JP5430892B2 - Circuit board inspection apparatus and circuit board inspection method - Google Patents

Description

  The present invention relates to a circuit board inspection apparatus and a circuit board inspection method for inspecting an insulation state between conductor patterns of a circuit board and a conduction state of each conductor pattern.

  As this type of circuit board inspection apparatus, a circuit board inspection apparatus disclosed in Japanese Patent Laid-Open No. 2001-66351 is known. This circuit board inspection apparatus includes a fixture and a connection measurement unit, and is configured to be able to perform a continuity inspection of each conductor pattern (land pattern) on the circuit board and an insulation inspection between the conductor patterns. In this case, the fixture is a gap between a lower fixture in which a plurality of probe pins corresponding to each conductor pattern of the circuit board are formed to protrude on the upper surface and each electronic component mounted on the other surface of the circuit board. Correspondingly, a plurality of contact pins are formed on the lower surface of the contact pin, and the upper fixture is moved up and down by an elevating mechanism. In this circuit board inspection apparatus, the circuit board is sandwiched between the lower fixture and the upper fixture so that the probe pin of the lower fixture is brought into contact with each conductor pattern and a signal is supplied to a predetermined probe pin. Thus, based on a signal input by the connection measuring unit via the probe pin, an insulation inspection between the conductor patterns and a conduction inspection of each conductor pattern are performed. In this case, in this type of circuit board inspection apparatus, one of the insulation inspection and the continuity inspection is performed, and then the other of the both inspections is performed.

On the other hand, a non-patent document 1 discloses a bulk short-type insulation inspection method as an insulation inspection method capable of performing an inspection of an insulation state between conductor patterns on a circuit board having a large number of conductor patterns with a small number of inspections. Yes. In this bulk short insulation test method, one conductor pattern is selected from each conductor pattern (net) on the circuit board, and a conductor pattern group (net) composed of all other conductor patterns except the one. In a state where the conductor patterns in the assembly are connected to each other, a voltage signal is supplied between the one conductor pattern and the conductor pattern group, and between the one conductor pattern and each conductor pattern of the conductor pattern group. The resistance value is measured, and the insulation value is inspected by comparing the resistance value with a reference value. For this reason, in this bulk short type insulation inspection method, whether or not the insulation state between other conductor patterns is favorable for all conductor patterns by performing (number of conductor patterns-1) times. As a result, the inspection efficiency can be improved.
JP 2001-66351 A (page 3-5, FIG. 1) Editor-in-Chief Akihiko Hara, “Inspection Technology and Equipment Handbook for High-Density Mounting”, International Urban Communication Center Editorial Office, September 1, 2001, p. 87

  However, the conventional circuit board inspection apparatus including the circuit board inspection apparatus described above has the following problems. That is, in the conventional circuit board inspection apparatus, after performing one of the insulation inspection and the continuity inspection, the other of the two inspections is performed. For this reason, in the conventional circuit board inspection apparatus, when inspecting a circuit board having a large number of conductor patterns, the insulation inspection is performed by the above-described bulk short-type insulation inspection method, thereby shortening the insulation inspection time. However, there is a problem that it is difficult to further improve the inspection efficiency as a result of requiring a lot of time in the continuity inspection performed before or after the insulation inspection.

  The present invention has been made in view of the problems to be improved, and it is a main object of the present invention to provide a circuit board inspection apparatus and a circuit board inspection method capable of improving the inspection efficiency for a circuit board having a large number of conductor patterns. And

In order to achieve the above object, the circuit board inspection apparatus according to claim 1 is characterized in that the insulation state between the conductor patterns and the conductors are based on the physical quantity generated when the inspection signal is supplied to the plurality of conductor patterns on the circuit board. A circuit board inspection apparatus including an inspection unit for inspecting a conductive state of a pattern, wherein the inspection unit connects the conductor patterns in a first conductor pattern group configured by a part of the plurality of conductor patterns to each other. In addition, with the conductor patterns in the second conductor pattern group constituted by the conductor patterns outside the first conductor pattern group being connected to each other, the insulation test as the inspection signal between the two conductor pattern groups The conductor pattern in the first conductor pattern group and the conductor pattern in the second conductor pattern group based on a physical quantity generated when a signal is supplied. When the insulating state first running insulation inspection for inspecting the insulation state in the first insulation test between the emission is determined to good, as the object of continuity testing from within one of the two conductive pattern group A continuity test for inspecting the continuity state of the conductor pattern to be continuity-inspected based on a physical quantity generated at both ends of the conductor pattern when supplying a continuity test signal as the inspection signal to the selected conductor pattern; and within the other conductor pattern group of all other of the conductor pattern except the one conductor pattern and the conductive inspected conductor pattern from the other of the two conductor patterns groups were selected for the second insulation test in all states in which the connecting the respective conductive patterns to each other in the third conductive pattern group composed of at least comprises conductive pattern conductor patterns contained in this Conductor pattern and the third conductive pattern of the second insulation test object based on the physical quantity generated when supplying the insulation test signal between the second insulating inspected conductors pattern and the third conductive pattern group A second insulation inspection for inspecting the insulation state between the conductor patterns in the group is performed in parallel.

