JPH1164428A - Component inspection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a component inspection device capable of inspecting a connection state without damaging the terminal of a circuit component. SOLUTION: This component inspection device 1 inspects the electric connection state of a first part and a second part on an inspection object component. In this case, it is provided with a probe 3 for signal supply for supplying reference signals Sr to the first part, and a probe 16 for signal detection of a non- contact type constituted so as to be arranged near the second part capable of detecting the reference signals Sr supplied to the first part through the second part by electrostatic coupling. Based on the signal level of the reference signals Sr detected by the probe 16 for the signal detection, the connection state of both parts is inspected.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board
C package, hybrid substrate and MCM (Mult
The present invention relates to a component inspecting apparatus suitable for inspecting a circuit pattern breakage in an iChip Module or the like and a floating terminal of an integrated circuit.

[0002]

2. Description of the Related Art As an inspection method applied to this kind of component inspection apparatus, for example, a so-called inspection method for inspecting whether or not terminals of an integrated circuit mounted on a circuit board are securely soldered to a circuit pattern is used. The four-terminal method is conventionally known. In this inspection method, as shown in FIG. 9, a signal supply probe 3 for supplying a reference signal Sr from a reference signal source 2 and a voltage measurement probe 5 connected to a voltmeter 4 are inspected. A circuit pattern to which the terminals T of the integrated circuit 6 are to be soldered is connected with the reference potential connection probes 7, 8 for contacting the terminals T of the integrated circuit 6 and connecting to the reference potential of the reference signal source 2 and the voltmeter 4. P. Then, in this state, the reference signal source 2,
A constant current is conducted in a current path leading to the signal supply probe 3, the terminal T of the integrated circuit 6, the circuit pattern P, and the reference potential connection probe 7, and the voltage measurement probe 5
The voltage between the probe and the reference potential connection probe 8 is measured by the voltmeter 4. In this case, when the measured voltage value is equal to or lower than the predetermined voltage, it is determined that the terminal T is soldered to the circuit pattern P because the contact resistance between the terminal T and the circuit pattern P of the integrated circuit 6 is small. it can.
According to the inspection method using the four-terminal method, it is possible to easily inspect the floating terminals of the integrated circuit 6.

[0003]

However, the conventional four-terminal inspection method has the following problems. That is, since the signal supply probe 3 or the voltage measurement probe 5 having a sharp tip is brought into contact with the terminal T of the integrated circuit 6, the terminal T may be damaged. Also, today, where the fine pitch of integrated circuits is remarkable,
When inspecting terminal floating of a QEP type integrated circuit having a narrow pin pitch, there is a problem that it is extremely difficult to bring the signal supply probe 3 or the voltage measurement probe 5 into contact with the terminal T. Further, when the soldering of the terminal T is defective, the terminal T is pressed against the circuit pattern P by bringing the signal supply probe 3 or the like into contact with the terminal T. There is a problem that it may be erroneously determined that soldering is performed.

On the other hand, as a device capable of inspecting the terminal floating of the terminal T without bringing the signal supply probe 3 or the voltage measurement probe 5 into contact with the terminal T of the integrated circuit 6 to be inspected,
An in-circuit test apparatus described in JP-A-4-309875 is known, and this in-circuit test apparatus basically employs a configuration shown in FIG. In the terminal lift inspection of the integrated circuit by the in-circuit test apparatus 50, first, the reference signal Sr of the reference signal source 2
The electrode 9 for supplying the current is brought into contact with the package surface of the integrated circuit 6 to be inspected, and the current measuring probe 5
1 is brought into contact with the circuit pattern P to be connected to the terminal T of the integrated circuit 6. Next, the reference signal Sr is passed through the electrode 9.
Is output, a current based on the reference signal Sr flows through the terminal T via the internal capacitance of the integrated circuit 6 between the electrode 9 and the terminal T. At this time, the current flowing through the terminal T conducts the circuit pattern P and is input to the current measuring probe 51, and the value of the current flowing in the circuit pattern P is measured by the ammeter 52. In this case, when the measured current value is large, the terminal T and the circuit pattern P are soldered. When the measured current value is small, the terminal T is connected to the circuit pattern P.
Can be determined not to be soldered.

