JPH01122583A - Measurement jig for semiconductor device - Google Patents
Measurement jig for semiconductor deviceInfo
- Publication number
- JPH01122583A JPH01122583A JP27951087A JP27951087A JPH01122583A JP H01122583 A JPH01122583 A JP H01122583A JP 27951087 A JP27951087 A JP 27951087A JP 27951087 A JP27951087 A JP 27951087A JP H01122583 A JPH01122583 A JP H01122583A
- Authority
- JP
- Japan
- Prior art keywords
- contact
- semiconductor device
- sheet
- shows
- projection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 28
- 238000005259 measurement Methods 0.000 title claims description 5
- 238000012360 testing method Methods 0.000 claims abstract description 22
- 239000013013 elastic material Substances 0.000 claims description 6
- 238000000691 measurement method Methods 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims 3
- 239000004615 ingredient Substances 0.000 claims 2
- 238000000034 method Methods 0.000 description 7
- 238000007796 conventional method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Connecting Device With Holders (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
Description
【発明の詳細な説明】 〔概要〕 半導体デバイスの測定治具に関し。[Detailed description of the invention] 〔overview〕 Regarding measurement jigs for semiconductor devices.
コンタクト数の多い半導体デバイスの試験を容易にしか
も信頼性よく行うことを目的とし。The purpose is to easily and reliably test semiconductor devices with a large number of contacts.
曲げ可能なフィルム２及び該フィルム２上に形成された
複数のコンタクト用突起３と複数の接続用スルーホール
４及び該突起３と該スルーボール４を結ぶ配線５を有す
るコンタクト・シート１を有し、各コンタクト用突起３
は独立に動くことができ、該コンタクト用突起３と被測
定半導体装置イスのコンタクト部とを接触させる手段を
有する半導体デバイスの測定治具をもって構成とする。The contact sheet 1 has a bendable film 2, a plurality of contact protrusions 3 formed on the film 2, a plurality of connection through holes 4, and a wiring 5 connecting the protrusions 3 and the through balls 4. , each contact protrusion 3
The semiconductor device measuring jig is configured to include a semiconductor device measuring jig which can move independently and has means for bringing the contact protrusion 3 into contact with the contact portion of the semiconductor device chair to be measured.
本発明は半導体デバイスの測定治具に係り、特にコンタ
クト数の多い半導体デバイスの試験に使用する測定治具
に関する。The present invention relates to a measuring jig for semiconductor devices, and more particularly to a measuring jig used for testing semiconductor devices with a large number of contacts.
従来、半導体デバイスの組立後の試験において。 Conventionally, in post-assembly testing of semiconductor devices.
フラットパッケージ等のデバイスを試験する場合には、
テストカードによる試験を行っている。この時の測定法
は第８図（ａ）に示すようにポゴピン１２とテス、トカ
ード９を治具により上から押さえつける方式をとってい
る。第８図（、ｂ ）はポゴピンの構造を示す。ポゴピ
ンの針は接触部分で電気的接触を保ちつつ上下にスライ
ドし、ばねによってテストカード９におさえつけられる
。When testing devices such as flat packages,
Tests are conducted using test cards. The measurement method at this time is to press the pogo pin 12, test, and card 9 from above using a jig, as shown in FIG. 8(a). Figure 8(,b) shows the structure of pogopin. The needle of the pogo pin slides up and down while maintaining electrical contact at the contact portion, and is held down to the test card 9 by a spring.
この方式の問題点として。 This is the problem with this method.
（ａ）多ピンになればなるほど、ポゴピンの数が増え、
テストカードが大きくなる。その場合テストカードの反
り、あるいはポゴピンの高さのばらつきにより、正常な
コンタクトをとることが困難になる。ポゴピンの高さを
自在に調整するすることは困難で、現在のところポゴピ
ンのストロークもＩｎと小さい。(a) The more pins there are, the more pogo pins there are.
Test cards get bigger. In that case, it becomes difficult to make normal contact due to warping of the test card or variations in the height of the pogo pins. It is difficult to freely adjust the height of the pogo pin, and the stroke of the pogo pin is currently as small as In.
