TW202411670A - Detection circuit - Google Patents

Abstract

The present invention discloses a detection circuit, which is applied for detecting a circuit device under test. The detection circuit according to the present invention provides a test power source by a source measurement unit, in the meanwhile, turned on between a probe module and the source measurement unit is performed by a switch module. And, a loop is formed by the circuit device under test, the probe module and the source measurement unit. Hereby, the test source is supplied to the circuit device under test by the test probe module, and a corresponded test voltage is generated. Thus, the quantitative characteristic of the detection circuit may be detected.

Description

Detection circuit

The present invention relates to a test circuit, in particular to a detection circuit, which is used to detect the electrical properties of a circuit component to be tested.

The manufacturing of integrated circuits (ICs) or chips will first go through the upstream IC design company proposing a corresponding circuit design solution. The midstream semiconductor foundry will provide the corresponding semiconductor process for foundry manufacturing based on the IC design company's circuit design solution. The downstream packaging and testing factory will then conduct circuit testing on the integrated circuits (ICs) or chips produced by the semiconductor foundry. Therefore, circuit testing is an indispensable stage in the manufacturing process of integrated circuits (ICs) or chips. Whether it is a traditional packaging type or a wafer-level packaging, the wafer type and packaging type of the integrated circuit (IC) or chip must undergo a specific testing procedure to ensure that each electronic component inside the integrated circuit (IC) or chip operates normally.

Furthermore, after the integrated circuit (IC) or chip is placed on the circuit board, the circuit layout on the circuit board also needs to be tested and verified, such as circuit testing and circuit verification of the printed circuit board (PCB). Nowadays, automatic test equipment (ATE) is used to automatically test electronic components on the circuit board, and even to test the integrated circuit (IC) or chip on the circuit board.

However, during the test process, the probe is used to contact the test pad or pin on the circuit board, and the test voltage may cause sparks. The automated test machine does not provide effective quantitative data for the test personnel to understand. For example, the detection device of Chinese Patent No. CN104422860B of Nidec Read Co., Ltd. uses a determination unit to determine whether the constant current source provides a constant current to the test circuit and whether the test circuit maintains a voltage slope to determine whether the test circuit is defective, but it cannot obtain an accurate quantifiable value.

Based on the above problems, the present invention provides a detection circuit, which connects the probe module and the power measurement unit through a switch module, so that the circuit element to be tested coupled to the probe module forms a loop with the probe module and the power measurement unit, and uses a test power to obtain a test voltage from the circuit element to be tested, so that the detection circuit can obtain quantifiable data from the circuit element to be tested.

One purpose of the present invention is to provide a detection circuit, which couples a power measurement unit, a switch module and an impedance element through a probe module, and uses the probe module to detect a circuit element to be tested, and conducts the power measurement unit and the probe module through the switch module, thereby supplying a test power to the circuit element to be tested to obtain a corresponding test voltage, thereby obtaining quantifiable data from the circuit element to be tested.

In view of the above-mentioned purpose, the present invention provides a detection circuit, which is applied to detect a circuit element to be tested, a probe module; a power measurement unit, which is respectively coupled to the probe module and a ground terminal; a switch module, which is respectively coupled to the probe module and the power measurement unit; and an impedance element, a first end of which is coupled to the probe module, and a second end of which is coupled to the power measurement unit and the ground terminal; wherein, when the switch module conducts the probe module and the power measurement unit and forms a loop with the circuit element to be tested, the power measurement unit provides a test power, which is supplied to the circuit element to be tested through the probe module and generates a first test voltage accordingly.

The present invention further provides an embodiment, wherein when a circuit impedance value of the circuit element to be tested is less than a preset impedance value of the power measurement unit, the power measurement unit switches the test power to a current source, supplies power to the circuit element to be tested through the probe module, and generates a second test voltage accordingly.

