JPH11352151A - Contact probe and probe device equipped with it and manufacture of contact probe - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a contact probe capable of preventing short-circuiting caused by contact between adjacent contact pins at the time of overdriving, and a probe device equipped with it, and a manufacturing method of the contact probe. SOLUTION: This contact probe is such a contact prove 1 that plural pattern wiring 3 is formed on the surface of a film 2 and each head of the pattern wiring is arranged in the projected state from the film 2, to thereby form a contact pin 3a, and the contact pin 3a is coated with a resin J except the head part 3b.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a contact probe which is used as a probe pin, a socket pin, or the like, and performs an electrical test by contacting each terminal of a semiconductor IC chip, a liquid crystal device, or the like, and a probe device provided with the same. More specifically, the present invention relates to a method for inspecting an IC on a wafer of a surface-arranged terminal such as a flip chip, etc.

[0002]

2. Description of the Related Art Generally, a probe card is used to perform an electrical test by contacting a semiconductor chip such as an IC chip or an LSI chip or each terminal of an LCD (liquid crystal display).

FIG. 14 shows a known probe card of this type. That is, in this probe card, an opening is provided at a measurement position of the card on the glass epoxy plate, and a contact pin (needle) is provided at this position.
Are provided in a protruding form. As a material of the needle, a tungsten (W) material having a small degree of wear is generally used. The probe card shown in this figure has a leaf spring shape with contact pins extending obliquely downward, and is called a horizontal needle type.

As shown in FIG. 13, as terminals to be inspected by a probe card, there are peripherally arranged terminals having terminal electrodes formed only around the chip, and terminal electrodes formed over the entire surface of the chip. And surface-arranged terminals. Here, the horizontal needle type probe card can cope with the peripherally arranged terminals, but cannot cope with the surface arranged terminals, and there is a limit in increasing the number of pins. In addition, the horizontal needle probe card has a limit in the inspection speed because the total length of the contact pins is as long as about 40 to 30 mm.

Therefore, instead of the horizontal arrangement type, FIG.
The vertical arrangement type shown in FIG. According to this vertical needle type probe card, it is possible to cope with surface-arranged terminals and to realize a multi-pin configuration. In addition, since the length of contact pins is relatively short, about 11 to 7.5 mm, there is also a problem of inspection speed. Be improved.

[0006] However, the vertical arrangement type has the following problems. That is, conventionally, when there is some deviation in the total length of each contact pin, in order to bring all the long and short contact pins into contact with each terminal, the long contact pin is overdriven (after the contact pin comes into contact with the terminal, a further When it is bent downward, the short contact pins are also brought into contact with the terminals, thereby ensuring the long and short contact.

Here, in the above probe card, since the material of the contact pin is tungsten and has high rigidity, the long contact pin does not sufficiently bend during overdrive, and the contact of the short contact pin with the terminal is uncertain. In particular, the vertical needle type has a problem that it is more difficult to bend because the contact pin contacts the terminal substantially perpendicularly.

In addition, when the above-mentioned tungsten contact pin is bent due to lack of flexibility, the bending direction is not constant, and as a result, there is a possibility that adjacent contact pins may erroneously come into contact with each other. was there. In addition, in the needle type, in addition to the incorporation of contact pins, the height and alignment of each pin must be manually performed, which is extremely difficult. It was difficult to cope with the narrow pin pitch.

On the other hand, for example, Japanese Patent Publication No. 7-820
No. 27 proposes a contact probe technique in which a plurality of pattern wirings are formed on a resin film, and the ends of these pattern wirings are arranged so as to protrude from the resin film and serve as contact pins. In this technical example, the tip of each of the plurality of pattern wirings is used as a contact pin, thereby achieving a narrow pitch with a large number of pins.
This eliminates the need for many complicated components.

A conventional contact probe 100 is shown in FIG.
As shown in FIG. 6, an IC probe is cut into a predetermined shape, and has a structure in which a pattern wiring 103 formed of Ni (nickel) or a Ni alloy is adhered to the surface of a polyimide resin film 102. The end of the pattern wiring 103 protrudes from the end of the film 102 to form a contact pin 103a.

In recent years, it has been proposed to incorporate this contact probe into a vertical needle type probe card. That is, with the recent high integration, the electrode pitch of LSIs and the like is also becoming narrower, and in order to cope with this, the contact pins of the above-mentioned contact probes are vertically arranged, and the two-dimensional needle arrangement is performed at a narrower pitch. Is what makes it possible.