The circuit board inspection apparatus according to claim 2 is the circuit board inspection apparatus according to claim 1, wherein the inspection unit is connected to the conductor pattern selected as the second insulation inspection target in the second insulation inspection. inspecting an insulation state between the selected conductor pattern as the conductor pattern and the second insulating inspected in said third conductive pattern group composed of all the other of the conductor pattern excluding the inspected conductive pattern To do.

The circuit board inspection apparatus according to claim 3 is the circuit board inspection apparatus according to claim 1, wherein the inspection unit is the second insulation inspection target in the other conductor pattern group in the second insulation inspection. only all of the conductor pattern other than the selected conductor pattern for inspecting an insulation state between the selected conductor pattern as the conductor pattern and the second insulating inspected in constituted the third conductive pattern group as.

  Further, the circuit board inspection apparatus according to claim 4 includes a storage unit that stores conductor pattern data capable of specifying the number of the conductor patterns in the circuit board inspection apparatus according to any one of claims 1 to 3, The inspection unit specifies each conductor pattern group based on the conductor pattern data, and selects the conductor pattern to be inspected for continuity and the conductor pattern to be inspected for second insulation.

The circuit board inspection method according to claim 5 is an insulating state between the conductor patterns and a conduction state of the conductor patterns based on a physical quantity that is generated in response to the supply of the inspection signal to the plurality of conductor patterns on the circuit board. A circuit board inspection method for inspecting a circuit board, wherein the conductor patterns in a first conductor pattern group constituted by a part of the plurality of conductor patterns are connected to each other and the conductor patterns outside the first conductor pattern group are connected to each other. Based on a physical quantity generated when an insulation inspection signal as the inspection signal is supplied between the two conductor pattern groups in a state where the conductor patterns in the second conductor pattern group to be configured are connected to each other. the first insulating inspection for inspecting an insulation state between the corresponding conductor pattern of the and the conductor pattern of the conductive pattern in the group in the second conductive pattern group When executed by the insulating state in the first insulation test is determined to good, the continuity test signal as one the inspection signal to the selected conductive pattern as a target of the continuity test from among the two conductive pattern group A continuity test for inspecting the continuity state of the conductor pattern to be inspected on the basis of physical quantities generated at both ends of the conductor pattern when the first and second conductor patterns are supplied; all conductor patterns included in the other conductor patterns within a group of all other of the conductor pattern excluding the conductor pattern of the selected one of the conductor patterns the conducting test object consists of at least comprises conductive pattern as that the third conductor pattern the second insulating inspected conductors in a state where the connecting the respective conductive patterns to each other in the group pattern and the third The insulation state between the conductor pattern of the second insulation inspection target and the conductor pattern in the third conductor pattern group based on the physical quantity generated when the insulation inspection signal is supplied to the body pattern group. The second insulation inspection to be inspected is executed in parallel.

The circuit board inspection apparatus according to claim 1 and the circuit board inspection method according to claim 5 inspect an insulation state between a conductor pattern in the first conductor pattern group and a conductor pattern in the second conductor pattern group. When it is determined that the insulation state is good in the first insulation test, the continuity test for inspecting the continuity state of one conductor test target selected from one of the two conductor pattern groups, and the other of the two conductor pattern groups Including at least all the conductor patterns included in the other conductor pattern group of all the other conductor patterns except the one conductor pattern to be inspected for the second insulation and the conductor pattern to be inspected for continuity selected from Parallel to the second insulation test for inspecting the insulation state between the conductor pattern in the third conductor pattern group constituted by the conductor patterns and the conductor pattern to be subjected to the second insulation test To run Te. Therefore, according to the circuit board inspection apparatus and the circuit board inspection method, the continuity inspection and the first inspection are performed in comparison with the conventional circuit board inspection apparatus that performs one of the two inspections after performing one of the insulation inspection and the continuity inspection. The inspection time as a whole can be shortened by the time for performing the two insulation inspections in parallel. Therefore, according to this circuit board inspection apparatus and circuit board inspection method, it is possible to sufficiently improve the inspection efficiency when inspecting a circuit board having a large number of conductor patterns.

In the circuit board inspection apparatus according to claim 2, the inspection unit uses all the conductor patterns other than the conductor pattern selected as the second insulation inspection target and the conductor pattern to be subjected to the continuity inspection in the second insulation inspection. The insulation state between the conductor pattern in the third conductor pattern group to be configured and the conductor pattern selected as the second insulation inspection target is inspected. For this reason, according to this circuit board inspection apparatus, the same quality result as the quality result by the bulk short-type insulation test can be obtained in the second insulation test.

