JP5290672B2 - Circuit board inspection equipment - Google Patents

Circuit board inspection equipment Download PDF

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JP5290672B2
JP5290672B2 JP2008230394A JP2008230394A JP5290672B2 JP 5290672 B2 JP5290672 B2 JP 5290672B2 JP 2008230394 A JP2008230394 A JP 2008230394A JP 2008230394 A JP2008230394 A JP 2008230394A JP 5290672 B2 JP5290672 B2 JP 5290672B2
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electrode plate
circuit board
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capacitance
inspection
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JP2010066031A (en
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英雄 松林
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Hioki EE Corp
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本発明は、回路基板における導体パターンの良否を検査する回路基板検査装置に関するものである。   The present invention relates to a circuit board inspection apparatus for inspecting the quality of a conductor pattern on a circuit board.

この種の回路基板検査装置として、特公平４−１７３９４号公報に開示された電気接続回路網のテスト装置（以下、「回路基板検査装置」ともいう）が知られている。この回路基板検査装置では、回路基板（回路板）の一方の面に形成されている複数の導体パターン（導体）の良否を検査する際に、電極板（導電プレート）を回路基板の他方の面側に配置して各導体パターンと電極板との間の静電容量を測定し、その静電容量が基準範囲内のときには導体パターンが良好であると判別し、基準範囲外のときには導体パターンが不良であると判別している。この場合、導体パターンに検査用信号を供給するプローブ機構と電極板との間には浮遊容量が存在するため、この浮遊容量によって静電容量の測定値が影響されることがある。このため、この種の回路基板検査装置では、一般的に、静電容量の測定前または測定後に上記した浮遊容量を測定して、静電容量の測定値を浮遊容量の測定値で補正している。
特公平４−１７３９４号公報（第７頁、第１図） As this type of circuit board inspection apparatus, an electrical connection circuit network test apparatus (hereinafter also referred to as “circuit board inspection apparatus”) disclosed in Japanese Patent Publication No. 4-17394 is known. In this circuit board inspection apparatus, when inspecting the quality of a plurality of conductor patterns (conductors) formed on one surface of a circuit board (circuit board), an electrode plate (conductive plate) is attached to the other surface of the circuit board. Measure the capacitance between each conductor pattern and the electrode plate, and determine that the conductor pattern is good when the capacitance is within the reference range. It is determined that it is defective. In this case, since a stray capacitance exists between the probe mechanism that supplies the inspection signal to the conductor pattern and the electrode plate, the measured capacitance value may be affected by the stray capacitance. For this reason, in this type of circuit board inspection apparatus, generally, the above-described stray capacitance is measured before or after the capacitance measurement, and the measured capacitance value is corrected by the measured stray capacitance value. Yes.
Japanese Examined Patent Publication No. 4-17394 (page 7, Fig. 1)

ところが、上記の回路基板検査装置を含む従来の回路基板検査装置には、改善すべき以下の課題がある。すなわち、この種の回路基板検査装置では、上記したように、プローブ機構と電極板との間の浮遊容量の測定値で静電容量の測定値を補正している。この場合、発明者は、プローブ機構と電極板との間の浮遊容量は、電極板に対するプローブ機構の位置によって異なることを見出した。具体的には、発明者は、図４に示すように、プローブ機構１１４が電極板１１２の中央部１１２ａの上方に位置して、プローブ機構１１４の全体が電極板１１２に対向しているときには、電極板１１２におけるいずれの位置においてもプローブ機構１１４と電極板１１２との間の浮遊容量の測定値が同じ値（ほぼ同じ値）となるのに対して、プローブ機構１１４が電極板１１２の縁部１１２ｂに位置して、プローブ機構１１４の一部または全部が電極板１１２に対向していないときには、浮遊容量の測定値が上記した値よりも小さな値となることを見出した。このため、電極板１１２の上に載置した回路基板における導体パターンが、電極板１１２の中央部１１２ａに位置しているときと、電極板１１２の縁部１１２ｂに位置しているときとでは、浮遊容量の測定値、つまり補正すべき値が異なることとなる。したがって、従来の回路基板検査装置では、回路基板における全ての導体パターンの近傍において浮遊容量を測定する必要があるため、検査効率の向上が困難であり、この点の改善が望まれている。   However, the conventional circuit board inspection apparatus including the circuit board inspection apparatus has the following problems to be improved. That is, in this type of circuit board inspection apparatus, as described above, the measured capacitance value is corrected with the measured floating capacitance value between the probe mechanism and the electrode plate. In this case, the inventors have found that the stray capacitance between the probe mechanism and the electrode plate varies depending on the position of the probe mechanism with respect to the electrode plate. Specifically, the inventor, as shown in FIG. 4, when the probe mechanism 114 is positioned above the central portion 112 a of the electrode plate 112 and the entire probe mechanism 114 faces the electrode plate 112, The measured value of the stray capacitance between the probe mechanism 114 and the electrode plate 112 is the same value (almost the same value) at any position on the electrode plate 112, whereas the probe mechanism 114 has an edge portion of the electrode plate 112. It has been found that when the probe mechanism 114 is not partly or entirely opposed to the electrode plate 112 located at 112b, the measured value of the stray capacitance is smaller than the above value. For this reason, when the conductor pattern on the circuit board placed on the electrode plate 112 is located at the central portion 112a of the electrode plate 112 and when it is located at the edge portion 112b of the electrode plate 112, The measured value of the stray capacitance, that is, the value to be corrected is different. Therefore, in the conventional circuit board inspection apparatus, since it is necessary to measure the stray capacitance in the vicinity of all the conductor patterns on the circuit board, it is difficult to improve the inspection efficiency, and improvement of this point is desired.

本発明は、かかる改善すべき課題に鑑みてなされたものであり、検査効率を向上し得る回路基板検査装置を提供することを主目的とする。   The present invention has been made in view of the problems to be improved, and a main object of the present invention is to provide a circuit board inspection apparatus capable of improving inspection efficiency.