[0012]

However, the above-mentioned conventional contact probe has the following problems. That is, in the conventional contact probe,
Although the contact pins can be sufficiently bent at the time of overdrive as compared with the tungsten needle, there is a possibility that adjacent contact pins may come into contact with each other to cause a short circuit (short circuit). In particular, when applied to a vertical needle type, it is necessary to bend the contact pins in a direction perpendicular to the vertical direction. At a narrow pitch, the contact pins in a plurality of contact probes are close to each other, so that they are adjacent to each other. There is a problem that it is bent in the direction to make the contact easy.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-described problems, and has a contact probe capable of preventing a short circuit due to contact between adjacent contact pins during overdrive, a probe device having the same, and a method of manufacturing a contact probe. The aim is to provide a method.

[0014]

The present invention has the following features to attain the object mentioned above. That is, in the contact probe according to claim 1, a plurality of pattern wirings are formed on the surface of the film, each tip of these pattern wirings are arranged in a protruding state from the film and become contact pins, The technology is employed in which the contact pins are covered with a resin except for the tip.

In this contact probe, since the contact pins are covered with resin except for the tip,
Even if adjacent contact pins are bent and contact with each other during overdrive, the contact pins are insulated by the resin, which is an insulator, so that they do not make direct contact and do not short-circuit. In addition, since the tips of the contact pins are not covered, there is no problem in the conductivity with electrodes such as IC chips. Further, since the contact pins are reinforced by the resin, the rigidity of even relatively thin contact pins can be improved. That is, the burden on the contact pin due to repeated fatigue is reduced, and the useful life of the contact pin is improved. If the material of the pattern wiring (contact pin) formed on the film is, for example, Ni or a Ni alloy, even if the contact pin is disposed almost vertically, it is still easily bent, so that the terminals of all the short and long pins Contact can be secured.

In the contact probe according to the second aspect,
2. The contact probe according to claim 1, wherein the contact pins are bent in the same direction at a predetermined position on the way.

In this contact probe, since the contact pins are bent in the same direction at a predetermined position in the middle thereof, when overdrive is applied, each contact pin moves in the same direction with the predetermined position as a bending point. It buckles by bending. That is, even if excessive overdrive is applied to ensure reliable contact with an electrode such as an IC chip, each contact pin similarly buckles at the predetermined position, and an adjacent contact pin is formed by a resin covering the contact pin. Functions as a stopper, it is possible to prevent a load exceeding a certain level from being applied to the contact pin without worrying about a short circuit. Further, the predetermined position is:
Although the bending point is the portion to which the bending stress is applied most, since the predetermined position is also covered with the resin, this portion can be reinforced and the life of the contact pin can be improved.

According to a third aspect of the present invention, the contact probe according to the first or second aspect is arranged such that the axes of the contact pins are substantially perpendicular to the contact surface of the object to be measured. A technique in which the films are arranged side by side with an interval between the respective surfaces is adopted.

In this probe device, a plurality of contact probes having contact pins covered with resin are provided, and the contact pins are arranged such that the axes of the contact pins are substantially perpendicular to the contact surface of the object to be measured. In addition, since the films are arranged side by side with an interval therebetween, it is possible to cope with surface-arranged terminals and to realize a multi-pin structure. In this case, since the contact pins are covered with the resin, a short circuit can be prevented even if the contact pins are disposed substantially vertically and contact the contact pins of another adjacent contact probe.

According to a fourth aspect of the present invention, there is provided a method for manufacturing a contact probe, wherein a plurality of pattern wirings are formed on a film, and the tips of the pattern wirings are arranged so as to protrude from the film to form contact pins. A first metal layer forming step of forming a first metal layer of a material to be adhered to or bonded to the material of the contact pin on a substrate layer, and forming a mask on the first metal layer. A plating step of forming a second metal layer to be provided for the pattern wiring and the contact pins by plating on an unmasked portion that has been applied, and at least forming the second metal layer on the second metal layer from which the mask has been removed. A film applying step of applying the film covering except for a portion provided for a contact pin; and A separation step of separating the part and the substrate layer and portions made of the first metal layer that, in the contact pin which projects from said film after said separation step,
A resin coating step of coating the resin except for the tip end thereof, wherein the resin coating step is a resin coating step of coating a photosensitive resin over the plurality of contact pins, and a mask is formed on the contact pins after the resin coating step. And a process of selectively removing the resin by removing the photosensitive resin from the front end portion and the intermediate portion between the adjacent contact pins by performing exposure and development.

