JP6173836B2 - Substrate inspection apparatus and substrate inspection method - Google Patents

Description

  The present invention relates to a board inspection apparatus and a board inspection method for inspecting a conductive state of a conductor pattern on a circuit board.

As this type of substrate inspection apparatus, a continuity inspection apparatus disclosed by the applicant in Japanese Patent Application Laid-Open No. 2010-25871 is known. When conducting a continuity test on a plurality of nets ( wiring patterns ) on a circuit board, this continuity test device connects each net in series using a probe that is in contact with each net (each test target part). It is possible to inspect each net at once. For this reason, in this continuity inspection apparatus, it is possible to sufficiently improve the inspection efficiency of the continuity inspection as compared with the configuration in which each net is inspected one by one.

JP 2010-25871 A (page 5-7, FIG. 1)

However, the above continuity testing apparatus has the following problems to be improved. That is, in the above-described continuity inspection apparatus, a plurality of nets are connected in series and each net is inspected collectively. In this case, in a bare board (circuit board on which electronic components are not mounted) in which a net is formed on the surface of the board, generally, each net is independently insulated from each other. In this case, the continuity state of each net can be accurately inspected using the continuity inspection apparatus. On the other hand, in recent years of the multilayer circuit board having a plurality of layers the net has been formed, even if the electronic component is not mounted, the net between or within the substrate, net board surface inside the electronic component May be connected to each other. When such a multilayer circuit board is to be inspected, even if a continuity failure (disconnection) occurs in the inspection target net, the net is connected to the other net with a low resistance component. The resistance value between them may be detected low. For this reason, in the above continuity test apparatus, when such a multilayer circuit board is to be inspected, it is erroneously determined that the continuity state is good even though a continuity failure (disconnection) has occurred in the inspection target net. There is a risk of being judged, and improvement of this point is desired.

  This invention is made | formed in view of this subject, and it aims at providing the board | substrate inspection apparatus and board | substrate inspection method which can improve a test | inspection precision.

  In order to achieve the above object, the board inspection apparatus according to claim 1, wherein a plurality of the conductor patterns to be inspected are selected from the conductor patterns of the circuit board, and the probes are brought into contact with the conductor patterns. A processing unit that executes a batch inspection process that collectively tests the conduction state of each conductor pattern in a state where the conductor patterns are connected in series, and the processing units are connected to each other via electronic components. When inspecting the circuit board in which a conductor pattern group composed of the conductor patterns is present, when selecting the conductor pattern to be inspected from the conductor pattern group and executing the collective inspection process, the conductor pattern group Select only one conductor pattern.

  The substrate inspection apparatus according to claim 2 is the substrate inspection apparatus according to claim 1, wherein the processing unit specifies the conductor pattern group based on circuit board data indicating a configuration of the circuit board. Execute specific processing.

Further, the substrate inspection apparatus according to claim 3, wherein, in the substrate inspection device according to claim 1 or 2, wherein the processing unit, the result of the batch test process when the failure, which is the object of the collective inspection process A part of each conductor pattern is selected as a new inspection target and the batch inspection process is executed, and when the result of the batch inspection process for the new inspection target is defective, a part of the new inspection target is selected. Further, by repeating the process of selecting the new inspection object and executing the batch inspection process, the inspection objects are narrowed down until the number of inspection objects including the conductor pattern that may have a poor conduction state becomes two. Later, the conductive state of the two conductor patterns thus narrowed down is inspected, and a defective conductor pattern specifying process for specifying the conductive pattern having a poor conductive state is executed.

  According to a fourth aspect of the present invention, there is provided a method for inspecting a substrate, wherein a plurality of the conductor patterns to be inspected are selected from each conductor pattern of a circuit board and each conductor pattern is connected via a probe in contact with the conductor pattern. A board inspection method for performing a collective inspection process for collectively inspecting the conductive state of each conductor pattern in a state where the conductor patterns are connected in series, and comprising the conductor patterns connected to each other via electronic components When inspecting the circuit board in which the conductor pattern group exists, when selecting the conductor pattern to be inspected from the conductor pattern group and executing the collective inspection process, only one conductor pattern is selected from the conductor pattern group. Select.

  The substrate inspection method according to claim 5 is the substrate inspection method according to claim 4, wherein the conductor pattern group specifying process for specifying the conductor pattern group based on circuit board data indicating a configuration of the circuit board is performed in the batch. It is executed prior to the inspection process.

