TWI824686B - Detection circuit - Google Patents

Abstract

The present invention discloses a detection circuit, which is applied for detecting a circuit device under test. The detection circuit according to the present invention provides a test power source by a source measurement unit, in the meanwhile, turned on between a probe module and the source measurement unit is performed by a switch module. And, a loop is formed by the circuit device under test, the probe module and the source measurement unit. Hereby, the test source is supplied to the circuit device under test by the test probe module, and a corresponded test voltage is generated. Thus, the quantitative characteristic of the detection circuit may be detected.

Description

Detection circuit

The present invention relates to a test circuit, in particular to a detection circuit, which is used to detect the electrical properties of circuit components to be tested.

The manufacturing of integrated circuits (IC) or wafers (Chip) will first go through the upstream IC design company to propose a corresponding circuit design plan. The midstream semiconductor foundry will provide the corresponding semiconductor process based on the IC design company's circuit design plan. OEM manufacturing is followed by downstream packaging and testing factories to conduct circuit testing on the integrated circuit (IC) or chip (Chip) produced by the semiconductor foundry. Therefore, circuit testing is very important for integrated circuits. The manufacturing process of IC) or wafer (Chip) is one of the indispensable stages. Whether it is traditional packaging type or wafer level packaging, the wafer type and packaging type of integrated circuit (IC) or chip (Chip) must go through a specific testing process to ensure that the integrated circuit Every electronic component inside an integrated circuit (IC) or chip (Chip) operates normally.

Furthermore, after the integrated circuit (IC) or chip (Chip) is placed on the circuit board, the circuit layout on the circuit board also needs to be tested and verified, such as: circuit testing and circuit testing of the printed circuit board (PCB). For verification, automatic test equipment (ATE) is now used to automatically test electronic components on circuit boards, and even test integrated circuits (ICs) or chips (Chip) on circuit boards. .

However, during the test process, the probe is nothing more than using a probe to contact the test pad or pin on the circuit board, and the test voltage may cause sparks. The automated test machine does not provide effective quantitative data to the tester. learn. For example: The detection device of Nidec Lid Co., Ltd.'s Chinese Patent No. CN104422860B uses a determination part to determine that a constant current source provides a constant current to the circuit under test and determines whether the test voltage of the circuit to be tested maintains a voltage slope. Testing whether the circuit is defective, but unable to obtain an exact quantifiable value.

Based on the above problems, the present invention provides a detection circuit that conducts the probe module and the power measurement unit through the switch module, thereby allowing the circuit element under test and the probe module to be coupled to the probe module and The power measurement unit forms a loop and uses the test power supply to obtain the test voltage from the circuit component under test, thereby allowing the detection circuit to obtain quantifiable data from the circuit component under test.

One object of the present invention is to provide a detection circuit that uses a probe module to couple a power measurement unit, a switch module and an impedance element, and uses the probe module to detect a circuit element under test, and uses the switch module to A conductive power measurement unit and a probe module are assembled to supply test power to the circuit component under test to obtain the corresponding test voltage, so that quantifiable data can be obtained from the circuit component under test.

In view of the above purpose, the present invention provides a detection circuit, which is used to detect a circuit component under test, a probe module; a power measurement unit, which is coupled to the probe module and a ground terminal respectively; and a switch. a module, which is respectively coupled to the probe module and the power measurement unit; and an impedance element, a first end of which is coupled to the probe module, and a second end of the impedance element is coupled to the power source The measurement unit is coupled to the ground terminal; when the switch module conducts the probe module and the power measurement unit and forms a loop with the circuit component under test, the power measurement unit provides a test power , power is supplied to the circuit element under test through the probe module to generate a first test voltage correspondingly.

The present invention further provides an embodiment in which when a circuit impedance value of the circuit element under test is less than a preset impedance value of the power supply measurement unit, the power supply measurement unit switches the test power supply to a current source, Power is supplied to the circuit element under test through the probe module, and a second test voltage is correspondingly generated.

