JPH09230005A - Circuit board testing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To shorten the test time while keeping the certainty of a test by comparing electric characteristic data measured when a moving probe comes into contact with a plurality of circuit patterns with reference data corresponding to the above data. SOLUTION: A fixing probe 5 is electrically connected to a conductive plate 12 and a moving probe 4 is moved in contact with a circuit board 2 to be brought into contact with a plurality of circuit patterns P formed on the board 2. If electrostatic capacity measured by an electric characteristic measuring means 41 when the probe 4 comes into contact with each circuit pattern P is not within the tolerance of electrostatic capacity as previously stored reference data, a board 2 is determined to be faulty. Further, resistance values at both ends of each circuit pattern P are measured to test the board 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to printed circuit boards and I
C package, hybrid board and MCM (Mult
The present invention relates to a circuit board inspection device for inspecting the quality of a circuit board such as an i Chip Module) and the like, specifically, the circuit pattern of the circuit board and the mounted circuit components.

[0002]

2. Description of the Related Art Due to recent advances in semiconductor manufacturing technology and printing technology, for example, IC packages are manufactured with extremely high precision and high density, with a circuit pattern width of 0.1 mm and a circuit pattern interval of 0.15 mm. It is like this. As a circuit board inspection device for inspecting such a high-definition circuit board, there is one disclosed in Japanese Patent Laid-Open No. 8-15361.

This conventional circuit board inspection apparatus comprises a probe for connecting to one end of each circuit pattern and a contact probe for connecting to the other end of the circuit pattern. In this circuit board inspection device, a probe is connected to one end of each circuit pattern, the contact probe to which a voltage is applied is continuously moved while contacting the circuit board, and the probe and the contact probe are moved during the movement. Inspect for electrical continuity. Thus, when inspecting a circuit pattern having a narrow pattern width, a so-called XY in-circuit tester, that is, two probes are moved in the XY direction on the circuit board, and then both probes are lowered to move each circuit. The reliability of the inspection is improved because it is not necessary to make the contact probe fixedly contact with each circuit pattern, as compared with a device in which conduction is inspected by fixedly contacting both ends of the pattern.

[0004]

However, the conventional circuit board inspection apparatus has the following problems. First, for example, the common terminal of the integrated resistor is connected to a common pattern such as a power source and ground, and each independent terminal of the integrated resistor is
When conducting a continuity test of circuit patterns that are respectively connected to a plurality of circuit patterns independent of each other,
There are the following problems. That is, the conventional circuit board inspecting device detects the disconnection of the circuit pattern by utilizing the principle that both the probes instantaneously always contact both ends of one circuit pattern. Therefore, even if the probe is connected to the common pattern and the contact probe is moved on a plurality of circuit patterns, one of the resistance elements in the integrated resistor is defective, or one of the plurality of circuit patterns is In the case where one of them is broken, it is possible to confirm the continuity by the normal circuit pattern connected to the normal resistance element, but it is not possible to detect the defect or the break. In this case, the disconnection inspection of each circuit pattern can be performed by bringing the contact probe into contact with each independent terminal side of the integrated resistor and moving the probe while making contact with the other end side of the plurality of independent circuit patterns. However, in such a case, it is necessary to connect the probe to one end of the circuit pattern on the independent terminal side and move the contact probe for each inspection of each circuit pattern, so that the probe is surely brought into contact with the circuit pattern. Is difficult, and on the contrary, it takes much time for inspection. As described above, the conventional circuit board inspecting device has a problem in that it is impossible to reliably inspect a plurality of circuit patterns commonly connected to each other through circuit components in a short time.

Secondly, in the conventional circuit board inspecting apparatus, the probe must be connected to the other end of the circuit pattern without fail. Therefore, when the disconnection inspection of a large number of circuit patterns is performed, the movement or connection of the probe must be prevented. Therefore, there is a problem that it takes a long time.

Thirdly, since the probe must be connected to the other end of the circuit pattern, it is difficult to surely bring the probe into contact with the circuit pattern when the circuit pattern width is narrow. is there.

Fourthly, the conventional circuit board inspecting device can detect only the disconnection of the circuit pattern, and cannot inspect the circuit pattern defect in which a plurality of circuit patterns are short-circuited with each other. There is a point.