The circuit board inspection apparatus according to claim 3, wherein the inspection unit performs the second insulation in the other conductor pattern group (the conductor pattern group to which the conductor pattern selected as the second insulation inspection target belongs) in the second insulation inspection. inspecting the insulation state between the conductor pattern and the selected conductive pattern as a second insulating inspected third conductive pattern in the group constituted only with all of the conductor pattern other than the conductor pattern selected as the inspection target. For this reason, according to this circuit board inspection apparatus, for example, the continuity test is performed in a state where all the conductor patterns in the conductor pattern group to which the conductor pattern to be subjected to the second insulation inspection does not belong are connected to each other (in series connection). By performing in this way, the conductive state of all the conductor patterns can be inspected with a small number of times.

  In the circuit board inspection apparatus according to claim 4, the inspection unit specifies each conductor pattern group based on the conductor pattern data stored in the storage unit, and the conductor pattern to be subjected to continuity inspection and the second insulation inspection target. Select the conductor pattern. For this reason, according to this circuit board inspection apparatus, it is possible to eliminate the need for these specific work and selection work by the user. Efficiency can be further improved.

  The best mode of a circuit board inspection apparatus and a circuit board inspection method according to the present invention will be described below with reference to the accompanying drawings.

  First, the configuration of the circuit board inspection apparatus 1 will be described. A circuit board inspection apparatus 1 shown in FIG. 1 is an example of a circuit board inspection apparatus according to the present invention. For example, a plurality of conductor patterns P1 to P10 formed on one surface (see FIG. 2; The circuit board 100 having the “conductor pattern P”) is configured to be able to inspect the insulation state between the conductor patterns P and the conduction state of each conductor pattern P according to the circuit board inspection method according to the present invention. Specifically, as shown in FIG. 1, the circuit board inspection apparatus 1 includes a substrate holding unit 2, a probe unit 3, a moving mechanism 4, and an inspection unit 5.

  The substrate holding unit 2 includes a holding plate and a clamp mechanism (not shown) that is attached to the holding plate and sandwiches and fixes the end portion of the circuit board 100 so as to hold the circuit board 100. ing. The probe unit 3 includes a plurality of probe pins 21 and is configured as a jig. In this case, the probe unit 3 defines the number and arrangement pattern of the probe pins 21 according to the position of the connection point H (see FIG. 2) for connecting the electrical parts provided on each conductor pattern P of the circuit board 100. Has been. The moving mechanism 4 executes probing by moving the probe unit 3 in the vertical direction under the control of the control unit 15.

  As shown in FIG. 1, the inspection unit 5 includes a scanner unit 11, an inspection signal generation unit 12, a measurement unit 13, a storage unit 14, and a control unit 15. The scanner unit 11 includes a plurality of switches (not shown), and switches each switch to an on state or an off state according to the control of the control unit 15, whereby the probe pin 21 and the inspection signal in the probe unit 3 are switched. Connection / disconnection (connection and disconnection) with the generation unit 12 and connection / disconnection between the probe pin 21 and the measurement unit 13 are performed. The inspection signal generation unit 12 includes a voltage signal generation circuit 31 and a current signal generation circuit 32. In this case, the voltage signal generation circuit 31 generates a voltage signal S1 (inspection signal for insulation in the present invention, as an example, a DC voltage) as the inspection signal S under the control of the control unit 15. The current signal generation circuit 32 generates a current signal S2 (a continuity test signal according to the present invention, which is a direct current as an example) under the control of the control unit 15.

  The measuring unit 13 measures a current (an example of a physical quantity in the present invention) that flows between the conductor patterns P with the supply of the voltage signal S1. Further, the measuring unit 13 measures a voltage (an example of a physical quantity in the present invention) generated between both ends of the conductor pattern P (between both connection points H and H) with the supply of the current signal S2. The storage unit 14 stores conductor pattern data D1 used in the inspection process 50 (see FIG. 3) executed by the control unit 15. Further, the storage unit 14 stores the measurement value measured by the measurement unit 13 and the result of the inspection executed by the control unit 15. In this case, the conductor pattern data D1 includes the number of conductor patterns P on the circuit board 100, information on the position of the connection point H provided on each conductor pattern P, and the like.

  The control unit 15 controls each component constituting the moving mechanism 4 and the inspection unit 5 according to an operation signal output from an operation unit (not shown). Specifically, the control unit 15 controls the movement of the probe unit 3 by the moving mechanism 4. In addition, the control unit 15 controls the generation of the inspection signal S (the voltage signal S1 and the current signal S2) by the inspection signal generation unit 12 and also controls the connection / disconnection processing by the scanner unit 11 to thereby control the circuit board 100. An inspection signal S is supplied to the conductor pattern P. In the inspection process 50, the control unit 15 performs a first insulation test, a continuity test, and a second insulation test, which will be described in detail later.

