CN110794290B - Substrate detection device and substrate detection method - Google Patents
Substrate detection device and substrate detection method Download PDFInfo
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- CN110794290B CN110794290B CN201911179851.6A CN201911179851A CN110794290B CN 110794290 B CN110794290 B CN 110794290B CN 201911179851 A CN201911179851 A CN 201911179851A CN 110794290 B CN110794290 B CN 110794290B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
- G01R31/2812—Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
Abstract
The invention provides a substrate detection device and a substrate detection method. A control unit (27) and a signal switching unit (26) form a voltage measurement circuit through a plurality of circuit patterns (41, 42) to be measured. In the correction voltage measurement step, the control unit (27) measures the thermal electromotive force (V0) by the voltage measurement unit (19) in a state where no current is supplied to any of the circuit patterns (41, 42) to be measured. In the circuit pattern measurement step, the control unit (27) measures the voltage drop by the voltage measurement unit (19) in a state where current is supplied to any one of the circuit patterns (41, 42) to be measured. In a correction step, the control unit (27) corrects the voltage drop measured in the circuit pattern measurement step using the value of the thermal electromotive force (V0) measured in the correction voltage measurement step. The control unit (27) performs a circuit pattern measurement step and a correction step for each of the plurality of circuit patterns (41, 42) to be measured.
Description
The present application is a divisional application of an invention patent application having an application date of 24/4/2014 and an application number of 201480022923.5, entitled "substrate detection apparatus and substrate detection method".
Technical Field
The present invention relates to a structure for eliminating the influence of a thermal electromotive force in a substrate detection apparatus.
Background
Conventionally, a substrate detection apparatus for detecting a plurality of circuit patterns formed on a circuit substrate is known. For example, patent document 1 describes such a substrate detection apparatus.
Fig. 9 schematically illustrates a state where a conventional substrate detection apparatus detects a circuit pattern 12 formed on a circuit substrate 11. The circuit pattern 12 illustrated in fig. 9 has detection points 13 and 14 formed thereon. The substrate detection apparatus has a plurality of detection probes 15 which can contact the detection points 13 and 14.
The substrate detection apparatus has a voltage measurement unit 19 (voltmeter) for measuring the potential difference between the detection points 13 and 14. The substrate detection apparatus further includes a current supply unit 17 for supplying a predetermined current to the circuit pattern 12.
The substrate inspection apparatus configured as described above supplies a predetermined current i [ A ] to the circuit pattern 12 by the current supply unit 17, and measures a voltage drop generated between the inspection points 13 and 14 at that time by the voltage measurement unit 19. When the resistance between the detecting points 13 and 14 of the circuit pattern 12 is R omega, the voltage drop generated between the detecting points 13 and 14 is iR V.
The substrate detection apparatus determines the resistance R of the circuit pattern 12 based on the magnitude of the current i supplied to the circuit pattern 12 and the magnitude of the voltage drop iR measured by the voltage measurement unit 19. The substrate detection apparatus can determine whether or not the circuit pattern 12 is normal based on the obtained resistance R value.
In such a substrate inspection apparatus, since the inspection probe 15 is in contact with the inspection point 13 or 14, a thermal electromotive force due to a seebeck effect (seebeck effect) may be generated. Therefore, the voltage measuring unit 19 in fig. 9 cannot simply measure the voltage drop iR generated between the detecting points 13 and 14 due to the influence of the thermal electromotive force. Here, the measurement result V [ V ] of the voltage measurement section 19 by the thermoelectric potential due to the Seebeck effect]The resulting influence is V0[V]In this case, the measurement result V can be represented by the following formula 1.
V＝iR+V0Mathematical formula 1
Therefore, in order to accurately measure the magnitude of the voltage drop iR generated in the circuit pattern 12, it is preferable to correct the magnitude so as to cancel the thermal electromotive force V from the measurement result V of the voltage measuring section 190The influence of (c). However, in general, the thermal electromotive force V0Is unknown.
Heretofore, it has been considered that the thermal electromotive force V0Is the range of error. Therefore, elimination of the thermal electromotive force V is not particularly taken0Correction of the influence.
However, with the recent reduction in core thickness or coreless manufacturing work, the thickness of the circuit board 11 is reduced, and the resistance of the circuit pattern 12 is also reduced. Therefore, since the recent detection device needs to measure the micro-resistance with good precision, the thermal electromotive force V cannot be ignored0The influence of (c).
Therefore, recently, correction is intentionally made to eliminate the thermal electromotive force V0The influence of (c). Therefore, after the measurement of fig. 9 is performed, the magnitude of the current supplied to the circuit pattern 12 is changed and the measurement is performed once again. For example, as shown in FIG. 10, for the circuitThe pattern 12 supplies a current-i [ A ] in the opposite direction to the first measurement (FIG. 9)]The voltage is measured by the voltage measuring section 19. When the measurement result (second measurement result) of the voltage measured by the voltage measurement unit 19 is V', V ═ iR + V0. Here, the thermoelectromotive force V of the first measurement (FIG. 9) and the second measurement (FIG. 10) is assumed0When the magnitude of the thermal electromotive force is constant, the thermal electromotive force V can be cancelled by obtaining the difference between the first measurement result V and the second measurement result V0The influence of (c). I.e., V-V ═ 2 iR. Therefore, the resistance R of the circuit pattern 12 can be determined with high accuracy from (V-V')/2 i. In the following description, the cancellation of the thermal electromotive force V as described above is performed0The method of influence is referred to as "existing detection method" for short.
