JP4185225B2 - Contact probe inspection system - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an inspection apparatus for inspecting the position and electrical characteristics of a contact pin of a contact probe that performs an electrical test by contacting each terminal of a semiconductor IC chip, a liquid crystal device, or the like.
[0002]
[Prior art]
In general, contact pins are used to perform an electrical test by contacting each terminal of a semiconductor chip such as an IC chip or LSI chip or an LCD (liquid crystal display).
In recent years, with the high integration and miniaturization of IC chips and the like, the pitch of contact pads, which are electrodes, has been reduced, and there has been a demand for a narrower pitch of contact pins. However, with a tungsten needle contact probe used as a contact pin, it is difficult to cope with a narrow multi-pin pitch due to the limit of the diameter of the tungsten needle.
[0003]
On the other hand, for example, in Japanese Patent Publication No. 7-82027, a plurality of pattern wirings are formed on a resin film, and respective tip portions of these pattern wirings are arranged in a protruding state from the resin film to form contact pins. Technology has been proposed. In this technical example, the tip portions of a plurality of pattern wirings are used as contact pins to reduce the pitch of the multi-pins and eliminate the need for many complicated parts.
[0004]
As shown in FIG. 6, the contact probe 1 has a structure in which a pattern wiring 3 formed of Ni (nickel) or Ni alloy is attached to one surface of a polyimide resin film 2. The tip of the pattern wiring 3 protrudes from the contact pin 3a.
The contact probe 1 can contact the rear end side of the pattern wiring 3 with the electrode of the printed circuit board, and can transmit a signal obtained from the pattern wiring 3 to an external inspection device or the like through the electrode of the printed circuit board. Yes.
Reference numeral 4 denotes an alignment hole.
[0005]
The contact probe 1 has a narrow pitch and multi-pin configuration corresponding to the IC chip or the like to be measured, and it is necessary to inspect whether or not desired characteristics can be obtained as a contact probe after fabrication.
Conventionally, as an inspection apparatus for inspecting such a contact probe, an electrical inspection is performed by bringing the needle tip of the inspection apparatus into contact with a contact pin, or contact resistance is examined by pressing the contact pin against a metal conduction plate. Used to inspect the variation in the height position of the contact pins.
[0006]
[Problems to be solved by the invention]
However, the following problems remain in the conventional inspection apparatus. That is, when inspecting a contact pin (for example, a power pin or a ground pin) whose pattern wiring is made into a bus, in order to perform inspection by positioning and contacting a separate needle for detecting a needle tip to each contact pin. There is an inconvenience that the measurement time and cost for the contact pins that have been increased.
In addition, there is a disadvantage that it is impossible to accurately inspect the variation in height position for each contact pin simultaneously with the individual electrical inspection for each contact pin.
[0007]
The present invention has been made in view of the above-described problems, and provides a contact probe inspection apparatus that can individually inspect each contact pin at the same time and can also measure variations in the height position of the contact pin. Objective.
[0008]
[Means for Solving the Problems]
The present invention employs the following configuration in order to solve the above problems. That is, the contact probe inspection apparatus according to claim 1 is an inspection apparatus for inspecting the positions and electrical characteristics of a plurality of contact pins included in the contact probe, the probe support mechanism for supporting the contact probe, and the plurality of contact probes. An inspection plate whose surface can be contacted to the tip of the contact pin, an inspection plate support mechanism for positioning and supporting the inspection plate, and electrical characteristics of the contact pin connected to the inspection plate and the contact probe Measuring board, and the inspection plate is made of an insulating substrate of a resin film, and a plurality of electroplating plates that are bonded to the insulating substrate with an adhesive and are electrically connected to the wiring of the measuring device. The plurality of pattern wirings are arranged at the same positions as the electrode pads of the measurement object of the contact probe. Technology and a contact pad portions are employed.
[0009]
In this contact probe inspection apparatus, an inspection plate includes an insulating substrate made of a resin film, and a plurality of electroplated pattern wirings that are bonded to the insulating substrate with an adhesive and are electrically connected to the wiring of a measuring instrument. Since a plurality of pattern wirings are provided with contact pad portions arranged at the same positions as the electrode pads of the measurement object of the contact probe, each contact pin of the contact probe supported by the probe support mechanism By positioning and contacting the contact pads of the test plate supported by the test plate support mechanism, all the contact pads corresponding to each contact pin can be brought into contact with a single positioning. It is possible to inspect the electrical characteristics and contact resistance.
[0010]
The contact probe inspection apparatus according to claim 2, wherein in the contact probe inspection apparatus according to claim 1, each of the plurality of pattern wirings includes a connection pad portion connected to the wiring of the measuring instrument. The connection pad portion employs a technique that is concentrated in one area.
