JP5208787B2 - Circuit board inspection apparatus and circuit board inspection method - Google Patents

Description

  The present invention relates to a circuit board inspection apparatus and a circuit board inspection method for inspecting an insulation state between conductor patterns and a conduction state of each conductor pattern in a circuit board having a plurality of conductor patterns and electronic components connected to the conductor patterns. Is.

  As this type of circuit board inspection apparatus, a circuit board inspection apparatus disclosed in Japanese Patent Laid-Open No. 2001-66351 is known. This circuit board inspection apparatus includes a fixture and a connection measurement unit, and is configured to be able to perform a continuity inspection of each conductor pattern (land pattern) on the circuit board and an insulation inspection between the conductor patterns. In this case, the fixture is a gap between a lower fixture in which a plurality of probe pins corresponding to each conductor pattern of the circuit board are formed to protrude on the upper surface and each electronic component mounted on the other surface of the circuit board. Correspondingly, a plurality of contact pins are formed on the lower surface of the contact pin, and the upper fixture is moved up and down by an elevating mechanism. In this circuit board inspection apparatus, the circuit board is sandwiched between the lower fixture and the upper fixture so that the probe pin of the lower fixture is brought into contact with each conductor pattern and a signal is supplied to a predetermined probe pin. Thus, based on a signal input by the connection measuring unit via the probe pin, an insulation inspection between the conductor patterns and a conduction inspection of each conductor pattern are performed. In this case, in this type of circuit board inspection apparatus, one of the insulation inspection and the continuity inspection is performed, and then the other of the both inspections is performed.

JP 2001-66351 A (page 3-5, FIG. 1)

  However, the conventional circuit board inspection apparatus including the circuit board inspection apparatus described above has the following problems. That is, in the conventional circuit board inspection apparatus, after performing one of the insulation inspection and the continuity inspection, the other of the two inspections is performed. For this reason, in the conventional circuit board inspection apparatus, when inspecting a circuit board having a large number of conductor patterns, it takes a lot of time for each of the continuity inspection and the insulation inspection, and it is difficult to improve the inspection efficiency. There is a problem that there is.

  The present invention has been made in view of the problems to be improved, and a circuit board inspection apparatus and circuit capable of improving the inspection efficiency for a circuit board having a large number of conductor patterns and electronic components connected to the conductor patterns. The main purpose is to provide a substrate inspection method.

  In order to achieve the above object, a circuit board inspection apparatus according to claim 1, wherein the circuit board having a plurality of conductor patterns and electronic components connected to the conductor patterns has an insulation state between the conductor patterns and the conductor patterns. It is a circuit board inspection apparatus provided with the test | inspection part which test | inspects a continuity state, Comprising: The said test | inspection part mutually connects the said conductor pattern in the 1st conductor pattern group comprised with the said conductor pattern to which the said electronic component is connected. The conductor pattern in the first conductor pattern group and the second conductor pattern group in the second conductor pattern group composed of the conductor patterns that are not connected to the electronic component are set to the same potential. Performing a first insulation test for inspecting an insulation state between the conductor patterns in the two conductor pattern group; A second insulation test for inspecting an insulation state between the conductor patterns in the first conductor pattern group, and an insulation state between the conductor patterns in the second conductor pattern group when the edge state is determined to be good. Conducting a third insulation test to be inspected, and conducting a continuity test for inspecting a continuity state of the conductor pattern in which neither the second insulation test nor the third insulation test is performed with at least one of the two insulation tests Run in parallel.

  The circuit board inspection apparatus according to claim 2 is the circuit board inspection apparatus according to claim 1, wherein the inspection unit includes the conductor patterns in the first conductor pattern group in the second insulation inspection. The conductor patterns in the third conductor pattern group constituted by the conductor patterns connected to each other through the electronic components are set to the same potential, and the conductor patterns in the third conductor pattern group The insulation state between the conductor pattern within one conductor pattern group and outside the third conductor pattern group is inspected.

  According to a third aspect of the present invention, there is provided the circuit board inspection apparatus according to the first or second aspect, wherein the storage unit stores connection data that can identify the conductor pattern to which the electronic component is connected; And a processing unit that executes a specifying process for specifying each conductor pattern group based on the connection data.