  Next, according to the circuit board inspection method according to the present invention using the circuit board inspection apparatus 1, a method for inspecting the insulation state between the conductor patterns P and the conduction state of the conductor patterns P in the circuit board 100, and The operation of the circuit board inspection apparatus 1 will be described with reference to the drawings.

  First, the circuit board 100 to be inspected is placed on a holding plate (not shown) in the board holding unit 2, and then the end of the circuit board 100 is sandwiched by a clamp mechanism (not shown) of the board holding unit 2. By fixing, the circuit board 100 is held by the board holding part 2. Subsequently, an inspection start operation is performed using an operation unit (not shown). At this time, the control unit 15 controls the moving mechanism 4 according to the operation signal output from the operation unit to move the probe unit 3 downward. Thereby, the tip of each probe pin 21 of the probe unit 3 is brought into contact (probing) with each connection point H of each conductor pattern P.

  Next, the control unit 15 executes the inspection process 50 shown in FIG. In this inspection process 50, the control unit 15 reads the conductor pattern data D1 from the storage unit 14 (step 51). Subsequently, the control unit 15 performs the first insulation test only once (step 52). In the first insulation test, the control unit 15 specifies the number of conductor patterns P on the circuit board 100 and the position of the connection point H provided on each conductor pattern P based on the conductor pattern data D1. Next, the control unit 15 assigns each conductor pattern P to the first conductor pattern group Gf and the second conductor pattern group Gs (see FIG. 2; hereinafter, when the first conductor pattern group Gf and the second conductor pattern group Gs are not distinguished from each other. (Also referred to as “conductor pattern group G”). In this case, for example, as shown in the figure, the control unit 15 sets the conductor pattern group G composed of the conductor patterns P1 to P5 (a part of each conductor pattern P) as the first conductor pattern group Gf, A conductor pattern group G composed of P6 to P10 (conductor pattern P outside the first conductor pattern group Gf group) is defined as a second conductor pattern group Gs.

  Subsequently, the control unit 15 controls the voltage signal generation circuit 31 of the inspection signal generation unit 12 to generate the voltage signal S1. Next, the control unit 15 controls the scanner unit 11 to connect the probe pin 21 in contact with each connection point H of the conductor pattern P in the first conductor pattern group Gf and the voltage signal generation circuit 31. In addition, the control unit 15 controls the scanner unit 11 to connect the probe pin 21 that is in contact with each connection point H of the conductor pattern P in the second conductor pattern group Gs to the ground potential. As a result, the conductor patterns P in the first conductor pattern group Gf group are connected to each other, and the conductor patterns P in the second conductor pattern group Gs are connected to each other. Is supplied (applied) with a voltage signal S1.

  Subsequently, the control unit 15 causes the measurement unit 13 to measure the current flowing between the first conductor pattern group Gf and the second conductor pattern group Gs as the voltage signal S1 is supplied. Next, the control unit 15 calculates a resistance value based on the current measurement value measured by the measurement unit 13 and the voltage value of the voltage signal S1, and compares the resistance value with a predetermined reference value to compare the first conductor. The insulation state between the conductor pattern P in the pattern group Gf and the conductor pattern P in the second conductor pattern group Gs is inspected.

  Subsequently, the control unit 15 determines whether the inspected insulation state is good or not in the first insulation inspection described above (step 53). In this case, in the first inspection, the control unit 15 has a poor insulation state between the conductor pattern P in the first conductor pattern group Gf and the conductor pattern P in the second conductor pattern group Gs (not good). ) Is displayed on the display unit (not shown), and the inspection process 50 is terminated.

  On the other hand, when the control unit 15 determines in step 53 that the insulation state between the conductor pattern P in the first conductor pattern group Gf and the conductor pattern P in the second conductor pattern group Gs is good, the continuity is established. An inspection is executed (step 54). In this continuity test, the control unit 15 controls the current signal generation circuit 32 of the test signal generation unit 12 to generate the current signal S2. Next, based on the conductor pattern data D1, the control unit 15 selects one of the two conductor pattern groups G (for example, the second conductor pattern group Gs) as a continuity test target as shown in FIG. A conductor pattern P (for example, conductor pattern P10: hereinafter also referred to as “continuity inspection target pattern Pc”) is selected. Subsequently, the control unit 15 controls the scanner unit 11 to connect the probe pin 21 in contact with the connection point H at one end of the selected continuity test target pattern Pc and the current signal generation circuit 32, and The probe pin 21 that is in contact with the connection point H at the other end of the continuity test target pattern Pc is connected to the ground potential. Thereby, the current signal S2 is supplied to the continuity test target pattern Pc.