（ｂ）テストカードとポゴピンとのコンタクトをとるた
めに１機械的に上から力を加えているが。(b) A mechanical force is applied from above to make contact between the test card and the pogo pin.
この圧力を調整する手段が人間の勘に頼っていて信頼性
に乏しい。The means for adjusting this pressure relies on human intuition and is unreliable.
本発明の目的は、ポゴピンよりストロークが大きく、高
さコントロールが容易に出来る手段、及び機械的圧力を
利用せずに一定の圧力を常に与える手段を持つ測定治具
を提供するものである。An object of the present invention is to provide a measuring jig that has a larger stroke than a pogo pin, a means for easily controlling the height, and a means for constantly applying constant pressure without using mechanical pressure.
第１図に本発明のコンタクト・シートを示す。 FIG. 1 shows a contact sheet of the present invention.
曲げ可能なフィルム２及び該フィルム２上に形成された
複数のコンタクト用突起３と複数の接続用スルーホール
４及び該突起３と該スルーホール４を結ぶ配線５を有す
るコンタクト・シート１を有し、各コンタクト用突起３
は独立に動くことができ、該コンタクト用突起３と被測
定半導体デバイスのコンタクト部とを接触させる手段を
有する半導体デバイスの測定治具によって上記問題点は
解決される。The contact sheet 1 has a bendable film 2, a plurality of contact protrusions 3 formed on the film 2, a plurality of connection through holes 4, and a wiring 5 connecting the protrusions 3 and the through holes 4. , each contact protrusion 3
The above problem is solved by a semiconductor device measuring jig which can move independently and has means for bringing the contact protrusion 3 into contact with the contact portion of the semiconductor device to be measured.
第１図に示したコンタクト・シートは曲げ可能なので、
これを用いることにより、従来のポゴピン使用よりも上
下の作動距離を大きくとれる。従って、従来よりも多ビ
ン構造のデバイスへの適用範囲が広い。更に弾性物質や
空気圧を使用してコンタクト同志を接触させると、一定
の接触圧が得られ、測定の信頼性が高い。Since the contact sheet shown in Figure 1 is bendable,
By using this, a larger vertical working distance can be achieved than using conventional pogo pins. Therefore, the range of application to devices with a multi-bin structure is wider than that of the conventional method. Furthermore, when the contacts are brought into contact using an elastic material or air pressure, a constant contact pressure can be obtained, and the reliability of measurement is high.
以下本発明の実施例について説明する。 Examples of the present invention will be described below.
（ａ）第２図にコンタクト部の形状を示す。各種形状が
可能で２図（ａ）はバンプ方式コンタクト部で半球状の
もの１図（ｂ）はコンタクト・チップ方式コンタクト部
で円錐状のものである。(a) Figure 2 shows the shape of the contact part. Various shapes are possible, and Fig. 2 (a) shows a bump type contact portion, which is hemispherical, and Fig. 1 (b) shows a contact tip type contact portion, which has a conical shape.
（ｂ）第３図は弾性物質によるコンタクト・シートの保
持機構の例である。コンタクト・シート１を載せる支持
台６の上部のコンタクト部があたる部分をゴム等の弾性
物質７で覆う。(b) FIG. 3 is an example of a contact sheet holding mechanism using an elastic material. The upper part of the support base 6 on which the contact sheet 1 is placed is covered with an elastic material 7 such as rubber.
（Ｃ）上記の改良として、各コンタクト部に対して力が
独立に働くような機能を持った保持機構とすることもで
きる。第４図は空気圧を利用した保持機構である。各々
のコンタクト用突起３を高圧空気で押し挙げて半導体デ
バイスのコンタクト部と接触させる。(C) As an improvement to the above, it is also possible to provide a holding mechanism that has a function of applying force to each contact portion independently. FIG. 4 shows a holding mechanism using air pressure. Each contact protrusion 3 is pushed up with high pressure air to bring it into contact with the contact portion of the semiconductor device.