However, this in-circuit test apparatus 5
There are the following problems in the terminal floating inspection using 0. That is, the in-circuit test apparatus 50 measures the internal capacitance in the integrated circuit 6 and the current value of the reference signal Sr flowing through the circuit pattern P via the terminal T of the integrated circuit 6.
In this case, since the internal capacitance is small, the current flowing through the circuit pattern P is extremely small even in a normal connection state in which the terminal T and the circuit pattern P are soldered. In addition, since the circuit pattern P is in a high impedance state with respect to the reference potential of the reference signal source 2 and the ammeter 52, the reference signal Sr and noise from the electrode 9 easily jump directly into the circuit pattern P. ing. Therefore, the difference between the current value measured by the ammeter 52 when the terminal T is not in contact with the circuit pattern P and the current value measured when the terminal T is in a normal connection state is small.
Therefore, it is difficult to set a threshold value of a current value for discriminating between a normal state and a defective state, and it is extremely difficult to determine whether the connection state is good or not.

Further, for one circuit pattern P,
When a plurality of terminals T, T,... In one integrated circuit 6 are connected in parallel, in the in-circuit test apparatus 50, the current measurement probe 51 is brought into contact with the circuit pattern P for inspection. When any one of the plurality of terminals T, T,... Is not soldered, there is a problem that the unsoldered terminal T cannot be specified.

In the case of inspecting a fine-pitch integrated circuit, a plurality of other circuit patterns are formed close to and parallel to the circuit pattern to be inspected. There is a large capacitance. In this case, a current based on the reference signal Sr flows to other circuit patterns via the internal capacitance of the integrated circuit. Therefore, the reference signal Sr leaks from another circuit pattern to the circuit pattern to be inspected via the capacitance between the two circuit patterns. For this reason, there is also a problem that it is difficult to detect a so-called poor contact state, in which the terminal and the circuit pattern are connected by scraps of solder or are connected by a fine line pattern due to poor etching. In this case, by connecting another circuit pattern to the reference potential of the reference signal source 2, it is possible to prevent the reference signal Sr from leaking to the circuit pattern to be inspected. Since the probe 7 needs to be brought into contact, a problem arises that the probe 7 cannot be applied to a so-called XY type in-circuit tester.

The present invention has been made in view of such a problem, and has as its main object to provide a component inspection apparatus capable of inspecting a connection state without damaging a terminal of a circuit component. It is another object of the present invention to provide a component inspection apparatus capable of reliably inspecting a connection state and applicable to an XY-type in-circuit tester.

[0009]

According to a first aspect of the present invention, there is provided a component inspection apparatus for inspecting an electrical connection between a first portion and a second portion on a component to be inspected. In the inspection apparatus, a signal supply probe for supplying a reference signal to a first portion and a reference signal supplied to the first portion so as to be arranged close to the second portion are supplied through the second portion. And a non-contact type signal detection probe which can be detected by electrostatic coupling, and a connection state of both parts is inspected based on a signal level of a reference signal detected by the signal detection probe.

In this component inspection apparatus, when a reference signal is supplied to the first portion via the signal supply probe, the signal detection probe disposed in proximity to the second portion receives the reference signal via the second portion. The reference signal supplied to the first portion is detected by electrostatic coupling. Next, the connection state of both parts is inspected based on the signal level of the reference signal detected by the signal detection probe. Specifically, when the signal level exceeds a predetermined threshold value, it is determined that the connection is established, and when the signal level is lower than the threshold value, it is determined that the connection is not established. At this time, since the signal detection probe is a non-contact type, for example, when the second portion is a terminal of a circuit component, the connection state can be inspected without damaging the terminal.

According to a second aspect of the present invention, there is provided a component inspection apparatus.
In the described component inspection apparatus, the two parts are predetermined parts on the print pattern.

According to a third aspect of the present invention, there is provided a component inspection apparatus.
In the component inspection apparatus described above, the two parts are predetermined parts on a printed pattern formed on the multilayer circuit board.

According to a fourth aspect of the present invention, there is provided a component inspection apparatus.
In the component inspection apparatus described above, the second portion is a terminal of the circuit component mounted on the circuit board, and the first portion is a circuit pattern to be connected to the terminal of the circuit component. .

According to a fifth aspect of the present invention, there is provided a component inspection apparatus.
In the component inspection apparatus described above, the circuit component is an integrated circuit.

In the component inspection apparatus according to the fourth and fifth aspects, even when a plurality of terminals in one circuit component are connected in parallel to one circuit pattern, a signal is output to a terminal to be inspected. Since the detection probes are individually inspected in proximity to each other, it is possible to reliably identify the terminals that are not connected to the circuit pattern.

