KR100952138B1 - Menufacturing method of probe assembly - Google Patents

Menufacturing method of probe assembly Download PDF

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Publication number
KR100952138B1
KR100952138B1 KR1020090048179A KR20090048179A KR100952138B1 KR 100952138 B1 KR100952138 B1 KR 100952138B1 KR 1020090048179 A KR1020090048179 A KR 1020090048179A KR 20090048179 A KR20090048179 A KR 20090048179A KR 100952138 B1 KR100952138 B1 KR 100952138B1
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South Korea
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photoresist pattern
probe assembly
tip portion
substrate
metal layer
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KR1020090048179A
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Korean (ko)
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장현진
김유성
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주식회사 코디에스
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2879—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to electrical aspects, e.g. to voltage or current supply or stimuli or to electrical loads
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

PURPOSE: A probe assembly manufacturing method easily manufactures the probe assembly by simplifying the manufacturing process. CONSTITUTION: A sacrifice metal layer(8) having the groove corresponding to the first tip part of form is plated on substrate. The photoresist pattern(13) is formed on the sacrifice metal layer. By plating metal in the photoresist pattern and groove a plurality of beams connected to the first tip part is formed. The first tip part is formed in one end of above beams. The second tip part is formed in the other end of above beams. The mold is bonded in above beams by spreading adhesive in the intermediate area of above beams. The photoresist pattern is formed on substrate. The sacrifice metal layer is plated on substrate. The photoresist pattern corresponding to the form of the first tip part is removed.

Description

프로브 조립체 제조방법{MENUFACTURING METHOD OF PROBE ASSEMBLY}MENUFACTURING METHOD OF PROBE ASSEMBLY

본 발명은 프로브 조립체 제조방법에 관한 것으로서, 보다 상세하게는 켄틸레버 타입의 프로브 조립체를 용이하게 제조할 수 있는 프로브 조립체 제조방법에 관한 것이다. The present invention relates to a method for manufacturing a probe assembly, and more particularly, to a method for manufacturing a probe assembly capable of easily manufacturing a cantilever type probe assembly.

반도체 또는 액정표시장치의 제조는 다양한 공정을 거쳐 완성되는데, 각 공정 후 전기적 검사를 하게 된다. 이 중에서 특히, 액정표시장치를 예로 설명한다. The manufacture of a semiconductor or a liquid crystal display device is completed through various processes, and electrical inspection is performed after each process. In particular, the liquid crystal display device will be described as an example.

최근에 액정표시장치는 소비전력이 낮고, 휴대성이 양호하여 기술집약적이며 부가가치가 높은 차세대 첨단 디스플레이(display)소자로 각광받고 있다. Recently, the liquid crystal display device has been spotlighted as a next generation advanced display device having low power consumption, good portability, technology intensive, and high added value.

도 1a 및 도 1b를 참조하면, 일반적인 액정표시장치(100)는 TFT기판(110)과 칼라필터기판(120) 사이에 액정층(130)을 주입하고 양 기판을 합착하여 구성된다. 상기 TFT기판(110)의 아래에는 편광판(151)이 부착된다. 또한 칼라필터기판(120)의 위에는 편광판(152)과, 보호필름(153)이 부착된다. 1A and 1B, a general liquid crystal display device 100 is formed by injecting a liquid crystal layer 130 between a TFT substrate 110 and a color filter substrate 120 and bonding both substrates together. The polarizer 151 is attached to the bottom of the TFT substrate 110. In addition, a polarizing plate 152 and a protective film 153 are attached to the color filter substrate 120.

합착후에도 편광판이 부착된 TFT기판(110)은 2개변 혹은 3개변에서 에지면(111)이 노출되는데, 노출된 에지면(111)에는 패드(전극)가 형성된다. Even after bonding, the edge substrate 111 is exposed on two or three sides of the TFT substrate 110 having the polarizing plate, and a pad (electrode) is formed on the exposed edge surface 111.

상기 패드(141)에는 구동IC(Driver IC) 또는 태그필름(Tag Film)이 연결된 다. A driver IC or a tag film is connected to the pad 141.