The present invention further provides an embodiment, wherein there is a difference between a first test impedance value corresponding to the second test voltage and the test power source and a second test impedance value of the impedance element, and the difference corresponds to an electrical insulation strength of the circuit element to be tested.

The present invention further provides an embodiment wherein the difference is 100 ohms to 10k ohms.

The present invention further provides an embodiment, wherein the current source is a constant current, and the constant current is a constant value between 1 mA and 30 mA.

The present invention further provides an embodiment, which further comprises a processing unit coupled to the probe module, and the processing unit is used to determine that when the first test voltage exceeds a threshold value, the first test voltage corresponds to a normal state of the circuit element to be tested.

The present invention further provides an embodiment, wherein the circuit element to be tested includes a first circuit and a second circuit, and the probe module includes a first probe element and a second probe element. When the first probe element and the second probe element are coupled to the first circuit and the second circuit respectively, and the switch module is turned on, the probe module, the power measurement unit, the impedance element and the circuit element to be tested form the loop.

The present invention further provides an embodiment, wherein the first test voltage is a preset voltage setting value.

In order to enable you to have a deeper understanding and knowledge of the features and effects of the present invention, we would like to provide you with a better embodiment and detailed description, as follows:

Certain terms are used in the specification and claims to refer to specific components. However, those with ordinary knowledge in the art of the present invention should understand that the same component may be referred to by different terms. Moreover, the specification and claims do not use the difference in name as a way to distinguish components, but use the difference in the overall technology of the components as the criterion for distinction. The term "including" mentioned throughout the specification and claims is an open term and should be interpreted as "including but not limited to". Furthermore, the term "coupled" includes any direct and indirect means of connection. Therefore, if the text describes a first device coupled to a second device, it means that the first device can be directly connected to the second device, or can be indirectly connected to the second device through other devices or other means of connection.

In view of the above-mentioned prior art, the automated testing device cannot provide quantifiable testing data, and thus cannot provide quantifiable values for users to intuitively understand the circuit testing status.

Hereinafter, the present invention will be described in detail by illustrating various embodiments of the present invention with reference to the drawings. However, the concept of the present invention may be embodied in many different forms and should not be construed as being limited to the exemplary embodiments described herein.

First, please refer to FIG. 1 , which is a system schematic diagram of an embodiment of the present invention. As shown in the figure, a detection circuit 10 of an embodiment of the present invention includes a probe module 12, a power measurement unit 14, a switch module 16 and an impedance element 18. The probe module 12 of the present embodiment is used to detect a circuit element PCB, for example: detecting circuit elements on a printed circuit board, integrated circuits on a wafer, etc., and the power measurement unit 14 is respectively coupled to the probe module 12 and a ground terminal GND. In particular, the switch module 16 is provided between the probe module 12 and the power measurement unit 14, so that the switch module 16 is respectively coupled to the probe module 12 and the power measurement unit 14, a first end of the impedance element 18 is coupled to the probe module 12, and a second end of the impedance element 18 is coupled to the power measurement unit 14 and coupled to the ground terminal GND.

Continuing with the above, as shown in FIG. 2, when the switch module 16 is open, the probe module 12, the power measurement unit 14 and the circuit component PCB under test do not form a loop. As shown in FIG. 3, when the switch module 16 conducts the probe module 12, the power measurement unit 14 and the circuit component PCB under test to form a loop LOOP, the power measurement unit 14 provides a test power P, which is supplied to the circuit component PCB under test through the probe module 12 and generates a voltage detection signal V _S accordingly. As shown in FIG. 4 , the high level (ON) of the detection control signal DET indicates that the probe module 12 is in the detection period of detecting the circuit element PCB to be tested, the switch control signal SW indicates the switching period of the switch module 16, ON indicates that the switch module 16 is turned on, and OFF indicates that the switch module 16 is open, and the voltage detection signal _VS indicates the voltage level obtained by the detection circuit 10. When a circuit impedance value of the circuit element PCB to be tested is greater than a preset impedance value of the power measurement unit 14, the power measurement unit 14 switches the test power P to a voltage source (for example: a 250V voltage source, whose voltage is 250V relative to the system ground level SGND), and the voltage detection signal _VS is a first test voltage _VS1. When the first test voltage V _S1 exceeds a threshold value TH1 (for example, a voltage level of 200V), that is, is greater than the threshold value TH1, the first test voltage V _S1 corresponds to that the circuit component PCB to be tested is in a normal state.