The present invention has been made in view of the above problems, and a main object of the present invention is to provide a circuit board inspection apparatus capable of shortening the inspection time while maintaining the reliability of the inspection. Another object of the present invention is to provide a circuit board inspection device capable of easily and surely inspecting a high-definition circuit board.

[0009]

In order to achieve the above object, a circuit board inspection apparatus according to claim 1 has a predetermined measurement point on the circuit board or a predetermined electrical relationship with a circuit pattern of the circuit board. Fixed probe that can be conducted by touching the measurement point of, a moving probe that can be conducted by contacting the circuit pattern on the circuit board, and a movement path that is preset with the moving probe in contact with the circuit board A probe movement control means for moving the probe and a measuring means for continuously measuring electrical characteristic data between the fixed probe and the moving probe during movement, and a circuit based on the measured electrical characteristic data. A circuit board inspection device for inspecting a board, the reference corresponding to electrical characteristic data at each movement position or movement elapsed time on a movement path of a movement probe. Characterized in that it comprises a storage means for storing a over data, and inspecting means for inspecting the circuit board by the each measured electrical property data were compared with the reference data corresponding thereto.

In this circuit board inspection apparatus, in a state where the fixing probe is in contact with a measurement point on the circuit board or the like,
The probe movement control means causes the movement probe to move along a preset movement path while being in contact with the circuit board.
In this case, when the moving probe sequentially contacts the plurality of circuit patterns, the electrical characteristic data such as the electrostatic capacitance and the resistance value is measured by the measuring means each time. On the other hand, the inspection means compares the electrical characteristic data measured by the measuring means with the reference data corresponding to the data and stored in the storage means. As a result, the quality of each circuit pattern is inspected, so that it is possible to reliably inspect a plurality of circuit patterns by one movement of the moving probe. Thus, in this circuit board inspection device, the inspection time is shortened while maintaining the reliability of the inspection.

A circuit board inspecting apparatus according to a second aspect is the circuit board inspecting apparatus according to the first aspect, wherein an insulator that can be adhered to one surface of the circuit board and one surface of the circuit board sandwiching the insulator. And a conductive plate that can be disposed so as to face the conductive plate, and the measuring means, between the conductive pattern and the circuit pattern formed on the other surface of the circuit board, with the fixing probe in contact with the conductive plate. It is characterized in that the capacitance is measured as electrical characteristic data.

In this circuit board inspection apparatus, the measuring means is
The capacitance between the conductive plate and the circuit pattern on the circuit board is measured as electrical characteristic data. In this case, the fixing probe may be connected to the conductive plate, and it is not necessary to connect it to one end of each circuit pattern. Therefore, it is not necessary to connect the fixing probe to each circuit pattern, and the inspection time is shortened. Further, even when the circuit board is manufactured with high precision and the pattern width of the circuit pattern is extremely narrow,
Since it is not necessary to connect the fixing probe to one end of each circuit pattern, the circuit board can be reliably inspected.
Further, even when the plurality of circuit patterns are short-circuited with each other, the short-circuit failure can be surely inspected by the measuring means measuring the capacitance.

A circuit board inspection apparatus according to a third aspect of the present invention is the circuit board inspection apparatus according to the second aspect, wherein the inspection means detects a change point of a data value in the electrical measurement data continuously measured by the measurement means. In addition, the electrical characteristic data at the time when a predetermined time has passed since the change point was detected is compared with the reference data.

In this circuit board inspecting apparatus, when the moving probe moves on a plurality of circuit patterns, the tip of the moving probe contacts one circuit pattern and then a gap between the circuit pattern and the next contacting circuit pattern. The same circuit pattern may be touched across the same circuit. In this case, the tip always contacts only the next circuit pattern after passing through the gap. Therefore, the inspection means captures the electrical characteristic data when a predetermined time determined based on the moving speed or the like has elapsed after detecting the change in the electrical characteristic data, so that the positioning accuracy of the moving probe is slightly low. However, the electrical characteristic data of one circuit pattern and the circuit pattern to be contacted next can be reliably identified.

A circuit board inspecting apparatus according to a fourth aspect is the circuit board inspecting apparatus according to any one of the first to third aspects, wherein the moving probe is a plurality of probes arranged at a predetermined interval. The storage means stores reference data corresponding to each of the plurality of probes, the measurement means measures electrical characteristic data between the fixing probe and the plurality of probes, and the inspection means measures. The circuit board is inspected by comparing each electrical characteristic data of each probe with the corresponding reference data.

