JP5215148B2 - Insulation inspection device and insulation inspection method - Google Patents

Description

  The present invention relates to an insulation inspection apparatus and an insulation inspection method for inspecting an insulation state between conductor patterns formed on a substrate to be inspected.

As this type of insulation inspection apparatus and insulation inspection method, the applicant of the present application discloses an insulation inspection apparatus and an insulation inspection method in Patent Document 1 below. This insulation test device and insulation inspection method, when inspecting the substrate N number of conductor patterns to be inspected have been formed, log 2 _N Exceeded nearest integer number of inspections to log 2 _N and (M times) By adopting an inspection method for performing inspection specified in the above, the inspection time for the substrate is shortened. This inspection method is disclosed in Non-Patent Document 1 below as a so-called multiple method.
JP 2008-58254 A (pages 3-11, 1-7) Editor-in-Chief Akihiko Hara, “Inspection Technology and Equipment Handbook for High-Density Mounting”, International Urban Communication Center Editorial Office, September 1, 2001, p. 87-88

However, the following problems to be solved exist in the insulation inspection apparatus and the insulation inspection method employing this multiple method. That is, in the insulation inspection apparatus and the insulation inspection method adopting the multiple method, a single sheet is obtained by collectively inspecting the insulation state between a plurality of conductor patterns and other conductor patterns at each of M inspection processes. The number of inspection processes required for inspecting the substrate to be inspected is reduced. However, while there is a demand to further reduce the inspection time required for each substrate to be inspected, the number of inspections is less than the number of inspections of log ₂ N or less in the insulation inspection method using the conventional insulation inspection apparatus. Since the insulation state between all the conductor patterns cannot be inspected by this inspection processing, there is a problem that it is difficult to further shorten the inspection time.

  The present invention has been made in view of such problems, and a main object of the present invention is to provide an insulation inspection apparatus and an insulation inspection method that can reduce the time required for the insulation inspection of a substrate to be inspected.

In order to achieve the above object, the insulation inspection apparatus according to claim 1 is provided with N inspection probes provided on N conductor patterns (N is a natural number of 4 or more) formed on a substrate to be inspected with a constant voltage source. A voltage supply unit that supplies a DC constant voltage as an inspection voltage via the switch, and a switching process for switching the connection between the high-potential output unit and the low-potential output unit in the voltage supply unit and each of the inspection probes A plurality of first conductor patterns in contact with the connection switching unit and the inspection probes connected to the high potential output unit of the conductor patterns, and the low potential output of the conductor patterns A measuring unit that measures an electrical parameter between a plurality of second conductor patterns that are in contact with each of the inspection probes connected to the unit, and the switching process by controlling the connection switching unit (( _{-1) <log 2 N ≦ M} (M is a natural number)) satisfy M times causes executed based on the electrical parameter is measured by controlling the measurement unit in each switching state wherein the first of An insulation inspection apparatus comprising: a control unit that executes an inspection process for inspecting an insulation state between a conductor pattern and each of the second conductor patterns and inspects the quality of the inspection target substrate by M inspection processes. And each of the switching states between the inspection probe brought into contact with the first conductor pattern and the inspection probe brought into contact with the second conductor pattern at the time of each inspection process. the electrical parameters measured length KuTadashi constant has been the waiting time of each inspection process after waiting after the start of the supply of the DC constant voltage according to the magnitude of the capacitance of the control The section performs the M inspection processes in order from the inspection process in the switching state in which the capacitance is small, and the insulation state between the first conductor patterns and the second conductor patterns. When it is determined that the substrate is defective, the inspection for the inspection object substrate being inspected is terminated.

  The insulation inspection apparatus according to claim 2 is the insulation inspection apparatus according to claim 1, further comprising a capacitance measuring unit that measures the capacitance for each switching state, wherein the control unit is measured by the capacitance measuring unit. The inspection is performed in order from the inspection process in the switching state where the capacitance is small.

  The insulation inspection apparatus according to claim 3, further comprising: a storage unit that stores inspection procedure data capable of specifying an execution order of the M inspection processes according to the insulation inspection apparatus according to claim 2, wherein the control unit When the inspection procedure data is stored in the storage unit, the M inspection processes are executed according to the stored inspection procedure data, and when the inspection procedure data is not stored in the storage unit, the capacity An execution order for controlling the measurement unit to measure the capacitance for each switching state and executing the M inspection processes in order from the inspection process in the switching state where the measured capacitance is small. The inspection procedure data is defined and stored in the storage unit.

According to a fourth aspect of the present invention, there is provided an insulation inspection method for inspecting N conductor patterns (N is a natural number of 4 or more) formed on a substrate to be inspected with a constant voltage source via N inspection probes. ((M−1) <log ₂ N ≦ M) is performed for switching the connection between the high-potential output section and the low-potential output section in the voltage supply section that supplies a constant DC voltage as a working voltage and each inspection probe. (M is a natural number)) is executed M times, and in each switching state, the DC constant voltage is supplied from the voltage supply unit, and connected to the high potential output unit of the conductor patterns. A plurality of first conductor patterns in contact with the inspection probes and a plurality of second conductor patterns in contact with the inspection probes connected to the low potential output portion of the conductor patterns. And an inspection process for inspecting an insulation state between each of the first conductor patterns and each of the second conductor patterns based on the measured electrical parameters is performed M times. An insulation inspection method for inspecting the quality of the inspection target substrate by the inspection processing of the inspection, wherein the inspection probe is brought into contact with the first conductor pattern and the second conductor pattern is contacted at the time of each inspection processing. The inspection process is executed M times in order from the inspection process in the switching state in which the capacitance between inspection probes is small, and the magnitude of the capacitance for each switching state in each inspection process the electrical parameters measured latency length KuTadashi boss was the the inspection process every time after waiting after the start of the supply of the DC constant voltage in accordance with, and the respective first When the insulation state between the conductor pattern and each of the second conductor patterns is determined to be defective, the inspection on the inspection target substrate being inspected is terminated.

