KR100968602B1 - Mprobe assembly - Google Patents

Mprobe assembly Download PDF

Info

Publication number
KR100968602B1
KR100968602B1 KR1020100006744A KR20100006744A KR100968602B1 KR 100968602 B1 KR100968602 B1 KR 100968602B1 KR 1020100006744 A KR1020100006744 A KR 1020100006744A KR 20100006744 A KR20100006744 A KR 20100006744A KR 100968602 B1 KR100968602 B1 KR 100968602B1
Authority
KR
South Korea
Prior art keywords
mold part
tip portion
mold
probe assembly
tip
Prior art date
Application number
KR1020100006744A
Other languages
Korean (ko)
Inventor
장현진
김유성
Original Assignee
주식회사 코디에스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 코디에스 filed Critical 주식회사 코디에스
Priority to KR1020100006744A priority Critical patent/KR100968602B1/en
Application granted granted Critical
Publication of KR100968602B1 publication Critical patent/KR100968602B1/en

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G01R1/06761—Material aspects related to layers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2879—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to electrical aspects, e.g. to voltage or current supply or stimuli or to electrical loads
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

PURPOSE: A probe assembly unit is provided to help a user to easily manufacture a conventional fine pitch. CONSTITUTION: A plurality of beams(6) are located on a first mold(3) by a certain interval and have both ends which are protruded from the both side of the first mold. A second mold(8) is formed by filling spaces between beams. A first tip(10) is protruded from the one end of the beam. A second tip(12) is formed on the first tip and is protruded from the beam in longitudinal direction.

Description

프로브 조립체{MPROBE ASSEMBLY}Probe Assembly {MPROBE ASSEMBLY}

본 발명은 프로브 조립체에 관한 것으로서, 보다 상세하게는 켄틸레버 타입의 프로브 조립체를 용이하게 제조할 수 있는 프로브 조립체에 관한 것이다. The present invention relates to a probe assembly, and more particularly, to a probe assembly capable of easily manufacturing a cantilever type probe assembly.

반도체 또는 액정표시장치의 제조는 다양한 공정을 거쳐 완성되는데, 각 공정 후 전기적 검사를 하게 된다. 이 중에서 특히, 액정표시장치를 예로 설명한다. The manufacture of a semiconductor or a liquid crystal display device is completed through various processes, and electrical inspection is performed after each process. In particular, the liquid crystal display device will be described as an example.

최근에 액정표시장치는 소비전력이 낮고, 휴대성이 양호하여 기술집약적이며 부가가치가 높은 차세대 첨단 디스플레이(display)소자로 각광받고 있다. Recently, the liquid crystal display device has been spotlighted as a next generation advanced display device having low power consumption, good portability, technology intensive, and high added value.

도 1a 및 도 1b를 참조하면, 일반적인 액정표시장치(100)는 TFT기판(110)과 칼라필터기판(120) 사이에 액정층(130)을 주입하고 양 기판을 합착하여 구성된다. 상기 TFT기판(110)의 아래에는 편광판(151)이 부착된다. 또한 칼라필터기판(120)의 위에는 편광판(152)과, 보호필름(153)이 부착된다. 1A and 1B, a general liquid crystal display device 100 is formed by injecting a liquid crystal layer 130 between a TFT substrate 110 and a color filter substrate 120 and bonding both substrates together. The polarizer 151 is attached to the bottom of the TFT substrate 110. In addition, a polarizing plate 152 and a protective film 153 are attached to the color filter substrate 120.

합착후에도 편광판이 부착된 TFT기판(110)은 2개변 혹은 3개변에서 에지면(111)이 노출되는데, 노출된 에지면(111)에는 패드(전극)가 형성된다. Even after bonding, the edge substrate 111 is exposed on two or three sides of the TFT substrate 110 having the polarizing plate, and a pad (electrode) is formed on the exposed edge surface 111.

