JP3477084B2 - Lead frame board holding device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead frame substrate retainer used for inspecting wire pull strength, ball shear strength and die shear strength in a semiconductor element manufacturing process.

[0002]

2. Description of the Related Art With the recent high-density mounting of semiconductor elements,
Many quality problems occur due to peeling of semiconductor chips due to short-time curing of die bond paste, disconnection of gold wire lines due to thinning of gold wire lines, and insufficient adhesion of gold balls due to downsizing of wire bond electrodes. is doing. In order to prevent occurrence of these quality problems, wire pull strength, ball shear strength and die shear strength are inspected.

This strength inspection is performed by using a strength inspection device using a highly sensitive semiconductor load sensor.

FIG. 17 is a perspective view schematically showing an example of a conventional strength inspection device. The strength inspection apparatus is an apparatus used for strength inspection of a semiconductor device, and the semiconductor device has leads formed with a plurality of pairs of lead frames each including a first lead frame and a second lead frame as a pair of lead frames. It is provided on the frame substrate.

The strength inspection apparatus includes a support base 101 on which a lead frame substrate retainer for fixing the lead frame substrate is installed, and the support base 101 in the X axis direction and the Y direction.
An XY table 102 that moves in the axial direction, a semiconductor load sensor 103 that can detect a load applied to an object to be inspected, a Z table 104 that moves the semiconductor load sensor 103 in the Z axis direction, and an XY table. 10
2 and Z table 104, and a control unit 105 to which the detection result of the semiconductor load sensor 103 is input and the XY table 102 and Z table 10.
Operation switch 106 for operating 4 and instructing measurement start
Composed of and. The lead frame substrate pressing device is used so that the semiconductor chip and the gold wire line mounted on the first lead frame will not be damaged, such as scratched or deformed, during the strength inspection.

First, a strength inspection procedure in the case where a semiconductor device mounted on a horizontal lead frame substrate is an object to be inspected for strength inspection will be described.

FIG. 18 is an explanatory view showing an example of a horizontal lead frame substrate which is the object of strength inspection.
Is a plan view showing the horizontal lead frame substrate, and FIG. 6B is a side view showing the horizontal lead frame substrate.
18C is an enlarged plan view showing the semiconductor chip mounting portion (region C1 in FIG. 18B) of the horizontal lead frame substrate.

The horizontal lead frame substrate 111 is formed by stamping out a conductive thin plate, and has a first lead frame 111a having a die bond area S1 and a second lead frame 111 having a second bond area S2.
and a plurality of pairs of lead frames each having a pair of lead frames b.

Next, a procedure for mounting a semiconductor chip on each lead frame of the horizontal lead frame substrate 111 shown in FIG. 18 (that is, a semiconductor device manufacturing process) and a strength inspection process for the horizontal lead frame substrate 111 after mounting. , And will be described with reference to FIG. Note that FIG.
Is a semiconductor chip mounting portion (die bond area S1 portion and second bond area S of each pair of lead frames).
The plan view and the side view of (2 part) are shown for each process.

First, as a first step, a horizontal lead frame substrate 111 is placed on a support table (not shown) of a manufacturing apparatus (see FIGS. 19A and 19B).

Then, as a second step, the die bond paste 112 is applied to the die bond areas S1 of all the first lead frames 111a of the horizontal lead frame substrate 111 (see FIGS. 19C and 19D).

Subsequently, in a third step, the semiconductor chip 113 is mounted on each first lead frame 111a via the die bond paste 112 (FIG. 19 (e) and FIG. 1).
9 (f)).

Subsequently, as a fourth step, the semiconductor chip 1
The horizontal lead frame substrate 111 with 13 mounted is placed in a curing furnace (not shown), and the die bond paste 11
2 is cured (see FIG. 19 (g) and FIG. 19 (h)).

Then, as a fifth step, wire bonding is performed between the second bond areas S2 of all the second lead frames 111b and the electrodes (not shown) of all the semiconductor chips 113 by using gold wires 114. (See FIG. 19 (i) and FIG. 19 (j)). In this way, a plurality of semiconductor devices having the first lead frame 111a and the second lead frame 111b as output terminals are formed.

