KR101013243B1 - Circuit pattern inspection device and circuit pattern inspection method - Google Patents

Circuit pattern inspection device and circuit pattern inspection method Download PDF

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Publication number
KR101013243B1
KR101013243B1 KR1020057009601A KR20057009601A KR101013243B1 KR 101013243 B1 KR101013243 B1 KR 101013243B1 KR 1020057009601 A KR1020057009601 A KR 1020057009601A KR 20057009601 A KR20057009601 A KR 20057009601A KR 101013243 B1 KR101013243 B1 KR 101013243B1
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South Korea
Prior art keywords
inspection
pattern
detection
electrode
supply
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KR1020057009601A
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Korean (ko)
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KR20050084001A (en
Inventor
슈우지 야마오까
쇼고 이시오까
히로시 하모리
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오에이치티 가부시끼가이샤
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Priority to JP2002382813 priority Critical
Priority to JPJP-P-2002-00382813 priority
Application filed by 오에이치티 가부시끼가이샤 filed Critical 오에이치티 가부시끼가이샤
Priority to JP2003436043A priority patent/JP3978178B2/en
Priority to JPJP-P-2003-00436043 priority
Publication of KR20050084001A publication Critical patent/KR20050084001A/en
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Publication of KR101013243B1 publication Critical patent/KR101013243B1/en

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806Apparatus therefor, e.g. test stations, drivers, analysers, conveyors

Abstract

Provided is a circuit inspection apparatus capable of reliably and easily detecting a defect in a circuit board.
The inspection signal supply electrode 35 and the inspection signal detection sensor electrode 25 while maintaining the state spaced apart from the pattern by a predetermined distance at both ends of the inspection object pattern 15 when inspecting the inspection object pattern having at least end portions arranged in a column shape. Is moved across the pattern, and the detection signal supplied to the inspection object pattern 15 by capacitive coupling from the supply electrode 35 is detected with the sensor electrode capacitively coupled with the inspection object pattern in the same manner, so that the detection signal is predetermined. If it is lower than the range, it is determined that the pattern is disconnected and the detected signal value is larger than the predetermined range.
Figure R1020057009601
Inspection signal supply electrode, inspection target pattern, circuit inspection device

Description

Circuit pattern inspection device and circuit pattern inspection method {CIRCUIT PATTERN INSPECTION DEVICE AND CIRCUIT PATTERN INSPECTION METHOD}
The present invention relates to a circuit pattern inspection apparatus and a circuit pattern inspection method capable of inspecting a defect of a conductive pattern formed on a substrate.
When manufacturing the circuit board which forms a conductive pattern on a board | substrate, it was necessary to test whether the conductive pattern formed on the board | substrate did not have a disconnection or a short circuit.
Conventionally, as an inspection method of a conductive pattern, a pin is made to contact both ends of a conductive pattern like patent document 1, and an electric signal is supplied from a pin of one end side to a conductive pattern, and the electrical signal from the pin of the other end side, for example. The contact inspection method (pin contact method) which conducts the conduction test of a conductive pattern, etc. by the electric power demand is known. The power supply of the electrical signal is performed by placing a metal probe in the entire terminal and flowing a current therefrom in a conductive pattern.
This pin contact method has the advantage that the S / N ratio is high in order to directly contact the pin probe.
However, in recent years, the wiring pitch for connection is also refine | miniaturized by densification of a conductive pattern, and what has become less than 50 micrometers has emerged. Narrow pitch Probe cards consisting of multiple probes are expensive to manufacture.
At the same time, it was necessary to make a new probe card according to the use of the wiring pattern (different test object). For this reason, inspection cost became high and it became a big obstacle to the low cost of an electronic component.
Further, the probe card is fragile due to its fine structure, and it has always been necessary to consider the risk of damage in practical use.
For this reason, the pin probe is directly contacted to one end of the conductor pattern to be inspected as shown in Patent Literature 2 to apply a test signal containing an alternating current component, and the probe at the other end is provided without contacting the conductor pattern. There has also been proposed a contact-non-contact combination method of positioning in a space separated state and detecting the test signal through capacitive coupling.
In this contact-non-contact combination method, since the probe of the other end of a pattern line does not need to make direct contact with a pattern like a pin probe, positioning precision can be made rough. In addition, since the non-contact portion can be common to a plurality of pattern lines, the number of probes can be reduced. Therefore, even if the space | interval of a conductive pattern is minute, it can respond.
Japanese Patent Laid-Open No. 62-269075
Japanese Patent Laid-Open No. 11-72524
However, in the above contact-non-contact combination method, the probes disposed at both ends of the conductive pattern, the detection signal processing from the probes, and the like are provided in accordance with the arrangement interval of the conductive patterns, so that the shape of the conductive pattern is one of a predetermined type. If the conductive patterns were different, the jig also needed to be manufactured according to the pattern.
Moreover, with the said contact-non-contact combined system, the one end part of the conductor pattern of the test object which directly contacts a pin probe is also refine | miniaturized, and it is difficult for a pin probe to contact. In addition, the risk of breaking the conductor pattern to be inspected by contacting the pin probe was also inevitable.
This invention is made | formed in order to solve the subject of the said prior art, Comprising: It is providing the test | inspection apparatus and the test method which can make a precise wiring pattern simple structure, and can respond to a change of wiring pattern. As one means of achieving such an object, for example, one embodiment of the invention according to the present invention has the following configuration.
That is, the inspection signal of the alternating current is supplied from one side of the inspection subject region of the inspection subject pattern in which the vicinity of both ends of the inspection subject region is formed in a column shape, and the signal from the inspection subject pattern is detected from the other side. A circuit pattern inspection device for inspecting the inspection target pattern, comprising: supply means having supply electrodes for supplying the inspection signal to the inspection object pattern from one side of the inspection object region of the inspection object pattern, and a signal from the inspection object pattern Detecting means having a detecting electrode for detecting a negative electrode; and moving means for moving across the column-shaped pattern portions near both ends of the inspected region while separating the supply electrode of the supply means and the detecting electrode of the detecting means from the inspected pattern. It characterized by having a.
For example, the inspection object pattern may be a conductive pattern formed in a substantially bar shape on a substrate with a predetermined width.
For example, the width of the detection electrode may be at least as wide as two columns of the inspection target pattern.
In addition, for example, the said detection means is a test | inspection by the said 1st detection electrode arrange | positioned in the other end position of the test | inspection pattern to which an inspection signal is supplied by the said supply electrode in one end position, and the said supply electrode in one end position. It is characterized by including the 2nd detection electrode arrange | positioned in the other end position of the test object pattern adjacent to the test object pattern to which a signal is supplied.
In addition, for example, the width of the first detection electrode may be equal to or less than the pattern width of the inspection target pattern.
For example, the width of the second detection electrode may be equal to or less than the pattern width of the inspection target pattern.
