JP6723190B2 - Inspection equipment - Google Patents

Description

The present invention relates to a jig inspection device for inspecting a power semiconductor product.

When inspecting the electrical characteristics of power semiconductor products, measurement is performed at a large current. Therefore, in order to reduce the effects of the residual resistance and contact resistance of the cable, it is desirable to realize a test circuit using Kelvin connection.

For power semiconductor products having large terminals, probe pins (force line, sense line) of the inspection jig can be brought into contact with the terminals of the power semiconductor product. However, for a power semiconductor product having a small terminal, a jig for contacting the probe pin of the force wire with the terminal of the power semiconductor product has the following configuration.

In order to realize the Kelvin connection, the jig has a relay wiring. The relay wiring is wiring for contacting the terminal of the power semiconductor product and the probe pin of the sense line.

Patent Document 1 discloses an inspection jig for inspecting the electrical characteristics of semiconductor products.

JP, 2008-076281, A

In order to make the result of the inspection using the inspection jig accurate, it is necessary to inspect the soundness of the inspection jig. Some inspection jigs have two types of relay wiring for inspecting power semiconductor products. The two types of relay wirings are provided on the plate-shaped member. Further, the tips of the two types of relay wirings protrude from the plate-shaped member. When inspecting the soundness of such an inspection jig, it is required to inspect whether or not the heights of the tips of the two types of relay wirings are deviated.

The present invention has been made in order to solve such a problem, and provides an inspection device capable of inspecting whether or not there is a difference in height of the tips of two types of relay wirings. With the goal.

In order to achieve the above object, an inspection apparatus according to one aspect of the present invention is an apparatus for inspecting a jig for inspecting electric characteristics of a power semiconductor product. The jig has a plate shape, and a first relay wiring and a second relay wiring for inspecting the power semiconductor product are provided on the main surface side of the jig. Each of the wiring and the second relay wiring has a first tip and a second tip, and the first tip of the first relay wiring is adjacent to the first tip of the second relay wiring, The inspection device uses an electrode for contacting the first tip of the first relay wiring and the first tip of the second relay wiring, and the electrode, using the first relay wiring and the first relay wiring. A constant current source for supplying a current to a second relay wire, wherein the electrode has a first portion for contacting the first tip of the first relay wire, and the first tip of the second relay wire. A second portion for contacting the first relay wire, the first portion having a flat first flat surface for contacting the first tip of the first relay wire, and the second portion It has a flat second plane for contacting the first tip of the second relay wiring, and in the electrode, the first plane and the second plane are provided at the same height.

According to the invention, the electrode has a flat first plane for contacting the first tip of the first relay wire and a flat first plane for contacting the first tip of the second relay wire. A second plane. In the electrode, the first plane and the second plane are provided at the same height.

Accordingly, it is possible to inspect whether or not the height of the first tip of the first relay wiring is the same as the height of the first tip of the second relay wiring. That is, it is possible to inspect whether or not there is a difference in height of the tips of the two types of relay wirings.

It is a figure which shows the structure for inspecting the electric characteristic of a power semiconductor product using a jig. It is a top view of a jig. It is a figure which shows the structure of the inspection apparatus which concerns on Embodiment 1 of this invention. FIG. 3 is a side view of the inspection device according to the first embodiment of the present invention. It is a figure which shows the structure of the inspection apparatus which concerns on Embodiment 2 of this invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following drawings, the same components are designated by the same reference numerals. The names and functions of the constituent elements designated by the same reference numerals are the same. Therefore, detailed description of some of the components denoted by the same reference numerals may be omitted.

It should be noted that the dimensions, materials, shapes, and the relative arrangements of the components illustrated in the embodiments may be appropriately changed depending on the configuration of the apparatus to which the present invention is applied, various conditions, and the like. In addition, the dimensions of each component in each drawing may differ from the actual dimensions.

(Jig configuration)
First, the jig 10 to be inspected in the present invention will be described. FIG. 1 is a diagram showing a configuration for inspecting electrical characteristics of a power semiconductor product D1 described later using a jig 10. In addition, in FIG. 1, a measuring device 50N described later is shown at a position different from an actual position in order to make the configuration easy to understand.

In FIG. 1, the X direction, the Y direction, and the Z direction are orthogonal to each other. The X direction, Y direction and Z direction shown in the following figures are also orthogonal to each other. In the following, a direction including the X direction and a direction (−X direction) opposite to the X direction is also referred to as “X axis direction”. Further, hereinafter, a direction including the Y direction and a direction (−Y direction) opposite to the Y direction is also referred to as “Y axis direction”. Further, hereinafter, a direction including the Z direction and a direction (−Z direction) opposite to the Z direction is also referred to as “Z axis direction”.