（ｄ）第５図は簡易方式保持機構である。コンタクト用
突起３の当たる支持台６上の部分に個別に弾性体を配置
する。図（ａ、）は球状弾性体の例であり１図（ｂ）は
円筒状弾性体の例である。(d) FIG. 5 shows a simple holding mechanism. Elastic bodies are individually arranged on the parts of the support base 6 where the contact projections 3 come into contact. Figure 1 (a) is an example of a spherical elastic body, and Figure 1 (b) is an example of a cylindrical elastic body.
（ｅ）コンタクト・シートと半導体デバイスのコンタク
ト同志を接触させるための加圧法を第６図に示す。図（
ａ）は真空引きによる方法で、テストカード９のついた
半導体デバイス８を真空吸引でコンタクト・シート１に
接触させる。図（ｂ）は高圧空気による方法で、テスト
カード９をはめ込むソケット１０をテストカード９の上
からかぶせ、高圧空気で押さえつける。(e) A pressurizing method for bringing the contacts of the contact sheet and the semiconductor device into contact is shown in FIG. figure(
A) is a vacuum suction method, in which the semiconductor device 8 with the test card 9 attached is brought into contact with the contact sheet 1 by vacuum suction. Figure (b) shows a method using high-pressure air, in which a socket 10 into which the test card 9 is inserted is placed over the test card 9 and pressed down with high-pressure air.
（ｆ）第７図はビングリッドアレー（ＰＧＡ）とコンタ
クト・シートとのコンタクト法である。ビングリッドア
レーは図（ａ＞に示すようにコンタクト部が内側にある
構造で、そのコンタクト部の配置に合わせて図（ｂ）に
示すようなビングリッドアレー用コンタクト・シートを
作る。図（Ｃ）はコンタクト状態を示す。丁度ビングリ
・ノドアレー１１をはめ込むソケット１０にデバイスを
はめ込むと、コンタクト・シートの突起とデバイスのコ
ンタクト部が接触するように構成する。接触をより確実
に、かつ均一にするため、コンタクトの下に弾性物質７
を配置する。(f) FIG. 7 shows a contact method between a bin grid array (PGA) and a contact sheet. The bin grid array has a structure in which the contact part is on the inside as shown in Figure (a), and a contact sheet for the bin grid array as shown in Figure (b) is made according to the arrangement of the contact part. ) indicates a contact state.When the device is inserted into the socket 10 into which the Bingli node array 11 is inserted, the protrusion of the contact sheet and the contact portion of the device are configured to come into contact.The contact is made more reliable and uniform. Therefore, there is an elastic material 7 under the contact.
Place.
本発明によれば、多ピンデバイスの試験が信頬性良く確
実に、しかも容易に出来るテストカード付半導体デバイ
スの測定治具を提供することが出来る。さらに本発明の
測定治具を使用すれば１作業性が著しく向上する。According to the present invention, it is possible to provide a semiconductor device measurement jig with a test card that allows testing of multi-pin devices with high reliability, reliably, and easily. Furthermore, if the measuring jig of the present invention is used, the work efficiency will be significantly improved.
第１図は本発明のコンタクト・シート。
第２図はコンタクト部。
第３図は弾性物質による保持機構。
第４図は空気圧による保持機構。
第５図は簡易方式保持機構。
第６図は半導体デバイスとのコンタクト法。
第７図はピングリッドアレーとのコンタクト法第８図は
従来の測定法
である。 図において。
１はコンタクトシート。
２はフィルム。
３はコンタクト用突起。
４は接続用スルーホール。
５は配線。
６は支持台。
７は弾性物質。
８は半導体デバイス。
９はテストカード。
１０はソケット。
１１はピングリッドアレー。
１２はポゴピン
？−−＼
仝
＼−ノ′
ヘ
ロ
越
哩
＼２ユ／
Ｊき
ｌFIG. 1 shows a contact sheet of the present invention. Figure 2 shows the contact section. Figure 3 shows a holding mechanism using an elastic material. Figure 4 shows a holding mechanism using air pressure. Figure 5 shows a simple holding mechanism. Figure 6 shows the contact method with semiconductor devices. FIG. 7 shows a contact method with a pin grid array. FIG. 8 shows a conventional measurement method. In fig. 1 is a contact sheet. 2 is film. 3 is a contact protrusion. 4 is a through hole for connection. 5 is wiring. 6 is a support stand. 7 is an elastic substance. 8 is a semiconductor device. 9 is a test card. 10 is a socket. 11 is a pin grid array. Is 12 a pogo pin? −−＼仝＼－ノ′Hero over the top ＼2yu／Jkil
Claims (4)
された複数のコンタクト用突起３と複数の接続用スルー
ホール４及び該突起３と該スルーホール４を結ぶ配線５
を有するコンタクト・シート１を有し、各コンタクト用
突起３は独立に動くことができ、該コンタクト用突起３
と被測定半導体デバイスのコンタクト部とを接触させる
手段を有することを特徴とする半導体デバイスの測定治
具。(1) A bendable film 2, a plurality of contact protrusions 3 and a plurality of connection through holes 4 formed on the film 2, and wiring 5 connecting the protrusions 3 and the through holes 4.