Further, for example, the moving means moves across the column-shaped portions near both ends of the inspection subject region in a state in which the supply electrode surface of the supply means and the detection electrode surface of the detection means are capacitively coupled with the inspection object pattern. It is characterized by.
Further, for example, if the inspection target pattern is normal when the detection result by the detection means is in a predetermined range, the determination means for determining that the inspection target pattern is defective when the detection result is out of the predetermined range is provided. It features.
Further, for example, the supply electrode of the supply means and the detection electrode of the detection means are moved to both ends of the inspection target pattern in which the determination means is judged to be defective, and the supply electrode of the supply means or the detection electrode of the detection means is And a second moving means for moving either one along the pattern toward the other and a position detecting means for detecting the detected change position based on the detection result of the detecting means.
Further, for example, a contact means for contacting the test target pattern with the other of the supply electrode of the supply means or the detection electrode of the detection means is provided.
Further, for example, at least one of the supply electrode and the detection electrode that is moved by the second moving means is provided with an imaging means.
Or a separation control means for positioning control so that the distance between at least one of the supply electrode and the detection electrode moved by the second moving means and the inspection target pattern becomes substantially constant.
And a separation distance control means for positioning control such that at least one of the supply electrode and the detection electrode moved by the moving means and the inspection object pattern become substantially constant, for example. .
Further, for example, the separation processing control means includes a displacement meter that moves together with the detection electrode or the supply electrode at a position near the detection electrode or the supply electrode, and the detection electrode or the supply electrode is in accordance with a detection result of the displacement meter. Positioning control is carried out in the direction orthogonal to the said inspection object so that the separation distance of an inspection object may become substantially constant.
Further, for example, the separation processing control means orthogonal to the inspection object by making the average displacement of the detection result of the displacement meter between the plurality of pitches of the inspection object pattern as the separation distance between the detection electrode or the supply electrode and the inspection object. And positioning control in the direction.
Further, for example, supply means having a supply electrode for supplying a test signal to the test target pattern from one side of the test target region of the test target pattern in which the vicinity of both ends of the test target region is formed in a column shape, and the test target pattern. A pattern inspection method in a circuit pattern inspection apparatus having a detection means having a detection electrode for detecting a signal from the device, wherein the supply electrode of the supply means and the detection electrode of the detection means are supplied with the supply electrode surface of the supply means and the detection. The supply electrode and the detection electrode and the inspection target pattern are moved across the columnar pattern portions near both ends of the inspection target region while keeping the detection electrode surface of the means spaced apart from the inspection target pattern surface, and the inspection An inspection signal of alternating current is A circuit pattern inspection method characterized by supplying and detecting a signal from the inspection object pattern from the other side and inspecting the inspection object pattern.
In addition, for example, the circuit pattern is characterized in that the conductive pattern formed in a substantially bar shape with a predetermined width on the substrate.
For example, the width of the detection electrode is at least as wide as two columns of the inspection target pattern, and a short circuit between adjacent conductive patterns is detected by detecting a signal from a conductive pattern adjacent to a conductive pattern supplying the inspection signal. It is characterized by making it possible to detect.
Further, for example, a signal from a conductive pattern supplying a test signal from the detection electrode is detected by the first detection electrode of the detection means to detect disconnection between the conductive patterns, and a test signal is detected from the detection electrode. A signal from a conductive pattern adjacent to the supplied conductive pattern is detected by the second detection electrode of the detecting means, so that a short circuit between adjacent conductive patterns can be inspected.
Further, for example, a rough disconnection site position of the conductive pattern is detected from a detection means position which is not detected by the detection means.
Further, for example, when the inspection target pattern is normal when the detection result by the detection means is in a predetermined range, it is determined that the inspection target pattern is defective when the detection result is out of the predetermined range.
Further, for example, the determination means identifies and holds the inspection target pattern position determined to be defective, and supplies supply electrodes of the supply means and detection electrodes of the detection means to both ends of the inspection target pattern determined to be the identified failure. It moves, and either one of the said supply electrode or the said detection electrode is moved along the pattern toward the other side, and a change position is made into the defective position of a test | inspection pattern based on the detection result of the said detection means.
Further, for example, any one of the supply electrode of the supply means or the detection electrode of the detection means is brought into contact with the inspection target pattern.
Moreover, for example, the imaging means provided in either one of the said supply electrode or the said detection electrode is moved along a pattern toward the other side, and it picks up the bad state of the bad position of the inspection object pattern, It is characterized by the above-mentioned.
For example, a displacement meter which moves together with the detection electrode or the supply electrode is disposed near the detection electrode or the supply electrode, and a distance between the detection electrode or the supply electrode and the inspection object is determined according to the detection result of the displacement meter. Positioning control is performed in a direction orthogonal to the inspection object so as to be substantially constant, and the result of the detection electrode is fixed.
Further, for example, positioning control with the inspection object is performed by setting the average displacement of the detection result of the displacement meter between the plurality of pitches of the inspection object pattern as the separation distance between the detection electrode or the supply electrode and the inspection object. It is a circuit pattern test method of Claim 25 to do.
BRIEF DESCRIPTION OF THE DRAWINGS It is a figure for demonstrating the pattern inspection principle of embodiment of one invention which concerns on this invention.
2 is a flowchart for explaining inspection control of the inspection apparatus which is an example of the present embodiment.
Fig. 3 is a diagram showing an example of a detection signal in the case where three short-circuit (short) of adjacent inspection target patterns in the inspection apparatus according to the present embodiment are shown.
Fig. 4 is a diagram showing an example of detection waveforms when one of the inspection target patterns in the inspection apparatus according to the embodiment is in a disconnected (open) state on the way.
Fig. 5 is a diagram showing the configuration of an inspection apparatus of a second embodiment example according to the present invention.
Fig. 6 is a diagram showing the configuration of an inspection apparatus of a third embodiment example according to the present invention.
FIG. 7 is a view for explaining electrode movement control in the inspection apparatus of the third embodiment. FIG.
8 is a flowchart for explaining a pattern failure site identification control in the third embodiment.
9 is a diagram illustrating an example of a bad pattern detection signal waveform at a sensor electrode in the apparatus of the third embodiment.
10 is a diagram illustrating an example of a detection signal waveform of a sensor electrode in a defective pattern.
It is a figure for demonstrating the structure of the inspection apparatus of the 4th Embodiment example which concerns on this invention.
EMBODIMENT OF THE INVENTION Hereinafter, with reference to drawings, embodiment of one invention which concerns on this invention is described in detail. The following description is given by taking an example of a circuit pattern inspection apparatus that inspects a defect of a dot matrix pattern before alignment in a dot matrix display panel forming a liquid crystal display panel as a pattern to be inspected.
However, the present invention is not limited to the examples described below, and is not limited as long as the test target pattern is formed at least in the vicinity of both ends of the test target region in a column shape.
[Example of Embodiment of First Invention]
BRIEF DESCRIPTION OF THE DRAWINGS It is a figure for demonstrating the pattern inspection principle of embodiment of one invention which concerns on this invention.