In the following, a plane including the X-axis direction and the Y-axis direction will also be referred to as “XY plane”. Further, in the following, a plane including the X-axis direction and the Z-axis direction is also referred to as “XZ plane”. In the following, a plane including the Y-axis direction and the Z-axis direction will also be referred to as “YZ plane”.

FIG. 2 is a top view of the jig 10. The jig 10 is a jig for inspecting the electrical characteristics of the power semiconductor product D1. The power semiconductor product D1 is, for example, a module-type semiconductor element as a power device. The power semiconductor product D1 has a plurality of terminals t1.

Referring to FIGS. 1 and 2, the jig 10 has a plate shape. The jig 10 has a main surface 10a. At least two relay wirings 11 are provided on the main surface 10a side of the jig 10.

Specifically, the jig 10 includes wiring regions R1a and R1b. Each of the wiring regions R1a and R1b is provided on the main surface 10a side of the jig 10. A plurality of relay wirings 11 are provided in each of the wiring regions R1a and R1b. Each relay wiring 11 is a wiring for inspecting the power semiconductor product D1 (terminal t1). Each relay wire 11 has tips X1 and X2. The tips X1 and X2 of the relay wirings 11 project from the main surface 10a of the jig 10.

Hereinafter, the relay wiring 11 provided in the wiring region R1a is also referred to as “relay wiring 11a”. In the following, the relay wiring 11 provided in the wiring region R1b is also referred to as "relay wiring 11b". That is, each of the relay wirings 11a and 11b has the tips X1 and X2.

The electrical characteristics of the power semiconductor product D1 (terminal t1) as the inspected product are measured by the measuring device 300 shown in FIG. The measuring device 300 includes a jig 20N and a measuring device 50N.

The jig 20N includes a plate-shaped portion 21N, a plurality of probe pins 2f, and a plurality of probe pins 2s. The probe pin 2f is a pin that functions as a force line. The probe pin 2s is a pin that functions as a sense line. A plurality of probe pins 2f and a plurality of probe pins 2s are fixed to the plate-shaped portion 21N. The plurality of probe pins 2f and the plurality of probe pins 2s are connected to the measuring device 50N by a plurality of wirings 3.

Next, a process for measuring the electric characteristic of the power semiconductor product D1 (terminal t1) (hereinafter, also referred to as “electric characteristic measuring process”) will be described. In the electrical characteristic measurement process, first, as shown in FIG. 1, the tip X1 of the relay wiring 11a and the tip X1 of the relay wiring 11b are respectively brought into contact with the two types of terminals t1 of the power semiconductor product D1. The product D1 is fixed to the jig 10.

Next, as shown in FIG. 1, the jig 20N is placed on the jig 10. As a result, the plurality of probe pins 2f come into contact with the power semiconductor product D1 (terminal t1). The probe pin 2s contacts the tip X2 of the relay wiring 11a, and another probe pin 2s contacts the tip X2 of the relay wiring 11b.

Then, the measuring device 50N supplies a current to the plurality of probe pins 2f. As a result, the current returns to the measuring instrument 50N via the power semiconductor product D1 (terminal t1), the tips X1 and X2, and the probe pin 2s. The measuring instrument 50N can measure the electrical characteristics of the power semiconductor product D1 (terminal t1) by measuring the current from the probe pin 2s.

Next, the inspection device 100 for inspecting the jig 10 will be described. The inspection device 100 is a device for inspecting the energization state and the contact state of the jig 10.

<Embodiment 1>
FIG. 3 is a diagram showing the configuration of the inspection device 100 according to the first embodiment of the present invention. In FIG. 3, a constant current source 60, which will be described later, is shown at a position different from the actual position in order to make the characteristic configuration of the inspection device 100 easy to understand.

FIG. 4 is a side view of the inspection device 100 according to the first embodiment of the present invention. Note that FIG. 4 also shows the jig 10 that is not included in the inspection apparatus 100. In addition, in FIG. 4, regarding the electrode 40 described below, only the lower portion of the electrode 40 is shown.

Referring to FIGS. 3 and 4, inspection device 100 includes jig 20, voltage measuring devices 50a and 50b, and constant current source 60. The jig 20 is used to inspect the jig 10. The jig 10 has the configuration described above. Note that, as shown in FIG. 3, the tip X1 of the relay wiring 11a is adjacent to the tip X1 of the relay wiring 11b. In other words, the distance between the tip X1 of the relay wiring 11a and the tip X1 of the relay wiring 11b is shorter than the distance between the tip X2 of the relay wiring 11a and the tip X2 of the relay wiring 11b.