The conventional detection method is to eliminate the thermal electromotive force V0At least 2 measurements are required for 1 circuit pattern. Thus, the detection time is required to be 2 times as long as that in the case where the influence of the thermal electromotive force is not corrected by a simple calculation.
Thus, in the conventional substrate detection apparatus, elimination of the thermal electromotive force V is performed0In the correction of the influence, there is a problem that the detection time of the circuit board becomes long.
The present invention has been made in view of the above circumstances, and an object thereof is to provide a substrate detection apparatus capable of eliminating the influence of thermal electromotive force and detecting at high speed.
Documents of the prior art
Patent document 1
Japanese patent laid-open publication No. 2009-
Disclosure of Invention
The problems to be solved by the present invention are as described above, and the means for solving the problems and the effects thereof will be described next.
According to an aspect of the present invention, there is provided a substrate detection apparatus for detecting a circuit pattern formed on a circuit substrate. The substrate detection device comprises a voltage measurement circuit forming part, a voltage measurement part, a current supply part and a control part. The voltage measurement circuit forming unit forms a voltage measurement circuit through a circuit pattern to be measured. The voltage measuring unit is disposed on the voltage measuring circuit. The current supply unit can supply a current to the circuit pattern to be measured. The control unit can execute a correction voltage measuring step, a circuit pattern measuring step, and a correcting step. The correction voltage measuring step is to measure the voltage by the voltage measuring unit in a state where no current is supplied to the circuit pattern to be measured. The circuit pattern measuring step is a step of measuring a voltage by the voltage measuring unit in a state where a current is supplied to the circuit pattern to be measured. The correcting step corrects the voltage measured in the circuit pattern measuring step by the voltage measured in the correcting voltage measuring step.
According to the correction voltage measuring step, the influence of the thermoelectromotive force generated in the voltage measuring circuit can be measured. Therefore, the measurement value in the correction voltage measurement step can be used to perform correction for eliminating the influence of the thermal electromotive force. In the correction voltage measuring step, since no current flows into the circuit pattern, the voltage can be measured immediately without a surge current. Thus, the correction voltage measurement step can be completed at a higher speed than the voltage drop in the measurement circuit pattern. Therefore, the time required for measurement can be shortened compared to the conventional detection method in which the voltage drop of the circuit pattern is measured 2 times to eliminate the influence of the thermal electromotive force.
The substrate detection apparatus is preferably configured as follows. That is, the voltage measurement circuit forming unit forms the voltage measurement circuit through a plurality of circuit patterns of a measurement object. The control unit performs the circuit pattern measuring step and the correcting step on each of the plurality of circuit patterns to be measured.
In this way, since the voltage measurement circuit is formed by the plurality of circuit patterns passing through the measurement object, the plurality of circuit patterns can be measured by 1 voltage measurement circuit. The influence of the thermal electromotive force may be measured 1 time, and each circuit pattern to be measured may be measured 1 time. Therefore, the number of measurements can be reduced and the time required for the measurement can be shortened, compared to the conventional detection method in which each circuit pattern needs to be measured 2 times to eliminate the influence of the thermal electromotive force.
In the substrate detection apparatus, it is preferable that the voltage measurement circuit forming unit forms the voltage measurement circuit by passing through 3 or more circuit patterns to be measured.
Thus, a voltage measuring circuit can be formed through a plurality of circuit patterns. Thus, the number of circuit patterns that can be measured by 1 voltage measurement circuit increases, and the effect of shortening the time required for measurement can be improved.
In the substrate detection apparatus, it is preferable that the voltage measurement circuit includes an even number of circuit patterns that conduct both sides of the circuit substrate.
Thus, the voltage measurement circuit can be closed without requiring wiring for connecting the front surface and the back surface of the substrate. Accordingly, the area of the voltage measurement circuit can be reduced, and the influence of noise (noise) is hardly received, thereby improving the measurement accuracy.
According to another aspect of the present invention, there is provided a substrate inspection method for inspecting a circuit pattern formed on a circuit substrate as follows. That is, the substrate inspection method includes a voltage measurement circuit forming step, a correction voltage measurement step, a circuit pattern measurement step, and a correction step. The voltage measurement circuit forming step is to form a voltage measurement circuit through a circuit pattern of a measurement object. The correction voltage measuring step is a step of measuring a voltage by a voltage measuring unit disposed in the voltage measuring circuit in a state where no current is supplied to the circuit pattern to be measured. The circuit pattern measuring step is a step of measuring a voltage by the voltage measuring unit in a state where a current is supplied to the circuit pattern to be measured. The correcting step corrects the voltage measured in the circuit pattern measuring step by the voltage measured in the correcting voltage measuring step.
Drawings
Fig. 1 is a front view of the entire configuration of a substrate detection apparatus according to an embodiment of the present invention.
Fig. 2 is a schematic diagram of the calibration voltage measurement step of the first embodiment.
Fig. 3 is an explanatory diagram of the voltage measurement circuit.
Fig. 4 is a schematic diagram of the first circuit pattern measuring step.
Fig. 5 is a schematic diagram of the second circuit pattern measuring step.
FIG. 6 is a schematic view of a second embodiment.
Fig. 7 is an explanatory diagram of a voltage measurement circuit according to a second embodiment.
Fig. 8 is a diagram showing a modification.
Fig. 9 is an explanatory view of a conventional substrate inspection method.
Fig. 10 is an explanatory view of a conventional substrate inspection method.