  The insulation inspection method according to claim 5 is the insulation inspection method according to claim 4, wherein the capacitance in each switching state is measured, and the inspection processing in the switching state in which the measured capacitance is small. Execute in order.

  The insulation inspection method according to claim 6 is the insulation inspection method according to claim 5, wherein there is no inspection procedure data that can specify the execution order of the M inspection processes. The inspection procedure data is generated by defining an execution order for executing the M inspection processes in order from the inspection process in the switching state in which the measured capacitance is small and the measured capacitance is generated. The M inspection processes are executed according to the following.

According to the insulation inspection apparatus according to claim 1 and the insulation inspection method according to claim 4, between each of the inspection probe brought into contact with the first conductor pattern and the inspection probe brought into contact with the second conductor pattern during each inspection process. and it executes the checking process of M times in order from the inspection process state switching capacitance is small, during the inspection process, the inspection was long KuTadashi boss in accordance with the magnitude of the capacitance of each switching state An electrical parameter is measured after waiting for the processing standby time after the start of supply of a DC voltage as a test voltage, and the insulation state between each first conductor pattern and each second conductor pattern is poor. Insulating state between each first conductor pattern and each second conductor pattern other than at the time of the M-th inspection process by ending the inspection on the inspection target substrate being inspected when determined By ending the inspection of the inspection target substrate when it is determined to be defective, the time required for the inspection of the defective inspection target substrate is reduced by not performing unnecessary inspection processing for the defective inspection target substrate. The inspection process can be sufficiently shortened, and M inspection processes are executed in order from the inspection process in the switching state with a small capacitance, so that the M inspection processes are executed in the order from the inspection process in the switching state with a large capacitance. Compared with the case where it is executed, when the insulation state between each first conductor pattern and each second conductor pattern is determined to be defective in the inspection process before the Mth time, the standby for the inspection process already executed The time required for the inspection of the defective substrate to be inspected is reduced by the short time (in the case where a plurality of inspection processes have been completed, the total waiting time for each inspection process). It can be shortened.

  Moreover, according to the insulation inspection apparatus according to claim 2 and the insulation inspection method according to claim 5, the capacitance for each switching state is measured, and the measured capacitance is executed in order from the inspection processing for the switching state with a small capacitance. Thus, for example, in comparison with the method of defining the execution order of M times of inspection processing based on the theoretical value of the capacitance calculated based on the design information of the inspection target substrate and the insulation inspection apparatus, Since the execution order of the M inspection processes can be defined based on the capacitance according to the actual state of the insulation inspection apparatus, it is possible to reliably reduce the time required for the inspection of a defective inspection target substrate. it can.

  Furthermore, according to the insulation inspection apparatus according to claim 3 and the insulation inspection method according to claim 6, when there is no inspection procedure data that can specify the execution order of the M times of inspection processing, the electrostatic capacity for each switching state is determined. The test procedure data is generated by defining an execution order for executing the M test processes in order from the test process in the switching state in which the capacitance is measured and the measured capacitance is small, and the M test is performed according to the generated test procedure data. By executing the process, the capacitance of each switching state is measured for each substrate to be inspected, and the same kind of inspection object is compared with defining the execution order of M inspection processes each time. For a substrate, it is only necessary to generate the inspection procedure data by executing the capacitance measurement process once, and thereafter, the insulation inspection process can be executed according to the generated inspection procedure data. The inspection time required when many test plate can be further reduced.

  The best mode of an insulation inspection apparatus and an insulation inspection method according to the present invention will be described below with reference to the accompanying drawings.

  First, the configuration of the insulation inspection apparatus 1 will be described with reference to the drawings.

  An insulation inspection apparatus 1 shown in FIG. 1 is an example of an insulation inspection apparatus according to the present invention, and inspects insulation states of various circuit boards such as the circuit board 100 shown in FIGS. 5 to 7 according to the insulation inspection method according to the present invention. It is configured to be possible. In this case, the circuit board 100 is an example of an inspection target board in the present invention, and a plurality of conductor patterns are formed. Note that several tens to several hundreds of conductor patterns are formed on the actual circuit board 100. However, in order to facilitate understanding of the present invention, the conductor patterns Pa to Ph are formed on the circuit board 100 as an example. 8 (example where “N” in the present invention is “8”: hereinafter referred to as “conductor pattern P” when not distinguished from each other) is formed, and for these eight conductor patterns P, An example of inspecting the insulation state will be described below.

  On the other hand, as shown in FIG. 1, the insulation inspection apparatus 1 includes a probe mechanism 2, a connection switching unit 3, a voltage supply unit 4, a measurement unit 5, an operation unit 6, a display unit 7, a control unit 8, and a storage unit 9. ing. The probe mechanism 2 includes a plurality of inspection probes 12a to 12h ("N" in the present invention) implanted in the probe holding portion 11 in accordance with the positions of the inspection points defined on the conductor patterns P on the circuit board 100. "8": hereinafter referred to as "inspection probe 12" when not distinguished from each other), the probe holding unit 11 is moved in accordance with the control signal S2 from the control unit 8 to connect each inspection probe 12 to the circuit. And a moving mechanism 13 that contacts or separates each conductor pattern P (each inspection point) on the substrate 100. In this case, each inspection probe 12 is connected to the connection switching unit 3 via signal cables 15a to 15h (hereinafter, also referred to as “signal cable 15” when not distinguished). In the actual insulation inspection apparatus 1, several tens to several hundreds of inspection probes 12 are implanted in the probe holder 11 according to the number of conductor patterns P on the circuit board 100.

