JP5356749B2 - Substrate inspection apparatus and probe Z-axis offset acquisition method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a board inspection apparatus capable of acquiring the offset in the Z axis direction of a probe without using a standard board for offset acquisition, simply and rapidly even while the board is inspected, and without damaging the probe, and to provide a method for acquiring the Z axis offset. <P>SOLUTION: A board fixing apparatus 1 being a board inspection apparatus 1 for performing an electric inspection by contacting probes 3a, 3b to the board 50 includes: Z axis units 2a, 2b for removably fixing as well as moving the probes 3a, 3b; a conduction unit 5 for which the position in the Z axis direction is known; a measuring unit 10 for detecting the electric conduction of the probes 3a (3b) and the conduction unit 5; and a control unit 11 for acquiring the offset in the Z axis direction of the tip of the probe 3a (3b) based on the travel distance of the probes when the electric conduction of the probe 3a (3B) and the conduction unit 5 is detected by moving the probe 3a (3b) to the conduction unit 5 along the Z axis direction. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention relates to a substrate inspection apparatus that electrically inspects a substrate by bringing a probe into contact with the probe, and a method for obtaining an offset from a theoretical position of the probe tip in the Z-axis direction.

  In a board inspection device that inspects a printed circuit board with printed wiring and a board with components mounted on it, the probe is brought into contact with the measurement points formed with the conductive patterns and the measurement points of the terminals of the mounted parts. The quality of the substrate is inspected by measuring electrical parameters such as values, current values, voltage values, and capacitance values as inspection values. Such a substrate inspection apparatus is described in Patent Document 1, for example.

  In the board inspection apparatus (circuit board inspection apparatus) described in Patent Document 1, the pair of probe moving mechanisms move the pair of probes to lower the contact point of the board (circuit board) from above and bring them into contact with each other. The substrate is inspected by measuring the capacitance.

  In recent years, in response to an increase in the density of a substrate, it is necessary to bring a probe into contact with a large number of narrow measurement points in substrate inspection, and the tip of the probe is narrow and formed at an acute angle. A highly durable probe is used, but since the number of measurement points is large, the tip gradually wears. For this reason, it is necessary to replace the probe every predetermined number of inspections.

  When the probe is exchanged, the probe tip position slightly differs from the theoretical position (designed position) assumed in advance, depending on the degree of probe attachment and probe processing deviation. The probe descends along the Z-axis direction (vertical direction) perpendicular to the substrate surface and is brought into contact with the substrate. For this reason, if the actual probe tip position is slightly different from the theoretical position in the Z-axis direction, the board or parts may be damaged, the probe itself may be damaged, or conversely, non-contact with the board may occur. There is a possibility that. In order to prevent these, it is necessary to acquire an offset (distance difference) in the Z-axis direction between the actual probe tip position and the theoretical position and reflect it in the vertical movement of the probe.

  In the conventional board inspection apparatus, the offset in the Z-axis direction is obtained using a reference board for obtaining an offset whose conductor pattern is formed and whose thickness is known.

  Specifically, a reference board is set on the board inspection apparatus, and the pair of probes are gradually lowered simultaneously from above the conductor pattern. The offset from the theoretical position is calculated and obtained from the descending amount of the probe when the tips of both probes are in contact with the conductor pattern and the two probes are conducted.

JP-A-2005-37170

  However, the conventional offset acquisition method for setting the reference substrate on the substrate inspection apparatus and acquiring the offset of the probe tip in the Z-axis direction has the following problems to be improved. That is, each time the probe is replaced, it is necessary to set the reference substrate in the apparatus, which is complicated. Further, when a probe offset abnormality is suspected during the substrate inspection, it is time consuming to confirm whether or not the offset is good unless the substrate under inspection is replaced with a reference substrate.

  Also, if the Z-axis offset of each of the pair of probes is greatly different, even if one probe is in contact with the reference substrate, conduction cannot be detected if the other probe is not in contact with the reference substrate. Furthermore, if both probes continue to descend and the mechanical push-in allowable amount is exceeded, one of the probes will be damaged.