上記目的を達成すべく請求項１記載の回路基板検査装置は、載置台と、回路基板を載置可能にされて当該載置台の上に配設される電極板と、当該電極板の上に載置された回路基板の導体パターンに接触させる検査用プローブを有するプローブ機構と、前記導体パターンに接触させた前記検査用プローブを介して当該導体パターンに検査用信号を供給したときに生じる物理量に基づいて当該各導体パターンと前記電極板との間の静電容量を測定すると共に当該電極板に近接させた当該検査用プローブに当該検査用信号を供給したときに生じる物理量に基づいて前記プローブ機構と前記電極板との間の浮遊容量を測定して当該浮遊容量の測定値に基づいて当該静電容量の測定値を補正する測定部とを備えて、前記補正後の静電容量の測定値に基づいて前記導体パターンの良否を検査する回路基板検査装置であって、前記電極板の中央部には、その領域内のいずれの位置に前記検査用プローブを近接させたときにも前記浮遊容量の測定値が同じ値となる載置領域が当該電極板の縁部側の領域と区別可能に設けられ、前記電極板は、前記載置領域の外周部に沿って配設されて前記回路基板の縁部を当接させて当該電極板に対して当該回路基板を位置決めさせる枠部材を備えると共に、当該電極板の前記縁部から前記載置領域の前記外周部までの最短の長さが前記プローブ機構における前記検査用プローブおよび当該検査用プローブに接続されている導体の前記電極板の表面に沿った長さ以上に規定され、前記測定部は、前記載置領域内の任意の位置に前記検査用プローブを近接させて測定した前記浮遊容量の測定値に基づいて全ての前記導体パターンについての前記静電容量の測定値を補正する。 In order to achieve the above object, a circuit board inspection apparatus according to claim 1 is provided with a mounting table, an electrode plate on which the circuit board can be mounted and disposed on the mounting table, and the electrode plate. A physical quantity generated when an inspection signal is supplied to the conductor pattern via the probe mechanism having an inspection probe brought into contact with the conductor pattern of the mounted circuit board and the inspection probe brought into contact with the conductor pattern. The probe mechanism based on a physical quantity generated when the inspection signal is supplied to the inspection probe brought close to the electrode plate while measuring the capacitance between the conductor pattern and the electrode plate And measuring the stray capacitance between the electrode plate and correcting the measured capacitance value based on the measured stray capacitance value. Based on A circuit board inspection apparatus for inspecting the quality of the conductor pattern, wherein the stray capacitance is measured even when the inspection probe is brought close to any position in the central portion of the electrode plate. A mounting region having the same value is provided so as to be distinguishable from a region on the edge side of the electrode plate, and the electrode plate is disposed along the outer periphery of the mounting region, and the edge of the circuit board is provided. A frame member for positioning the circuit board with respect to the electrode plate by contacting a portion thereof, and the shortest length from the edge of the electrode plate to the outer peripheral portion of the placement area is the probe mechanism The length of the inspection probe and the conductor connected to the inspection probe is not less than the length of the electrode plate along the surface of the electrode plate, and the measurement unit is located at any position within the placement area. Measure with the probe close Correcting the measured value of the capacitance of all of the conductor pattern based on the measured value of the stray capacitance.

請求項１記載の回路基板検査装置では、その領域内のいずれの位置に検査用プローブを近接させたときにも浮遊容量の測定値が同じ値となる載置領域が縁部側の領域と区別可能に電極板の中央部に設けられ、測定部が、載置領域内の任意の位置に検査用プローブを近接させて測定した浮遊容量の測定値に基づいて全ての導体パターンについての静電容量の測定値を補正する。このため、この回路基板検査装置によれば、電極板に対するプローブ機構の位置によって浮遊容量が異なることに起因して全ての導体パターンの近傍において浮遊容量を測定する必要のある従来の回路基板検査装置とは異なり、浮遊容量の測定回数を任意の少ない測定回数に削減することができる。したがって、この回路基板検査装置によれば、浮遊容量の測定回数を削減できる分、検査時間を短縮することができる結果、検査効率を十分に向上させることができる。   2. The circuit board inspection apparatus according to claim 1, wherein a mounting region in which the measured value of the stray capacitance is the same when the inspection probe is brought close to any position in the region is distinguished from the region on the edge side. Capacitance for all conductor patterns based on the measured value of stray capacitance, which is provided at the center of the electrode plate and measured by the measurement unit with the inspection probe close to an arbitrary position in the mounting area. Correct the measured value. Therefore, according to this circuit board inspection apparatus, the conventional circuit board inspection apparatus that needs to measure the stray capacitance in the vicinity of all the conductor patterns due to the fact that the stray capacitance varies depending on the position of the probe mechanism with respect to the electrode plate. Unlike the above, the number of stray capacitance measurements can be reduced to an arbitrarily small number of measurements. Therefore, according to this circuit board inspection apparatus, the inspection time can be shortened as much as the number of times of measurement of the stray capacitance can be reduced, so that the inspection efficiency can be sufficiently improved.

また、この回路基板検査装置によれば、載置領域の外周部に沿って配設されて回路基板の縁部を当接させて電極板に対して回路基板を位置決めさせるための枠部材を備えて電極板を構成したことにより、枠部材の存在によって載置領域を縁部側の領域と明確に区別させることができると共に、枠部材の存在によって回路基板を載置領域内に確実に位置させることができる。 Also, according to the circuit board inspection apparatus, comprising a frame member for positioning the circuit board is brought into contact with the edge of the circuit board is disposed along the outer periphery of the mounting region and the electrode plate By configuring the electrode plate, the placement area can be clearly distinguished from the edge side area by the presence of the frame member, and the circuit board is reliably positioned in the placement area by the presence of the frame member. be able to.