한편, 상기 패드에 구동IC(Driver IC) 또는 태그필름(Tag Film)을 연결하기 전에 프로브의 일단은 상기 패드에 접촉시키고 타단은 상기 구동IC에 접촉시킨 상태에서 전기적 신호를 인가하여 액정패널을 검사한다. Meanwhile, before connecting a driver IC or a tag film to the pad, one end of the probe is in contact with the pad and the other end is in contact with the driver IC to inspect the liquid crystal panel. do.

여기서 상기 패드는 1열 또는 복수열로 형성되며, 각 열마다 복수의 패드가 매우 조밀한 피치로 형성된다. 따라서 프로브 조립체도 이러한 패드의 피치와 동일한 피치로 형성되어야 하는데, 기술적으로 조밀한 피치로 형성하는 것이 매우 난해한 작업이다. Here, the pads are formed in one row or a plurality of rows, and a plurality of pads are formed in very dense pitches in each row. Therefore, the probe assembly must also be formed at the same pitch as the pad, which is a technically difficult task.

본 발명은 상술한 문제점을 해결하기 위하여 안출된 것으로서, 본 발명의 목적은 켄틸레버 타입의 프로브 조립체를 용이하게 제조할 수 있는 프로브 조립체 제조방법을 제공함에 있다. The present invention has been made to solve the above problems, an object of the present invention is to provide a probe assembly manufacturing method that can easily produce a cantilever type probe assembly.

위와 같은 기술적 과제를 해결하기 위하여 본 발명에 의한 프로브 조립체 제조방법은 1) 기판상에 제1팁부에 대응되는 형태의 홈이 형성된 희생금속층을 도금하는 단계; 2) 상기 희생금속층상에 포토레지스트 패턴을 형성한 후, 상기 패턴과 홈에 금속도금하여 일단에 상기 제1팁부이 연결되는 빔을 형성하는 단계; 3) 상기 빔의 타단에 제2팁부를 형성하는 단계; 및 4) 상기 빔에 몰드부를 본딩하는 단계;를 포함한다. In order to solve the above technical problem, a method of manufacturing a probe assembly according to the present invention includes: 1) plating a sacrificial metal layer having a groove corresponding to a first tip portion on a substrate; 2) forming a photoresist pattern on the sacrificial metal layer, and then metal plating the pattern and the groove to form a beam to which the first tip part is connected at one end; 3) forming a second tip portion at the other end of the beam; And 4) bonding a mold portion to the beam.

또한 상기 1)단계는, 1-1) 상기 기판상에 상기 제1팁부의 형태에 대응되도록 포토레지스트 패턴을 형성하는 단계; 1-2) 상기 기판상에 희생금속층을 도금하는 단계; 및 1-3) 상기 포토레지스트를 제거하는 단계;를 포함한다. In addition, the step 1), 1-1) forming a photoresist pattern on the substrate to correspond to the shape of the first tip portion; 1-2) plating a sacrificial metal layer on the substrate; And 1-3) removing the photoresist.

또한 상기 제1팁부는 단차지게 형성되는 것이 바람직하다. In addition, the first tip portion is preferably formed stepped.

또한 상기 3)단계는, 3-1) 상기 제2팁부에 대응되도록 포토레지스트 패턴을 형성하는 단계; 및 3-2) 상기 패턴을 이용하여 금속을 도금하는 단계;를 포함하는 것이 바람직하다. In addition, the step 3), 3-1) forming a photoresist pattern corresponding to the second tip portion; And 3-2) plating the metal using the pattern.

또한 상기 4)단계는 상기 빔들의 중간영역에 접착제를 도포하고 상기 몰드부 를 접착하는 것이 바람직하다. Also in step 4), it is preferable to apply an adhesive to the intermediate region of the beams and to bond the mold part.

또한 상기 몰드부는 유리 또는 세라믹인 것이 바람직하다. In addition, the mold portion is preferably glass or ceramic.

본 발명에 따르면, 켄틸레버 타입의 프로브 조립체를 용이하게 제조할 수 있는 효과가 있다. According to the present invention, the cantilever type probe assembly can be easily manufactured.

이하, 첨부된 도면을 참조하여 본 발명에 의한 프로브 조립체 제조방법을 설명한다. Hereinafter, a method for manufacturing a probe assembly according to the present invention will be described with reference to the accompanying drawings.