In this method of manufacturing a contact probe,
With a resin coating step of coating the resin except for the tip of the contact pins protruding from the film after the separation step,
After the resin coating step, the method includes a resin selective removal step of applying a mask to the contact pin, exposing and developing the contact pin to remove only the photosensitive resin at the front end portion and the intermediate portion of the adjacent contact pin. By using this, the increase in the number of manufacturing steps can be minimized, and a large number of contact pins can be coated with resin simultaneously and with high precision.

[0022]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a first embodiment of a contact probe and a probe device according to the present invention will be described with reference to FIGS. In these figures,
Reference numeral 1 denotes a contact probe, 2 denotes a resin film (film), 3 denotes pattern wiring, and 70 denotes a probe device (probe card).

As shown in FIG. 1, the contact probe 1 of this embodiment has a structure in which a pattern wiring 3 formed of metal is attached to one surface of a polyimide resin film 2. The tip of the pattern wiring 3 projects from the contact pin 3a. The contact pin 3a is coated with a cured polyimide or epoxy resin J except for the tip 3b.

As shown in FIGS. 2 to 5, the probe device 70 is configured such that the axis of each of the contact pins 3a is connected to a terminal electrode (object to be measured) P.
Are arranged so as to be substantially perpendicular to the contact surface Pa, and are juxtaposed between the respective surfaces of the resin films 2 via the spacers 2e. The spacer 2 e is made of, for example, a non-conductive material such as ceramics, and also functions as a support for supporting the contact probe 1. A positioning hole 2h is provided on a side portion of the resin film 2, and the contact probe 1 is positioned by inserting a ceramic rod 2j into the positioning hole.

As shown in FIG. 4, a metal film (thin metal plate) 500 is provided on the surface of the resin film 2 on the back side of the surface on which the pattern wiring 3 is formed. In the metal film 500, half etching is performed on the back side of the specific position in the axial direction of the contact pin 3a.

In the contact probe 1, since the contact pins 3a are covered with the photosensitive resin J except for the tip portions 3b, even if the adjacent contact pins 3a are bent and contact with each other at the time of overdrive, the contact pins 3a are insulated. Since the photosensitive resin J is insulated between the contact pins 3a, there is no direct contact and no short circuit occurs. In addition,
Since the tip 3b of the contact pin 3a is not covered, there is no problem in the conductivity with electrodes such as an IC chip.

Since the contact pins 3a are reinforced by the photosensitive resin J, the contact pins 3a are relatively thin.
a can also improve the rigidity. That is, the burden on the contact pin 3a due to repeated fatigue is reduced, and the useful life of the contact pin 3a is improved.

Next, with reference to FIGS. 6 to 11, the steps of manufacturing the contact probe 1 will be described in the order of steps.

[Base Metal Layer Forming Step] First, as shown in FIG. 6A, a base metal layer 6 is formed on a stainless supporting metal plate 5 by Cu (copper) plating. [Pattern forming step] After a photoresist layer (mask) 7 is formed on the base metal layer 6, FIG.
As shown in FIG.
Then, a photomask 8 having a predetermined pattern is applied to the substrate, and the photoresist layer 7 is exposed to light, and as shown in FIG. Opening (unmasked part)
7a is formed. In the present embodiment, the photoresist layer 7 is formed of a negative photoresist, but a desired opening 7a may be formed using a positive photoresist. In the present embodiment, the photoresist layer 7 corresponds to a “mask” in the present invention. However, the “mask” in the claims of the present application is not limited to the one in which the opening 7 a is formed through the exposure and development steps using the photomask 8 like the photoresist layer 7 of the present embodiment. Absent. For example, a hole is formed in advance in a portion to be plated (that is, it is formed in advance in a state indicated by reference numeral 7 in FIG. 6C).
It may be a film or the like. In the claims of the present application, when such a film or the like is used as a “mask”, the pattern forming step in the present embodiment is unnecessary.

[Electroplating Step] Then, FIG.
As shown in FIG. 6, after the Ni or Ni alloy layer N serving as the pattern wiring 3 is formed in the opening 7a by plating, the photoresist layer 7 is formed as shown in FIG.
Is removed.