また、この回路基板検査装置では、電極板の縁部から載置領域の外周部までの最短の長さがプローブ機構における検査用プローブおよび検査用プローブに接続されている導体（以下、この導体および検査用プローブを合わせて「導体部分」ともいう）の電極板の表面に沿った長さ以上に規定されている。このため、この回路基板検査装置によれば、例えば、載置領域の外周部に検査用プローブを近接させるときのプローブ機構の姿勢が、電極板における縁部側の領域の上部に導体部分が位置しかつ載置領域の外周部とプローブ機構とのなす平面視の角度が９０°となる姿勢、つまり載置領域の外周部から導体部分の基端部（検査用プローブとは逆側の端部）までの最短の長さが最も長くなる姿勢であったとしても、導体部分の全部を電極板（縁部側の領域）の上方に確実に位置させて電極板に確実に対向させることができる。したがって、この回路基板検査装置によれば、載置領域の中央部分に検査用プローブを近接させるときは勿論のこと、載置領域の外周部に検査用プローブを近接させるときにも（つまり、載置領域内のいずれの位置に検査用プローブを近接させるときにも）、プローブ機構の姿勢に関わりなく浮遊容量の測定値を確実に同じ値（ほぼ同じ値）とすることができる。 Further, in this circuit board inspection apparatus, the shortest length from the edge of the electrode plate to the outer periphery of the placement region is the inspection probe in the probe mechanism and the conductor connected to the inspection probe (hereinafter referred to as this conductor and The length of the inspection probe is also referred to as “conductor portion”) along the surface of the electrode plate. For this reason, according to this circuit board inspection apparatus, for example, the posture of the probe mechanism when the inspection probe is brought close to the outer peripheral portion of the mounting region is such that the conductor portion is positioned above the edge side region of the electrode plate. In addition, the posture in which the angle in a plan view formed by the outer periphery of the placement region and the probe mechanism is 90 °, that is, the base end of the conductor portion from the outer periphery of the placement region (the end opposite to the inspection probe) ) Even if the shortest length is the longest, the entire conductor portion can be reliably positioned above the electrode plate (region on the edge side) and can be reliably opposed to the electrode plate. . Therefore, according to this circuit board inspection apparatus, not only when the inspection probe is brought close to the center portion of the placement area, but also when the inspection probe is brought close to the outer peripheral portion of the placement area (that is, the placement probe is placed). Regardless of the position of the probe mechanism, the measured value of the stray capacitance can be reliably set to the same value (almost the same value) regardless of the position of the probe mechanism.

以下、本発明に係る回路基板検査装置の最良の形態について、添付図面を参照して説明する。   Hereinafter, the best mode of a circuit board inspection apparatus according to the present invention will be described with reference to the accompanying drawings.

最初に、図１に示す回路基板検査装置１の構成について説明する。回路基板検査装置１は、本発明に係る回路板検査装置の一例であって、同図に示すように、載置台１１、電極板１２、信号出力部１３、プローブ機構１４、移動機構１５、測定部１６、記憶部１７および制御部１８を備えて、回路基板１００における導体パターン１０１（図２参照）の良否を検査可能に構成されている。   First, the configuration of the circuit board inspection apparatus 1 shown in FIG. 1 will be described. The circuit board inspection apparatus 1 is an example of a circuit board inspection apparatus according to the present invention. As shown in the figure, the mounting board 11, the electrode plate 12, the signal output unit 13, the probe mechanism 14, the moving mechanism 15, and the measurement The circuit unit 100, the storage unit 17, and the control unit 18 are configured to be capable of inspecting the quality of the conductor pattern 101 (see FIG. 2) on the circuit board 100.

載置台１１は、図１に示すように、電極板１２および回路基板１００を載置可能に構成されている。また、載置台１１には、図外の吸気装置による空気の吸引で電極板１２および回路基板１００を固定するための小径の吸気孔（図示せず）が多数形成されている。   As shown in FIG. 1, the mounting table 11 is configured to be able to mount the electrode plate 12 and the circuit board 100. The mounting table 11 is formed with a large number of small-diameter intake holes (not shown) for fixing the electrode plate 12 and the circuit board 100 by suction of air by an intake device (not shown).

電極板１２は、図２，３に示すように、回路基板１００を載置させる領域としてその中央部に設けられた載置領域１２ｂ（図２参照）に回路基板１００を載置可能に構成されて、図１に示すように、回路基板１００の検査時に載置台１１の上（載置台１１と回路基板１００との間）に配設（載置）される。この場合、電極板１２は、図２，３に示すように、導電性材料によって形成された電極２１と、非導電性材料によって形成されて電極２１の上に積層された絶縁層２２とを備えて矩形の板状に構成されている。また、電極２１および絶縁層２２には、小径の通気孔（図示せず）が多数の形成されており、載置台１１による空気の吸引によって載置領域１２ｂに載置された回路基板１００を吸引して固定することが可能となっている。また、電極板１２の上面１２ａ（本発明における表面）には、載置領域１２ｂの外周部１２ｃに沿って枠部材２３が配設されている。この場合、枠部材２３は、回路基板１００を電極板１２の載置領域１２ｂに載置する際に回路基板１００の縁部を当接させて電極板１２に対して回路基板１００を位置決めする機能を有している。また、枠部材２３は、載置領域１２ｂと電極板１２の縁部側の領域（以下、「縁部側領域１２ｄ」ともいう）とを区画する（載置領域１２ｂを縁部側領域１２ｄと区別する）機能を有している。また、電極板１２は、図２に示すように、その縁部から載置領域１２ｂの外周部１２ｃ（枠部材２３の内側の縁部）までの最短の長さＬ１がプローブ機構１４における導体部分１４ａ（同図参照）の電極板１２の上面１２ａに沿った長さＬ２（平面視の長さ）以上に規定されている。   As shown in FIGS. 2 and 3, the electrode plate 12 is configured so that the circuit board 100 can be placed in a placement area 12 b (see FIG. 2) provided in the center as an area for placing the circuit board 100. As shown in FIG. 1, the circuit board 100 is disposed (placed) on the mounting table 11 (between the mounting table 11 and the circuit board 100) when the circuit board 100 is inspected. In this case, as shown in FIGS. 2 and 3, the electrode plate 12 includes an electrode 21 formed of a conductive material and an insulating layer 22 formed of a nonconductive material and stacked on the electrode 21. It is configured as a rectangular plate. The electrode 21 and the insulating layer 22 are formed with a large number of small-diameter vent holes (not shown), and the circuit board 100 placed on the placement region 12b is sucked by the suction of air by the placement table 11. And can be fixed. Further, a frame member 23 is disposed on the upper surface 12a (surface in the present invention) of the electrode plate 12 along the outer peripheral portion 12c of the placement region 12b. In this case, the frame member 23 has a function of positioning the circuit board 100 with respect to the electrode plate 12 by contacting the edge of the circuit board 100 when the circuit board 100 is placed on the placement region 12 b of the electrode plate 12. have. Further, the frame member 23 partitions the placement region 12b and a region on the edge side of the electrode plate 12 (hereinafter also referred to as “edge side region 12d”) (the placement region 12b is separated from the edge side region 12d). It has a function to distinguish. Further, as shown in FIG. 2, the electrode plate 12 has a conductor portion in the probe mechanism 14 having a shortest length L1 from the edge thereof to the outer peripheral portion 12c of the placement region 12b (the inner edge of the frame member 23). It is defined to be not less than a length L2 (length in plan view) along the upper surface 12a of the electrode plate 12 of 14a (see the same figure).

