KR20070099322A - Inspection apparatus of testing a flat panel display and method of fabricating the same - Google Patents

Abstract

An inspection apparatus for testing a flat display device and a manufacturing method thereof are provided to mount various probes meeting the current trend of pad electrode minimization and to prevent electrical malfunction of the probes due to a short circuit between adjacent probes by arranging the probes so as to be protruded on both sides of the body and coating an insulating film on the protruding parts coming in contact with the probe tip. An inspection apparatus for testing a flat display device include the followings: a substrate(100) made of silicon; a body(118) placed on the substrate and made of a ceramic material; a plurality of probes(115) placed so as to be protruded on both sides of the body; and a probe tip(122) placed on the bottom of the protruding probe, wherein a part of the protruding probe attached by the probe tip is coated with an insulating film(109).

Description

Inspection apparatus for testing flat panel display device and its manufacturing method {Inspection apparatus of testing a flat panel display and method of fabricating the same}

1 to 8 are views illustrating an inspection apparatus for a flat panel display device test and a method of manufacturing the same according to an embodiment of the present invention.

9 to 16 are views illustrating an inspection apparatus for a flat panel display device test and a method of manufacturing the same according to another exemplary embodiment of the present invention.

FIG. 17 is a view illustrating an inspection apparatus for testing a flat panel display device and a method of manufacturing the same according to another embodiment of the present invention.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inspection apparatus and a manufacturing method thereof, and more particularly, to an inspection apparatus for a flat panel display device test and a manufacturing method thereof.

In general, a liquid crystal display (LCD), a plasma display panel (PDP), a field emission display (FED), and the like are referred to as a flat panel display (FPD). The flat panel display device includes a pad electrode for applying a signal, and the flat panel display device test is performed by using a probe that can determine whether there is a defect by applying an electrical signal to the pad electrode.

Probes for testing flat panel display devices include the needle type, which is manufactured only by hand, the blade type, which is produced by hand with the introduction of new technology, the film type, and the MEMS ( MEMS type using MEMS (Micro Electro Mechanical System) technology.

Needle type probes include bending a straight tungsten beam, attaching the adhesive to a reinforcement plate with adhesive, and adjusting the coordinate position of the contact surface to contact the pad electrode to be inspected and the contact surface to contact the signal transfer device. And physically correcting the position, and cleaning the position-corrected inspection probe. However, such a series of processes are all made by hand, and thus, it takes a lot of time to manufacture, high defect rate, and also has a limitation that productivity is low due to complicated process.

The blade-type probe is manufactured through a process of manufacturing a mold into which a blade is to be inserted, manufacturing a blade, inserting a blade, and covering a cover on an upper surface of the mold into which the blade is inserted. . However, some of these processes are still manual, especially at high manufacturing costs.

The MEMS type probe may include fabricating an inspection probe beam on the sacrificial layer, removing the sacrificial layer, covering a protective cover on the inspection probe, correcting the position of the inspection probe, and It is manufactured through a process consisting of removing noise generating factors. However, the electrical and mechanical properties are known to be inferior, and accuracy due to noise generation may be degraded, and problems in which probes to be isolated from each other may contact each other may cause a short circuit.

SUMMARY OF THE INVENTION The present invention has been made in an effort to provide a variety of probe arrangements in response to a trend of miniaturization of pad electrodes of a flat panel display device, and to prevent a malfunction due to a short circuit between adjacent probes. It is to provide an inspection apparatus.

It is an object of the present invention to provide a method for manufacturing a test apparatus for a flat panel display device test as described above without manual labor.

In order to achieve the above technical problem, an inspection apparatus for testing a flat panel display device according to an embodiment of the present invention, the substrate; A body disposed on the substrate; A plurality of probes protruding from both sides of the body; And a probe tip disposed at a lower end of the probe protruding from one side of the body of the probe.

The substrate may be a silicon substrate.

The body may be made of a ceramic material.