According to a sixth aspect of the present invention, there is provided a component inspection apparatus for inspecting an electrical connection state between a first portion and a second portion on a circuit board, wherein the circuit component mounted on the circuit board is provided. And an electrode for supplying a reference signal by electrostatic coupling to a terminal of the circuit component as the second part and configured to be disposed in a contact or non-contact state with respect to the package surface, and to be disposed close to the terminal. And a non-contact type signal detection probe for detecting a reference signal supplied to the terminal, and a circuit pattern formed on a circuit board as a first portion to be connected to the terminal. A reference potential connection probe for connecting to a reference potential for the reference signal, and inspecting a connection state of both parts based on a signal level of the reference signal detected by the signal detection probe. And wherein the door.

According to a seventh aspect of the present invention, there is provided a component inspection apparatus for inspecting an electrical connection state between a first portion and a second portion on a circuit board, wherein the circuit component mounted on the circuit board is provided. And an electrode configured to be disposed in a non-contact state with respect to the terminal and supplying a reference signal by electrostatic coupling to the terminal as the second portion, and configured to be disposed close to the terminal and supplied to the terminal. A non-contact type signal detection probe for detecting the reference signal, and a reference potential for the reference signal which is configured to be able to contact a circuit pattern formed on a circuit board as a first portion to be connected to the terminal. A reference potential connection probe for connection, wherein a connection state of both parts is inspected based on a signal level of a reference signal detected by the signal detection probe.

In the component inspection apparatus according to the sixth or seventh aspect, the reference signal is supplied to the terminal of the circuit component by electrostatic coupling via the electrode. In this case, since the reference potential connection probe is in contact with the first portion, the impedance of the first portion is extremely reduced. Therefore, when the terminal is securely connected to the circuit pattern to be connected, the signal level of the reference signal appearing at the terminal is extremely low. On the other hand, when the terminal of the circuit component and the circuit pattern are in a poor contact state and the resistance value at the connection portion between them is large, and when the terminal is not connected to the circuit pattern, the signal level of the reference signal appearing at the terminal is large. . For this reason, it is extremely easy to set a threshold value when inspecting the terminal lift of the circuit component with respect to the circuit pattern. Further, since the impedance of the first portion is extremely low, the jump of the reference signal or noise from the electrode to the circuit pattern is prevented. Moreover, another circuit pattern is formed close to and parallel to the circuit pattern to be inspected,
Even when the reference signal is leaking from the electrode to another circuit pattern, the leakage of the reference signal from the other circuit pattern to the circuit pattern to be inspected is prevented. For this reason, it is possible to prevent erroneous determination due to the intrusion of the reference signal or noise into the circuit pattern, and as a result, it is possible to reliably inspect the floating of the terminals of the circuit component. Also, since the signal detection probe is a non-contact type probe, by forming it with a small diameter, it is possible to reliably conduct continuity and disconnection inspection of wiring patterns in high-density packages and circuit patterns on high-density circuit boards. Become. Moreover,
At this time, it is not necessary to move the signal detection probe up and down, so that the inspection time can be shortened.

[0019] According to the eighth aspect of the present invention, there is provided a component inspection apparatus.
Or the component inspection apparatus according to 7, wherein the electrode is configured to be able to supply a reference signal by electrostatic coupling to terminals of a plurality of circuit components mounted and fixed on the circuit board above or beside the circuit board. It is characterized by having been done.

According to a ninth aspect of the present invention, there is provided a component inspection apparatus according to the sixth aspect.
9. The component inspection apparatus according to any one of items 1 to 8, wherein the circuit component is an integrated circuit.

According to a tenth aspect of the present invention, in the component inspection apparatus of the first aspect, an amplifier circuit for amplifying a reference signal detected by the signal detection probe is further provided. And the signal detection probe are connected by a three-layer coaxial cable.

According to an eleventh aspect of the present invention, in the component inspection system of the tenth aspect, the signal detection probe includes a central conductor of the three-layer coaxial cable and a shield portion for shielding the central conductor. It is characterized by having been done.

In these component inspection apparatuses, since the amplifier circuit and the signal detection probe are connected by a three-layer coaxial cable, the ingress of reference signals and noise from portions other than the signal detection probe is prevented, and A reference signal having a level corresponding to the signal level of the reference signal at the second portion is input to the detection probe. For this reason, it is possible to prevent the connection signal from being erroneously determined due to the direct input of the reference signal from the electrode or the input of noise. Also, by making the signal detection probe extra-fine with the center conductor and shield part of the three-layer coaxial cable,
It is possible to reliably inspect whether the terminals of the fine-pitch integrated circuit are soldered or not.