[ description of reference numerals ]
10: substrate detection device
11: circuit board
17: current supply unit
19: voltage measurement part
26: signal switching part (Voltage measuring circuit forming part)
27: control part (Voltage measuring circuit forming part)
41. 42: first and second circuit patterns
Detailed Description
Hereinafter, a first embodiment of the present invention will be described with reference to the drawings. Fig. 1 shows a schematic front view of a substrate detection apparatus 10 according to the first embodiment.
As shown in fig. 1, the substrate detection apparatus 10 has a housing 30. A substrate mounting table 20 on which a circuit substrate to be detected is mounted, a first detection unit 21, and a second detection unit 22 are provided in an internal space of the housing 30.
And a substrate mounting table 20 on which the circuit substrate 11 to be detected can be mounted. The first detection unit 21 is located above the circuit board 11 mounted on the board mounting stage 20. The second detection unit 22 is located below the circuit board 11 mounted on the substrate mounting stage 20. The first and second detecting portions 21 and 22 each include a detecting jig 23 having a plurality of probes (contact terminals) 15 and a holding body 24 for holding the detecting jig 23.
In addition, the substrate detection apparatus 10 has a jig moving mechanism 25. The jig moving mechanism 25 is configured to be able to appropriately move the first detection unit 21 and the second detection unit 22 in the internal space of the housing 30.
The substrate detection apparatus 10 configured as described above moves the first and second detection units 21 and 22 relative to the circuit substrate 11 mounted on the substrate mounting stage 20, so that the probe 15 can contact a detection point formed on a circuit pattern included in the circuit substrate 11.
Fig. 2 schematically shows a state where the probe 15 contacts the detection point. A first circuit pattern 41 and a second circuit pattern 42 are formed on the circuit board 11 illustrated in fig. 2. This is a simplified drawing for illustration, and a circuit board may have several tens to several thousands of circuit patterns formed thereon in actual practice.
The first and second circuit patterns 41 and 42 illustrated in fig. 2 are insulated from each other. The first and second circuit patterns 41 and 42 illustrated in fig. 2 are formed by respectively conducting the upper surface (first surface) and the lower surface (second surface) of the circuit board 11. At least 2 detecting points capable of contacting the probe 15 are formed on the first and second circuit patterns 41 and 42, respectively. For example, the first circuit pattern 41 illustrated in fig. 2 has the detecting points 43 on the upper surface side of the circuit board 11 and the detecting points 44 on the lower surface side. The second circuit pattern 42 illustrated in fig. 2 has detection points 45 on the upper surface side of the circuit board 11 and detection points 46 on the lower surface side. In addition, fig. 2 is simplified, and the actual circuit board may have hundreds to thousands of detecting points.
The probe 15 is a needle-shaped or linear member having conductivity. As shown in fig. 2, the plurality of probes 15 provided in the first detecting section 21 are provided so as to be capable of contacting the detecting points 43, 45, and … formed on the upper surface (first surface) of the circuit board 11 to be detected. Similarly, the plurality of probes 15 provided in the second detection unit 22 are provided so as to be able to contact the detection points 44, 46, and … formed on the lower surface (second surface) of the circuit board 11 to be detected. Fig. 2 shows a state where the first and second detection units 21 and 22 have 4 probes, respectively, but this is simplified, and an actual apparatus may have hundreds to thousands of probes 15.
The first and second detecting units 21 and 22 are configured to be able to contact 2 probes 15 at respective detecting points. This is because the substrate detection apparatus 10 of the present embodiment is configured to measure the resistance between detection points by a four-terminal method. That is, among the 2 probes 15 in contact with each detection point, one is a current supply probe and the other is a voltage measurement probe.
As shown in fig. 1, the upper and lower first and second detection units 21 and 22 respectively include a current supply unit 17, a current measurement unit 18, and a voltage measurement unit 19 in a holder 24. Further, a signal switching unit 26 is provided in the holding body 24 of the upper and lower first and second detection units 21 and 22. The substrate detection apparatus 10 includes a control unit 27 capable of controlling the signal switching unit 26. The control unit 27 is a computer including a CPU, ROM, RAM, and the like. The control unit 27 holds data relating to a circuit pattern and the like formed on the circuit board 11.
The current supply unit 17 is configured to be able to supply a predetermined current (direct current in the present embodiment). As shown in fig. 2 and the like, the signal switching unit 26 is a switch that can switch the connection/disconnection state between the current measuring probe 15 and the positive electrode-side terminal of the current supply unit 17 in each current measuring probe 15. In fig. 2 and the like, unnecessary switches and wirings are not shown as appropriate for convenience of explanation.
The current measuring unit 18 is configured to measure a flowing current. As shown in fig. 2 and the like, the signal switching unit 26 is a switch that can switch the connection/disconnection state between the current measurement probe 15 and the positive electrode-side terminal of the current measurement unit 18 in each current measurement probe 15. In fig. 2 and the like, unnecessary switches and wirings are not shown as appropriate for convenience of explanation. The negative electrode-side terminal of the current measuring unit 18 is grounded.
The control unit 27 can switch each probe 15 for current measurement to any one of a state of being connected to the current supply unit 17, a state of being connected to the current measurement unit 18, and a state of being not connected to either one of the current supply unit 17 and the current measurement unit 18 by appropriately controlling the switch of the signal switching unit 26.