The probe to which the probe tip is attached is preferably coated with an insulating film.

In the present invention, the probe tip may be further provided with a protruding pin disposed on the top of the probe is not attached.

In order to achieve the above technical problem, an inspection apparatus for testing a flat panel display device according to another embodiment of the present invention, the first substrate; A first body disposed on the first substrate; A plurality of first probes protruding from both sides of the first body; And a first probe tip disposed at a lower end of the first probe protruding from one side of the first body of the first probe. A second body attached to a lower portion of the first substrate; A second substrate disposed under the second body; A plurality of second probes protruding from both sides of the second body; And a second probe tip disposed at a lower end of the second probe protruding from one side of the second body of the second probe.

The first probe tip and the second probe tip are preferably staggered with each other such that they do not overlap in the vertical direction.

In order to achieve the above technical problem, a method of manufacturing an inspection apparatus for testing a flat panel display device according to an embodiment of the present invention, the step of forming a groove for forming a probe tip on the substrate using a first mask film pattern ; Forming a seed layer on the grooved substrate; Forming a first plating mold having an opening exposing the groove on the seed layer; Forming a probe and a probe tip in the opening defined by the first plating mold; Removing the first plating mold; Forming an insulating film on an exposed surface of the seed layer and the probe exposed by removing the first plating mold; Forming a second plating mold having an opening for exposing a central portion of the probe coated with the insulating film on the resultant in which the insulating film is formed; Forming a body in an opening defined by the second plating mold; Forming a second mask film pattern aligned with the body under the substrate; Removing both exposed portions of the substrate and the insulating layer by etching using the second mask layer pattern as an etch mask to expose the probe and the probe tip; And removing the second mask layer pattern.

The first mask layer pattern and the second mask layer pattern may be formed as a photoresist layer.

The first plating frame and the second plating frame may be formed of a photoresist film.

The insulating film may be formed of a polymer insulating material.

The body may be formed of ceramic.

The forming of the probe and the probe tip may be performed using an electroplating method.

In order to achieve the above technical problem, a method of manufacturing an inspection apparatus for testing a flat panel display device according to another embodiment of the present invention, forming a groove for forming a probe tip on the substrate using a first mask film pattern ; Forming a seed layer on the grooved substrate; Forming a first plating mold having an opening exposing the groove on the seed layer; Forming a probe and a probe tip in the opening defined by the first plating mold; Forming a second mask layer pattern on the first plating mold and the probe; Forming a protruding pin on a portion of the surface of the probe by using the second mask layer pattern; Sequentially removing the second mask layer pattern and the first plating mold; Forming a third mask layer pattern covering the protruding pins on a portion of the seed layer and the probe exposed by removing the first plating mold; Forming an insulating film on an exposed surface exposed by the third mask film pattern; Forming a second plating frame exposing the center portion of the probe to which the insulating film is coated together with the third mask layer pattern on the resultant product on which the insulating film is formed; Forming a body in an opening defined by the third mask layer pattern and the second plating mold; Forming a fourth mask film pattern aligned with the body under the substrate; Removing both exposed portions of the substrate and the insulating layer by etching using the fourth mask layer pattern as an etch mask to expose the probe and the probe tip; And removing the fourth mask layer pattern.

The first to fourth mask layer patterns may be formed as photoresist layers.

The first plating frame and the second plating frame may be formed of a photoresist film.

In order to achieve the above another technical problem, a method of manufacturing an inspection apparatus for testing a flat panel display device according to another embodiment of the present invention, the first body is disposed on the first substrate, both sides of the first body Forming a first structure in which a plurality of first probes protrude and a first probe tip is disposed at a lower end of the first probe protruding on one side of the first body of the first probes; A second body is disposed on the second substrate, and a plurality of second probes protrude from both sides of the second body, and at the bottom of the second probe protruding from one side of the second body of the second probes. Forming a second structure in which the second probe tip is disposed; And attaching a bottom surface of the first substrate and an upper surface of the second body.