The present invention further provides an embodiment in which there is a difference between the second test voltage and a first test impedance value corresponding to the test power source and a second test impedance value of the impedance element, and the difference corresponds to The electrical insulation strength of one of the circuit components under test.

The present invention further provides an embodiment, wherein the difference is 100 ohms to 10k ohms.

The present invention further provides an embodiment in which the current source is a certain current, and the constant current is a certain value between 1 milliampere and 30 milliamperes.

The present invention further provides an embodiment, which further includes a processing unit coupled to the probe module. The processing unit is used to determine that when the first test voltage exceeds a threshold, the first test voltage is corresponding to The circuit component under test is in a normal state.

The present invention further provides an embodiment in which the circuit component under test includes a first circuit and a second circuit, and the probe module includes a first probe component and a second probe component. When the first probe component The probe element and the second probe element are coupled to the first circuit and the second circuit respectively, and when the switch module is turned on, the probe module, the power measurement unit and the impedance element are in contact with the to-be-tested Circuit elements form this loop.

The present invention further provides an embodiment in which the first test voltage is a preset voltage setting.

In order to enable you, the review committee, to have a further understanding of the characteristics and effects of the present invention, we would like to provide preferred embodiments and accompanying detailed descriptions, as follows:

Certain words are used in the specification and claims to refer to specific components. However, those with ordinary knowledge in the technical field of the present invention should understand that the same component may be called by different terms. Moreover, this specification and claims The difference in names is not used as a way to distinguish components; rather, the difference in overall technology of the components is the criterion for distinction. The "includes" mentioned throughout the description and claims is an open-ended term, and therefore should be interpreted as "includes but is not limited to." Furthermore, the word "coupling" here includes any direct and indirect means of connection. Therefore, if a first device is coupled to a second device, it means that the first device can be directly connected to the second device, or can be indirectly connected to the second device through other devices or other connection means.

In view of the above-mentioned prior art, the automated detection device cannot provide quantifiable detection data, and therefore cannot provide quantifiable values to allow users to intuitively understand the circuit detection status.

In the following, the present invention will be described in detail by illustrating various embodiments of the present invention through drawings. This inventive concept may, however, be embodied in many different forms and should not be construed as limited to the illustrative embodiments set forth herein.

First, please refer to Figure 1, which is a system schematic diagram of an embodiment of the present invention. As shown in the figure, the detection circuit 10 of one embodiment of the present invention includes a probe module 12, a power measurement unit 14, a switch module 16 and an impedance element 18. The probe module of this embodiment 12 is used to detect a circuit component PCB, such as detecting circuit components on a printed circuit board, integrated circuits on a wafer, etc., and the power measurement unit 14 is coupled to the probe module 12 and a ground terminal respectively. GND, especially the switch module 16 is provided between the probe module 12 and the power measurement unit 14, so that the switch module 16 is coupled to the probe module 12 and the power measurement unit respectively. Unit 14, a first end of the impedance element 18 is coupled to the probe module 12, a second end of the impedance element 18 is coupled to the power measurement unit 14 and coupled to the ground terminal GND.

Continuing from the above, as shown in Figure 2, when the switch module 16 is open circuit, the probe module 12, the power measurement unit 14 and the circuit component PCB under test do not form a loop, but as shown in Figure 3 As shown in the figure, when the switch module 16 conducts the probe module 12 and the power measurement unit 14 and forms a loop LOOP with the circuit component PCB under test, the power measurement unit 14 provides a test power P, Power is supplied to the circuit component PCB under test through the probe module 12 and a voltage detection signal V _S is correspondingly generated. As shown in Figure 4, the high level (ON) of the detection control signal DET represents the detection period during which the probe module 12 detects the circuit component PCB under test, and the switch control signal SW represents the switch module. During the switching period of 16, ON means that the switch module 16 is on, OFF means that the switch module 16 is open, and the voltage detection signal V _S means the voltage level obtained by the detection circuit 10. When the circuit component PCB under test is When a circuit impedance value is greater than a preset impedance value of the power measurement unit 14, the power measurement unit 14 switches the test power supply P to a voltage source (for example: 250V voltage source, the voltage of which is relative to the system ground 250V voltage of level SGND). At this time, the voltage detection signal _VS is a first test voltage _VS1 . When the first test voltage _VS1 exceeds a threshold value TH1 (for example: 200V voltage level), that is When it is greater than the threshold value TH1, the first test voltage V _S1 corresponds to the circuit component PCB under test being in a normal state.