Thereafter, as a sixth step, the horizontal lead frame substrate pressing device 107 shown in FIG. 20 is arranged on the support base 101 of the strength inspection device shown in FIG. 17, and the horizontal lead frame substrate pressing device 107 is arranged. The horizontal lead frame substrate 111 is arranged between the horizontal lead frame substrate mounting portion 107a and the contact portion 107b. The horizontal lead frame substrate mounting portion 107a is a member having a U-shaped cross section, and is arranged with its opening facing downward. A groove portion 1 for fitting the horizontal lead frame substrate 111 on the upper surface of the horizontal lead frame substrate mounting portion 107a.
07a1 is provided. Further, the contact portion 107b is
It is a member for pressing and fixing the horizontal lead frame substrate 111 into the groove 107a1. As described above, with the horizontal lead frame substrate 111 arranged on the horizontal lead frame substrate mounting portion 107a, a semiconductor device to be inspected is selected from a plurality of semiconductor devices, and the semiconductor device to be inspected is selected. The wire pull strength is measured (see FIGS. 19 (k) and 19 (l)).

Subsequently, as a seventh step, ball shear strength measurement is performed on the semiconductor device to be inspected (see FIGS. 19 (m) and 19 (n)).

Finally, as an eighth step, die shear strength measurement is performed on the semiconductor device to be inspected (see FIGS. 19 (o) and 19 (p)).

Among the above-mentioned first to eighth steps, the first to fifth steps are semiconductor device manufacturing steps, and the remaining sixth to eighth steps are strength inspection steps. .

Next, the wire pull strength measurement (sixth step), the ball shear strength measurement (seventh step) and the die shear strength measurement (eighth step) performed on the semiconductor device formed by using the horizontal lead frame substrate. )about,
This will be described with reference to FIGS. 21, 22 and 23.

In the wire pull strength measurement performed in the sixth step, first, in the step 6-1, the horizontal lead frame substrate holding device 107 is arranged in the strength inspection device, and the horizontal lead frame substrate holding device 107 is placed in the horizontal lead frame substrate holding device 107. Horizontal lead frame substrate 1 having a plurality of semiconductor devices formed thereon
Fix 11 Next, the wire pull hook 123 is attached to the semiconductor load sensor 103 of the strength inspection device.
Further, one semiconductor device to be inspected is selected from the plurality of semiconductor devices (see FIG. 21A).

Subsequently, in a 6th-2 step, the XY table 102 and the Z table 104 are moved to place the wire pulling hook 123 near the gold wire 114 of the semiconductor device to be inspected (FIG. 21B). reference).

Then, as a sixth to third step, the XY table 102 and the Z table 104 are further moved,
The bent portion of the wire pull hook 123 is arranged below the gold wire 114 (see FIG. 21C).

Then, as a sixth to fourth step, the measurement is started by operating the operation switch 106 of the strength inspection device, the Z table 104 is automatically moved according to the control signal from the control section 105, and the wire pull hook is set. The semiconductor load sensor 103 to which 123 is attached rises (see FIG. 21 (d)).

Finally, as a sixth to fifth step, the gold wire 1
The Z table 104 continues to move until 14 is broken, and the wire pull strength is obtained by the control unit 105 based on the load applied to the gold wire 114 when the gold wire 114 is broken (see FIG. 21E).

On the other hand, in the ball shear strength measurement performed in the seventh step, first, in a step 7-1, the ball shear tool is attached to the semiconductor load sensor 103 of the strength inspection device in a state where the above-described wire pull strength measurement is completed. Attach 125 (see FIG. 22 (a)).

Subsequently, in the 7th-2 step, the XY table 102 and the Z table 104 are moved to place the ball shearing tool 125 in the vicinity of the gold ball 114a of the semiconductor device to be inspected (FIG. 22 (b). )reference). The gold ball 114a is the gold wire 114a.
Is formed when the semiconductor chip 113 is securely connected to a predetermined position.

Subsequently, as a seventh step, the measurement is started by operating the operation switch 106 of the strength inspection device, and the XY table 102 and the Z table 104 are automatically moved according to the control signal from the control section 105. , The upper surface of the semiconductor chip 113 is detected. That is, the tip of the ball shearing tool 125 contacts the upper surface of the semiconductor chip 113 (see FIG. 22C).