A substrate inspection method according to claim 6 is the substrate inspection method according to claim 4 or 5, wherein when the result of the collective inspection process is defective, the conductor pattern as an object of the collective inspection process. A part is selected as a new inspection target, the batch inspection process is executed, and when the result of the batch inspection process for the new inspection target is defective, a part of the new inspection target is further new inspection target The inspection target is narrowed down after the inspection target is narrowed down until the number of inspection targets including the conductor pattern that may have a poor conduction state is reduced to 2 by repeating the process of executing the collective inspection process by selecting A defective conductor pattern specifying process is performed in which the conductive state of the two conductive patterns is inspected and the conductive pattern having a defective conductive state is specified.

  In the substrate inspection apparatus according to claim 1 and the substrate inspection method according to claim 4, when inspecting a circuit board on which a conductor pattern group composed of conductor patterns connected to each other through electronic components exists, When selecting the conductor pattern to be inspected from the conductor pattern group and executing the batch inspection process, only one conductor pattern is selected from the conductor pattern group. For this reason, according to this board inspection apparatus and board inspection method, a plurality of conductor patterns connected via electronic components are not simultaneously selected as inspection targets in a batch inspection process, so that a conductor pattern to be inspected In spite of the disconnection, the current flows to the other conductor pattern to be inspected through the electronic parts, and the conductor state of the conductor patterns to be inspected (the plurality of conductor patterns connected in series) is erroneously determined to be good. When the situation to be judged is surely prevented and a disconnection has occurred in each conductor pattern, it can be determined with high accuracy that the conductive state of the conductor pattern is defective. Therefore, according to the substrate inspection apparatus and the substrate inspection method, compared with the conventional configuration and method in which a conductive pattern having a poor conduction state may be erroneously determined to have a good conduction state, the inspection accuracy for the conductor pattern is improved. It can be improved sufficiently.

  In the substrate inspection apparatus according to claim 2 and the substrate inspection method according to claim 5, a conductor pattern group specifying process for specifying a conductor pattern group is executed based on circuit board data indicating the configuration of the circuit board. Therefore, according to the board inspection apparatus and the board inspection method, for example, the conductor pattern group can be easily specified as compared with the configuration and method of manually specifying the conductor pattern group based on the drawing of the circuit board. Therefore, the inspection efficiency can be sufficiently improved.

Further, in the substrate inspection apparatus according to claim 3 and the substrate inspection method according to claim 6, when the result of the collective inspection process is defective, a part of each conductor pattern subjected to the collective inspection process is newly inspected. Select a target to perform batch inspection processing, and when the result of the batch inspection processing for a new inspection target is defective, select a part of the new inspection target as a new inspection target and execute the batch inspection processing By repeating the process, the conduction state of the two conductor patterns narrowed down is inspected after narrowing down the inspection object until the number of inspection objects including the conductor pattern having a bad conduction state becomes two . A defective conductor pattern specifying process for specifying a conductor pattern is executed. Therefore, according to the substrate inspection apparatus and the substrate inspection method, when the result of the collective inspection process is defective, the conductive state is established for each of the plurality of conductor patterns to be inspected in the collective inspection process. Compared with the configuration and method for inspecting pass / fail, a conductor pattern with a poor continuity state can be identified with a small number of inspections, so that the efficiency of inspection for identifying a defective conductor pattern can be sufficiently improved.

1 is a configuration diagram showing a configuration of a substrate inspection apparatus 1. FIG. It is a block diagram which shows the typical structure of the circuit board 100a. It is a block diagram which shows the typical structure of the circuit board data Dp. It is a block diagram which shows the typical structure of the circuit board 100b. 2 is a configuration diagram showing a schematic configuration of a circuit board 200. FIG.

  Hereinafter, embodiments of a substrate inspection apparatus and a substrate inspection method will be described with reference to the accompanying drawings.

  Initially, the structure of the board | substrate inspection apparatus 1 shown in FIG. 1 as an example of a board | substrate inspection apparatus is demonstrated. The board inspection apparatus 1 includes, for example, circuit boards 100a and 100b (hereinafter, not distinguished) that have a plurality of nets N1 to N9 (corresponding to conductor patterns, hereinafter also referred to as “net N” when not distinguished) shown in FIGS. The conduction state of each net N in the circuit board (sometimes also referred to as “circuit board 100”) can be inspected according to a board inspection method described later. Specifically, as shown in FIG. 1, the substrate inspection apparatus 1 includes a substrate holding unit 2, a probe unit 3, a moving mechanism 4, a scanner unit 5, an inspection unit 6, a storage unit 7, and a control unit 8. Has been. In this case, the inspection unit 6 and the control unit 8 constitute a processing unit.