먼저, 기판(1)에 희생층(2)을 형성하고(도 2 참조), 상기 희생층상에 제1팁부의 형태에 대응되도록 포토레지스트 패턴을 형성한다. 상기 제1팁부는 피검사체의 패드에 접촉하는 구성요소이다. 본 실시예에서는 상기 제1팁부가 단차를 가진 2단으로 형성된다. 따라서 상기 희생층상에 제1팁부의 1단의 형태에 대응되는 제1포토레지스트 패턴(3)을 형성하고(도 3 참조), 희생금속층(4)을 도금하고 평탄화한다(도 4 참조). 다음으로, 2단의 형태에 대응되는 제2포토레지스트 패턴(5)을 형성하고(도 5 참조), 희생금속층(6)을 도금하고 평탄화한다(도 6 참조). First, a sacrificial layer 2 is formed on the substrate 1 (see FIG. 2), and a photoresist pattern is formed on the sacrificial layer so as to correspond to the shape of the first tip portion. The first tip portion is a component that contacts the pad of the object under test. In this embodiment, the first tip portion is formed in two stages having a step. Accordingly, the first photoresist pattern 3 corresponding to the first stage of the first tip portion is formed on the sacrificial layer (see FIG. 3), and the sacrificial metal layer 4 is plated and planarized (see FIG. 4). Next, the second photoresist pattern 5 corresponding to the two-stage form is formed (see FIG. 5), and the sacrificial metal layer 6 is plated and planarized (see FIG. 6).

다음으로 상기 제1 및 제2 포토레지스트를 제거하면 홈(6a)이 생성된다(도 7 참조). Next, when the first and second photoresist are removed, grooves 6a are formed (see FIG. 7).

다음으로 상기 희생금속층상에 빔의 형태에 대응되는 형태로 제3포토레지스트 패턴(7)을 형성한다(도 8 참조). Next, a third photoresist pattern 7 is formed on the sacrificial metal layer in a form corresponding to the shape of the beam (see FIG. 8).

다음으로 상기 홈과 제3포토레지스트 패턴에 니켈합금 등의 금속을 도금하면 2단구조를 갖는 제1팁부(9)와 빔(8)이 형성된다(도 9 참조). Next, when a metal such as a nickel alloy is plated on the groove and the third photoresist pattern, a first tip portion 9 and a beam 8 having a two-stage structure are formed (see FIG. 9).

다음으로, 피검사체의 구동IC에 접촉하는 제2팁부를 형성하는데, 구체적으로는 상기 제2팁부의 형태에 대응되는 형태로 제4포토레지스트 패턴(10)을 형성하고(도 10 참조), 상기 패턴을 이용하여 금속을 도금함으로써 제2팁부(11)가 형성된다(도 11 참조). 이 상태에서 평탄화공정이 진행된다. Next, a second tip portion is formed in contact with the driving IC of the inspected object. Specifically, a fourth photoresist pattern 10 is formed in a form corresponding to that of the second tip portion (see FIG. 10). The second tip portion 11 is formed by plating a metal using a pattern (see FIG. 11). In this state, the planarization process proceeds.

다음으로 제3 및 제4포토레지스트를 제거한다(도 12 참조). Next, the third and fourth photoresist are removed (see FIG. 12).

다음으로 몰드부의 형태에 대응되는 형태로 제5포토레지스트 패턴(12)을 형성하고(도 13 참조), 상기 패턴을 이용하여 접착제로서 에폭시 수지를 도포하고, 유리 또는 세라믹 재질의 몰드부(13)를 접착한다(도 14 참조). Next, the fifth photoresist pattern 12 is formed in a form corresponding to the shape of the mold portion (see FIG. 13), an epoxy resin is applied as an adhesive using the pattern, and the mold portion 13 of glass or ceramic material is used. (See Fig. 14).

다음으로 상기 제5포토레지스트를 제거하고(도 15 참조) 상기 희생금속층을 에칭하면 상기 기판이 이형되어(도 16 참조) 도 17에 도시된 바와 같이 프로브 조립체가 완성된다. Next, when the fifth photoresist is removed (see FIG. 15) and the sacrificial metal layer is etched, the substrate is released (see FIG. 16) to complete the probe assembly as shown in FIG. 17.

도 1a 및 도 1b는 일반적인 액정패널을 나타낸 것이다. 1A and 1B show a general liquid crystal panel.