상기 패드(141)에는 구동IC(Driver IC) 또는 태그필름(Tag Film)이 연결된다. A driver IC or a tag film is connected to the pad 141.

한편, 상기 패드에 구동IC(Driver IC) 또는 태그필름(Tag Film)을 연결하기 전에 프로브의 일단은 상기 패드에 접촉시키고 타단은 상기 구동IC에 접촉시킨 상태에서 전기적 신호를 인가하여 액정패널을 검사한다. Meanwhile, before connecting a driver IC or a tag film to the pad, one end of the probe is in contact with the pad and the other end is in contact with the driver IC to inspect the liquid crystal panel. do.

여기서 상기 패드는 1열 또는 복수열로 형성되며, 각 열마다 복수의 패드가 매우 조밀한 피치로 형성된다. 따라서 프로브 조립체도 이러한 패드의 피치와 동일한 피치로 형성되어야 하는데, 기술적으로 조밀한 피치로 형성하는 것이 매우 난해한 작업이다. Here, the pads are formed in one row or a plurality of rows, and a plurality of pads are formed in very dense pitches in each row. Therefore, the probe assembly must also be formed at the same pitch as the pad, which is a technically difficult task.

본 발명은 상술한 문제점을 해결하기 위하여 안출된 것으로서, 본 발명의 목적은 켄틸레버 타입의 프로브 조립체를 용이하게 제조할 수 있는 프로브 조립체를 제공함에 있다. SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a probe assembly capable of easily manufacturing a cantilever type probe assembly.

위와 같은 기술적 과제를 해결하기 위하여 본 발명에 의한 프로브 조립체는 제1몰드부; 상기 제1몰드부상에 일정간격으로 위치되며, 양측 단부가 상기 제1몰드부의 좌우로 돌출되는 복수의 빔; 상기 복수의 빔들 사이의 공간을 충진하여 형성되는 제2몰드부; 상기 빔의 일측 단부에 돌출형성되는 제1팁부; 및 상기 제1팁부상에 형성되되, 가시성을 확보하기 위하여 상기 빔으로부터 길이방향으로 돌출 형성되는 제2팁부;를 포함한다. In order to solve the above technical problem, the probe assembly according to the present invention comprises: a first mold part; A plurality of beams positioned at predetermined intervals on the first mold part, and both end portions protruding to the left and right of the first mold part; A second mold part formed by filling a space between the plurality of beams; A first tip portion protruding from one end of the beam; And a second tip portion formed on the first tip portion and protruding from the beam in a longitudinal direction to ensure visibility.

또한 상기 제1몰드부 및 제2몰드부는 동일 재질인 것이 바람직하다. In addition, the first mold portion and the second mold portion is preferably made of the same material.

또한 상기 빔, 제1팁부 및 제2팁부는 동일 재질로 형성되는 것이 바람직하다. In addition, the beam, the first tip portion and the second tip portion is preferably formed of the same material.

본 발명에 따르면, 켄틸레버 타입의 프로브 조립체를 용이하게 제조할 수 있는 효과가 있다.According to the present invention, the cantilever type probe assembly can be easily manufactured.

도 1a 및 도 1b는 일반적인 액정패널을 나타낸 것이다.
도 2 내지 도 16은 본 발명에 의한 프로브 조립체 제조방법을 순서대로 나타낸 것이다.
도 17은 본 발명에 의한 프로브 조립체를 나타낸 것이다. 1A and 1B show a general liquid crystal panel.
2 to 16 show the method of manufacturing a probe assembly according to the present invention in order.
Figure 17 shows a probe assembly according to the present invention.

이하, 첨부된 도면을 참조하여 본 발명에 의한 프로브 조립체 제조방법 및 프로브 조립체를 설명한다. Hereinafter, a probe assembly manufacturing method and a probe assembly according to the present invention will be described with reference to the accompanying drawings.