For example, in an IC package or the like, there may be a case where a plurality of circuit pattern groups in which a plurality of independent circuit patterns are printed in parallel are further printed at a predetermined interval. Even in such a case, in this circuit board inspection apparatus, since the moving probe is composed of a plurality of probes, by arranging the probes at predetermined intervals, the respective circuits of the plurality of circuit pattern groups can be arranged. The patterns can be inspected at the same time.

A circuit board inspecting apparatus according to a fifth aspect is the circuit board inspecting apparatus according to the fourth aspect, wherein the plurality of probes are independently contactable at arbitrary positions in a direction perpendicular to the surface of the circuit board. It is characterized by being.

In this circuit board inspection device, for example, an IC
In a package or the like, when the surface of a circuit board is formed in a stepped structure and a circuit pattern group is printed on each surface, a plurality of probes individually contact the circuit pattern on each surface. As a result, the circuit pattern on each surface of the stepped structure can be inspected at the same time, which shortens the inspection time.

A circuit board inspection apparatus according to a sixth aspect is the circuit board inspection apparatus according to any one of the first to fifth aspects, wherein the storage means is based on a moving probe that is moved along a preset movement path. The electrical characteristic data measured by the measuring means is stored as reference data.

In this circuit board inspecting device, the measuring means measures the electric characteristic data by moving the moving probe along the predetermined moving path while keeping the moving probe in contact with the circuit board, and the storing means measures the electric characteristic data. The stored electrical characteristic data is stored as reference data. Then, the probe movement control means inspects the moving probe by comparing the electric characteristic data stored by moving the moving probe along the movement path with the newly measured electric characteristic data. As a result, it becomes possible to save the labor of inputting the reference data.

A circuit board inspection apparatus according to a seventh aspect is the circuit board inspection apparatus according to any one of the first to sixth aspects, wherein the circuit board inspection apparatus is fixed to the circuit board inspection apparatus and the circuit board inspection apparatus. An inspection jig configured to include an anisotropic electro-conductive elastic body placed on the circuit board and electrically connected to the circuit pattern on the circuit board is provided. It is characterized by moving on the circuit board.

For example, an IC such as a microcomputer
When the circuit pattern in the package is miniaturized using gold, if the moving probe is moved in contact with the circuit pattern, the circuit pattern will be damaged and the insulation resistance between the circuit patterns will decrease. There is.
When inspecting such a circuit board, in this circuit board inspection apparatus, the probe movement control means moves the moving probe on the circuit board via an anisotropic conductive elastic body such as anisotropic conductive rubber. At this time, since the moving probe is electrically connected to the circuit pattern through the anisotropic conductive elastic body, it is possible to perform the inspection without damaging the circuit pattern.

[0023]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment to which a circuit board inspection apparatus according to the present invention is applied will be described below with reference to the accompanying drawings.

FIG. 1 shows a plan view of a circuit board inspection apparatus 1. The circuit board inspecting apparatus 1 holds the circuit board 2 as an inspection object, and can adhere to the lower surface of the circuit board 2 such as an insulator 11 (see FIG. 2) which is a dielectric material and a lower surface of the insulator 11. Substrate holder 3 to which a flexible conductive plate 12 (see FIG. 2) can be attached, and moving probe 4
A first moving mechanism 6 and a second moving mechanism for moving the fixing probe 5 and the fixing probe 5 in the X direction of the surface of the circuit board 2 (the left-right direction with respect to the paper surface) and the Y direction which is a direction orthogonal to the X direction. 7 and a control device 8 for controlling the movement of both moving mechanisms 6, 7 and inspecting the quality of the circuit board 2.