  The present invention has been made to solve these problems, and without using a reference substrate for offset acquisition, the probe Z-axis can be easily and quickly even during substrate inspection without damaging the probe. It is an object of the present invention to provide a substrate inspection apparatus capable of acquiring a direction offset and a method for acquiring an offset in a Z-axis direction of a probe.

The substrate inspection apparatus according to claim 1, which has been made to achieve the above-described object, is a substrate inspection in which a probe is brought into contact with a substrate to be inspected to electrically inspect the substrate. An apparatus comprising: a clamp portion for fixing the substrate; a moving mechanism for detachably fixing the probe and moving the probe to the clamp portion; and provided in the clamp portion and orthogonal to the substrate surface and known conductive portion position of the Z-axis direction, and a measuring unit for detecting the electrical conduction between each other of the probe and the conductive portion, the probe along the Z-axis direction by controlling the moving mechanism said to The probe tip theory is based on the amount of movement of the probe when the electrical continuity of the probe and the conductive part is detected by the measuring part from the reference height above the conductive part. Z-axis direction from position An offset acquisition part for acquiring an offset, characterized in that it comprises a. In this case, “the position is known” includes a case where the position can be calculated.

  The substrate inspection apparatus according to claim 2 is the substrate inspection apparatus according to claim 1, wherein the offset acquisition unit acquires the offset in the Z-axis direction under a predetermined condition during the inspection of the substrate. To do.

  The substrate inspection apparatus according to claim 3 is the substrate inspection apparatus according to claim 2, wherein the predetermined condition is that the inspection values at a plurality of locations electrically acquired for the inspection of the substrate are normal. This is characterized in that the inspection value range is continuously exceeded a predetermined number of times.

A substrate inspection apparatus according to a fourth aspect of the present invention is the substrate inspection apparatus according to any one of the first to third aspects , wherein the clamp portion is movable in the Z-axis direction and mounts the substrate. The substrate is sandwiched between and fixed .

The probe Z-axis offset acquisition method according to claim 5 is a probe Z-axis offset acquisition method in a substrate inspection apparatus that inspects a substrate by bringing the probe into contact with the probe. position in the Z axis direction perpendicular to the plane is predisposed known conductive parts, while detecting the presence or absence of electrical conduction between each other the probe and the conductive portion, the reference height of the sky of the conductive portion of the probe The Z-axis direction from the theoretical position of the tip of the probe unit based on the amount of movement of the probe when the electrical continuity of the probe and the conductive unit is detected along the Z-axis direction. The offset is acquired.

  According to the substrate inspection apparatus and the Z-axis offset acquisition method of the probe according to the present invention, the probe and the conductive part are moved close to the reference height along the Z-axis direction to the conductive part whose position in the Z-axis direction is known. By acquiring the offset in the Z-axis direction from the theoretical position of the probe tip (hereinafter referred to as the Z-axis offset) based on the amount of movement of the probe when the measurement unit detects the continuity of Since there is no need to set, the Z-axis offset can be acquired easily and quickly. Further, the Z-axis offset can be obtained simply and quickly by bringing the probe into contact with the conductive portion without removing the substrate to be inspected even during substrate inspection. Furthermore, since the Z-axis offset can be acquired with one probe, unlike the conventional Z-axis offset acquisition with two probes, the probe can be prevented from being damaged.

  In addition, according to the substrate inspection apparatus of the present invention, the offset acquisition unit automatically acquires a probe abnormality such as a probe bending or a tip defect automatically by acquiring a Z-axis offset under a predetermined condition during the inspection of the substrate. It can be detected reliably.

  Further, according to the substrate inspection apparatus according to the present invention, the offset acquisition unit is configured with a predetermined condition when the inspection value electrically acquired for the substrate inspection continuously exceeds the inspection value range determined to be normal for a predetermined number of times. By acquiring the Z-axis offset, the probe abnormality can be accurately detected while preventing erroneous detection.