信号出力部１３は、図１に示すように、検査用信号Ｓｅ（例えば、交流電圧）を生成する。プローブ機構１４は、同図に示すように、プローブ３１（本発明における検査用プローブ）、および非導電材料によって形成されてプローブ３１を保持するアーム部３２を備えて構成されている。また、プローブ３１には、検査用信号Ｓｅを供給するための導線３３が接続されており、この導線３３は、アーム部３２に沿って配線されている。なお、導線３３が、本発明における「検査用プローブに接続されている導体」に相当する。移動機構１５は、ＸＹ方向（電極板１２の上面１２ａに沿った方向）、およびＺ方向（上下方向）にプローブ機構１４を移動させる。   As shown in FIG. 1, the signal output unit 13 generates a test signal Se (for example, an AC voltage). As shown in the figure, the probe mechanism 14 includes a probe 31 (inspection probe in the present invention) and an arm portion 32 that is formed of a non-conductive material and holds the probe 31. In addition, a lead wire 33 for supplying the inspection signal Se is connected to the probe 31, and the lead wire 33 is wired along the arm portion 32. The conducting wire 33 corresponds to “a conductor connected to the inspection probe” in the present invention. The moving mechanism 15 moves the probe mechanism 14 in the XY direction (direction along the upper surface 12a of the electrode plate 12) and the Z direction (vertical direction).

測定部１６は、回路基板１００の導体パターン１０１に接触させたプローブ３１を介して導体パターン１０１に検査用信号Ｓｅを供給したときに流れる電流Ｉ（本発明における、「検査用信号を供給したときに生じる物理量」の一例）に基づき、各導体パターン１０１と電極板１２との間の静電容量を測定する（以下、静電容量の測定値を「静電容量Ｃａ」ともいう）。また、測定部１６は、電極板１２に近接させたプローブ３１に検査用信号Ｓｅを供給したときに流れる電流Ｉに基づいてプローブ機構１４（具体的には、プローブ機構１４における導体部分１４ａであって、より具体的には、プローブ３１およびプローブ３１に接続された導線３３におけるアーム部３２に沿って配線された部分）と電極板１２との間の浮遊容量を測定する（以下、浮遊容量の測定値を「浮遊容量Ｃｂ」ともいう）。さらに、測定部１６は、浮遊容量Ｃｂに基づいて静電容量Ｃａを補正する。   The measuring unit 16 is configured to supply a current I (when the inspection signal is supplied in the present invention, when the inspection signal Se is supplied to the conductor pattern 101 via the probe 31 in contact with the conductor pattern 101 of the circuit board 100. The capacitance between each conductor pattern 101 and the electrode plate 12 is measured based on (an example of “physical quantity generated in”) (hereinafter, the measured capacitance value is also referred to as “capacitance Ca”). In addition, the measurement unit 16 is configured to detect the probe mechanism 14 (specifically, the conductor portion 14a in the probe mechanism 14 based on the current I that flows when the inspection signal Se is supplied to the probe 31 close to the electrode plate 12. More specifically, the stray capacitance between the electrode 31 and the probe 31 and a portion of the lead wire 33 connected to the probe 31 wired along the arm portion 32) is measured (hereinafter referred to as stray capacitance). The measured value is also referred to as “floating capacitance Cb”). Furthermore, the measurement unit 16 corrects the electrostatic capacitance Ca based on the stray capacitance Cb.

記憶部１７は、静電容量Ｃａ、浮遊容量Ｃｂ、および補正後の静電容量Ｃａ（以下、補正後の静電容量Ｃａを「補正後静電容量Ｃｃ」ともいう）を記憶する。また、記憶部１７は、制御部１８による導体パターン１０１の良否検査に用いられる基準値Ｃｄを記憶する。制御部１８は、図外の操作部から出力される操作信号に従って回路基板検査装置１を構成する各構成要素を制御する。具体的には、制御部１８は、信号出力部１３による検査用信号Ｓｅの出力、移動機構１５によるプローブ機構１４の移動、並びに測定部１６による静電容量の測定、浮遊容量の測定、および静電容量Ｃａの補正（補正後静電容量Ｃｃの算出）を制御する。また、制御部１８は、静電容量Ｃａ、浮遊容量Ｃｂおよび補正後静電容量Ｃｃを記憶部１７に記憶させる。また、制御部１８は、補正後静電容量Ｃｃと基準値Ｃｄとを比較して、導体パターン１０１の良否を検査する。   The storage unit 17 stores the capacitance Ca, the stray capacitance Cb, and the corrected capacitance Ca (hereinafter, the corrected capacitance Ca is also referred to as “corrected capacitance Cc”). In addition, the storage unit 17 stores a reference value Cd used for the quality inspection of the conductor pattern 101 by the control unit 18. The control unit 18 controls each component constituting the circuit board inspection apparatus 1 according to an operation signal output from an operation unit (not shown). Specifically, the control unit 18 outputs the inspection signal Se by the signal output unit 13, the movement of the probe mechanism 14 by the moving mechanism 15, and the capacitance measurement, the stray capacitance measurement, and the static measurement by the measurement unit 16. The correction of the capacitance Ca (calculation of the corrected capacitance Cc) is controlled. Further, the control unit 18 causes the storage unit 17 to store the electrostatic capacitance Ca, the stray capacitance Cb, and the corrected capacitance Cc. In addition, the control unit 18 compares the corrected capacitance Cc with the reference value Cd and inspects the quality of the conductor pattern 101.

次に、回路基板検査装置１を用いて回路基板１００の各導体パターン１０１の良否を検査する方法、およびその際の回路基板検査装置１の動作について、図面を参照して説明する。   Next, a method for inspecting the quality of each conductor pattern 101 of the circuit board 100 using the circuit board inspection apparatus 1 and the operation of the circuit board inspection apparatus 1 at that time will be described with reference to the drawings.