Next, an outline of the operation of the circuit board inspection device 1 will be described. The circuit board inspecting apparatus 1 is configured so that it can be roughly classified into two types of inspecting methods. In the first inspection method, the circuit board 2 is inspected by measuring the capacitance between each circuit pattern P and the conductive plate 12. Specifically, as shown in FIG. 2, the fixing probe 5
Are electrically connected to the conductive plate 12, and the moving probe 4 is moved in a state of being in contact with the circuit board 2 so as to be brought into contact with a plurality of circuit patterns P formed on the circuit board 2. Then, the moving probe 4 is used for each circuit pattern P.
41 when measuring the electrical characteristics
When the electrostatic capacitance measured by is not within the allowable range of the electrostatic capacitance as the reference data stored in advance, the circuit board 2 is determined to be defective. On the other hand, in the second inspection method, the circuit board 2 is inspected by measuring the resistance value (or voltage value) at both ends of each circuit pattern P. In this inspection method, for example, a common terminal of the integrated resistor is connected to a common pattern such as a power source and a ground, and each independent terminal of the integrated resistor is connected to a plurality of circuit patterns P independent of each other. When inspecting a circuit pattern, the fixing probe 5 is connected to the common pattern, and the moving probe 4 is moved to make contact with a plurality of circuit patterns P one after another. And at that time,
When the resistance value (or voltage value) measured by the electrical characteristic measuring means 9 is not within the allowable range of the resistance value (or voltage value) as the reference data stored in advance, the circuit board 2 is It is determined to be defective.

Next, the above-mentioned components will be described in detail.

The moving probe 4 is integrally composed of three probes 4a, 4b, 4c arranged at a predetermined interval, and each probe 4a, 4b, 4c is arbitrary in a direction perpendicular to the surface of the circuit board 2. Are independently contactable with each other. Thus, for example, when the circuit board 2 to be inspected is an IC package or the like, when the surface of the circuit board 2 is formed in a stepped structure and a circuit pattern group is printed on each surface, a plurality of circuit pattern groups are printed. Probes 4a, 4b, and 4c independently contact the circuit patterns on the respective surfaces. Thereby, the circuit pattern P on each surface of the stepped structure can be inspected at the same time. Further, each of the probes 4a to 4c has a rounded tip end portion, and prevents the circuit pattern P from being damaged when moving on the circuit board 2.

When the circuit board 2 is inspected, the fixing probe 5 is moved above a predetermined measurement point on the circuit board 2 by the second moving mechanism 7, and then fixedly contacts the measurement point.

The first moving mechanism 6 moves the moving probe 4 to the X-axis.
An X-axis guide 21 for moving in the axial direction and a Y-axis guide 22 for moving the X-axis guide 21 in the Y-axis direction are provided. The X-axis guide 21 is attached to the moving body 23 that supports the moving probe 4, and is used for moving in the Z-axis direction that is the vertical direction with respect to the surface of the circuit board 2 and in the θ direction shown in FIG. 1. A motor 24 for moving the probes 4 and a motor 26 for moving the moving body 23 in the X-axis direction by rotating a ball screw 25 provided in the X-axis guide 21 are provided. The Y-axis guide 22 is a motor 2 for moving the X-axis guide 21 in the Y-axis direction by rotating the ball screw 27.
8 is provided. In this first moving mechanism 6, each motor 2
By controlling 4, 26, 28 by the control device 8, the moving probe 4 is moved to an arbitrary position on the X axis and the Y axis, and each of the probes 4a to 4c is moved.
Up and down movement and rotation in the θ direction are possible at that position. As a result, each of the probes 4a to 4c is attached to the circuit board 2
It is possible to move in any direction while being in contact with the surface of.

The second moving mechanism 7 attaches the fixing probe 5 to the X-axis.
An X-axis guide 31 for moving in the axial direction and a Y-axis guide 32 for moving the X-axis guide 31 in the Y-axis direction are provided. The X-axis guide 21 is attached to the moving body 33 that supports the fixing probe 5 and the moving body 33.
Motor 3 for moving the fixing probe 5 in the axial direction
4 and a ball screw 3 arranged in the X-axis guide 31
And a motor 36 for moving the moving body 33 in the X-axis direction by the rotation of 5. In addition, the Y-axis guide 32
Turns the X-axis guide 31 to Y by rotating the ball screw 37.
A motor 38 for moving in the axial direction is provided. In the second moving mechanism 7, each of the motors 34, 36, 38 is controlled by the control device 8 to move the fixing probe 5 to an arbitrary position on the X axis and the Y axis, and at that position. It can move up and down. As a result, the fixing probe 5 can come into contact with an arbitrary position on the circuit board 2. The fixing probe 5 is not limited to the structure that can be moved by the moving body 33, and has a structure in which a clip or the like is provided at the tip and the clip can be connected to the ground line or the power line of the circuit board 2 and the conductive plate 12. May be.