본 발명에 의한 프로브 조립체 제조방법은 제1몰드부를 형성한 다음, 제1몰드부상에 일정간격으로 복수의 빔을 형성하되 양측 단부가 상기 제1몰드부의 좌우로 돌출되도록 형성하고, 상기 빔들 사이의 공간에 수지를 충진하여 제2몰드부를 형성한 후, 상기 빔의 일단에 제1팁부를 형성하고, 마지막으로 제1팁부상에 제2팁부를 형성함으로써 완성된다. In the method of manufacturing a probe assembly according to the present invention, after forming a first mold part, a plurality of beams are formed at a predetermined interval on the first mold part, and both ends thereof are formed to protrude to the left and right of the first mold part, and between the beams. After filling the space with a resin to form the second mold part, the first tip part is formed at one end of the beam, and finally, the second tip part is formed on the first tip part.

먼저, 기판(1)상에 제1포토레지스트 패턴(2)을 형성한 상태에서(도 2 참조) 상기 기판(1)을 식각하여 제1몰드부가 형성될 소정 공간(1a)을 마련하고(도 3 참조), 상기 제1포토레지스트(2)를 제거한 후(도 4 참조) 에폭시를 충진하고 평탄화하여 제1몰드부(3)를 형성한다(도 5 참조). 여기서 상기 제1포토레지스트 패턴은 제1몰드부의 형태 및 면적에 대응된다는 것은 당연하다. First, in a state in which the first photoresist pattern 2 is formed on the substrate 1 (see FIG. 2), the substrate 1 is etched to prepare a predetermined space 1a in which the first mold part is to be formed (FIG. 3), after removing the first photoresist 2 (see FIG. 4), the first mold part 3 is formed by filling and planarizing the epoxy (see FIG. 5). It is obvious that the first photoresist pattern corresponds to the shape and area of the first mold part.

다음으로, 상기 기판 및 제1몰드부상에 희생층(4)을 형성하고(도 6 참조), 상기 희생층 상에 제2포토레지스트 패턴(5)을 형성한 다음(도 7 참조), 상기 패턴에 금속을 도금한 후(도 8 참조) 상기 제2포토레지스트를 제거하면 복수의 빔(6)이 형성한다(도 9 참조). 물론, 상기 제2포토레지스트 패턴은 상기 복수의 빔의 형태, 크기 및 피치 등에 대응되도록 형성한다. Next, a sacrificial layer 4 is formed on the substrate and the first mold part (see FIG. 6), and a second photoresist pattern 5 is formed on the sacrificial layer (see FIG. 7). After the metal is plated (see FIG. 8), the second photoresist is removed to form a plurality of beams 6 (see FIG. 9). Of course, the second photoresist pattern is formed to correspond to the shape, size and pitch of the plurality of beams.

다음으로 상기 복수의 빔(6)이 형성된 상태에서 그 위에 상기 제1포토레지스트 패턴과 동일한 제3포토레지스트(7) 패턴을 형성하고(도 10 참조) 상기 패턴에 에폭시 수지를 충진하여 제2몰드부(8)를 형성하고(도 11 참조), 상기 제2몰드부 경화 후 평탄화한다. Next, in the state where the plurality of beams 6 are formed, a third photoresist 7 pattern identical to the first photoresist pattern is formed thereon (see FIG. 10), and the second mold is filled with an epoxy resin. A portion 8 is formed (see FIG. 11) and planarized after curing the second mold portion.

다음으로, 상기 빔의 일단에 제1팁부를 형성하기 위한 제4포토레지스트(9) 패턴을 형성하고(도 12 참조), 상기 패턴에 금속을 도금하여 제1팁부(10)를 형성하고(도 13 참조), 평탄화한다. 상기 제4포토레지스트(9)는 상기 빔의 일단이 노출되어 제1팁부가 형성될 소정의 공간(9a)이 마련되는 패턴으로 도포한다. Next, a fourth photoresist 9 pattern is formed at one end of the beam (see FIG. 12), and a metal is plated on the pattern to form the first tip portion 10 (FIG. 12). 13) and planarization. The fourth photoresist 9 is coated in a pattern in which one end of the beam is exposed to form a predetermined space 9a in which the first tip part is formed.