  The circuit board inspection method according to claim 4 inspects an insulation state between the conductor patterns and a conduction state of the conductor patterns in a circuit board having a plurality of conductor patterns and electronic components connected to the conductor patterns. A method for inspecting a circuit board, wherein the conductor patterns in the first conductor pattern group composed of the conductor patterns to which the electronic components are connected are set to the same potential and the electronic components are not connected. Insulation between the conductor pattern in the first conductor pattern group and the conductor pattern in the second conductor pattern group while making the conductor patterns in the second conductor pattern group composed of conductor patterns have the same potential. When a first insulation test for inspecting the state is performed and it is determined that the insulation state is good in the first insulation test, the first conductive test is performed. A second insulation test for inspecting an insulation state between the conductor patterns in the pattern group, and a third insulation test for inspecting an insulation state between the conductor patterns in the second conductor pattern group; A continuity test for inspecting the continuity state of the conductor pattern in which neither the insulation test nor the third insulation test is performed is performed in parallel with at least one of the both insulation tests.

In the circuit board inspection apparatus according to claim 1 and the circuit board inspection method according to claim 4, when the insulation state is determined to be good in the first insulation inspection, the second insulation inspection and the third insulation inspection are executed. The continuity test for inspecting the continuity state of the conductor pattern for which neither the second insulation test nor the third insulation test is performed is performed in parallel with at least one of the second insulation test and the third insulation test. Therefore, according to the circuit board inspection apparatus and the circuit board inspection method, as compared with the conventional circuit board inspection apparatus for performing the other of the two test after performing either of insulation test and continuity test, second The inspection time as a whole can be reduced by the amount of time for performing at least one of the insulation inspection and the third insulation inspection and the continuity inspection in parallel. Therefore, according to this circuit board inspection apparatus and circuit board inspection method, it is possible to sufficiently improve the inspection efficiency when inspecting a circuit board having a large number of conductor patterns.

  In the circuit board inspection apparatus according to claim 2, the inspection unit is configured by conductor patterns connected to each other through electronic components among the conductor patterns in the first conductor pattern group in the second insulation inspection. A conductor pattern in the third conductor pattern group, a conductor pattern in the third conductor pattern group, and a conductor pattern in the first conductor pattern group and outside the third conductor pattern group. Check the insulation state between. For this reason, according to this circuit board inspection apparatus, it is possible to reliably avoid damage to electronic components due to potential differences occurring between the conductor patterns in the same third conductor pattern group.

  According to the circuit board inspection apparatus of claim 3, the processing unit identifies each conductor pattern group based on the connection data stored in the storage unit, so that which conductor pattern is connected by the electronic component. As a result, it is possible to eliminate the work of investigating whether or not each conductor pattern group is specified, and as a result, the inspection efficiency can be improved accordingly.

1 is a configuration diagram showing a configuration of a circuit board inspection device 1. FIG. 1 is a configuration diagram showing a configuration of a circuit board 100. FIG. It is a data block diagram which shows notionally the structure of the connection data Dc. It is a data block diagram which shows notionally the structure of the conductor pattern group data Dg. 5 is a flowchart of an inspection process 50.

  Embodiments of a circuit board inspection apparatus and a circuit board inspection method according to the present invention will be described below with reference to the accompanying drawings.

  First, the configuration of the circuit board inspection apparatus 1 will be described. A circuit board inspection apparatus 1 shown in FIG. 1 is an example of a circuit board inspection apparatus according to the present invention. For example, a plurality of conductor patterns P1 to P24 (see FIG. 2; hereinafter referred to as “conductor pattern P” unless otherwise distinguished). And the insulation state between the conductor patterns P in the circuit board 100 having the electronic components E1 to E4 connected to the conductor pattern P (refer to the same figure: hereinafter, also referred to as “electronic component E”). The conductive state of each conductor pattern P is configured to be inspected according to the circuit board inspection method according to the present invention. Specifically, as shown in FIG. 1, the circuit board inspection apparatus 1 includes a substrate holding unit 2, a probe unit 3, a moving mechanism 4, and an inspection unit 5.

  The substrate holding unit 2 includes a holding plate and a clamp mechanism (not shown) that is attached to the holding plate and sandwiches and fixes the end portion of the circuit board 100 so as to hold the circuit board 100. ing. The probe unit 3 includes a plurality of probe pins 21 and is configured as a jig. In this case, the probe unit 3 defines the number and arrangement pattern of the probe pins 21 according to the position of the connection point H (see FIG. 2) for connecting the electrical parts provided on each conductor pattern P of the circuit board 100. Has been. The moving mechanism 4 executes probing by moving the probe unit 3 in the vertical direction under the control of the control unit 15.