  The board holding unit 2 includes a mounting table and a fixing mechanism (both not shown) and is configured to hold the circuit board 100. As shown in FIG. 1, the probe unit 3 includes a plurality of probes 31 and is configured in a jig shape. In this case, the probe unit 3 probes the contact points P1 to P18 (see FIG. 2; hereinafter referred to as “contact point P” when not distinguished) defined in advance on each net N of the circuit board 100. The number and arrangement pattern of the probes 31 are defined so that the 31 contacts one by one. The moving mechanism 4 executes probing by moving the probe unit 3 in the vertical direction under the control of the control unit 8.

  The scanner unit 5 includes a plurality of switches (not shown), and switches each switch to an on state or an off state according to the control of the control unit 8, so that each probe 31 of the probe unit 3 and the inspection unit 6 are switched. Connect to and disconnect from.

  The inspection unit 6 includes a signal output unit (not shown), and generates and outputs an inspection signal S (for example, DC voltage) according to the control of the control unit 8. In addition, the inspection unit 6 controls the current flowing through the net N in a state where the inspection signal S is supplied (output) to the net N of the circuit board 100 via each probe 31 of the probe unit 3 according to the control of the control unit 8. (Electric signal input via the probe 31) is measured, and the conduction state of the net N is inspected based on the current value.

  The storage unit 7 stores circuit board data Dp used in a collective inspection process (to be described later) executed by the control unit 8. In this case, the circuit board data Dp is data indicating the configuration of the circuit board 100. For example, as shown in FIG. 3, information for identifying each net N formed on the circuit board 100 (shown in FIG. 3). "Net name"), information indicating the number of contact points P with which the probes 31 provided in each net N are brought into contact (for example, "number of points" shown in the figure), information identifying each contact point P (same as above) "Point number" shown in the figure), information indicating electronic components connected to each net N (for example, "connection part number" shown in the figure), and net groups G1 to G3 (corresponding to conductor pattern groups) to be described later In the following, information ("net group number" shown in the figure) indicating "net group G" when not distinguished from each other is included.

  In this case, in this configuration, the initial (initial state) circuit board data Dp does not include information indicating the net group G, and the net group specifying process (conductor pattern group specifying) described later executed by the control unit 8 is performed. When the net group G is specified by processing, the control unit 8 adds (overwrites) information indicating the net group G to the original circuit board data Dp and stores the information in the storage unit 7. In addition, the storage unit 7 stores a result of batch inspection processing executed by the inspection unit 6 and the control unit 8.

  The control part 8 controls each part which comprises the board | substrate inspection apparatus 1 according to the operation signal output from the operation part outside a figure. Specifically, the control unit 8 controls the movement of the probe unit 3 by the moving mechanism 4. Moreover, the control part 8 performs a net group specific process. In this net group specifying process, the control unit 8 is a component such as a conductive resistor as an example of an electronic component (for example, the conductive components R1 to R5 shown in FIG. A net group G composed of the nets N connected through the circuit board data Dp is specified.

  Further, the control unit 8 selects a plurality of nets N to be inspected from the nets N of the circuit board 100 and collectively checks the conduction state of the nets N in a state where the nets N are connected in series. The inspection process is executed together with the inspection unit 6. Further, in this collective inspection process, when the control unit 8 selects the plurality of nets N to be inspected, the net group G exists on the circuit board 100 as a result of executing the above-described net group specifying process. When selecting the inspection target net N from within the net group G, only one net N is selected from the net group G (one from each net group G when there are a plurality of net groups G).

  Further, the control unit 8 (and the inspection unit 6), when the result of the collective inspection process is defective, that is, one or more of the plurality of nets N to be inspected is a conduction failure point Nb such as disconnection (see FIG. 4). When there is an error, the process of selecting a part of each net N targeted for the batch inspection process as a new inspection target and executing the batch inspection process is repeated until there are two inspection target nets N. After that, a defective net specifying process (defective conductor pattern specifying process) for inspecting the conductive state of the two nets N and specifying the net N having a defective conductive state is executed.

  Next, as an example, a substrate inspection method for inspecting the conduction state of each net N in the circuit boards 100a and 100b shown in FIGS. 2 and 4 using the substrate inspection apparatus 1, and the operation of the substrate inspection apparatus 1 at that time, This will be described with reference to the drawings.

  First, the circuit board 100a to be inspected is placed on a mounting table (not shown) of the board holding unit 2, and then the circuit board 100a is fixed by a fixing mechanism (not shown) of the board holding unit 2 to The substrate 100 a is held by the substrate holding unit 2. Subsequently, an inspection start operation is performed using an operation unit (not shown). At this time, the control unit 8 controls the moving mechanism 4 according to the operation signal output from the operation unit, and moves the probe unit 3 toward the circuit board 100a (downward) as shown in FIG. Thereby, the tip of each probe 31 of the probe unit 3 is brought into contact (probing) with each contact point P of each net N.