  Further, according to the substrate inspection apparatus of the present invention, since the conductive portion is arranged close to the substrate by arranging the conductive portion in the clamp portion of the substrate, it is possible to obtain an accurate Z-axis offset with little error at the substrate position. it can. Further, even when the Z-axis offset is acquired during the inspection, the moving distance of the probe from the substrate is short. Therefore, the Z-axis offset can be acquired quickly.

Preferred form for carrying out the invention

  Examples of the present invention will be described in detail below, but the scope of the present invention is not limited to these examples.

  FIG. 2 shows a schematic top view of the substrate inspection apparatus 1 of the present invention in a state where the substrate 50 is set. FIG. 1 shows a configuration diagram of the substrate inspection apparatus 1 along with the AA cross section of FIG.

  As shown in FIGS. 1 and 2, the board inspection apparatus 1 includes bases 7a and 7b, clamp parts 4a, 4b, 4c and 4d, a conductive part 5, Z-axis units 2a and 2b, a measurement part 10, and a control part. 11 and the memory 12, and the substrate 50 to be inspected is inspected. As an example, the substrate 50 is a circuit substrate on which conductive patterns (not shown) are printed and wired on both sides.

  On the bases 7a and 7b, conveyance rails 15a and 15b for supporting a pair of opposing edge portions of the substrate 50 are arranged as shown in both drawings. The transport rails 15a and 15b are conveyor devices capable of transporting the substrate 50 along the bases 7a and 7b, and the substrate 50 placed at a substrate placement location (not shown) is the inspection location shown in FIG. After completion of the substrate inspection, the substrate is transported to a substrate removal place (not shown).

  The clamp portions 4a, 4b, 4c, and 4d are configured to be movable on the bases 7a and 7b along the Z-axis direction (vertical direction in FIG. 1) orthogonal to the surface of the substrate 50. The clamp portions 4a and 4b sandwich two portions of one side edge of the substrate 50 between the conveyance rail 15a, and the clamp portions 4c and 4d are two of the other edge portion of the substrate 50 between the conveyance rail 15b. The substrate 50 is fixed by sandwiching the portion.

  In the clamp portion 4a, a concave recess is formed in the movement range of probes 3a and 3b described later, and an electrically conductive portion 5 is disposed at the bottom of the recess. By disposing the conductive portion 5 at the bottom of the concave recess, the distance of the conductive portion 5 from the upper surface of the substrate 50 is shortened. In addition, the conductive portion 5 is disposed in the projection plane on the upper surface of the substrate 50 in the clamp portion 4a, and is disposed at a short distance from the substrate 50. A thin gold film 5 a is formed on the upper surface (upper side in FIG. 1) of the conductive portion 5. In FIG. 1, the thickness of the gold film 5 a is exaggerated for easy understanding of the invention.

  The conductive portion 5 is arranged such that the position of the upper surface of the conductive portion 5 (the upper surface of the gold film 5a) in the Z-axis direction is strictly managed with respect to the origin of the clamp portion 4a. The conductive part 5 is electrically connected to the measuring part 10.

  The clamp units 4a, 4b, 4c, and 4d are configured to be movable under the control of the control unit 11 by controlling the position in the Z-axis direction from the reference position of the substrate inspection apparatus 1. For this reason, the position of the upper surface of the conductive portion 5 in the Z-axis direction can be calculated by the control unit 11 and is known to the control unit 11 regardless of the upper or lower position of the clamp unit 4a. In addition, the moving mechanism of the clamp parts 4a-4d is not shown in figure.

  The Z-axis unit 2a is attached to a known XY robot (not shown) or the like as an example, and in the X-axis Y-axis direction indicated by an arrow in FIG. 2, that is, in the X-axis Y-axis direction parallel to the surface of the substrate 50 It is configured to be movable. The XY robot and the Z-axis unit 2a (Z-axis unit 2b) correspond to the movement mechanism of the present invention, and the movement amount is controlled by the control unit 11.