As shown in FIG. 3, the control device 8 has an electric characteristic measuring means 41, a probe movement control means 42, a keyboard 43 for inputting allowable range data of reference data, which will be described later, and an external device. An I / O circuit 44 for exchanging signals with the CRT 46, a CRT controller 45 for controlling image display of the CRT 46, and a CRT 46 for displaying inspection results and the like.

The electrical measuring means 41 includes a switching circuit 51, an electrical characteristic measuring circuit 52, an A / D conversion circuit 53, an I / O circuit 54, a CPU (inspecting means) 55, a ROM 56 and an R.
An AM (storage unit) 57 is provided.

The switching circuit 51 has relays 51a to 51c for switching the connection between the probes 4a to 4c of the moving probe 4 and the electrical characteristic measuring circuit 52, and the I / O circuit 5
A switching signal from the CPU 55 is input via 4 and the relays 51a to 51c are switched according to the switching signal.

The electrical characteristic measuring circuit 52 is configured to be capable of measuring by selecting either electrostatic capacitance measurement or resistance value measurement, and responds to a control signal from the CPU 55 via the I / O circuit 54. Take a measurement. Specifically, when measuring the capacitance, the electrical characteristic measuring circuit 52 outputs a constant voltage AC to the fixing probe 5 and moves via the conductive plate 12, the insulating plate 11 and the circuit pattern P. The conductive plate 1 based on the phase and voltage value of the AC signal input to the probe 4 for
The capacitance between 2 and the circuit pattern P is measured and output as measurement data to the A / D conversion circuit 53. On the other hand, when measuring the resistance value, the electrical characteristic measuring circuit 52 outputs a constant voltage direct current or a constant voltage alternating current to the fixing probe 5, and through the circuit pattern P having the fixing probe 5 connected to one end. The resistance value of the circuit pattern P is measured based on the DC or AC voltage value input to the moving probe 4 and output as measurement data to the A / D conversion circuit 53.
In these cases, the electrical characteristic measuring circuit 52 generates measurement data by sampling the signal each time the relay 51a to 51c switched by the switching signal outputs the signal.

The A / D conversion circuit 53 analog-digital converts the measurement data from the electrical characteristic measurement circuit 52 and outputs it to the CPU 55. The I / O circuit 54 is the CPU 5
The switching signal and the control signal output from the circuit 5 are output to the switching circuit 51 and the electrical characteristic measuring circuit 52, respectively.

The CPU 55 reads the measurement data sequentially output from the electrical characteristic measuring circuit 52 in synchronization with the switching signal, and also stores the measurement data in the RAM 57 and stores the probes 4a-4.
The circuit board 2 is compared with the reference data corresponding to c.
Is determined. Further, the CPU 55 outputs a movement control signal to the probe movement control means 42, and the motors 24, 2
The rotation control of 6, 28, 34, 36, 38 is performed.

The ROM 56 stores the operation program of the CPU 55. The RAM 57 is backed up by a battery (not shown) and stores measurement data and reference data. Functionally, the RAM 57 may be a non-volatile memory, such as an EEPROM (Electrically Erasa).
ble PROM) etc. can also be used.

The probe movement control means 42 described above is also used.
Is an X-Y axis motor control unit 61 and a Z axis motor control unit 62.
And the θ-axis motor control unit 63, and drives the motors 26 and 28 via the XY-axis motor control unit 61 based on a movement control signal from the CPU 55, and drives the motors via the Z-axis motor control unit 62. Drive 24 and 34, and θ
The motor 24 is driven via the shaft motor control unit 63.

Next, the inspection processing in the circuit board inspection apparatus 1 will be described with reference to FIG.

First, the inspection by capacitance will be described. The CPU 55 uses the keyboard 43 to move X, Y
When the movement control data for θ and θ are input (step 71), after the movement control data is read,
It is transferred to the RAM 57 and stored. In this case, the above-mentioned movement control data is input with respect to the start position and the end position of each movement of the movement probe 4 on the circuit board 2. Specifically, regarding the start position, , The position P11 on the X-axis and the Y-axis (represented by (x11, y11) on the coordinate axis) where the moving probe 4 is first plotted on the circuit board 2, and the position P11.
At the end position X, which is the end point of the moving probe 4 and the rotation angle (θ11) of the moving probe 4 with respect to the Z axis.
It is composed of data consisting of a position P12 (x12, y12) on the axis and the Y axis and a distance (z12) that moves upward with respect to the Z axis at that position. These movement control data are input for each movement of the movement probe 4, and this processing is ended.

