JP2011237405A - Probe block and probe unit for inspection of display panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a probe block and a probe unit for inspection of a display panel, which are capable of effectively inspecting a display panel having micro electrodes arrayed with high density and capable of decreasing a pin miss in an inspection process.SOLUTION: A display panel inspection probe block 220 comprises a probe block body 222 including an inclined projection portion 224; a probe film 100 which is joined to a lower surface of the inclined projection portion 224, projects and extends from an end of the inclined projection portion 224, and is in contact with an electrode of a display panel to apply a signal to the electrode; and a first plate 242 which is joined to an upper surface of the inclined projection portion 224 and is in contact with an upper surface of the projecting and extending probe film 100 to support the probe film 100.

Description

The present invention relates to a probe block for inspection of a display panel and a probe unit.

The LCD (Liquid Crystal Display) production process consists of a cell process for making a display panel, and a driver, backlight, light guide plate and polarizing plate are assembled with the display panel produced in the cell process. It is roughly divided into the module assembly process that produces finished products.

Here, the display panel is an image display device in which the surfaces on which the source electrode and the gate electrode are formed are arranged facing each other on the substrate, and after the liquid crystal material is put between the substrates, the voltage is applied to both electrodes. Is applied to generate an electric field, and liquid crystal molecules are moved by the generated electric field to change the light transmittance, thereby expressing an image.

At this time, a display inspection probe unit (hereinafter referred to as a “probe unit”) performs an inspection on the display panel produced in the cell process, thereby confirming the presence or absence of a defect that may occur in the manufacturing process.

For example, the probe unit includes TFT (Thin Film Transistor), TN (Twisted Nematic), STN (Super Twisted Nematic), CSTN (Color Super Twisted Nematic), DSTN (Double Super Twisted Nematic), and organic EL (Electro Luminescence). A test electrical signal is applied to the electrode (or pad) of the display panel to check whether the display panel operates normally without causing a pixel error.

FIG. 1 is an overall configuration diagram of a conventional probe unit for inspecting a display panel.

As shown in FIG. 1, the probe unit 10 is located on the display panel 20 and inspects whether each cell is abnormal. At this time, the probe unit 10 applies an electrical signal to the electrode of the display panel 20, receives the output signal, and transmits it to the inspection system.

Through such a process, the display panel 20 is inspected for defects such as point defects, line defects, and spot defects that may occur in the manufacturing process.

FIG. 2 is a perspective view of a conventional probe unit.

As shown in FIG. 2, the probe unit 10 generally includes a probe block 12, a PCB unit 16, and a head block 14.

The probe block 12 performs an inspection process by bringing a probe into contact with an electrode of the display panel 20, applying an electrical signal, and detecting an output signal thereby. Here, the probe block 12 can be formed integrally with a TCP (Taped Carrier Package) block (not shown), and such a TCP block sends an electrical signal received from the PCB unit 16 to the probe block 12. introduce.

The head block 14 moves the probe block 12 up and down or fixes it at a fixed position so that the probe of the probe block 12 contacts the electrode of the display panel 20 with an appropriate physical pressure.

The PCB unit 16 generates an electrical signal for inspecting each cell of the display panel 20 and transmits it to the probe block 12 through the film 18.

On the other hand, recently, the number of high-quality display panels has been continuously increasing, and as a result, the need for a probe block having a probe for inspecting a high-density display panel has increased.

However, since the diameter of the probe configured in the above-described conventional probe block is at least about 300 micrometers, there is a limit to inspecting a display panel in which fine electrodes are arranged at high density. In particular, it has been difficult to produce a high-density probe block having uniformly and accurately arranged probes due to technical limitations in processing the probes.

In addition, in the case of a probe configured with a conventional probe block, the probe is worn when the tip of the probe contacts the display panel, and the display panel is not accurately inspected, or the probe is replaced at an appropriate time. There was an inconvenience of having to. In addition, a pin miss may occur due to the individual vertical movement of the probe.

One embodiment of the present invention effectively inspects a display panel in which fine electrodes are arranged at a high density by forming the probe portions at a high density and uniformly using a photolithography method. It is another object of the present invention to provide a display panel inspection probe block and a probe unit that can reduce pin mistakes during an inspection process because the probe portion does not have fluidity.

Also, in one embodiment of the present invention, a plurality of contact bumps are collectively formed on the probe portion according to each signal line so that the contact position is changed from the worn contact bump to the next contact bump. An object of the present invention is to provide a display panel inspection probe block and a probe unit that can continuously perform an inspection process for a display panel using the next contact bump without replacing the worn contact bump.