[0011]
According to this contact probe inspection device, since the connection pad portions are concentrated in one area, it is easy to connect to the wiring of the measuring instrument and the inspection plate can be miniaturized. It is.
[0012]
The contact probe inspection device according to claim 3, wherein the inspection plate support mechanism is configured to contact the contact pin with the inspection plate in contact with the contact pin. A technique including an inspection plate moving mechanism that moves the test plate toward the head is employed.
[0013]
In the contact probe inspection apparatus, the inspection plate support mechanism includes an inspection plate moving mechanism that moves the inspection plate toward the contact pin in a state where the inspection plate is in contact with the contact pin. It is possible to measure the contact resistance by changing the amount of overdrive, and it is possible to inspect the variation in the height position of the contact pin more accurately.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
A contact probe inspection apparatus according to a first embodiment of the present invention will be described below with reference to FIGS.
In these drawings, reference numeral 5 denotes a probe support mechanism, 6 denotes an inspection plate, 7 denotes an inspection plate support mechanism, and 8 denotes a tester.
[0015]
As shown in FIG. 1, the inspection apparatus according to the present embodiment is configured such that the contact probe 1 for inspecting the electrical characteristics of an electric circuit or the like formed on an IC chip has a plurality of contact pins 3 a and positions of the contact probe 1. The electrical characteristics are inspected.
[0016]
This inspection apparatus includes a probe support mechanism 5 that supports the contact probe 1 in a horizontal state, an inspection plate 6 that is arranged so that the surface can be in contact with the tips of a plurality of contact pins 3a, and a horizontal position by positioning the inspection plate 6. An inspection plate support mechanism 7 that supports the state, and a tester (measuring instrument) 8 that is connected to the inspection plate 6 and the contact probe 1 and measures the electrical characteristics of the contact pins 3a are provided.
[0017]
As shown in FIG. 2, the inspection plate 6 includes an electrically insulating substrate 9 made of a polyimide resin film and a plurality of inspections formed on the surface of the insulating substrate 9 and electrically connected to the wiring of the tester 8. The inspection board wiring 10 includes a board wiring (pattern wiring) 10, and the inspection board wiring 10 includes a contact pad portion 10 a arranged at the same position as an electrode pad of an IC chip that is a measurement target of the contact probe 1.
[0018]
Each inspection board wiring 10 includes a connection pad portion 10 b connected to the wiring of the tester 8, and these connection pad portions 10 b are arranged in a row in the vicinity of the four sides of the inspection plate 6.
In addition, the code | symbol 10c is a hole for positioning.
[0019]
The probe support mechanism 5 includes a mechanical part 11 that clamps and fixes the contact probe 1, and a plurality of electrode pads 12 a to which the mechanical part 11 is attached and electrically connected to the inspection plate wiring 10 of the contact probe 1. A printed circuit board 12 and a card holder 13 to which the printed circuit board 12 is fixed so that the pogo pins 13a are in contact with the corresponding electrode pads 12a are provided.
[0020]
The inspection plate support mechanism 7 includes an inspection plate table 14 on which the inspection plate 6 is placed and fixed, and a table driving mechanism (inspection plate moving mechanism) 15 that moves the inspection plate table 14 together with the inspection plate 6 in the vertical direction. It has. The table drive mechanism 15 includes a drive motor (not shown) and the like, and the contact pin 3a is fixed in a state where the inspection plate 6 is fixed to the inspection plate table 14 according to an instruction from the tester 8 or in conjunction with the tester 8. It can be moved toward.
[0021]
The tester 8 includes a first switch X for switching between the contact pins 3 a connected to the tester 8 and a second switch Y for switching between the inspection plate wiring 10 connected to the tester 8. It is connected.
The first switch X and the second switch Y are electrically connected to the pogo pins 13a and the connection pad portion 10b, respectively, so that the tester 8 can be connected to the arbitrary pogo pins 13a and the connection pad portion 10b. Is set.
[0022]
Next, the manufacturing method of the test | inspection board 6 in this embodiment is demonstrated in order of a process with reference to FIG.
[0023]
[Base metal layer formation process]
First, as shown in FIG. 3A, a base metal layer 17 is formed on a support metal plate 16 made of stainless steel by Cu (copper) plating.
[0024]
[Pattern formation process]
After a photoresist layer 18 is formed on the base metal layer 17, as shown in FIG. 3B, a photomask M having a predetermined pattern is applied to the photoresist layer 18 by photolithography and exposed. As shown in FIG. 3C, the photoresist layer 18 is developed to remove the portion to be the pattern wiring 2 and form an opening 18a in the remaining photoresist layer 18.
[0025]
In the present embodiment, the photoresist layer 18 is formed of a negative photoresist, but a positive photoresist may be employed to form the desired openings 18a and 18b.