Then, as the 7th-4th step, the Z table 104 is automatically moved to move the ball sharing tool 125.
22. The tip end of is raised by a certain distance from the upper surface of the semiconductor chip 113 (see FIG. 22D).

Finally, as the 7th-5th step, the XY table 102 is automatically moved, and the ball sharing tool 12 is moved.
The ball shear strength is obtained by the control unit 105 based on the load required to peel off the gold ball 114a by the tip portion of No. 5 (see FIG. 22 (e)).

On the other hand, in the die shear strength measurement performed in the eighth step, first, in the eighth step, the die shear tool 126 is attached to the semiconductor load sensor 103 of the strength inspection device in a state where the above-mentioned ball shear strength measurement is completed. Is attached (see FIG. 23 (a)). Subsequently, as an 8th step, the XY table 102 and the Z table 104 are moved to dispose the die-sharing tool 126 in the vicinity of the semiconductor chip 113 (see FIG. 23B).

Then, in the 8th step, the measurement is started by operating the operation switch 106 of the strength inspection device, and the XY table 102 and the Z table 104 are automatically moved according to the control signal from the control unit 105. , The upper surface of the first lead frame 111a is detected. That is, the tip of the die shearing tool 126 contacts the upper surface of the first lead frame 111a (see FIG. 23 (c)).

Then, in the 8th-4th step, the Z table 104 is automatically moved, and the tip end portion of the die-sharing tool 126 is raised by a predetermined distance from the upper surface of the first lead frame 111a (FIG. 23 (d). )reference).

Finally, in the 8th-5th step, the XY table 102 is automatically moved and the die-sharing tool 126 is used.
The die shear strength is obtained in the control unit 105 based on the load required to peel off the semiconductor chip 113 by the front end of the (FIG. 23 (e)).

Next, a case will be described in which a semiconductor device on a vertical lead frame substrate is used as an object to be inspected for strength inspection instead of the semiconductor device on the horizontal lead frame substrate.

FIG. 24 is an explanatory view showing an example of a vertical lead frame substrate which is the object of strength inspection.
Is a plan view showing the vertical lead frame substrate, and FIG. 6B is a side view showing the vertical lead frame substrate.
24C is an enlarged plan view showing a semiconductor chip mounting portion (region C2 in FIG. 24A) of the vertical lead frame substrate, and FIG. 19D is a semiconductor chip mounting portion of the vertical lead frame substrate. FIG. 25 is an enlarged side view showing a portion (region C3 in FIG. 24B).

This vertical lead frame substrate 115 is formed by stamping out a conductive thin plate, and has a first lead frame 115a having a die bond area S1 and a second lead frame 115 having a second bond area S2.
and a plurality of pairs of lead frames each having a pair of lead frames b.

Next, a procedure for mounting a semiconductor chip on the vertical lead frame substrate 115 shown in FIG. 24 (that is, a semiconductor device manufacturing process) and a strength inspection process for the vertical lead frame substrate 115 after mounting will be described. This will be described with reference to 25. Note that FIG. 25 shows the semiconductor chip mounting portion (die bond area S1) of each pair of lead frames.
A plan view and a side view of the portion and the second bond area S2 portion) are shown for each step.

First, as the first step, the vertical lead frame substrate 115 is placed on a support (not shown) of the manufacturing apparatus (see FIGS. 25 (a) and 25 (b)).

Next, as a second step, the die bond paste 112 is applied to the die bond areas S1 of all the first lead frames 115a of the vertical lead frame substrate 115 (see FIGS. 25 (c) and 25 (d)).

Then, in a third step, the semiconductor chip 113 is mounted on each first lead frame 115a via the die bond paste 112 (FIG. 25 (e) and FIG. 2).
5 (f)).

Next, as a fourth step, the semiconductor chip 1
The vertical lead frame substrate 115 with 13 mounted therein is placed in a curing furnace (not shown), and the die bond paste 11
2 is cured (see FIG. 25 (g) and FIG. 25 (h)).