  As shown in FIG. 1, the inspection unit 5 includes a scanner unit 11, an inspection signal generation unit 12, a measurement unit 13, a storage unit 14, and a control unit 15. The scanner unit 11 includes a plurality of switches (not shown), and switches each switch to an on state or an off state according to the control of the control unit 15, whereby the probe pin 21 and the inspection signal in the probe unit 3 are switched. Connection / disconnection (connection and disconnection) with the generation unit 12 and connection / disconnection between the probe pin 21 and the measurement unit 13 are performed.

  The inspection signal generation unit 12 includes a voltage signal generation circuit 31 and a current signal generation circuit 32. The voltage signal generation circuit 31 generates a voltage signal Sv (insulation inspection signal in the present invention) under the control of the control unit 15. The current signal generation circuit 32 generates a current signal Si (conduction test signal in the present invention) under the control of the control unit 15. The measuring unit 13 measures a current (an example of a physical quantity in the present invention) that flows between the conductor patterns P with the supply of the voltage signal Sv. Further, the measurement unit 13 measures a voltage (another example of the physical quantity in the present invention) generated between both ends of the conductor pattern P (between both connection points H and H) with the supply of the current signal Si.

  The storage unit 14 stores connection data Dc used in the inspection process 50 (see FIG. 5) executed by the control unit 15. In this case, the connection data Dc is an example of connection data in the present invention, and, as conceptually shown in FIG. 3, a conductor pattern to which the respective electronic components E1 to E4 mounted on the circuit board 100 are connected. It includes information that can identify P. The storage unit 14 stores conductor pattern group data Dg (see FIG. 4) generated by the control unit 15.

  The control unit 15 controls each component constituting the moving mechanism 4 and the inspection unit 5 according to an operation signal output from an operation unit (not shown). Specifically, the control unit 15 controls the movement of the probe unit 3 by the moving mechanism 4. Further, the control unit 15 controls the generation of the voltage signal Sv and the current signal Si by the inspection signal generation unit 12 and also controls the connection / disconnection processing by the scanner unit 11, so that the conductor pattern P of the circuit board 100 is controlled. The voltage signal Sv and the current signal Si are supplied. In the inspection process 50, the control unit 15 performs a first insulation inspection, a second insulation inspection, a third insulation inspection, and a continuity inspection, which will be described in detail later.

  In addition, the control unit 15 functions as a processing unit in the present invention, and is a first conductor pattern group composed of all the conductor patterns P to which the electronic component E is connected from among the conductor patterns P in the circuit board 100. Gf (see FIG. 2) is specified based on the connection data Dc. Moreover, the control part 15 specifies 2nd conductor pattern group Gs (refer the same figure) comprised by all the conductor patterns P to which the electronic component E is not connected based on the connection data Dc. Further, the control unit 15 uses the third conductor pattern groups Gt1 to Gt3 configured by the conductor patterns P connected to each other via the electronic component E (see the same figure: hereinafter, the “third conductor pattern group Gt Is also specified based on the connection data Dc. In addition, the control unit 15 generates conductor pattern group data Dg (see FIG. 4) including information indicating the conductor patterns P constituting the respective conductor pattern groups Gf, Gs, and Gt, and stores them in the storage unit 14. The process of specifying each conductor pattern group Gf, Gs, Gt corresponds to the specifying process in the present invention.

  Next, in accordance with the circuit board inspection method according to the present invention using the circuit board inspection apparatus 1, a method for inspecting the insulation state between the conductor patterns P and the conduction state of each conductor pattern P in the circuit board 100, and at that time The operation of the circuit board inspection apparatus 1 will be described with reference to the drawings.

  First, the circuit board 100 to be inspected is placed on a holding plate (not shown) in the board holding unit 2, and then the end of the circuit board 100 is sandwiched by a clamp mechanism (not shown) of the board holding unit 2. By fixing, the circuit board 100 is held by the board holding part 2. Subsequently, an inspection start operation is performed using an operation unit (not shown). At this time, the control unit 15 controls the moving mechanism 4 according to the operation signal output from the operation unit to move the probe unit 3 downward. Thereby, the tip of each probe pin 21 of the probe unit 3 is brought into contact (probing) with each connection point H of each conductor pattern P.