  The connection switching unit 3 is an example of the connection switching unit in the present invention, and in accordance with the control signal S1 from the control unit 8, the high potential output unit 4H (H potential) and the low potential output unit 4L (L Potential: As an example, a switching process for switching the connection between each inspection probe 12 (the signal cable 15 connected to each inspection probe 12) and the above-described inspection probe 12 is executed. The voltage supply unit 4 is an example of a voltage supply unit in the present invention, and includes a constant voltage source (not shown). The voltage supply unit 4 is used for inspection from the high potential output unit 4H and the low potential output unit 4L according to the control signal S3 from the control unit 8. By outputting the voltage V, an inspection voltage (DC constant voltage) V is supplied to each conductor pattern P of the circuit board 100 via the connection switching unit 3, each signal cable 15, and each inspection probe 12.

  The measurement unit 5 includes a voltage measurement unit 5a, a current measurement unit 5b, and a capacitance measurement unit 5c. The voltage measuring unit 5a is connected between the conductor patterns P and P generated by the supply of the inspection voltage V from the voltage supply unit 4 (each conductor pattern P to which the inspection probe 12 connected to the high potential output unit 4H is connected). The voltage (potential difference: between the first conductor pattern in the present invention) and each conductor pattern P (second conductor pattern in the present invention) to which the inspection probe 12 connected to the low potential output portion 4L is connected. An example of an electrical parameter in the present invention is detected, and measurement data Dv indicating the voltage value is output to the control unit 8. The current measuring unit 5b detects a current that conducts between each of the first conductor patterns P and each of the second conductor patterns P by the supply of the inspection voltage V from the voltage supply unit 4. Measurement data Di indicating the current value (another example of the electrical parameter in the present invention) is output to the control unit 8.

  The capacitance measuring unit 5c is an example of the capacitance measuring unit according to the present invention. As described later, the first conductor pattern according to the present invention is performed during each inspection process on the circuit board 100 according to the control of the control unit 8 as described later. The capacitance between the inspection probe 12 brought into contact with the test probe and the inspection probe 12 brought into contact with the second conductor pattern in the present invention is measured. Specifically, the control unit 8 is provided between each inspection probe 12 connected to the high potential output unit 4H and each inspection probe 12 connected to the low potential output unit 4L during each inspection process for the circuit board 100. Capacitance, that is, the signal cable 15 and the inspection probe 12 connected to the high potential output unit 4H, and the conductor pattern P with which the inspection probe 12 is brought into contact (hereinafter referred to as “H potential portion” together) The signal cable 15 and the inspection probe 12 connected to the low-potential output unit 4L, and the conductor pattern P with which the inspection probe 12 is brought into contact (hereinafter, these are also referred to as “L-potential portion”). Is measured for each switching state of the connection of the inspection probe 12 to the voltage supply unit 4. Moreover, the control part 8 outputs the measurement result as measurement data Dc. The capacitance measurement process will be described in detail later.

  In this case, in the switching state in which the electrostatic capacitance is large, the time required from the start of supply of the inspection voltage V to the completion of charging for the electrostatic capacitance between the H potential portion and the L potential portion ( The time required for the current flowing between the conductor patterns P and P to become stable (converged to a constant value) becomes longer. Therefore, in this insulation inspection apparatus 1, as will be described later, standby is performed for each switching state (each inspection process) so as to become longer according to the magnitude of the capacitance measured by the capacitance measuring unit 5c. A configuration in which the voltage value and the current value are measured by the voltage measuring unit 5a and the current measuring unit 5b after the time is specified and the supply of the inspection voltage V is started and the standby time until the specified standby time elapses. It has been adopted. As a result, it is possible to calculate an accurate insulation resistance value between the conductor patterns P and P as a result of measurement in a state where the voltage value, the current value, and the like are stable.

  The operation unit 6 includes various switches such as a power switch and an inspection start switch, and outputs an operation signal corresponding to the operation of each switch. The display unit 7 displays various images such as inspection results under the control of the control unit 8. The control unit 8 is an example of a control unit in the present invention, and comprehensively controls the insulation inspection apparatus 1. Specifically, the control unit 8 controls the measurement unit 5 (capacitance measurement unit 5c) by starting the insulation inspection process 20 shown in FIG. 2 according to the operation signal output from the operation unit 6. The measurement process for measuring the capacitance between the H potential portion and the L potential portion is executed for each switching state in each M inspection processes. Further, the control unit 8 prescribes a standby time for each switching state (each inspection process) for a long time according to the size of the measured capacitance, and from the switching state inspection process for which the measured capacitance is small. Inspection procedure data Dt is generated and stored in the storage unit 9 so as to execute the M inspection processes in order.

In this case, in this insulation inspection apparatus 1, when the number of conductor patterns P to be inspected is N, a switching process for switching the connection of each inspection probe 12 to the voltage supply unit 4 is performed as described later ( (M-1) <log ₂ N ≦ M that satisfies the condition of N ≦ M (M is a natural number) is executed, and each of the first conductor patterns P and each of the above-mentioned first and second conductor patterns P is measured based on the electric parameters measured in each switching state. The inspection process for inspecting the insulation state between the second conductor patterns P is executed, and therefore, in this example of eight N lines in the present invention, M = 3 inspections for one circuit board 100. By executing the processing, the insulation state between the conductor patterns P is inspected, and the quality of one circuit board 100 is inspected.

  Specifically, the control unit 8 brings each inspection probe 12 into contact with each conductor pattern P of the circuit board 100 by outputting a control signal S2 to the moving mechanism 13 of the probe mechanism 2 as described later. Further, the control unit 8 outputs a control signal S1 to the connection switching unit 3 according to the inspection procedure data Dt, whereby the high potential output unit 4H and the low potential output unit 4L in the voltage supply unit 4 and each inspection probe 12 are connected. Switch the connection. Further, the control unit 8 outputs the control signal S3 to the voltage supply unit 4 to supply the inspection voltage V to the circuit board 100 (conductor pattern P) via each inspection probe 12. The control unit 8 controls the measurement unit 5 to execute measurement processing. Further, the control unit 8 calculates the resistance value between the conductor patterns P and P based on the measurement data Dv output from the voltage measurement unit 5a and the measurement data Di output from the current measurement unit 5b, and the calculation The result and the reference data for inspection Ds (reference resistance value) stored in the storage unit 9 are compared to check the quality of the circuit board 100 (insulation state between the conductor patterns P and P).