In the present embodiment, the photoresist layer 18 serves as a “mask”. However, the “mask” is not limited to the one in which the opening 18a is formed through the exposure / development process using the photomask M like the photoresist layer 18 of the present embodiment. For example, a film or the like in which holes are formed in advance at a place to be plated (that is, formed in advance in a state indicated by reference numeral 18 in FIG. 3C) may be used. When such a film or the like is used as a “mask”, the pattern forming step in this embodiment is not necessary.
[0026]
[Plating process]
Then, as shown in FIG. 3D, a Ni alloy layer N to be the inspection plate wiring 10 is formed in the opening 18a by electrolytic plating.
After the plating process, the photoresist layer 18 is removed as shown in FIG.
[0027]
[Film deposition process]
Next, as shown in FIG. 3F, an insulating substrate 9 made of a polyimide resin film is bonded onto the Ni alloy layer N with an adhesive 19.
[0028]
[Separation process]
Then, as shown in FIG. 3 (g), after separating the insulating substrate 9, the inspection plate wiring 10 and the base metal layer 17 from the supporting metal plate 16, the insulating substrate is subjected to Cu etching. 9 is a state in which only the inspection board wiring 10 is adhered.
[0029]
[Gold coating process]
Then, as shown in FIG. 3H, the exposed test plate wiring 10 is subjected to Au plating to form an Au layer AU on the surface.
[0030]
The inspection plate 6 having the inspection plate wiring 10 as shown in FIG.
Thus, the inspection board wiring 10 including the contact pad portion 10a can be formed with high accuracy by patterning with a mask, and the inspection board wiring 10 and the contact pad portion 10a can be formed only by changing the mask. Since the arrangement can be changed, various inspection plates can be easily and inexpensively manufactured, and a variety of contact probe inspections can be handled.
[0031]
When the contact probe 1 is inspected using the inspection apparatus configured as described above, first, the contact probe 1 is assembled into the mechanical part 11 and attached to the printed circuit board 12, and the printed circuit board 12 is attached to the card holder 13. It is attached to. On the other hand, the inspection plate 6 is attached to a predetermined position of the inspection plate table 14.
[0032]
Then, the inspection plate 6 on the inspection plate table 14 is moved toward the contact probe 1 by the table drive mechanism 15 and positioned close to a predetermined position where the contact pin 3a contacts the contact pad portion 10a.
In addition, the first switching device X and the second switching device Y perform a wiring switching process for connecting the contact pin 3a to be tested and the tester 8 and connecting the corresponding contact pad portion 10a and the tester 8.
[0033]
In this state, the tester 8 measures the electrical characteristics such as contact resistance of the contact pin 3a to be inspected, and further repeats the switching process of the connection by the first switch X and the second switch Y, and other contact pins The same measurement is performed at 3a. As a result, the electrical characteristics of the individual contact pins 3a can be inspected with only one positioning.
[0034]
Further, after the measurement at this position is finished, the table drive mechanism 15 moves the inspection plate table 14 in the vertical direction to change the overdrive amount of the contact pin 3a applied to the contact pad portion 10a, and again the above. The same measurement is performed. That is, as shown in FIG. 4, the contact resistance tends to become smaller as the overdrive amount becomes larger up to a predetermined overdrive amount. Therefore, not only the electrical characteristics but also the obtained contact resistance and the inspection moved. Variation in the height position of each contact pin 3a can be inspected from the positional relationship with the plate 6.
[0035]
Note that not only the height of the contact pin 3a but also the horizontal displacement is large, and when the displacement is large, the contact pad 3a is disconnected from the contact pad portion 10a even when the overdrive amount is sufficient. Since it disappears, it can be detected.
[0036]
Next, a second embodiment of the contact probe inspection apparatus according to the present invention will be described with reference to FIG.
[0037]
The difference between the second embodiment and the first embodiment is that the inspection board 6 of the first embodiment has connection pads 10b arranged in a row near the four sides of the inspection board 6, respectively. In the inspection board 20 of the second embodiment, as shown in FIG. 5, the contact pad portions 21a of the inspection board wiring 21 are arranged in the same manner as in the first embodiment, but each connection pad portion 21b is one region. It differs in that it is concentrated on A. [0038]
That is, according to this inspection apparatus, since the connection pad portions 21b are concentrated in one area A, it is easy to connect to the wiring of the tester 8, and the inspection plate 20 can be downsized. Is possible.
[0039]
The present invention includes the following embodiments.
(1) In each of the above embodiments, the inspection plate wirings 10 and 21 are formed on the insulating substrate 9 formed of the polyimide resin film, and the inspection plates 6 and 20 are formed. However, the inspection plate wiring is formed on the insulating substrate. Others may be used as long as they are formed. For example, a printed board may be used as the inspection board.