  As shown in FIG. 1, the Z-axis unit 2a includes a main body 20a, an elevating part 21a, a fixing part 22a, and a probe 3a. An elevating part 21a is attached to the main body part 20a so as to be able to move straight along the Z-axis direction. The main body 20a is driven by controlling the amount of movement of the elevating unit 21a under the control of the control unit 11.

  A fixed portion 22a is disposed in the lower portion (lower portion in the figure) of the elevating portion 21a. The fixing | fixed part 22a fixes the probe 3a so that attachment or detachment is possible. The probe 3a is fixed at a predetermined mounting angle so that the tip thereof is directed downward (lower part in the figure) and is slightly inclined with respect to the Z axis.

  The probe 3a is formed into a thin rod shape with an acute end made of a conductive metal, and is brought into contact with the substrate 50 at an angle. The probe 3 a is electrically connected to the measurement unit 10. The amount of movement of the elevating part 21a in the Z-axis direction is equal to the amount of movement of the tip of the probe 3a in the Z-axis direction.

  As shown in FIG. 1, the Z-axis unit 2b includes a main body 20b, an elevating part 21b, a fixing part 22b, and a probe 3b. The probe 3 b is electrically connected to the measurement unit 10. Since the Z-axis unit 2b is configured in the same manner as the Z-axis unit 2a except for the reference numerals, detailed description thereof is omitted.

  As shown in FIG. 2, the Z-axis unit 2b is attached to an XY robot (not shown) separate from the Z-axis unit 2a so that the probe 3b faces the probe 3a of the Z-axis unit 2a.

  The measurement unit 10 includes a voltage source, a voltmeter, an ammeter, a calculation unit, and the like. Under the control of the control unit 11, the presence or absence of electrical continuity between the probe 3a and the conductive unit 5 is detected. The detection result is output to the control unit 11 in real time. For example, the measurement unit 10 detects the presence or absence of electrical continuity by measuring the resistance value between the probe 3a and the conductive unit 5 or the flowing current value.

  Similarly, the measurement unit 10 detects the presence or absence of electrical continuity between the probe 3b and the conductive unit 5 under the control of the control unit 11, and outputs the detection result to the control unit 11 in real time.

  Moreover, the measurement part 10 applies a voltage between the probes 3a and 3b as an example under control of the control part 11, measures the electric current value which flows between them, and the applied voltage value, and this measured value or measurement A resistance value or a capacitance value calculated from the value is output to the control unit 11 as an electrical inspection value.

  The control unit 11 includes a CPU (central processing unit) (not shown), an operation program storage unit, and the like, and controls the overall operation of the substrate inspection apparatus 1 including the XY robot, the Z-axis units 2a and 2b, and the like. Perform the inspection process. Furthermore, the control unit 11 also serves as an offset acquisition unit in the present invention, and executes a Z-axis offset acquisition process and a probe self-check process described later.

  The control unit 11 is connected to a memory 12 such as a flash memory or an EEPROM that can be rewritten and can retain recorded contents even when the power is turned off. In the memory 12, the position in the X-axis and Y-axis direction at the center of the conductor part 5, the relative position (height) in the Z-axis direction from the origin of the clamp part 4a on the top surface of the conductor part 5, and the Z-axis units 2a and 2b are connected to the probe 3a. , 3b, the theoretical position (reference height) in the Z-axis direction of the tip of the probe 3a, 3b from the reference position of the device when it is raised to the highest sky, and the probe 3a with respect to the origin of the Z-axis units 2a, 2b The relative theoretical position of the tip of 3b in the X-axis and Y-axis directions is recorded. The theoretical position refers to a position obtained by calculation from the total length design value of the probes 3a and 3b, the mounting angle design value at the time of fixation, the length of each part of the apparatus, and the like.

  Further, in the memory 12, XYZ coordinate information of each measurement point (not shown) of the substrate 50, set information of measurement points with which the probes 3a and 3b are brought into contact, a measurement order of measurement points, and an electrical inspection value at each measurement point The inspection value range in which is determined to be normal (good), the allowable range of the Z-axis offset of the probes 3a and 3b, etc. are recorded.