Next, a non-defective standard substrate is attached to the substrate holder 3.
(Step 72), the fixing probe 5 is connected to the conductive plate 12. Next, the reference data is absorbed by moving the moving probe 4 according to the movement control data input in step 71 (step 73). In this case, as shown in FIG. 5A, first, the measurement data for the first position P11 (x11, y11) is output from the A / D conversion circuit 53, and the measurement data is sequentially output at predetermined time intervals. . It should be noted that in the figure, only the measurement data of the probe 4a is shown as a representative (hereinafter, the inspection process for the probe 4a will be representatively described). If the moving probe 4 comes into contact with the circuit pattern P during this movement, reference numerals D1 to D in FIG.
As shown in FIG. 5, the capacitance between the circuit pattern P and the conductive plate 12 is measured. During this period, the CPU 55 detects a change point (TP1 to TP5) at which the measurement data changes from a small capacitance value to a large capacitance value, and reads a time point after a predetermined time elapses from the change point (RT1 to R5).
At T5), the measurement data at that time is used as the reference data for the circuit pattern P, and is stored in the RAM 57 as a pair with the movement control data corresponding to the reference data. The CPU 55 absorbs all the reference data by executing these processes for each movement control data.

Next, the judgment value is input from the keyboard 43 (step 74). Specifically, as shown in FIG. 5A, the upper limit allowable value Du and the lower limit allowable value Dl are input with each reference data set as the center value Dc. In addition, an allowable ratio with respect to the central value Dc is set in advance,
You may make it set automatically by calculation of CPU55.

Next, the circuit board 2 to be inspected is set on the board holder 3 (step 75), and measurement of electrical characteristics is started (step 76). In the measurement of the electrical characteristics, the measurement data corresponding to each circuit pattern P is measured in the same way as the reference data is absorbed in step 73. Next, the CPU 55 determines whether or not the value of the measurement data is within the range from the upper limit allowable value Du to the lower limit allowable value Dl, and if there is a circuit pattern P that is not within the range, it is determined as a defective product. , Circuit board number to be inspected, "defective"
And the coordinate axis corresponding to the circuit pattern P are displayed on the CRT 46, and the data is stored in the RAM 57.
To memorize. These processes are repeated for each circuit pattern P, and after all circuit patterns P are measured, if all the measured data are within the allowable range, the CPU 55 determines that the product is a good product, and the circuit board to be inspected. The number and the character of "non-defective item" are displayed on the CRT 46 (step 77).

Next, if the inspection is to be continued, the processing from step 75 is repeated (step 78), and if not to be continued, this processing is ended (step 79).

Next, the inspection by the resistance value will be described. It should be noted that only the points different from the inspection by capacitance will be described, and the overlapping points will be omitted.

In this inspection, in step 71, as movement control data, in addition to the movement control data regarding X, Y and θ described above, movement control data regarding X, Y and θ regarding the fixing probe 5, and C
The data regarding the timing of reading the measurement data by the PU 55 (in the case of moving the moving probe 4 at a constant speed, the elapsed time from the start of the movement at the movement start position, or the data on the movement distance from the movement start coordinates) is Is entered. Also, in step 73,
Resistance value (or voltage value input to moving probe 4)
The measurement data of is absorbed as reference data, and step 74
In, enter data regarding the allowable range for the reference data. In this inspection, in step 76, as shown in FIG. 6A, each movement start position P11,
Time t1, t from the time when movement starts on P12 ...
When 2 ... t5 has passed, the CPU 55 reads the measured data at that time, and if the resistance value (or voltage value) at that time is all within the allowable range of the reference data, it is determined as a non-defective product and is shown in FIG. When the measurement data is 0Ω, as at time t3, the measured data is not within the allowable range, so that it is determined that the ground and the circuit pattern P are short-circuited or the circuit components are short-circuited, and the product is defective.

Next, a modified embodiment will be described with reference to FIG. In this modified embodiment, only points different from the above-described embodiment will be described, and detailed description of the same points will be omitted.