In FIG. 1, the code | symbol 10 is a board | substrate with which the electroconductive pattern which should be examined of the example of this embodiment is arrange | positioned, In this example, the glass substrate used for a liquid crystal display panel is used.
On the surface of the glass substrate 10, the conductive patterns 15 for forming the dot matrix display panel inspected by the circuit pattern inspection apparatus of the example of this embodiment are arranged in a columnar shape at regular intervals. In the conductive pattern example shown in FIG. 1, the widths of the patterns 15 are almost the same, and the pattern intervals are also substantially equally spaced. However, in the present embodiment, the inspection can be similarly performed even if the pattern intervals are not equal intervals.
Reference numeral 20 denotes a sensor unit, 30 an inspection signal supply unit, 50 an analog signal processing circuit that processes and outputs a detection signal from the sensor unit 20 to the control unit 60, and 60 denotes control of the entire inspection apparatus of this embodiment. The controller in charge, 70 is a robot controller for controlling the scalar robot 80, 80 is to position and hold the liquid crystal panel 10 at the inspection position and at the same time the sensor of the sensor unit 20 in accordance with the control of the robot controller 70 It is a scalar robot which scans so that the electrode and the supply electrode of the test | inspection signal supply part 30 may traverse all the connection terminals of the conductive pattern of the test target of the liquid crystal panel 10 in order.
In the example of this embodiment, the scalar robot 80 is comprised so that three-dimensional positioning is possible in order to position the inspection target board | substrate (liquid crystal panel) 10 in a predetermined | prescribed inspection position. Similarly, the three-dimensional positioning control is comprised so that the sensor part 20 and the test | inspection signal supply part 30 may move on a test | inspection pattern, maintaining the predetermined distance from the surface of the test | inspection board | substrate 10. FIG.
In the above description, the scalar robot 80 has described an example of moving the inspection target pattern image while maintaining the sensor unit 20 and the inspection signal supply unit 30 at a predetermined distance from the surface of the inspection target substrate 10. . However, the present embodiment is not limited to the above examples, and the sensor unit 20 and the inspection signal supply unit 30 are fixed, and the inspection target substrate 10 is connected to the sensor unit 20 and the inspection signal supply unit 30. You may control so that a board | substrate may be moved, maintaining the surface of the front-end | tip electrodes 25 and 35 at a predetermined distance. In this way, the same effect can be obtained.
In actual inspection control, when the pattern intervals are not equally spaced or when the pattern pitches at both ends are different, the movement distance of the sensor electrode 25 and the movement distance of the supply electrode 35 are synchronized with each other. It is necessary to control at least part of the sensor electrode 25 so that the supply electrode 35 is at the other end position of the pattern which is actually supplying the test signal. By controlling in this way, even if each pattern space | interval is not equal intervals or the pattern pitch of both ends differs, it can respond simply by controlling the movement speed of the positive electrode of a scalar robot.
The sensor electrode 25 and the supply electrode 35 are arrange | positioned at least at the front-end | tip surface of the sensor part 20 and the test signal supply part 30 which concern on the example of this embodiment. The sensor electrode 25 and the supply electrode 35 are made of metal, for example, copper (Cu) or gold (Au). Moreover, you may coat | cover each electrode with the insulating material for protection. For example, although a semiconductor may be used as an electrode, the reason why the electrode is formed of a metal is that the capacitance between the conductive pattern can be increased.
The inspection signal supply unit 30 is moved by the scalar robot 80 to traverse one terminal portion of the inspection target pattern, such as the liquid crystal panel 10, and supplies the inspection signal in turn through capacitive coupling to each inspection target pattern, It is preferable that the width of the supply electrode 35 of the tip portion is, for example, equal to or less than the pattern pitch of the inspection target pattern (the size of the pattern width and the pattern gap of the inspection pattern).
This means that when the width of the supply electrode 35 is larger than the pattern pitch of the inspection target pattern, when the sensor electrode 25 of the sensor unit 20 detects the inspection signal, the inspection signal from the inspection target pattern other than the inspection target pattern is detected. Because it will.
However, if the width of the supply electrode 35 does not necessarily have to be less than or equal to the pattern pitch of the inspection target pattern, and only a plurality of inspection target patterns and patterns adjacent to the pattern can be grasped, the inspection of the example of the embodiment described later will be described in detail. The inspection can be performed by the method.
The sensor unit 20 is moved by the scalar robot 80 to traverse one terminal portion of the inspection target pattern, such as the liquid crystal panel 10, and the like to the inspection signal supply unit 30 in turn through capacitive coupling to each inspection target pattern. It is preferable to detect the test signal supplied by the sensor, and the width of the sensor electrode 25 at the tip portion is preferably at least one pitch or more wider than the width of the supply electrode 35.
The detection signal from the sensor unit 20 is transferred to the analog signal processing circuit 50 for analog signal processing. The analog signal processed by the analog signal processing circuit 50 by the analog signal is transferred to the controller 60, and it is determined that the inspection target pattern that the inspection signal supply unit 30 of the liquid crystal panel 10 is in contact with is defective. The control unit 60 also controls to supply the test signal to the test signal supply unit 30.
The analog signal processing circuit 50 includes an amplifier 51 for amplifying a detection signal from the sensor unit 20 and a band pass filter for removing noise components of the detection signal amplified by the amplifier 51 and passing the detection signal ( 52, a rectifying circuit 53 for full-wave rectifying the signal from the band pass filter 52, and a smoothing circuit 54 for smoothing the detection signal subjected to full-wave rectification by the rectifying circuit 53. In addition, the rectifier circuit 53 for performing full-wave rectification and the smoothing circuit 54 for smoothing the detection signal are not necessarily provided.
The control part 60 is in charge of the control of the whole test | inspection apparatus of this embodiment, and the process progress of the ROM 62 and CPU61 which memorize | stores the control procedure of a computer (CPU) 61, CPU61, etc. It is supplied to the RAM 63 which temporarily stores information, a detection signal, etc., the A / D converter 64 which converts into the digital signal corresponding to the analog signal from the analog signal processing circuit 50, and the test signal supply part 30. A signal supply unit 65 for supplying an inspection signal to be performed is provided, and a display unit 66 for displaying an inspection result, operation instruction guidance, or the like.
The signal supply unit 65 generates, for example, a sinusoidal signal of 200 V AC or 200 V as a test signal and supplies it to the test signal supply unit 30. In this case, the band pass filter 52 is set as a band pass filter which passes 200 Hz which is this test signal. In addition, the test signal is not limited to the sine wave signal, and may be a rectangular wave or a pulse wave as long as it is an AC signal.
The inspection control of the conductive pattern of this embodiment example which has the above structure is demonstrated below with reference to the flowchart of FIG. 2 is a flowchart for explaining inspection control of the inspection apparatus according to the embodiment.