[Film Adhering Step] Next, FIG.
As shown in FIG. 1, on the Ni or Ni alloy layer N, except for the tip of the pattern wiring 3 shown in FIG. Glue. The resin film 2 is made of a polyimide resin PI and a metal film (copper foil) 5.
Reference numeral 00 denotes a two-layer tape provided integrally. Prior to this film deposition step, the copper surface 500
Then, copper etching is performed by using a photoengraving technique to form a ground plane. Then, in this film attaching step, the resin surface PI of the two-layer tape is attached to the Ni or Ni alloy layer N via the adhesive 2a. The metal film 500 is made of Ni, Ni in addition to copper foil.
An alloy or the like may be used.

[Separation Step] Then, as shown in FIG. 6 (g), after the portion consisting of the resin film 2, the pattern wiring 3 and the base metal layer 6 is separated from the supporting metal plate 5, Cu etching is performed. After that, only the pattern wiring 3 is adhered to the resin film 2. By this separation step, the contact pins 3a are formed so as to protrude from the resin film 2.

[Resin Coating Step] Next, as shown in FIG. 7A, a photosensitive resin J is applied to at least the entire surface of the contact pins 3a by dip or the like (resin coating step). Then, through a pre-bake (pre-baking step), as shown in FIG. 7B, a mask M prepared in advance is applied to the contact pins 3a except for at least the tip 3b, and exposed in a photolithography step. ,
By developing, unnecessary portions of the resin, that is, the tip 3b, the intermediate portion of the adjacent contact pin 3a, and the photosensitive resin J on the resin film 2 are removed (resin selective removing step). Further, the same processing is performed on the back side, and the entire contact pin 3a except for the tip 3b is completely covered with the photosensitive resin J. After this,
The photosensitive resin J is completely cured by curing.

[Half Etching Step] Next, a part of the metal film 500 is half-etched as shown in FIG. The half-etching in this case is performed by, for example, terminating the etching in the middle of the metal film 500 in the process of etching the metal film 500 using photolithography technology, instead of etching all the metals (copper).

[Gold Coating Step] Then, as shown in FIG.
Plating is performed to form an Au plating layer A on the surface. At this time, the Au layer A is formed on the entire surface of the contact pin 3a projecting from the resin film 2 over the entire periphery of the tip 3b.

The method of manufacturing the contact probe 1 includes a resin coating step of coating the photosensitive resin J on the contact pins 3a protruding from the resin film 2 after the separation step except for the tip 3b thereof, and after the resin coating step. A mask M is applied to the contact pin 3a, and exposure and development are performed to remove only the tip 3b and the photosensitive resin J at an intermediate portion between the adjacent contact pins 3a. Therefore, the use of photolithography technology minimizes an increase in the number of manufacturing steps. In addition, a large number of contact pins 3a can be coated with resin simultaneously at low cost and with high precision.

As shown in FIGS. 3 and 9, the metal film 500 is provided up to the vicinity of the contact pin 3a, and the amount of projection L of the contact pin 3a from the tip of the metal film 500 is set to 5 mm or less. ing. The metal film 500 can be used as a ground, which enables impedance matching to be performed near the tip of the probe device 70, and prevents adverse effects due to reflected noise even when performing a test in a high frequency range. it can.

The resin film 2 (polyimide resin P
The metal film 500 attached to I) has the following advantages. That is, when there is no metal film 500, since the resin film 2 is made of a polyimide resin, as shown in FIG. 10, the resin film 2 absorbs moisture and elongates, and the interval t between the contact pins 3a, 3a changes. There was something. Therefore, there is a problem that the contact pin 3a cannot contact a predetermined position of the terminal electrode, and an accurate electrical test cannot be performed. In the present embodiment, the metal film 500 is adhered to the resin film 2 so as to reduce the change in the interval t even when the humidity changes, so that the contact pin 3a can be securely brought into contact with a predetermined position of the terminal electrode. Has become.

FIG. 8 shows that the contact probe 1 is
FIG. 9 is a diagram showing a probe cut into a predetermined shape as a probe, and FIG. 9 is a cross-sectional view taken along the line CC of FIG. As shown in FIG. 8, the resin film 2 is provided with a positioning hole 2h through which the rod 2j is inserted. 5 and 9
As shown in FIG.
The other end of the flexible substrate 9 is connected to the printed circuit board 20 to constitute the probe device 70.