  In this case, in this insulation inspection apparatus 1, when it is determined that the insulation state between the conductor patterns P and P is defective during any of the M inspection processes (three times in this example). In addition, without executing the remaining inspection processing, at that time, the circuit board 100 under inspection is inspected as defective and the insulation inspection processing 20 is completed. Therefore, when inspecting a plurality of circuit boards 100, if there is a defective circuit board 100 in which the insulation state between the conductor patterns P and P is defective, an unnecessary inspection of the defective circuit board 100 is performed. The average inspection time required for one circuit board 100 is sufficiently shortened by the amount that the processing is not performed. The storage unit 9 stores the inspection procedure data Dt, the inspection reference data Ds, and the like.

  Next, an insulation inspection method for inspecting the insulation state of the circuit board 100 using the insulation inspection apparatus 1 and the operation of the insulation inspection apparatus 1 at that time will be described with reference to the drawings.

  First, after holding the circuit board 100 of the board to be inspected on the board holding part (not shown), the operation part 6 is operated to instruct to start the inspection. At this time, the control unit 8 starts the insulation inspection process 20 shown in FIG. 2 according to the operation signal output from the operation unit 6. In the insulation inspection process 20, the control unit 8 first determines whether or not the inspection procedure data Dt for the circuit board 100 to be inspected is stored in the storage unit 9 (step 21). At this time, at the time of the first inspection for the circuit board 100, the control unit 8 executes processing for generating inspection procedure data Dt for the circuit board 100. Specifically, the control unit 8 first performs M = 3 inspection processes for one circuit board 100 (for each switching state of connection of each inspection probe 12 to the voltage supply unit 4 during each inspection process). ) Is performed (step 22).

  More specifically, the control unit 8 first outputs a control signal S2 to the moving mechanism 13, thereby bringing each inspection probe 12 into contact with each conductor pattern P (inspection point) on the circuit board 100 (circuit). Probing the substrate 100). Next, the control unit 8 outputs a control signal S1 to the connection switching unit 3 so that the switching state shown in FIG. 5 (the switching state of “inspection process A” shown in FIG. 3) is achieved. The high potential output unit 4H and the low potential output unit 4L are connected to each inspection probe 12 (signal cable 15). At this time, the inspection probes 12a, 12c, 12e, and 12g are connected to the high potential output unit 4H via the signal cables 15a, 15c, 15e, and 15g, and the inspection probes 12a, 12c, 12e, and 12g are in contact with each other. The conductor patterns Pa, Pc, Pe, and Pg are connected to the H potential, and the inspection probes 12b, 12d, 12f, and 12h are connected to the low potential output portion 4L via the signal cables 15b, 15d, 15f, and 15h. The conductor patterns Pb, Pd, Pf, Ph to which the inspection probes 12b, 12d, 12f, 12h are in contact are connected to the L potential. The “inspection process A” (inspection process in the switching state shown in FIG. 5) corresponds to the first inspection process at the time of M = 3 inspection processes adopting a conventional general multiple method. .

  Next, the control unit 8 starts the supply of the inspection voltage V by outputting the control signal S3 to the voltage supply unit 4, and controls the measurement unit 5 (capacitance measurement unit 5c) to control the H potential region. And the capacitance C10 between the L potential portion and the L potential portion is measured. In this case, the capacitance between the signal cables 15a, 15c, 15e, 15g connected to the H potential and the signal cables 15b, 15d, 15f, 15h connected to the L potential is connected to the H potential. Capacitance between the inspection probes 12a, 12c, 12e, 12g and the inspection probes 12b, 12d, 12f, 12h connected to the L potential, and the inspection probes 12a, 12c, 12e, 12g Capacitance between the conductor patterns Pa, Pc, Pe, and Pg that are in contact with the conductor patterns Pb, Pd, Pf, and Ph that are in contact with the inspection probes 12b, 12d, 12f, and 12h A value obtained by synthesizing various capacitances (synthetic capacitance) is measured as the capacitance C10.

  In this case, the processing of “measuring the capacitance C10 between the H potential portion and the L potential portion” described above is “test probes 12a, 12c, 12e, 12g connected to the H potential (this "Inspection probe to be brought into contact with the first conductor pattern" in the invention) and inspection probes 12b, 12d, 12f, and 12h connected to the L potential ("inspection probe to be in contact with the second conductor pattern" in the present invention) It means the process of “measuring the capacitance between the probe and the probe”). Further, “capacitance between the inspection probes 12a, 12c, 12e, and 12g connected to the H potential and the inspection probes 12b, 12d, 12f, and 12h connected to the L potential” is measured. Is actually executed as a process of “measuring the capacitance between predetermined wires in the connection switching unit 3 to which each inspection probe 12 is connected via each signal cable 15”. Is done. Hereinafter, in order to facilitate understanding of the present invention, the capacitance measurement process will be described as “measuring the capacitance between the H potential portion and the L potential portion”.

  Subsequently, the control unit 8 outputs the control signal S1 to the connection switching unit 3 so that the switching state shown in FIG. 6 (the switching state of “inspection process B” shown in FIG. 3) is achieved. The four high potential output units 4H and the low potential output unit 4L are connected to each inspection probe 12 (signal cable 15). At this time, the inspection probes 12a, 12b, 12e, and 12f are connected to the high potential output unit 4H via the signal cables 15a, 15b, 15e, and 15f, and the inspection probes 12a, 12b, 12e, and 12f are in contact with each other. The conductor patterns Pa, Pb, Pe, and Pf thus made are connected to the H potential, and the inspection probes 12c, 12d, 12g, and 12h are connected to the low potential output section 4L via the signal cables 15c, 15d, 15g, and 15h. The conductor patterns Pc, Pd, Pg, and Ph that are in contact with the inspection probes 12c, 12d, 12g, and 12h are connected to the L potential. The “inspection process B” (inspection process in the switching state shown in FIG. 6) corresponds to the second inspection process at the time of M = 3 inspection processes adopting a conventional general multiple method. .