For example, as shown in fig. 4, the control unit 27 connects the current measuring probe 15, which is in contact with the detection point 43 of the first circuit pattern 41, to the current supply unit 17 by appropriately controlling the signal switching unit 26. At this time, the control unit 27 appropriately controls the signal switching unit 26 to connect the current measuring probe 15 in contact with the other detection point 44 of the first circuit pattern 41 to the current measuring unit 18. At this time, the control unit 27 places the other current measuring probe 15 in a state not connected to the current supply unit 17 and not connected to the current measuring unit 18. Thus, a predetermined current is supplied from the current supply unit 17 to between the detection points 43 and 44 of the first circuit pattern 41, and the magnitude of the flowing current can be measured by the current measurement unit 18.
Similarly, for example, as shown in fig. 5, the control unit 27 connects the current measuring probe 15 contacting the detecting point 45 of the second circuit pattern 42 to the current supply unit 17 by appropriately controlling the signal switching unit 26. At this time, the control unit 27 appropriately controls the signal switching unit 26 to connect the current measuring probe 15 in contact with the other detection point 46 of the second circuit pattern 42 to the current measuring unit 18. At this time, the control unit 27 places the other current measuring probe 15 in a state not connected to the current supply unit 17 and not connected to the current measuring unit 18. Thus, a predetermined current is supplied from the current supply unit 17 to between the detection points 45 and 46 of the second circuit pattern 42, and the magnitude of the flowing current can be measured by the current measurement unit 18.
As described above, the control unit 27 can measure the magnitude of the current flowing through any circuit pattern provided on the circuit board 11 by appropriately controlling the signal switching unit 26 to supply the current to the circuit pattern.
And a voltage measuring unit 19 configured to measure a voltage. As shown in fig. 2 and the like, the signal switching unit 26 is a switch that can switch the connection/disconnection state between the voltage measurement probe 15 and the positive electrode-side terminal of the voltage measurement unit 19 in each voltage measurement probe 15. As shown in fig. 2 and the like, the signal switching unit 26 is a switch that can switch the connection/disconnection state between the voltage measurement probe 15 and the negative electrode-side terminal of the voltage measurement unit 19 in each voltage measurement probe 15. In fig. 2 and the like, unnecessary switches and wirings are not shown as appropriate for convenience of explanation.
As shown in fig. 2 and the like, the signal switching unit 26 has an interconnection bus 31 for short-circuiting the voltage measurement probes 15. The signal switching unit 26 is a switch provided in each voltage measurement probe 15 to switch between a connection state and a non-connection state between the interconnection bus 31 and the voltage measurement probe 15. In fig. 2 and the like, unnecessary switches and interconnection buses 31 are not shown as appropriate for convenience of description.
The control unit 27 can form a voltage measurement circuit passing through a plurality of circuit patterns by appropriately controlling the switches of the signal switching unit 26.
For example, in the example of fig. 2, the control unit 27 appropriately controls the signal switching unit 26 to connect the voltage measurement probe 15 connected to the detection point 43 of the first circuit pattern 41 to the positive electrode side terminal of the voltage measurement unit 19. At this time, the control unit 27 appropriately controls the signal switching unit 26 to connect the voltage measuring probe 15 connected to the detection point 45 of the second circuit pattern 42 to the negative electrode-side terminal of the voltage measuring unit 19. At this time, the control unit 27 appropriately controls the signal switching unit 26 to connect the voltage measuring probe 15 connected to the detecting point 44 of the first circuit pattern 41 and the voltage measuring probe 15 connected to the detecting point 46 of the second circuit pattern 42 to each other via the interconnection bus 31. Therefore, in the example of fig. 2, a voltage measurement circuit is formed that passes through the first circuit pattern 41 and the second circuit pattern 42.
In order to clearly show the voltage measurement circuit, the circuit of fig. 2 is shown more schematically in fig. 3. As shown in fig. 3, the voltage measurement circuit 29 is a closed loop circuit, and the voltage measurement unit 19 is inserted in series in the middle thereof. The voltage measuring circuit 29 illustrated in fig. 2 and 3 is formed by passing through the first circuit pattern 41 and the second circuit pattern 42.
With the above configuration, the control unit 27 can form the voltage measurement circuit 29 through an arbitrary circuit pattern provided on the circuit board 11 by appropriately controlling the signal switching unit 26. Therefore, the control unit 27 and the signal switching unit 26 according to the present embodiment may be referred to as a voltage measurement circuit forming unit.
Next, a substrate detection method using the substrate detection apparatus 10 according to the present embodiment will be described with reference to fig. 2 to 5.
First, the control unit 27 appropriately controls the signal switching unit 26 to form a voltage measurement circuit through a plurality of circuit patterns to be measured (voltage measurement circuit forming step). This state is illustrated in fig. 2. In fig. 2, for example, a first circuit pattern 41 and a second circuit pattern 42 formed on the circuit board 11 are objects to be measured. In the case of fig. 2, the control unit 27 forms the voltage measurement circuit 29 (see fig. 3) through the first circuit pattern 41 and the second circuit pattern 42 to be measured.
Next, the control unit 27 appropriately controls the signal switching unit 26 so that any one of the probes 15 connected to the detection point of the circuit pattern to be measured is in a state of not being connected to the current supply unit 17 (the state of fig. 2). Therefore, no current is supplied to any of the first and second circuit patterns 41 and 42 to be measured.
In this state, the control unit 27 measures the voltage by the voltage measuring unit 19 (correction voltage measuring step). Thus, the magnitude V of the influence of the thermoelectromotive force generated in the voltage measurement circuit 29 on the measurement result of the voltage measurement unit 19 can be measured0(hereinafter, abbreviated as "thermoelectromotive force V0"). At this time, the control unit 27 stores the measured thermoelectromotive force V0The value is obtained.