Preferably, the first and second probes are staggered from each other so as not to overlap each other in the vertical direction.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, embodiments of the present invention may be modified in many different forms, and the scope of the present invention should not be construed as being limited by the embodiments described below.

1 to 8 are perspective views illustrating a test apparatus for a flat display device test and a method of manufacturing the same according to an exemplary embodiment of the present invention.

First, as shown in FIG. 1, the first mask layer pattern 102 is formed on the substrate 100. The substrate 100 may be a silicon substrate. The first mask film pattern 102 may be formed using an exposure and development process using a photoresist film. The first mask film pattern 102 has an opening 104, which exposes a part of the surface of the substrate 100, that is, the surface where the groove is to be formed. Next, etching is performed using the first mask layer pattern 102 as an etching mask to form grooves 106 having a predetermined depth in the exposed portion of the substrate 100, as shown in FIG. 2. Although only two grooves 106 are shown in the figure, the number of grooves 106 is equal to the number of probes of the inspection apparatus. After the groove 106 is formed, the first mask film pattern 102 is removed.

Next, as shown in FIG. 3, a metal seed layer 108 is formed over the substrate 100 having the groove 106. And the first plating mold 110 is formed thereon. The first plating mold 110 may be formed using an exposure and development process using a photoresist film. The first plating mold 110 is for forming a probe, and has an opening 112 exposing a region where the probe is to be formed. The number of openings 112 is also the same as the number of probes, and each opening 112 overlaps one groove 106. The first plating mold 110 formed of the photoresist film is formed to a sufficient height of about the thickness of the probe, and thus, additional etching for securing the thickness of the probe, which has been previously performed, is unnecessary.

Next, as shown in FIG. 4, the probe 114 is formed using an electroplating method using the seed layer 108 exposed by the opening (112 in FIG. 3) of the first plating mold 110. In this case, a probe tip (not shown) is formed together in the groove 106. After forming the probe 114 together with the probe tip, the first plating mold 110 is removed. 5, the entire surface of the structure on the substrate 100 is coated with an insulating film 109. As the insulating film 109, an oxide film or a nitride film may be used, and a polymer insulating material film may be used.

Next, as shown in FIG. 6, a second plating mold 116 is formed on the insulating film 109. The second plating mold 116 may also be formed using an exposure and development process using a photoresist film. The second plating mold 116 is for forming a body 118 and has an opening that exposes a region where the body 118 is to be formed. The body 118 is then formed by filling the opening by the second plating mold 116 with a material for the body, such as a ceramic.

Next, as shown in FIG. 7, the second plating mold 116 of FIG. 6 is removed. As the second plating mold 116 is removed, the insulating film 109 and the probe 115 covered with the insulating film are exposed in the upper portion. Thereafter, the second mask layer pattern 120 is formed on the rear surface of the substrate 100. The second mask layer pattern 120 is disposed to overlap the body 118, thus exposing a portion of the rear surface of the substrate 100.

Next, as shown in FIG. 8, the exposed portion of the substrate 100 is removed by etching using the second mask layer pattern 120 as an etch mask, and the insulating film exposed as the substrate 100 is subsequently removed. Remove the exposed part of 109). Thereafter, the second mask layer pattern 120 is removed. Then, as shown in the drawing, a frame having a structure in which the substrate 100, the insulating film 109 and the body 118 are sequentially stacked is formed, and the probes 115 covered with the insulating film 109 are moved outward from both sides of the frame. It protrudes. The probe tip 122 is disposed on the bottom surface of one of the probes 115 protruding from both sides of the frame, that is, the direction in which the substrate 100 is disposed. The probe 115, in which the probe tip 122 is not disposed, is connected to an electrical signal transfer device (not shown) that applies an electrical signal for inspection when the flat panel display device is tested.