  Next, the control unit 8 starts the supply of the inspection voltage V by outputting the control signal S3 to the voltage supply unit 4, and controls the measurement unit 5 (capacitance measurement unit 5c) to control the H potential region. And the capacitance C20 between the L potential part and the L potential part are measured. In this case, the capacitance between the signal cables 15a, 15b, 15e, 15f connected to the H potential and the signal cables 15c, 15d, 15g, 15h connected to the L potential is connected to the H potential. Capacitance between the inspection probes 12a, 12b, 12e, and 12f being inspected and the inspection probes 12c, 12d, 12g, and 12h connected to the L potential, and the inspection probes 12a, 12b, 12e, and 12f Capacitance between the conductor patterns Pa, Pb, Pe, and Pf that are in contact with the conductor patterns Pc, Pd, Pg, and Ph that are in contact with the inspection probes 12c, 12d, 12g, and 12h A value obtained by combining various capacitances is measured as capacitance C20.

  Subsequently, the control unit 8 outputs a control signal S1 to the connection switching unit 3 so that the switching state shown in FIG. 7 (the switching state of “inspection process C” shown in FIG. 3) is achieved. The four high potential output units 4H and the low potential output unit 4L are connected to each inspection probe 12 (signal cable 15). At this time, the inspection probes 12a to 12d are connected to the high potential output unit 4H via the signal cables 15a to 15d, and the conductor patterns Pa to Pd with which the inspection probes 12a to 12d are brought into contact have the H potential. Are connected to the low potential output section 4L via the signal cables 15e to 15h, and the conductor patterns Pe to Ph in contact with the inspection probes 12e to 12h are L Connected to potential. Note that the “inspection process C” (inspection process in the switching state shown in FIG. 7) corresponds to the third inspection process in M = 3 inspection processes adopting a conventional general multiple method. .

  Next, the control unit 8 starts the supply of the inspection voltage V by outputting the control signal S3 to the voltage supply unit 4, and controls the measurement unit 5 (capacitance measurement unit 5c) to control the H potential region. And the capacitance C30 between L and the L potential portion is measured. At this time, the capacitance between the signal cables 15a to 15d connected to the H potential and the signal cables 15e to 15h connected to the L potential, the inspection probes 12a to 12h connected to the H potential. The capacitance between 12d and the inspection probes 12e to 12h connected to the L potential, and the conductor patterns Pa to Pd in contact with the inspection probes 12a to 12d and the inspection probes 12e to 12h are in contact with each other. A value obtained by synthesizing various capacitances such as capacitance between the conductive patterns Pe to Ph is measured as the capacitance C30.

  In this case, in this insulation inspection apparatus 1, in order to avoid a situation in which each signal cable 15 is caught when the probe holding portion 11 is moved by the moving mechanism 13, each signal cable 15 is bound or knitted by a binding band. And bundled into a single thick cable. Therefore, the capacitance component between the signal cables 15 among the capacitances C10, C20, and C30 is substantially equal in each switching state. However, with regard to the capacitance component between the inspection probes 12 and the capacitance component between the conductor patterns P, there are many switching states in which the portion that becomes the H potential and the portion that becomes the L potential are adjacent to each other at a very short distance. The capacity becomes larger. Therefore, in this example, the capacitance “capacitance C30” <“capacitance C20” <“capacitance C10” is measured. In addition, when what is called a flat cable is employ | adopted as said each signal cable 15, the capacity | capacitance component between each signal cable 15 of said each electrostatic capacitance C10, C20, C30 is a part used as H potential. Since the switching state in which there are many locations that are adjacent to each other at a very short distance from the L potential portion has a larger capacity, “capacitance C30” <“capacitance C20” <“capacitance C10” The trend is even more pronounced.

  Next, the control unit 8 determines the execution order of each inspection process and the standby time during each inspection process according to the measured capacitances C10 to C30, and generates inspection procedure data Dt (step 23). ). Specifically, the control unit 8 sequentially executes “inspection process B” and “inspection process A” in this order from “inspection process C” executed in the switching state of the capacitance C10 having a small measured capacitance. Thus, the inspection procedure data Dt is generated. In this case, as shown in FIG. 4, the controller 8 adjusts the capacitance C30 having the longest time required for charging the capacitance between the H potential portion and the L potential portion when the inspection voltage V is supplied. The waiting time T3 of “inspection process A” executed in the switching state is specified to be the longest, and the waiting time T1 of “inspection process C” executed in the switching state of the capacitance C10 having the shortest charge time is specified to be the shortest. Thus, the inspection procedure data Dt is generated. Therefore, by executing each of the inspection processes A to C according to the generated inspection procedure data Dt, the inspection process that is defined with a short standby time due to a small electrostatic capacity is executed earlier.

  Subsequently, the control unit 8 executes the first inspection process among the M = 3 inspection processes for the circuit board 100 in accordance with the generated inspection procedure data Dt (step 24). Specifically, the control unit 8 outputs a control signal S1 to the connection switching unit 3 so that the switching state shown in FIG. 7 (the switching state of “inspection process C” shown in FIG. 4) is high. The potential output unit 4H and the low potential output unit 4L are connected to each inspection probe 12 (signal cable 15). Next, the control unit 8 starts supplying the inspection voltage V by outputting the control signal S3 to the voltage supply unit 4. At this time, in the measurement unit 5, the voltage measurement unit 5 a waits for the waiting time T <b> 1 after the supply of the inspection voltage V is started according to the control of the control unit 8. The potential difference between the first conductor pattern in the invention) and the conductor patterns Pe to Ph (second conductor pattern in the invention) is measured and the measurement data Dv is output. The current value of the current conducted between the conductor pattern and the second conductor pattern is measured, and measurement data Di is output.