As shown in Figure 5, when the circuit impedance value of the circuit component PCB under test is less than a preset impedance value of the power measurement unit 14, the power measurement unit 14 switches the test power P to a current source. , power is supplied to the circuit component PCB under test through the probe module 12, and the corresponding generated voltage detection signal _VS is a second test voltage _VS2 . There is a difference between a first test impedance value _RS1 corresponding to the test power supply P and a second test impedance value _RS2 of the impedance element 18, and the first test impedance value _RS1 corresponds to the to-be- Measure the circuit impedance value of the circuit component PCB and calculate it as follows: RSPK=[(V _S /I _S )-R _S2 ]=[R _S1 -R _S2 ]

Among them, _IS is the current value when the test power supply P is switched to the current source, and RSPK is the difference. The difference corresponds to the electrical insulation strength of the circuit component PCB under test. The difference is about 100 ohms to 10k ohms.

When the test power P provided by the power measurement unit 14 of the above embodiment is a current source, the current source is a certain current, and the constant current is a certain value between 1 milliamp and 30 milliamps. In addition, the first test voltage _VS1 is a preset voltage setting.

Referring again to Figures 1 and 2, it can be seen that the detection circuit 10 of this example further includes a processing unit 20 and a sensing unit 22. The processing unit 20 is coupled to the probe module 12. The processing unit 20 is based on the The detection control signal DET determines the first test voltage V _S1 and the second test voltage V _S2 . When the sensing unit 22 obtains the first test voltage V _S1 that is greater than the threshold TH1 , the processing unit 20 determines The circuit element PCB under test is in a normal state corresponding to the first test voltage V _S1 , and when the sensing unit 22 obtains the second test voltage V _S2 that is less than the threshold value TH1 , the processing unit 20 determines that the The circuit element PCB under test is in an abnormal state corresponding to the second test voltage _VS2 . There is no need to gradually change the voltage level of the test power supply P by controlling the power measurement unit 14 to test the circuit component PCB under test. A quantifiable value can be directly measured to determine whether the circuit component PCB under test is abnormal.

In addition, the processing unit 20 can be further coupled to the power measurement unit 14 so that the processing unit 20 obtains a value of the test power P through a feedback signal FB of the power measurement unit 14 . In this embodiment, the processing unit 20 is coupled to the probe module 12 through the sensing unit 22, whereby when the switch module 16 is turned on, the sensing unit 22 can measure the corresponding test power supply. V _S1 and the second test voltage V _S2 generate a corresponding sensing signal SEN to the processing unit 20 , thereby allowing the processing unit 20 to obtain the test power supply V _S1 and the second test voltage V _S2 through the sensing signal SEN. Corresponding measurement value.

Referring back to Figure 1, the circuit component under test PCB includes a first circuit C1 and a second circuit C2, and the probe module 12 includes a first probe component 122 and a second probe component 124. When the The first probe element 122 and the second probe element 124 are respectively coupled to the first circuit C1 and the second circuit C2, and there is an electrical connection between the first circuit C1 and the second circuit C2. Therefore, When the switch module 16 is turned on, the probe module 12, the power measurement unit 14, the impedance element 18 and the circuit component PCB under test form the loop LOOP.

To sum up, the present invention provides a detection circuit that detects a circuit component under test through a probe module and controls it through a power measurement unit and a switch module, such as the circuit impedance value of the circuit component under test. When it is less than the preset impedance value of the power supply measurement unit, it will drive the power supply measurement unit to switch its test power source to a certain current source, thereby detecting and obtaining abnormal measurement values, thereby providing quantifiable data, instead of Traditional detection methods, thus avoiding errors or errors.