Then, in a fifth step, wire bonding is performed between the second bond areas S2 of all the second lead frames 115b and the electrodes (not shown) of all the semiconductor chips 113 using gold wires 114 ( 25 (i) and 25 (j)). In this way, a plurality of semiconductor devices having the first lead frame 115a and the second lead frame 115b as output terminals are manufactured.

Thereafter, as a sixth step, the vertical lead frame substrate pressing device 108 shown in FIG. 26 is arranged on the support base 101 of the strength inspection device shown in FIG. 17, and the vertical lead frame substrate pressing device 108 is arranged. The vertical lead frame substrate 115 is arranged between the vertical lead frame substrate mounting portion 108 a and the contact portion 108 b. The vertical lead frame substrate mounting portion 108a is a member having an L-shaped cross section, and a recess 108a1 for inserting the vertical lead frame substrate 115 is provided on the outer surface of the vertical portion thereof. The contact portion 108b is a member for pressing and fixing the vertical lead frame substrate 115 into the recess 108a1. As described above, in the state in which the vertical lead frame substrate 115 is arranged on the vertical lead frame substrate mounting portion 108a, a semiconductor device to be inspected is selected from a plurality of semiconductor devices, and the semiconductor device to be inspected is selected. On the other hand, the wire pull strength measurement is performed as in the case of the horizontal lead frame substrate (see FIG. 21) (FIG. 25).
(K) and FIG. 25 (l)).

Next, as a seventh step, ball shear strength measurement is performed on the semiconductor device to be inspected as in the case of the horizontal lead frame substrate (see FIG. 22) (FIG. 25 (m) and FIG. 25 ( n)).

Finally, as the eighth step, the die shear strength is measured for the semiconductor device to be inspected, as in the case of the horizontal lead frame substrate (see FIG. 23) (FIG. 25 (o) and FIG. 25 ( p)).

Of the above-mentioned first to eighth steps, the first to fifth steps are semiconductor device manufacturing steps, and the remaining sixth to eighth steps are strength inspection steps. .

Next, the conventional strength inspection procedure when the strength inspection of the horizontal lead frame substrate 111 and the strength inspection of the vertical lead frame substrate 115 are carried out in series is shown in FIG.
It will be described according to the flowchart shown in FIG.

First, as a first step, which type of lead frame the semiconductor device to be inspected is mounted is selected (S101). That is, in this example, the horizontal lead frame substrate is selected (S1
The result of 01 is "in the case of a horizontal lead frame substrate").

Then, as a second step, in order to perform strength inspection of the horizontal lead frame substrate 111, the horizontal lead frame substrate pressing device 107 is attached and fixed to the support base 101 of the strength inspection device (S102).

Subsequently, as a third step, the horizontal lead frame substrate 111 is fixed to the horizontal lead frame substrate pressing device 107 (S103).

Then, as a fourth step, the wire pull strength, ball shear strength and die shear strength are measured by a strength inspection device (S104, S105 and S106).

After the inspection is completed, as a fifth step, the horizontal lead frame substrate 111 is taken out from the horizontal lead frame substrate pressing device 107 (S107).

Subsequently, as a sixth step, the horizontal lead frame substrate pressing device 107 is removed from the support base 101 (S108).

Then, as a seventh step, it is judged whether or not the inspection of all the lead frame substrates is completed (S10).
9). In this example, next, the semiconductor device mounted on the vertical lead frame substrate 115 is inspected (S1).
The determination result of 09 is NO).

Then, as an eighth step, which type of lead frame the semiconductor device to be inspected next is mounted is selected (S101). That is, in this embodiment, the vertical lead frame substrate is selected (S
The result of 101 is “in the case of a vertical lead frame substrate”).

Then, as a ninth step, in order to perform strength inspection of the vertical lead frame substrate 115, the vertical lead frame substrate pressing device 108 is attached and fixed to the support base 101 of the strength inspection device (S110).

Subsequently, as a tenth step, the vertical lead frame substrate 115 is fixed to the vertical lead frame substrate pressing device 108 (S111).

Then, as an eleventh step, the wire pull strength, the ball shear strength and the die shear strength are measured by a strength inspection device (S104, S105 and S10).
6).

Then, as a twelfth step, the horizontal lead frame substrate 115 is taken out from the vertical lead frame substrate pressing device 108 (S112).

