CN109557376B - Resistance measuring device, substrate inspection device, and resistance measuring method - Google Patents
Resistance measuring device, substrate inspection device, and resistance measuring method Download PDFInfo
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- CN109557376B CN109557376B CN201811122773.1A CN201811122773A CN109557376B CN 109557376 B CN109557376 B CN 109557376B CN 201811122773 A CN201811122773 A CN 201811122773A CN 109557376 B CN109557376 B CN 109557376B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
- G01R31/2812—Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
- G01R27/08—Measuring resistance by measuring both voltage and current
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
- G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
Abstract
The invention provides a resistance measuring device, a substrate inspection device and a resistance measuring method. The resistance measuring device comprises a first current probe and a second current probe, and contacts with the chip side electrode; the first detection probe and the second detection probe are contacted with the outward electrode; a voltage detection unit for detecting a voltage between the first detection probe and the second detection probe; the positive electrode of the first constant current source is connected with the first current probe, the negative electrode of the first constant current source is connected with the ground, and the current of a first current value is output; the positive electrode of the second constant current source is connected with the negative electrode of the first constant current source and the ground and is connected with the first constant current source in series, the negative electrode of the second constant current source is connected with the second current probe, and the current of a second current value which is substantially the same as the first current value is output; a ground probe for conducting the wiring to the ground; and a resistance acquisition unit that acquires the resistance of the wiring based on the voltage detected by the voltage detection unit.
Description
Technical Field
The present invention relates to a resistance measuring device for measuring resistance, a substrate inspection device using the same, and a resistance measuring method.
Background
Previously, in order to inspect wiring patterns formed on a substrate such as a printed wiring board, the resistance value of the wiring patterns was measured. As a test of the wiring pattern, it is needless to say that whether or not the wiring is broken is also necessary to detect a defect that the wiring is not broken such as a reduction in width or thickness of the wiring pattern. In order to detect such a failure that the disconnection is not achieved, it is necessary to perform a high-precision resistance measurement. As such a high-precision resistance measurement method, a resistance measurement apparatus using a four-terminal measurement method is known.
For example, the resistance measuring apparatus described in Japanese patent application laid-open No. 2004-184374 includes: a pair of contact probes (P1, P2) for flowing a current for measuring resistance into a wiring pattern of a resistance measurement object, and a pair of contact probes (P3, P4) for measuring a voltage of a resistance measurement portion.
According to this configuration, since the current for measuring the resistance does not flow through the contact probes P3 and P4 for measuring the voltage, the voltage drop due to the resistances of the contact probes P3 and P4 themselves is reduced, and the resistance measurement can be performed with high accuracy. According to fig. 1 of japanese unexamined patent publication No. 2004-184374, a contact probe P1 on the positive electrode side for current output is connected to a constant current source, and a contact probe P2 on the negative electrode side is connected to a circuit ground (circuit ground).
However, in the resistance measuring apparatus described in japanese unexamined patent publication No. 2004-184374, a current for resistance measurement flows through a contact resistor between the contact probe P2 on the negative electrode side and the measurement object M, and a voltage is generated. The voltage becomes a common mode voltage (common mode voltage) with respect to the contact probes P3 and P4 for voltage measurement (common mode noise). Since the contact resistance Ro of the contact probe P2 can be about 100deg.OMEGA, when the current i for resistance measurement is set to 20mA, the common mode voltage Vc becomes Ro×i=100deg.OMEGA×20mA=2000 mV (see FIG. 7).
On the other hand, for example, when the object to be measured is a wiring pattern, the resistance Rx is about 1mΩ. Then, when the current i for resistance measurement is 20mA, the measurement voltage Vm measured by the contact probe P3 and the contact probe P4 becomes rx×i=1mΩ×20ma=20μv=0.02 mV (see fig. 7).
Thus, the measurement voltage becomes 20log (measurement voltage/common mode voltage) =20 log (0.02/2000) = -100dB with respect to the common mode voltage. The contact resistance generated by the contact of the contact probe P2 is unstable, and thus the common mode voltage also fluctuates unstably. Since the measurement voltage becomes a minute voltage of the order of-100 dB with respect to the common mode voltage, the measurement accuracy of the measurement voltage is deteriorated due to the influence of the fluctuation of the common mode voltage. As a result, there is a problem that the accuracy of the resistance measurement value obtained from the measured voltage is also lowered.
In addition, as a method of making the common mode voltage zero, the following method is conceivable: as described in japanese patent application laid-open No. 2007-333598, a common mode voltage is fed back to an inverting amplifier circuit of an operational amplifier, and the common mode voltage is eliminated by the output of the operational amplifier. Fig. 8 is an equivalent circuit diagram of the circuit shown in fig. 1 of japanese unexamined patent publication No. 2007-333598, in which Ro represents contact resistances of the current supply terminal 22, the current supply terminal 23, the voltage measurement terminal 24, and the voltage measurement terminal 25, and Co represents parasitic capacitance.
However, in this method, since a time delay of feedback due to Ro or parasitic capacitance Co, which are resistive components of the feedback circuit, and a response of the operational amplifier are slow, it is difficult to operate at high speed, and it is not easy to eliminate an unstable common mode voltage.
Disclosure of Invention
The invention aims to provide a resistance measuring device, a substrate inspection device and a resistance measuring method, wherein the resistance measuring precision by a four-terminal measuring method is easy to improve.