According to such an inspection apparatus, as the probe tip 122 is disposed at the bottom end of the probe 115, even if the pad of the flat panel display to be inspected is finely positioned, accurate contact can be made. In addition, since the probe 115 is coated with the insulating film, even if the adjacent probe 115 is in contact with the electrical short does not occur, it is possible to ensure high reliability.

9 to 16 are perspective views illustrating a test apparatus for a flat display device test and a method of manufacturing the same according to another exemplary embodiment of the present invention.

The inspection apparatus according to the present embodiment is different from the above-described embodiment in that the protruding pin 206 is disposed at the end of the conductive probe 114 in addition to the probe tip 122. Specifically, the steps as described with reference to FIGS. 1 to 4 are performed. As a result, the probe 114 defined by the opening of the first plating mold 110 (112 in FIG. 3) is formed, and in this process, a probe tip (not shown) is formed in the groove (106 in FIG. 2).

Next, as shown in FIG. 9, a second mask film pattern 202 is formed on the resultant shown in FIG. 4. The second mask film pattern 202 can also be formed using an exposure and development process using a photoresist film. The second mask film pattern 202 has an opening 204, which exposes a part of the surface of the probe 114, that is, the surface of the part where the protruding pin is to be formed. Next, as shown in FIG. 10, the protruding pins 206 filling the openings 204 are formed by using an electroplating method using the exposed surface of the probe 114 exposed by the openings 204 as a seed layer.

Next, the second mask film pattern 202 and the first plating mold 110 are sequentially removed. 11, the seed layer 108 is disposed on the substrate 100, and the probe 114 is disposed on the seed layer 108. A protruding pin 206 is disposed on an upper surface of one end of the probe 114, and a probe tip (not shown) is disposed on the lower surface of the other end of the probe 114, although not shown in the drawing.

Next, as shown in FIG. 12, the seed layer 108 is removed to expose a portion of the surface of the substrate 100. The third mask layer pattern 208 is formed to cover the exposed surface of the substrate 100 and a part of the probe 114. The third mask film pattern 208 may also be formed by performing exposure and development processes using a photoresist film. The protruding pins 206 of FIG. 11 are covered by the third mask layer pattern 208.

Next, as shown in FIG. 13, an insulating film is coated on a portion exposed by the third mask layer pattern 208, that is, a portion of the surface of the substrate 100 and a portion of the probe 114. Then, an insulating film 109 is formed on the substrate 100, and an insulated probe 210 is formed on the insulating film 109. As the insulating film 109, an oxide film or a nitride film may be used, and a polymer insulating material film may be used.

Next, as shown in FIG. 14, a second plating mold 116 is formed on the insulating film 109. The second plating mold 116 may also be formed using an exposure and development process using a photoresist film. The second plating mold 116 is for forming the body 118 together with the third mask layer pattern 208 and has an opening that exposes a region where the body 118 is to be formed. Here, the central portion of the probe (210 in FIG. 13) is exposed by the opening. The body 118 is then formed by filling the opening by the second plating mold 116 with a material for the body, such as a ceramic.

Next, as shown in FIG. 15, the second plating mold 116 of FIG. 14 and the third mask film pattern 208 of FIG. 14 are removed. Since the second plating mold 116 and the third mask film pattern 208 are formed of a photoresist film, the second plating mold 116 and the third mask film pattern 208 can be removed at the same time by a conventional strip process. As the second plating mold 116 and the third mask layer pattern 208 are removed, the probes 114 and 210 protruding from both sides of the body 118 are exposed at the upper portion. The probe 114 is made of conductive material, and the probe 115 has a structure covered with an insulating film. The conductive probe 114 has a protruding pin 206 disposed on an upper surface thereof, while a probe tip (not shown) is disposed on a lower surface of the probe 115 covered with an insulating film, although not shown in the drawing. Next, a fourth mask film pattern 120 is formed on the back surface of the substrate 100. The fourth mask layer pattern 120 is disposed to overlap the body 118, thereby exposing a portion of the back surface of the substrate 100.