Finally, as a thirteenth step, the support base 101
The vertical lead frame substrate pressing device 108 is removed from (S113).

In this example, the strength inspection of the semiconductor device on the horizontal lead frame substrate 111 is performed by 1
The strength inspection is performed once for the semiconductor device on the vertical lead frame substrate 115, but repeated inspection is performed until there is no lead frame substrate to be inspected (that is, until the result of S109 is YES). You can go.

As described above, in the conventional strength inspection method,
When measuring the strength of the semiconductor device on the horizontal lead frame substrate 111, the horizontal lead frame substrate holding device 107 is used, and when measuring the strength of the semiconductor device on the vertical lead frame substrate 111, the vertical lead frame substrate 111 is used. The frame substrate pressing device 108 was used. Therefore, it takes about 5 minutes to replace the lead frame substrate holding device.
It takes more than a minute.

[0063]

As described above, the lead frame substrate retainer in the conventional strength inspection apparatus is used for the horizontal lead frame substrate retainer when measuring the strength of the semiconductor device on the horizontal lead frame substrate. When measuring the strength of a semiconductor device on a vertical lead frame substrate by using, a vertical lead frame substrate pressing device was used. Therefore, it is necessary to replace the lead frame pressing device every time the mold of the lead frame substrate to be inspected is changed, and this replacement work takes time.

If the lead frame substrate is thin, when it is fixed to the lead frame substrate retainer,
There have been quality problems such as the lead frame substrate being flexibly deformed and the gold wire being deformed.

The present invention was devised to solve such a problem, and it is an object of the present invention to provide a lead frame substrate retainer which can be commonly used for a horizontal lead frame substrate and a vertical lead frame substrate.

[0066]

A lead frame substrate retainer of the present invention is a lead frame substrate retainer used for inspection of wire pull strength, ball shear strength and die shear strength, and is for positioning a horizontal lead frame substrate. A jig, a holding jig for holding and fixing the horizontal lead frame substrate on the positioning jig, a moving mechanism for moving the holding jig so as to move closer to and away from the positioning jig, and a vertical lead frame. It is composed of a pair of holding jigs for holding and fixing the substrate, and a moving mechanism for moving one holding jig so as to move closer to and further away from the other holding jig.

Further, a supply member for supplying the horizontal lead frame substrate to the positioning jig and supplying the vertical lead frame substrate to the holding jig is provided.

The moving mechanism is an air cylinder.

[0069]

BEST MODE FOR CARRYING OUT THE INVENTION Next, an embodiment of a lead frame substrate pressing device of the present invention will be described with reference to the drawings.

FIG. 1 is a plan view showing an embodiment of a lead frame substrate pressing device of the present invention, and FIG. 2 is a side view of the lead frame substrate pressing device shown in FIG. 1 as seen from the direction indicated by arrow A1. FIG. 1 and FIG. 2 show the lead frame substrate pressing device installed in the strength inspection device. The semiconductor load sensor is not shown in FIG.

This lead frame substrate pressing device 1 is
A positioning jig 2 for positioning the horizontal lead frame substrate 111 and the horizontal lead frame substrate 11 shown in FIG.
Holding jigs 3a and 3b for pressing and fixing 1 on the positioning jig 2, and vertical moving mechanisms 4a and 4b for vertically moving the pressing jigs 3a and 3b so as to approach and separate from the positioning jig 2. And the holding jigs 6a, 6 for holding and fixing the vertical lead frame substrate 115 shown in FIG.
b, and a back-and-forth moving mechanism 7 for moving one holding jig 6a back and forth so as to approach and separate from the other holding jig 6b.

Further, the lead frame substrate holding device 1
Is fixed to an XY table 8 equipped with a high precision ball screw and a stepping motor, and can be pitch-moved in the X and Y directions by an operation switch (not shown). Therefore, since the movement of the lead frame substrate pressing device 1 can be controlled by the pitch feed, the work of aligning the inspection target object with respect to the semiconductor load sensor 9 can be performed in a short time.

