JPH0521996A - Electronic-part inserting apparatus - Google Patents

Abstract

PURPOSE:To perform efficient production or unmanned operation for a long time in high efficiency by solving the problem of deterioration of production efficiency because of the face that a defective part cannot be removed during a step when the defective product such as a bent lead wire is present, discriminating the defective part before insertion, and automatically removing the defective part. CONSTITUTION:In a chuck unit 9 for holding a lead wire, a strain gage 21, which can judge the presence or absence of the bending and missing of each lead wire 23 of an electronic part 7, is provided. The chuck unit 9 also has comb-tooth-shaped chuck pawls 20. The chuck unit 9 is provided in an electronic-part inserting apparatus.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component inserting device for mounting electronic components on a printed circuit board.

[0002]

2. Description of the Related Art Conventionally, as a technique for mounting electronic components on a printed circuit board, it has been general to use a device having a structure as shown in FIGS. The conventional technique will be described below with reference to FIGS.

In the figure, 1 is the main body of the insertion machine and 2 is the X
-Y drive unit, 3 insertion head drive unit, 4 anvil head drive unit, 5 component supply unit, 6 substrate transfer unit, 7 DI
P type IC, 8 is a substrate into which the DIP type IC 7 is inserted, 9 is a chuck unit, 10 is a piston, 11 is a chuck claw,
12 is an anvil unit, 13 is an anvil piston,
14 is a clinch claw, 15 is a return spring of the anvil piston 13, 16 is an IFT coil, 17 is an IFT coil 1
Chuck claw for holding 6 and 18 for IFT coil 1
Clinch claw for holding 6, 19 is IFT coil 1
6 is a substrate into which 6 is inserted.

Next, the operation will be described. As shown in the figure, the DIP type IC 7 positioned at the tip of the component supply unit 5 is sandwiched by the chuck claws 11 of the chuck unit 9 provided at the tip of the insertion head drive unit 3. After sandwiching, the chuck unit 9 is raised, and the insertion head drive unit 3 and the anvil head drive unit 4 are positioned above the insertion point of the substrate 8 into which the DIP type IC 7 positioned by the substrate transfer unit 6 is inserted. After that, the chuck unit 9 inserts the DIP type IC 7 into the insertion hole of the substrate 8, so that the insertion head drive unit 3 descends. Simultaneously with this operation, the anvil unit 12 is also raised by the anvil head drive unit 4, and the lead wire of the DIP type IC 7 inserted into the substrate 8 is bent by the clinch claw 14 and, at the same time, the insertion detection is completed. Figure 1
0 indicates the case where the IFT coil 16 is used instead of the DIP type IC 7 as the insertion target component, and the operation is the same as the case of the DIP type IC 7 described above.

[0005]

However, in the above-mentioned conventional electronic component inserting apparatus, as shown in FIGS. 9 (a) and 9 (b), the lead wire of the DIP type IC 7 is inserted before the chuck claw 1 is inserted.
There may be a case where the sheet is already bent when sandwiched by 1, and cannot be clearly inserted into the insertion hole of the substrate 8. Even in such a case, in the conventional insertion device, the DIP IC 7 is once inserted, and the clinch claw 14 bends and detects. Upon receiving the non-detection signal, the machine stops, and it is necessary to manually remove the defective part and restart the machine. The same applies to the case of the IFT coil 16 shown in FIGS. 10 (a) and 10 (b). Therefore, at present, it is impossible to remove parts that have lead wires bent during the manufacture of parts or at the time of supplying parts, and it is necessary to deal with them after they have all been inserted. This is a major issue when aiming for driving.

The present invention is intended to solve the above problems,
An object is to provide an electronic component insertion device having high functionality.

[0007]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides a lead wire clamping chuck unit having a comb-shaped chuck claw for confirming the clamping condition of a lead wire of an electronic component, and A strain gauge is provided on the tooth surface.

[0008]

According to the present invention, therefore, when a defective lead wire component is sandwiched, the quality of the component is immediately determined, and when a defective component such as a bent or missing lead wire is detected, the insertion operation is performed. It is possible to realize efficient insertion such as canceling the operation and performing the discarding operation.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS.
In addition, the same parts as those in FIGS. 8 to 10 are denoted by the same reference numerals, detailed description thereof will be omitted, and different points will be described.

1 to 4 show an electronic component inserting apparatus according to an embodiment of the present invention. In the drawings, 20 is a comb-shaped chuck claw, 21 is a strain gauge affixed to the comb-shaped chuck claw 20, 22 is a dust box for discarding defective parts.