[0024]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the accompanying drawings. Note that the same components as those used in the conventional four-terminal method are denoted by the same reference numerals, and redundant description will be omitted.

FIG. 1 is a block diagram showing a basic configuration of a component inspection apparatus according to the present invention. As shown in FIG. 1, the component inspection apparatus 1 supplies a reference signal Sr which is a sine wave of 10 KHz. Signal source 2, signal supply probe 3,
The voltmeter 4, the signal detection probe 16, the amplification circuit 12 for amplifying the reference signal Sr detected by the signal detection probe 16, the signal detection probe 16 and the amplification circuit 1.
2 is provided with a three-layer coaxial cable (triaxial cable) 11. The three-layer coaxial cable 1
In FIG. 1, a shield portion 14 for shielding a center conductor 13 (see FIG. 3) at the distal end is exposed, and both the center conductor 13 and the inner shield portion 14 constitute a signal detection probe 16. As a result, the signal detection probe 16 can be easily configured. In this case, the signal detection probe 16 has an outer diameter of about 0.6.
mm, the outer diameter of the center conductor 13 is formed to be about 0.2 mm, forming an extremely fine probe. Further, the signal detection probe 16 can constitute a probe having directivity in a direction facing the exposed distal end of the signal detection probe 11. For this reason, the signal detection probe 16 causes the signal supplied to the circuit pattern, etc., which is close to and opposed to the distal end portion, to be static by the capacitance existing between the circuit pattern and the central conductor 13 of the three-layer coaxial cable 11. It is detected by electro-coupling.

Next, the basic inspection principle of the component inspection apparatus 1 will be described by taking, as an example, a case of inspecting the circuit pattern P1 for cut-off. First, the reference signal Sr is supplied to the circuit pattern P1 by bringing the signal supply probe 3 into contact with one end of the circuit pattern P1 formed on the circuit board PC and serving as the first portion in the present invention. Next, the distal end opening of the signal detection probe 16 is brought close to the other end of the circuit pattern P1 as the second part in the present invention. In this state, if the circuit pattern P1 is not cut off, the reference signal Sr supplied from the signal supply probe 3 is detected by the signal detection probe 16 via one end and the other end of the circuit pattern P1. Is done. Next, the amplification circuit 12
Reference signal S detected by signal detection probe 16
r is amplified with a predetermined gain, and the voltmeter 4 measures the signal level of the amplified reference signal Sr. In this case, the signal level measured by the voltmeter 4 exceeds the threshold value set in advance when the circuit pattern P1 has not been cut, and is lower than the threshold value when the pattern has been cut. Level. Therefore, by comparing the threshold value with the measured signal level, it is possible to inspect the pattern break.

Next, a specific configuration of the component inspection apparatus 1 will be described with reference to FIGS. Parts inspection device 1
Is an XY type in-circuit tester, and FIG.
As shown in (1), an XY direction moving mechanism 21 for moving the signal supply probe 3 in the XY direction and an XY direction moving mechanism for moving the signal detection probe 16 in the XY direction. 22 and C for executing various processes in component inspection
PU 23, a constant voltage source 24 for supplying a reference signal Sr having a predetermined constant voltage, an amplifier circuit 12 for amplifying the reference signal Sr detected by the signal detection probe 16, and a reference signal amplified by the amplifier circuit 12. A measuring circuit 25 for measuring the signal level of Sr, and an A / A for converting the signal level measured by the measuring circuit 25 from analog to digital.
A D conversion circuit 26, a ROM 27 for storing an operation program of the CPU 23, a threshold value as reference data for determining a connection state, and the like, and a display unit 28 for displaying an inspection result and the like are provided. Here, the constant voltage source 24 and the measuring circuit 25 correspond to the reference signal source 2 and the voltmeter 4 in FIG. 1, respectively.

As shown in FIG. 3, the amplifier circuit 12 includes an operational amplifier 31 functioning as a voltage follower.
And an operational amplifier 32 having a differential amplification gain of about 1300 times,
It comprises a capacitor 33 and resistors 34 to 36, the center conductor 13 of the signal detection probe 16 is connected to the positive input of the operational amplifier 31,
4 is connected to the minus input of the operational amplifier 31, and the outer shield part 15 is connected to the reference potential of the amplifier circuit 12. The amplifier circuit 12 constitutes a so-called driven shield circuit. With this configuration, the amplifier circuit has a high gain of about 1300 times as a whole, maintains a high input impedance, and has a noise to the plus input section of the operational amplifier 31. To reduce the input amount.