  Next, the control unit 15 executes an inspection process 50 shown in FIG. In this inspection process 50, the control unit 15 reads the connection data Dc from the storage unit 14 (step 51). Subsequently, the control unit 15 executes a specifying process for specifying each conductor pattern group Gf, Gs, Gt based on the connection data Dc (step 52). In this specifying process, the control unit 15 specifies the first conductor pattern group Gf composed of the conductor patterns P1 to P12 to which any one of the electronic components E is connected, as shown in FIG. A second conductor pattern group Gs composed of conductor patterns P13 to P24 to which E is not connected is specified. Further, as shown in the figure, the control unit 15 is connected via a third conductor pattern group Gt1 composed of conductor patterns P1 to P8 connected via an electronic component E1, and electronic components E2 and E3. The third conductor pattern group Gt2 composed of the conductor patterns P9 and P10 and the third conductor pattern group Gt3 composed of the conductor patterns P11 and P12 connected via the electronic component E4 are specified. Next, the control unit 15 generates conductor pattern group data Dg (see FIG. 4) including information indicating the conductor patterns P constituting the conductor pattern groups Gf, Gs, and Gt, and stores them in the storage unit 14 (see FIG. 4). Step 53: Generation and recording of conductor pattern group data Dg).

  In this case, as described above, in the circuit board inspection apparatus 1, the control unit 15 specifies the first conductor pattern group Gf, the second conductor pattern group Gs, and the third conductor pattern group Gt based on the connection data Dc. For this reason, in this circuit board inspection apparatus 1, it is unnecessary to investigate which conductor pattern P is connected by the electronic component E and specify each conductor pattern group Gf, Gs, Gt. Efficiency can be improved.

  Subsequently, the control unit 15 performs a first insulation test (step 54). In the first insulation test, the control unit 15 controls the voltage signal generation circuit 31 of the test signal generation unit 12 to generate a voltage signal Sv (for example, a high DC voltage of about 10V to 1000V). Next, the control unit 15 reads the conductor pattern group data Dg from the storage unit 14, and based on the conductor pattern group data Dg, the conductor patterns P1 to P12 and the second conductor pattern group constituting the first conductor pattern group Gf. The conductor pattern P constituting Gs is specified.

  Subsequently, the control unit 15 controls the scanner unit 11 to contact each connection point H of all the conductor patterns P1 to P12 in the first conductor pattern group Gf (which constitutes the first conductor pattern group Gf). The probe pin 21 connected to the voltage signal generation circuit 31 is in contact with the connection points H of all the conductor patterns P13 to P24 in the second conductor pattern group Gs (which constitutes the second conductor pattern group Gs). The probe pin 21 is connected to the ground potential. Thus, the voltage signal Sv is supplied (applied) between each conductor pattern P in the first conductor pattern group Gf and each conductor pattern P in the second conductor pattern group Gs via each probe pin 21. .

In this case, as described above, all the conductor patterns P in the first conductor pattern group Gf are connected to the inspection signal generation unit 12 via the probe pins 21 so that each conductor pattern P has the same potential (in this example, Is maintained at the potential of the voltage signal Sv), and all the conductor patterns P in the second conductor pattern group Gs are connected to the ground potential via the probe pins 21 so that each conductor pattern P has the same potential (in this example, the ground potential). ) Is maintained. Therefore, a large potential difference is caused by electronic components E to occur breakage is reliably prevented between the conductor patterns P in the first conductive pattern group Gf.

  Next, the control unit 15 causes the measurement unit 13 to measure the current flowing between the first conductor pattern group Gf and the second conductor pattern group Gs as the voltage signal Sv is supplied. Subsequently, the control unit 15 calculates a resistance value based on the current measurement value measured by the measurement unit 13 and the voltage value of the voltage signal Sv, and compares the resistance value with a predetermined reference value to determine the first value. The quality of the insulation state between the conductor pattern P in the conductor pattern group Gf and the conductor pattern P in the second conductor pattern group Gs is inspected. In this case, when the calculated resistance value is less than the reference value, the control unit 15 determines that the insulation state is defective, displays that fact on a display unit outside the figure, and ends the inspection process 50.