Also, according to an embodiment of the present invention, a plurality of signal line portions having different lengths are alternately arranged at regular intervals, thereby minimizing the interference of electrical signals that may be caused by a high voltage difference. It is an object to provide a probe block and a probe unit for inspecting a display panel.

Also, an embodiment of the present invention includes a first plate that contacts the upper end of the second plate to which the probe film is attached, so that the contact bumps of the probe film can be effectively displayed at an appropriate physical pressure. An object of the present invention is to provide a probe block and a probe unit for inspecting a display panel, which can be brought into contact with the electrode of the panel.

As a technical means for solving the above technical problem, a display panel inspection probe block according to the first aspect of the present invention is coupled to a probe block body including an inclined protrusion and a lower surface of the inclined protrusion. A probe film that protrudes and extends from the tip of the inclined protrusion, applies a signal to the electrode of the display panel, and a probe film that is coupled to the upper side of the inclined protrusion and extends A first plate in contact with the upper surface and supporting the probe film.

The display panel inspection probe unit according to the second aspect of the present invention is coupled to a probe block main body including an inclined protrusion and a lower surface of the inclined protrusion, and extends and protrudes from the tip of the inclined protrusion. A probe film that contacts the electrode and applies a signal to the electrode, and a first plate that supports the probe film by contacting the upper surface of the probe film that is coupled to the upper surface of the inclined projecting portion and extends. A probe block that is coupled to the upper part of the probe block, moves the probe block up and down so that the probe film and the electrode of the display panel are in contact with each other, and a crimping block that is detachably coupled to the lower part of the probe block including.

According to the problem-solving means of the present invention described above, the photolithography method is used to form the probe portion at a high density and uniformly at the same time, so that a display panel in which fine electrodes are arranged at a high density is effective. In addition, since there is no fluidity of the probe portion, pin mistakes during the inspection process can be reduced.

Further, according to the problem solving means of the present invention described above, a plurality of contact bumps are collectively placed on the probe portion according to each signal line so that the contact position is changed from the worn contact bump to the next contact bump. Since it is formed, the inspection process for the display panel can be continuously performed using the next contact bump without replacing the worn contact bump.

In addition, according to the problem solving means of the present invention described above, since a plurality of signal line portions having different lengths are alternately arranged at regular intervals, the interference of electrical signals that may occur due to a high voltage difference is prevented. Can be minimized.

Further, according to the problem solving means of the present invention described above, since the first plate is in contact with the upper end of the second plate to which the probe film is attached, the contact bumps of the probe film are applied with an appropriate physical pressure. Can effectively contact the electrodes of the display panel.

It is the whole block diagram of a probe unit for inspecting the conventional display panel. It is a perspective view of the conventional probe unit. It is a figure which shows the probe unit by one Example of this invention. It is a figure which shows the front-end | tip part of a probe block. It is a figure which shows the front-end | tip part of a probe block. It is a figure which shows the front-end | tip part of a probe block. FIG. 4 is an exploded perspective view of the probe unit of FIG. 3. 1 is a perspective view of a probe film according to an embodiment of the present invention. It is a top view of the probe film of FIG. FIG. 4 is a diagram illustrating signal line portions formed in a certain pattern and contact bumps protruding from the signal line portions according to an embodiment of the present invention. It is a whole flowchart of the manufacturing method of the probe film for probe blocks by one Example of this invention. It is a detailed flowchart of the manufacturing method of the probe film for probe blocks by one Example of this invention. It is a figure which shows the process for demonstrating the manufacturing method of the probe film for probe blocks by one Example of this invention. It is a figure which shows the process for demonstrating the manufacturing method of the probe film for probe blocks by one Example of this invention. It is a figure which shows the process for demonstrating the manufacturing method of the probe film for probe blocks by one Example of this invention. It is a figure which shows the process for demonstrating the manufacturing method of the probe film for probe blocks by one Example of this invention. It is a figure which shows the process for demonstrating the manufacturing method of the probe film for probe blocks by one Example of this invention. It is a figure which shows the process for demonstrating the manufacturing method of the probe film for probe blocks by one Example of this invention. It is a figure which shows the process for demonstrating the manufacturing method of the probe film for probe blocks by one Example of this invention. It is a figure which shows the process for demonstrating the manufacturing method of the probe film for probe blocks by one Example of this invention. It is a figure which shows the process for demonstrating the manufacturing method of the probe film for probe blocks by one Example of this invention. It is a figure which shows the process for demonstrating the manufacturing method of the probe film for probe blocks by one Example of this invention. It is a figure which shows the process for demonstrating the manufacturing method of the probe film for probe blocks by one Example of this invention. FIG. 12 is a diagram illustrating a signal line portion formed in the steps of FIGS. 11 a to 11 k and a plurality of contact bumps formed to protrude from the signal line portion.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that a person having ordinary knowledge in the technical field to which the present invention belongs can be easily implemented. However, the present invention can be embodied in various different forms and is not limited to the embodiments described herein. Further, parts not related to the description for clearly explaining the present invention in the drawings are omitted, and like parts are denoted by like reference numerals throughout the specification.