The contact sheet 1 has a contact sheet 1 having a structure in which each contact protrusion 3 is movable independently.
A measuring jig for a semiconductor device, comprising means for bringing the contact portion of the semiconductor device under test into contact with the contact portion of the semiconductor device to be measured.
ンタクト部とを接触させ圧力を加える手段として弾性物
質の弾性を利用することを特徴とする特許請求の範囲第
１項記載の半導体デバイスの測定治具。(2) A measurement method for a semiconductor device according to claim 1, characterized in that the elasticity of an elastic material is used as means for bringing the contact protrusion 3 into contact with the contact portion of the semiconductor device under test and applying pressure. Ingredients.
ンタクト部とを接触させ圧力を加える手段として真空に
よる吸引力を利用することを特徴とする特許請求の範囲
第１項記載の半導体デバイスの測定治具。(3) A measurement method for a semiconductor device according to claim 1, characterized in that suction force by vacuum is used as means for bringing the contact protrusion 3 into contact with the contact portion of the semiconductor device to be measured and applying pressure. Ingredients.
ンタクト部とを接触させ圧力を加える手段として高圧空
気による加圧を利用することを特徴とする特許請求の範
囲第１項記載の半導体デバイスの測定治具。(4) Measurement of a semiconductor device according to claim 1, characterized in that pressurization by high-pressure air is used as means for bringing the contact protrusion 3 into contact with the contact portion of the semiconductor device under test and applying pressure. jig.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27951087A JPH01122583A (en) | 1987-11-05 | 1987-11-05 | Measurement jig for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27951087A JPH01122583A (en) | 1987-11-05 | 1987-11-05 | Measurement jig for semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01122583A true JPH01122583A (en) | 1989-05-15 |
Family
ID=17612040
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27951087A Pending JPH01122583A (en) | 1987-11-05 | 1987-11-05 | Measurement jig for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01122583A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04233480A (en) * | 1990-09-14 | 1992-08-21 | Internatl Business Mach Corp <Ibm> | Flexible-tape type probe |
| JPH0774219A (en) * | 1993-08-31 | 1995-03-17 | Kurisutaru Device:Kk | Probe substrate, its manufacture and probe device |
| JPH11258269A (en) * | 1998-03-09 | 1999-09-24 | Fujitsu Ltd | Contactor for semiconductor device |
| KR20030075541A (en) * | 2002-03-19 | 2003-09-26 | 주식회사 파이컴 | Probe of inspection apparatus for testing flat pannel display |
| WO2011024303A1 (en) * | 2009-08-31 | 2011-03-03 | 株式会社アドバンテスト | Probe, probe card and electronic component testing apparatus |
| JP2011237405A (en) * | 2010-05-06 | 2011-11-24 | Di Probe Co Ltd | Probe block and probe unit for inspection of display panel |
| WO2021193579A1 (en) * | 2020-03-25 | 2021-09-30 | 日本電産リード株式会社 | Inspection probe and inspection device |
| WO2023074198A1 (en) * | 2021-10-27 | 2023-05-04 | 株式会社ヨコオ | Flexible substrate and testing jig |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61219874A (en) * | 1985-03-27 | 1986-09-30 | Hitachi Micro Comput Eng Ltd | Socket |
| JPS61259470A (en) * | 1984-12-31 | 1986-11-17 | ゼネラル・エレクトリツク・カンパニイ | Compression type socket for direct and mutual link to semiconductor chip |
-
1987