  On the other hand, when the calculated resistance value is equal to or greater than the reference value in the first insulation test, the control unit 15 determines that the insulation state is good, and then executes the second insulation test (step 55). In the second insulation test, the control unit 15 controls the voltage signal generation circuit 31 of the test signal generation unit 12 to generate the voltage signal Sv. Subsequently, the control unit 15 reads the conductor pattern group data Dg from the storage unit 14, and based on the conductor pattern group data Dg, one third conductor pattern group Gt (for example, among the third conductor pattern groups Gt) , A conductor pattern P (in this example, conductor patterns P1 to P8: see the same figure) constituting the third conductor pattern group Gt1: see FIG. 2, and another third conductor pattern group Gt (for example, A conductor pattern P (in this example, conductor patterns P9, P10: see the figure) constituting the three conductor pattern group Gt2: see the figure) is specified. Next, the control unit 15 controls the scanner unit 11 so that the probe pin 21 in contact with each connection point H of all the conductor patterns P1 to P8 in the third conductor pattern group Gt1 is supplied to the voltage signal generation circuit 31. The probe pins 21 that are in contact with the connection points H of all the conductor patterns P9 and P10 in the third conductor pattern group Gt2 other than the third conductor pattern group Gt1 are connected to the ground potential.

  As a result, the voltage signal Sv is supplied (applied) via the probe pins 21 between the conductor patterns P in the third conductor pattern group Gt1 and the conductor patterns P in the third conductor pattern group Gt2. The In this example, each conductor pattern P in the third conductor pattern group Gt2 when viewed from the third conductor pattern group Gt1 side, and the third conductor pattern group Gt1 when viewed from the third conductor pattern group Gtf2 side. Each of the conductor patterns P corresponds to “a conductor pattern in the first conductor pattern group and outside the third conductor pattern group” in the present invention.

  In this case, also in the second insulation inspection, all the conductor patterns P in the third conductor pattern group Gt1 are maintained at the same potential, and all the conductor patterns P in the third conductor pattern group Gt2 are maintained at the same potential. Therefore, the electronic component E connected between the conductor patterns P in the same third conductor pattern group Gt is surely prevented from being damaged in the same manner as the first insulation inspection described above.

  Subsequently, the control unit 15 causes the measurement unit 13 to measure the current that flows between the third conductor pattern group Gt1 and the third conductor pattern group Gt2 as the voltage signal Sv is supplied. Next, the control unit 15 calculates a resistance value based on the measured current value measured by the measuring unit 13 and the voltage value of the voltage signal Sv, compares the resistance value with a predetermined reference value, and compares the resistance value with a predetermined reference value. The quality of the insulation state between the conductor pattern P in the pattern group Gt1 and the conductor pattern P in the third conductor pattern group Gt2 (between the conductor patterns P supplying the voltage signal Sv) is inspected.

  Subsequently, in the same manner as described above, the control unit 15 is configured between the conductor pattern P in the third conductor pattern group Gt1 and the conductor pattern P in the third conductor pattern group Gt3, and in the third conductor pattern group Gt2. The quality inspection of the insulation state between the conductor pattern P and the conductor pattern P in the third conductor pattern group Gt3 is sequentially performed.

  Next, when the quality check of the insulation state between all the third conductor pattern groups Gt is completed, the control unit 15 checks the quality of the insulation state between the conductor patterns P in each third conductor pattern group Gt. To do. In this case, the control unit 15 controls the voltage signal generation circuit 31 so that the voltage signal Sv is a low voltage that does not break even when applied to the electronic component E (for example, a direct current of about 0.1 V to 0.5 V). Voltage). Subsequently, two conductor patterns P are selected from the conductor patterns P in one of the third conductor pattern groups Gt (for example, the third conductor pattern group Gt1), and the connection point H of one conductor pattern P is selected. Is connected to the voltage signal generation circuit 31, and the probe pin 21 in contact with the connection point H of the other conductor pattern P is connected to the ground potential. As a result, a low voltage signal Sv is supplied (applied) between the conductor patterns P via the probe pins 21.

  Next, the control unit 15 causes the measurement unit 13 to measure the current flowing between the two conductor patterns P as the voltage signal Sv is supplied. Subsequently, the control unit 15 calculates a resistance value based on the measured current value measured by the measuring unit 13 and the voltage value of the voltage signal Sv, compares the resistance value with a predetermined reference value, and compares both the conductors. The quality of the insulation state between the patterns P is inspected. Next, the control unit 15 sequentially performs the quality check of the insulation state for all combinations that select two of the conductor patterns P in the third conductor pattern group Gt1. Subsequently, the control unit 15 similarly performs a quality test of the insulation state between the conductor patterns P in the other third conductor pattern group Gt, and ends the quality test for all the third conductor pattern groups Gt. When it is done, the inspection result is displayed on a display unit outside the figure.

