 12b and also controls the connection / disconnection processing by the scanner unit 11, thereby the conductor pattern P of the circuit board 100 is controlled. To supply the voltage signal Sv. In addition, the control unit 15 functions as an inspection unit, and in the inspection process 50, performs a first continuity test, a second continuity test, and an insulation test, which will be described in detail later.

  Next, a circuit board inspection method for inspecting the conduction state of each conductor pattern P and the insulation state between each conductor pattern P on the circuit board 100 using the circuit board inspection apparatus 1, and the circuit board inspection apparatus 1 at that time The operation will be described with reference to the drawings.

  First, the circuit board 100 to be inspected is placed on a holding plate (not shown) in the board holding unit 2, and then the end of the circuit board 100 is sandwiched by a clamp mechanism (not shown) of the board holding unit 2. By fixing, the circuit board 100 is held by the board holding part 2. Subsequently, an inspection start operation is performed using an operation unit (not shown). At this time, the control unit 15 controls the moving mechanism 4 according to the operation signal output from the operation unit to move the probe unit 3 downward. Thereby, the tip of each probe pin 41 of the probe unit 3 is brought into contact (probing) with each end H of each conductor pattern P.

  Next, the control unit 15 executes the inspection process 50 shown in FIG. In this inspection process 50, the control unit 15 causes the first power supply unit 12a and the second power supply unit 12b to start outputting the voltage signal Sv (step 51). At this time, the first power supply unit 12a starts outputting the voltage signal Sv1 (for example, a DC voltage signal of about 100V), and the second power supply unit 12b has a voltage lower than the voltage value of the first voltage signal Sv1. The output of the value voltage signal Sv2 (for example, a DC voltage signal of about 1 V) is started.

  Subsequently, the control unit 15 reads the conductor pattern data Dc from the storage unit 14 (step 52). Next, the control unit 15 specifies the conductor pattern P (position, number, etc.) of the circuit board 100 based on the conductor pattern data Dc, and then, a pair of conductor patterns P ( For example, the conductor patterns P1 and P2) shown in FIG. 3 are selected (step 53).

  Next, the control unit 15 executes a connection process (step 54). In this connection process, the control unit 15 controls the scanner unit 11 to connect the probe pin 41 in contact with the end H1 of the conductor pattern P1 to the first power supply unit 12a as shown in FIG. The probe pin 41 that is in contact with the end H2 of the conductor pattern P1 is connected to the first measurement unit 13a, and the probe pin 41 that is in contact with the end H1 of the conductor pattern P2 is routed through the third measurement unit 13c. Then, the probe pin 41 in contact with the end H2 of the conductor pattern P2 is connected to the second measurement unit 13b while being connected to the second power supply unit 12b.

  At this time, the first voltage signal Sv1 output from the first power supply unit 12a is supplied to the end H1 of the conductor pattern P1 via the probe pin 41, and the second voltage output from the second power supply unit 12b. The signal Sv2 is supplied to the end H1 of the conductor pattern P2 via the probe pin 41. Further, in this state (a state where the connection process is executed), the first measurement unit 13a measures the voltage value of the end H2 of the conductor pattern P1, and the second measurement unit 13b detects the voltage of the end H2 of the conductor pattern P2. Measure the voltage value. In addition, the third measurement unit 13c calculates the current value of the current flowing between the conductor patterns P1 and P2 when the first voltage signal Sv1 and the second voltage signal Sv2 are supplied to the end portions H1 of the conductor patterns P1 and P2. taking measurement.

  Subsequently, the control unit 15 performs the connection process (the first voltage signal Sv1 is supplied to the end H1 of the conductor pattern P1, and the second voltage signal Sv2 is supplied to the end H1 of the conductor pattern P2. In the state), the first continuity test for the conductor pattern P1, the second continuity test for the conductor pattern P2, and the insulation test for both conductor patterns P1 and P2 are executed in parallel (step 55). Specifically, the control unit 15 first reads the reference value data Ds from the storage unit 14, and based on the reference value data Ds, the reference value Vs used for determining the quality of the conductive state of the conductor patterns P1 and P2, and A reference value Rs used for determining whether the insulation state between the conductor patterns P1 and P2 is acceptable is specified. Next, in the first continuity test, the control unit 15 determines the voltage value (hereinafter also referred to as “voltage value Vm1”) of the end H2 of the conductor pattern P1 measured by the first measurement unit 13a and the first voltage signal Sv1. On the basis of the known voltage value (hereinafter also referred to as “voltage value Vk1”), the quality determination of the conductive state of the conductor pattern P1 is performed. In this case, when the conductive state of the conductor pattern P1 is good, the voltage value Vk1 and the voltage value Vm1 are equal. Therefore, as an example, the control unit 15 obtains a difference value obtained by subtracting the voltage value Vm1 from the voltage value Vk1. The conductive state of the conductor pattern P1 is determined to be good when Vs or less, and the conductive state of the conductor pattern P1 is determined to be defective when the difference value exceeds the reference value Vs.