The probe device 70 configured as described above
When a probe test or the like of an IC chip is performed using the IC chip, the probe device 70 is mounted on a prober and electrically connected to a tester, and a predetermined electric signal is transmitted from the contact pin 3a of the pattern wiring 3 to the IC chip on the wafer. The output signal from the IC chip is transmitted from the contact pin 3a to the tester, and the electrical characteristics of the IC chip are measured.

In the probe device 70 of the present embodiment, a plurality of contact probes 1 having contact pins 3a protruding from the resin film 2 are provided, and the axis of the contact pins 3a is set to the contact surface Pa of the terminal electrode P. Are arranged substantially perpendicular to the substrate, and are arranged side by side while providing a space between the resin films 2 and 2 with a spacer 2e therebetween. can do. In this case, since the contact pins 3a are covered with the photosensitive resin J, the contact pins 3a
Can be prevented from being short-circuited even if the contact pins 3a of the other contact probes 1 are arranged substantially vertically and make contact with the contact pins 3a.

Since the portions other than the tip 3b of the contact pins 3a are covered with the photosensitive resin J, it is not necessary to always check the positions of the adjacent contact pins 3a. That is, if only the tip 3b, which is the tip of the needle, is checked, there is no problem in the inspection.
Since the contact resistance value and the like can be detected relatively easily by inspection, the number of inspection steps can be greatly reduced.

Further, in this embodiment, the pattern wiring 3
Since the material of the (contact pin 3a) is Ni or a Ni alloy, it is easy to bend even if the contact pin 3a is disposed almost vertically as compared with the conventional one using tungsten, thereby making it possible to shorten the length. The contact of all the pins 3a with the terminal electrode P can be ensured.

Further, by half-etching a predetermined amount at a predetermined position of the metal film 500 on the back side of the contact pin 3a, the bending direction and the bending position of the contact pin 3a during overdrive can be made the same. In addition, since it is possible to bend easily with a smaller buckling load, erroneous contact between adjacent contact pins 3a can be prevented.

In the first embodiment described above,
Although the probe device 70 is used as a probe card, it may be used as another measurement jig or the like. For example, the present invention may be applied to an IC chip test socket or the like mounted on an IC chip burn-in test device or the like for holding and protecting the IC chip inside.

Next, a second embodiment will be described. In the present embodiment, the resin film 2 is bent around an imaginary line that is substantially perpendicular to the axis of the pattern wiring 3. That is, the lower portion of the resin film 2 below the position supported by the spacer 2e is bent using a jig or the like to elastically deform the resin film 2. Thus, the contact pins 3a are bent around the imaginary line of the resin film 2 and the contact of all the long and short pins 3a can be secured.

Next, a third embodiment will be described with reference to FIGS. In this embodiment, the photomask 8 used in the pattern forming process is used.
Has a shape corresponding to the contact pin 3a,
It is formed so as to be bent at an intermediate position (predetermined position) X in the axial direction. By using this photomask 8,
Photoresist layer (mask) 7 exposed and developed by mask
Indicates that the shape of the portion corresponding to the contact pin 3a in the unmasked portion 7a is a position X in the axial direction.
It is formed so as to be bent. And then Ni
Since the contact pin 3a manufactured by the plating process is formed to be bent at a position X in the axial direction, the contact pin 3a bends from the bending point X during overdrive.

In this case, since the mask exposure technique is used,
Regarding the bending point X of the contact pin 3a, the bending angle and the pin width can be accurately adjusted, and as a result, the direction and amount of bending can be accurately controlled. Moreover, since the photomask 8 can be used repeatedly after it has been manufactured once, a large number of high-precision photomasks 8 can be produced, for example, as compared with a method of bending the pin 3a or the resin film 2 by using a jig or the like after manufacturing the contact pins 3a. Can be produced. In addition, compared to a method in which half etching or pin bending is performed after the production of the contact pins 3a, the present embodiment has an effect that only the mask shape is changed and the number of steps is not changed.

Further, the photosensitive resin J is applied to the contact pins 3
When the mask M is formed in advance, the mask M is prepared in advance in accordance with the bent shape of the contact pin 3a.
It is possible to cover the intermediate position X in the axial direction with high accuracy.