[ means of solving the problems ]
The resistance measuring device according to the present invention is a resistance measuring device for measuring a resistance of a conductor, comprising: a first current probe and a second current probe for contacting the conductor and flowing a predetermined measurement current; a first detection probe and a second detection probe for contacting the conductor and detecting a voltage generated in the conductor by the measurement current; a voltage detection unit configured to detect a voltage between the first detection probe and the second detection probe; the positive electrode of the first constant current source is connected with the first current probe, the negative electrode of the first constant current source is connected with the ground, and a preset current with a first current value is output; a second constant current source having an anode connected to a cathode of the first constant current source and the ground and connected in series with the first constant current source, the cathode connected to the second current probe, and outputting a current of a second current value substantially equal to the first current value; a grounding part for conducting a prescribed part of the conductor to the ground; and a resistor acquisition unit that acquires the resistor from the voltage detected by the voltage detection unit.
The resistance measurement method according to the present invention is a resistance measurement method for measuring a resistance of a conductor, and includes: (a) A step of bringing a first current probe into contact with the conductor with a first detection probe; (b) A step of bringing a second current probe into contact with a second detection probe at a position of the conductor separated from contact positions of the first current probe and the first detection probe; (c) A step of outputting a current of a first current value set in advance by a first constant current source having a positive electrode connected to the first current probe and a negative electrode connected to the ground, and outputting a current of a second current value substantially equal to the first current value by a second constant current source having a negative electrode connected to the second current probe and a positive electrode connected to the negative electrode of the first constant current source and the ground and connected in series to the first constant current source; (d) A step of conducting a predetermined portion of the conductor to the ground; (e) Detecting a voltage between the first detection probe and the second detection probe; and (f) obtaining the resistance from the voltage detected in the step (e).
According to these structures, resistance measurement can be performed by a four-terminal measurement method using the first current probe and the second current probe and the first detection probe and the second detection probe. The current flowing from the predetermined portion of the conductor that is in conduction with the ground to the ground becomes substantially zero as a result of the output currents of the first constant current source and the second constant current source that are connected in series and whose connection points are set to the ground potential, respectively, being to maintain the first current value and the second current value. As a result, the common mode voltage becomes substantially zero. Further, since the resistance can be obtained from the measured voltage measured in a state where the common mode voltage is substantially zero, the accuracy of measuring the resistance can be easily improved. Therefore, the accuracy of resistance measurement by the four-terminal measurement method can be easily improved.
Preferably, the ground part includes a ground probe for contacting the predetermined portion, and the ground probe is connected to the ground.
Preferably, the step (d) is a step of bringing a ground probe connected to the ground into contact with the predetermined portion.
According to these configurations, the conductor can be brought into conduction with the ground by bringing the ground probe into contact with a predetermined portion of the conductor.
The ground may be a wire connecting the second detection probe to the ground.
The second detection probe may be connected to the ground, and the step (b) may be performed concurrently with the step (d).
According to these configurations, the second detection probe can be used as a ground probe, and thus, there is no need to provide a separate ground probe to be in contact with the conductor.
Preferably, a first electrode is provided at one end portion of the conductor, a second electrode having a larger area than the first electrode is provided at the other end portion of the conductor, the step (a) is a step of bringing the first current probe into contact with the first detection probe, the step (b) is a step of bringing the second current probe into contact with the second detection probe, the step (d) is a step of bringing the second electrode into contact with the second electrode at the predetermined position, and the ground probe is in contact with the second electrode.
According to this method, two probes are brought into contact with a first electrode having a small area, and three probes are brought into contact with a second electrode having a large area. Therefore, each probe is easily brought into contact with the first electrode and the second electrode.
The substrate inspection apparatus of the present invention includes: the resistance measuring device; and a substrate inspection unit for inspecting wiring as the conductor formed on the substrate based on the resistance measured by the resistance measuring device.
With this configuration, the wiring formed on the substrate can be inspected based on the resistance measured by the resistance measuring device.
The resistance measuring device, the substrate inspection device, and the resistance measuring method having such a structure can easily improve the accuracy of resistance measurement by the four-terminal measurement method.
Drawings
Fig. 1 is a block diagram showing an example of a structure of a substrate inspection apparatus using a resistance measuring apparatus according to a first embodiment of the present invention.
Fig. 2 is an explanatory diagram showing an equivalent circuit of the substrate inspection apparatus and the substrate shown in fig. 1.
Fig. 3 is a flowchart showing an example of a resistance measurement method according to an embodiment of the present invention.
Fig. 4 is an explanatory diagram showing connection of the substrate inspection apparatus when inspecting an integrated circuit (Integrated Circuit, IC).
Fig. 5 is a block diagram showing an example of the structure of a substrate inspection apparatus using a resistance measuring apparatus according to a second embodiment of the present invention.
Fig. 6 is an explanatory diagram showing an equivalent circuit of the substrate inspection apparatus and the substrate shown in fig. 5.
Fig. 7 is an explanatory diagram for explaining a common mode voltage of the background art.
Fig. 8 is an equivalent circuit diagram of the circuit described in fig. 1 of japanese unexamined patent publication No. 2007-333598.
[ description of symbols ]
1. 1a: substrate inspection device (resistance measuring device)
4: voltage detecting unit
5: control unit
6: scanner
22. 23: current supply terminal
24. 25: voltage measuring terminal
51: resistance acquisition unit
52: substrate inspection part
61. 62, 63, 64, 65: switch
100：IC
A: substrate board
A1: chip side electrode (first electrode)
A2: outward electrode (second electrode)
A3: wiring (conductor)
Co: parasitic capacitance
Cp: capacitor with a capacitor body
CS1: constant current source (first constant current source)
CS2: constant current source (second constant current source)
D: diode
GND: ground/grounding terminal
I: measuring current
I 1 : first current value
I 2 : second current value
Is、I 3 : current value
P1 to Pn: signal terminal
Pc1, pc2, pv1, pv2, PG: probe with a probe tip
Rc1, rc2, rv1, rv2, RG: resistor
Rc 2 、Rv 2 Rx: resistance value
Rref: reference value
Ro: contact resistance
Vc: common mode voltage
Vm, vs: measuring voltage
Vcc: power supply terminal
S1-S9: step (a)
Detailed Description
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(first embodiment)
Fig. 1 is a block diagram showing an example of a structure of a substrate inspection apparatus 1 using a resistance measuring apparatus according to a first embodiment of the present invention. In the drawings, the same reference numerals denote the same structures, and a description thereof will be omitted.
