JPS6167299A - Punching and containing device of electronic part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to an electronic component (
This invention relates to a device that punches out so-called suspended electronic components from a lead frame and automatically stores them in a magazine.

[Background of the invention]

The suspended electronic component described above is in the middle of the manufacturing process of an electronic component such as a thin IC, for example.

[Background of the idea]

FIG. 2 is a perspective view of a thin IC, and FIG. 3 is a perspective view of the state of a semi-finished product (so-called suspended state) during the manufacturing process of the thin IC.

As shown in Figure 2, the thin IC is a flat package 1.
It has a structure in which a large number of parts 2 protrude around the periphery. In the suspended state shown in FIG. 3, a large number of leads 2 are punched and formed on the lead frame 3, and the package 1 is molded onto these glued leads 2.

In order to separate the above-mentioned suspended thin IC from the lead frame and store each thin IC in a magazine, the operation shown in FIG. 4 is conventionally performed. In this figure, numeral 3 is the previously described lead frame. This lead frame 3 has a plurality of molded packages 1, 1,
Based on the pitch dimension p of .

The punch 4 is pushed up by a driving means (not shown) and punches out a thin IC from the lead frame 3. The punched thin IC is sucked and held by the suction pad 5 and lifted.

The suction pad 5 moves to the 5' position indicated by allA, and the thin ICs that have been suctioned and held are arranged and mounted on the pallet 6.

The thin ICs on the pallet 6 are manually placed one by one on the tester table 7 and inspected, and those determined to be good are manually stored in the magazine (storage container for transportation) 8. .

Among the above-mentioned work steps, the work of arranging the punched thin ICs on the pallet 6 using the suction pad 5 can be done manually or can be automated; Since the thin IC is not fixed in position, it is likely to be misaligned, and the work of mounting it on a predetermined position on the pallet 6 using the suction pad 5 is unstable. Further, testing using the tester table 7 and storing the product in the magazine 8 require a great deal of effort.

Moreover, thin ICs that are determined to be defective on the tester table 7 are disposed of, but are punched out with a punch 4, sucked and conveyed with a suction pad 5, arranged on a pallet 6, etc.
・Since it is discarded after completing the process, the process up to that point is wasted.

[Purpose of the invention]

The present invention was developed in view of the above-mentioned circumstances, and it fully automatically processes electronic components from measurement and quality determination to punching and magazine storage. The purpose of the present invention is to provide a device that can be disposed of together with a lead frame without any trouble.

The present invention is a device created for thin ICs,
It can be applied not only to thin ICs but also to various electronic components produced in a semi-finished state (suspended state) molded on a lead frame.

[Summary of the invention]

To achieve the above object, the present invention provides an apparatus.

In an apparatus for punching electronic components by pitch-feeding a lead frame in which an electronic component is molded in the longitudinal direction, the device is provided with a means for contacting and conducting the electronic component before punching it with the punch to determine its quality. A means for controlling the drive of the punch is provided so as to punch out only the determined electronic component, and a pusher is provided for pushing the punched electronic component laterally (in a horizontal direction perpendicular to the pitch feed direction of the lead frame). At the same time, a guide member is installed to face the pusher and receive the pushed electronic component and store it in the magazine.

[Embodiments of the invention]

Next, one embodiment of the present invention will be described with reference to FIG. This figure is an explanatory diagram in which a drive/control system diagram is added to a perspective view of an embodiment of the electronic component punching storage device of the present invention.

3 is the lead frame, arrow A is its pitch feed direction, 4
is a punch for punching.

Thin ICB in position before being fed into punch 4
A probe card 9 having a large number of probes (contact conduction pieces) 9a is installed opposite to the probe card 9, and the probes 9a are brought into contact conduction with the leads 2 of the thin ICB. The probe 9a is connected to a tester 10, and this tester 1
0 measures the electrical performance of the thin ICB. The measurement data is input to the automatic control device 11, and its quality is determined.

A presser jig 12 is installed above the punch 4 at a position facing it with the lead frame 3 interposed therebetween. Punch 4 above
The holding jig 12 has a structure that is driven up and down by commands from the automatic control device 11.

A thin IC pusher 13 that is driven horizontally at right angles to the pitch feed direction (arrow A) of the lead frame 3 is provided on the side of the thin IOC directly facing the punch 4. This pusher 13 is also reciprocated by a command from the automatic control device 11. A thin IC guide rail 14 is provided on the side of the lead frame 3 so as to face the thin IC pusher 13 described above. Further, the magazine 8 is positioned directly opposite the end of the guide rail 14 opposite to the end facing the lead frame 3. Specifically, means (not shown) for fixing the magazine 8 at this position is provided. This magazine 8 is a member similar to the magazine 8 shown in the conventional device example (FIG. 4).

In the apparatus of this embodiment configured as described above, when the lead frame 3 is pitch-fed in the direction of arrow A, the thin IC molded on this lead frame first passes a position facing the probe card 9; Electrical measurements are automatically controlled! 11, the quality is judged, and the judgment result is stored.

After advancing 4 pitches from the measurement 2 determination described above, the position is opposite to the punch 4.

Based on the stored determination results, the automatic control device 11
If the thin IC is rejected, the lead frame 3 is advanced without issuing a punching command.

If the stored judgment result is pass, presser jig 12
is moved downward to press down the thin IC, and the punch 4 is moved upward to punch out the thin IC.

The punched thin IC is held between the holding jig 12 and the punch 4 so as not to shift.

The punch 4 and the holding jig 12 rise slightly together while holding the punched thin IC, and make the thin IC face the guide rail 14. From this state, the holding jig 1
2 to release the clamping pressure.

Next, the thin IC is pushed by the pusher 13 to engage with the guide rail 14, and further pushed to be stored in the magazine 8.

The reference numeral 15 shown in this figure is an opening formed in the punched area of a thin IC of an acceptable product, and the reference numeral 16 is a thin IC of a rejected product that was pitch-fed without being punched.

〔Effect of the invention〕

As described in detail above, if the present invention device is applied, the entire process from measuring electronic components to determining whether they are good or bad, punching them out, and storing them in a magazine can be done fully automatically. This has an excellent practical effect in that it can be discharged together with the lead frame without being overlaid.

[Brief explanation of drawings]

FIG. 1 is an explanatory diagram in which a drive and control system diagram is added to a perspective view of one embodiment of the present invention. Fig. 2 is a perspective view of a thin IC as an example of an electronic component, Fig. 3 is a perspective view of a lead frame in which a thin IC is molded in a suspended state, and Fig. 4 is a thin IC in a suspended state according to the prior art. It is an explanatory view of the process of punching out and storing it in a magazine. 1... Package, 2... Lead, 3... Lead frame, 4... Punch, 5... Suction pad,
6... Pallet, 7... Tester table, 8...
Magazine, 9... Probe card, 9a... Probe (contact continuity piece), 12... Holding jig, 13... Pusher, 14... Guide rail.

Claims (1)

[Claims] In an apparatus for punching electronic components with a punch while pitch-feeding a lead frame in which an electronic component is molded in the longitudinal direction, a means is provided to determine the quality of the electronic component by contacting the electronic component before punching it with the punch, and to determine whether the electronic component is good or not. A means for controlling the drive of the punch is provided so as to punch out only the determined electronic component, and a pusher is provided for pushing the punched electronic component laterally (in a horizontal direction perpendicular to the pitch feeding direction of the lead frame). An apparatus for punching and storing electronic parts, characterized in that a guide member for receiving the pushed electronic parts and storing them in the magazine is installed facing the pusher.