  Next, the control unit 15 causes the measurement unit 13 to measure a voltage generated at both ends (between both connection points H and H) of the continuity test target pattern Pc as the current signal S2 is supplied. Subsequently, the control unit 15 calculates a resistance value based on the measured value of the voltage measured by the measuring unit 13 and the current value of the current signal S2, and compares the resistance value with a predetermined reference value to check the continuity. The conductive state of the target pattern Pc is inspected.

  In addition, the control unit 15 performs a second insulation test in parallel with the above-described continuity test (step 55). In the second insulation inspection, the control unit 15 performs the second operation from the other of the two conductor pattern groups G (in this example, the first conductor pattern group Gf) based on the conductor pattern data D1, as shown in FIG. One conductor pattern P (for example, conductor pattern P1: hereinafter also referred to as “second insulation inspection target pattern Pi”) as an object of insulation inspection is selected. Next, the control unit 15, based on the conductor pattern data D 1, as shown in the figure, the selected second insulation inspection target pattern Pi (in this example, the conductor pattern P 1) and the above-described conduction inspection target pattern Pc (in this example) Then, all of the other conductor patterns P except for the conductor pattern P10) (“a conductor pattern that is a part or all of another conductor pattern and includes all conductor patterns in the other conductor pattern group” in the present invention). In this example, the conductor pattern group G composed of the conductor patterns P2 to P9) is specified as the third conductor pattern group Gt.

  Subsequently, the control unit 15 controls the voltage signal generation circuit 31 of the inspection signal generation unit 12 to generate the voltage signal S1. Next, the control unit 15 controls the scanner unit 11 to connect the probe pin 21 in contact with the connection point H of the second insulation inspection target pattern Pi and the voltage signal generation circuit 31. In addition, the control unit 15 controls the scanner unit 11 to connect the probe pin 21 that is in contact with each connection point H of the conductor patterns P2 to P9 in the third conductor pattern group Gt to the ground potential. Thereby, in a state where the conductor patterns P in the third conductor pattern group Gt are connected to each other, the second insulation inspection target pattern Pi and the third conductor pattern group Gt (specifically, each conductor in the third conductor pattern group Gt). A voltage signal S1 is supplied (applied) to the pattern P).

  Subsequently, the control unit 15 causes the measurement unit 13 to measure the current flowing between the second insulation inspection target pattern Pi and the third conductor pattern group Gt as the voltage signal S1 is supplied. Next, the control unit 15 calculates a resistance value based on the measured current value measured by the measuring unit 13 and the voltage value of the voltage signal S1, compares the resistance value with a predetermined reference value, and calculates the second value. The insulation state between the insulation inspection target pattern Pi and the conductor pattern P in the third conductor pattern group Gt is inspected.

  Subsequently, the control unit 15 changes the continuity test target pattern Pc to another conductor pattern P and sequentially executes the above-described continuity test, and in parallel with this, the second insulation test target pattern Pi is changed to another conductor pattern P. The pattern is changed to the pattern P and the above-described second insulation inspection is sequentially executed. Specifically, as shown in FIG. 4, for example, the control unit 15 sequentially selects the conductor pattern P in the order of the conductor pattern P9, the conductor pattern P8,... As the second insulation inspection target pattern Pi, the conductor pattern P is sequentially selected in the order of the conductor pattern P2, the conductor pattern P3,..., The conductor pattern P10, and the second insulation inspection is executed. In this case, as shown in the figure, when the continuity test target pattern Pc is selected from the second conductor pattern group Gs, the control unit 15 selects the second insulation test target pattern Pi from the first conductor pattern group Gf. When the continuity test target pattern Pc is selected from the first conductor pattern group Gf, the second insulation test target pattern Pi is selected from the second conductor pattern group Gs. That is, the control unit 15 selects the continuity test target pattern Pc and the second insulation test target pattern Pi from different conductor pattern groups G.

  Here, in a conventionally known bulk short type insulation inspection method, one conductor pattern P selected from each conductor pattern P on the circuit board 100 and all other conductor patterns P except for one conductor pattern P. Therefore, a continuity test cannot be performed in parallel with this test. On the other hand, in the circuit board inspection apparatus 1 and the circuit board inspection method, the insulation state between the conductor pattern P in the first conductor pattern group Gf and the conductor pattern P in the second conductor pattern group Gs in the first insulation inspection. The second insulation test is performed when the condition is good. For this reason, at the time of execution of the second insulation test, it is already confirmed that the insulation state between the continuity test target pattern Pc selected from the different conductor pattern groups G and the second insulation test target pattern Pi is good. Even if the continuity test target pattern Pc is removed from the third conductor pattern group Gt as described above, the same quality result as the quality result by the bulk short-type insulation test can be obtained in the second insulation test. . In this case, it is possible to inspect whether or not the insulation state between other conductor patterns is good for all the conductor patterns with a small number of times in the same manner as the bulk short-circuit type insulation inspection. Therefore, in this circuit board inspection apparatus 1 and the circuit board inspection method, the continuity inspection for the continuity inspection target pattern Pc excluded from the third conductor pattern group Gt can be performed in parallel with the second insulation inspection. The inspection time as a whole can be shortened by the time required to perform the continuity inspection and the second insulation inspection in parallel.