  Next, the control unit 8 reads the circuit board data Dp from the storage unit 7. Subsequently, the control unit 8 executes a net group specifying process. In this net group specifying process, the control unit 8 converts the net group G formed of the nets N connected through the conductive components R from the nets N formed on the circuit board 100a to the circuit board data. Specify based on Dp. Specifically, as shown in FIG. 2, in the circuit board 100a, the conductive component R1 is connected to the net N1 and the net N2, and the nets N1 and N2 are connected via the conductive component R1. The control unit 8 determines this based on information (see FIG. 3) indicating the conductive component R connected to each net N included in the circuit board data Dp, and uses the nets N1 and N2 to Specify that group G is configured. Further, the control unit 8 sets the identified net group G as the net group G1, and associates the information indicating the net group G1 (the numerical value of the net group number “1” shown in the figure) with the information indicating the nets N1 and N2. In addition to the circuit board data Dp, the data is stored in the storage unit 7.

  Similarly, as shown in FIGS. 2 and 3, the control unit 8 is connected via the nets N3 and N4 connected via the conductive parts R2 and R3 and the conductive parts R4 and R5. It is specified that the net group G is configured by the nets N7 to N9. Further, the control unit 8 shows the net groups G2 and G3 with the net group G constituted by the nets N3 and N4 as the net group G2 and the net group G constituted by the conductive components R4 and R5 as the net group G3. Information is stored in the storage unit 7 in addition to the circuit board data Dp.

  Next, the inspection unit 6 and the control unit 8 execute a first batch inspection process. In this collective inspection process, the control unit 8 reads the circuit board data Dp from the storage unit 7 and selects a plurality of (for example, four) nets N to be inspected from the nets N indicated by the circuit board data Dp. select. In this case, net groups G1 to G3 exist on the circuit board 100a (see FIGS. 2 and 3). For this reason, the control part 8 selects the net | network N as a test object one by one from the three net groups G1-G3. As an example, the control unit 8 selects the net N1 from the net group G1, selects the net N3 from the net group G2, and selects the net N7 from the net group G3. Further, a net N6 that does not belong to the net group G (not connected to another net N via the conductive component R) is selected.

  Subsequently, the control unit 8 controls the scanner unit 5 so that the selected nets N1, N3, N6, and N7 are connected in series, and contacts the contact points P of the nets N1, N3, N6, and N7. The probe 31 is connected. Specifically, for example, contact point P2 of net N1 and contact point P5 of net N3 are connected, contact point P6 of net N3 and contact point P11 of net N6 are connected, and contact point P12 of net N6 and The scanner unit 5 is controlled so that the contact point P13 of the net N7 is connected. In this case, each contact point P is connected in series via each probe 31 in contact with each contact point P and the internal wiring of the scanner unit 5 connected to each probe 31.

  Next, the control unit 8 controls the scanner unit 5 to contact points P located at both ends of the nets N1, N3, N6, and N7 connected in series (in this example, the contact point P1 of the net N1, and the net The probe 31 in contact with the contact point P14) of N7 is connected to the inspection unit 6. Subsequently, the control unit 8 controls the inspection unit 6 to output the inspection signal S. As a result, the inspection signal S is supplied to the nets N1, N3, N6, and N7 connected in series.

  Next, the control unit 8 controls the inspection unit 6 to inspect the conduction states of the nets N1, N3, N6, and N7. In this case, the inspection unit 6 inputs and measures the current flowing through the nets N1, N3, N6, and N7 as the inspection signal S is supplied via the probe 31. Subsequently, the inspection unit 6 calculates a resistance value based on the measured current value and the voltage value of the inspection signal S, compares the resistance value with the reference value, and conducts the nets N1, N3, N6, and N7. Check the condition.

  In this case, as shown in FIG. 2, when the nets N1, N3, N6, and N7 are connected normally without any disconnection (conducting failure location), the resistance value is equal to or less than the reference value. It is determined that the conduction states of N1, N3, N6, and N7 are good. Next, the control unit 8 controls the inspection unit 6 to stop the output of the inspection signal S. Further, the control unit 8 causes the storage unit 7 to store the inspection result of the conduction state by the inspection unit 6.