다음으로, 상기 제1팁부상에 제2팁부를 형성하기 위한 제5포토레지스트(11) 패턴을 형성하고(도 14 참조), 상기 패턴에 금속을 도금하여 제2팁부(12)를 형성하고(도 15 참조), 평탄화한다. 상기 제5포토레지스트(11)는 상기 제1팁부가 노출되어 제2팁부가 형성될 소정의 공간(11a)이 마련되는 패턴으로 도포한다. Next, a fifth photoresist 11 pattern for forming a second tip portion is formed on the first tip portion (see FIG. 14), and a metal is plated on the pattern to form a second tip portion 12 ( 15) and planarization. The fifth photoresist 11 is coated in a pattern in which the first tip portion is exposed and a predetermined space 11a in which the second tip portion is formed is provided.

마지막으로 상기 제4 및 제5포토레지스트을 제거하고(도 16 참조), 희생층을 에칭하고, 기판을 제거하면, 도 17에 도시된 바와 같은 프로브 조립체가 제조된다. Finally, the fourth and fifth photoresist is removed (see FIG. 16), the sacrificial layer is etched and the substrate is removed to produce a probe assembly as shown in FIG. 17.

도 16을 참조하면, 본 발명에 의한 프로브 조립체는 에폭시수지로 형성된 제1몰드부(3)와, 희생층(4)과, 상기 제1몰드부(3)상에 일정간격으로 위치되는 복수의 빔(6)과, 상기 복수의 빔(6)들 사이의 공간을 충진하여 형성되는 제2몰드부(8)와, 상기 빔(6)의 일측 단부에 상방으로 돌출형성되는 제1팁부(10)와, 상기 제1팁부(10)상에 상방으로 돌출형성되는 제2팁부(12)로 구성된다. 또한 상기 제1몰드부(3) 및 제2몰드부(8)는 동일 재질로 형성되고, 상기 빔(6), 제1팁부(10) 및 제2팁부(12)도 동일재질로 형성된다. Referring to FIG. 16, a probe assembly according to the present invention includes a plurality of first mold parts 3 formed of an epoxy resin, a sacrificial layer 4, and a plurality of parts positioned at predetermined intervals on the first mold parts 3. A second mold part 8 formed by filling the beam 6, the spaces between the plurality of beams 6, and a first tip part 10 protruding upward from one end of the beam 6; ) And a second tip portion 12 protruding upward on the first tip portion 10. In addition, the first mold part 3 and the second mold part 8 are formed of the same material, and the beam 6, the first tip part 10, and the second tip part 12 are also formed of the same material.

3:제1몰드부 4: 희생층
6: 빔 8: 제2몰드부
10: 제1팁부 12: 제2팁부3: first mold portion 4: sacrificial layer
6: beam 8: second mold part
10: first tip portion 12: second tip portion

Claims (3)

제1몰드부;
상기 제1몰드부상에 일정간격으로 위치되며, 양측 단부가 상기 제1몰드부의 좌우로 돌출되는 복수의 빔;
상기 복수의 빔들 사이의 공간을 충진하여 형성되는 제2몰드부;
상기 빔의 일측 단부에 돌출형성되는 제1팁부; 및
상기 제1팁부상에 형성되되, 상기 빔으로부터 길이방향으로 돌출 형성되는 제2팁부;를 포함하여 형성된 켄틸레버 타입(cantilever type)이며,
상기 제1,2몰드부는 에폭시를 충진하여 형성되는 것을 특징으로 하는 프로브 조립체.
A first mold part;
A plurality of beams positioned at predetermined intervals on the first mold part, and both end portions protruding to the left and right of the first mold part;
A second mold part formed by filling a space between the plurality of beams;
A first tip portion protruding from one end of the beam; And
A second tip portion formed on the first tip portion and protruding in the longitudinal direction from the beam; and a cantilever type formed including
And the first and second mold parts are formed by filling an epoxy.
제1항에 있어서,
상기 제1몰드부 및 제2몰드부는 동일 재질인 것을 특징으로 하는 프로브 조립체.
The method of claim 1,
And the first mold part and the second mold part are made of the same material.
제1항에 있어서,
상기 빔, 제1팁부 및 제2팁부는 동일 재질로 형성되는 것을 특징으로 하는 프로브 조립체. The method of claim 1,
Probe assembly, characterized in that the beam, the first tip portion and the second tip portion is formed of the same material.
KR1020100006744A 2010-01-26 2010-01-26 Mprobe assembly KR100968602B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020100006744A KR100968602B1 (en) 2010-01-26 2010-01-26 Mprobe assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020100006744A KR100968602B1 (en) 2010-01-26 2010-01-26 Mprobe assembly