Next, the control unit 27 supplies a current to the circuit pattern to be measured, measures the magnitude of the current flowing at that time by the current measuring unit 18, and measures the potential difference (voltage drop) generated at that time by the voltage measuring unit 19 (first and second circuit pattern measuring steps). The control unit 27 performs the circuit pattern measuring step on each of the circuit patterns 41 and 42 to be measured.
For example, the control unit 27 appropriately controls the signal switching unit 26 to supply a current between the 2 detection points 43 and 44 of the first circuit pattern 41 to be measured, as shown in fig. 4. The control unit 27 detects the magnitude of the current flowing at this time by the current measuring unit 18. At this time, the current measurement result from the current measurement section 18 is i1. Resistance between 2 detecting points 43, 44 of first circuit pattern 41Is R1At this time, a voltage drop (i) occurs between the detecting points 43 and 441R1). The control unit 27 measures the voltage drop generated between the detection points 43 and 44 by the voltage measuring unit 19. At this time, V is obtained from the voltage drop measurement result of the voltage measurement unit 191. For convenience of explanation, the above measurement is referred to as a "first circuit pattern measurement step".
In the circuit pattern measuring step, the voltage measuring circuit forming portion (the control portion 27 and the signal switching portion 26) is configured so that the switching state of the voltage measuring probe 15 connected thereto does not change from the state in the calibration voltage measuring step. Therefore, it is pointed out that the voltage measurement circuit 29 in the first circuit pattern measurement step (fig. 4) measures the thermoelectromotive force V from the correction voltage measurement step0The state of time (the state of fig. 2 and 3) is not changed. That is, the voltage measurement circuit 29 in fig. 2 and 3 is configured to pass through the first circuit pattern 41 to be measured. Thus, the voltage measuring unit 19 disposed in the voltage measuring circuit 29 can measure the first circuit pattern 41 in the original state.
Similarly, the control unit 27 appropriately controls the signal switching unit 26 to supply a current between the 2 detection points 45 and 46 of the other measurement target second circuit pattern 42, as shown in fig. 5. The control unit 27 detects the magnitude of the current flowing at this time by the current measuring unit 18. At this time, the current measurement result from the current measurement section 18 is i2. The resistance between the 2 detecting points 45, 46 of the second circuit pattern 42 is R2At this time, a voltage drop (i) occurs between the detecting points 45 and 462R2). The control unit 27 measures the voltage drop generated between the detection points 45 and 46 by the voltage measuring unit 19. At this time, V is obtained from the voltage drop measurement result of the voltage measurement unit 192. For convenience of explanation, the above measurement is referred to as "second circuit pattern measurement step".
It is noted that the voltage measuring circuit 29 in the second circuit pattern measuring step (fig. 5) is configured to measure the thermoelectromotive force V from the correction voltage measuring step0The state of time (the state of fig. 2 and 3) is not changed. That is, the voltage measuring circuit 29 of fig. 2 and 3 passes through the object to be measuredAnd a second circuit pattern 42. Thus, the voltage measuring unit 19 disposed in the voltage measuring circuit 29 can measure the second circuit pattern 42 in the original state.
However, since the voltage measurement circuit 29 may generate a thermoelectric force due to the seebeck effect, the voltage drop measurement result V in the first circuit pattern measurement step1And a voltage drop measurement result V in the second circuit pattern measurement step2Respectively, including the effects of thermal electromotive force. However, as described above, in the first circuit pattern measuring step (fig. 4) and also in the second circuit pattern measuring step (fig. 5), the configuration of the voltage measuring circuit 29 is unchanged from the time of the correction voltage measuring step (fig. 2 and 3). Therefore, it can be considered that the thermoelectromotive force generated in the voltage measurement circuit 29 does not change in the correction voltage measurement step, the first circuit pattern measurement step, and the second circuit pattern measurement step.
That is, the measurement result V1 of the voltage measuring unit 19 in the first circuit pattern measuring step uses the thermal electromotive force V measured in the corrected voltage measuring step0Can be represented by mathematical formula 2:
V1＝i1R1+V0mathematical formula 2
Similarly, the measurement result V of the voltage measuring section 19 in the second circuit pattern measuring step2Using the thermal electromotive force V measured in the voltage correction measuring step0Can be expressed by mathematical formula 3 as follows:
V2＝i2R2+V0mathematical formula 3
Therefore, the control unit 27 uses the thermal electromotive force V measured in the corrected voltage measurement step0Value-corrected measurement result V of the voltage measuring section 19 in the first circuit pattern measuring step1And a measurement result V of the voltage measuring section 19 in the second circuit pattern measuring step2(correction step).
More specifically, the control unit 27 is a measurement result V from the voltage measuring unit 19 in the first circuit pattern measuring step1Subtracting the thermoelectromotive force V measured in the correction voltage measuring step0FromThis cancels out the influence of the thermal electromotive force (see equation 4).
V1-V0＝i1R1Mathematical formula 4
Thus, the control unit 27 can accurately obtain the magnitude (i) of the voltage drop generated in the first circuit pattern 411R1)。
Similarly, the control unit 27 is the measurement result V from the voltage measuring unit 19 in the second circuit pattern measuring step2Subtracting the thermoelectromotive force V measured in the correction voltage measuring step0Thereby canceling the influence of the thermal electromotive force (see equation 5).
V2-V0＝i2R2Mathematical formula 5
Thus, the control section 27 can accurately obtain the magnitude (i) of the voltage drop generated in the second circuit pattern 422R2)。
As described above, according to the substrate detection method using the substrate detection apparatus 10 of the present embodiment, the voltage drop generated in the first and second circuit patterns 41 and 42 can be accurately measured by eliminating the influence of the thermal electromotive force.