The substrate inspection apparatus 1 (resistance measurement apparatus) shown in fig. 1 includes: a constant current source CS1 (first constant current source), a constant current source CS2 (second constant current source), a voltage detection section 4, a current probe Pc1 (first current probe), a current probe Pc2 (second current probe), a detection probe Pv1 (first detection probe), a detection probe Pv2 (second detection probe), a ground probe PG (ground section), a scanner 6, and a control section 5.
Fig. 1 shows a state in which each probe of the substrate inspection apparatus 1 has been brought into contact with a substrate a to be inspected. The substrate inspection apparatus 1 performs resistance measurement by a so-called four terminal measurement method. The portion from which the substrate inspection section 52 described later is removed from the substrate inspection apparatus 1 corresponds to an example of a resistance measuring apparatus.
The substrate to be inspected may be, for example, a package substrate for semiconductor packaging, a interposer substrate (interposer substrate), a film carrier (film carrier), a printed wiring board, a glass epoxy substrate, a flexible substrate, a ceramic multilayer wiring board, or the like, an electrode plate for a display such as a liquid crystal display, an Electroluminescence (EL) display, or a transparent conductive plate for a touch panel, or various substrates such as a semiconductor substrate such as a semiconductor wafer, a semiconductor chip, or a chip size package (Chip Size Package, CSP).
The substrate to be inspected may be a component-embedded substrate (embedded substrate)) in which electronic components such as semiconductor chips are embedded. The inspection object is not limited to the substrate, and may be an electronic component such as a semiconductor chip. Inspection points such as wiring patterns, pads, lands, solder bumps, and terminals are formed on a substrate or electronic component to be inspected.
Fig. 1 is a cross-sectional view of an interposer substrate for semiconductor package of a substrate a to be inspected. A plurality of chip-side electrodes A1 (first electrodes) connected to the semiconductor chip are formed on one surface of the substrate a. The intervals between the plurality of chip-side electrodes A1 are set to be narrow in comparison with the fine electrode intervals of the semiconductor chip, and the size of the chip-side electrodes A1 is also set to be small. A plurality of outward electrodes A2 (second electrodes) for connecting the semiconductor chip to the outside are formed on the other surface of the substrate a.
The plurality of outward electrodes A2 are arranged in a grid pattern, for example, and are connected to the outside via solder balls. In order to facilitate wiring to the outside, the interval between the plurality of outward electrodes A2 is made wider than the interval between the chip-side electrodes A1, and the size of the outward electrode A2 is made larger than the chip-side electrode A1.
The chip-side electrode A1 and the external electrode A2 are connected to each other by a wiring A3 (conductor) formed so as to penetrate the thickness direction of the substrate a. The substrate inspection device 1 measures and inspects the resistance Rx of each wiring A3. The wiring A3 corresponds to one example of a conductor, the chip-side electrode A1 corresponds to one end of the wiring A3, and the outward electrode A2 corresponds to the other end of the wiring A3.
The current probe Pc1, the current probe Pc2, the detection probe Pv1, the detection probe Pv2, and the ground probe PG are configured as, for example, a detachable inspection jig with respect to the substrate inspection apparatus 1. Hereinafter, the current probe Pc1, the current probe Pc2, the detection probe Pv1, the detection probe Pv2, and the ground probe PG may be referred to as only the probe Pc1, the probe Pc2, the probe Pv1, the probe Pv2, and the probe PG.
The probes Pc1, pc2, pv1, pv2, and PG are, for example, elastic (flexible) wire-shaped contactors having diameters of about 100 μm to 200 μm. The current probe Pc1, the current probe Pc2, the detection probe Pv1, and the detection probe Pv2 are made of a metal such as tungsten, high-speed Steel (SKH), or beryllium copper (Be-Cu), or other electrical conductor.
The tip of the current probe Pc1 and the detection probe Pv1 contact the chip-side electrode A1 of the substrate a. The tips of the current probe Pc2, the detection probe Pv2, and the ground probe PG contact the outward electrode A2 at a position spaced apart from the chip-side electrode A1. When the probes are brought into contact with the chip-side electrode A1 and the outward electrode A2 in this manner, two probes are brought into contact with the chip-side electrode A1 having a small and narrow pitch, and three probes are brought into contact with the outward electrode A2 having a larger and wide pitch than the chip-side electrode A1. Therefore, each probe is easily brought into contact with the chip-side electrode A1 and the outward electrode A2.
In fig. 1, although one probe Pc1, one probe Pc2, one probe Pv1, one probe Pv2, and one probe PG are shown for each of the two probes, there are cases where several hundred to several thousand inspection points are set for one substrate, and there are cases where several hundred to several thousand probes Pc1, pc2, one probe Pv1, one probe Pv2, and one probe PG are set for a large number of inspection points.
The scanner 6 is a switching circuit for switching the connection relationship between the current probe Pc1 and the current probe Pc2 and the constant current source CS1 and the constant current source CS2, the connection relationship between the detection probe Pv1 and the detection probe Pv2 and the voltage detection unit 4, and the connection relationship between the ground probe PG and the ground. The scanner 6 includes, for example, a plurality of switches including a switch 61, a switch 62, a switch 63, a switch 64, and a switch 65. The switches 61, 62, 63, 64, 65 are, for example, semiconductor switches such as transistors or various switching elements such as relay switches. The switches are turned on and off in response to a control signal from the control unit 5, for example.