Next, the overall operation of the in-circuit tester 1 will be described with reference to FIGS.

First, according to the inspection data stored in the ROM 27, the CPU 23 causes the XY direction moving mechanism 21,
By driving 22, the signal supply probe 3 and the signal detection probe 16 are moved to one end and the other end of the circuit pattern P1, respectively. Next, the CPU 23
Causes the constant voltage source 24 to output the reference signal Sr. As a result, the reference signal Sr is
Is detected. Next, the amplification circuit 12 amplifies the detected reference signal Sr and outputs the amplified reference signal Sr to the measurement circuit 25. After measuring the signal level of the input reference signal Sr, the measurement circuit 25 converts the measured value from analog to digital,
Output to U23. Next, the CPU 23 determines that the circuit pattern P1 has run out by comparing the input measurement value with a threshold value stored in the ROM 27. Next, after displaying the determination result on the display unit 28, the CPU 23 sequentially inspects the next circuit pattern P1 to be inspected by the same process according to the inspection data in the ROM 27.

Next, an example of inspecting another part to be inspected will be described with reference to FIGS.

As shown in FIG. 4, the component inspection apparatus 1 can also inspect the circuit pattern P2 of the multilayer circuit board PC1 for broken patterns and quality of through holes. In this case, the signal supply probe 3 is brought into contact with one end of the circuit pattern P2 formed on the multilayer circuit board PC1, and the other end of the circuit pattern P2 connected via the through holes SH. Probe 1 for signal detection
6 is brought close. Also in this case, similarly, the amplifier circuit 12 amplifies the reference signal Sr detected by the signal detection probe 16, and the voltmeter 4 measures the signal level of the amplified reference signal Sr. Next, by comparing the threshold value with the measured signal level of the reference signal Sr, the pattern break of the circuit pattern P2 or the through-hole S
The quality of H can be checked.

Next, referring to FIG. 5, a description will be given of an example of inspecting the inner layer pattern in the BGA type integrated circuit package for a break in the pattern. As shown in the drawing, terminals 42, 42,... For connecting circuit patterns are formed on the back side of the integrated circuit package 41, and terminals 43, 43,. Are formed, and both terminals 42 and 43 are connected to the inner layer pattern P.
3 are connected. In this case, the signal supply probe 3 is connected to the terminal 42 as the first part in the present invention, and the signal detection probe 16 is brought close to the terminal 43 as the second part in the present invention. In the above, the detection of the reference signal Sr by the signal detection probe 16 makes it possible to reliably inspect the inner layer pattern P3 for a break in the pattern.

In the package 41 for such an integrated circuit, since the pitch of the terminals 43, 43 is narrow, the conventional contact probe cannot be brought into contact with the terminals 43. As a result, the pattern cut of the inner layer pattern P3 is inspected. Can not do. On the other hand, in the component inspection apparatus 1, since the signal detection probe 16 having a very small diameter only needs to be brought close to the terminal 43, it is possible to reliably and easily inspect the inner layer pattern P3 for a break in the pattern.

Next, with reference to FIGS. 6 to 8, an example of testing for floating terminals of an integrated circuit will be described.

As shown in FIG. 6, in this inspection, the signal detecting probe 16 is brought close to the terminal T of the integrated circuit 6 as the second part of the present invention, and the first part of the present invention is used as the first part. The signal supply probe 3 is brought into contact with a predetermined portion of the circuit pattern P4 to be connected to the terminal T. In this state, when the reference signal Sr is supplied from the signal supply probe 3, the reference signal Sr becomes the circuit pattern P4, the terminal T, and the terminal T and the signal detection probe 1.
The signal is detected by the signal detection probe 16 by electrostatic coupling through the capacitance between the six. Next, the amplification circuit 12
The detected reference signal Sr is amplified. Also in this case, by comparing the signal level of the amplified reference signal Sr with a predetermined threshold value, the terminal floating of the terminal T from the circuit pattern P4 is inspected without damaging the terminal T. be able to. It is not necessary to move the signal detection probe 16 up and down, and it is sufficient to move the signal detection probe 16 only in the X-Y direction, so that the inspection time for terminal floating can be reduced.