まず、載置台１１上の所定位置に電極板１２を載置し、次いで、電極板１２の載置領域１２ｂに検査対象の回路基板１００を載置する。続いて、図２に示すように、枠部材２３の１つの角部に回路基板１００の１つの角部を押し付けることにより、電極板１２に対して回路基板１００を位置決めする。次いで、図外の吸気装置を作動させる。この際に、載置台１１に形成されている吸気孔からの空気の吸引によって電極板１２が載置台１１に固定されると共に、回路基板１００が電極板１２に固定される。   First, the electrode plate 12 is mounted at a predetermined position on the mounting table 11, and then the circuit board 100 to be inspected is mounted on the mounting region 12 b of the electrode plate 12. Subsequently, as shown in FIG. 2, the circuit board 100 is positioned with respect to the electrode plate 12 by pressing one corner of the circuit board 100 against one corner of the frame member 23. Next, the intake device (not shown) is operated. At this time, the electrode plate 12 is fixed to the mounting table 11 and the circuit board 100 is fixed to the electrode plate 12 by suction of air from the intake holes formed in the mounting table 11.

続いて、図外の操作部を用いて検査開始操作を行う。次いで、制御部１８が、操作部から出力された操作信号に従い、信号出力部１３、移動機構１５および測定部１６を制御して、プローブ機構１４と電極板１２との間の浮遊容量の測定を実行させる。具体的には、制御部１８は、移動機構１５を制御して、図３に示すように、電極板１２の載置領域１２ｂに載置された回路基板１００の任意の位置（例えば、回路基板１００の中央部）、つまり載置領域１２ｂ内の任意の位置にプローブ３１が近接するようにプローブ機構１４を移動させる。続いて、制御部１８は、信号出力部１３を制御して検査用信号Ｓｅを出力させると共に、測定部１６を制御して、プローブ３１に対する検査用信号Ｓｅの供給に伴って流れる電流Ｉに基づく浮遊容量の測定を行わせる。次いで、制御部１８は、測定部１６によって測定された浮遊容量Ｃｂを記憶部１７に記憶させる。   Subsequently, an inspection start operation is performed using an operation unit (not shown). Next, the control unit 18 controls the signal output unit 13, the moving mechanism 15, and the measurement unit 16 according to the operation signal output from the operation unit to measure the stray capacitance between the probe mechanism 14 and the electrode plate 12. Let it run. Specifically, the control unit 18 controls the moving mechanism 15 to set an arbitrary position (for example, the circuit board) of the circuit board 100 placed on the placement area 12b of the electrode plate 12 as shown in FIG. 100), that is, the probe mechanism 14 is moved so that the probe 31 comes close to an arbitrary position in the placement region 12b. Subsequently, the control unit 18 controls the signal output unit 13 to output the inspection signal Se and also controls the measurement unit 16 based on the current I flowing along with the supply of the inspection signal Se to the probe 31. Have stray capacitance measured. Next, the control unit 18 causes the storage unit 17 to store the stray capacitance Cb measured by the measurement unit 16.

続いて、制御部１８は、信号出力部１３、移動機構１５および測定部１６を制御して、各導体パターン１０１と電極板１２との間の静電容量の測定を実行させる。具体的には、制御部１８は、移動機構１５を制御して、１つの導体パターン１０１にプローブ３１が接触するようにプローブ機構１４を移動させる。次いで、制御部１８は、信号出力部１３を制御して検査用信号Ｓｅを出力させると共に、測定部１６を制御して、プローブ３１を介しての導体パターン１０１に対する検査用信号Ｓｅの供給に伴って流れる電流Ｉに基づく静電容量の測定を行わせる。続いて、制御部１８は、測定部１６によって測定された静電容量Ｃａを記憶部１７に記憶させる。同様にして、制御部１８は、他の各導体パターン１０１と電極板１２との間の静電容量の測定を実行させて、静電容量Ｃａを記憶部１７に記憶させる。   Subsequently, the control unit 18 controls the signal output unit 13, the moving mechanism 15, and the measurement unit 16 to perform measurement of the capacitance between each conductor pattern 101 and the electrode plate 12. Specifically, the control unit 18 controls the moving mechanism 15 to move the probe mechanism 14 so that the probe 31 comes into contact with one conductor pattern 101. Next, the control unit 18 controls the signal output unit 13 to output the inspection signal Se and also controls the measurement unit 16 to accompany the supply of the inspection signal Se to the conductor pattern 101 via the probe 31. The capacitance is measured based on the flowing current I. Subsequently, the control unit 18 stores the capacitance Ca measured by the measurement unit 16 in the storage unit 17. Similarly, the control unit 18 causes the measurement of the capacitance between each other conductor pattern 101 and the electrode plate 12 to store the capacitance Ca in the storage unit 17.

次いで、制御部１８は、測定部１６を制御して、浮遊容量Ｃｂに基づく静電容量Ｃａの補正を実行させる。この場合、測定部１６は、記憶部１７から各導体パターン１０１についての静電容量Ｃａを読み出すと共に、浮遊容量Ｃｂを読み出して、例えば、静電容量Ｃａから浮遊容量Ｃｂを減算することによって補正後静電容量Ｃｃを算出する。続いて、制御部１８は、測定部１６によって算出された補正後静電容量Ｃｃを記憶部１７に記憶させる。   Next, the control unit 18 controls the measurement unit 16 to execute correction of the capacitance Ca based on the stray capacitance Cb. In this case, the measurement unit 16 reads the capacitance Ca for each conductor pattern 101 from the storage unit 17 and also reads the stray capacitance Cb, and after correction by subtracting the stray capacitance Cb from the capacitance Ca, for example. The capacitance Cc is calculated. Subsequently, the control unit 18 stores the corrected capacitance Cc calculated by the measurement unit 16 in the storage unit 17.