The constant current sources CS1 and CS2 are constant current circuits that flow a constant current, and a constant current for measurement flows through the wiring A3. As the constant current source CS1 and the constant current source CS2, various circuits known as constant current circuits such as a transistor, a zener diode, a current mirror circuit, and the like can be used, or a switching power supply circuit and the like can be used.
The positive electrode (+) of the constant current source CS1 is connected to the current probe Pc1 via the switch 61, and the negative electrode (-) is connected to the ground GND. The constant current source CS1 outputs a first current value I set in advance from its positive electrode (+) toward the current probe Pc1 1 Is set in the above-described range). Will first current value I 1 For example, the temperature is set to about 20 mA.
The positive electrode (+) of the constant current source CS2 is connected to the negative electrode (-) of the constant current source CS1 and the ground GND, and is connected in series with the constant current source CS1, and the negative electrode (-) thereof is connected to the current probe Pc2 via the switch 62. The constant current source CS2 outputs a first current value I from its positive electrode (+) toward the constant current source CS1 1 Substantially the same second current value I 2 Is set in the above-described range). The substantially identical means that the same meaning is used even if there is a difference in the degree of the difference due to manufacturing variations of the constant current sources CS1 and CS2, current control accuracy, and the like.
Ground GND is the circuit ground of substrate inspection device 1. The ground GND may be a frame ground (ground) of the substrate inspection apparatus 1, but is more preferably a circuit ground.
When the switches 61, 62, 63, 64, 65 are turned on by the control unit 5, a current loop (current loop) is formed in which the measurement current I is returned from the ground GND to the ground GND through the constant current source CS1, the switch 61, the current probe Pc1, the chip-side electrode A1, the wiring A3, the outward electrode A2, the current probe Pc2, the switch 62, and the constant current source CS 2.
The voltage detection unit 4 measures the voltage between the detection probes Pv1 and Pv 2. The voltage detection unit 4 is configured using, for example, an analog-digital converter, a voltage dividing resistor, or the like. The positive electrode (+) terminal of the voltage detection unit 4 is connected to the detection probe Pv1 via a switch 63, and the negative electrode (-) terminal of the voltage detection unit 4 is connected to the detection probe Pv2 via a switch 64. Thus, the voltage detection unit 4 measures the voltage between the detection probes Pv1 and Pv2 selected by the scanner 6 as the measurement voltage Vs, and outputs data indicating the measurement voltage Vs to the control unit 5.
The control unit 5 is, for example, a so-called microcomputer including a central processing unit (Central Processing Unit, CPU) that executes predetermined arithmetic processing, a random access memory (Random Access Memory, RAM) that temporarily stores data, a nonvolatile memory device that stores a predetermined control program or the like, and peripheral circuits thereof. The control unit 5 functions as a resistance acquisition unit 51 and a substrate inspection unit 52 by executing a predetermined control program.
The resistance acquisition unit 51 calculates the resistance value Rx of the wiring A3 to be measured based on the measurement voltage Vs detected by the voltage detection unit 4. Specifically, according to the current value is=the first current value I of the current I for measurement 1 And a second current value I 2 And a measured voltage Vs, and the resistance Rx is calculated using the following equation (1).
Resistance Rx=Vs/Is (1)
The substrate inspection device 1 (resistance measurement device) includes a current measurement unit that measures a current value Is of a current actually flowing through the wiring A3, and the resistance acquisition unit 51 may calculate the resistance value Rx using the current value Is measured by the current measurement unit and the measured voltage Vs. If the current value Is a fixed value, the resistance value Rx Is proportional to the measured voltage Vs. Therefore, the resistance obtaining unit 51 may obtain the measured voltage Vs directly as information indicating the resistance value Rx without calculating the resistance value Rx using the expression (1).
The substrate inspection unit 52 inspects the wiring A3 as a conductor based on the resistance value Rx acquired by the resistance acquisition unit 51. Specifically, the substrate inspection unit 52 compares the reference value Rref stored in advance in the storage unit with the resistance value Rx, determines that the wiring A3 is good when the resistance value Rx is smaller than the reference value Rref, and determines that the wiring A3 is bad when the resistance value Rx is equal to or greater than the reference value Rref.
Fig. 2 is an explanatory diagram showing an equivalent circuit between the substrate inspection apparatus 1 and the substrate a in a state where the switches 61, 62, 63, 64, 65 are turned on. In fig. 2, the resistance Rc1 represents the contact resistance between the current probe Pc1 and the chip-side electrode A1, the resistance of the switch 61, etc., the resistance Rc2 represents the contact resistance between the current probe Pc2 and the outward electrode A2, the resistance of the switch 62, etc., the resistance Rv1 represents the contact resistance between the detection probe Pv1 and the chip-side electrode A1, the resistance of the switch 63, etc., the resistance Rv2 represents the contact resistance between the detection probe Pv2 and the outward electrode A2, the resistance of the switch 64, etc., and the resistance RG represents the contact resistance between the ground probe PG and the outward electrode A2, the resistance of the switch 65, etc. In addition, the parasitic capacitance generated in the equivalent circuit shown in fig. 2 is represented by a capacitor Cp.