  Further, in the second continuity test, the control unit 15 determines the voltage value (hereinafter also referred to as “voltage value Vm2”) of the end H2 of the conductor pattern P2 measured by the second measurement unit 13b and the second voltage signal Sv2. On the basis of the known voltage value (hereinafter also referred to as “voltage value Vk2”), the quality determination of the conductive state of the conductor pattern P2 is performed. In this case, when the conductive state of the conductor pattern P2 is good, the voltage value Vk2 and the voltage value Vm2 are equal. Therefore, as an example, the control unit 15 obtains a difference value obtained by subtracting the voltage value Vm2 from the voltage value Vk2. When the reference value Vs or less, the conductive state of the conductor pattern P2 is determined to be good, and when the difference value exceeds the reference value Vs, the conductive state of the conductor pattern P2 is determined to be defective.

In addition, in the insulation test, the control unit 15 determines the current value of the current flowing between the conductor patterns P1 and P2 measured by the third measurement unit 13c (hereinafter also referred to as “current value Im”) and the voltage value described above. Based on Vm1 and Vm2, the quality of the insulation state between the conductor patterns P1 and P2 is determined. In this case, as an example, the control unit 15 calculates the resistance value Rm between the conductor patterns P1 and P2 by the following equation (1).
Rm = (Vm1-Vm2) / Im (1)

Subsequently, the control unit 15 determines that the insulation state between the conductor patterns P1 and P2 is good when the calculated resistance value Rm is equal to or greater than the reference value Rs described above, and the conductor when the difference value is less than the reference value Rs. The insulation state between the patterns P1 and P2 is determined to be defective. Thus, the first continuity test, the second continuity test, and the insulation test for the conductor patterns P1, P2 are completed. In this example, since the voltage values Vk1 and Vk2 are known, the resistance value Rm can be calculated by the following equation (2) instead of the above equation (1).
Rm = (Vk1-Vk2) / Im (2)

  Next, the control unit 15 stores (records) the inspection result (determination result) in the storage unit 14 (step 56). Subsequently, the control unit 15 performs the first continuity test and the second continuity test on all the conductor patterns P on the circuit board 100, and all the combinations selected from all the conductor patterns P on the circuit board 100. It is determined whether or not the insulation inspection between the conductor patterns P has been completed (step 57). In this case, when it is determined that the above inspections for all the conductor patterns P and all the combinations have not been completed, the control unit 15 repeatedly executes the above-described Step 53 to Step 57. In this case, in step 53, the control unit 15 selects a pair of conductor patterns P (for example, conductor patterns) different from the combination of the pair of conductor patterns currently selected (conductor patterns P1 and P2 in the above example). Select P3, P4). That is, the control unit 15 repeatedly executes Step 53 to Step 57 to perform the first continuity test, the second continuity test, and the pair of conductor patterns selected from the conductor patterns P on the circuit board 100. The process of executing the insulation inspection in parallel is sequentially executed while changing the combination of the pair of conductor patterns P.

  Next, when the control unit 15 determines in the above step 57 that the respective inspections for all the conductor patterns P and all the combinations have been completed, the inspection result recorded in the storage unit 14 is displayed on a display unit outside the figure. Then, the inspection process 50 is completed. In this case, in the circuit board inspection apparatus 1, as described above, in a state where one connection process is performed, the conduction state inspection for the pair of conductor patterns P1 and P2 and the insulation state for both the conductor patterns P1 and P2 are performed. Inspection (ie, three inspections) can be performed. For this reason, in this circuit board inspection apparatus 1, compared with the conventional circuit board inspection apparatus which needs to perform connection processing by the number of the conductor patterns P and the number of combinations of the pair of conductor patterns P, As a result of reducing the number of connection processes necessary for performing each of the above-mentioned inspections on the conductor pattern P and all combinations, the inspection efficiency when performing inspection on a circuit board having a large number of conductor patterns is sufficiently obtained. It is possible to improve.

  As described above, in the circuit board inspection apparatus 1 and the circuit board inspection method, the first voltage signal Sv1 is supplied to the end H1 of one conductor pattern P and the end H1 of the other conductor pattern P is supplied to the end H1. On the other hand, in a state where the second voltage signal Sv2 is being supplied, the conduction state of both the conductor patterns P is inspected and the insulation state between the two conductor patterns is inspected. Therefore, according to the circuit board inspection apparatus 1 and the circuit board inspection method, three inspections (two conduction state inspections and one insulation state inspection) are performed in a state where one connection process is performed. be able to. Therefore, according to the circuit board inspection apparatus 1 and the circuit board inspection method, the conventional circuit board inspection apparatus that needs to perform connection processing by the number of the conductor patterns P and the number of combinations of the pair of conductor patterns P In comparison, the number of connection processes required to perform each inspection on all conductor patterns P and all combinations can be reduced. As a result, when a circuit board having a large number of conductor patterns is inspected. Inspection efficiency can be improved sufficiently.

  In the circuit board inspection apparatus 1 and the circuit board inspection method, the first continuity test, the second continuity test, and the insulation test are performed on the pair of conductor patterns selected from the conductor patterns P on the circuit board 100. Execute sequentially while changing the combination of patterns P. Therefore, according to the circuit board inspection apparatus 1 and the circuit board inspection method, each inspection for all combinations of all the conductor patterns P and the pair of conductor patterns P includes a simple configuration including the three measurement units 13a to 13c. As a result, the increase in the cost of the circuit board inspection apparatus 1 can be kept low.