ここで、この回路基板検査装置１では、上記したように、電極板１２の縁部から載置領域１２ｂの外周部１２ｃ（枠部材２３の内側の縁部）までの最短の長さＬ１がプローブ機構１４における導体部分１４ａの電極板１２の上面１２ａに沿った長さＬ２以上に規定されている。このため、例えば、載置領域１２ｂの外周部１２ｃにプローブ３１を近接させるときのプローブ機構１４の姿勢が、縁部側領域１２ｄの上部に導体部分１４ａが位置しかつ載置領域１２ｂの外周部１２ｃとプローブ機構１４とのなす平面視の角度が９０°となる姿勢、つまり載置領域１２ｂの外周部１２ｃから導体部分１４ａの基端部（プローブ３１とは逆側の端部）までの最短の長さが最も長くなる姿勢であったとしても、プローブ機構１４における導体部分１４ａの全部が電極板１２（縁部側領域１２ｄ）の上方に確実に位置して電極板１２に確実に対向している。   Here, in this circuit board inspection apparatus 1, as described above, the shortest length L1 from the edge of the electrode plate 12 to the outer peripheral portion 12c of the placement region 12b (the inner edge of the frame member 23) is the probe. The length of the conductor portion 14a in the mechanism 14 is defined to be not less than the length L2 along the upper surface 12a of the electrode plate 12. For this reason, for example, when the probe 31 is brought close to the outer peripheral portion 12c of the placement region 12b, the probe mechanism 14 is positioned such that the conductor portion 14a is positioned above the edge side region 12d and the outer periphery of the placement region 12b. 12c and the probe mechanism 14 in an orientation in which the angle in plan view is 90 °, that is, the shortest distance from the outer peripheral portion 12c of the placement region 12b to the base end portion of the conductor portion 14a (the end portion opposite to the probe 31) Even if the length of the probe mechanism 14 is the longest, the entire conductor portion 14a in the probe mechanism 14 is surely positioned above the electrode plate 12 (edge side region 12d) and reliably faces the electrode plate 12. ing.

この場合、図４に示すように、電極板１２の縁部にプローブ機構１４が位置して、導体部分１４ａの一部または全部が電極板１２に対向していないときには、その対向していない部分が大きいほど浮遊容量Ｃｂが小さな値となる。つまり、電極板１２の縁部にプローブ機構１４が位置しいるときには、プローブ機構１４の位置に応じて浮遊容量Ｃｂが変化することとなる。これに対して、導体部分１４ａの全部が電極板１２に対向しているときには、プローブ機構１４の位置に拘わらず浮遊容量Ｃｂが同じ値（ほぼ同じ値）となる。したがって、この回路基板検査装置１では、上記のように電極板１２を構成したことで、載置領域１２ｂの中央部分にプローブ３１を近接させるときは勿論のこと、載置領域１２ｂの外周部１２ｃにプローブ３１を近接させるときにも（つまり、載置領域１２ｂ内のいずれの位置にプローブ３１を近接させるときにも）、プローブ機構１４の姿勢に関わりなく浮遊容量Ｃｂが同じ値（ほぼ同じ値）となる結果、載置領域１２ｂ内の任意の位置にプローブ３１を近接させて測定した浮遊容量Ｃｂに基づいて全ての導体パターン１０１についての静電容量Ｃａの補正を正確に行うことが可能となっている。   In this case, as shown in FIG. 4, when the probe mechanism 14 is located at the edge of the electrode plate 12 and part or all of the conductor portion 14 a does not face the electrode plate 12, the portion that does not face The larger the value, the smaller the stray capacitance Cb. That is, when the probe mechanism 14 is located at the edge of the electrode plate 12, the stray capacitance Cb changes according to the position of the probe mechanism 14. On the other hand, when all the conductor portions 14a face the electrode plate 12, the stray capacitance Cb has the same value (substantially the same value) regardless of the position of the probe mechanism 14. Therefore, in this circuit board inspection apparatus 1, since the electrode plate 12 is configured as described above, not only when the probe 31 is brought close to the center portion of the placement region 12b, but also the outer peripheral portion 12c of the placement region 12b. The stray capacitance Cb is the same value (substantially the same value) regardless of the attitude of the probe mechanism 14 even when the probe 31 is brought close to the probe 31 (that is, when the probe 31 is brought close to any position in the placement region 12b). As a result, it is possible to accurately correct the capacitance Ca for all the conductor patterns 101 based on the stray capacitance Cb measured by bringing the probe 31 close to an arbitrary position in the placement region 12b. It has become.

次いで、制御部１８は、記憶部１７から補正後静電容量Ｃｃおよび基準値Ｃｄを読み出して、両者を比較することによって各導体パターン１０１の良否を検査する。続いて、制御部１８は、検査結果を図外の表示に表示させる。以上により、回路基板１００における各導体パターン１０１についての良否検査が終了する。   Next, the control unit 18 reads the corrected capacitance Cc and the reference value Cd from the storage unit 17 and compares the two to check the quality of each conductor pattern 101. Subsequently, the control unit 18 displays the inspection result on a display outside the drawing. Thus, the quality inspection for each conductor pattern 101 on the circuit board 100 is completed.

このように、この回路基板検査装置１では、その領域内のいずれの位置にプローブ３１を近接させたときにも浮遊容量Ｃｂが同じ値（ほぼ同じ値）となる載置領域１２ｂが、電極板１２の縁部側領域１２ｄの領域と区別可能に電極板１２の中央部に設けられ、測定部１６が、載置領域１２ｂ内の任意の位置にプローブ３１を近接させて測定した浮遊容量Ｃｂに基づいて全ての導体パターン１０１についての静電容量Ｃａを補正する。このため、この回路基板検査装置１によれば、電極板に対するプローブ機構の位置によって浮遊容量が異なることに起因して全ての導体パターンの近傍において浮遊容量を測定する必要のある従来の回路基板検査装置とは異なり、浮遊容量の測定回数を任意の少ない測定回数に削減することができる。したがって、この回路基板検査装置１によれば、浮遊容量の測定回数を削減できる分、検査時間を短縮することができる結果、検査効率を十分に向上させることができる。   Thus, in this circuit board inspection apparatus 1, the mounting region 12b in which the stray capacitance Cb has the same value (substantially the same value) when the probe 31 is brought close to any position in the region is the electrode plate. 12 is provided at the center of the electrode plate 12 so as to be distinguishable from the region 12d on the edge side region 12d. The stray capacitance Cb measured by the measurement unit 16 by bringing the probe 31 close to an arbitrary position in the placement region 12b. Based on this, the capacitance Ca for all the conductor patterns 101 is corrected. For this reason, according to the circuit board inspection apparatus 1, the conventional circuit board inspection in which the stray capacitance needs to be measured in the vicinity of all the conductor patterns due to the stray capacitance being different depending on the position of the probe mechanism with respect to the electrode plate. Unlike the device, the number of stray capacitance measurements can be reduced to an arbitrarily small number of measurements. Therefore, according to the circuit board inspection apparatus 1, the inspection time can be shortened as much as the number of times of measurement of the stray capacitance can be reduced, so that the inspection efficiency can be sufficiently improved.