Next, as shown in FIG. 16, the exposed portion of the substrate 100 is removed by etching using the fourth mask layer pattern 120 as an etch mask, and the insulating film exposed as the substrate 100 is subsequently removed. Remove the exposed part of 109). Thereafter, the second mask layer pattern 120 is removed. Then, as illustrated, a frame having a structure in which the substrate 100, the insulating film 109, and the body 118 are sequentially stacked is formed, and on both sides of the body 118, the probe 210 insulated from the conductive probe is formed. Are projected respectively. The probe tip 122 is disposed at a lower surface of the insulated probe 210, that is, in a direction in which the substrate 100 is disposed. On the other hand, the protruding pin 206 is disposed on the upper surface of the conductive probe 114, that is, in a direction opposite to the direction in which the substrate 100 is disposed. The protruding pin 206 is connected to an electrical signal transfer device (not shown) for applying an electrical signal for inspection during the flat panel display device test.

FIG. 17 is a view illustrating an inspection apparatus for testing a flat panel display device and a method of manufacturing the same according to another embodiment of the present invention.

Referring to FIG. 17, the inspection apparatus according to the present embodiment is different from the above-described embodiments in that the inspection apparatus has a multilayer structure instead of a single layer. Specifically, the upper first inspection device 300 and the lower second inspection device 400 are attached to each other. The first inspection apparatus 300 has a structure in which the first bodies 118a are sequentially stacked on the first substrate 100a via the first insulating layer 109a. An insulated first probe 210a protrudes from one side of the first body 118a, and a conductive first probe 114a protrudes from an opposite side of the first body 118a. The first probe tip 122a is disposed on the lower surface of the insulated first probe 210a, and the first protruding pin 206a is disposed on the upper surface of the conductive first probe 114a. Similarly, an insulated second probe 210b protrudes from one side of the second body 118b, and a conductive second probe 114b protrudes from an opposite side of the second body 118b. The second probe tip 122b is disposed on the lower surface of the insulated second probe 210b, and the second protruding pin 206b is disposed on the upper surface of the conductive second probe 114b.

The adhesion of the first inspection apparatus 300 and the second inspection apparatus 400 is performed by the adhesive 500 interposed between the lower surface of the first substrate 100a and the upper surface of the second body 118b. In this case, the first probe tip 122a and the second probe tip 122b are arranged in a structure that does not overlap in a vertical direction, that is, in a mutually staggered structure. As such, the first probe tip 122a and the second probe tip 122b having a multilayer structure are alternately disposed, thereby reducing the number and inspectable pitches of the probe tips.

As described so far, the inspection apparatus and the manufacturing method for a flat panel display device test according to the present invention provides the following advantages.

First, since it can be manufactured by applying a semiconductor manufacturing process rather than the conventional manual work, it is possible to reduce the defect rate that can occur during the manufacturing process and mass production.

Secondly, since the probe tip is disposed on the bottom surface of the probe, electrical and mechanical properties may be improved, and scrum marks that may occur on pads of the flat panel display element during inspection may be minimized.

Third, since the probe with the probe tip is coated with an insulating film, a signal short circuit does not occur even by contact of adjacent probes, and therefore, it is possible to suppress the malfunction due to a signal short circuit during inspection.

Fourth, by forming a probe using a first plating mold having a sufficient thickness, no additional etching for securing the probe thickness, which has been conventionally performed, is unnecessary.

Fifth, by forming a protruding pin at one end of the probe, the inspection driving integrated circuit can be manufactured integrally, thereby effectively removing the noise generated at the rear end, and easily detaching between the inspection device and the signal transfer device. can do.

Although the present invention has been described in detail with reference to preferred embodiments, the present invention is not limited to the above embodiments, and various modifications may be made by those skilled in the art within the technical spirit of the present invention. Do.