In this case, since the amplifier circuit 12 and the signal detection probe 16 are connected by the three-layer coaxial cable 11, the reference signal Sr and noise from other parts than the signal detection probe 16 are prevented from entering. The signal detection probe 16 has a reference signal Sr at a terminal T.
, A reference signal Sr having a level corresponding to the signal level is input. For this reason, it is possible to prevent erroneous determination as to whether the soldering is good or bad due to the direct jump of the reference signal Sr or the input of noise. Further, since the signal detection probe 16 is configured to be extremely fine, the integrated circuit 6 having a fine pitch is formed.
Of the soldering of the terminal T can be surely inspected. Moreover, even when a plurality of terminals T, T,... In one integrated circuit 6 are connected in parallel to one circuit pattern P, a signal detection probe is connected to each of the terminals T to be inspected. Since the inspection is individually performed by bringing the 16 into close proximity, the terminal T that is not connected to the circuit pattern P can be reliably specified.

Also, as shown in FIG. 7, the use of the electrode 45 instead of the signal supply probe 3 can inspect the floating of the terminals of the integrated circuit 6. In this case, the electrode 45 connected to the output part of the reference signal source 2 is placed on the package surface of the integrated circuit 6, the signal detection probe 16 is brought close to above the terminal T, and the reference signal source 2 Is brought into contact with a predetermined portion of the circuit pattern P4 to be connected to the terminal T. In this state, when the reference signal Sr is output from the electrode 45, the reference signal Sr
Is supplied to the terminal T via the package surface and the internal capacitance of the integrated circuit 6. Therefore, the signal detection probe 16
By comparing the signal level of the reference signal Sr detected by the above with a predetermined threshold value, the terminal floating can be inspected. In this case, the electrode 45 and the signal detection probe 16 are moved by the XY direction moving mechanism 22, and the signal detection probe 16 is further moved independently in the XY direction independently of the electrode 45. It is configured to be possible.

In this case, since the reference potential connection probe 7 is in contact, the impedance of the circuit pattern P4 is extremely reduced. Therefore, the circuit pattern P
When the terminal T is securely connected to the terminal 4, the signal level of the reference signal Sr appearing at the terminal T is extremely small. On the other hand, when the terminal T and the circuit pattern P4 are in a poor contact state and the resistance value at the connection portion between them is large,
When the terminal T and the circuit pattern P4 are not soldered, the signal level of the reference signal Sr appearing at the terminal T is large. For this reason, it is extremely easy to set a threshold value when inspecting terminal lifting of the terminal T. Further, since the impedance of the circuit pattern P4 is extremely low,
The reference signal Sr of P4 and noise are prevented from entering the circuit pattern from the electrode 45. Moreover, the circuit pattern P4
Another circuit pattern is formed close to and parallel to the
Even if the reference signal Sr leaks from 5 to another circuit pattern, the leak of the reference signal Sr from another circuit pattern to the circuit pattern P4 is prevented. For this reason,
As a result, it is possible to prevent erroneous determination due to a reference signal or noise from jumping into or leaking into a circuit pattern, so that terminal lifting of the integrated circuit 6 can be reliably inspected. Further, unlike the four-terminal method, since the signal detection probe 16 does not contact the terminal T, the terminal T is connected to the circuit pattern P during inspection.
The terminal float can be more reliably inspected without pressing the terminal 4.

Further, as shown in FIG. 8, the same area as the circuit board PC is provided so that the reference signal Sr can be electrostatically coupled to the terminals T of the plurality of integrated circuits 6 instead of the electrodes 45. The use of the electrode 46 can also check the terminal floating of the integrated circuit 6. In this case, the electrode 46 connected to the output of the reference signal source 2 is fixedly arranged above the surface of the circuit board PC, and the signal detection probe 16 and the reference potential connection probe 7 are shown in FIG. And place it in the same way as In this state, when the reference signal Sr is output from the electrode 46, the reference signal Sr is directly supplied to the terminal T via the capacitance between the surface of the electrode 46 and the terminal T. In this case, the terminal T
Is floating from the circuit pattern P4, the reference signal Sr easily jumps into the terminal T.
The signal level of the reference signal Sr detected by 6 becomes high. Therefore, by comparing the signal level of the reference signal Sr detected by the signal detection probe 16 and amplified by the amplifier circuit 12 with a predetermined threshold value, it is possible to inspect terminal lifting.