When the inspection is performed by the inspection apparatus of the example of this embodiment, the glass substrate on which the inspection target conductive pattern is formed is conveyed to the circuit pattern inspection apparatus position (work position) of the example of the present embodiment. For this reason, first, in step S1, the liquid crystal panel 10 which is a test object is set to a test | inspection apparatus. This may be set to the inspection apparatus by a conveyance robot (not shown) which has been automatically conveyed, or may be set directly by the operator. When the inspection object is set in the inspection apparatus, the control unit 60 starts the robot controller 70 to control the scalar robot 80, and positions the inspection object at the inspection position.
Subsequently, in step S3, the inspection signal supply unit 30 is provided at an initial position (an inspection target pattern position at the far end with a predetermined distance) on one end side of the inspection target pattern 15 of the inspection target (liquid crystal panel) 10. Positioning the supply electrode 35 and conveying the sensor electrode 25 of the sensor unit 20 to an initial position (an inspection target pattern position at the far end of a predetermined distance) of the other end side of the inspection target pattern. Determine your location.
In addition, in the example of this embodiment, the gap (distance between a test object pattern and an electrode) is maintained in the range of 100 micrometers-200 micrometers, for example. However, the gap is not limited to the above examples, and the gap in the present embodiment is determined according to the size of the inspection target pattern, and when the size of the pattern is large, the gap is widened, and when the size of the pattern is small, the gap is also narrowed. .
In addition, when the pattern size is very small, a coating is formed on the electrode surface with an insulating material so that the pattern and the electrode do not directly contact each other, and the sensor unit 20 or the test signal supply unit 30 is directly adhered to the substrate via the insulating material. By controlling the gap to be almost the thickness of the insulating material, the distance between the inspection target pattern and the electrode can be easily and accurately set to a constant distance.
As a result, even a very precise pattern can be obtained with a simple structure and easy and accurate inspection results.
In subsequent step S5, the signal supply unit 65 is instructed to start supplying the test signal to the supply electrode 35 of the test supply unit 30.
In step S7, the distance between the pattern and the electrode is kept constant, and the electrodes 20 and 35 of the sensor unit 20 and the test signal supply unit 30 are synchronized to cross the test target pattern. In addition, a control for moving while controlling to keep the separation distance from the inspection target pattern surface constant is disclosed. Thereby, the sensor electrode 25 detects the signal potential from the inspection object pattern to which the inspection signal was supplied by capacitive coupling with the supply electrode 35.
That is, when the supply electrode 35 is at the position of the pattern to which the test signal is supplied, at least some of the sensor electrodes 25 are all at the other end position of the test target pattern to which the test signal is supplied. While 35) moves one pitch of the inspection target pattern at one end, the sensor electrode 25 at the other end is also controlled to move by one pitch of the inspection target pattern.
For this reason, in step S10, the signal processing circuit 50 is activated to control the detection signal from the sensor electrode 25 to be output to the control unit 60. In the signal processing circuit 50, as described above, the detection signal from the sensor electrode 25 of the sensor unit 20 is amplified to the required level by the amplifier 51, and the detection signal amplified by the amplifier 51 is inspected. It passes to the band pass filter 52 which passes the signal of the signal frequency, removes a noise component, and then, the signal from the band pass filter 52 is full-wave rectified by the rectifier circuit 53, and the full-wave rectified detection signal is returned. Smoothing is performed by the smoothing circuit 54 and transferred to the A / D converter 64 of the controller 60.
The CPU 61 starts the A / D converter 64 to convert it into a digital signal corresponding to the input analog signal, and reads the detection signal detected by the sensor electrode 25 as a digital value.
In the following step S12, the CPU 61 transfers the read detection signal to the RAM 63. The RAM 63 sequentially stores the transferred detection signal. The read detection signal includes a detection signal from a normal inspection target pattern, a detection signal from a disconnected inspection target pattern, or an entire detection signal from an adjacent inspection target pattern shorted to the inspection target pattern.
In step S14, it is determined whether the inspection of the inspection target pattern has ended, for example, whether the sensor electrode 25 has moved to a position beyond the last pattern of the inspection target pattern (the inspection of the inspection target pattern ends) To see if they are successful).
When the inspection is finished only up to the middle of the inspection target pattern, the flow advances to step S16 to continue scanning of the electrode and supply the inspection signal to the next pattern. The process then returns to Step S10 to continue the readout process.
On the other hand, in step S14, when the inspection about all the inspection target patterns is complete | finished, it progresses to step S20 and instructs the signal supply part 65 to stop supply of a test | inspection signal, and the signal processing circuit 50, A The operation of the / D conversion unit 64 is stopped.
Finally, in step S22, the inspection object is moved away from the inspection position, positioning is carried to the next conveyance position, and necessary post-processing is performed.
By controlling as mentioned above, both of the sensor electrode 25 and the supply electrode 35 can test | inspect a pattern, without contacting a test target pattern or the like at all. For this reason, even if the board | substrate with a small intensity | strength of the inspection object pattern is examined, inspection can be performed without causing a problem, such as damaging an inspection object pattern.
For this reason, even the glass substrate for liquid crystal display panels used for the liquid crystal display panel for small mobile phones which cannot fully acquire pattern strength can be reliably examined, without damaging a wiring pattern.
In addition, in the inspection control of the conductive pattern of the embodiment, the AC sine wave signal, which is a continuous signal from the supply electrode 35, is moved from the supply electrode 35 to the inspection object pattern while moving the sensor electrode 25 and the supply electrode 35 to cross the inspection object pattern. Since the supply potential and the signal potential from the inspection object pattern are detected by the sensor electrode 25, the detection signal which is the signal potential obtained from the sensor electrode 25 is detected as a continuous detection signal value which is somewhat constant.
For this reason, when there is a defective inspection target pattern of open (disconnected inspection target pattern) or short (neighbor inspection target pattern and short inspection inspection pattern) among the plurality of inspection target patterns provided on the inspection target substrate, the opening or the short A numerical difference arises between the continuous detection signal value which is somewhat constant detected in the continuous range of a normal inspection object pattern which is absent, and the detection signal value of the defect detected in the defective inspection object pattern position which has an open or a short.
As described above, since a detection signal value of a defect due to an open or a short is shown as a numerical difference, that is, a change in a numerical value, the detection signal detection result is described later in detail with reference to FIG. 3 and FIG. By setting the graph as shown in Fig. 4, it is possible to easily determine the defect of the inspection target substrate and to specify the defect inspection target pattern position with open or short.
In addition, to some extent, the gap between the sensor electrode 25 and the inspection target pattern or the supply electrode 35 and the inspection target pattern that changes each time when the inspection apparatus inspects the substrate to be inspected in turn is changed. The constant continuous detection signal value becomes a different value as an absolute value each time the inspection target substrate is changed.
However, the determination of the defect of the inspection target substrate by the inspection control of the conductive pattern of the present embodiment and the specification of the defect inspection target pattern position with the open or the short are caused by the defects caused by the opening or the short appearing in the continuous detection signal values to some extent constant. It is possible to use the numerical difference of the detection signal values, that is, the change in the relative numerical value of the detection signal.