The jig 20 includes a plate portion 21, an electrode 40, and a plurality of probe pins 2s. An electrode 40 and a plurality of probe pins 2s are fixed to the plate-shaped portion 21.

The electrode 40 is a conductor. The electrode 40 is an electrode for contacting the tip X1 of the relay wiring 11a and the tip X1 of the relay wiring 11b. That is, the electrode 40 has a shape for contacting the tip X1 of the relay wiring 11a and the tip X1 of the relay wiring 11b.

Specifically, the electrode 40 includes portions 41 and 42. The portion 41 is a portion for contacting the tip X1 of the relay wiring 11a. The portion 42 is a portion for contacting the tip X1 of the relay wiring 11b.

The portion 41 has a plane S1. The plane S1 is a surface for contacting the tip X1 of the relay wiring 11a. The portion 42 has a plane S2. The plane S2 is a surface for contacting the tip X1 of the relay wiring 11b.

Each of the planes S1 and S2 is a flat surface. The plane S1 is parallel to the plane S2. Further, in the electrode 40, the plane S1 and the plane S2 are provided at the same height. Specifically, the planes S1 and S2 are provided on the electrode 40 so that the entire plane S1 and the entire plane S2 can contact the same flat surface.

The probe pin 2s is a pin for contacting the tip X2 of the relay wiring 11a or the relay wiring 11b. In the following, the probe pin 2s for contacting the tip X2 of the relay wiring 11a is also referred to as “probe pin 2sa”. Further, in the following, the probe pin 2s for contacting the tip X2 of the relay wiring 11b is also referred to as “probe pin 2sb”.

The constant current source 60 has a function of supplying a current. As will be described later in detail, the constant current source 60 uses the electrode 40 to supply a current to the relay wiring 11a and the relay wiring 11b.

The constant current source 60 has terminals T0, T1 and T2. The terminal T0 is electrically connected to the electrode 40 by the wiring 3. The terminal T1 is electrically connected to the probe pin 2sa by the wiring 3. The terminal T2 is electrically connected to the probe pin 2sb by the wiring 3.

In the following, the wiring 3 connected to the probe pin 2sa is also referred to as “wiring 3a”. In the following, the wiring 3 connected to the probe pin 2sb is also referred to as "wiring 3b". Further, in the following, the wiring 3 connected to the electrode 40 is also referred to as “wiring 3e”. The constant current source 60 supplies a current to the electrode 40 via the wiring 3e.

The voltage measuring devices 50a and 50b have a function of measuring the voltage between the tip X1 and the tip X2 of the relay wiring 11. The voltage measuring device 50a is provided between the wiring 3e and the wiring 3a. The voltage measuring device 50b is provided between the wiring 3e and the wiring 3b.

Next, a process for inspecting the jig 10 (hereinafter, also referred to as “jig inspection process”) will be described. In the following, a state in which the jig 10 does not have a defect is also referred to as a “normal state”. In the normal state, there is no defect in the relay wirings 11a and 11b. In the normal state, the height of the tip X1 of the relay wire 11a is the same as the height of the tip X1 of the relay wire 11b.

In the jig inspection processing, first, jig arrangement processing is performed. In the jig placement process, the jig 20 is placed on the jig 10 as shown in FIG. As a result, in the normal state, the flat surface S1 of the portion 41 of the electrode 40 contacts the tip X1 of the relay wiring 11a. Further, in the normal state, the plane S2 of the portion 42 of the electrode 40 contacts the tip X1 of the relay wiring 11b. Further, in the normal state, the probe pin 2sa contacts the tip X2 of the relay wiring 11a. Further, in a normal state, the probe pin 2sb contacts the tip X2 of the relay wiring 11b.

Next, a current supply process is performed. In the current supply process, the constant current source 60 supplies a current to the electrode 40 via the wiring 3e. As a result, in a normal state, a current flows through the relay wirings 11a and 11b of the jig 10. Specifically, in a normal state, current flows through the wiring 3e, the portion 41 of the electrode 40, the tips X1 and X2 of the relay wiring 11a, the probe pin 2sa, and the wiring 3a to the terminal T1 (constant current source 60). Return to. In the normal state, the current returns to the terminal T2 (constant current source 60) via the wiring 3e, the portion 42 of the electrode 40, the tips X1 and X2 of the relay wiring 11b, the probe pin 2sb, and the wiring 3b.