  In this case, the insulation state pass / fail inspection performed by supplying the voltage signal Sv to the two conductor patterns P is performed for all combinations of selecting two of the conductor patterns P in the third conductor pattern group Gt. In place of this method (brute force method) inspection, the bulk short method can also be used for inspection. In this bulk short test, one conductor pattern P is selected from each conductor pattern P in the third conductor pattern group Gt, and all other conductor patterns P except for the one are connected to each other. The voltage signal Sv is supplied between the one conductor pattern P and the other conductor patterns P connected to each other, and the resistance value between the one conductor pattern P and the other conductor patterns P is measured. Then, the insulation value is inspected by comparing the resistance value with the reference value. In this bulk short test, (number of all the conductor patterns P in the third conductor pattern group Gt-1) times of inspection is performed, so that all the conductor patterns P in the third conductor pattern group Gt are tested. Since the quality inspection of the insulation state can be performed, the inspection efficiency of the third insulation inspection can be improved.

Further, in place of the round-robin inspection and the bulk short inspection described above, the so-called multiple inspection can be performed. In this multiple inspection, each conductor pattern P in the third conductor pattern group Gt is divided into two groups (group A and group B), and each conductor pattern P is set to the same potential in each group. A voltage signal Sv is supplied to the conductor pattern P to inspect whether or not the insulation state between the conductor patterns P is good. Then, this inspection is performed a predetermined number of times while changing the contents of grouping (conductor patterns P belonging to each group and the number thereof) according to a predetermined rule. In this case, the number of inspections (number of groupings) required for inspecting whether the insulation state between all the conductor patterns P is good is as follows: a is log ₂ N or more defined by the integer closest to log ₂ N (e.g., 3 times at the time of N = 8). For this reason, in this multiple method inspection, the insulation state pass / fail inspection for all conductor patterns P in the third conductor pattern group Gt is performed with a smaller number of inspections than the brute force inspection and bulk short inspection. It can be performed.

  Next, the control unit 15 performs a third insulation test (step 56). In the third insulation test, the control unit 15 controls the voltage signal generation circuit 31 of the test signal generation unit 12 to generate the voltage signal Sv. Subsequently, the control unit 15 reads the conductor pattern group data Dg from the storage unit 14, and specifies the conductor patterns P13 to P24 constituting the second conductor pattern group Gs based on the conductor pattern group data Dg.

  Next, the control unit 15 controls the scanner unit 11 to select two conductor patterns P from each conductor pattern P in the second conductor pattern group Gs (which constitutes the second conductor pattern group Gs). The probe pin 21 in contact with the connection point H of one conductor pattern P is connected to the voltage signal generation circuit 31, and the probe pin 21 in contact with the connection point H of the other conductor pattern P is set to the ground potential. Connecting. As a result, the voltage signal Sv is supplied (applied) between the conductor patterns P via the probe pins 21.

  Subsequently, the control unit 15 causes the measurement unit 13 to measure the current flowing between the two conductor patterns P as the voltage signal Sv is supplied. Next, the control unit 15 calculates a resistance value based on the measured current value measured by the measuring unit 13 and the voltage value of the voltage signal Sv, compares the resistance value with a predetermined reference value, and forms both conductor patterns. The insulation state between P is checked for quality. Subsequently, the control unit 15 sequentially performs the quality check of the insulation state for all combinations that select two of the conductor patterns P in the second conductor pattern group Gs. Next, the control unit 15 displays the inspection result on a display unit (not shown) when the inspection of the insulation state between all the conductor patterns P is completed. In this case, in the same manner as in the second insulation inspection, the bulk short method or the multiple method can be used instead of the round-robin method.

  In addition, the control unit 15 performs a continuity test in parallel with at least one (either or both) of the second insulation test and the third insulation test described above (step 57). In this continuity test, the control unit 15 controls the current signal generation circuit 32 of the test signal generation unit 12 to generate the current signal Si. Subsequently, the control unit 15 performs a conductor pattern P in which neither the second insulation inspection nor the third insulation inspection is performed from among the respective conductor patterns P (conductor pattern P not subjected to both insulation inspections). Is selected as the conductor pattern P to be inspected. Next, the control unit 15 controls the scanner unit 11 to connect the probe pin 21 that is in contact with the connection point H at one end of the selected conductor pattern P to the current signal generation circuit 32 and also to the conductor pattern P. The probe pin 21 that is in contact with the connection point H at the other end is connected to the ground potential. Thereby, the current signal Si is supplied to the conductor pattern P.