  Next, a Z-axis offset acquisition process which is an example of the probe Z-axis offset acquisition method of the present invention will be described. As described above, the conducting portion 5 is arranged in advance.

  When the probe 3a exceeds the service life, the probe 3a is replaced with a new one. For example, the probe 3a may be replaced when the substrate 50 is set in the substrate inspection apparatus 1 as shown in FIG. 1, or the substrate 50 is not set as shown in FIG. Sometimes it is exchanged. FIG. 3 shows only an enlarged cross-sectional view in the vicinity of the clamp portion 4a and only the Z-axis unit 2a. In FIG. 3, the clamp part 4a is lowered to a position in contact with the base 7a.

  After the replacement work of the probe 3a is completed, the control unit 11 starts the Z-axis offset acquisition process shown in the flowchart in FIG.

  In this process, the control unit 11 first reads the position of the conductive unit 5 in the X-axis and Y-axis directions from the memory 12 in step 61 and controls the XY robot so that the tip of the probe 3a is above the center of the conductor unit 5. The Z-axis unit 2a is moved so as to be positioned (see FIG. 3). At this time, the control unit 11 raises the probe 3a to the reference height of the Z-axis unit 2a.

  Next, in step 62, the control unit 11 reads the relative position in the Z-axis direction from the origin of the clamp unit 4a on the upper surface of the conductor unit 5 from the memory 12, and starts the conductor from the position moved in the Z-axis direction of the clamp unit 4a. The position of the upper surface of the part 5 is calculated, and further, a theoretical distance for lowering the probe 3a necessary for the probe 3a and the conductor part 5 to contact each other is calculated.

  Next, the control part 11 makes the measurement part 10 start the detection of the presence or absence of the electrical continuity between the probe 3a and the electroconductive part 5 by step 63. FIG. At this time, since the probe 3 a is not in contact with the conductive portion 5, the measuring portion 10 outputs a detection result indicating no continuity to the control portion 11.

  While detecting the presence / absence of this conduction, the control unit 11 controls the Z-axis unit 2a in step 64 to slowly lower the probe 3a from the reference height along the Z-axis direction to approach the conductive unit 5. (See the two-dot chain line arrow in FIG. 3). The control unit 11 monitors the presence or absence of electrical continuity between the probe 3a and the conductive unit 5 based on the output from the measurement unit 10 (step 65), and executes steps 64 and 65 while continuity is detected to be absent. Then, the descent of the probe 3a is continued.

  When the probe 3a comes into contact with the conductive portion 5 (see the probe 3a indicated by a two-dot chain line in FIG. 1) and it is detected that conduction is present in step 65, the control unit 11 immediately determines in step 66 that the probe 3a. Stops descending. For this reason, damage to the probe 3a can be prevented.

  Since the gold film 5a is formed on the conductive part 5, the formation of an oxide film is prevented, and the measurement part 10 can reliably detect conduction between the probe 3a and the conductive part 5 (gold film 5a). .

  Next, in step 67, the control unit 11 acquires an offset in the Z-axis direction (Z-axis offset) from the theoretical position of the tip of the probe 3a based on the amount of movement by which the probe 3a is lowered. Specifically, the control unit 11 calculates a difference between the movement amount by which the probe 3a is lowered and the theoretical distance calculated in step 62, and sets this difference as the Z-axis offset of the probe 3a.

  In step 68, the controller 11 records the Z-axis offset of the probe 3a in the memory 12. This is the end of the offset acquisition process.

  Even when the probe 3b is replaced, the Z-axis offset of the probe 3b is acquired and recorded in the memory 12 by moving the probe 3b over the conductor portion 5 in the same manner as described above. Since the process is the same as that of the probe 3a, detailed description thereof is omitted.