The operation of the above configuration will be described.
As shown in the figure, the DIP type IC 7 positioned at the tip of the component supply unit 5 is sandwiched by the comb tooth-shaped chuck claws 20 of the chuck unit 9 provided at the tip of the insertion head drive unit 3. At this time, due to the function of the strain gauge 21 attached to the comb-shaped chuck claw 20, the lead wire 23
The abnormal state such as bending, missing or presence of parts is confirmed, and if normal, the insertion into the substrate 8 for the DIP type IC is completed. If it is abnormal, the defective part is discarded in the dust box 22 for discarding the defective product.

Next, referring to FIGS.
An example in which an IFT coil is used instead of the IP type IC will be described. In the figure, 24 is a lead wire inspection block, 25 is a lead wire inspection sensor, 26 is a rotary connecting rod, 27 is a pulse motor, 28 is an insertion head frame, 29 is an insertion head up / down ball screw, and 30 is an insertion head up / down. Servo motor for.

The operation of the above configuration will be described. The IFT coil 16 positioned at the tip of the component supply unit 5 shown in FIG. 1 is held by the chuck claw 17 for the IFT coil provided at the tip of the insertion head drive unit 3. Thereafter, the insertion head frame 28 receives the driving force of the insertion head up / down servo motor 30, and the insertion head up / down ball screw 2
Rise through 9 and reach the upper limit. Then, the pulse motor 27 operates and the lead wire detection block 24 is IFT-operated.
The coil 16 is rotationally moved to a position just below. After the rotational movement, the insertion head up / down servo motor 30 is driven to lower the insertion head frame 28, and the lead wire 3 of the IFT coil 16 is moved.
1 into the insertion hole 32 of the lead wire inspection block 24,
The lead wire inspection sensor 25 checks whether the lead wire 31 is bent or missing. If it is detected by the lead wire inspection sensor 25, it is determined as a non-defective product, and the XY drive unit 2 moves to move the IFT.
The IFT coil 16 is inserted into the coil substrate 19. If the lead wire inspection sensor 25 does not detect the lead wire, the lead wire is determined to be defective, insertion is not performed, and the defective product is discarded in the dust box 22 for discarding the defective component.

[0014]

As is apparent from the above-described embodiments, the present invention provides a lead wire holding block having a lead wire holding chuck unit or a lead wire holding sensor having a comb tooth-shaped chuck claw on which a strain gate is attached. It is equipped with a chuck claw for clamping the body of the electronic component, and it is possible to determine the defect of the electronic component before inserting the electronic component, and it is possible to save the trouble of manually removing the defective component until now. It is possible to highly efficiently perform automated production, especially unmanned operation for a long time.

[Brief description of drawings]

FIG. 1 is a perspective view of an electronic component inserting device according to an embodiment of the present invention.

FIG. 2 is an enlarged perspective view of a chuck unit portion of the electronic component inserting device.

FIG. 3A is a front view of a main portion of a comb-shaped chuck claw portion of the chuck unit portion; FIG.

FIG. 4 is a schematic plan view of essential parts showing a state in which a DIP type IC is inserted using the electronic component inserting apparatus.

FIG. 5 is a schematic side view of an electronic component insertion device according to another embodiment of the present invention.

FIG. 6 is a perspective view of essential parts near a chuck claw of the electronic component inserting apparatus.

FIG. 7 is a schematic plan view of essential parts showing a state where an IFT coil is inserted using the electronic component inserting device.

FIG. 8 is a perspective view of a conventional electronic component insertion device.

FIG. 9 (a) is an enlarged perspective view of a chuck unit portion of the electronic component inserting apparatus, and FIG. 9 (b) is a front view of an essential part near the chuck claw of the chuck unit.

FIG. 10 (a) is an enlarged perspective view of a chuck unit portion of another conventional electronic component inserting apparatus, and FIG. 10 (b) is a side view of essential parts near the chuck claws of the chuck unit.

[Explanation of symbols]

7 DIP type IC (electronic parts) 9 Chuck unit 16 IFT coil (electronic parts) 17 Chuck claw 20 Comb-shaped chuck jaws 21 strain gauge 23, 31 lead wire 24 Lead wire inspection block 25 Lead wire inspection sensor

Claims (2)

[Claims] 1. An electronic component insertion device having a chuck unit for pinching a lead wire, which has a comb-shaped chuck claw provided with a strain gauge capable of determining whether or not a lead wire of an electronic component such as a DIP type IC is bent or missing. 2. An electronic component insertion device including a lead wire inspection block having a lead wire inspection sensor capable of determining whether or not a lead wire of an electronic component such as an IFT coil is bent or missing, and a chuck claw for holding a body of the electronic component. .