  Further, the control unit 8 calculates the resistance value (insulation resistance value) between the first conductor pattern and the second conductor pattern based on the measurement data Dv and Di output from the measurement unit 5. Further, the control unit 8 outputs a control signal S3 to the voltage supply unit 4 to stop the supply of the inspection voltage V, and calculates the calculated insulation resistance value and the inspection reference data Ds stored in the storage unit 9. (Reference resistance value) is compared to inspect the insulation state between the first conductor pattern and the second conductor pattern. At this time, if the calculated insulation resistance value is less than the reference resistance value, the control unit 8 determines that an insulation failure has occurred between the first conductor pattern and the second conductor pattern (step 25). ), The circuit board 100 is inspected as defective without executing the remaining inspection processes (in this example, “inspection process B” and “inspection process A”) of M = 3 inspection processes. Then, this insulation inspection process 20 is completed. Therefore, the inspection time for the defective circuit board 100 is shortened by not performing the remaining two inspection processes for the defective circuit board 100.

  Further, when the conventional general multiple method is adopted, the “waiting time T3 from the start of the supply of the inspection voltage V to the start of the voltage and current measurement by the measuring unit 5 is the longest“ inspection process ”. A ”is executed as the first inspection process at the time of M = 3 inspection processes, whereas in this insulation inspection apparatus 1,“ inspection process C ”with the shortest waiting time T1 is performed M = 3 inspections. This is executed as the first inspection process at the time of processing. Therefore, when an insulation failure is detected during the first inspection process, the inspection time required for inspecting the defective circuit board 100 is such that the standby time T1 of the inspection process C is shorter than the standby time T3 of the inspection process A. However, when the insulation inspection method by the insulation inspection apparatus 1 is adopted (in this example, when the conventional general multiple method is adopted (in this example, the configuration in which the inspection process A is first executed) is adopted (in this example). , When the configuration in which the inspection process C is executed first is adopted).

  On the other hand, when the insulation resistance value calculated in the “inspection process C” is equal to or greater than the reference resistance value, the control unit 8 determines that the insulation state between the first conductor pattern and the second conductor pattern is good. (Step 25), the determination result is stored in the storage unit 9. Further, the control unit 8 determines that all M = 3 inspection processes are not completed (step 26), and executes a second inspection process for the circuit board 100 (step 24). Specifically, the control unit 8 outputs a control signal S1 to the connection switching unit 3 so that the switching state shown in FIG. 6 (the switching state of “inspection process B” shown in FIG. 4) is high. The potential output unit 4H and the low potential output unit 4L are connected to each inspection probe 12 (signal cable 15). Next, the control unit 8 starts supplying the inspection voltage V by outputting the control signal S3 to the voltage supply unit 4. At this time, in the measurement unit 5, the voltage measurement unit 5 a waits for the waiting time T <b> 2 after the supply of the inspection voltage V is started under the control of the control unit 8, and then the voltage measurement unit 5 a performs the conductor patterns Pa, Pb, Pe. , Pf (first conductor pattern in the present invention) and conductor patterns Pc, Pd, Pg, Ph (second conductor pattern in the present invention) are measured to output measurement data Dv, The measurement unit 5b measures the current value of the current that conducts between the first conductor pattern and the second conductor pattern, and outputs measurement data Di.

  The control unit 8 calculates the resistance value (insulation resistance value) between the first conductor pattern and the second conductor pattern based on the measurement data Dv and Di output from the measurement unit 5. The calculated insulation resistance value is compared with the inspection reference data Ds (reference resistance value) stored in the storage unit 9 to inspect the insulation state between the first conductor pattern and the second conductor pattern. To do. At this time, if the calculated insulation resistance value is less than the reference resistance value, the control unit 8 determines that an insulation failure has occurred between the first conductor pattern and the second conductor pattern (step 25). ), M = Inspecting the circuit board 100 as defective without executing the remaining inspection processing (in this example, “inspection processing A”) of the three inspection processings, and ending the insulation inspection processing 20 To do. Therefore, the inspection time for the defective circuit board 100 is shortened by the amount of time that the remaining one inspection process for the defective circuit board 100 is not executed.

  Further, when the conventional general multiple method is adopted, as described above, “inspection process A” having the longest waiting time T3 is executed as the first inspection process in M = 3 inspection processes. On the other hand, in the insulation inspection apparatus 1, the “inspection process C” having the shortest waiting time T1 is executed as the first inspection process at the time of M = 3 inspection processes. Therefore, when an insulation failure is detected during the second inspection process, the inspection time required to inspect the defective circuit board 100 is the total time of the waiting time T1 of the inspection process C and the waiting time T2 of the inspection process B. Is shorter than the total time of the waiting time T3 of the inspection process A and the waiting time T2 of the inspection process B (in this example, the inspection process A is first executed). When the insulation inspection method by the insulation inspection apparatus 1 is adopted (in this example, when the constitution for executing the inspection process C first is adopted) is shorter than when the constitution is adopted.

  On the other hand, when the insulation resistance value calculated in the “inspection process B” is equal to or greater than the reference resistance value, the control unit 8 determines that the insulation state between the first conductor pattern and the second conductor pattern is good. (Step 25), the determination result is stored in the storage unit 9. Further, the control unit 8 determines that all M = 3 inspection processes are not completed (step 26), and executes a third inspection process for the circuit board 100 (step 24). Specifically, the control unit 8 outputs a control signal S1 to the connection switching unit 3 so that the switching state shown in FIG. 5 (the switching state of “inspection processing A” shown in FIG. 4) is high. The potential output unit 4H and the low potential output unit 4L are connected to each inspection probe 12 (signal cable 15). Next, the control unit 8 starts supplying the inspection voltage V by outputting the control signal S3 to the voltage supply unit 4. At this time, in the measurement unit 5, the voltage measurement unit 5 a waits for the waiting time T <b> 3 after the supply of the inspection voltage V is started according to the control of the control unit 8, and then the voltage measurement unit 5 a performs the conductor patterns Pa, Pc, Pe. , Pg (first conductor pattern in the present invention) and conductor patterns Pb, Pd, Pf, Ph (second conductor pattern in the present invention) are measured to output measurement data Dv, The measurement unit 5b measures the current value of the current that conducts between the first conductor pattern and the second conductor pattern, and outputs measurement data Di.