도 2 내지 도 17은 본 발명에 의한 프로브 조립체 제조방법을 순서대로 나타낸 것이다. 2 to 17 show the method for manufacturing a probe assembly according to the present invention in order.

Claims (6)

1) 기판상에 제1팁부에 대응되는 형태의 홈이 형성된 희생금속층을 도금하는 단계;1) plating a sacrificial metal layer having grooves of a shape corresponding to the first tip portion on the substrate; 2) 상기 희생금속층상에 포토레지스트 패턴을 형성한 후, 상기 포토레지스트 패턴과 홈에 금속도금하여 일단에 상기 제1팁부가 연결되는 복수의 빔을 형성하는 단계;2) forming a photoresist pattern on the sacrificial metal layer, and then metal plating the photoresist pattern and the groove to form a plurality of beams to which the first tip part is connected at one end; 3) 상기 빔들의 타단에 제2팁부를 형성하는 단계; 및 3) forming a second tip portion at the other end of the beams; And 4) 상기 빔들의 중간영역에 접착제를 도포하여 몰드부를 본딩하는 단계;를 포함하며, 4) bonding an mold part by applying an adhesive to an intermediate region of the beams; 상기 1)단계는,Step 1), 1-1) 상기 기판상에 상기 제1팁부의 형태에 대응되도록 포토레지스트 패턴을 형성하는 단계;1-1) forming a photoresist pattern on the substrate to correspond to the shape of the first tip portion; 1-2) 상기 기판상에 희생금속층을 도금하는 단계; 및 1-2) plating a sacrificial metal layer on the substrate; And 1-3) 상기 제1팁부의 형태에 대응되는 포토레지스트 패턴을 제거하는 단계;를 포함하는 것을 특징으로 하는 프로브 조립체 제조방법. 1-3) removing the photoresist pattern corresponding to the shape of the first tip portion; probe assembly manufacturing method comprising a. 삭제delete 제1항에 있어서,The method of claim 1, 상기 제1팁부는 단차지게 형성되는 것을 특징으로 하는 프로브 조립체 제조방법. Probe assembly method characterized in that the first tip portion is formed stepped. 제3항에 있어서,The method of claim 3, 상기 3)단계는,Step 3), 3-1) 상기 제2팁부에 대응되도록 포토레지스트 패턴을 형성하는 단계; 및 3-1) forming a photoresist pattern corresponding to the second tip portion; And 3-2) 상기 제2팁부에 대응되는 포토레지스트 패턴을 이용하여 금속을 도금하는 단계;를 포함하는 것을 특징으로 하는 프로브 조립체 제조방법. 3-2) plating the metal using a photoresist pattern corresponding to the second tip part. 삭제delete 제1항에 있어서,The method of claim 1, 상기 몰드부는 유리 또는 세라믹인 것을 특징으로 하는 프로브 조립체 제조방법. And the mold part is glass or ceramic.
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101746975B1 (en) * 2015-12-16 2017-06-13 최재규 Manufacturing method of a pogo pin and pogo pin manufactured using the same
KR102201705B1 (en) * 2019-10-31 2021-01-12 (주)영진아스텍 Manufacturing of a probe tip module in which a multiple probe tips are connected to a bridge

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KR100733815B1 (en) 2006-07-25 2007-07-02 주식회사 유니테스트 Method for manufacturing probe structure
KR100748023B1 (en) 2006-06-16 2007-08-09 주식회사 유니테스트 Method for manufacture probe structure of probe card
KR20070099322A (en) * 2006-04-04 2007-10-09 주식회사 코넴 Inspection apparatus of testing a flat panel display and method of fabricating the same

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KR20070099322A (en) * 2006-04-04 2007-10-09 주식회사 코넴 Inspection apparatus of testing a flat panel display and method of fabricating the same
KR100748023B1 (en) 2006-06-16 2007-08-09 주식회사 유니테스트 Method for manufacture probe structure of probe card
KR100733815B1 (en) 2006-07-25 2007-07-02 주식회사 유니테스트 Method for manufacturing probe structure

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101746975B1 (en) * 2015-12-16 2017-06-13 최재규 Manufacturing method of a pogo pin and pogo pin manufactured using the same
KR102201705B1 (en) * 2019-10-31 2021-01-12 (주)영진아스텍 Manufacturing of a probe tip module in which a multiple probe tips are connected to a bridge

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