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020090048177A Division KR100952139B1 (en) 2009-06-01 2009-06-01 Menufacturing method of probe assembly and probe assembly

Publications (1)

Publication Number Publication Date
KR100968602B1 true KR100968602B1 (en) 2010-07-08

Family

ID=42645288

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100006744A KR100968602B1 (en) 2010-01-26 2010-01-26 Mprobe assembly

Country Status (1)

Country Link
KR (1) KR100968602B1 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070099322A (en) * 2006-04-04 2007-10-09 주식회사 코넴 Inspection apparatus of testing a flat panel display and method of fabricating the same

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070099322A (en) * 2006-04-04 2007-10-09 주식회사 코넴 Inspection apparatus of testing a flat panel display and method of fabricating the same

Similar Documents

Publication Publication Date Title
US8854564B2 (en) Substrate for a display device and method of manufacturing the same
CN102708771B (en) Array substrate, manufacturing method and display unit thereof
JP2002118138A (en) Prismatic bump with insulating layer, chip-on-glass product using the same, and manufacturing method therefor onto ic chip surface
US20180197891A1 (en) Array substrate, manufacturing method thereof, display panel and display device
JP2011237405A (en) Probe block and probe unit for inspection of display panel
KR101039338B1 (en) Probe unit testing micro pitch array
KR101152182B1 (en) Probe film used probe block and method for manufacturing thereof
KR100968602B1 (en) Mprobe assembly
JP2011170167A (en) Liquid crystal device
JP2011149938A (en) Film type probe unit, and method of manufacturing the same
KR100952138B1 (en) Menufacturing method of probe assembly
KR100952139B1 (en) Menufacturing method of probe assembly and probe assembly
KR101677697B1 (en) Method of manufacturing a flexible contact film used as probes of a probe unit
KR100929649B1 (en) Menufacturing method of probe assembly
KR100931563B1 (en) Probe assembly having plural row and menufacturing method of the same
KR100972758B1 (en) Menufacturing method of probe assembly
KR101235018B1 (en) Manufacturing method of film type probe unit
KR101272882B1 (en) Probe film used probe block and method for manufacturing there of
KR100949295B1 (en) Menufacturing method of probe assembly having plural row
KR101155092B1 (en) Method for probe film used probe block
KR100946373B1 (en) Menufacturing method of probe assembly having drive ic
KR101127117B1 (en) Probe unit and method for fabricating the same
KR100925496B1 (en) Menufacturing method of probe assembly having drive ic
KR20150008529A (en) Test element, array substrate having the same and method of measuring sheet resistance using the same
KR101142462B1 (en) Probe block with fine pitch tips for inspecting lcd panel and the fabrication method thereof

Legal Events

Date Code Title Description
A107 Divisional application of patent
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20130423

Year of fee payment: 4

FPAY Annual fee payment

Payment date: 20140516

Year of fee payment: 5

FPAY Annual fee payment

Payment date: 20150428

Year of fee payment: 6

LAPS Lapse due to unpaid annual fee