In this case, since the electrodes 46 are fixedly arranged, there is no need to move the electrodes 46 by the XY direction moving mechanism 22, and only the signal detecting probe 16 is
A configuration in which the movement is performed by the −Y direction movement mechanism 22 can be adopted. Therefore, the device can be easily configured. In this example, the electrode 46 is connected to the circuit board PC.
Although it is fixedly arranged above the surface of the circuit board, it may be fixedly arranged on the side of the circuit board PC. In such a case, the device can be simply configured and the terminal floating can be inspected. it can.

Note that the present invention is not limited to the above embodiment. For example, in the present embodiment, the component inspection apparatus 1 that inspects the connection state by the XY method has been described. However, the present invention is not limited to this, and is applicable to a so-called fixture type pin board type component inspection apparatus. It is possible.

Further, the signal detection probe in the present invention is not limited to the signal detection probe 16 shown in the present embodiment, but may be any type as long as it can detect a reference signal by an electrostatic method. it can. In addition, the inspection target when inspecting the terminal floating is not limited to the terminal of the integrated circuit, and the terminal of various circuit components such as a switch, a resistor, and a capacitor can be inspected.

[0044]

As described above, according to the parts inspection apparatus of the first to fifth aspects, the first probe is provided by the signal supply probe.
A reference signal is supplied to a portion of the circuit component, and the signal detection probe detects the reference signal by electrostatic coupling via the second portion. For example, when the second portion is a terminal of a circuit component, the terminal is connected to the terminal. The connection state can be inspected without scratching.

In this case, when inspecting a connection state between a terminal of a circuit component such as an integrated circuit and a circuit pattern, a plurality of terminals in one circuit component are connected in parallel to one circuit pattern. Even in this case, since the signal detection probe is placed close to the inspection target terminal for inspection, the terminal not connected to the circuit pattern can be reliably specified.

According to the component inspection apparatus of the present invention, the circuit pattern as the first portion to be connected to the terminal by the reference potential connection probe is connected to the reference potential, and the circuit is connected to the electrode from the electrode. By detecting the reference signal supplied to the terminal by the signal detection probe in a state where the reference signal is supplied to the terminal of the component by electrostatic coupling, the reference signal and noise jump from the electrode to the circuit pattern, and It is possible to prevent erroneous determination due to prevention of leakage of the reference signal from another circuit pattern to the circuit pattern to be inspected and the like, and thereby it is possible to surely inspect the floating of the terminal of the circuit component. Also,
By forming the signal detection probe with a small diameter, BG
The continuity and disconnection inspection of a wiring pattern in a high-density package such as an A-type package or a CSP (chip size package) or a circuit pattern on a high-density circuit board can be reliably performed. Further, at that time, it is not necessary to move the signal detection probe up and down, so that the inspection time can be reduced.

In this case, according to the component inspection apparatus of the eighth aspect, since the electrodes are fixedly arranged above or on the side of the circuit board, there is no need to move the electrodes, so that the inspection time is further reduced. Can be.

Further, according to the parts inspection apparatus of the tenth and eleventh aspects, since the amplifier circuit and the signal detection probe are connected by the three-layer coaxial cable, the reference signal from other parts than the signal detection probe can be obtained. By preventing noise from entering, a reference signal having a level corresponding to the signal level of the reference signal at the second portion is input to the signal detection probe. As a result, it is possible to prevent the connection signal from being erroneously determined due to a direct jump of the reference signal from the electrode or noise input. In addition, since the signal detection probe is configured to be extremely thin with the center conductor and the shield portion of the three-layer coaxial cable, it is possible to reliably inspect the soldering of the terminals of the fine-pitch integrated circuit. In addition, by configuring the signal detection probe with the central conductor and the shield portion of the three-layer coaxial cable, the signal detection probe can be easily configured.

[Brief description of the drawings]

FIG. 1 is a basic configuration diagram of a component inspection apparatus according to an embodiment of the present invention.

FIG. 2 is a specific configuration diagram of the component inspection apparatus according to the embodiment of the present invention.

FIG. 3 is a specific circuit diagram of an amplifier circuit.

FIG. 4 is a basic configuration diagram in a case where a component inspection apparatus according to an embodiment of the present invention inspects a multilayer circuit board for pattern breaks and through holes.

FIG. 5 is a basic configuration diagram in a case where a pattern inspection of an inner layer pattern in an integrated circuit package is inspected in the component inspection apparatus according to the embodiment of the present invention.