  Subsequently, the control unit 15 causes the measurement unit 13 to measure a voltage generated between both end portions (between both connection points H and H) of the conductor pattern P to be inspected for continuity as the current signal Si is supplied. Next, the control unit 15 calculates a resistance value based on the measured voltage value measured by the measuring unit 13 and the current value of the current signal Si, compares the resistance value with a predetermined reference value, and compares the resistance value with the conductor pattern. Check the conductive state of P. Subsequently, the control unit 15 changes the conductor pattern P to be a continuity test to another conductor pattern P and sequentially executes the continuity test.

Next, the control unit 15 ends the inspection process 50 when all of the second insulation test, the third insulation test, and the continuity test are completed. In this case, in the circuit board inspection apparatus 1 and the circuit board inspection method, as described above, at least one of the second insulation inspection and the third insulation inspection and the continuity inspection are performed in parallel. Therefore, in the circuit board inspection apparatus 1 and the circuit board inspection method, the second insulation is compared with the conventional circuit board inspection apparatus that performs either one of the insulation inspection and the continuity inspection and then performs the other of the two inspections. The inspection time as a whole can be shortened by the time required to perform at least one of the inspection and the third insulation inspection in parallel with the continuity inspection.

As described above, in the circuit board inspection apparatus 1 and the circuit board inspection method, when the insulation state is determined to be good in the first insulation inspection, the second insulation inspection and the third insulation inspection are performed, and the second insulation inspection is performed. The continuity test for inspecting the continuity state of the conductor pattern P on which neither of the third insulation test is performed is performed in parallel with at least one of the second insulation test and the third insulation test. For this reason, according to the circuit board inspection apparatus 1 and the circuit board inspection method, compared with the conventional circuit board inspection apparatus that executes the other of the two inspections after performing one of the insulation inspection and the continuity inspection, The inspection time as a whole can be reduced by the amount of time for performing at least one of the 2 insulation inspection and the third insulation inspection and the continuity inspection in parallel. Therefore, according to the circuit board inspection apparatus 1 and the circuit board inspection method, it is possible to sufficiently improve the inspection efficiency when inspecting a circuit board having a large number of conductor patterns P.

  In the circuit board inspection apparatus 1 and the circuit board inspection method, the conductor patterns P connected to each other via the electronic component E among the conductor patterns P in the first conductor pattern group Gf in the second insulation inspection. The conductor patterns P in the third conductor pattern group Gt configured by the same electric potential as each other while being in the first conductor pattern group Gf and between the other conductor patterns P outside the third conductor pattern group Gt The insulation state between the conductor patterns P to which the voltage signal Sv is supplied is inspected based on the current value generated when the voltage signal Sv is supplied. For this reason, according to the circuit board inspection apparatus 1 and the circuit board inspection method, it is possible to reliably damage the electronic component E due to potential difference occurring between the conductor patterns P in the same third conductor pattern group Gt. It can be avoided.

  Further, according to the circuit board inspection apparatus 1 and the circuit board inspection method, it is possible to identify which conductor pattern P by specifying each conductor pattern group Gf, Gs, Gt based on the connection data Dc stored in the storage unit 14. As a result, it is possible to eliminate the work of specifying the conductor pattern groups Gf, Gs, and Gt by checking whether they are connected by the electronic component E. As a result, the inspection efficiency can be improved accordingly.

  The present invention is not limited to the configuration and method described above. For example, the third insulation test is performed after the second insulation test is performed, and the continuity test is performed in parallel with at least one of these two insulation tests. However, after the third insulation test is performed, the second insulation test is performed. It is also possible to adopt a configuration and a method for performing two insulation tests and performing a continuity test in parallel with at least one of these two insulation tests. It is also possible to employ a configuration and method in which the second insulation test and the third insulation test are executed in parallel, and further, the continuity test is executed in parallel with both insulation tests. Further, in addition to the first insulation test, the second insulation test, the third insulation test, and the continuity test described above, the present invention can be applied to a circuit board inspection apparatus and a circuit board inspection method that perform a quality inspection of the electronic component E.

  Further, in the second insulation inspection, each conductor pattern P in each third conductor pattern group Gt has the same potential and is insulated using a high voltage signal Sv (in the above example, a DC voltage of about 10V to 1000V). Between the conductor patterns P in each third conductor pattern group Gt using a low voltage signal Sv (in the above example, a DC voltage of about 0.1 V to 0.5 V). As described above with respect to the example of performing the pass / fail inspection of the insulation state, for all the conductor patterns P in the first conductor pattern group Gf (that is, all the conductor patterns P in all the third conductor pattern groups Gt), It is also possible to adopt a configuration and a method for performing a quality inspection of an insulation state by any one of a round-robin method, a bulk short method, and a multiple method using a low voltage signal Sv.