  Next, when the continuity test and the second insulation test for all the conductor patterns P are completed, the control unit 15 determines whether the continuity state inspected in the continuity test is good and displays the result on a display unit outside the drawing. In addition, the quality of the insulation state inspected in the second insulation inspection is determined, the result is displayed on the display unit outside the figure, and the inspection process 50 is completed. In this case, when the conductive state is determined for each conductor pattern P and the conductive state is determined to be defective, the inspection process 50 is terminated, or the insulating state is determined for each conductor pattern P. It is also possible to employ a configuration and a method for terminating the inspection process 50 when it is determined that the defect is defective.

  As described above, in the circuit board inspection apparatus 1 and the circuit board inspection method, the insulation state between the conductor pattern P in the first conductor pattern group Gf and the conductor pattern P in the second conductor pattern group Gs is inspected. A continuity test for inspecting the continuity state of one continuity test target pattern Pc selected from one of the two conductor pattern groups Gf and Gs when one insulation test is executed only once and it is determined that the insulation state is good; A part of or all of the other conductor patterns P excluding one second insulation inspection target pattern Pi selected from the other of the conductor pattern groups Gf and Gs and the continuity inspection target pattern Pc, and the second insulation inspection The second insulation test and the conductor pattern P in the third conductor pattern group Gt constituted by the conductor patterns P including all the conductor patterns P in the conductor pattern group G to which the target pattern Pi belongs. The second insulation test and parallel the run to inspect an insulation state between the target pattern Pi. For this reason, according to the circuit board inspection apparatus 1 and the circuit board inspection method, the continuity inspection and the conventional circuit board inspection apparatus that perform one of the two inspections after performing one of the insulation inspection and the continuity inspection. The inspection time as a whole can be shortened by the time for performing the second insulation inspection in parallel. Therefore, according to the circuit board inspection apparatus 1 and the circuit board inspection method, it is possible to sufficiently improve the inspection efficiency when inspecting a circuit board having a large number of conductor patterns P.

  In the circuit board inspection apparatus 1 and the circuit board inspection method, in the second insulation inspection, the third conductor constituted by all of the conductor patterns P other than the second insulation inspection target pattern Pi and the continuity inspection target pattern Pc. The insulation state between the conductor pattern P in the pattern group Gt and the second insulation inspection target pattern Pi is inspected. Therefore, according to the circuit board inspection apparatus 1 and the circuit board inspection method, the same quality result as the quality result by the bulk short-type insulation test can be obtained in the second insulation test.

  Further, in this circuit board inspection apparatus 1, the control unit 15 specifies each of the conductor pattern groups Gf, Gs, Gt based on the conductor pattern data D1 stored in the storage unit 14, and also conducts the continuity inspection target pattern Pc and the first pattern. 2 Select an insulation inspection target pattern Pi. For this reason, according to this circuit board inspection apparatus 1, as a result of eliminating the need for these specific work and selection work by the user, compared with a circuit board inspection apparatus that does not have such a function, Inspection efficiency can be further improved.

  The present invention is not limited to the above-described configuration and method (hereinafter, the above-described configuration and method are also referred to as “first configuration and method”). For example, the conductor pattern group G composed of all of the conductor patterns P other than the second insulation inspection target pattern Pi and the continuity inspection target pattern Pc, that is, each conductor pattern P and the second conductor in the first conductor pattern group Gf. Although the example in which the conductor pattern group G configured by both the conductor patterns P in the pattern group Gs is specified as the third conductor pattern group Gt has been described above, the conductor pattern group G to which the second insulation inspection target pattern Pi belongs. Adopting a configuration and method (hereinafter, this configuration and method are also referred to as “second configuration and method”) that specify a conductor pattern group G composed only of the inner conductor pattern P as the third conductor pattern group Gt. You can also.

  In the second configuration and method, as shown in FIG. 5, the control unit 15 performs the second insulation inspection in the second insulation inspection, and the conductor pattern group to which the selected second insulation inspection target pattern Pi (for example, the conductor pattern P1) belongs. G (the other conductor pattern group in the present invention, and in this example, the first conductor pattern group Gf), among all the conductor patterns P except for the second insulation inspection target pattern Pi ( In this example, the conductor pattern group G composed only of the conductor patterns P2 to P5) is specified as the third conductor pattern group Gt. Next, the control unit 15 controls the inspection signal generation unit 12 and the scanner unit 11 in the same manner as in the first configuration and method described above, thereby controlling the second insulation inspection target pattern Pi and the third conductor pattern group Gt. In addition, the voltage signal S1 is supplied during the period, and the insulation state between the second insulation inspection target pattern Pi and the conductor pattern P in the third conductor pattern group Gt is inspected.