  The control unit 8 calculates the resistance value (insulation resistance value) between the first conductor pattern and the second conductor pattern based on the measurement data Dv and Di output from the measurement unit 5. The calculated insulation resistance value is compared with the inspection reference data Ds (reference resistance value) stored in the storage unit 9 to inspect the insulation state between the first conductor pattern and the second conductor pattern. To do. At this time, if the calculated insulation resistance value is less than the reference resistance value, the control unit 8 determines that an insulation failure has occurred between the first conductor pattern and the second conductor pattern (step 25). ), The circuit board 100 is inspected as defective, and the insulation inspection process 20 is completed. Further, the control unit 8 determines that the insulation state between the first conductor pattern and the second conductor pattern is good when the insulation resistance value calculated in the “inspection process A” is equal to or greater than the reference resistance value. (Step 25), the determination result is stored in the storage unit 9, and the insulation inspection process 20 is terminated. Thereby, a series of inspection processes for the circuit board 100 is completed.

Thus, in this insulation inspection apparatus 1 and the insulation inspection method by the insulation inspection apparatus 1, the inspection probe 12 brought into contact with the first conductor pattern in the present invention and the second conductor pattern in the present invention at the time of each inspection process. In order from the inspection process (in this example, the inspection process C) in which the electrostatic capacitance between the inspection probes 12 to be contacted (that is, the electrostatic capacity between the H potential part and the L potential part) is small (in this example, the inspection process C) M times ( in this example, and it executes the checking process a through C of 3 times), in each inspection process at a through C, waiting for each test treatment was long KuTadashi boss in accordance with the magnitude of the capacitance C10~C30 After waiting for time T1 to T3 after the supply of the inspection voltage V is started, the electrical parameters (in this example, the voltage value and the current value) are measured, and the first conductor pattern and the second conductor pattern are measured. Ends the inspection of the circuit board 100 under test when the insulation state between the over emissions (between the conductor pattern P connected to H each conductive pattern P and L potential was connected to the potential) is determined to be defective.

  Therefore, according to the insulation inspection device 1 and the insulation inspection method by the insulation inspection device 1, the insulation state between each first conductor pattern P and each second conductor pattern P is not during the M-th inspection process. By ending the inspection of the circuit board 100 being inspected when it is determined to be defective, the time required for the inspection of the defective circuit board 100 is reduced by not performing unnecessary inspection processing for the defective circuit board 100. The switching state inspection with a large capacitance can be performed by performing M inspection processes in order from the inspection state in the switching state with a small capacitance (in this example, inspection processing C). Compared to the case where the M inspection processes are executed in order from the process (in this example, the inspection process A), each first conductor pattern P and each of the first conductor patterns P and the respective first conductor patterns P in the inspection process before the Mth time. When the insulation state between the conductor patterns P is determined to be defective, the waiting time at the time of the already executed inspection process (in the case where a plurality of inspection processes have been completed, the total waiting time at each inspection process) The time required for the inspection of the defective circuit board 100 can be further shortened by the shorter time.

  In addition, according to the insulation inspection device 1 and the insulation inspection method by the insulation inspection device 1, the capacitances C10 to C30 for each switching state are measured, respectively, and the switching state inspection processing with a small measured capacitance ( In this example, the execution order of the M inspection processes is performed based on the theoretical value of the capacitance calculated based on, for example, the design information of the circuit board 100 and the insulation inspection apparatus 1 by sequentially executing the inspection processes C). Compared with the defining method, the execution order of the M times of the inspection processing can be defined based on the electrostatic capacitance in accordance with the actual state of the circuit board 100 and the insulation inspection apparatus 1, so that the defective circuit board 100 The time required for the inspection can be surely shortened.

  Further, according to the insulation inspection device 1 and the insulation inspection method by the insulation inspection device 1, the capacitance for each switching state when there is no inspection procedure data Dt that can specify the execution order of the M inspection processes. The inspection procedure data Dt is generated by defining the execution order for executing the M inspection processes in order from the inspection process in the switching state in which the measured capacitances C10 to C30 are small, and the generated inspection procedure By executing M inspection processes according to the data Dt, the capacitances C10 to C30 for each switching state are measured for each circuit board 100, and the execution order of the M inspection processes is defined each time. Compared to the above, for the same type of board to be inspected (circuit board 100), the measurement process of the capacitances C10 to C30 is executed once to generate the inspection procedure data Dt. After, since according to the generated test procedure data Dt may perform insulation test process, it is possible to shorten the inspection time required when many test allogeneic inspection target board (circuit board 100) further.

  In addition, this invention is not limited to said structure. For example, in the above-described insulation inspection apparatus 1, the capacitance measuring unit according to the present invention is configured to include the capacitance measuring unit 5c separately from the voltage measuring unit 5a and the current measuring unit 5b. The configuration of the inspection apparatus is not limited to this, and the voltage measurement unit 5a, the current measurement unit 5b, and the control unit 8 constitute a capacity measurement unit in the present invention, and the control unit 8 uses the measurement data Dv from the voltage measurement unit 5a. A configuration in which the above-described capacitances C10 to C30 and the like are calculated based on measurement data Di and the like from the current measurement unit 5b can also be adopted.