- 1987-11-05 JP JP27951087A patent/JPH01122583A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61259470A (en) * | 1984-12-31 | 1986-11-17 | ゼネラル・エレクトリツク・カンパニイ | Compression type socket for direct and mutual link to semiconductor chip |
| JPS61219874A (en) * | 1985-03-27 | 1986-09-30 | Hitachi Micro Comput Eng Ltd | Socket |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04233480A (en) * | 1990-09-14 | 1992-08-21 | Internatl Business Mach Corp <Ibm> | Flexible-tape type probe |
| JPH0774219A (en) * | 1993-08-31 | 1995-03-17 | Kurisutaru Device:Kk | Probe substrate, its manufacture and probe device |
| JPH11258269A (en) * | 1998-03-09 | 1999-09-24 | Fujitsu Ltd | Contactor for semiconductor device |
| KR20030075541A (en) * | 2002-03-19 | 2003-09-26 | 주식회사 파이컴 | Probe of inspection apparatus for testing flat pannel display |
| WO2011024303A1 (en) * | 2009-08-31 | 2011-03-03 | 株式会社アドバンテスト | Probe, probe card and electronic component testing apparatus |
| JPWO2011024303A1 (en) * | 2009-08-31 | 2013-01-24 | 株式会社アドバンテスト | Probe, probe card and electronic component testing apparatus |
| JP2011237405A (en) * | 2010-05-06 | 2011-11-24 | Di Probe Co Ltd | Probe block and probe unit for inspection of display panel |
| WO2021193579A1 (en) * | 2020-03-25 | 2021-09-30 | 日本電産リード株式会社 | Inspection probe and inspection device |
| WO2023074198A1 (en) * | 2021-10-27 | 2023-05-04 | 株式会社ヨコオ | Flexible substrate and testing jig |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100459050B1 (en) | Method and apparatus for planarizing a semiconductor contactor | |
| US6489790B1 (en) | Socket including pressure conductive rubber and mesh for testing of ball grid array package | |
| TWI578001B (en) | Semiconductor device alignment socket unit and semiconductor device test apparatus including the same | |
| US8092231B2 (en) | Socket for electric component | |
| US5773986A (en) | Semiconductor wafer contact system and method for contacting a semiconductor wafer | |
| KR20110084978A (en) | Probe card | |
| KR20050084326A (en) | Apparatus and method for limiting over travel in a probe card assembly | |
| JP2006523310A (en) | High speed connector | |
| JPH01122583A (en) | Measurement jig for semiconductor device | |
| US9696369B2 (en) | Wafer test apparatus | |
| US4056777A (en) | Microcircuit test device with multi-axes probe control | |
| JP4045687B2 (en) | IC device test carrier board | |
| US7274093B2 (en) | Semiconductor device connector, semiconductor device carrier, semiconductor device socket using the same and probe card | |
| JP3543089B2 (en) | Contact unit | |
| CN114167094A (en) | Film probe card and probe head thereof | |
| KR102121754B1 (en) | Device for test socket pin having single coil spring divided into upper and lower regions | |
| KR101112766B1 (en) | Push apparatus for test | |
| TWI794985B (en) | Connecting mechanism, testing device, and processing machine | |
| JPH1019991A (en) | Test head for circuit board tester | |
| JPH10239390A (en) | Inspection probe equipment of socket for ic test | |
| CN219831294U (en) | Semiconductor device testing apparatus and semiconductor device testing system | |
| KR100308123B1 (en) | socket for testing QFP | |
| KR100446551B1 (en) | Volcano type probe, its manufacturing method and probe card having it | |
| JPH03183972A (en) | Device and method for testing characteristic of ic package | |
| JPH073833B2 (en) | Probe device |