  Subsequently, the inspection unit 6 and the control unit 8 execute a second batch inspection process. In the second batch inspection process, the control unit 8 selects a plurality of nets N to be inspected from nets N that are not inspected in the first batch inspection process (hereinafter also referred to as “untargeted nets N”). select. In this case, there is no untargeted net N that does not belong to the net group G (not connected to another net N via the conductive component R) at this time, and the three net groups G1 to G3 Each untargeted net N exists. For this reason, the control unit 8 selects one net N to be inspected from each net group G1 to G3 (three in total). As an example, the control unit 8 selects the net N2 from the net group G1, selects the net N4 from the net group G2, and selects the net N8 from the net group G3.

  Next, the control unit 8 controls the scanner unit 5 to connect the selected nets N2, N4, and N8 in series, and then touches the contact points P located at both ends of the serially connected N2, N4, and N8. The probe 31 that is in contact is connected to the inspection unit 6. Next, the control unit 8 controls the inspection unit 6 to output the inspection signal S.

  Subsequently, the control unit 8 controls the inspection unit 6 to inspect the conduction states of the nets N2, N4, and N8. In this case, as shown in FIG. 2, since the nets N2, N4, and N8 are normally disconnected and disconnected, the inspection unit 6 determines that the conductive states of the nets N2, N4, and N8 are good. Next, the control unit 8 controls the inspection unit 6 to stop the output of the inspection signal S and causes the storage unit 7 to store the inspection result of the conduction state by the inspection unit 6.

  Subsequently, the inspection unit 6 and the control unit 8 execute a third batch inspection process. In this case, since there are untargeted nets N in the two net groups G2 and G3 at this time, the control unit 8 selects one net N as an inspection target from each net group G2 and G3. Select (two in total). Specifically, the control unit 8 selects the net N5 from the net group G2 and selects the net N9 from the net group G3.

  Next, the control unit 8 controls the scanner unit 5 to connect the selected nets N5 and N9 in series, and then contacts the contact points P located at both ends of the N5 and N9 connected in series. The probe 31 is connected to the inspection unit 6. Next, the control unit 8 controls the inspection unit 6 to output the inspection signal S. Subsequently, the control unit 8 controls the inspection unit 6 to inspect the conduction states of the nets N5 and N9. In this case, as shown in FIG. 2, since the nets N5 and N9 are normally connected without disconnection, the inspection unit 6 determines that the conduction state of the nets N5 and N9 is good. Next, the control unit 8 controls the inspection unit 6 to stop the output of the inspection signal S and causes the storage unit 7 to store the inspection result of the conduction state by the inspection unit 6. Thus, the inspection of the circuit board 100a is completed.

  Here, in this board | substrate inspection apparatus 1, as above mentioned, the batch inspection process which test | inspects a continuity state in the state which connected the some net | network N in series is performed. For this reason, it is possible to sufficiently improve the inspection efficiency as compared with the configuration in which the inspection of the continuity state is performed on each of the nets N.

  Next, when the circuit board 100b shown in FIG. 4 is inspected, the circuit board 100b is held by the board holding unit 2 and the inspection start operation is performed as described above. At this time, the control unit 8 controls the moving mechanism 4 to move the probe unit 3, whereby the tips of the probes 31 of the probe unit 3 come into contact with the contact points P of the nets N (probing). )

  Subsequently, the inspection unit 6 and the control unit 8 execute a first batch inspection process. In this case, the control unit 8 selects the nets N1, N3, and N7 from the net groups G1, G2, and G3 as the nets N to be inspected in the same manner as in the inspection for the circuit board 100a, and the net group. A net N6 that does not belong to G is selected.

  Next, the control unit 8 controls the scanner unit 5 to connect the selected nets N1, N3, N6, and N7 in series, and then is positioned at both ends of the serially connected N1, N3, N6, and N7. The probe 31 that is in contact with the contact point P is connected to the inspection unit 6. Next, the control unit 8 controls the inspection unit 6 to output the inspection signal S, and subsequently controls the inspection unit 6 to inspect the conduction states of the nets N1, N3, N6, and N7. Here, as shown in FIG. 4, when the disconnection (conducting failure location Nb) occurs in the net N1, the resistance value exceeds the reference value, so that the inspection unit 6 has the nets N1, N3, N6, N7 (these It is determined that the conduction state of one or more of the nets N) is defective. Next, the control unit 8 controls the inspection unit 6 to stop the output of the inspection signal S and causes the storage unit 7 to store the inspection result of the conduction state by the inspection unit 6.