On the other hand, the positioning jig 2 has a groove portion 2a into which the horizontal lead frame substrate 111 can be fitted, and is used only when performing a strength inspection of the semiconductor device formed on the horizontal lead frame substrate 111. The horizontal lead frame substrate 111 is prepared for each type such as the shape. This positioning jig 2 is fixed to the XY table 8 at the time of use and can be easily attached to the lead frame substrate retainer 1 simply by fitting it into the recesses of the support members 10a and 10b that support the vertical movement mechanisms 4a and 4b. Can be installed at

The pressing jigs 3a and 3b can be moved up and down by vertical moving mechanisms 4a and 4b such as air cylinders, and the semiconductor chip mounting portion of the horizontal lead frame substrate 111 is opposed to the semiconductor load sensor 9. In the state
The horizontal lead frame substrate 111 can be pressed into the groove 2a of the positioning jig 2 with the comb-shaped tip.

The holding jigs 6a and 6b are a fixed-side holding jig 6a fixed to the XY table 8 and a moving-side holding jig 6b which can be moved back and forth by a front-back moving mechanism 7 such as an air cylinder. It consists of This clamping jig 6a,
6b holds the vertical lead frame substrate 115 with two holding jigs 6a and 6b.
The semiconductor chip mounting portion can be fixed in a state of facing the semiconductor load sensor 9. The XY table 8 is driven by an operation by an operation switch or a control signal from a control unit (not shown), similarly to the conventional one.

The semiconductor load sensor 9 can be moved in the Z-axis direction by a Z table (not shown) in the same manner as the conventional load sensor, and is operated by an operation switch or controlled by a control unit (not shown). Driven by a signal.

Further, in this embodiment, the horizontal lead frame substrate 111 and the vertical lead frame substrate 1 before inspection are used.
15 is housed in a supply member composed of a housing member 11 and a housing member loader 12, and the housing member 11 supplies the horizontal lead frame substrate 111 to the positioning jig 2 and holds and holds the vertical lead frame substrate 115. It can be supplied to the tools 6a and 6b. Further, the storage member 11 is arranged in the storage member loader 12 at the time of inspection, and the storage member loader 12 places the horizontal lead frame substrate 111 or the vertical lead frame substrate 115 at a predetermined position of the lead frame substrate retainer 1. It can be supplied while sliding. By using such a supply method, the horizontal lead frame substrate 111
It is possible to prevent flexural deformation that occurs when the vertical lead frame substrate 115 is placed in the lead frame substrate retainer 1, deformation of the gold wire line, and disconnection.

Next, a procedure for inspecting the strength of a semiconductor device using the lead frame substrate pressing device of the present invention will be described. In this example, a case where the strength inspection of the horizontal lead frame substrate 111 is first performed and then the strength inspection of the vertical lead frame substrate 115 is performed will be described.

FIG. 3 is a flow chart showing an example of the strength inspection procedure of this semiconductor device. FIG. 4 is a plan view showing an example of the lead frame substrate retainer when the horizontal lead frame substrate is being supplied to the lead frame substrate retainer, and FIG. 5 shows the lead frame substrate retainer shown in FIG. It is the side view seen from the direction shown by A2, and FIG. 6 is a partially expanded side view which shows the area | region B1 in FIG. FIG. 7 is a plan view showing an example of the lead frame substrate retainer with the horizontal lead frame substrate fixed, and FIG. 8 is a partially enlarged side view showing a region B2 in FIG. 9 is a side view of the lead frame substrate retainer shown in FIG. 7 as seen from the direction indicated by arrow A3, and FIG. 10 is a partially enlarged side view showing a region B3 in FIG. 11 is a plan view showing an example of the lead frame substrate retainer when the vertical lead frame substrate is being supplied to the lead frame substrate retainer, and FIG. 12 is a lead frame substrate retainer shown in FIG. It is the side view which looked at the apparatus from the direction shown by arrow A4, and FIG. 13 is a partially expanded side view which shows the area | region B4 in FIG. 14 is a plan view showing an example of the lead frame substrate retainer with the vertical lead frame substrate fixed, and FIG. 15 shows the lead frame substrate retainer shown in FIG. 14 by an arrow A5. 16 is a side view seen from the direction, and FIG. 16 is a partially enlarged side view showing a region B5 in FIG.