As shown in FIG. 5 , when the circuit impedance value of the circuit element PCB to be tested is less than a preset impedance value of the power measurement unit 14, the power measurement unit 14 switches the test power source P to a current source, and supplies power to the circuit element PCB to be tested through the probe module 12, and the corresponding voltage detection signal V _S is a second test voltage V _S2 . There is a difference between a first test impedance value _RS1 corresponding to the test power source P and a second test impedance value _RS2 of the impedance element 18, and the first test impedance value _RS1 corresponds to the circuit impedance value of the circuit element PCB to be tested, which is calculated as follows: RSPK=[( _VS / _IS ) _-RS2 ]=[ _RS1 - _RS2 ]

Wherein, _IS is the current value when the test power source P switches to the current source, and RSPK is the difference, which corresponds to an electrical insulation strength of the circuit component PCB to be tested, and the difference is approximately between 100 ohms and 10k ohms.

When the test power source P provided by the power measurement unit 14 of the present embodiment is the current source, the current source is a constant current, and the constant current is a constant value between 1 mA and 30 mA. In addition, the first test voltage V _S1 is a preset voltage constant value.

Referring again to FIG. 1 and FIG. 2, it can be seen that the detection circuit 10 of this embodiment further includes a processing unit 20 and a sensing unit 22. The processing unit 20 is coupled to the probe module 12. The processing unit 20 determines the first test voltage V _S1 and the second test voltage V _S2 according to the detection control signal DET. When the sensing unit 22 obtains the first test voltage V _S1 greater than the threshold value TH1, the processing unit 20 determines that the circuit component PCB to be tested is in a normal state corresponding to the first test voltage V _S1 , and when the sensing unit 22 obtains the second test voltage V _S2 less than the threshold value TH1, the processing unit 20 determines that the circuit component PCB to be tested is in a normal state corresponding to the second test voltage V S2. _S2 corresponds to an abnormal state. It is not necessary to control the power measurement unit 14 to gradually change the voltage level of the test power P to test the circuit component PCB under test, and a quantifiable value can be directly measured to determine whether the circuit component PCB under test is abnormal.

In addition, the processing unit 20 can be further coupled to the power measurement unit 14, so that the processing unit 20 obtains a value of the test power P through a feedback signal FB of the power measurement unit 14. The processing unit 20 of this embodiment is coupled to the probe module 12 through the sensing unit 22, so that when the switch module 16 is turned on, the sensing unit 22 can measure the corresponding test power V _S1 and the second test voltage V _S2 and generate a corresponding sensing signal SEN to the processing unit 20, so that the processing unit 20 obtains the measurement values corresponding to the test power V _S1 and the second test voltage V _S2 through the sensing signal SEN.

Referring again to FIG. 1 , the circuit element PCB to be tested includes a first circuit C1 and a second circuit C2, and the probe module 12 includes a first probe element 122 and a second probe element 124. When the first probe element 122 and the second probe element 124 are coupled to the first circuit C1 and the second circuit C2 respectively, and the first circuit C1 and the second circuit C2 are electrically connected, when the switch module 16 is turned on, the probe module 12, the power measurement unit 14, the impedance element 18 and the circuit element PCB to be tested form the loop LOOP.

In summary, the present invention provides a detection circuit, which detects a circuit element to be tested through a probe module and controls it through a power measurement unit and a switch module. When the circuit impedance value of the circuit element to be tested is less than the preset impedance value of the power measurement unit, the power measurement unit is driven to switch its test power source to a certain current source, thereby detecting and obtaining abnormal measurement values, thereby providing quantifiable data, rather than a traditional detection method, thereby avoiding errors or mistakes.