Note that the parallelism of the contact pins in the vertical direction is relatively difficult to obtain, and is usually managed with a width of several μm.
For this reason, when actually contacting the contact pins, an excessive load is applied to contact the shortest contact pins, so that a long load is applied to the longest contact pins. However, in this embodiment,
Since the contact pin 3a is bent in the same direction at an intermediate position X in the axial direction, in order to make reliable contact with the contact surface Pa of the terminal electrode P such as an IC chip, FIG.
As shown in (b), when overdrive is applied in the direction of the arrow in the drawing, each contact pin 3a can bend and buckle in the same direction with the midpoint position X in the axial direction as a bending point, resulting in excessive buckling. There is a merit that the contact pin 3a adjacent to each other also suppresses the load, no unnecessary load is generated, and no load is applied to the contact pin 3a.

That is, even if excessive overdrive is applied, each contact pin 3a similarly buckles at an intermediate position X in the axial direction, and the adjacent contact pin 3a functions as a stopper due to the photosensitive resin J covering the contact pin 3a. Therefore, it is possible to prevent a load exceeding a certain level from being applied to the contact pin 3a without worrying about a short circuit. Further, by designing the position, angle, and the like of the bent portion (X) between the adjacent contact pins 3a in anticipation of contacting in advance, an excessive load is prevented by the contact between the adjacent contact pins 3a. be able to.

Also, the bending stress generated at the intermediate position X in the axial direction where the contact pin 3a is bent,
Although there is a possibility that cracks or the like may occur in the contact pins 3a due to repeated use for a long time, in the present embodiment, since the photosensitive resin J is coated up to the position X in the axial direction, the portion where the bending stress is generated is covered. In addition, the service life of the battery with repeated use can be improved.

The present invention includes the following embodiments. (1) As a method for manufacturing the contact probe in the above embodiment, a photosensitive resin J is used as a resin for covering the contact pins, and the resin is selectively applied to the contact pins by patterning in a photolithography process using a mask M. Although the coating is performed, the coating may be performed by another method.

For example, a method may be used in which the contact pins are immersed in a bath containing a resin, pulled up, and then the resin that covers the tip portions that come into contact with the electrodes is exposed. In this case, as means for exposing the resin, for example, means for selectively burning off the resin at the distal end by irradiation with a laser or the like may be employed.

As another method, a method may be used in which a sheet-like resin is applied to only necessary portions of the contact pins, and then the same resin as above is exposed. In this case, as a means for attaching the resin, for example, a means for pressing the resin onto the contact pin by a pressure press or the like may be adopted.

(2) As the resin for covering the contact pins, most of commonly used resins can be applied, and depending on the type of the resin, coating such as pressure press, roll coat, micro dispenser, or screen printing is used. A method (a method of coating a contact pin) can be adopted. Table 1 below shows, as typical examples, resin names and coating methods applicable thereto in comparison.

[0057]

[Table 1]

[0058]

According to the present invention, the following effects can be obtained. (1) According to the contact probe of the first aspect, since the contact pins are covered with resin except for the tip, even if the contact pins are arranged adjacent to each other at a narrow pitch, the contact pins are overdriven. Is bent so that it does not directly contact the adjacent contact pin, thereby preventing a short circuit. In addition, since the contact pins are reinforced by the resin, the rigidity of the contact pins can be improved, and the burden on the contact pins due to repeated fatigue can be reduced, thereby improving the service life of the contact pins.

(2) According to the contact probe of the second aspect, since the contact pins are bent in the same direction at a predetermined position in the middle thereof, each contact pin is similarly seated at the predetermined position during overdrive. By bending, the adjacent contact pins covered with the resin function as stoppers, so that a certain load or more can be prevented from being applied to the contact pins without worrying about a short circuit.
In addition, the predetermined position is a portion where bending stress is most applied as a bending point, but since the predetermined position is also covered with resin, this portion can be reinforced and the life of the contact pin can be improved. it can.

(3) According to the probe device of the third aspect, a plurality of contact probes having contact pins covered with resin are provided, and the axes of the contact pins are substantially aligned with the contact surface of the object to be measured. Since the films are arranged vertically and are arranged side by side while providing an interval between the films, it is possible to correspond to a surface-arranged terminal and realize a multi-pin structure. In this case, since the contact pins are covered with the resin, a short circuit can be prevented even if the contact pins are disposed substantially vertically and contact the contact pins of another adjacent contact probe.