  Here, in the configuration and method for selecting the net N as the inspection target without considering the net group G, a plurality of nets N (for example, the conductive parts shown in FIG. 4) connected via the conductive parts R are used. There is a possibility that a plurality of nets N1, N2) connected via R1 are selected as inspection targets. When such nets N1 and N2 are selected as inspection targets, the nets N1 and N2 are in a good conduction state even though the conduction failure point Nb exists in the net N1, as shown in FIG. An erroneous determination will be made. Specifically, for example, the nets N1 and N2 are selected as inspection targets, the contact point P2 of the net N1 and the contact point P3 of the net N2 are connected, the nets N1 and N2 are connected in series, and the nets N1 and N2 are connected in series. When the collective inspection process is executed by connecting the probes 31 that are in contact with the contact points P1 and P4 located at both ends of N2 to the inspection unit 6, the continuity failure point Nb exists in the net N1. However, as a result of the current flowing through the net N2 through the conductive component R1, it is erroneously determined that the nets N1 and N2 are in a good conduction state.

  On the other hand, in the board inspection apparatus 1 and the board inspection method, as described above, in the collective inspection process, one net group G composed of the nets N connected to each other through the conductive component R is one. Only the net N is selected as an inspection target. For this reason, in the board inspection apparatus 1 and the board inspection method, a plurality of nets N connected via the conductive component R are not simultaneously selected as inspection targets in the batch inspection process. Despite the occurrence of disconnection in N, it is certain that a current flows through the conductive object R to another inspection target net N, and that the inspection target net N is erroneously determined to have a good conduction state. To be prevented. That is, when a disconnection occurs in the net N, it is determined with high accuracy that the conduction state of each net N to be inspected including the net N is defective.

  Subsequently, the inspection unit 6 and the control unit 8 execute the second batch inspection process execution and the third batch inspection process execution in the same manner as the above-described inspection for the circuit board 100a. In this case, as shown in FIG. 4, since the disconnection has not occurred in the nets N2 to N9 other than the net N1, the inspection unit 6 determines that the conduction states of the nets N2 to N9 are good.

  Here, as described above, in the first batch inspection process, the inspection unit 6 determines that the conduction state of the nets N1, N3, N6, and N7 (one or more of these nets N) is defective. Yes. At this time, the inspection unit 6 and the control unit 8 execute a defective net specifying process for specifying a net N having a poor conduction state. In the defective net identification process, the inspection unit 6 and the control unit 8 select a part of the nets N1, N3, N6, and N7 that are the inspection targets in the first batch inspection process as new inspection targets, and perform the batch inspection process. The process of executing is repeated.

  Specifically, the inspection unit 6 and the control unit 8 select two nets N1 and N3 as a part of the four nets N1, N3, N6, and N7, for example, the contact point P2 of the net N1 and the net N3. The contact points P5 are connected via the probe 31 to connect the nets N1 and N3 in series, and in this state, the batch inspection process (first batch inspection process in the defective net identification process) is executed. In this case, since the disconnection has occurred in the net N1, the inspection unit 6 determines that the conduction state of the nets N1 and N3 is defective.

  Next, the inspection unit 6 and the control unit 8 select the two nets N6 and N7 as other parts of the four nets N1, N3, N6, and N7, for example, the contact point P15 of the net N6 and the net N7. The contact point P16 is connected via the probe 31 so that the nets N6 and N7 are connected in series, and in this state, the collective inspection process (second collective inspection process in the defective net specifying process) is executed. In this case, since no disconnection has occurred in the nets N6 and N7, the inspection unit 6 determines that the conduction states of the nets N6 and N7 are good.

  At this time, since there are two nets N (nets N to be inspected) that may be in a poor conduction state (nets N1 and N3), the inspection unit 6 and the control unit 8 subsequently One of N3 (for example, the net N1) is selected, and the conduction state inspection for the net N1 (individual inspection of the net N1) is performed. At this time, the inspection unit 6 determines that the conduction state of the net N1 is defective. Next, the control unit 8 selects the other of the nets N1 and N3 (in this example, the net N3), and checks the conduction state of the net N3. At this time, the inspection unit 6 determines that the conduction state of the net N3 is good. Thereby, it is specified that only the net N1 of the nets N1, N3, N6, and N7, in which the conductive state is determined to be defective in the first batch inspection process, is defective.

In this case, in the method of repeating the above-described defective net identification process, that is, the process of executing the batch inspection process by narrowing down the inspection target, as an example, there are m nets N to be subjected to the defective net identification process, and one net When disconnection occurs only in N (however, it is not possible to grasp how many nets N are disconnected at the time of starting the defective net identification process), the log ₂ m value is rounded up to the value By inspecting the number of times multiplied by 2, it is possible to identify a net N having a poor conduction state. For example, when m is 16, it is possible to identify a net N having a poor conduction state by eight inspections. On the other hand, in the configuration and method for inspecting the quality of the conduction state for each of the m nets N determined to be defective in the collective inspection process, when m is 16, If the above inspection is not performed, it is impossible to identify the net N having a poor conduction state. For this reason, in this board | substrate inspection apparatus 1 and a board | substrate inspection method, it is possible to identify the net | network N with a bad conduction | electrical_connection state by few inspection frequency.