また、この回路基板検査装置１によれば、載置領域１２ｂの外周部１２ｃに沿って配設されて回路基板１００の縁部を当接させて電極板１２に対して回路基板１００を位置決めさせるための枠部材２３を備えて電極板１２を構成したことにより、枠部材２３の存在によって電極板１２の載置領域１２ｂを縁部側領域１２ｄと明確に区別させることができると共に、枠部材２３の存在によって回路基板１００を載置領域１２ｂ内に確実に位置させることができる。   Further, according to the circuit board inspection apparatus 1, the circuit board 100 is positioned with respect to the electrode plate 12 by being arranged along the outer peripheral portion 12 c of the placement region 12 b and contacting the edge of the circuit board 100. Since the electrode plate 12 is configured to include the frame member 23, the placement region 12b of the electrode plate 12 can be clearly distinguished from the edge side region 12d by the presence of the frame member 23, and the frame member 23 is provided. Therefore, the circuit board 100 can be reliably positioned in the placement region 12b.

また、この回路基板検査装置１では、電極板１２の縁部から載置領域１２ｂの外周部１２ｃまでの最短の長さＬ１がプローブ機構１４における導体部分１４ａの電極板１２の上面１２ａに沿った長さＬ２以上に規定されている。このため、この回路基板検査装置１によれば、例えば、載置領域１２ｂの外周部１２ｃにプローブ３１を近接させるときのプローブ機構１４の姿勢が、縁部側領域１２ｄの上部に導体部分１４ａが位置しかつ載置領域１２ｂの外周部１２ｃとプローブ機構１４とのなす平面視の角度が９０°となる姿勢、つまり載置領域１２ｂの外周部１２ｃから導体部分１４ａの基端部（プローブ３１とは逆側の端部）までの最短の長さが最も長くなる姿勢であったとしても、プローブ機構１４における導体部分１４ａの全部を電極板１２（縁部側領域１２ｄ）の上方に確実に位置させて電極板１２に確実に対向させることができる。したがって、この回路基板検査装置１によれば、載置領域１２ｂの中央部分にプローブ３１を近接させるときは勿論のこと、載置領域１２ｂの外周部１２ｃにプローブ３１を近接させるときにも（つまり、載置領域１２ｂ内のいずれの位置にプローブ３１を近接させるときにも）、プローブ機構１４の姿勢に関わりなく浮遊容量Ｃｂを確実に同じ値（ほぼ同じ値）とすることができる。   In the circuit board inspection apparatus 1, the shortest length L1 from the edge of the electrode plate 12 to the outer peripheral portion 12c of the placement region 12b is along the upper surface 12a of the electrode plate 12 of the conductor portion 14a in the probe mechanism 14. The length is defined as L2 or more. Therefore, according to this circuit board inspection apparatus 1, for example, the posture of the probe mechanism 14 when the probe 31 is brought close to the outer peripheral portion 12c of the placement region 12b is such that the conductor portion 14a is located above the edge side region 12d. The position in which the outer peripheral portion 12c of the placement region 12b and the probe mechanism 14 are 90 ° in plan view, that is, from the outer peripheral portion 12c of the placement region 12b to the proximal end portion of the conductor portion 14a (the probe 31 and Even if the shortest length to the opposite end) is the longest, the entire conductor portion 14a in the probe mechanism 14 is reliably positioned above the electrode plate 12 (the edge side region 12d). Thus, the electrode plate 12 can be reliably opposed. Therefore, according to the circuit board inspection apparatus 1, not only when the probe 31 is brought close to the central portion of the placement region 12b, but also when the probe 31 is brought close to the outer peripheral portion 12c of the placement region 12b (that is, Regardless of the position of the probe mechanism 14, the stray capacitance Cb can be reliably set to the same value (substantially the same value) regardless of the position of the probe mechanism 14).

なお、本発明は、上記した構成に限定されない。例えば、電極板１２の載置領域１２ｂと縁部側領域１２ｄとを区別させる手段として枠部材２３を用いる例について上記したが、線やマークなどを載置領域１２ｂの外周部１２ｃに沿って設けたり、載置領域１２ｂと縁部側領域１２ｄとを色分けしたりすることで、載置領域１２ｂと縁部側領域１２ｄとを区別させる構成を採用することもできる。また、載置領域１２ｂ内の１つの位置（上記の例では、載置領域１２ｂに載置された回路基板１００の中央部）において浮遊容量を測定し、その１つの位置における浮遊容量Ｃｂに基づいて全ての導体パターン１０１についての静電容量Ｃａの補正を行う例について上記したが、載置領域１２ｂ内の２つ以上の位置において浮遊容量を測定し、各浮遊容量Ｃｂに基づいて静電容量Ｃａの補正を行う構成を採用することもできる。この場合、各位置における浮遊容量Ｃｂを平均してその平均値に基づいて静電容量Ｃａの補正を行うこともできるし、各浮遊容量Ｃｂのうちの、補正対象の静電容量Ｃａの導体パターン１０１に最も近い位置において測定した浮遊容量Ｃｂに基づいてその静電容量Ｃａの補正を行うこともできる。   The present invention is not limited to the configuration described above. For example, the example in which the frame member 23 is used as a means for distinguishing the placement region 12b and the edge side region 12d of the electrode plate 12 has been described above. However, lines, marks, and the like are provided along the outer peripheral portion 12c of the placement region 12b. Alternatively, it is possible to adopt a configuration in which the placement area 12b and the edge side area 12d are distinguished by color-coding the placement area 12b and the edge side area 12d. Further, the stray capacitance is measured at one position in the placement area 12b (in the above example, the central portion of the circuit board 100 placed on the placement area 12b), and based on the stray capacitance Cb at the one position. In the above example, the capacitance Ca is corrected for all the conductor patterns 101. However, the stray capacitance is measured at two or more positions in the placement region 12b, and the capacitance is determined based on each stray capacitance Cb. A configuration for correcting Ca can also be employed. In this case, the stray capacitance Cb at each position can be averaged and the capacitance Ca can be corrected based on the average value, and the conductor pattern of the capacitance Ca to be corrected among the stray capacitance Cb. The electrostatic capacitance Ca can be corrected based on the stray capacitance Cb measured at the position closest to 101.