  Subsequently, the control unit 15 changes the continuity test target pattern Pc to another conductor pattern P and sequentially executes the above-described continuity test, and in parallel with this, the second insulation test target pattern Pi is changed to another conductor pattern P. The pattern is changed to the pattern P and the above-described second insulation inspection is sequentially executed. Specifically, as shown in FIG. 5, for example, the control unit 15 sequentially selects the conductor pattern P in the order of the conductor pattern P9, the conductor pattern P8,... As the second insulation inspection target pattern Pi, the conductor pattern P is sequentially selected in the order of the conductor pattern P2, the conductor pattern P3,..., The conductor pattern P10, and the second insulation inspection is executed. In this case, as shown in the figure, when the continuity test target pattern Pc is selected from the second conductor pattern group Gs, the control unit 15 sets the second insulation test target pattern Pi to the first conductor pattern group Gf. And a conductor pattern group G composed only of all the conductor patterns P except for the second insulation inspection target pattern Pi among the conductor patterns P in the first conductor pattern group Gf is selected as the third conductor pattern group Gt. As specified. In addition, when the control unit 15 selects the continuity test target pattern Pc from the first conductor pattern group Gf, the control unit 15 selects the second insulation test target pattern Pi from the second conductor pattern group Gs, and the second conductor. A conductor pattern group G composed only of all conductor patterns P except for the second insulation inspection target pattern Pi among the conductor patterns P in the pattern group Gs is specified as the third conductor pattern group Gt.

  In this case, also in the second configuration and method, the insulation state between the conductor pattern P in the first conductor pattern group Gf and the conductor pattern P in the second conductor pattern group Gs is good in the first insulation inspection. Sometimes a second insulation test is performed. For this reason, at the time of execution of the second insulation test, it has already been confirmed that the insulation state between the conductor pattern P in the first conductor pattern group Gf and the conductor pattern P in the second conductor pattern group Gs is good. As described above, even if the third conductor pattern group Gt is configured only by the conductor pattern P in the conductor pattern group G to which the second insulation inspection target pattern Pi belongs (second insulation inspection target pattern Pi). Even if the conductor pattern P in the conductor pattern group G that does not belong to is excluded from the third conductor pattern group Gt), the second insulation inspection target pattern Pi is changed and the second insulation inspection is sequentially executed. The insulation state of the conductor pattern P can be inspected. Therefore, also in the second configuration and method, the continuity test for the continuity test target pattern Pc excluded from the third conductor pattern group Gt can be performed in parallel with the second insulation test. The inspection time as a whole can be shortened by the time for performing the second insulation inspection in parallel.

  In the second configuration and method described above, all the conductor patterns P in the conductor pattern group G (one of the two conductor pattern groups Gf and Gs) to which the second insulation inspection target pattern Pi does not belong are connected to each other. The continuity test can also be performed in a (serial connection) state. By performing in this way, the continuity state of all the conductor patterns P can be inspected with a small number of times.

  In the first and second configurations and methods described above, the second insulation test can be performed by the multiple method disclosed in Non-Patent Document 1 described above. The insulation state of the conductor pattern P can be inspected.

  Furthermore, although the example in which the circuit board 100 having 10 conductor patterns P is inspected has been described above, the same effect as described above can be realized when inspecting the circuit board 100 having any of the plurality of conductor patterns P. be able to. Further, in the first insulation inspection, an example in which the first conductor pattern group Gf and the second conductor pattern group Gs are configured by the same number of conductor patterns P (the conductor patterns P are divided so as to have the same number) is described above. However, the two conductor pattern groups Gf and Gs may be configured by different numbers of conductor patterns P.

  Further, the circuit board inspection apparatus 1 configured to be able to perform inspection on the circuit board 100 having the conductor pattern P formed on one surface has been described as an example. However, the circuit board inspection apparatus 1 includes a pair of probe units 3 and the conductor pattern P on both surfaces. It is also possible to apply the present invention to a circuit board inspection apparatus configured to execute the above-described inspection on a circuit board on which is formed. Further, the present invention can be applied to a circuit board inspection apparatus configured to be able to inspect a multilayer circuit board. Furthermore, instead of the probe unit 3, the present invention is applied to a flying probe type circuit board inspection apparatus in which a plurality of probe pins are moved and the probe pins are brought into contact with the connection points H of the conductor pattern P to which the inspection signal S is to be supplied. You can also.