For this reason, relative values, such as the ratio of the detection signal value of the defect to the continuous detection signal value, the ratio of the change of the detection signal value of the defect, and the like to the threshold value for determination of a defect or the position of a defect can be utilized, and are fixed to some extent as an absolute value. Even if the inspection device does not use the continuous detection signal value, even if the inspection apparatus inspects the inspection target substrates in turn, it is possible to reliably determine the defect and to specify the defect position.
In addition, the inspection control of the conductive pattern of the example of this embodiment is not limited to the above example, It detects whether the detection signal read in step S12 is within the threshold value range by the said relative value between step S12 and step S14, and a detection result. If is within the threshold range, the process proceeds to step S14. If it is not within the threshold range, the step of storing the position or state of the inspection target pattern is determined by determining that the inspection target pattern supplying the inspection signal is an open or shorted defective inspection target pattern. You may provide.
3 and 4 show the test signal detection results by the sensor electrode 25 under the above control. Fig. 3 is a diagram showing an example of test signal detection when three places of the test target pattern in the test apparatus of this embodiment are disconnected (opened), and Fig. 4 is a test target pattern in this embodiment example. It is a figure which shows the example of test signal detection in the case of short-circuiting (short) in the middle.
When the test target pattern is normal, the test signal (AC signal) supplied to the supply electrode 35 from the signal supply unit 65 is supplied to the test target pattern which is capacitively coupled to the sensor electrode 25 via the test target pattern. It reaches the lower part and is detected by the sensor electrode 25 by capacitive coupling with the sensor electrode 25, and is output to the control part 60.
In this way, since the supply electrode 35 and the sensor electrode 25 supply and detect the inspection signal (alternating signal) while crossing the inspection object pattern, the detection signal is continuously detected as a detection signal value which is somewhat constant.
When at least a part of the inspection target pattern is disconnected, at least a part of the inspection signal (AC power) supplied from the signal supply unit 65 to the supply electrode 35 is connected to the sensor electrode 25 by the disconnection portion of the inspection target pattern. Since it does not reach, the detection signal value becomes small. For this reason, as shown in FIG. 3, the detection signal value of the disconnected test | inspection target pattern part becomes small compared with the continuous constant value detected from a normal test target pattern.
On the other hand, when the inspection target pattern is short-circuited with the adjacent inspection target pattern, the inspection signal (AC power) supplied from the signal supply unit 65 to the supply electrode 35 is adjacent inspection through the short circuit with the adjacent inspection target pattern. Since it also flows in the target pattern, the detection signal from the sensor electrode 25 overlaps with the detection signal of the adjacent inspection target pattern, and the detection signal value becomes large. For this reason, as shown in FIG. 4, the detection signal value of the shorted test | inspection pattern site | part is large compared with the continuous constant value detected from a normal test subject pattern.
The disconnection and short-circuit of the detection target pattern as described above can be performed with one sensor electrode 25 so that the width of the sensor electrode 25 is set at least one pitch wider than the width of the supply electrode 35. Because there is.
However, the width of the sensor electrode 25 does not necessarily have to be one pitch or more of the inspection target pattern than the width of the supply electrode 35, and inspection of the disconnected inspection target pattern or the inspection target pattern shorted with the neighboring inspection target pattern. As long as a pattern can be inspected, it is good also as a structure of the example of 2nd Embodiment which mentions detail later.
At this time, if a threshold value is set within a certain range of continuous detection signal values that are fixed to some extent as absolute values, disconnection of the inspection target pattern when the detection signal value is smaller than the threshold value, and inspection target pattern when the detection signal value is larger than the threshold value. It can be determined that the short is. For example, in FIG. 3, when the threshold value is 0.02 Vpp with respect to 0.60 Vpp of continuous detection signal which is somewhat constant, the inspection at the position of the sensor movement distance of about 22 mm, 42 mm, and 78 mm which is 0.58 Vpp or less It is determined that the target pattern is disconnected.
Further, for example, continuous values are used by using a relative value such as a ratio of a defective detection signal value to a continuous detection signal value or a ratio of a change of a defective detection signal value to a threshold value for determining a failure or specifying a defective position. When the detection signal value is lowered by 3% or more, disconnection of the inspection object pattern and when the continuous detection signal value is increased by 3% or more can be determined to be a short circuit of the inspection object pattern.
As described above, in the present embodiment, it is possible to use the absolute value as the threshold for the failure determination of the pattern, as well as the ratio of the relative change of the detection signal value of the defective pattern to the detection signal value of the normal pattern as the threshold value. Even if inspection is performed while switching the inspection target substrate, the most appropriate threshold value can be set according to the detection result, and even if the detection signal value fluctuates from inspection to inspection, even if the detection signal value is low, these effects can be completely prevented, so that accurate inspection You get results.
In this way, since both the sensor portion and the inspection signal supply portion are non-contact, even in the inspection method in which the detection signal value is very small, the difference can be reliably recognized by using the inspection apparatus of the present embodiment, and the inspection of the pattern state is easy and reliable. Can be done.
For this reason, compared with the conventional method of determining defect by making the absolute value of a detection signal value into a threshold value, the defect of a pattern can be detected very accurately and easily. Moreover, since it is non-contact, accurate positioning precision is unnecessary, and even the board | substrate with a very fine pattern pitch of an inspection can be inspected with high precision.
[Example of Embodiment 2 of the Invention]
In the above description, at least part of the sensor electrode 25 has been described to control the supply electrode 35 to be at the other end position of the pattern which is actually supplying the test signal. However, the present invention is not limited to the above examples, and for example, a plurality of sensor electrodes 25 are provided, and one of the plurality of sensor electrodes 25 is actually supplied with a test signal by the supply electrode 35. At least one other of the plurality of sensor electrodes 25 provided so as to be at the other end position of the pattern is disposed at the other end position of the pattern adjacent to the pattern where the supply electrode 35 is actually supplying the test signal. It is good also as a structure to install.
A second embodiment according to the present invention configured as described above will be described below with reference to FIG. 5. Fig. 5 is a diagram for explaining the configuration of an inspection device of a second embodiment example according to the present invention.
In Fig. 5, the same components as those shown in Fig. 1 of the above-described first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.
In FIG. 5, at least the front end surface of the sensor part 20 is provided with the 1st sensor electrode 22 and the 2nd sensor electrode 24. As shown in FIG. The first sensor electrode 22 and the second sensor electrode 24 are spaced apart by the pattern pitch of the inspection target pattern, and the first sensor electrode 22 actually supplies the inspection signal to the supply electrode 35. The second sensor electrode 24 is installed so as to be the other end position of the supply-demand inspection target pattern, and the other sensor adjacent to the adjacent inspection target pattern adjacent to the supply-reception inspection target pattern to which the supply electrode 35 is actually supplying the inspection signal. It is provided in the state offset in the edge position.