1 is a block diagram showing a configuration of an insulation inspection apparatus 1. FIG. 10 is a flowchart of an insulation inspection process 20. It is explanatory drawing for demonstrating the electric potential and the electrostatic capacitances C10-C30 of the conductor pattern P (probe 12 for an inspection, the signal cable 15) in each test process AC. It is explanatory drawing for demonstrating the electric potential of the conductor pattern P (inspection probe 12, the signal cable 15) in each test process AC, waiting time T1-T3, and the execution order of each test process. It is explanatory drawing for demonstrating the electric potential and the electrostatic capacitance C10 of the conductor pattern P (inspection probe 12, the signal cable 15) in the test process A. FIG. It is explanatory drawing for demonstrating the electric potential and the electrostatic capacitance C20 of the conductor pattern P (Inspection probe 12, Signal cable 15) in the inspection process B. It is explanatory drawing for demonstrating the electric potential and the electrostatic capacitance C30 of the conductor pattern P (inspection probe 12, the signal cable 15) in the test process C. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Insulation inspection apparatus 3 Connection switching part 4 Voltage supply part 4H High potential output part 4L Low potential output part 5 Measuring part 5a Voltage measuring part 5b Current measuring part 5c Capacitance measuring part 8 Control part 12a-12h Inspection probe 15a- 15h Signal cable 20 Insulation inspection processing 100 Circuit board C10, C20, C30 Capacitance Dc, Di, Dv Measurement data Pa to Ph Conductor pattern T1 to T3 Standby time V Inspection voltage

Claims (6)

N book formed on the inspection target board provided with a constant voltage source (N is a natural number of 4 or more), respectively supplying a voltage constant direct voltage as test voltage through the testing probe of N present on the conductor pattern of A supply switching unit that executes a switching process for switching the connection between the high-potential output unit and the low-potential output unit in the voltage supply unit and the inspection probes; and the high-potential output of the conductor patterns. A plurality of first conductor patterns that are in contact with each of the inspection probes connected to a portion, and a plurality of that are in contact with each of the inspection probes that are connected to the low potential output portion of the conductor patterns. A measurement unit that measures an electrical parameter between the second conductor patterns, and the connection switching unit to control the switching process ((M−1) <log ₂ N ≦ M (M is a natural number)) The conditions The insulation state between each of the first conductor patterns and each of the second conductor patterns is inspected based on the electrical parameters measured by controlling the measurement unit in each switching state and executed M times. An insulation inspection apparatus including a control unit that executes inspection processing to inspect the pass / fail of the inspection target substrate by M inspection processing.
The measuring unit is configured to provide an electrostatic for each switching state between the inspection probe brought into contact with the first conductor pattern and the inspection probe brought into contact with the second conductor pattern during each inspection process. the electrical parameters measured after waiting a long KuTadashi constant has been the waiting time of each inspection processing according to the size of the capacity after the start of the supply of the DC constant voltage,
The control unit executes the M inspection processes in order from the inspection process in the switching state in which the electrostatic capacitance is small, and the control unit between the first conductor patterns and the second conductor patterns. An insulation inspection apparatus that terminates the inspection of the substrate to be inspected when it is determined that the insulation state is defective. A capacitance measuring unit for measuring the capacitance for each switching state;
The insulation inspection apparatus according to claim 1, wherein the control unit sequentially executes the inspection process in the switching state in which the capacitance measured by the capacitance measurement unit is small. A storage unit for storing inspection procedure data capable of specifying the execution order of the M inspection processes;
When the inspection procedure data is stored in the storage unit, the control unit executes the M inspection processes according to the stored inspection procedure data, and the inspection procedure data is stored in the storage unit. If not, the capacitance measuring unit is controlled to measure the capacitance for each switching state, and the M times of inspection processing are sequentially performed from the inspection processing in the switching state where the measured capacitance is small. The insulation inspection apparatus according to claim 2, wherein the inspection procedure data is generated and stored in the storage unit by defining an execution order for performing the steps. A DC constant voltage as an inspection voltage is supplied to N conductor patterns (N is a natural number of 4 or more) formed on a substrate to be inspected with a constant voltage source via N inspection probes. The switching process for switching the connection between the high-potential output section and the low-potential output section in the voltage supply section and each of the inspection probes satisfies the condition ((M−1) <log ₂ N ≦ M (M is a natural number)). And a plurality of test probes connected to the high-potential output portion of the conductor patterns while being supplied with the DC constant voltage from the voltage supply portion in each switching state. And measuring an electrical parameter between the first conductor pattern and a plurality of second conductor patterns in contact with the inspection probes connected to the low potential output portion of the conductor patterns. Then, an inspection process for inspecting an insulation state between each of the first conductor patterns and each of the second conductor patterns based on the measured electrical parameters is performed, and the inspection target substrate is performed by M times of the inspection processes. An insulation inspection method for inspecting the quality of
The capacitance between the inspection probe brought into contact with the first conductor pattern and the inspection probe brought into contact with the second conductor pattern at the time of each inspection processing is sequentially reduced from the inspection processing in the switching state. and executes the checking process of M times, during the respective inspection process, wherein the DC constant voltage wait long KuTadashi boss was the the inspection process every according to the size of the capacitance of each switching state The inspection during the inspection when the electrical parameter is measured after waiting after the start of the supply, and the insulation state between the first conductor pattern and the second conductor pattern is determined to be defective An insulation inspection method for ending inspection on a target substrate.   The insulation inspection method according to claim 4, wherein the capacitance for each switching state is measured, and the measurement is performed in order from the inspection processing in the switching state where the measured capacitance is small.   When the inspection procedure data that can specify the execution order of the M inspection processes does not exist, the capacitance for each switching state is measured, and the inspection processing in the switching state in which the measured capacitance is small 6. The insulation inspection method according to claim 5, wherein the inspection procedure data is generated by defining an execution order in which the M inspection processes are executed in order, and the M inspection processes are executed according to the generated inspection procedure data.

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