1 is a configuration diagram showing a configuration of a circuit board inspection device 1. FIG. 1 is a configuration diagram showing a configuration of a circuit board 100. FIG. 5 is a flowchart of an inspection process 50. It is the 1st explanatory view for explaining the procedure of a continuity inspection and the 2nd insulation inspection. It is the 2nd explanatory view for explaining the procedure of a continuity inspection and the 2nd insulation inspection.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Circuit board inspection apparatus 5 Inspection part 14 Memory | storage part 100 Circuit board D1 Conductor pattern data Gf 1st conductor pattern group Gs 2nd conductor pattern group Gt 3rd conductor pattern group H Connection point P Conductor pattern Pc Continuity inspection object pattern Pi 2nd Insulation inspection target pattern S Inspection signal S1 Voltage signal S2 Current signal

Claims (5)

A circuit board inspection apparatus provided with an inspection unit for inspecting an insulation state between each conductor pattern and a conduction state of each conductor pattern based on a physical quantity caused by supplying inspection signals to a plurality of conductor patterns on the circuit board. There,
The inspection unit connects the conductor patterns in the first conductor pattern group constituted by a part of the plurality of conductor patterns to each other and the second conductor constituted by the conductor patterns outside the first conductor pattern group. Based on a physical quantity generated when an insulation inspection signal as the inspection signal is supplied between the two conductor pattern groups in a state in which the conductor patterns in the pattern group are connected to each other, the elements in the first conductor pattern group When the first insulation inspection is performed to inspect the insulation state between the conductor pattern and the conductor pattern in the second conductor pattern group and the insulation state is determined to be good in the first insulation inspection , the both When a continuity test signal as the test signal is supplied to a conductor pattern selected as a continuity test target from one of the conductor pattern groups, the conductor pattern Wherein a continuity test for checking the conduction state of the conductor pattern of the conductive test object on the basis of the physical quantity occurring in the end portions, wherein the one conductor pattern selected from among the other two conductive pattern group as the target of the second insulation test The third conductor pattern group in the third conductor pattern group composed of a conductor pattern including at least all the conductor patterns included in the other conductor pattern group among all the other conductor patterns other than the conductor pattern to be inspected for continuity. the second insulation test on the basis of the physical quantity generated when supplying the insulation test signal between the second insulating inspected conductors pattern and the third conductive pattern group in a state of connecting the respective conductive patterns to each other The second insulation test for inspecting the insulation state between the target conductor pattern and the conductor pattern in the third conductor pattern group is executed in parallel. Road board inspection apparatus. In the second insulation inspection, the inspection unit includes the third conductor pattern including all the conductor patterns other than the conductor pattern selected as the second insulation inspection target and the conductor pattern to be inspected for continuity. circuit board inspection apparatus according to claim 1 for inspecting an insulation state between the selected conductor pattern as the conductor pattern and the second insulating inspected in the group. In the second insulation inspection, the inspection section includes only the conductor pattern other than the conductor pattern selected as the second insulation inspection target in the other conductor pattern group. The circuit board inspection apparatus according to claim 1, wherein an insulation state between the conductor pattern and the conductor pattern selected as the second insulation inspection target is inspected. A storage unit for storing conductor pattern data capable of specifying the number of the conductor patterns;
4. The inspection unit according to claim 1, wherein the inspection unit specifies each conductor pattern group based on the conductor pattern data, and selects the conductor pattern to be subjected to continuity inspection and the conductor pattern to be subjected to second insulation inspection. Circuit board inspection device according to claim 1. A circuit board inspection method for inspecting an insulation state between each conductor pattern and a conduction state of each conductor pattern based on a physical quantity generated along with supply of an inspection signal for a plurality of conductor patterns on a circuit board,
The conductor patterns in the first conductor pattern group composed of a part of the plurality of conductor patterns are connected to each other and the conductor patterns in the second conductor pattern group composed of the conductor patterns outside the first conductor pattern group are connected. The conductor pattern in the first conductor pattern group and the first conductor pattern based on a physical quantity generated when an insulation inspection signal as the inspection signal is supplied between the two conductor pattern groups in a state where the conductor patterns are connected to each other. When a first insulation test for inspecting an insulation state between the two conductor pattern groups in the two conductor pattern group is performed and the insulation state is determined to be good in the first insulation test , one of the two conductor pattern groups Generated at both ends of the conductor pattern when the continuity test signal as the test signal is supplied to the conductor pattern selected as the continuity test target from among A continuity test for checking the conduction state of the conductor pattern of the conductive test object on the basis of the physical quantity, wherein both conductive pattern group from the other selected one conductor pattern and said continuity check of the target as a target of the second insulation test all other relevant other all the conductor patterns of the third conductor pattern in the group consisting of at least comprises conductive pattern conductive patterns included in the conductor pattern in the group of the conductor pattern excluding the conductor pattern conductive pattern of the second insulation test object based on the physical quantity generated when supplying the insulation test signal between the second insulating inspected conductors pattern and the third conductive pattern group in a state of being connected to each other Circuit board inspection method for executing in parallel a second insulation inspection for inspecting an insulation state between the conductor pattern and the conductor pattern in the third conductor pattern group .

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