また、電極板１２の縁部から載置領域１２ｂの外周部１２ｃまでの最短の長さＬ１をプローブ機構１４における導体部分１４ａの電極板１２の上面１２ａに沿った長さＬ２以上に規定した例について上記したが、プローブ機構１４の姿勢が、載置領域１２ｂの外周部１２ｃに対してプローブ機構１４が斜めとなる姿勢（外周部１２ｃとプローブ機構１４とのなす平面視の角度が９０°以外となる姿勢）で載置領域１２ｂにプローブ３１を近接させる構成では、上記した長さＬ１を長さＬ２よりも短く規定することができる。   In addition, an example in which the shortest length L1 from the edge of the electrode plate 12 to the outer peripheral portion 12c of the placement region 12b is defined to be equal to or longer than the length L2 along the upper surface 12a of the electrode plate 12 of the conductor portion 14a in the probe mechanism 14 As described above, the posture of the probe mechanism 14 is such that the probe mechanism 14 is inclined with respect to the outer peripheral portion 12c of the placement region 12b (the angle in plan view formed by the outer peripheral portion 12c and the probe mechanism 14 is other than 90 °). In the configuration in which the probe 31 is brought close to the placement region 12b in such a posture, the length L1 can be defined to be shorter than the length L2.

回路基板検査装置１の構成を示す構成図である。1 is a configuration diagram showing a configuration of a circuit board inspection device 1. FIG. 回路基板１００を載置した状態の電極板１２の平面図である。2 is a plan view of an electrode plate 12 with a circuit board 100 mounted thereon. FIG. 図２におけるＸ−Ｘ線断面図である。It is the XX sectional view taken on the line in FIG. 電極板１２（電極板１１２）に対するプローブ機構１４（プローブ機構１１４）の位置と浮遊容量Ｃｂとの関係を説明するための説明図である。It is explanatory drawing for demonstrating the relationship between the position of the probe mechanism 14 (probe mechanism 114) with respect to the electrode plate 12 (electrode plate 112), and the floating capacitance Cb.

符号の説明Explanation of symbols

１ 回路基板検査装置
１１ 載置台
１２ 電極板
１２ａ 上面
１２ｂ 載置領域
１２ｃ 外周部
１２ｄ 縁部側領域
１４ プローブ機構
１４ａ 導体部分
１６ 測定部
１８ 制御部
２３ 枠部材
３１ プローブ
１００ 回路基板
１０１ 導体パターン
Ｃａ 静電容量
Ｃｂ 浮遊容量
Ｃｃ 補正後静電容量
Ｃｄ 基準値
Ｉ 電流
Ｌ１，Ｌ２ 長さ
Ｓｅ 検査用信号 DESCRIPTION OF SYMBOLS 1 Circuit board inspection apparatus 11 Mounting stand 12 Electrode plate 12a Upper surface 12b Mounting area 12c Outer peripheral part 12d Edge side area 14 Probe mechanism 14a Conductor part 16 Measuring part 18 Control part 23 Frame member 31 Probe 100 Circuit board 101 Conductive pattern Ca Static Capacitance Cb Stray capacitance Cc Corrected capacitance Cd Reference value I Current L1, L2 Length Se Inspection signal

Claims (1)

載置台と、回路基板を載置可能にされて当該載置台の上に配設される電極板と、当該電極板の上に載置された回路基板の導体パターンに接触させる検査用プローブを有するプローブ機構と、前記導体パターンに接触させた前記検査用プローブを介して当該導体パターンに検査用信号を供給したときに生じる物理量に基づいて当該各導体パターンと前記電極板との間の静電容量を測定すると共に当該電極板に近接させた当該検査用プローブに当該検査用信号を供給したときに生じる物理量に基づいて前記プローブ機構と前記電極板との間の浮遊容量を測定して当該浮遊容量の測定値に基づいて当該静電容量の測定値を補正する測定部とを備えて、前記補正後の静電容量の測定値に基づいて前記導体パターンの良否を検査する回路基板検査装置であって、
前記電極板の中央部には、その領域内のいずれの位置に前記検査用プローブを近接させたときにも前記浮遊容量の測定値が同じ値となる載置領域が当該電極板の縁部側の領域と区別可能に設けられ、
前記電極板は、前記載置領域の外周部に沿って配設されて前記回路基板の縁部を当接させて当該電極板に対して当該回路基板を位置決めさせる枠部材を備えると共に、当該電極板の前記縁部から前記載置領域の前記外周部までの最短の長さが前記プローブ機構における前記検査用プローブおよび当該検査用プローブに接続されている導体の前記電極板の表面に沿った長さ以上に規定され、
前記測定部は、前記載置領域内の任意の位置に前記検査用プローブを近接させて測定した前記浮遊容量の測定値に基づいて全ての前記導体パターンについての前記静電容量の測定値を補正する回路基板検査装置。 A mounting table, an electrode plate on which the circuit board can be mounted and disposed on the mounting table, and an inspection probe that contacts the conductor pattern of the circuit board mounted on the electrode plate Capacitance between each conductor pattern and the electrode plate based on a physical quantity generated when a test signal is supplied to the conductor pattern via the probe mechanism and the inspection probe brought into contact with the conductor pattern And measuring the stray capacitance between the probe mechanism and the electrode plate based on a physical quantity generated when the inspection signal is supplied to the inspection probe brought close to the electrode plate. A circuit board inspection apparatus for inspecting the quality of the conductor pattern based on the measured capacitance value after the correction, and a measuring unit that corrects the measured capacitance value based on the measured value. I,
At the center of the electrode plate, there is a mounting region where the measured value of the stray capacitance becomes the same value when the inspection probe is brought close to any position in the region. It is provided so that it can be distinguished from the area of
The electrode plate includes a frame member that is disposed along an outer peripheral portion of the placement area and contacts the edge of the circuit board to position the circuit board with respect to the electrode plate. The shortest length from the edge of the plate to the outer peripheral portion of the placement area is the length along the surface of the electrode plate of the inspection probe and the conductor connected to the inspection probe in the probe mechanism More than that,
The measurement unit corrects the capacitance measurement values for all the conductor patterns based on the measurement value of the stray capacitance measured by bringing the inspection probe close to an arbitrary position in the placement area. Circuit board inspection device.
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