Throughout the specification, when one part is “coupled” to another, this is not only “directly coupled”, but “electrically coupled” with other elements in between. "Is included. Also, where a part “includes” any component, this means that other components may be included rather than other components, unless specifically stated to the contrary.

FIG. 3 shows a probe unit according to an embodiment of the present invention. 4a-4c show the tip of the probe block. FIG. 5 is an exploded perspective view of the probe unit of FIG.

As shown in FIGS. 3 to 5, the probe unit 200 of the present invention includes a head block 210, a probe block 220, and a crimping block 230.

The head block 210 is coupled to the upper portion of the probe block 220 to move and fix the probe block 220 up and down so that the probe portion of the probe block 220 contacts the electrode of the display panel with an appropriate physical pressure.

The probe block 220 is coupled to a probe block main body 222 including an inclined protrusion 224, and a lower surface of the inclined protrusion 224. The probe block 220 extends and protrudes from the tip of the inclined protrusion 224, and contacts the electrode of the display panel. And a first plate 242 that is coupled to the upper surface of the inclined projecting portion 224 and contacts the upper surface of the projecting and extended probe film 100 to support the probe film 100. Here, the probe block 220 may further include a fixing block 250 that is coupled to an upper surface of the first plate 242 and fixes and supports the first plate 242.

More specifically, as shown in FIG. 4 a, the tip A of the probe block 220 is coupled to the lower surface of the inclined protrusion 224 and the lower surface of the second plate 241. The probe film 100 that is in contact with the electrode of the display panel and applies a signal and the upper surface of the inclined protrusion 224 are coupled to the upper surface of the second plate 241 to contact the top surface 241 of the second plate. -1 for supporting −1. At this time, the front end portion 242-1 of the first plate 242 can contact the front end portion 241-1 of the second plate 241 at an inclined angle.

As shown in FIG. 4b, in another embodiment, the tip A ′ of the probe block 220 has the second plate 241 interposed between the lower surface of the inclined protrusion 224 and the probe film 100. First, the probe film 100 is coupled to the lower surface of the inclined protrusion 224 and extended from the tip of the inclined protrusion 224, and the tip 242-2 of the first plate 242 protrudes and extends. It may be configured in an extended form so as to be in contact with the upper surface.

Further, as shown in FIG. 4c, in another embodiment, the tip A ″ of the probe block 220 is formed by integrally forming the second plate 241 and the first plate 242 and the lower surface of the second plate 241. Alternatively, the probe film 100 may be combined.

The crimping block 230 is detachably coupled to the lower part of the probe block 220. The pressure-bonding block 230 includes a pressure-bonding block main body portion 231 housed in a recess formed in the lower portion of the probe block 220, a coupling protrusion 232 formed to protrude to one side of the main body portion 231, and a pressure-bonding block main body portion 231. A connection film 233 that extends from the lower portion of the connection protrusion 232 and is connected to the probe film 100 by pressing on the upper surface of the connection protrusion 232.

Here, the connection film 233 is mounted with a drive IC (Drive Integrated Circuit) (not shown) for inspecting the display panel. Such a driving IC applies an electrical signal to each electrode of the display panel and detects an output to detect whether or not the display panel is defective. The connection film 233 may be implemented as a chip on film.

Hereinafter, the probe film 100 described above will be described in more detail with reference to FIGS. 6 and 7.

FIG. 6 is a perspective view of a probe film according to an embodiment of the present invention. FIG. 7 is a plan view of the probe film of FIG.

6 and 7, the probe film 100 attached to the display panel inspection probe block is formed to protrude from the signal line portion 151 and the signal line portion 151, and includes a plurality of pieces provided in the display panel. A film 170 is bonded to the upper surfaces of a plurality of probe parts 150 each including contact bumps 152 that are in contact with the electrodes.