It is preferable that the width | variety of these 1st sensor electrode 22 and the 2nd sensor electrode 24 shall be below the pattern width of the inspection object pattern. The first sensor electrode 22 performs the inspection of the disconnection of the supply-demand inspection target pattern, and the second sensor electrode 24 performs the inspection of the short-circuit between the supply-demand inspection target pattern and the adjacent inspection target pattern. Because it is realized.
Specifically, when the width of the first sensor electrode 22 is less than or equal to the pattern width of the inspection target pattern, the supply-demand inspection target pattern is disconnected, and even if the supply-demand inspection target pattern and the adjacent inspection target pattern are short-circuited, the first sensor electrode ( 22) becomes less susceptible to the detection signal from the inspection signal from the adjacent inspection object pattern flowing into the adjacent inspection object pattern through the short circuit from the supply-demand inspection object pattern. If the width of the second sensor electrode 24 is less than or equal to the pattern width of the inspection target pattern, there is no disconnection or short circuit in the inspection target pattern, or the supply-demand inspection target pattern has no disconnection, but the supply-demand inspection target pattern and the adjacent inspection target pattern Even if this is short-circuited, the second sensor electrode 24 is less likely to be affected by the inspection signal from the supply-demand inspection target pattern.
Thus, the inspection of the disconnection and short circuit by the 1st sensor electrode 22 and the 2nd sensor electrode 24 is highly accurate, even if there exists the disconnection of the supply-demand inspection pattern and the presence or absence of the short circuit of the adjacent inspection object pattern. High inspection can be realized.
However, it is apparent by the sensor electrode 25 in the first embodiment that the widths of the first sensor electrode 22 and the second sensor electrode 24 do not necessarily have to be less than or equal to the pattern width of the inspection target pattern. .
In the second embodiment described in detail above, the offset sensor electrode has been described as the second sensor electrode 24, but the second adjacent inspection adjacent to the adjacent inspection target pattern adjacent to the supply-demand inspection target pattern is adjacent. By providing the 3rd sensor electrode which detects the test signal from a target pattern, it is also possible to test simultaneously the short circuit with two adjacent test target patterns adjacent to both sides of the power demand test target pattern.
In addition, the sensor electrode provided in the sensor part 20 does not have a problem even if only the 1st sensor electrode 22 or the 2nd sensor electrode 24 is sufficient, Of course, you may provide three or more offset sensor electrodes.
[Example of Embodiment of Third Invention]
The above description has described an example in which the defective pattern is detected by moving the sensor electrode 25 and the supply electrode 35 to cross the ends of the inspection target pattern. However, the present invention is not limited to the above example, and for example, one of the sensor electrode 25 or the supply electrode 35 is configured to be movable control along the inspection target pattern, and the defective pattern is specified by the above-described control. Later, the two electrodes are positioned at the defective pattern position, and one electrode is moved on the pattern along the defective pattern, the detection signal value at the sensor electrode 25 is read, and the change position of the detection signal value is detected to detect the pattern defect occurrence site. It may be configured so as to be specific.
A third embodiment according to the present invention configured as described above will be described below with reference to FIGS. 6 to 10. Fig. 6 is a test apparatus of a third embodiment example according to the present invention, Fig. 7 is a view for explaining electrode movement control in the test apparatus according to the third embodiment example according to the present invention. Fig. 8 is a pattern of the third embodiment example. 9 is a flowchart for explaining a failure site identification control, FIG. 9 is a diagram showing an example of a failure pattern detection signal waveform in the sensor electrode 25 in the apparatus of the third embodiment, and FIG. 10 is a sensor electrode in the failure pattern. It is a figure which shows the example of the detection signal waveform of (25).
In Fig. 6, the same components as those shown in Fig. 1 of the above-described first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.
In FIG. 6, a camera 26 is attached to the detection unit 20. This camera 26 is connected to the display part 66 of the control part 60, for example, in order to display the picked-up image, and is used for observing the fault occurrence state of a pattern fault occurrence site | part. In addition, the test signal supply unit 30 is provided with probe contacting means 32 provided with a test signal supply probe for supplying a test signal. The probe contact means 32 and the test signal supply probe are used to reliably specify the pattern defect occurrence site.
In the second embodiment, the scalar robot is configured to be capable of movement control not only in the direction of the arrow in FIG. 1 but also in the pattern length direction in FIG.
Then, inspection control shown in Fig. 2 of the first embodiment described above is performed to check whether or not the inspection target pattern is defective. As a result of the inspection, for example, the inspection object pattern position is held in the RAM 63 or the like with respect to the inspection object pattern that has become a pattern break.
In this way, when a bad pattern is detected and a bad pattern position is specified, the process moves to a bad site specifying process. In the defective part specifying process of the example of the second embodiment, as shown by 1 in FIG. 7, the supply electrode 35 and the sensor electrode 25 are first synchronized to move to the pattern position determined as defective.
Subsequently, as shown by (2) in FIG. 7, the inspection signal is sequentially read while moving the sensor electrode 25 from the pattern end toward the other end, and the position at which the read signal changes abruptly (the detection signal is detected or disappeared). Or a position that changes to a low level), and specifies the position as a pattern defect site.
Hereinafter, with reference to the flowchart of FIG. 8, it demonstrates in detail. In the second embodiment, following the processing in step S14 in the above-described first embodiment, the detection signal stored in the RAM 63 is checked to check whether a bad pattern is detected, and the bad pattern is detected. If not, the process proceeds to step S20.
On the other hand, when a bad pattern is detected as a result of the inspection, the signal supply unit 65 is erased, and at the same time as the step S3, the electrode is positioned at the initial position, and the process shifts to the processing shown in FIG. Then, after the processing shown in FIG. 8 is completed, the process may be shifted to the process of Step S20.
In the third embodiment, first, as shown in step S31 of FIG. 8, the defective pattern position detected by the processing of steps S1 to S16 shown in FIG. 2 is specified. For example, FIG. 9 shows a detection signal waveform when some patterns are disconnected. In the example shown in FIG. 9, the signal before performing the signal processing in the analog signal processing circuit 50 is shown. The rounded portion is a signal waveform detected as the pattern is opened (when two patterns are disconnected).
Subsequently, in step S33, the robot controller 70 is started, and the scalar robot 80 is controlled to move the sensor electrode 25 and the supply electrode 35 to the defective pattern position while synchronizing with each other. At this time, in order to perform detection at high sensitivity, positioning is performed so that the center of the width direction of the sensor electrode 25 and the supply electrode 35 is located at the substantially center position in the width direction of the defective pattern ( Control).
Subsequently, the process proceeds to step S35 to activate the signal supply unit 65 and apply an inspection signal to the supply electrode 35 to supply the inspection signal to the defective pattern. Then, the robot controller 70 is started to move the sensor electrode 25 in the direction of the supply electrode 35 along the pattern (control of 2 in FIG. 7).