Then, the voltage measurement process is performed. In the voltage measurement process, the voltage measuring device 50a measures the voltage between the wiring 3e and the wiring 3a. That is, the voltage measuring device 50a measures the voltage between the tip X1 and the tip X2 in the relay wiring 11a. Moreover, the voltage measuring device 50b measures the voltage between the wiring 3e and the wiring 3b. That is, the voltage measuring device 50b measures the voltage between the tip X1 and the tip X2 in the relay wiring 11b. With the above, the jig inspection process is completed.

By the jig inspection process, the energized state and the contact state of the jig 10 can be inspected. That is, the soundness of the jig 10 can be confirmed.

In the jig inspection process, if the current does not return to one or both of the terminals T1 and T2, it can be understood that one or both of the relay wirings 11a and 11b have a defect.

The defect is, for example, a state where one or both of the relay wirings 11a and 11b are disconnected. Further, the defect is, for example, a state in which one or both of the tips X1 and X2 of one or both of the relay wirings 11a and 11b are deformed. The defect is, for example, a state in which one or both of the tips X1 and X2 of one or both of the relay wirings 11a and 11b are worn. Further, the defect is a state in which foreign matter is attached to one or both of the tips X1 and X2 of the relay wirings 11a and 11b.

Further, in the electrode 40, the plane S1 and the plane S2 are provided at the same height. Therefore, in the jig inspection process, if the plane S1 does not contact the tip X1 of the relay wiring 11a or the plane S2 does not contact the tip X1 of the relay wiring 11b, the tip X1 of the relay wiring 11a may occur. It can be seen that the height of is different from the height of the tip X1 of the relay wiring 11b. That is, it is possible to detect that there is a height difference between the tip X1 of the relay wiring 11a and the tip X1 of the relay wiring 11b.

As described above, according to the present embodiment, the electrode 40 has a flat plane S1 for contacting the tip X1 of the relay wiring 11a and a flat plane S1 for contacting the tip X1 of the relay wiring 11b. And a plane S2. In the electrode 40, the plane S1 and the plane S2 are provided at the same height.

Thereby, it is possible to inspect whether or not the height of the tip X1 of the relay wiring 11a is the same as the height of the tip X1 of the relay wiring 11b. That is, it is possible to inspect whether or not there is a difference in the height of the tips of the two types of relay wirings.

Further, in the present embodiment, by measuring the voltage in the jig inspection process, it becomes possible to manage the resistance value of the contact resistance in the jig 10. As a result, the accuracy of detecting a defect in the jig 10 can be improved.

Further, in the configuration of the present embodiment, the VI characteristic can be obtained by changing the amount of current supplied by the constant current source 60. As a result, the accuracy of detecting a defect in the jig 10 can be improved.

In the conventional inspection of jigs, visual inspections such as foreign matter adhesion, presence of deformation, and disconnection check using a simple tester were performed offline. In such an inspection, disconnection, adhesion of foreign matter, etc. can be found, but it is difficult to find a minor defect in the jig. The minor malfunction is, for example, wear of the contact surface of the probe pin.

Therefore, when the jig has a slight defect, there is a problem that an erroneous determination frequently occurs due to an increase in contact resistance, deformation of wiring, and the like. In this case, the operator may find an abnormality in the jig by checking the jig.

Therefore, the inspection device 100 according to the present embodiment is configured as described above. Therefore, the inspection device 100 according to the present embodiment can solve the above problems.

<Second Embodiment>
The configuration of the present embodiment is a configuration for automatically inspecting a jig (hereinafter, also referred to as “configuration CtA”). Hereinafter, the inspection device to which the configuration CtA is applied is also referred to as “inspection device 100A”.

FIG. 5 is a diagram showing the configuration of the inspection device 100A according to the second embodiment of the present invention. With reference to FIG. 5, the inspection apparatus 100A includes a PC (Personal Computer) 70, a relay unit 80, a constant current source 60, a conversion unit 90, and a jig 20.

The constant current source 60 and the jig 20 are as described in the first embodiment. The inspection apparatus 100A is an apparatus in which the inspection apparatus 100 of FIG. 3 is provided with a PC 70, a conversion unit 90, and a relay unit 80 including voltage measuring devices 50a and 50b. Therefore, the connection configuration of the jig 20, the voltage measuring devices 50a and 50b, and the constant current source 60 in the inspection device 100A is the same as the configuration of FIG.

The PC 70 can perform an inspection based on various conditions by executing any of a plurality of types of inspection programs. The PC 70 is a computer that controls the constant current source 60 and the voltage measuring devices 50a and 50b in order to acquire the inspection value for inspecting the jig 10. The PC 70 controls the relay unit 80, the constant current source 60, and the conversion unit 90. The PC 70 controls the amount of current supplied by the constant current source 60, for example.