The operation of the substrate inspection apparatus 1 will be described below based on the equivalent circuit shown in fig. 2. First, the constant current source CS1 outputs a first current value I 1 The constant current source CS2 outputs a second current value I 2 As a result of the current of (a), a current I for measuring the current value Is flows through the wiring A3. At this time, the voltage detection unit 4 measures the voltage of the normal mode (normal mode) generated in the wiring A3 as the measurement voltage Vs via the detection probes Pv1 and Pv2 different from the current probes Pc1 and Pc2 flowing the measurement current I, and the voltage detection unit 4 sends the measurement voltage Vs to the resistance acquisition unit 51.
In this case, since the current does not flow through the resistors Rv1 and Rv2, the resistor obtaining unit 51 obtains the resistance value Rx from the measurement voltage Vs at which the resistors Rv1 and Rv2 have been excluded, and thus, it is possible to perform a high-precision resistance measurement compared with a so-called two-terminal measurement method.
Then, the common mode voltage will be explained. Since the constant current source CS2 and the resistor Rc2 are connected in series, the second current value I 2 Is first to flow in the resistor Rc 2. If the resistance Rc2 is the resistanceThe value is set as a resistance Rc 2 Rc is generated in the resistor Rc2 2 ×I 2 Is set in the above-described voltage range. The constant current circuit generally has a high internal resistance, and the negative electrode (-) of the constant current power supply CS2 is not in agreement with the ground potential, so that the voltage generated in the resistor Rc2 is not directly applied to the resistor RG. However, at least a part of the voltage generated in the resistor Rc2 is applied to the resistor RG, the current value I 3 Will flow in the resistor RG.
Here, at the first current value I 1 Second current value I 2 Current value I 3 There is a relationship represented by the following formulas (2) and (3).
I 1 ＝I 2 +I 3 ···(2)
I 1 ≒I 2 ···(3)
Here, since the constant current source CS1 is a constant current source, the first current value I 1 At a fixed value due to the first current value I 1 And a second current value I 2 Therefore, if the current value I 3 The current supplied to the negative electrode (-) of the constant current source CS2 is divided from the measurement current I to the resistor RG, and is relative to the second current value I 2 In short, the constant current source CS2 cannot flow out the second current value I 2 Is set in the above-described range).
Here, the constant current source CS2 is also a constant current source, and therefore, the second current value I is forcibly flown out 2 . At this time, since the positive electrode (+) of the constant current source CS2 is connected to the ground, the second current value I is forcibly discharged through the constant current source CS2 2 The potential of the negative electrode (-) of the constant current source CS2 decreases until the second current value I is supplied to the negative electrode (-) of the constant current source CS2 2 To the current of (a). The second current value I is supplied to the negative electrode (-) of the constant current source CS2 2 (. About.first current value I) 1 ) The current state of (2) means that the current value I is changed according to the formula 3 0.
Current value I flowing in resistor RG 3 And (0) means that the potentials of both ends of the resistor RG become substantially equal. Due to one end of the resistor RG being connected to groundThe other end of the resistor RG, i.e., the potential of the outward electrode A2 shown in fig. 2, becomes approximately the ground potential. Since the detection probe Pv2 is contacting the outward electrode A2, the potential of the outward electrode A2 becomes substantially the ground potential, that is, the common mode voltage applied to the voltage detection unit 4 becomes substantially zero.
As described above, the constant current source CS1 and the constant current source CS2, which are connected in series and have their connection points set to the ground potential, are respectively intended to maintain the first current value I 1 Second current value I 2 As a result of the output currents of (a), the operation is performed at a time immediately after the response time of the constant current sources CS1 and CS2, and the common mode voltage becomes substantially zero.
As described above, in the related art, the measurement accuracy of the measurement voltage is degraded by the fluctuation of the common mode voltage. In contrast, since the substrate inspection apparatus 1 can set the common mode voltage to substantially zero, the measurement accuracy of the resistance value Rx to be measured can be improved as compared with the related art. Therefore, the accuracy of resistance measurement by the four-terminal measurement method can be easily improved.
Fig. 3 is a flowchart showing an example of a resistance measurement method according to an embodiment of the present invention. First, the resistance acquisition unit 51 moves the current probe Pc1 and the detection probe Pv1 by a driving mechanism not shown in the drawings, and contacts the chip-side electrode A1 (step S1: step (a)). Then, the resistance acquisition unit 51 moves the current probe Pc2, the detection probe Pv2, and the ground probe PG by a driving mechanism not shown in the drawings, and contacts the outward electrode A2 (step S2: step (b), step (d)).
Then, the resistance obtaining unit 51 turns on the switches 61, 62, 63, 64, 65 (step S3). Step S2 and step S3 correspond to an example of the step (d). Then, the resistance obtaining unit 51 outputs a first current value I by the constant current source CS1 1 Current of (=is), a second current value I Is output by the constant current source CS2 2 (≒I 1 ) Is a current of (step S4: step (c)).
Then, the voltage detection unit 4 measures the voltage between the detection probes Pv1 and Pv2 as the measurement voltage Vs (step S5: step (e)). Then, the resistance obtaining unit 51 calculates the resistance value Rx of the measurement object according to the expression (1) (step S6), and displays the resistance value Rx by a display device, for example, which is omitted from the drawings.
As described above, by the processing in steps S1 to S6, the resistance value Rx can be calculated from the measured voltage Vs measured in a state where the common mode voltage is substantially zero, and therefore, the accuracy of calculating the resistance value Rx can be easily improved. Therefore, the accuracy of resistance measurement by the four-terminal measurement method can be easily improved.
Then, the substrate inspection unit 52 compares the resistance Rx with the reference value Rref (step S7). If the resistance value Rx is smaller than the reference value Rref (YES in step S7), the substrate inspection unit 52 determines that the wiring A3 is good (step S8). On the other hand, if the resistance value Rx is equal to or greater than the reference value Rref (NO in step S7), the substrate inspection unit 52 determines that the wiring A3 is defective (step S9), and the determination results are displayed on a display device, for example, the drawing is omitted, to terminate the process.