  Although an example in which only one net N is disconnected has been described above, when a disconnection occurs in a plurality of nets N, for example, in the above example, when a disconnection also occurs in the net N6, a defective net In the second batch inspection process in the specific process, the continuity of the nets N6 and N7 is determined to be defective. At this time, the inspection unit 6 and the control unit 8 respectively conduct the inspection of the continuity state (individual inspection) for the nets N6 and N7, thereby specifying that the continuity state of the net N6 is defective.

  As described above, in the board inspection apparatus 1 and the board inspection method, when inspecting the circuit board 100 having the net group G composed of the nets N connected to each other through the conductive component R, the net group is inspected. When selecting a conductor pattern to be inspected from G, only one net group G is selected from the net group G. For this reason, according to this board | substrate inspection apparatus 1 and the board | substrate inspection method, since the some net | network N connected via the electroconductive component R is not simultaneously selected as an inspection object in collective inspection processing, In spite of the disconnection of the net N, the current flows to the other net N to be inspected via the conductive component R, and the continuity of the nets N to be inspected (in series connection) When it is reliably prevented that the state is erroneously determined and a disconnection occurs in each net N, it is determined with high accuracy that the conduction state of the net N is defective. Therefore, according to the substrate inspection apparatus 1 and the substrate inspection method, the inspection accuracy with respect to the conductor pattern is compared with the conventional configuration and method in which the net N having a poor conduction state may be erroneously determined as being in a good conduction state. Can be sufficiently improved.

  Moreover, in this board | substrate inspection apparatus 1 and a board | substrate inspection method, the net group specific process which specifies the net group G based on the circuit board data Dp is performed. For this reason, according to the board inspection apparatus 1 and the board inspection method, for example, the net group G is easily specified as compared with the configuration and method for manually specifying the net group G based on the drawing of the circuit board 100. Therefore, the inspection efficiency can be sufficiently improved.

  Further, in this substrate inspection apparatus 1 and substrate inspection method, when the result of the collective inspection process is defective, a part of the net N targeted for the collective inspection process is selected as a new inspection object and the collective inspection process is executed. This process is repeated until the number of nets N to be inspected becomes two, and then the continuity state of the two nets N is inspected to execute a defective net identification process for identifying the net N having a poor continuity state. For this reason, according to this board | substrate inspection apparatus 1 and a board | substrate inspection method, when the result of a batch inspection process is unsatisfactory, it is a conduction | electrical_connection state with respect to each of the some net | network N made into the test object in the batch inspection process. Compared with the configuration and method for inspecting the quality of the product, the net N having a poor conduction state can be identified with a small number of inspections, so that the efficiency of the inspection for identifying the defective net N can be sufficiently improved. .

  The substrate inspection apparatus and the substrate inspection method are not limited to the configuration and method described above. For example, the example in which the circuit board 100 on which the net N connected through the conductive component R (component having conductivity) as an example of the electronic component exists is described above. Various effects such as those described above can be obtained by executing the same processing as described above on the circuit board 100 including various components such as inductors and ICs and including the net N connected via these electronic components. Can be realized.

  Moreover, although the example applied to the configuration and method for inspecting only the conduction state of the net N has been described above, it can also be applied to the configuration and method for inspecting the insulation state between the nets N in addition to the inspection of the conduction state. . In this case, after the conduction state inspection (collective inspection process) is completed, the insulation state inspection can be performed, or after the insulation state inspection is performed, the conduction state inspection can be performed. When the net N selected from one net group G and the net N selected from the other net group G are short-circuited, that is, when the insulation between the net groups G is poor, the selected net N is disconnected. Even if it occurs, there is a possibility that the conduction state of each net N is determined to be good in the batch inspection process due to a short circuit of each net N. Therefore, the inspection accuracy can be further improved by performing the inspection of the insulation state prior to the collective inspection process and executing the collective inspection process for only the net group G in which the insulation state between the net groups G is good. it can.

  Further, in the above example, the circuit board 100 in which the contact points P are provided only at both ends of each net N without each net N having a branch portion is an inspection target, as shown in FIG. In addition, the circuit board 200 provided with the net N16 having a branching portion and having contact points P (contact points P32 and P33 in the figure) provided at the tip of each branching portion can also be examined. . In this case, when inspecting the conduction state of the net N16 having a branch portion in this way, one contact point P (for example, the contact point P31) among the contact points P31 to P34 is set as a starting point (representative contact point). The part between the contact point P31 and the contact point P32, the part between the contact point P31 and the contact point P33, and the part between the contact point P31 and the contact point P34 are individually inspected. set to target.