At the same time, the detection signal from the sensor electrode 25 is read as shown in step S40. In step S42, it is checked whether or not the detection signal value from the sensor electrode 25 has changed significantly. If it does not change significantly, it returns to step S37 and the movement of the sensor electrode 25 is continued.
On the other hand, when the detection signal value from the sensor electrode 25 is largely changed in step S42, it progresses to the change step S44, and the position where the detection signal from the sensor electrode 25 started to change greatly, and the position where big change disappeared are calculated | required, The intermediate position of these positions is specified as a pattern defect site | part.
10 shows an example of a detection signal waveform in the sensor electrode 25. As shown in Fig. 10, the detection signal supplied by the supply electrode 35 does not reach the sensor electrode 25 and the detection signal value is low until the disconnection site. However, if the inspection signal supplied exceeds the disconnection site, the inspection signal supplied reaches the detection. The signal value rises. For example, since it was said that the intermediate position of the position where the detection signal from the sensor electrode 25 started to change largely, and the position where the large change disappeared was specified as a pattern defect site | part, the place about halfway of this inclination part is a defective site of a pattern. It is specified as
In addition, although the above description moved the sensor electrode 25 to the supply electrode direction, you may move the supply electrode 35 instead of the sensor electrode 25 to the sensor electrode 25 direction.
As described above, according to the third embodiment, similarly to the first embodiment described above, the defect inspection of the pattern at high precision can be carried out non-contact, and the defect is simply caused by moving and controlling the sensor electrode in two directions of XY. The specific defect site can also be identified without remaining in the inspection of whether there is a pattern. For this reason, for example, repair of a defective site can also be carried out in a short time as needed.
In addition, in the above-mentioned repair of the defective site, in order to determine whether repair is possible, it is preferable that the defective occurrence state of the pattern defective site can be observed. For example, if it is known that dust or the like is only attached to the site where the pattern defect has occurred, it can be determined that the repair can be performed on the spot, and if it is a fatal defect, the repair cannot be performed. The camera 26 attached to the detection part 20 is used for observing the failure occurrence state of this pattern failure occurrence site | part. Since this camera 26 is attached to the detection part 20, photography of the camera 26 is started in said step S35, photography is continued while step S40 and step S42 are performed, and the pattern defect in step S42 is carried out. Continue shooting until after the site is identified. The image of the pattern defect occurrence region photographed as described above is displayed on the display unit 66 during the subsequent shooting and after the specification of the pattern defect occurrence region, and used to observe the defect occurrence state of the pattern defect occurrence region.
In addition, the state of the defective part of a pattern may vary from the state which is completely disconnected or short-circuited, to the state of the some short circuit by the attachment of some disconnection or dust. In the state of some disconnection or some short circuit, the detection signal waveform shown in FIG. 10 may not be obtained in the non-contact inspection of both the sensor electrode 25 and the supply electrode 35. In such a case, the probe contact means 32 is operated to bring the test signal supply probe into contact with one end of the defective pattern, and then the sensor electrode 25 is moved along the defective pattern. can do.
In addition, using a sensor probe of a contact type instead of the sensor electrode 25 at the other end of the defective pattern, the sensor probe is brought into contact with the other end and the non-contact supply electrode 35 is connected to the other end of the defective pattern. You may move to a sensor probe direction.
[Example of Embodiment 4 of the Invention]
In the above description, an example in which two-dimensional control of the movement of the sensor electrode 25 and the supply electrode 35 by the scalar robot 80 is mainly performed in the X-Y direction has been described. This is because the inspection target substrate is a liquid crystal panel, and the smoothness is high with the glass substrate. In the case of inspecting a substrate having a large pattern thickness, a large inspection substrate, or an uneven surface, the control is configured not only in the above two-dimensional control but also in the vertical direction (Z direction), and even if the inspection target substrate has irregularities. It may be configured to obtain good or test results.
A third embodiment according to the present invention configured to control not only two-dimensional control but also up and down direction (Z direction) will be described below with reference to FIG. It is a figure for demonstrating the structure of the inspection apparatus of the 3rd Embodiment example which concerns on this invention. In Fig. 11, the same components as those shown in Fig. 1 of the first embodiment described above are denoted by the same reference numerals, and detailed description thereof will be omitted.
In Fig. 11, a laser displacement meter 28 is attached to the detection unit 20, and a laser displacement meter 38 is attached to the inspection signal supply unit 30, and the detection unit 20 is detected from the detection results from both displacement meters 28 and 38. And a distance measuring unit 90 for measuring the distance between the inspection signal supply unit 30 and the surface of the inspection target substrate.
In addition to the two-dimensional control of the detection unit 20 and the inspection signal supply unit 30, the scalar robot 80 is configured to be capable of positioning control in a direction (up and down direction) orthogonal to the drawing.
In the third embodiment having the above configuration, the distance measuring unit 90 activates the laser displacement meters 28 and 38 simultaneously with the movement of the electrode to measure the distance between each electrode and the surface of the inspection target substrate, and the measurement result. Is output to the control unit 60. In addition, the control unit 60 averages the measurement results of the measurement distances while the electrodes from the distance measuring unit 90 are moved by a certain distance, and controls the distance between the electrodes and the pattern so that the averaged distances are constant.
For example, the distance between an electrode and a board | substrate surface is controlled according to the average of the distance as much as three of a test object pattern.
The average of distances in this way is to prevent sudden Z-direction control to achieve smooth control and to reduce the effects of noise, measurement error, and the like.
Thus, Z direction control as well as X-Y direction is especially effective for the inspection of a large board | substrate. For example, in the inspection of the inspection target pattern on the surface of the large flat panel display panel, the curvature of the surface of the substrate cannot be avoided in any way, and even in such a case, the contact between the electrode and the pattern can be effectively prevented.
In addition, when the thickness of a pattern is thick, what is necessary is just to narrow the range of the measurement distance to average, and to enable high sensitivity detection.
As described above, according to the present invention, it is possible to reliably detect the defect of the inspection target pattern.
In addition, it is possible to easily recognize a pattern failure situation, and to specify a specific failure site.
Moreover, even if there is an unevenness | corrugation on the test object surface, it can reliably test without damaging a pattern.

Claims (26)

  1. Both ends of the inspection subject region are supplied with an alternating inspection signal from one end side of the inspection subject region of the inspection subject pattern, which is formed in a columnar shape, and detects a signal from the inspection subject pattern from the other end side. Circuit pattern inspection device for inspecting the target pattern,
    Supply means having a supply electrode for supplying the inspection signal to the inspection object pattern from one end side of the inspection object region of the inspection object pattern;
    Detection means having a detection electrode for detecting a signal from the inspection target pattern;
    And a moving means for moving the supply electrode of the supply means and the detection electrode of the detection means from across the column-shaped pattern portions of both ends of the inspection object region while being spaced apart from the inspection object pattern.