However, in the conventional detection method, in order to eliminate the influence of the thermal electromotive force, it is necessary to measure the voltage for each circuit pattern 2 times. Therefore, in the conventional detection method, it is necessary to measure the voltages 4 times in total in order to measure 2 first and second circuit patterns 41 and 42.
In contrast, according to the substrate inspection method of the present embodiment, the number of voltage measurements required for measuring the 2 first and second circuit patterns 41 and 42 may be 3 times in total (the calibration voltage measurement step, the first circuit pattern measurement step, and the second circuit pattern measurement step). Thus, according to the detection method of the present embodiment, the number of measurements can be reduced from 4 to 3 in the conventional case. Therefore, the measurement speed can be improved by about 1.33 times compared with the conventional method by simple calculation.
In addition, since the correction voltage measuring step is performed only by measuring the thermoelectromotive force V0The circuit pattern measurement process can be completed at a higher speed than the circuit pattern measurement process. That is, in the calibration voltage measuring step, the correction voltage is measured for any circuit patternSince no current flows, the voltage can be measured immediately without a surge current. Therefore, the voltage measurement in the correction voltage measurement step can be performed at a higher speed than the voltage measurement performed 1 time for supplying the current to the circuit pattern. Thus, the calibration voltage measurement process can be speeded up, and the substrate inspection method of the present embodiment can be speeded up more than 1.33 times that of the conventional inspection method.
As described above, the voltage measurement circuit forming unit (the control unit 27 and the signal switching unit 26) of the present embodiment forms the voltage measurement circuit 29 through the plurality of first and second circuit patterns 41 and 42 to be measured. The control unit 27 measures the thermal electromotive force V by the voltage measuring unit 19 in a state where no current is supplied to any of the first and second circuit patterns 41, 42 of the measurement object in the correction voltage measuring step0. The control unit 27 measures the voltage drop by the voltage measuring unit 19 in a state where the current is supplied to any one of the first and second circuit patterns 41 and 42 to be measured in the circuit pattern measuring step. The control unit 27 is a correction step of using the voltage drop measured in the circuit pattern measurement step in the thermoelectric power V measured in the correction voltage measurement step0The value is corrected.
According to the calibration voltage measurement step, the thermoelectromotive force V generated in the voltage measurement circuit 29 can be measured0. Therefore, the thermoelectromotive force V measured in the corrected voltage measurement step is used0Value, can perform elimination of its thermal electromotive force V0Correction of the influence. In the correction voltage measuring step, since no current flows into any of the first and second circuit patterns 41 and 42, no inrush current is caused, and the voltage can be measured immediately. Thus, the correction voltage measurement step can be completed at a higher speed than the voltage drop in the measurement circuit pattern. Therefore, the time required for measurement can be shortened as compared with the conventional detection method.
The control unit 27 of the present embodiment performs the circuit pattern measuring step and the correcting step on each of the plurality of first and second circuit patterns 41 and 42 to be measured.
That is, in the present embodiment, the plurality of first and second electrodes passing through the object to be measuredSince the voltage measurement circuit 29 is formed by the two circuit patterns 41 and 42, a plurality of first and second circuit patterns 41 and 42 can be measured by 1 voltage measurement circuit 29. Thermoelectromotive force V0The measurement may be performed 1 time, and each circuit pattern to be measured may be measured 1 time. Therefore, the number of measurements can be reduced and the time required for the measurement can be shortened, compared to the conventional detection method in which each circuit pattern is measured 2 times to eliminate the influence of the thermal electromotive force.
The second embodiment of the present invention will be described below. In the description of the second embodiment, the same or similar components as those of the above-described embodiment are denoted by the same reference numerals in the drawings, and the description thereof will be omitted.
In the first embodiment, the voltage measurement circuit forming unit (the control unit 27 and the signal switching unit 26) forms the voltage measurement circuit 29 through the 2 first and second circuit patterns 41 and 42 to be measured. However, the number of circuit patterns included in the voltage measurement circuit 29 is not limited to 2, and may be 3 or more.
For example, as shown in fig. 6, the second embodiment shows that the voltage measurement circuit forming unit (the control unit 27 and the signal switching unit 26) forms a voltage measurement circuit through 5 circuit patterns (the first circuit pattern 51, the second circuit pattern 52, the third circuit pattern 53, the fourth circuit pattern 54, and the fifth circuit pattern 55) to be measured.
In order to more clearly show the voltage measuring circuit of the second embodiment, the circuit of fig. 6 is more schematically shown in fig. 7. As in the first embodiment, the voltage measuring circuit 59 of the second embodiment is also formed in a closed loop shape, and the voltage measuring unit 19 is inserted in series in the middle thereof.
In this way, when the voltage measurement circuit 59 is formed by passing through the 5 first to fifth circuit patterns 51, 52, 53, 54, 55 to be measured, the 5 first to fifth circuit patterns 51, 52, 53, 54, 55 can be measured by 1 voltage measurement circuit 59. Therefore, in this case, the control unit 27 measures the thermal electromotive force V in a state where no current is supplied to any of the first to fifth circuit patterns 51, 52, 53, 54, and 550(correction voltage measuring step) for 5 first to second electrodesThe five circuit patterns 51, 52, 53, 54, 55 perform voltage drop measurement (circuit pattern measurement step), and correct the respective measurement results to the thermoelectromotive force V measured in the voltage measurement step0Correction is performed (correction step). Therefore, when the measurement is performed by the voltage measurement circuit 59 of the second embodiment shown in fig. 6 and 7, the control unit 27 performs the voltage measurement 6 times in total by performing the correction voltage measurement step 1 time and the circuit pattern measurement step 5 times.