  Further, the configuration and the method for executing the inspection on the circuit board 100 having the conductor pattern P formed on one surface have been described above, but the circuit board having the pair of probe units 3 and having the conductor pattern P formed on both surfaces is described above. It can also be applied to configurations and methods for performing inspections. Further, the present invention can also be applied to a configuration and method for inspecting a multilayer circuit board or a component-embedded circuit board in which an electronic component is built in the board. Further, the configuration example in which the probe unit 3 is provided and the probe pin 21 is brought into contact with each conductor pattern P at the same time has been described above. The present invention can also be applied to a flying probe type circuit board inspection apparatus in which probe pins are brought into contact only with the pattern P. In addition, the example in which the inspection is performed on the circuit board 100 having the three third conductor pattern groups Gt and the twelve individual conductor patterns P has been described above. Needless to say, the same effect as described above can be realized when the inspection is performed on various circuit boards in which the number of the conductor patterns P is different from that of the circuit board 100.

DESCRIPTION OF SYMBOLS 1 Circuit board inspection apparatus 5 Inspection part 14 Memory | storage part 15 Control part 100 Circuit board Dc Connection data E1-E4 Electronic component Gf 1st conductor pattern group Gs 2nd conductor pattern group Gt1-Gt3 3rd conductor pattern group P1-P24 Conductor pattern Si current signal Sv voltage signal

Claims (4)

A circuit board inspection apparatus provided with an inspection unit for inspecting an insulation state between each conductor pattern and a conduction state of each conductor pattern in a circuit board having a plurality of conductor patterns and an electronic component connected to the conductor pattern. ,
The inspection unit is configured by the conductor pattern in which the conductor patterns in the first conductor pattern group configured by the conductor pattern to which the electronic component is connected are set to the same potential and the electronic component is not connected. Insulating state between the conductor pattern in the first conductor pattern group and the conductor pattern in the second conductor pattern group is inspected while keeping the conductor patterns in the second conductor pattern group to have the same potential. When the first insulation inspection is performed and the insulation state is determined to be good in the first insulation inspection,
While performing the 2nd insulation test which test | inspects the insulation state between the said conductor patterns in the said 1st conductor pattern group, and the 3rd insulation test which test | inspects the insulation state between the said conductor patterns in the said 2nd conductor pattern group, A circuit board inspection apparatus that performs a continuity test for inspecting a continuity state of the conductor pattern in which neither the second insulation test nor the third insulation test is performed in parallel with at least one of the both insulation tests.   In the second insulation inspection, the inspection unit includes a conductor pattern connected to each other via the electronic component among the conductor patterns in the first conductor pattern group. Between the conductor pattern in the third conductor pattern group and the conductor pattern in the first conductor pattern group and outside the third conductor pattern group. The circuit board inspection apparatus according to claim 1, wherein the circuit board inspection apparatus inspects an insulation state.   A storage unit that stores connection data capable of specifying the conductor pattern to which the electronic component is connected; and a processing unit that executes a specifying process of specifying each conductor pattern group based on the connection data. The circuit board inspection apparatus according to claim 1 or 2. A circuit board inspection method for inspecting an insulation state between each conductor pattern and a conduction state of each conductor pattern in a circuit board having a plurality of conductor patterns and an electronic component connected to the conductor pattern,
The conductor pattern in the first conductor pattern group composed of the conductor pattern to which the electronic component is connected has the same potential as each other, and the second conductor is composed of the conductor pattern to which the electronic component is not connected. A first insulation test for inspecting an insulation state between the conductor pattern in the first conductor pattern group and the conductor pattern in the second conductor pattern group while keeping the conductor patterns in the pattern group at the same potential. And when the insulation state is determined to be good in the first insulation inspection,
While performing the 2nd insulation test which test | inspects the insulation state between the said conductor patterns in the said 1st conductor pattern group, and the 3rd insulation test which test | inspects the insulation state between the said conductor patterns in the said 2nd conductor pattern group, A circuit board inspection method for executing a continuity test for inspecting a continuity state of the conductor pattern in which neither the second insulation test nor the third insulation test is performed in parallel with at least one of the both insulation tests.

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