  2. The circuit pattern inspection apparatus according to claim 1, wherein the inspection target pattern is a conductive pattern formed in a rod shape with a predetermined width on a substrate.
  3. The circuit pattern inspection apparatus according to claim 1 or 2, wherein the width of the detection electrode is at least as wide as two columns of the inspection object pattern.
  4. The said detection means is a 1st detection electrode arrange | positioned at the other end position of the inspection object pattern to which an inspection signal is supplied by the said supply electrode in one end position, and at the one end position. And a second detection electrode arranged at the other end position of the inspection object pattern adjacent to the inspection object pattern to which the inspection signal is supplied by the supply electrode.
  5. The circuit pattern inspection apparatus according to claim 4, wherein the width of the first detection electrode is equal to or less than the pattern width of the inspection target pattern.
  6. The circuit pattern inspection apparatus according to claim 4, wherein the width of the second detection electrode is equal to or less than the pattern width of the inspection target pattern.
  7. The column-shaped portions of both ends of the inspection subject region according to claim 1 or 2, wherein the moving means has a capacitive coupling of the supply electrode surface of the supply means and the detection electrode surface of the detection means with the inspection object pattern. Circuit pattern inspection device, characterized in that moving across.
  8. The inspection object pattern according to claim 1 or 2, wherein the inspection object pattern is normal when the detection result by the detection means is within a predetermined range, and the inspection object pattern is determined to be defective when the detection result is out of the predetermined range. And a judging means.
  9. The supply electrode of the said supply means and the detection electrode of the said detection means are moved to the both ends of the test | inspection pattern which the said determination means judged to be defective, and among the supply electrodes of the said supply means or the detection electrode of the said detection means. And a second moving means for moving either one along the pattern toward the other, and a position detecting means for detecting the detected change position based on the detection result of the detecting means.
  10. The circuit pattern inspection apparatus according to claim 9, further comprising contact means for bringing the other of the supply electrode of the supply means or the detection electrode of the detection means into contact with the inspection object pattern.
  11. The circuit pattern inspection apparatus according to claim 9, wherein at least one of the supply electrode and the detection electrode moved by the second moving means is provided with an imaging means.
  12. 10. The apparatus according to claim 9, further comprising a separation control means for positioning control so that a distance between at least one of the supply electrode and the detection electrode moved by the second moving means and the inspection target pattern becomes constant. Circuit pattern inspection device.
  13. The separation distance control means of Claim 1 or 2 provided with the separation distance control means which carries out positioning control so that the separation distance of at least one of the said supply electrode and the said detection electrode moved by the said moving means and a test object pattern may become constant. Circuit pattern inspection apparatus characterized by the above-mentioned.
  14. The said space processing control means is equipped with the displacement meter which moves with the said detection electrode or the said supply electrode in the position near the said detection electrode or the supply electrode, The said detection electrode or the supply electrode according to the detection result of the said displacement meter. And positioning control in a direction orthogonal to the inspection object such that the separation distance between the inspection object and the inspection object becomes constant.
  15. The inspection target according to claim 14, wherein the separation processing control means sets the average displacement of the detection result of the displacement meter between a plurality of pitches of the inspection target pattern as a separation distance between the detection electrode or the supply electrode and the inspection object. And positioning control in a direction orthogonal to the circuit pattern inspection device.
  16. Supply means having a supply electrode for supplying a test signal to the test target pattern from one end side of the test target region of the test target pattern in which both ends of the test target region are formed in a column shape, and a signal from the test target pattern. It is a pattern inspection method in the circuit pattern inspection apparatus which has a detection means which has a detection electrode to detect,
    The supply electrode and the detection electrode while maintaining a state where the supply electrode of the supply means and the detection electrode of the detection means are spaced apart from the supply electrode surface of the supply means and the detection electrode surface of the detection means with the surface to be inspected; The inspection object pattern is moved across the columnar pattern portions of both ends of the inspection object area, and an inspection signal of AC is supplied from one end side of the inspection object area of the inspection object pattern and the inspection object is received from the other end side. And detecting the signal from the pattern to inspect the inspection target pattern.
  17. The method of claim 16, wherein the circuit pattern is a conductive pattern formed in a rod shape on a substrate at a predetermined width.
  18. 18. The method of claim 17, wherein the width of the detection electrode is at least as wide as two columns of the inspection target pattern, and a signal from a conductive pattern adjacent to a conductive pattern supplying the inspection signal is detected and between adjacent conductive patterns. The circuit pattern inspection method characterized by enabling detection of a short circuit.
  19. 18. The method according to claim 16 or 17, wherein the signal from the conductive pattern supplied with the inspection signal from the detection electrode is detected by the first detection electrode of the detection means, so that disconnection between the conductive patterns can be detected. A circuit pattern characterized by detecting a signal from a conductive pattern adjacent to a conductive pattern supplying a test signal from a detection electrode with a second detection electrode of the detection means, so that a short circuit between adjacent conductive patterns can be inspected. method of inspection.
  20. 19. The circuit pattern inspection method according to any one of claims 16 to 18, wherein a rough disconnection site position of the conductive pattern is detected from a detection means position which is not detected by the detection means.
  21. The test subject pattern according to any one of claims 16 to 18, wherein the test subject pattern is normal when the detection result by the detecting means is in a predetermined range, and the test subject pattern when the detection result is out of the predetermined range. The circuit pattern inspection method characterized in that it judges this defect.
  22. 22. The method according to claim 21, wherein the determination means identifies and holds the inspection target pattern position determined to be defective, and supplies supply electrodes of the supply means and detection electrodes of the detection means to both ends of the inspection target pattern determined as the identified failure. And the one of the supply electrode and the detection electrode is moved along the pattern toward the other side, and the change position is a defective position of the inspection target pattern based on the detection result of the detection means. Pattern inspection method.
  23. The circuit pattern inspection method according to claim 22, wherein the other of the supply electrode of the supply means or the detection electrode of the detection means is brought into contact with the inspection target pattern.
  24. 23. The circuit pattern according to claim 22, wherein the imaging means provided in one of the supply electrode and the detection electrode is moved along the pattern toward the other side, and the defective pattern of the defective position of the inspection target pattern is imaged. method of inspection.
  25. The displacement electrode which moves with the said detection electrode or a supply electrode near the said detection electrode or the said supply electrode, is arrange | positioned, and the said detection electrode or according to the detection result of the said displacement meter is in any one of Claims 16-18. And positioning the result in a direction orthogonal to the inspection object so that a distance between the supply electrode and the inspection object becomes constant, thereby uniforming the result of the detection electrode.
  26. The positioning control of the inspection target according to claim 25, wherein the average displacement of the detection result of the displacement meter between the plurality of pitches of the inspection target pattern is set as the separation distance between the detection electrode or the supply electrode and the inspection target. Circuit pattern inspection method, characterized in that.
KR1020057009601A 2002-11-30 2003-11-28 Circuit pattern inspection device and circuit pattern inspection method KR101013243B1 (en)

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