[0040]
(2) The alignment between the contact pin and the contact pad portion may be performed manually by a microscope or the like, or may be performed by automatically recognizing these positions from an image using a CCD or the like.
(3) Although Ni is coated with Au to form the contact pad portion, it may be formed of another highly conductive metal. For example, Cu or Ag may be adopted.
[0041]
(4) The inspection apparatus of the above embodiment inspects a contact probe whose inspection target is an IC chip, but inspects a contact probe whose inspection target is another electronic component (such as a semiconductor chip or a liquid crystal device). It may be a thing. Even in this case, the position of the contact pad portion is set similarly to the arrangement of the electrode pads of these electronic components.
[0042]
【The invention's effect】
The present invention has the following effects.
(1) According to the contact probe inspection apparatus of the first aspect, the inspection plate is electrically connected to the insulating substrate of the resin film and the wiring of the measuring instrument bonded to the insulating substrate with an adhesive. It consists of a plurality of pattern wirings made of electrolytic plating, and each of the plurality of pattern wirings has a contact pad portion arranged at the same position as the electrode pad of the measurement object of the contact probe. All of the contact pad portions corresponding to the pins can be brought into contact, and the electrical characteristics and contact resistance can be individually inspected for each contact pin.
Accordingly, application to bus contact pins and contact pin displacement (particularly, height position variation) inspection can be performed collectively, and inspection time and cost can be greatly reduced.
Also, since the contact pad is the same as the electrode pad to be measured by the actual contact probe, check the contact status and check the status of the needle trace etc. in a form closer to the contact probe usage. You can also.
Further, the inspection plate can be replaced corresponding to the contact probe, and can be easily applied to various contact probes.
[0043]
(2) According to the contact probe inspection apparatus of the second aspect, since the connection pad portions are concentrated in one area, the connection with the wiring of the measuring instrument is facilitated, and the inspection plate Can be miniaturized.
[0044]
(3) According to the inspection apparatus for a contact probe according to claim 3, the inspection plate support mechanism includes an inspection plate moving mechanism that moves the inspection plate toward the contact pin in a state where the inspection plate is in contact with the contact pin. Therefore, it becomes easy to measure the contact resistance by changing the amount of contact pin overdrive applied to the contact pad portion, and it is possible to inspect the variation in the height position of the contact pin more accurately.
[Brief description of the drawings]
FIG. 1 is an overall configuration diagram showing a first embodiment of a contact probe inspection apparatus according to the present invention.
FIG. 2 is a plan view showing an inspection plate in the first embodiment of the contact probe inspection apparatus according to the present invention.
FIG. 3 is a cross-sectional view of an essential part showing the inspection plate manufacturing method in the first embodiment of the contact probe inspection apparatus according to the present invention in the order of steps;
FIG. 4 is a graph showing the relationship between overdrive amount and contact resistance in the first embodiment of the contact probe inspection apparatus according to the present invention.
FIG. 5 is a plan view showing an inspection plate in a second embodiment of the contact probe inspection apparatus according to the present invention.
FIG. 6 is a perspective view of a main part showing a contact probe.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Contact probe 2 Pattern wiring 3a Contact pin 5 Probe support mechanism 6, 20 Inspection board 7 Inspection board support mechanism 8 Tester (measuring instrument)
9 Insulating substrate 10, 21 Inspection board wiring (pattern wiring)
10a, 21a Contact pad 10b, 21b Connection pad

Claims (3)

An inspection device for inspecting the position and electrical characteristics of a plurality of contact pins of a contact probe,
A probe support mechanism for supporting the contact probe;
An inspection plate arranged such that the surface can be contacted to the tips of the plurality of contact pins;
An inspection plate support mechanism for positioning and supporting the inspection plate;
A measuring instrument connected to the inspection plate and the contact probe to measure electrical characteristics of the contact pin;
The inspection plate comprises an insulating substrate of a resin film, and a plurality of pattern wirings made of electrolytic plating that are electrically connected to the wiring of the measuring instrument bonded to the insulating substrate with an adhesive ,
The contact pattern inspection apparatus, wherein the plurality of pattern wirings include a contact pad portion arranged at the same position as the electrode pad of the measurement object of the contact probe. The contact probe inspection apparatus according to claim 1,
The plurality of pattern wirings each include a connection pad portion connected to the wiring of the measuring instrument,
These contact pad inspection devices are arranged in a concentrated manner in one region. The contact probe inspection apparatus according to claim 1 or 2,
The inspection plate support mechanism includes an inspection plate moving mechanism that moves the inspection plate toward the contact pin in a state where the inspection plate is in contact with the contact pin.

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