As shown in the figure, in this embodiment, the circuit board inspection apparatus 1 includes a plurality of circuit boards 82, 82.
.... Board holder (board fixture) 83 for fixing
And circuit boards 82, 82 fixed to the board holder 83,
These circuit patterns 84, 84 ...
・ Anisotropic conductive rubber (anisotropic conductive elastic body) that conducts to 85
And an inspection jig 81 consisting of The inspection jig 81 is suitable for inspecting a circuit board having a small area such as an IC package of a microcomputer, and the board holder 83 has circuit boards 82, 82 ...
A partition frame (not shown) for restricting the position of the is formed. Therefore, the positions of the circuit boards 82, 82 ... Are regulated with high accuracy.

In the circuit board inspecting apparatus 1, the moving probe 4 is configured to be moved on the circuit board 82 via the anisotropic conductive rubber 85 under the movement control of the CPU 55. In this case, the anisotropic conductive rubber 85 conducts a constant voltage AC or a constant voltage DC on the surfaces directly above the circuit patterns 84, 84 without electrically connecting the circuit patterns 84, 84 to each other. Let As a result, the probe 4a is electrically conducted without damaging the circuit pattern 84 even when the circuit pattern is miniaturized using gold or the like. Therefore, the circuit board inspection device 1 can inspect the circuit boards 82, 82, ... Without lowering the insulation resistance between the circuit patterns 84, 84.

In the measurement of the electrostatic capacitance and resistance value, whether the circuit board 2 is good or bad is inspected based on whether or not the measured data value is within the allowable range.
The present invention is not limited to this, for example, as shown in FIG. 6B, after absorbing the reference data, the data value of the reference data is subjected to thick line processing, and the measured data is included in the range subjected to the thick line processing. You may inspect by what is called a waveform determination process which determines whether or not there is.

Furthermore, the present invention is not limited to the electrical characteristic measuring method shown in the present embodiment, and all terminals of the circuit component protruding on one surface of the circuit board 2 at the time of inspection by the resistance value. It is also possible to employ a measurement method in which the resistance value between the ground and the circuit pattern P is measured by connecting the to the ground with a conductive plate.

Further, the present invention can be applied to a method of presetting the reading timing of measurement data in the same way as the inspection by the resistance value when the inspection is performed by the electrostatic capacitance.

[0053]

As described above, according to the circuit board inspection apparatus of the first aspect, the electrical characteristic data measured when the moving probe contacts a plurality of circuit patterns, and the reference corresponding to the data. Since the quality of each circuit pattern is inspected by comparing with the data, a plurality of circuit patterns can be inspected by one movement of the moving probe. As a result, the inspection time can be shortened while maintaining the reliability of the inspection.

Further, according to the circuit board inspection apparatus of the second aspect, the work of connecting the fixing probe to one end of each circuit pattern is omitted, thereby shortening the inspection time.
Further, even when the pattern width of the circuit pattern is extremely narrow, it is not necessary to connect the fixing probe to one end of each circuit pattern, so that the circuit board can be inspected with high accuracy. Even when a plurality of circuit patterns are short-circuited with each other, it is possible to reliably inspect the short-circuit defect by determining whether the measured capacitance is within the allowable range. it can.

Further, according to the circuit board inspection apparatus of the third aspect, the change in the electrical characteristic data is detected, and the timing for fetching the electrical characteristic data is determined in advance based on the moving speed, etc. Even if the positioning accuracy of the probe for use is low, the electrical characteristic data of one circuit pattern and the circuit pattern to be contacted next can be reliably identified, and thus the inspection accuracy can be improved.

According to the circuit board inspection apparatus of the fourth aspect, in the IC package or the like, a plurality of circuit pattern groups in which a plurality of independent circuit patterns are printed in parallel are further printed at a predetermined interval. Even in such a case, the respective circuit patterns of the plurality of circuit pattern groups can be simultaneously inspected by the plurality of probes. Thereby, the inspection time can be shortened.

According to the circuit board inspection apparatus of the fifth aspect, in the IC package or the like, the surface of the circuit board is formed in a stepped structure, and the circuit pattern group is printed on each surface. In this case, a plurality of probes can independently contact the circuit pattern on each surface to inspect the circuit pattern on each surface at the same time, and thus the inspection time can be shortened.