First, as a first step, which type of lead frame the semiconductor device to be inspected is mounted is selected (S1). That is, in this embodiment, the horizontal lead frame substrate is selected (S1).
The result is "for horizontal leadframe substrate").

Subsequently, as a second step, the worker
As shown in, the positioning jig 2 is mounted in the recesses of the support members 10a and 10b (S2).

Subsequently, as a third step, the worker inserts the storage member 11 in which the horizontal lead frame substrate on which the semiconductor device to be inspected is mounted is stored in the storage member loader 12.
(S3).

Subsequently, as the fourth step, the XY table 8
Is operated by the operation switch to move the lead frame substrate pressing device 1 to the storage member 11 side. further,
As shown in FIGS. 4 to 6, the horizontal lead frame substrate 111 is transported from the storage member 11 to the positioning jig 2 while sliding (S4).

Subsequently, in a fifth step, the operator operates the operation switches to drive the vertical movement mechanisms 4a and 4b, so that the horizontal jigs are moved by the holding jigs 3a and 3b as shown in FIGS. The lead frame substrate 111 is pressed and fixed to the positioning jig 2 (S5).

Then, in a sixth step, the XY table 8 and the Z table are driven in accordance with the control signal from the control unit, and the wire pull strength, ball shear strength and die shear strength are measured in the same procedure as the conventional procedure. Be told (S6,
S7 and S8).

Subsequently, as a seventh step, after returning the inspected horizontal lead frame substrate 111 to the storage member 11 (S9), it is determined whether or not inspection of all the lead frame substrates has been completed (S10). ). In this embodiment, next, the semiconductor device mounted on the vertical lead frame substrate 115 is inspected (the determination result of S10 is NO).

Subsequently, as an eighth step, which type of lead frame the semiconductor device to be inspected next is mounted is selected (S1). That is, in this embodiment, the vertical lead frame substrate is selected (the result of S1 is "in the case of vertical lead frame substrate").

Subsequently, as a ninth step, the operator removes the positioning jig 2 which is unnecessary in the case of the vertical lead frame substrate 115 (S11).

Subsequently, as a tenth step, the XY table 8 is operated by the operation switch to move the lead frame substrate pressing device 1 to the housing member 11 side. Further, as shown in FIGS. 11 to 13, the vertical lead frame substrate 1 is inserted from the storage member 11 into the gap between the holding members 6a and 6b.
It is conveyed while sliding 15 (S4).

Subsequently, in an eleventh step, the operator operates the operation switch to drive the forward / backward moving mechanism 7, whereby the holding jig 6a,
The vertical lead frame substrate 115 is clamped and fixed by 6b (S5).

Subsequently, in a twelfth step, the XY table 8 and the Z table are driven according to the control signal from the control section,
The wire pull strength, ball shear strength, and die shear strength are measured in the same procedure as the conventional procedure (S
6, S7 and S8).

Finally, as a thirteenth step, the vertical lead frame substrate 115 that has been inspected is returned to the storage member 11 (S9).

In the present embodiment, one horizontal lead frame substrate 111 and one vertical lead frame substrate 115 are sequentially inspected, but the number of lead frame substrates and the order of inspection are not limited to this. The strength inspection is repeated until the inspection of all the lead frame substrates is completed (that is, the determination result in S10 is YES).

Further, in the lead frame substrate pressing device of the present invention, when the lead frame substrate is conveyed to the lead frame substrate pressing device, the motor pitch feed control by the XY table equipped with the stepping motor is used. It is possible to shorten the time required to replace the frame substrate.

[0095]

As described above, according to the present invention,
In the inspection of wire pull strength, ball shear strength, and die shear strength, the lead frame substrate is directly conveyed from the storage member to the lead frame substrate retainer, which causes damage such as scratches and bending when the lead frame substrate retainer is placed. Without doing so, reliability and measurement accuracy can be improved. In addition, the same lead frame substrate retainer can be shared for horizontal lead frame substrates and vertical lead frame substrates of different types by simply using a positioning jig that can be easily attached and detached.
The time required to replace the lead frame substrate can be shortened.

[Brief description of drawings]

FIG. 1 is a plan view showing an embodiment of a lead frame substrate pressing device of the present invention.