  Thus, according to the substrate inspection apparatus 1 of the present invention, unlike the conventional substrate inspection apparatus, it is not necessary to set a reference substrate for offset acquisition. Therefore, the Z-axis offset of the probe 3a (3b) can be acquired even when the substrate 50 shown in FIG. 1 is set or when the substrate 50 shown in FIG. 3 is not set. it can. Further, since the Z-axis offset can be acquired with one probe, even if there is an offset difference between a pair of probes, the probe is not damaged unlike a conventional substrate inspection apparatus.

  When the substrate inspection apparatus 1 inspects the substrate 50, the control unit 11 reads out the Z-axis offset of the probes 3a and 3b described above from the memory 12, and uses this as a correction value for the probes 3a and 3b. Move in the Z-axis direction.

  For this reason, the control part 11 can control correctly the position of the Z-axis direction of probe 3a, 3b front-end | tip.

  Next, an example in which the control unit 11 acquires the Z-axis offset under a predetermined condition while the substrate inspection apparatus 1 inspects the substrate 50 will be described.

  The predetermined condition is, for example, a condition that can detect the occurrence of an abnormality such as probe wear, probe bending, or probe tip defect.

  During the substrate inspection, the control unit 11 causes the probes 3a and 3b to contact a set of measurement points on the substrate 50 to cause the measurement unit 10 to measure the inspection value. The control unit 11 determines that the inspection value is normal if the inspection value is within the inspection value range. Since there are a large number of measurement points, the control unit 11 moves the probes 3a and 3b to continuously measure the test values between the measurement points one after another, thereby checking the quality of the many measurement points.

  At the same time, the control unit 11 executes a probe self-check process shown in FIG.

  In this probe self-check process, when the inspection values at a plurality of locations (a plurality of measurement points) continuously exceed the inspection value range determined to be normal for a predetermined number of times, the predetermined condition is satisfied. Get the axis offset. Hereinafter, this will be specifically described with reference to FIG.

  In this process, the control unit 11 determines whether or not the measured inspection value exceeds the inspection value range recorded in the memory 12 (step 71). If so, it is determined whether the inspection values at different measurement points continuously exceed the inspection value range (step 72). That is, it is determined whether the inspection value at the previous measurement point has also exceeded the inspection value range. If it is continuously exceeded, it is determined whether the number of consecutive times exceeds a predetermined number (10 times as an example) (step 73). That is, as an example, it is determined whether all the inspection values at the measurement points from ten locations have exceeded the inspection value range. In addition, when it determines with No by step 71-73, it returns to step 71.

  When it is determined in step 73 that the inspection value range has been exceeded a predetermined number of times, the control unit 11 executes the above-described Z-axis offset acquisition process for the probe 3a (step 74). If the Z-axis offset acquired in the Z-axis offset acquisition process is within the allowable range recorded in the memory 12, the control unit 11 determines that the probe 3a is normal (step 75) and is within the allowable range. If not, the substrate inspection apparatus 1 is stopped (step 78).

  When it is determined in step 75 that the probe 3a is normal, a Z-axis offset acquisition process is executed for the probe 3b (step 76). If the acquired Z-axis offset is within the allowable range recorded in the memory 12, the control unit 11 determines that the probe 3b is normal (step 77), and ends the probe self-check process. If it is not within the allowable range, the board inspection apparatus 1 is stopped (step 78). This completes the probe self-check process.

  As described above, by performing the self-check of the probe, the probe abnormality can be automatically and quickly detected.

  In the above description, the substrate inspection apparatus 1 has been described as having a pair of probes 3a and 3b. However, the number of probes may be one, or a plurality of probes such as three or four. You may have. For example, the present invention is a substrate inspection apparatus in which a conductive plate is arranged on the lower surface of the substrate 50, one probe is brought into contact with the upper surface of the substrate, and a capacitance value between the probe and the conductive plate is measured as an inspection value. Can also be applied. The present invention can also be applied to a substrate inspection apparatus that has four probes and performs substrate inspection by the four-terminal method.

  In the probe self-check process, the example in which the control unit 11 executes the Z-axis offset acquisition process when the inspection value exceeds the inspection value range a predetermined number of times as a predetermined condition has been described. As an example, the predetermined condition may be a case where a predetermined time such as 160 hours is exceeded.