The same processing as in steps S1 to S9 is repeated for the other wirings A3, whereby the resistance values Rx of all the wirings A3 to be measured in the substrate a can be measured, and whether or not the substrate a is good can be checked.
Since the common mode voltage is Noise, making the common mode voltage substantially zero corresponds to raising the Signal/Noise (S/N) ratio of the measurement voltage Vs. Therefore, according to the substrate inspection apparatus 1 and the resistance measurement method, the S/N ratio can be improved and the measurement accuracy of the resistance value Rx according to the measurement voltage Vs can be improved.
As a method of increasing the S/N ratio of the measurement voltage Vs, it is conceivable to increase the current value of the measurement current to increase the measurement voltage as the signal component. However, when the current value of the measurement current is increased in the circuit described in fig. 1 of japanese unexamined patent publication No. 2004-184374, the voltage generated in the contact resistance between the negative electrode-side contact probe P2 and the measurement object M increases, and as a result, the common mode voltage increases. Therefore, it is not easy to raise the S/N ratio in the circuit described in FIG. 1 of Japanese patent application laid-open No. 2004-184374.
On the other hand, according to the substrate inspection apparatus 1, by making the common mode voltage substantially zero, the S/N ratio of the measurement voltage Vs can be increased, and therefore, it is easy to increase the S/N ratio and to increase the measurement accuracy of the resistance value Rx.
In the circuit described in fig. 1 of japanese unexamined patent publication No. 2004-184374, when a measurement target such as a component-embedded substrate or an electronic component is measured for resistance, if a common mode voltage is generated during measurement, a potential difference may occur between the measurement target and a substrate inspection apparatus due to a relationship with a charge of a parasitic capacitance of the measurement target with respect to the electronic component such as a semiconductor element incorporated in the component-embedded substrate. In this case, there is a concern that voltage stress or current stress is applied to the electronic component due to the potential difference, and the electronic component is damaged.
Fig. 4 is an explanatory diagram showing connection of the substrate inspection apparatus 1 when the substrate inspection apparatus is inspected with respect to IC (Integrated Circuit) including the signal terminals P1 to Pn, the power supply terminal Vcc, and the ground terminal GND. As described above, in the resistance measurement using the two-terminal method or the four-terminal method before using the two constant current sources (CS 1 and CS 2) and the ground probe PG, the common mode voltage is applied to the terminals of the IC that are in contact with the current probe Pc1 and the current probe Pc2 or the detection probe Pv1 and the detection probe Pv 2. In the IC 100, there is a parasitic capacitance Co generated by the IC 100 itself or external wiring, and thus a common mode voltage applied to terminals of the IC is wound into the parasitic capacitance Co, and stress is applied to the IC 100, or breakage is generated.
In this case, it is conceivable to gradually increase the common mode voltage by gradually increasing the measurement current, thereby gradually charging the parasitic capacitance with the common mode voltage, thereby reducing the current value flowing into the parasitic capacitance, and removing the potential difference between the measurement object and the substrate inspection apparatus. Thus, it is considered that damage to the electronic component can be prevented. However, in the method of gradually charging the parasitic capacitance by gradually increasing the measurement current, it is necessary to wait for the voltage measurement before the parasitic capacitance of the measurement target is charged by the common mode voltage and the potential difference disappears, and the time required for the measurement increases.
However, according to the substrate inspection apparatus 1, since the common mode voltage becomes substantially zero, it is not necessary to wait for voltage measurement before the parasitic capacitance of the measurement target is charged by the common mode voltage and the potential difference disappears. As a result, the resistance measurement time and the inspection time can be easily shortened.
In addition, as a method of making the common mode voltage zero, the following method is conceivable: as described in japanese patent application laid-open No. 2007-333598, a common mode voltage is fed back to an inverting amplifier circuit of an operational amplifier, and the common mode voltage is eliminated by the output of the operational amplifier. However, in this method, since a time delay of feedback due to a resistive component or parasitic capacitance of the feedback circuit, a response of the operational amplifier, or the like is generated, it is not easy to eliminate an unstable common mode voltage.
On the other hand, according to the substrate inspection apparatus 1, the constant current source CS1 and the constant current source CS2, which are connected in series and whose connection points are set to the ground potential, are respectively intended to maintain the first current value I 1 Second current value I 2 As a result of the output current of (a), the common mode voltage becomes substantially zero, and thus the common mode voltage is easily reduced.
The substrate inspection device 1 may be a resistance measurement device that does not include the substrate inspection unit 52, or may not perform steps S7 to S9. The scanner 6 may not be provided. The ground probe PG is not necessarily limited to an example of contacting one end of the external electrode A2, i.e., the negative electrode side of the wiring A3 (conductor). The ground probe PG preferably contacts one end of the wiring A3 on the negative electrode side, but may contact the chip-side electrode A1 as one end of the wiring A3 on the positive electrode side, or may contact the intermediate portion of the wiring A3.
The current probes Pc1, pc2 and the detection probes Pv1, pv2 are not necessarily limited to examples of both ends of the wiring A3 (conductor) contacting the measurement object. Even when the current probe Pc1, the current probe Pc2, the detection probes Pv1, pv2 contact the middle portion of the measurement object, the resistance value between the contact portion of the current probe Pc1 and the detection probe Pv1 and the contact portion of the current probe Pc2 and the detection probe Pv2 can be measured.