FIG. 2 is a side view of the lead frame substrate retainer shown in FIG. 1 viewed from a direction indicated by an arrow A1.

FIG. 3 is a flowchart showing an example of a strength inspection procedure of a semiconductor device.

FIG. 4 is a plan view showing an example of a lead frame substrate retainer when a horizontal lead frame substrate is being supplied to the lead frame substrate retainer.

5 is a side view of the lead frame substrate retainer shown in FIG. 4 viewed from a direction indicated by an arrow A2.

6 is a partially enlarged side view showing a region B1 in FIG.

FIG. 7 is a plan view showing an example of a lead frame substrate retainer with a horizontal lead frame substrate fixed.

FIG. 8 is a partially enlarged side view showing a region B2 in FIG.

9 is a side view of the lead frame substrate retainer shown in FIG. 7 as seen from the direction indicated by arrow A3.

10 is a partially enlarged side view showing a region B3 in FIG.

FIG. 11 is a plan view showing an example of a lead frame substrate retainer when a vertical lead frame substrate is being supplied to the lead frame substrate retainer.

12 is a side view of the lead frame substrate retainer shown in FIG. 11 as seen from the direction indicated by arrow A4.

13 is a partially enlarged side view showing a region B4 in FIG.

FIG. 14 is a plan view showing an example of a lead frame substrate retainer with a vertical lead frame substrate fixed.

15 is a side view of the lead frame substrate retainer shown in FIG. 14 as seen from the direction indicated by arrow A5.

16 is a partially enlarged side view showing a region B5 in FIG.

FIG. 17 is a perspective view schematically showing an example of a conventional strength inspection device.

FIG. 18 is an explanatory diagram showing an example of a horizontal lead frame substrate which is a target of a strength inspection.

FIG. 19 is a process explanatory view showing an example of a conventional strength inspection procedure for a horizontal lead frame substrate.

FIG. 20 is a perspective view showing an example of a conventional horizontal lead frame substrate pressing device.

FIG. 21 is a process explanatory view showing an example of a wire pull strength measurement procedure.

FIG. 22 is a process explanatory view showing an example of a ball shear strength measuring procedure.

FIG. 23 is a process explanatory view showing an example of a die shear strength measurement procedure.

FIG. 24 is an explanatory diagram showing an example of a vertical lead frame substrate which is a target of a strength inspection.

FIG. 25 is a process explanatory view showing an example of a conventional strength inspection procedure for a vertical lead frame substrate.

FIG. 26 is a perspective view showing an example of a conventional vertical lead frame substrate pressing device.

FIG. 27 is a flowchart showing another example of the conventional strength inspection procedure.

[Explanation of symbols]

1 Lead frame substrate holder 2 Positioning jig 3a, 3b holding jig 4a, 4b Vertical movement mechanism 5 Vertical lead frame substrate 6a, 6b clamping jig 7 Forward / backward movement mechanism 8 XY table 9 Semiconductor load sensor 10a, 10b Support member 11 Storage member 12 Storage member loader 111 Horizontal lead frame substrate 115 Vertical Lead Frame Substrate

Continuation of the front page (56) Reference JP-A-6-209118 (JP, A) JP-A-5-74906 (JP, A) JP-A-8-17879 (JP, A) JP-A-5-102203 (JP , A) (58) Fields investigated (Int.Cl. ⁷ , DB name) G01M 13/00 H01L 21/50

Claims (3)

(57) [Claims] 1. A lead frame substrate pressing device used for inspection of wire pull strength, ball shear strength, and die shear strength, which comprises a positioning jig for positioning a horizontal lead frame substrate and a horizontal lead frame substrate pressed against the positioning jig. A holding jig for fixing the holding jig, a moving mechanism for moving the holding jig so as to move closer to and away from the positioning jig, and a pair of holding jigs for holding and fixing the vertical lead frame substrate. A lead frame substrate retainer comprising: a moving mechanism that moves one holding jig so as to move closer to and away from the other holding jig. 2. The lead frame substrate retainer according to claim 1, further comprising a supply member that supplies a horizontal lead frame substrate to the positioning jig and a vertical lead frame substrate to the holding jig. 3. The lead frame substrate retainer according to claim 1, wherein the moving mechanism is an air cylinder.