Here, the probe part 150 is formed in a lump at regular intervals using a photolithography method.

The contact bump 152 of the probe unit 150 is a part that contacts a plurality of electrodes provided in the display panel. Here, the contact bump 152 may be an asymmetrical rhombus in which the width (a ′) of the front end portion 153 is formed wider than the width of other portions and the height (b ′) decreases in the vertical direction. . That is, the contact bump 152 has the largest height (b ′) at the point where the vertical line (c ′) and the width direction line (a ′) of the tip 153 intersect, and the height increases in the vertical direction. Can be a decreasing form.

Then, the signal line unit 151 of the probe unit 150 applies an electrical signal to the display panel through the contact bump 152 in contact with the display panel, and transmits an output signal thereby to the inspection system. Such contact bumps 152 and signal line portions 151 can be arranged in the form of FIG.

FIG. 8 is a diagram illustrating signal line portions formed in a certain pattern according to an embodiment of the present invention and contact bumps formed protruding from the signal line portions.

As shown in FIG. 8, a plurality of contact bumps 152 may be formed to protrude from a plurality of signal line portions 151a and 151b having different lengths. Here, the signal line portions 151a and 151b are retracted from the first signal line portion 151a formed to the first length, the first signal line portion 151a, and shorter than the first signal line portion 151a. Second signal line portions 151b formed in a second length, and the first signal line portions 151a and the second signal line portions 151b may be alternately arranged.

Here, the same signal is transmitted to the signal line portion having the same length, and a voltage difference between the signal line portion 151a formed in the first length and the signal line portion 151b formed in the second length is increased. It can be 20V-40V. As described above, the signal line portions 151a and 151b are alternately arranged at regular intervals, thereby minimizing the interference of electrical signals that may be generated by the voltage difference.

Since a plurality of contact bumps 152 project from the signal line portion, the inspection process for the display panel can be effectively performed using the next contact bump without the need to replace the worn contact bump. .

More specifically, the contact bump 152 is formed in the above-mentioned asymmetrical rhombus, and the position of the contact can be smoothly changed from the worn contact bump to the next contact bump. The inspection process for the display panel is continuously performed using the next contact bump without replacement.

In addition, the above-described probe unit 150 is formed collectively at a constant interval using a photolithography method, and the contact bumps and the signal line unit do not flow and are arranged uniformly and accurately. Pin mistakes can be reduced when testing the display panel. Hereinafter, the method for producing the probe block probe film will be described more specifically with reference to FIG.

FIG. 9 is an overall flowchart of a method for producing a probe block probe film according to an embodiment of the present invention.

As shown in FIG. 9, in order to manufacture the probe block probe film of the present invention, first, a plurality of probe parts 150 each including a signal line part and a contact bump formed so as to protrude from the signal line part are formed by photolithography. A method is used to form all at once at a set interval on the substrate (step S1001). This step S1001 corresponds to steps S1101 to S1108 described later.

Next, the upper surface of the probe unit 150 is joined to the film unit (step S1002). This step S1002 corresponds to steps S1109 to S1110 described later.

Then, the substrate is removed (step S1003). This step S1003 corresponds to step S1111 described later.

A more specific process and detailed manufacturing order of the method for manufacturing the probe film shown in FIG. 9 will be described later with reference to FIGS. 10 and 11a to 11k.

FIG. 10 is a detailed flowchart of a method for manufacturing a probe block probe film according to an embodiment of the present invention. FIGS. 11a to 11k are diagrams illustrating steps for explaining a method for manufacturing a probe block probe film according to an embodiment of the present invention.

As shown in FIG. 11a, the first photoresist layer 120 formed on the silicone (Si) substrate 110 (hereinafter referred to as “substrate”) is patterned to form a pattern having a constant width (c ′). (Step S1101). Here, the corresponding width (c ′) may be formed to correspond to the length of the contact bump 152. More specifically, the first photoresist layer 120 is patterned using a mask pattern by exposing the exposed photoresist layer using a UV exposure apparatus or the like using a pre-defined mask layer and performing a phenomenon process on the exposed photoresist layer. Can do.

Next, as shown in FIG. 11B, using the first photoresist layer 120 as a mask, the substrate 110 is etched to form contact bump regions 122 (S1102). More specifically, a contact bump region 122 is formed by etching the substrate 110 at a predetermined depth using the first photoresist layer 120 as a mask by using a DRIE (Deep silicon Reactive Ion Etching) process. Can do.