Therefore, this invention is indeed novel, progressive and can be used industrially. It should undoubtedly meet the patent application requirements of my country's Patent Law. I file an invention patent application in accordance with the law and pray that the Office will grant the patent as soon as possible. I am deeply grateful.

However, the above are only preferred embodiments of the present invention and are not intended to limit the scope of the present invention. All changes and modifications can be made equally in accordance with the shape, structure, characteristics and spirit described in the patent scope of the present invention. , should be included in the patent scope of the present invention.

10: Detection circuit 12: Probe module 122: First probe component 124: Second probe component 14: Power measurement unit 16: Switch module 18: Impedance unit 20: Processing unit 22: Sensing unit C1: First circuit C2: Second circuit DET: Detection control signal FB: Feedback signal GND: Ground terminal P: Test power supply PCB: Circuit component under test SEN: Sensing signal SGND: System ground level SW: Switching control signal TH1 :Threshold value V _S :Voltage detection signal V _S1 :First test voltage V _S2 :Second test voltage

Figure 1: This is a system schematic diagram of an embodiment of the present invention; Figure 2: This is a schematic diagram of an open circuit of a switch module according to an embodiment of the present invention; Figure 3: This is a schematic diagram of the switch module conduction according to one embodiment of the present invention; Figure 4: It is a signal curve diagram of a normal state according to an embodiment of the present invention; and Figure 5: This is a signal curve diagram of an abnormal state according to an embodiment of the present invention.

10:Detection circuit

12:Probe module

122: First probe element

124: Second probe element

14:Power measurement unit

16:Switch module

18: Impedance unit

20: Processing unit

22: Sensing unit

C1: first circuit

C2: Second circuit

FB: feedback signal

GND: ground terminal

P: test power supply

PCB: circuit component to be tested

SEN: sensing signal

SW: switching control signal

Claims (7)

A detection circuit, which is used to detect a circuit component under test. The detection circuit includes: a probe module; a power measurement unit, which is coupled to the probe module and a ground terminal respectively; a switch module, They are respectively coupled to the probe module and the power measurement unit; and an impedance element, a first end of which is coupled to the probe module, and a second end of the impedance element is coupled to the power measurement unit and coupled to the ground terminal; wherein, when the switch module conducts the probe module and the power measurement unit and forms a loop with the circuit element under test, the power measurement unit provides a test power supply, which passes through the The probe module supplies power to the circuit element under test and generates a first test voltage correspondingly. When the circuit impedance value of the circuit element under test is less than a preset impedance value of the power supply measurement unit, the power supply measurement unit The test power supply is switched to a current source, and power is supplied to the circuit element under test through the probe module, thereby generating a second test voltage accordingly. The detection circuit of claim 1, wherein there is a difference between a first test impedance value corresponding to the test power supply and a second test impedance value of the impedance element, and the difference corresponds to the circuit element under test One electrical insulation strength. The detection circuit as claimed in claim 2, wherein the difference is between 100 ohms and 10k ohms. The detection circuit as described in claim 1, wherein the current source is a certain current, and the fixed current is a certain value between 1 milliampere and 30 milliamperes. The detection circuit as claimed in claim 1, further comprising a processing unit coupled to the probe module, the processing unit being used to determine when the first test voltage exceeds a threshold, the first test voltage is corresponding to The circuit component under test is in a normal state. The detection circuit as claimed in claim 1, wherein the circuit element to be tested includes a first circuit and a second circuit, and the probe module includes a first probe element and a second probe element. When the first probe element A probe element and the second probe element are respectively coupled to the first circuit and the second circuit, and when the switch module is turned on, the probe module, the power measurement unit and the impedance element are in contact with the to-be-waited The test circuit components form this loop. The detection circuit of claim 1, wherein the first test voltage is a preset voltage setting.

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