(second embodiment)
Next, a substrate inspection apparatus 1a using a resistance measuring apparatus according to a second embodiment of the present invention will be described. Fig. 5 is a block diagram showing an example of the structure of a substrate inspection apparatus 1a using a resistance measuring apparatus according to a second embodiment of the present invention. Fig. 6 is an explanatory diagram showing an equivalent circuit of the substrate inspection apparatus 1a and the substrate a shown in fig. 5. The substrate inspection apparatus 1a shown in fig. 5, 6 is different from the substrate inspection apparatus 1 shown in fig. 1 in the following aspects.
That is, the substrate inspection apparatus 1a shown in fig. 5 and 6 is different from the substrate inspection apparatus 1 in that the ground probe PG and the switch 65 are not provided, but the negative (-) terminal of the voltage detection unit 4 is connected to the ground. In this case, the wiring connecting the negative electrode (-) terminal of the voltage detection unit 4 to the ground corresponds to an example of the ground. In step S2, the ground probe PG is not brought into contact with the outward electrode A2, and in step S3, the switch 65 is not turned on.
Other structures are the same as those of the substrate inspection apparatus 1 shown in fig. 1, and therefore, the description thereof will be omitted. By the substrate inspection apparatus 1a, as in the case of the substrate inspection apparatus 1, the constant current source CS1 and the constant current source CS2, which are connected in series and whose connection points are set to the ground potential, are respectively intended to maintain the first current value I 1 Second current value I 2 Is provided. As a result, the current value I flowing through the resistor Rv2 3 The common mode voltage becomes substantially zero, and thus the common mode voltage is easily reduced.
In addition, according to the substrate inspection apparatus 1a, since the ground probe PG does not need to be provided separately, the cost is easily reduced as compared with the substrate inspection apparatus 1. Further, since the number of probes for the contact wiring A3 may be two, it is easy to contact probes as compared with the substrate inspection apparatus 1 in which three probes must be brought into contact with the wiring A3.
However, although the first current value I of the constant current source CS1 and the constant current source CS2 1 And a second current value I 2 Substantially identical (I) 1 ≒I 2 ) But there is a constant causeThe constant current sources CS1 and CS2 may be slightly inferior in terms of manufacturing variations and current control accuracy. When at the first current value I 1 And a second current value I 2 When a difference is generated between them, a current value I corresponding to the difference 3 The current of (2) flows in the resistor Rv2 shown in fig. 6. In this case, if the resistance value of the resistor Rv2 is set to the resistance value Rv 2 Then Rv is generated in the resistor Rv2 2 ×I 3 Is set in the above-described voltage range. This voltage is included in the measurement voltage Vs measured by the voltage detecting unit 4, and thus a measurement error of the measurement voltage Vs occurs.
On the other hand, in the substrate inspection apparatus 1 shown in fig. 2, when at the first current value I 1 And a second current value I 2 When a difference is generated between them, a current value I corresponding to the difference 3 Is flowing in the resistor RG. In the substrate inspection apparatus 1, the voltage generated by the current flowing through the resistor RG is not included in the measurement voltage Vs. Therefore, when the first current value I is difficult to generate 1 And a second current value I 2 The substrate inspection apparatus 1 is more preferable than the substrate inspection apparatus 1a in terms of measurement accuracy errors due to differences therebetween.
Claims (6)
1. A resistance measuring apparatus for measuring a resistance of a conductor, the resistance measuring apparatus comprising:
a first current probe and a second current probe for contacting the conductor and flowing a predetermined measurement current;
a first detection probe and a second detection probe for contacting the conductor and detecting a voltage generated in the conductor by the measurement current;
a voltage detection unit configured to detect a voltage between the first detection probe and the second detection probe;
the positive electrode of the first constant current source is connected with the first current probe, the negative electrode of the first constant current source is connected with the ground, and a preset current with a first current value is output;
a second constant current source having an anode connected to a cathode of the first constant current source and the ground and connected in series with the first constant current source, the cathode of the second constant current source being connected to the second current probe, and outputting a current of a second current value substantially identical to the first current value;
a ground part for conducting a predetermined portion of the conductor to the ground, the ground part including a ground probe for contacting the predetermined portion,
the ground probe is connected with the ground; and
and a resistor acquisition unit that acquires the resistor from the voltage detected by the voltage detection unit.
2. A resistance measuring apparatus for measuring a resistance of a conductor, the resistance measuring apparatus comprising:
a first current probe and a second current probe for contacting the conductor and flowing a predetermined measurement current;
a first detection probe and a second detection probe for contacting the conductor and detecting a voltage generated in the conductor by the measurement current;
a voltage detection unit configured to detect a voltage between the first detection probe and the second detection probe;
the positive electrode of the first constant current source is connected with the first current probe, the negative electrode of the first constant current source is connected with the ground, and a preset current with a first current value is output;
a second constant current source having an anode connected to a cathode of the first constant current source and the ground and connected in series with the first constant current source, the cathode of the second constant current source being connected to the second current probe, and outputting a current of a second current value substantially identical to the first current value;
a ground part for conducting a predetermined portion of the conductor to the ground, the ground part being a wiring for connecting the second detection probe to the ground; and
and a resistor acquisition unit that acquires the resistor from the voltage detected by the voltage detection unit.
3. A substrate inspection apparatus, characterized by comprising:
the resistance measuring device according to claim 1 or 2; and
and a substrate inspection unit for inspecting wiring as the conductor formed on the substrate based on the resistance measured by the resistance measuring device.