Here, the DRIE process may be performed in the order of, for example, a polymer deposition stage, a polymer etching stage, and a silicone etching stage. The set depth may vary depending on the asymmetric diamond shape of the contact bump 152. That is, the point at which the vertical line (c ′) and the line (a ′) in the width direction of the tip intersect is etched deepest. See FIGS. 6 and 7 above for this.

Next, as shown in FIG. 11C, a seed layer 130 is formed on the upper surface of the substrate 110 and the upper surface of the first photoresist layer 120 exposed by forming the contact bump region 122 (step S1103). Here, the seed layer 130 can be formed by sputtering a Ti (eg, 50 nm) and Cu (eg, 100 nm) seed metal. More specifically, the seed layer 130 can be formed in a process of sputtering Cu after sputtering Ti.

Next, as shown in FIG. 11d, the second photoresist layer 140 is patterned on the seed layer 130 to form the signal line region 142 (step S1104). Here, the second photoresist layer 140 is exposed by an ultraviolet exposure apparatus or the like using a mask layer that is defined in advance so that the signal line region 142 is formed, and a phenomenon process is performed on the exposed photoresist layer. It can be patterned by a mask pattern.

Next, as shown in FIG. 11e, the contact bump region 122 and the signal line region 142 are filled with a conductive material 144 (step S1105). Here, this step S1105 is performed in the process of plating at least one metal of Ni, NiCo, NiFe, and NiW.

Next, as shown in FIG. 11f, the probe unit 150 is formed by flattening the upper surfaces of the regions 122 and 142 filled with the conductive material 144 (step S1106). Here, the upper surfaces of the regions 122 and 142 filled with the conductive material 144 can be planarized by a chemical mechanical polishing (CMP) process. At this time, one end 151 of the probe unit 150 is used as a signal line unit, and the other end 152 formed to protrude from the one end 151 is used as a contact bump.

Next, as shown in FIG. 11g, the second photoresist layer 140 described above is removed (step S1107). Here, the second photoresist layer 140 may be removed by any one of an ashing process, a wet removal process, and an O ₂ plasma method.

Also, as shown in FIG. 11h, the seed layer 131 exposed by removing the second photoresist layer 140 is removed (step S1108). Here, the corresponding seed layer 131 may be removed through a dry etching process or a wet etching process.

Next, as shown in FIG. 11i, an adhesive 160 is applied to the upper surface of the probe unit 150 (step S1109). At this time, the adhesive 160 may be applied by performing epoxy spreading, and the adhesive 160 may be applied collectively to the upper surface of the first photoresist layer 120 according to the process method. Can do.

Next, as shown in FIG. 11j, the film portion 170 is bonded to the adhesive 160 (step S1110).

Further, as shown in FIG. 11k, the substrate 110 is removed to complete the production of the probe film (step S1111). Here, the first photoresist layer 120 can be removed together. At this time, the substrate 110 and the first photoresist layer 120 can be removed by a wet etching process. The wet etching process may be performed using a KOH solution or a TMAH (tetramethyl ammonium hydroxide) solution, which is an alkaline solution capable of etching the silicone. For example, wet etching can be performed at a temperature of 65 ° C. using a 44 wt% KOH (potassium hydroxide) solution. In addition, isopropyl alcohol can be added to the KOH solution used in the wet etching process.

In contrast, the substrate 110 and the first photoresist layer 120 may be removed by a dry etching process such as DRIE.

In this embodiment, after forming and patterning the first photoresist layer 120 on the substrate 110, the substrate 110 is etched using this as a mask to form the contact bump region. The contact bump region can also be formed by stacking a plurality of photoresist layers on the substrate 110 and then etching only the plurality of photoresist layers without etching the substrate 110.

By forming the contact bump region without etching the hard substrate 110 as described above, the process can be simplified and the manufacturing cost can be reduced.

FIG. 12 is a diagram illustrating a signal line portion formed in the steps of FIGS. 11a to 11k and a plurality of contact bumps formed to protrude from the signal line portion.

As shown in FIG. 12, the signal line portion 151 and a plurality of contact bumps 152 protruding from the signal line portion 151 can be formed at the same time in the steps of FIGS. 11a to 11k. . At this time, one contact bump 152 may be formed to protrude from the signal line portion 151.