Claims (18)

Board; A body disposed on the substrate; A plurality of probes protruding from both sides of the body; And And a probe tip disposed at a lower end of the probe which protrudes from one side of the body, among the probes. The method of claim 1, And the substrate is a silicon substrate. The method of claim 1, The body is an inspection device for testing a flat panel display, characterized in that made of a ceramic material. The method of claim 1, The probe having the probe tip attached to the probe is coated with an insulating film. The method of claim 1, And a protruding pin disposed at an upper end of the probe to which the probe tip is not attached. A first substrate; A first body disposed on the first substrate; A plurality of first probes protruding from both sides of the first body; And A first probe tip disposed at a lower end of the first probe protruding from one side of the first body of the first probe; A second body attached to a lower portion of the first substrate; A second substrate disposed under the second body; A plurality of second probes protruding from both sides of the second body; And And a second probe tip disposed at a lower end of the second probe protruding from one side of the second body, among the second probes. The method of claim 6, And the first probe tip and the second probe tip are staggered from each other so as not to overlap each other in the vertical direction. Forming a groove for forming a probe tip on the substrate by using a first mask layer pattern; Forming a seed layer on the grooved substrate; Forming a first plating mold having an opening exposing the groove on the seed layer; Forming a probe and a probe tip in the opening defined by the first plating mold; Removing the first plating mold; Forming an insulating film on an exposed surface of the seed layer and the probe exposed by removing the first plating mold; Forming a second plating mold having an opening for exposing a central portion of the probe coated with the insulating film on the resultant in which the insulating film is formed; Forming a body in an opening defined by the second plating mold; Forming a second mask film pattern aligned with the body under the substrate; Removing both exposed portions of the substrate and the insulating layer by etching using the second mask layer pattern as an etch mask to expose the probe and the probe tip; And And removing the second mask layer pattern. The method of claim 8, And the first mask layer pattern and the second mask layer pattern are formed of a photoresist film. The method of claim 8, And the first plating frame and the second plating frame are formed of a photoresist film. The method of claim 8, And the insulating film is formed of a polymer insulating material. The method of claim 8, The body is a method of manufacturing an inspection apparatus for testing a flat panel display, characterized in that formed of a ceramic. The method of claim 8, The forming of the probe and the probe tip may be performed using an electroplating method. Forming a groove for forming a probe tip on the substrate by using a first mask layer pattern; Forming a seed layer on the grooved substrate; Forming a first plating mold having an opening exposing the groove on the seed layer; Forming a probe and a probe tip in the opening defined by the first plating mold; Forming a second mask layer pattern on the first plating mold and the probe; Forming a protruding pin on a portion of the surface of the probe by using the second mask layer pattern; Sequentially removing the second mask layer pattern and the first plating mold; Forming a third mask layer pattern covering the protruding pins on a portion of the seed layer and the probe exposed by removing the first plating mold; Forming an insulating film on an exposed surface exposed by the third mask film pattern; Forming a second plating frame exposing the center portion of the probe to which the insulating film is coated together with the third mask layer pattern on the resultant product on which the insulating film is formed; Forming a body in an opening defined by the third mask layer pattern and the second plating mold; Forming a fourth mask film pattern aligned with the body under the substrate; Removing both exposed portions of the substrate and the insulating layer by etching using the fourth mask layer pattern as an etch mask to expose the probe and the probe tip; And And removing the fourth mask layer pattern. The method of claim 14, The first to fourth mask film patterns are formed of a photoresist film. The method of claim 14, And the first plating frame and the second plating frame are formed of a photoresist film. A first body is disposed on a first substrate, and a plurality of first probes protrude from both sides of the first body, and a lower end of the first probe protruding from one side of the first body of the first probes. Forming a first structure in which the first probe tip is disposed; A second body is disposed on the second substrate, and a plurality of second probes protrude from both sides of the second body, and at the bottom of the second probe protruding from one side of the second body of the second probes. Forming a second structure in which the second probe tip is disposed; And And attaching a bottom surface of the first substrate and an upper surface of the second body to each other. The method of claim 17, And the first probe and the second probe are staggered so as not to overlap each other in the vertical direction.

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