According to the circuit board inspection apparatus of the sixth aspect, the reference data can be stored in the storage means by moving the moving probe along a predetermined moving path while the moving probe is in contact with the circuit board. Thus, it becomes possible to save the labor of inputting the reference data.

Further, according to the circuit board inspection apparatus of the seventh aspect, since the moving probe is electrically connected to the circuit pattern through the anisotropic conductive elastic body, the circuit board is inspected without damaging the circuit pattern. be able to.

[Brief description of drawings]

FIG. 1 is a plan view of a circuit board inspection device according to an embodiment of the present invention.

FIG. 2 is a conceptual diagram for explaining an inspection outline in the circuit board inspection apparatus according to the embodiment of the present invention.

FIG. 3 is a block diagram of a control device in the circuit board inspection device according to the embodiment of the present invention.

FIG. 4 is a flowchart of an inspection process in the circuit board inspection device according to the embodiment of the present invention.

5A is a signal waveform diagram for explaining an absorption process of reference data and measurement data in the circuit board inspection apparatus according to the embodiment of the present invention, and FIG. 5B is a reference data and measurement by the CPU. It is a figure which shows the read timing of data.

FIG. 6A is a signal waveform diagram for explaining absorption processing of reference data and measurement data at the time of inspection by a resistance value, and FIG. 6B is an allowable range of reference data subjected to thick line processing in the waveform determination processing. FIG.

FIG. 7 is a perspective view of an inspection jig of a circuit board inspection device according to a modified embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Circuit board inspection device 2 Circuit board 4 Moving probe 4a-4c Probe 5 Fixing probe 41 Electrical characteristic measuring means 42 Probe movement control means 55 CPU 57 RAM 81 Inspection jig 82 Circuit board 83 Board holder 84 Circuit pattern 85 Anisotropic conductive rubber

Claims (7)

[Claims] 1. A fixed probe that can be brought into contact with a predetermined measurement point to conduct electricity, a moving probe that can come into contact with a circuit pattern on a circuit board to be brought into conduction, and the moving probe can be brought into contact with the circuit board. A probe movement control means for moving along a preset movement path in the above state, and a measurement means for continuously measuring electrical characteristic data between the fixed probe and the moving probe during movement, A circuit board inspection device for inspecting the circuit board based on measured electrical characteristic data, wherein the electrical characteristic data at any one of the moving positions and the moving elapsed time of the moving probe on the moving path. By comparing the measured electric characteristic data with the corresponding reference data. Circuit board inspection apparatus characterized by comprising an inspection means for inspecting the circuit board. 2. The measuring means, comprising: an insulator that can be in close contact with one surface of the circuit board; and a conductive plate that can be disposed so as to face the one surface of the circuit board with the insulator interposed therebetween. Is the capacitance between the circuit pattern and the conductive plate formed on the other surface of the circuit board in the state where the fixing probe is in contact with the conductive plate as the electrical characteristic data. The circuit board inspection device according to claim 1, wherein the circuit board inspection device measures. 3. The inspecting means detects a change point of a data value in the electrical measurement data continuously measured by the measuring means, and when a predetermined time has elapsed from the time of detecting the change point. The electrical characteristic data is compared with the reference data.
The circuit board inspection device described. 4. The moving probe is integrally composed of a plurality of probes arranged at a predetermined interval, and the storage means stores reference data corresponding to each of the plurality of probes, and the measurement is performed. Means measures the electrical characteristic data between the fixing probe and the plurality of probes, the inspection means, each measured electrical characteristic data of each probe and the reference data corresponding thereto. 4. The circuit board inspection apparatus according to claim 1, wherein the circuit board is inspected by comparing each of the above. 5. The circuit board inspection apparatus according to claim 4, wherein the plurality of probes are configured to be independently contactable at arbitrary positions in a direction perpendicular to the surface of the circuit board. 6. The storage means is configured to be able to store the electrical characteristic data measured by the measuring means based on the moving probe moved along the preset moving path as the reference data. 6. The circuit board inspection device according to claim 1, wherein 7. A board fixture for fixing the circuit board, and anisotropic conductive elasticity placed on the circuit board fixed to the board fixture and electrically connected to a circuit pattern on the circuit board. Equipped with an inspection jig that includes the body,
7. The circuit board inspection apparatus according to claim 1, wherein the moving probe moves on the circuit board via the anisotropic conductive elastic body.