On the other hand, the above description of the present invention is for illustrative purposes only, and those having ordinary knowledge in the technical field to which the present invention belongs can be used without changing the technical idea or essential features of the present invention. It can be easily transformed into other specific forms. Thus, it should be understood that the above-described embodiments are illustrative in all aspects and not limiting. For example, each component described in a single type can be implemented in a distributed manner, and similarly, components described as being distributed can be implemented in a combined form. .

The scope of the present invention should be expressed not by the above detailed description but by the scope of the claims, and all changes or modifications derived from the meaning and scope of the scope of claims and the equivalent concept thereof. It should be construed that the form is within the scope of the invention.

DESCRIPTION OF SYMBOLS 100 Probe film 150 Probe part 151 Signal line part 152 Contact bump 170 Film part 200 Probe unit 210 Head block 220 Probe block 230 Crimp block 241 2nd plate 242 1st plate 250 Fixed block

Claims (20)

In the probe block for display panel inspection,
A probe block body including an inclined protrusion; and
A probe film coupled to a lower surface of the inclined protrusion, extending from a tip of the inclined protrusion, and contacting a display panel electrode to apply a signal to the electrode;
A first plate coupled to the upper side surface of the inclined projecting portion and contacting the upper surface of the projecting and extended probe film to support the probe film;
A probe block comprising: The probe block according to claim 1, further comprising a second plate interposed between a lower surface of the inclined protrusion and the probe film. The probe block according to claim 2, wherein the second plate and the first plate are integrally formed. The probe block according to claim 2, wherein the tip of the first plate is in contact with the tip of the second plate at an inclined angle. The probe block according to claim 1, further comprising a fixing block coupled to an upper surface of the first plate and configured to fix and support the first plate. The probe film is
A plurality of probe portions each including contact bumps that are formed to protrude from the signal line portion and the signal line portion and are in contact with the plurality of electrodes provided in the display panel;
A film part joined to the upper surface of the probe part;
The probe block according to claim 1, comprising: The probe block according to claim 6, wherein the probe portions are collectively formed at regular intervals using a photolithography method. The signal line section includes a first signal line section formed to a first length, and a second signal line section formed to a second length shorter than the first signal line section. Including
The probe block according to claim 6, wherein the first signal line portions and the second signal line portions are alternately arranged. The probe block according to claim 6, wherein the contact bump has a shape in which a width of a tip portion is wider than a width of another portion and a height is reduced in a vertical direction. In the probe unit for inspecting the display panel,
A probe block body including an inclined protrusion, a probe film coupled to a lower surface of the inclined protrusion, extending from the tip of the inclined protrusion, and contacting the electrode of the display panel to apply a signal to the electrode And a probe block including a first plate that supports the probe film in contact with an upper surface of the probe film that is coupled to the upper side surface of the inclined protrusion and protrudes and extends.
A head block that is coupled to the top of the probe block and moves the probe block up and down so that the probe film and the electrode of the display panel are in contact with each other;
A crimping block removably coupled to a lower portion of the probe block;
A probe unit comprising: The crimp block is
A pressure-bonding block main body housed in a recess formed in the lower portion of the probe block;
A coupling protrusion formed to protrude from one side of the crimp block main body;
A connecting film that extends from the lower part of the crimping block main body around the coupling protrusion and is connected by crimping to the probe film side on the upper surface of the coupling protrusion,
The probe unit according to claim 10, comprising: The probe unit according to claim 11, wherein the connection film is mounted with a driving IC for inspecting the display panel. The probe unit according to claim 10, further comprising a second plate interposed between a lower surface of the inclined protrusion and the probe film. The probe unit according to claim 13, wherein the second plate and the first plate are integrally formed. 14. The probe unit according to claim 13, wherein the tip of the first plate is in contact with the tip of the second plate at an inclined angle. The probe unit according to claim 10, further comprising a fixing block coupled to an upper surface of the first plate and fixing and supporting the first plate. The probe film is
A plurality of probe portions each including contact bumps that are formed to protrude from the signal line portion and the signal line portion and are in contact with the plurality of electrodes provided in the display panel;
A film part joined to the upper surface of the probe part;
The probe unit according to claim 10, comprising: 18. The probe unit according to claim 17, wherein the probe unit is formed collectively at a constant interval using a photolithography method. The signal line part includes a first signal line part formed to a first length and a second signal line part formed to a second length shorter than the first signal line part,
The probe unit according to claim 17, wherein the first signal line portions and the second signal line portions are alternately arranged. 18. The probe unit according to claim 17, wherein the contact bump has a shape in which a tip portion is wider than another portion and a height is reduced in a vertical direction.

Images