  In the probe self-check process, the example in which the control unit 11 determines whether or not the acquired Z-axis offset is within the allowable range has been described. However, when the Z-axis offset is acquired, the substrate inspection apparatus 1 is stopped. Thus, the operator may determine whether the Z-axis offset is good or bad.

  Moreover, although the example which has arrange | positioned the electroconductive part 5 to the clamp part 4a was demonstrated, it can also arrange | position to the exposed site | part of the base 7a (7b). In this case, it is preferable to dispose as close to the substrate 50 as possible.

  In the Z-axis offset acquisition process, the reference height for raising the probe 3a (3b) is set to an arbitrary height as long as the position in the Z-axis direction from the reference position of the apparatus can be calculated. Can do.

  Moreover, although the example in which the probe is in contact with the conductive pattern of the substrate 50 has been described, the present invention can also be applied to a substrate inspection apparatus that inspects the probe by contacting a component mounted on the substrate.

It is a block diagram of the board | substrate inspection apparatus to which this invention is applied. It is a top surface schematic diagram of a substrate inspection device to which the present invention is applied. It is a partial enlarged view of the board | substrate inspection apparatus to which this invention is applied. It is a flowchart which shows the Z-axis offset acquisition process of the board | substrate inspection apparatus to which this invention is applied. It is a flowchart which shows the probe self-check process of the board | substrate inspection apparatus to which this invention is applied.

Explanation of symbols

  1 is a substrate inspection apparatus, 2a and 2b are Z-axis units, 3a and 3b are probes, 4a, 4b, 4c and 4d are clamp parts, 5 is a conductive part, 5a is a gold film, 7a and 7b are bases, and 10 is Measurement unit, 11 is a control unit, 12 is a memory, 15a and 15b are transport rails, 20a and 20b are main body units, 21a and 21b are lifting units, 22a and 22b are fixed units, 50 is a substrate, 61 to 68, and 71 to 71 78 is a step in the flowchart.

Claims (5)

A substrate inspection apparatus for electrically inspecting a substrate by bringing the probe into contact with a substrate to be inspected, a clamp portion for fixing the substrate, a probe detachably fixing the probe, and the clamp Detects electrical continuity between the probe and the conductive part, a moving mechanism that can move to the part, a conductive part that is provided in the clamp part and whose position in the Z-axis direction perpendicular to the substrate surface is known And a measurement unit that controls the moving mechanism to bring the probe close to the conductive unit from a reference height above the conductive unit along the Z-axis direction, so that electrical conduction between the probe and the conductive unit is established. A substrate inspection apparatus, comprising: an offset acquisition unit that acquires an offset in the Z-axis direction from the theoretical position of the probe tip based on a movement amount of the probe when detected by the measurement unit.   The substrate inspection apparatus according to claim 1, wherein the offset acquisition unit acquires the offset in the Z-axis direction under a predetermined condition during the inspection of the substrate.   The predetermined condition is a case where inspection values at a plurality of locations electrically acquired for inspection of the substrate continuously exceed a range of inspection values determined to be normal for a predetermined number of times. 2. The substrate inspection apparatus according to 2. The said clamp part is movable in the said Z-axis direction, and pinches | interposes and fixes this board | substrate between the bases which mount the said board | substrate on any one of Claim 1 to 3 characterized by the above-mentioned. Board inspection equipment. A method for acquiring a Z-axis offset of a probe in a substrate inspection apparatus for inspecting a substrate by contacting a probe, wherein a conductive portion whose position in the Z-axis direction orthogonal to the substrate surface is known is previously set in a clamp portion for fixing the substrate. arrangement and, while detecting the presence or absence of electrical conduction between each other the probe and the conductive portion, allowed closer to conductor communicating portion the probe from the reference height of the sky of the conductive portion along the Z-axis direction, the Obtaining the Z-axis offset of the probe from the theoretical position of the probe tip based on the amount of movement of the probe when detecting electrical continuity between the probe and the conductive part Method.

Images