The relay unit 80 is connected to the jig 20. The relay unit 80 performs various processes under the control of the PC 70. The relay unit 80 includes voltage measuring devices 50a and 50b. That is, the PC 70 controls the voltage measuring devices 50a and 50b as needed.

Further, the relay unit 80 has a function of changing the probe pin 2s to which the current supplied from the constant current source 60 flows, under the control of the PC 70. In the following, the probe pin 2s that is the target of the current flow is also referred to as “target probe pin”. For example, the relay unit 80 sequentially changes the target probe pin from the probe pin 2s at the left end to the probe pin 2s at the right end in the plurality of probe pins 2s shown in FIG.

The conversion unit 90 has a function of performing A/D conversion and D/A conversion.

Next, a process for inspecting the jig 10 (hereinafter, also referred to as “jig inspection process A”) performed by the inspection device 100A will be described. In the jig inspection process A, the jig arrangement process, the current supply process, and the voltage measurement process are performed as in the first embodiment.

The relay unit 80 transmits a signal indicating the voltage measured by the voltage measurement process to the conversion unit 90. The conversion unit 90 obtains the voltage value of the signal by A/D conversion. Then, the conversion unit 90 transmits the voltage value as the inspection value to the PC 70. The PC 70 determines, for example, the upper limit and the lower limit of the inspection value.

Then, each time the relay unit 80 changes the target probe pin in the plurality of probe pins 2s, the current supply process and the voltage measurement process are performed. Thereby, the plurality of relay wirings 11 can be sequentially inspected.

As described above, according to the present embodiment, the jig 10 can be automatically inspected. Further, the operation of the relay unit 80 allows the plurality of relay wires 11 to be sequentially inspected.

The jig 10 may be inspected each time the power semiconductor product D1 is completely inspected and the power semiconductor product D1 is removed from the jig 10. With this configuration, it is possible to quickly detect an abnormality in the jig 10.

Further, the power semiconductor product D1 may be inspected for electrical characteristics and the jig 10 may be inspected. With this configuration, it is possible to quickly detect an abnormality in the jig 10.

Further, the inspection device 100A may be connected to a production device (mass production device) so that the inspection device 100A communicates with the production device. According to this configuration, the jig can be inspected online. Accordingly, it is possible to suppress the occurrence of erroneous determination due to the defect of the jig 10. As a result, stable production and highly reliable electrical characteristic test can be realized.

In addition, conventionally, there is a problem that it takes time to check all the relay wirings 11. In addition, there is a problem in that the wear control and the like cannot be conventionally performed. On the other hand, in the present embodiment, the soundness of the jig 10 can be easily confirmed by bringing the jig 20 into contact with the jig 10 and performing an inspection.

In addition, in the PC 70, the tendency of the contact resistance value can be managed by accumulating the inspection value data. This makes it possible to predict the occurrence of an abnormality in the jig 10 in advance and prevent the occurrence of the abnormality.

It should be noted that, in the present invention, the respective embodiments can be freely combined, or the respective embodiments can be appropriately modified or omitted within the scope of the invention.

10, 20, 20N jig, 11, 11a, 11b relay wiring, 40 electrodes, 50a, 50b voltage measuring device, 60 constant current source, 70 PC, 100, 100A inspection device.

Claims (3)

An inspection device for inspecting a jig for inspecting electric characteristics of a power semiconductor product,
The jig has a plate shape,
A first relay wiring and a second relay wiring for inspecting the power semiconductor product are provided on the main surface side of the jig,
Each of the first relay wire and the second relay wire has a first tip and a second tip,
The first tip of the first relay wire is adjacent to the first tip of the second relay wire,
The inspection device,
An electrode for contacting the first tip of the first relay wire and the first tip of the second relay wire;
A constant current source that supplies a current to the first relay wiring and the second relay wiring using the electrode,
The electrodes are
A first portion for contacting the first tip of the first relay wiring;
A second portion for contacting the first tip of the second relay wiring,
The first portion has a flat first flat surface for contacting the first tip of the first relay wire,
The second portion has a flat second flat surface for contacting the first tip of the second relay wiring,
An inspection apparatus in which the first plane and the second plane are provided at the same height in the electrode. The inspection device further comprises
The inspection device according to claim 1, further comprising a voltage measuring device that measures a voltage between the first tip and the second tip in each of the first relay wiring and the second relay wiring. The inspection device further comprises
The inspection apparatus according to claim 2, further comprising a computer that controls the constant current source and the voltage measuring device to obtain an inspection value for inspecting the jig.

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