4. A resistance measurement method for measuring a resistance of a conductor, the resistance measurement method comprising:
(a) A step of bringing a first current probe into contact with the conductor with a first detection probe;
(b) A step of bringing a second current probe into contact with a second detection probe at a position of the conductor separated from contact positions of the first current probe and the first detection probe;
(c) A step of outputting a current of a first current value set in advance by a first constant current source having a positive electrode connected to the first current probe and a negative electrode connected to the ground, and outputting a current of a second current value substantially equal to the first current value by a second constant current source having a negative electrode connected to the second current probe and a positive electrode connected to the negative electrode of the first constant current source and the ground and connected in series to the first constant current source;
(d) A step of conducting a predetermined portion of the conductor to the ground, wherein the step (d) is a step of bringing a ground probe connected to the ground into contact with the predetermined portion;
(e) Detecting a voltage between the first detection probe and the second detection probe; and
(f) And (e) obtaining the resistance from the voltage detected in the step (e).
5. The method for measuring resistance according to claim 4, wherein,
a first electrode is provided at one end of the conductor, a second electrode having a larger area than the first electrode is provided at the other end of the conductor,
the step (a) is a step of bringing the first current probe and the first detection probe into contact with the first electrode,
the step (b) is a step of bringing the second current probe into contact with the second electrode,
the step (d) is a step of bringing the ground probe into contact with the second electrode as the predetermined portion.
6. A resistance measurement method for measuring a resistance of a conductor, the resistance measurement method comprising:
(a) A step of bringing a first current probe into contact with the conductor with a first detection probe;
(b) A step of bringing a second current probe into contact with a second detection probe at a position of the conductor separated from contact positions of the first current probe and the first detection probe;
(c) A step of outputting a current of a first current value set in advance by a first constant current source having a positive electrode connected to the first current probe and a negative electrode connected to the ground, and outputting a current of a second current value substantially equal to the first current value by a second constant current source having a negative electrode connected to the second current probe and a positive electrode connected to the negative electrode of the first constant current source and the ground and connected in series to the first constant current source;
(d) A step of conducting a predetermined portion of the conductor to the ground, wherein the second detection probe is connected to the ground, and
the step (b) also serves as the step (d);
(e) Detecting a voltage between the first detection probe and the second detection probe; and
(f) And (e) obtaining the resistance from the voltage detected in the step (e).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-186641 | 2017-09-27 | ||
| JP2017186641A JP6765125B2 (en) | 2017-09-27 | 2017-09-27 | Resistance measuring device, substrate inspection device, and resistance measuring method |
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| Publication Number | Publication Date |
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| CN109557376A CN109557376A (en) | 2019-04-02 |
| CN109557376B true CN109557376B (en) | 2023-05-16 |
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| JP (1) | JP6765125B2 (en) |
| KR (1) | KR20190036472A (en) |
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| DE102017211476A1 (en) * | 2017-07-05 | 2019-01-10 | Robert Bosch Gmbh | Apparatus and method for checking a functionality of a system resistance of a battery system |
| TWI716106B (en) * | 2019-09-16 | 2021-01-11 | 力成科技股份有限公司 | Resistance measuring method of package substrate and package substrate thereof |
| US11346883B2 (en) * | 2019-11-05 | 2022-05-31 | Formfactor, Inc. | Probe systems and methods for testing a device under test |
| TWI824686B (en) * | 2022-08-31 | 2023-12-01 | 牧德科技股份有限公司 | Detection circuit |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103956982A (en) * | 2014-05-05 | 2014-07-30 | 华侨大学 | Common-mode feedback circuit for duration of two-stage differential amplifier |
| CN107104673A (en) * | 2017-04-01 | 2017-08-29 | 唯捷创芯(天津)电子技术股份有限公司 | A kind of low gain error current rudder-type digital-to-analog converter, chip and communication terminal |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3638697B2 (en) * | 1996-01-22 | 2005-04-13 | 株式会社アドバンテスト | Driver IC output resistance measuring instrument |
| GB2341246A (en) * | 1998-09-03 | 2000-03-08 | Ericsson Telefon Ab L M | Differential level shifting circuit |
| JP4208560B2 (en) | 2002-12-06 | 2009-01-14 | 日置電機株式会社 | Impedance measuring device |
| TW200638812A (en) * | 2004-11-18 | 2006-11-01 | Matsushita Electric Ind Co Ltd | Wiring board, method for manufacturing same and semiconductor device |
| JP4798618B2 (en) * | 2006-05-31 | 2011-10-19 | ルネサスエレクトロニクス株式会社 | Output circuit and semiconductor integrated circuit device |
| JP2007333598A (en) | 2006-06-15 | 2007-12-27 | Nidec-Read Corp | Substrate inspecting means |
| CN101047383B (en) * | 2007-03-20 | 2011-05-04 | 湖南大学 | Current controlled full-balance differential current transmitter |
| SK288245B6 (en) * | 2010-09-03 | 2015-03-03 | Ivan Baĺ¤Ko | Power supply with active suppression of voltage |
| JP6545598B2 (en) * | 2015-10-15 | 2019-07-17 | 日置電機株式会社 | Resistance measuring device and inspection device |
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- 2018-09-10 KR KR1020180107833A patent/KR20190036472A/en not_active Application Discontinuation
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103956982A (en) * | 2014-05-05 | 2014-07-30 | 华侨大学 | Common-mode feedback circuit for duration of two-stage differential amplifier |
| CN107104673A (en) * | 2017-04-01 | 2017-08-29 | 唯捷创芯(天津)电子技术股份有限公司 | A kind of low gain error current rudder-type digital-to-analog converter, chip and communication terminal |
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| KR20190036472A (en) | 2019-04-04 |
| CN109557376A (en) | 2019-04-02 |
| TWI793179B (en) | 2023-02-21 |
| TW201915500A (en) | 2019-04-16 |
| JP6765125B2 (en) | 2020-10-07 |
| JP2019060768A (en) | 2019-04-18 |
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