  Specifically, when inspecting the circuit board 200, for example, in the first batch inspection process, the nets N11, N13, and N17 are selected from the three net groups G11 to G13 shown in FIG. (One net N is selected from each net group G), and a portion between the contact points P31 and P32 in the net N16 is selected as an inspection target. In the second batch inspection process, the nets N12, N14, and N18 are selected from the net groups G11 to G13 as inspection targets, and the portion between the contact points P31 and P33 in the net N16 is selected as the inspection target. Further, in the third batch inspection process, the nets N15 and N19 are selected from the net groups G12 and G13 as inspection targets, and the portion between the contact points P31 and P34 in the net N16 is selected as the inspection target. By selecting the inspection target for the collective inspection process in this way, the above-described various effects can be realized even when inspecting the circuit board 200 including the net N16 having the branch portion.

  Further, the configuration and method for specifying the net group G by the control unit 8 based on the circuit board data Dp have been described above, but information indicating the net group G for the circuit board 100 to be inspected is stored in the storage unit 7 in advance. Alternatively, it is possible to adopt a configuration and method in which the information is read out during the batch inspection process and the net group G to be inspected is selected.

  Further, instead of the above-described defective net specifying process, each of the nets N determined to be defective in the collective inspection process is inspected for the good or defective of the conductive condition, and the net N having a defective conductive condition. It is also possible to adopt a configuration and method for specifying

DESCRIPTION OF SYMBOLS 1 Board inspection device 6 Inspection part 8 Control part 100a, 100b, 200 Circuit board Dp Circuit board data G1-G3, G11-G13 Net group N1-N9, N11-N19 Net R1-R5, R11-R15 Conductive component

Claims (6)

A plurality of the conductor patterns to be inspected are selected from the conductor patterns on the circuit board, and the conductor patterns are connected in series through a probe in contact with the conductor patterns. Provided with a processing unit that performs batch inspection processing that collectively checks the continuity state,
The processing unit selects a conductor pattern to be inspected from the conductor pattern group when inspecting the circuit board on which the conductor pattern group composed of the conductor patterns connected to each other via electronic components exists. A board inspection apparatus that selects only one conductor pattern from the conductor pattern group when executing the collective inspection process.   The board inspection apparatus according to claim 1, wherein the processing unit executes a conductor pattern group specifying process for specifying the conductor pattern group based on circuit board data indicating a configuration of the circuit board. Wherein the processing unit is configured when the result of the collective inspection process is defective, by selecting a portion of the respective conductive patterns were included in the batch test process as a new test object executes the batch inspection process, the When the result of the collective inspection process for a new inspection object is defective, a part of the new inspection object is further selected as a new inspection object, and the process of executing the collective inspection process is repeated so that the continuity state is obtained. After narrowing down the inspection object until the number of inspection objects including the conductor pattern having a possibility of failure becomes two, the conduction state of the two conductor patterns thus narrowed down is inspected, and the conductor pattern in which the conduction state is defective The board inspection apparatus according to claim 1, wherein a defective conductor pattern specifying process for specifying is executed. A plurality of the conductor patterns to be inspected are selected from the conductor patterns on the circuit board, and the conductor patterns are connected in series through a probe in contact with the conductor patterns. A substrate inspection method for performing a collective inspection process for inspecting a continuity state collectively,
When inspecting the circuit board in which a conductor pattern group composed of the conductor patterns connected to each other via electronic components is present, the conductor pattern to be inspected is selected from the conductor pattern group and the collective inspection is performed. A substrate inspection method for selecting only one conductor pattern from the conductor pattern group when executing processing.   5. The substrate inspection method according to claim 4, wherein a conductor pattern group specifying process for specifying the conductor pattern group based on circuit board data indicating a configuration of the circuit board is executed prior to the collective inspection process. Wherein when batch inspection processing result is defective, by selecting a portion of the respective conductive patterns it was included in the batch test process as a new test object executes the batch inspection process, for the new inspection target When the result of the collective inspection process is defective, a part of the new inspection object may be further selected as a new inspection object, and the process of executing the collective inspection process may be repeated, whereby the conduction state may be defective. Defective conductor for specifying the conductor pattern in which the conduction state is defective by inspecting the conduction state of the two narrowed conductor patterns after narrowing down the inspection object until the number of inspection objects including the certain conductor pattern becomes two 6. The substrate inspection method according to claim 4, wherein the pattern specifying process is executed.

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