FIG. 6 is a basic configuration diagram in a case where terminal lifting of an integrated circuit is inspected in the component inspection apparatus according to the embodiment of the present invention.

FIG. 7 is another basic configuration diagram in a case where terminal lifting of an integrated circuit is inspected in the component inspection apparatus according to the embodiment of the present invention.

FIG. 8 is a diagram showing still another basic configuration in the case of inspecting a floating terminal of an integrated circuit in the component inspection apparatus according to the embodiment of the present invention.

FIG. 9 is a basic configuration diagram in the case where terminal lifting of an integrated circuit is inspected by a conventional four-terminal method.

FIG. 10 is a basic configuration diagram in the case of inspecting floating terminals of an integrated circuit in a conventional in-circuit test apparatus.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 component inspection device 3 signal supply probe 6 integrated circuit 7 reference potential connection probe 11 three-layer coaxial cable 13 center conductor 14 inner shield part 16 signal detection probe 45 electrode 46 electrode PC circuit board PC1 multilayer circuit board P1 circuit pattern P2 Circuit pattern P3 Inner layer pattern P4 Circuit pattern T terminal

Claims (11)

[Claims] 1. A component inspection apparatus for inspecting an electrical connection state between a first part and a second part on a part to be inspected, wherein a signal supply for supplying a reference signal to the first part is provided. A probe and a non-contact type signal detection device configured to be disposed close to the second portion and capable of detecting the reference signal supplied to the first portion by electrostatic coupling via the second portion. A component inspection apparatus comprising: a probe; and inspecting a connection state of the two parts based on a signal level of the reference signal detected by the signal detection probe. 2. The component inspection apparatus according to claim 1, wherein the two parts are predetermined parts on a print pattern. 3. The component inspection apparatus according to claim 2, wherein the two parts are predetermined parts on a printed pattern formed on a multilayer circuit board. 4. The method according to claim 1, wherein the second portion is a terminal of a circuit component mounted on a circuit board, and the first portion is a circuit pattern to be connected to a terminal of the circuit component. The component inspection apparatus according to claim 1, wherein 5. The component inspection apparatus according to claim 4, wherein said circuit component is an integrated circuit. 6. A component inspection apparatus for inspecting an electrical connection state between a first portion and a second portion on a circuit board, wherein the device is in contact with a package surface of a circuit component mounted on the circuit board. Or an electrode configured to be arranged in a non-contact state and configured to supply a reference signal by electrostatic coupling to a terminal of the circuit component as the second portion, and an electrode configured to be arranged close to the terminal. A non-contact type signal detection probe for detecting the reference signal supplied to the terminal, and a circuit pattern formed on the circuit board as the first portion to be connected to the terminal. A reference potential connection probe configured to be connected to a reference potential for the reference signal, wherein the two signals are connected based on the signal level of the reference signal detected by the signal detection probe. Component inspection apparatus characterized by checking the position of the connection state. 7. A component inspection apparatus for inspecting an electrical connection state between a first portion and a second portion on a circuit board, wherein the terminal is in non-contact with a terminal of a circuit component mounted on the circuit board. An electrode configured to be disposed in a state and configured to supply a reference signal by electrostatic coupling to the terminal as the second portion; and the reference configured to be disposed close to the terminal and supplied to the terminal. A non-contact signal detection probe for detecting a signal; and a reference to the reference signal, the probe being configured to be capable of contacting a circuit pattern formed on the circuit board as the first portion to be connected to the terminal. A reference potential connection probe for connecting to a potential, and inspecting a connection state between the two parts based on a signal level of the reference signal detected by the signal detection probe. And parts inspection apparatus. 8. The electrode is fixedly arranged above or to the side of the circuit board, and is capable of supplying the reference signal by electrostatic coupling to terminals of a plurality of circuit components mounted on the circuit board. The component inspection apparatus according to claim 6, wherein the component inspection apparatus is configured. 9. The component inspection apparatus according to claim 6, wherein the circuit component is an integrated circuit. 10. An amplifier circuit for amplifying the reference signal detected by the signal detection probe,
10. The component inspection apparatus according to claim 1, wherein the amplifier circuit and the signal detection probe are connected by a three-layer coaxial cable. 11. The component inspection according to claim 10, wherein the signal detection probe includes a center conductor of the three-layer coaxial cable and a shield portion for shielding the center conductor. apparatus.