In contrast, in the conventional detection method, the voltage needs to be measured 2 times for each of the 5 first to fifth circuit patterns 51, 52, 53, 54, 55, and a total of 10 times. As described above, according to the second embodiment shown in fig. 6 and 7, the number of measurements can be reduced from 10 times to 6 times in the conventional detection method, and the measurement speed can be increased by about 1.66 times by simple calculation compared to the conventional detection method. Therefore, the second embodiment has an effect of increasing the measurement speed more than the first embodiment (1.33 times).
As described above, according to the substrate detection method of the present invention, the effect of increasing the measurement speed can be obtained as the number of circuit patterns included in the voltage measurement circuit as the measurement target increases. The number of circuit patterns included in the voltage measurement circuit is not limited, and the control unit 27 and the signal switching unit 26 may form the voltage measurement circuit through any number of circuit patterns that can be handled. For example, a voltage measurement circuit may be formed by passing 100 circuit patterns.
As described above, the voltage measurement circuit 59 according to the second embodiment includes 3 or more circuit patterns (specifically, 5 circuit patterns) to be measured.
Thus, the voltage measuring circuit 59 can be formed through a plurality of circuit patterns. This increases the number of circuit patterns that can be measured by 1 voltage measurement circuit 59, and further improves the effect of shortening the time required for measurement.
The preferred embodiments of the present invention have been described above, but the above configuration may be modified as follows, for example.
In the above embodiment, the voltage measurement circuit forming section forms the voltage measurement circuit through the plurality of circuit patterns. Therefore, a plurality of circuit patterns can be measured by 1 voltage measurement circuit, and the number of voltage measurements can be reduced compared to the conventional detection method. However, the present invention is not limited to this, and the voltage measurement circuit forming unit may form the voltage measurement circuit through only 1 circuit pattern of the measurement object. In this case, since only 1 circuit pattern can be measured in the voltage measurement circuit, the voltage measurement step and the circuit pattern measurement step need to be corrected 1 time each, and 2 times of measurement in total, and the number of times of measurement is the same as that of the conventional detection method. However, as described above, the voltage measurement in the correction voltage measurement step can be completed at a higher speed than the voltage drop in the measurement circuit pattern. Therefore, even when the voltage measurement circuit passes through only 1 circuit pattern of the measurement object, the effect of shortening the measurement time can be obtained compared to the conventional detection method.
In the first embodiment, the first and second circuit patterns 41 and 42 forming the voltage measuring circuit 29 are all electrically connected to the upper surface and the lower surface of the circuit board 11, but the present invention is not limited thereto. For example, as shown in fig. 6 and 7, in the second embodiment, a voltage measuring circuit 59 is formed through a third circuit pattern 53 formed on the upper surface of the circuit board 11. Thus, the voltage measuring circuit can be formed without conducting the circuit pattern on the upper and lower surfaces of the circuit board.
However, it is preferable that the voltage measuring circuit includes an even number of circuit patterns on both surfaces of the conductive circuit board 11.
To explain this, fig. 8 illustrates a case where the voltage measurement circuit includes only circuit patterns on both sides of the conductive circuit board 11 in an odd number. That is, in the example of fig. 8, a voltage measurement circuit is formed via the first circuit pattern 51, the second circuit pattern 52, the third circuit pattern 53, and the fourth circuit pattern 54. Among the 4 circuit patterns, three (odd numbers) of the first circuit pattern 51, the second circuit pattern 52, and the fourth circuit pattern 54 are provided on both surfaces of the circuit board 11.
Thus, the present invention can also be applied to a case where the voltage measurement circuit includes only an odd number of circuit patterns on both sides of the conductive circuit board 11. In this case, however, wiring 60 (see fig. 8) for connecting the first detection unit 21 side and the second detection unit 22 side is additionally required in order to close the voltage measurement circuit. Therefore, the area of the voltage measurement circuit increases, and the voltage measurement circuit is easily affected by disturbance.
In this regard, when the voltage measurement circuit includes an even number of circuit patterns on both sides of the conductive circuit board 11 as in the first embodiment (fig. 2) or the second embodiment (fig. 6), the voltage measurement circuit can be closed without the need for the wiring 60 as described above. This reduces the area of the voltage measurement circuit, and makes it difficult to be affected by disturbance, thereby improving the measurement accuracy.
The voltage measuring circuit may not include circuit patterns for conducting both surfaces of the circuit board 11. For example, the voltage measuring circuit may be formed only through a circuit pattern formed on the upper surface (first surface) of the circuit board 11 (for example, the same as the third circuit pattern 53 in fig. 6). In this case, since only the upper surface side of the circuit board 11 is measured, the second detection unit 22 can be omitted. For example, the voltage measuring circuit may be formed only through a circuit pattern formed on the lower surface (second surface) of the circuit board 11. In this case, since only the lower surface side of the circuit board 11 is measured, the first detection unit 21 can be omitted.
In the above embodiment, the voltage drop is measured for all circuit patterns included in the voltage measurement circuit. However, the present invention is not limited to this, and the voltage drop may not be measured for several circuit patterns included in the voltage measurement circuit. That is, the voltage measurement circuit can be formed through a circuit pattern that is not a measurement target. For example, in the case of fig. 6, only the voltage drops of the first circuit pattern 51 and the second circuit pattern 52 may be measured, and the voltage drops of the remaining third to fifth circuit patterns 53, 54, 55 may not be measured (that is, the third to fifth circuit patterns 53, 54, 55 are not the measurement objects). In order to obtain the effects of the present invention, the voltage measurement circuit may include at least 1 circuit pattern of the measurement object.