(4) According to the method for manufacturing a contact probe according to the fourth aspect, after the separation step, a resin coating step of coating the contact pins protruding from the film except for the tip thereof with a resin is provided. It has a resin selective removal process that removes only the photosensitive resin at the tip and the middle part of the adjacent contact pin by applying a mask to the contact pin and exposing and developing it. An increase in the number of steps can be minimized, and a large number of contact pins can be coated with resin simultaneously and with high precision.

[Brief description of the drawings]

FIG. 1 is an enlarged plan view of a main part showing a first embodiment of a contact probe according to the present invention.

FIG. 2 is a main part perspective view showing a first embodiment of a probe device using a contact probe according to the present invention.

FIG. 3 is a sectional view along a pattern wiring showing a first embodiment of a probe device using a contact probe according to the present invention.

FIG. 4 is an enlarged sectional view along a pattern wiring showing a first embodiment of a probe device using a contact probe according to the present invention.

FIG. 5A is a plan view showing a first embodiment of a probe device using a contact probe according to the present invention,
(B) is the same side view.

FIG. 6 is a fragmentary cross-sectional view showing a method of manufacturing the contact probe according to the first embodiment of the present invention in the order of steps.

FIG. 7 is a main part plan view showing a resin coating step of the manufacturing method in the first embodiment of the contact probe according to the present invention.

FIG. 8 is a plan view showing a first embodiment of the contact probe according to the present invention.

FIG. 9 is a sectional view taken along the line CC of FIG. 8;

FIG. 10 is a front view for explaining a metal thin plate in the first embodiment of the contact probe according to the present invention.

FIG. 11 is a plan view showing a third embodiment of the contact probe according to the present invention.

FIG. 12 is an enlarged plan view of a main part before and after overdrive, showing a third embodiment of the contact probe according to the present invention.

13A and 13B show types of arrangement of electrode terminals, wherein FIG. 13A shows peripheral arrangement terminals, and FIG. 13B shows surface arrangement terminals.

FIG. 14 is a side view showing a horizontal needle type probe card.

FIG. 15 is a side view showing a vertical needle type probe card.

FIG. 16 is a perspective view of a main part showing a conventional example of a contact probe according to the present invention.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 contact probe 2 film (resin film) 2 e support (spacer) 3 pattern wiring 3 a contact pin 3 b tip 5 support substrate 6 base metal layer 7 photoresist layer (mask) 7 a unmasked portion 8 photomask 9 flexible substrate (FPC) 20 Substrate (printed circuit board) 70 Probe device (probe card) 500 Thin metal plate (metal film) J Photosensitive resin L Length of contact pin protruding from thin metal plate N Metal layer P Object to be measured (terminal electrode) Pa Contact surface X Midway position (predetermined position)

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Tadashi Nakamura Twelve-six Technopark, Mita City, Hyogo Prefecture Inside the Mita Plant of Mitsubishi Materials Corporation

Claims (4)

[Claims] 1. A contact probe in which a plurality of pattern wirings are formed on a surface of a film, and the tips of the pattern wirings are arranged so as to protrude from the film to be contact pins. A contact probe characterized by being coated with resin except for a tip portion. 2. The contact probe according to claim 1, wherein the contact pin is bent in the same direction at a predetermined position in the middle of the contact pin. 3. The contact probe according to claim 1, wherein the contact pins are disposed such that the axes of the contact pins are substantially perpendicular to the contact surface of the object to be measured, and between the respective surfaces of the film. A probe device characterized in that the probe devices are arranged side by side at intervals. 4. A method of manufacturing a contact probe, wherein a plurality of pattern wirings are formed on a film, and the tips of the pattern wirings are arranged so as to protrude from the film to form contact pins. A first metal layer forming step of forming a first metal layer of a material to be adhered to or bonded to the material of the contact pin; and applying a mask on the first metal layer to form a pattern on an unmasked portion. A plating step of forming a second metal layer provided for wiring and the contact pins by plating, and excluding at least a portion provided for the contact pins on the second metal layer from which the mask has been removed. A film applying step of applying the film to be covered, and a portion comprising the film and a second metal layer, and the substrate layer and the first metal layer. A separating step of separating a portion of the photosensitive resin from the contact pin protruding from the film after the separating step. A resin coating step of coating the entirety of the plurality of contact pins, and after the resin coating step, applying a mask to the contact pins, exposing and developing to remove only the photosensitive resin at the front end portion and an intermediate portion between adjacent contact pins. A method for manufacturing a contact probe, comprising: a step of selectively removing a resin.