  The present invention is not limited to the configuration and method described above. For example, although an example in which a DC voltage signal with a known voltage value is used as the voltage signal Sv has been described above, an AC voltage signal with a known voltage value can also be used as the voltage signal Sv. Further, by providing a voltmeter for measuring the voltage of the voltage signal Sv, a DC voltage signal or an AC voltage signal whose voltage value is not known (unknown) can be used as the voltage signal Sv.

  In addition, the configuration example including one each of the first measurement unit 13a, the second measurement unit 13b, and the third measurement unit 13c has been described above, but a configuration including a plurality (two or more) of these may be employed. . In this configuration, the first continuity test, the second continuity test, and the insulation test for a plurality of pairs (two or more pairs) of the conductor patterns P can be performed in parallel, so that the circuit board having many conductor patterns P is inspected. The inspection efficiency when performing can be further improved.

  Further, the configuration and the method for executing the inspection on the circuit board 100 having the conductor pattern P formed on one surface have been described above, but the circuit board having the pair of probe units 3 and having the conductor pattern P formed on both surfaces is described above. It can also be applied to configurations and methods for performing inspections. Further, the configuration example in which the plurality of probe pins 41 in the probe unit 3 are brought into contact with each end H of each conductor pattern P at the same time has been described above, but at least four probe pins are individually moved to each power supply unit 12a, It can also be applied to a flying probe type circuit board inspection apparatus in which a probe pin is brought into contact only with an end H of a conductor pattern P to which 12b and each of the measurement units 13a to 13c are to be connected.

  Moreover, although the example which performs each test | inspection with respect to the circuit board 100 which has the conductor pattern P (namely, linear conductor pattern P) with only the two edge parts H was mentioned above, the edge part H has three or more. The same effect as described above can be realized when the inspection is performed on the circuit board 100 having the conductor pattern P (that is, the conductor pattern P in which the conductor pattern P is branched). In addition, the example in which the inspection is performed on the circuit board 100 having the twelve conductor patterns P has been described above, but the inspection is performed on various circuit boards in which the number and shape of the conductor patterns P are different from the circuit board 100. Of course, the same effects as described above can be realized.

DESCRIPTION OF SYMBOLS 1 Circuit board inspection apparatus 5 Main-body part 12a 1st power supply part 12b 2nd power supply part 13a 1st measurement part 13b 2nd measurement part 13c 3rd measurement part 50 Inspection process 100 Circuit board Dc Conductor pattern data Ds Reference value data H1, H2 End Im Current value P1 to P12 Conductor pattern Rm Resistance value Rs, Vs Reference value Sv1 First voltage signal Sv2 Second voltage signal Vk1, Vk2 Voltage value Vm1, Vm2 Voltage value

Claims (2)

A circuit board inspection apparatus comprising an inspection unit for inspecting a conduction state of each conductor pattern and an insulation state between the conductor patterns in a circuit board having a plurality of conductor patterns,
A first power supply unit that outputs a first voltage signal for inspection; and a second power supply unit that outputs a second voltage signal having a voltage value different from that of the first voltage signal;
The inspection unit sequentially performs the conduction state inspection and the insulation state inspection on a pair of conductor patterns selected from the conductor patterns on the circuit board while changing the combination of the pair of conductor patterns. In doing so, the first voltage signal is supplied to one end of one of the pair of conductor patterns and the second voltage signal is supplied to one end of the other of the pair of conductor patterns. A first continuity test for inspecting a continuity state of the one conductor pattern based on a voltage value of the other end of the one conductor pattern and a voltage value of the first voltage signal in the state; and the other conductor pattern second continuity test for checking the conduction state of the other conductor patterns on the basis of the voltage value of the other end and the voltage value of the second voltage signal and the The pair of parallel circuit board inspection apparatus for performing an insulation test to inspect an insulation state between the conductor patterns on the basis of the current value of the current flowing between the pair of conductor patterns. A circuit board inspection method for inspecting a conduction state of each conductor pattern and an insulation state between each conductor pattern in a circuit board having a plurality of conductor patterns,
When sequentially performing the inspection of the conduction state and the inspection of the insulation state for a pair of the conductor patterns selected from the conductor patterns on the circuit board while changing the combination of the pair of conductor patterns, A first voltage signal is supplied to one end of one of the pair of conductor patterns, and a second voltage signal having a voltage value different from that of the first voltage signal is supplied to one end of the other of the pair of conductor patterns. A first continuity test for inspecting a continuity state of the one conductor pattern based on a voltage value of the other end portion of the one conductor pattern and a voltage value of the first voltage signal, and the other second electrically inspecting the conductive state of the other conductor patterns on the basis of the voltage value of the other end of the conductor pattern on the voltage value of the second voltage signal And testing, circuit board inspection method for executing in parallel and insulated inspection for inspecting an insulation state between the pair of conductive patterns on the basis of the current value of the current flowing between the pair of conductor patterns.

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