The order of executing the correction voltage measuring step, the circuit pattern measuring step and the correcting step is not particularly limited, except that the correction voltage measuring step and the circuit pattern measuring step need to be completed before the correcting step. For example, the correction voltage measuring step may be performed after the circuit pattern measuring step is performed. In the above description of the first embodiment, the measurement results are corrected after the measurement of all the first and second circuit patterns 41 and 42 to be measured is completed, but the present invention is not limited to this, and the measurement results may be corrected sequentially every time the measurement of each circuit pattern is completed, for example.
Claims (5)
1. A substrate detection device for detecting a circuit pattern formed on a circuit substrate, comprising:
a voltage measurement circuit forming unit for forming a voltage measurement circuit through a plurality of circuit patterns to be measured;
a voltage measuring unit disposed in the voltage measuring circuit;
a current supply unit for supplying a current to the circuit pattern to be measured; and
a control unit;
the control section performs at least:
a correction voltage measurement step of measuring a voltage of the voltage measurement circuit by the voltage measurement unit in a state where no current is supplied to the circuit patterns to be measured;
a circuit pattern measuring step of measuring a voltage with respect to each of the circuit patterns to be measured by the voltage measuring unit in a state where a current is supplied to each of the circuit patterns to be measured; and
a correction step of correcting the voltages of the plurality of circuit patterns to be measured in the circuit pattern measurement step by the voltage of the voltage measurement circuit measured in the correction voltage measurement step,
the voltage measurement circuit in the correction voltage measurement step, the voltage measurement circuit in the circuit pattern measurement step, and the voltage measurement circuit in the correction step have the same configuration.
2. The substrate inspecting apparatus according to claim 1,
the voltage measurement circuit forming unit forms the voltage measurement circuit through 3 or more circuit patterns of the measurement object.
3. The substrate detection apparatus according to claim 1 or 2,
the voltage measuring circuit includes an even number of circuit patterns that conduct both sides of the circuit substrate.
4. The substrate inspecting apparatus according to claim 1,
the voltage measurement circuit also passes through a circuit pattern that is not the circuit pattern to be measured.
5. A substrate detection method for detecting a circuit pattern formed on a circuit substrate, comprising at least:
a voltage measurement circuit forming step of forming a voltage measurement circuit through a plurality of circuit patterns to be measured;
a correction voltage measurement step of measuring a voltage of the voltage measurement circuit by a voltage measurement unit disposed in the voltage measurement circuit in a state where no current is supplied to the circuit patterns to be measured;
a circuit pattern measuring step of measuring a voltage with respect to each of the circuit patterns to be measured by the voltage measuring unit in a state where a current is supplied to each of the circuit patterns to be measured; and
a correction step of correcting the voltages of the plurality of circuit patterns to be measured in the circuit pattern measurement step by the voltage of the voltage measurement circuit measured in the correction voltage measurement step,
the voltage measurement circuit in the correction voltage measurement step, the voltage measurement circuit in the circuit pattern measurement step, and the voltage measurement circuit in the correction step have the same configuration.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013094352A JP6137536B2 (en) | 2013-04-26 | 2013-04-26 | Substrate inspection apparatus and substrate inspection method |
| JP2013-094352 | 2013-04-26 | ||
| CN201480022923.5A CN105164542A (en) | 2013-04-26 | 2014-04-24 | Circuit board inspection apparatus and circuit board inspection method |
| PCT/JP2014/002326 WO2014174852A1 (en) | 2013-04-26 | 2014-04-24 | Circuit board inspection apparatus and circuit board inspection method |
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| CN201480022923.5A Division CN105164542A (en) | 2013-04-26 | 2014-04-24 | Circuit board inspection apparatus and circuit board inspection method |
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| CN110794290A CN110794290A (en) | 2020-02-14 |
| CN110794290B true CN110794290B (en) | 2022-04-12 |
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| CN201480022923.5A Pending CN105164542A (en) | 2013-04-26 | 2014-04-24 | Circuit board inspection apparatus and circuit board inspection method |
| CN201911179851.6A Active CN110794290B (en) | 2013-04-26 | 2014-04-24 | Substrate detection device and substrate detection method |
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| JP (1) | JP6137536B2 (en) |
| KR (1) | KR102158640B1 (en) |
| CN (2) | CN105164542A (en) |
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| CN106824832B (en) * | 2017-02-15 | 2019-05-17 | 友达光电（苏州）有限公司 | A kind of detection device and its application method |
| JP6696523B2 (en) * | 2018-03-14 | 2020-05-20 | 日本電産リード株式会社 | Resistance measuring method, resistance measuring device, and board inspection device |
| TWI726681B (en) * | 2020-04-14 | 2021-05-01 | 元太科技工業股份有限公司 | Electronic device |
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Also Published As
| Publication number | Publication date |
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| JP6137536B2 (en) | 2017-05-31 |
| TW201443449A (en) | 2014-11-16 |
| CN110794290A (en) | 2020-02-14 |
| TWI510794B (en) | 2015-12-01 |
| KR20160004263A (en) | 2016-01-12 |
| WO2014174852A1 (en) | 2014-10-30 |
| CN105164542A (en) | 2015-12-16 |
| KR102158640B1 (en) | 2020-09-22 |
| JP2014215239A (en) | 2014-11-17 |
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