Therefore, this invention is novel, progressive and can be used in the industry. It should undoubtedly meet the patent application requirements of the Patent Law of our country. Therefore, we have filed an invention patent application in accordance with the law and pray that the Bureau will approve the patent as soon as possible. I am deeply grateful.

However, the above is only a preferred embodiment of the present invention and is not intended to limit the scope of implementation of the present invention. All equivalent changes and modifications based on the shape, structure, features and spirit described in the patent application scope of the present invention should be included in the patent application scope of the present invention.

10: Detection circuit 12: Probe module 122: First probe element 124: Second probe element 14: Power measurement unit 16: Switch module 18: Impedance unit 20: Processing unit 22: Sensing unit C1: First circuit C2: Second circuit DET: Detection control signal FB: Feedback signal GND: Ground terminal P: Test power PCB: Circuit element to be tested SEN: Sense signal SGND: System ground level SW: Switching control signal TH1: Threshold value V _S : Voltage detection signal V _S1 : First test voltage V _S2 : Second test voltage

Figure 1: It is a system schematic diagram of an embodiment of the present invention; Figure 2: It is a schematic diagram of an open circuit of a switch module of an embodiment of the present invention; Figure 3: It is a schematic diagram of a conduction of a switch module of an embodiment of the present invention; Figure 4: It is a signal curve diagram of a normal state of an embodiment of the present invention; and Figure 5: It is a signal curve diagram of an abnormal state of an embodiment of the present invention.

10: Detection circuit

12: Probe module

122: First probe element

124: Second probe element

14: Power measurement unit

16: Switch module

18: Impedance unit

20: Processing unit

22: Sensing unit

C1: First circuit

C2: Second circuit

FB: Feedback signal

GND: Ground terminal

P: Test power supply

PCB: Circuit components to be tested

SEN: Sensing signal

SW: Switching control signal

Claims (8)

A detection circuit is used for detecting a circuit element to be tested, and the detection circuit comprises: a probe module; a power measurement unit, which is respectively coupled to the probe module and a ground terminal; a switch module, which is respectively coupled to the probe module and the power measurement unit; and an impedance element, a first end of which is coupled to the probe module, and a second end of which is coupled to the power measurement unit and the ground terminal; wherein, when the switch module conducts the probe module and the power measurement unit and forms a loop with the circuit element to be tested, the power measurement unit provides a test power supply, which is supplied to the circuit element to be tested through the probe module and generates a first test voltage accordingly. A detection circuit as described in claim 1, wherein when a circuit impedance value of the circuit element to be tested is less than a preset impedance value of the power measurement unit, the power measurement unit switches the test power to a current source, supplies power to the circuit element to be tested through the probe module, and generates a second test voltage accordingly. A detection circuit as described in claim 2, wherein there is a difference between a first test impedance value corresponding to the test power source and a second test impedance value of the impedance element, and the difference corresponds to an electrical insulation strength of the circuit element to be tested. A detection circuit as described in claim 4, wherein the difference is between 100 ohms and 10k ohms. A detection circuit as described in claim 2, wherein the current source is a constant current, and the constant current is a constant value between 1 mA and 30 mA. The detection circuit as described in claim 1 further includes a processing unit coupled to the probe module, and the processing unit is used to determine that when the first test voltage exceeds a threshold value, the first test voltage corresponds to a normal state of the circuit element to be tested. A detection circuit as described in claim 1, wherein the circuit element to be tested includes a first circuit and a second circuit, and the probe module includes a first probe element and a second probe element. When the first probe element and the second probe element are coupled to the first circuit and the second circuit respectively, and the switch module is turned on, the probe module, the power measurement unit, the impedance element and the circuit element to be tested form the loop. A detection circuit as described in claim 1, wherein the first test voltage is a preset voltage setting.

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