KR101480681B1 - Bump film, method for manufacturing of the bump film and probing apparatus having the bump film - Google Patents

Abstract

The present invention relates to a bump film, a method for manufacturing the same, and a probe device having the same. The bump film according to an embodiment of the present invention comprises a film and multiple wires formed on one surface of the film, wherein each of the wires includes: a pattern layer which is formed on one surface of the film and is made of at least one conductive material; a bump layer which is formed on one surface of the pattern layer and is made of at least one conductive material; and a passivation layer which is formed on at least one side of the pattern layer to protect and support the pattern layer. Furthermore, according to an embodiment of the present invention, the method for manufacturing a bump film, which is provided to form multiple wires on one surface of a film, includes the steps of: forming a pattern layer which is made of at least one conductive material on one surface of the film; forming a bump layer which is made of at least one conductive material on one surface of the pattern layer; and forming a passivation layer on at least one side of the pattern layer, wherein each step is performed using a photolithography process.

Description

TECHNICAL FIELD [0001] The present invention relates to a bump film, a method of manufacturing the bump film, and a probe apparatus having the bump film.

The present invention relates to a probe device, and more particularly, to a bump film, a bump film manufacturing method, and a probe device provided with a bump film, which can reduce the maintenance cost of the probe device and improve durability.

BACKGROUND ART Generally, a manufacturing process of a flat panel display (FPD) such as a liquid crystal display (LCD), a plasma display panel (PDP), and the like includes a cell process for manufacturing a display panel, And a module assembling process of assembling the manufactured display panel with components such as a driver and a back light to produce an end product.

Such a display panel is an image display device in which a surface on which a source electrode and a gate electrode are respectively formed are arranged to face each other on a substrate. A liquid crystal material is injected between the substrates and a voltage is applied to the two electrodes to generate an electric field , And the image is expressed by moving the liquid crystal molecules by the generated electric field to change the light transmittance.

At this time, the display panel manufactured through the cell process needs to be inspected for defects that may occur in the manufacturing process. A probe apparatus for performing inspection on such a display panel applies a test signal to a plurality of terminals provided on a display panel to generate a pixel error mode, i.e., a color, a resolution, Brightness and so on.

Meanwhile, in recent years, a high-quality display panel has been continuously increasing, and accordingly, a film-type probe apparatus in which a high-density fine pattern is formed for inspecting a high-density display panel has been actively developed.

However, in the conventional probe apparatus, there is a problem that the bump, which is a portion contacting with a plurality of elements provided on the display panel, is frequently worn and the probe apparatus must be frequently replaced. That is, accurate inspection of the display panel is not performed due to abrasion of the bump, and the durability of the probe device is low, thereby increasing the maintenance cost due to replacement of the probe device.

An elastic block is used for the probe block to absorb an external force transmitted to the bump when the bump comes in contact with a plurality of elements provided on the display panel. The engineering plastic used as the elastic block is expensive, You need to replace it. However, when the probe is used in place of another material, there is a problem in that the probe block is poorly coupled with the probe block, resulting in poor durability.

Therefore, there is a demand for a probe device capable of reducing the maintenance cost of the probe device and improving the durability.

SUMMARY OF THE INVENTION The present invention has been made in order to solve the problems described above, and it is an object of the present invention to provide a method of manufacturing a semiconductor device, in which a passivation layer constituting a bump film is formed on at least one side of a pattern layer, Even when the layer is worn, the pattern layer can be directly brought into contact with a plurality of terminals provided on the object to be inspected. Therefore, the bump film, the bump film and the bump film which can reduce the replacement period of the bump film, And a probe apparatus including the bump film.

The technical problem of the present invention is not limited to those mentioned above, and another technical problem which is not mentioned can be clearly understood by those skilled in the art from the following description.

In order to achieve the above object, a bump film according to an embodiment of the present invention includes a film and a plurality of wirings formed on one surface of the film, wherein each of the plurality of wirings is formed on one surface of the film, A bump layer formed on at least one side of the pattern layer and made of at least one conductive material; and a bump layer formed on at least one side of the pattern layer, And a passivation layer for protecting and supporting the pattern layer.

According to another aspect of the present invention, there is provided a method of manufacturing a bump film, including forming a plurality of wirings on one surface of a film, Forming a bump layer made of at least one conductive material on one side of the pattern layer and forming a passivation layer on at least one side of the pattern layer, Forming a passivation layer, each of the steps being performed using a photolithography process.

According to another aspect of the present invention, there is provided a probe apparatus including a bump film, including: a bump film having a plurality of wirings electrically connected to a plurality of terminals provided on an inspection surface of a test object; The bump film is bonded to the inclined surface, and when one of the plurality of wirings contacts the plurality of terminals through one end of the bump film, the bump film is bonded to one end of the bump film A probe block having an elastic block for providing a buffering force and a fixing groove for fixing the elastic block to a lower portion of a front end of the probe block, the probe block having one end electrically connected to the plurality of wirings via the other end of the bump film, A drive film provided with a driver IC for applying a test signal for inspecting an object to be inspected; A flexible block for fixing the other end of the bump film and the driving film to the probe block and a flexible film having one end electrically connected to the other end of the driving film and transmitting a test signal transmitted through the other end to the driving film, Wherein the plurality of wirings each include a pattern layer formed on one surface of the bump film and made of at least one conductive material, and a conductive layer formed on at least one surface of the pattern layer, And a passivation layer formed on at least one side of the pattern layer, the passivation layer protecting and supporting the pattern layer.

The details of other embodiments are included in the detailed description and drawings.

According to the bump film, the bump film manufacturing method, and the probe apparatus including the bump film according to an embodiment of the present invention, by forming the passivation layer constituting the bump film on at least one side of the pattern layer, The pattern layer can be brought into direct contact with the plurality of terminals provided on the object to be inspected, thereby reducing the replacement period of the bump film, thereby reducing the maintenance cost and improving the durability of the bump film .

According to the bump film, the bump film manufacturing method, and the probe apparatus including the bump film according to the embodiment of the present invention, when the elastic block is bonded to the probe block, the bump film contacting the plurality of terminals provided on the test object, The region where the one end of the elastic block is located is bonded by using the hard epoxy resin, thereby preventing a part of the elastic block from falling off the probe block, thereby improving the durability of the probe device.

According to the bump film, the method of manufacturing a bump film, and the probe apparatus including the bump film according to an embodiment of the present invention, the junction surface of the elastic block and the probe block is formed in parallel with the inspection surface of the inspection object, It is possible to effectively provide a buffering force against an external force transmitted from the bump film when the one end of the bump film contacts the plurality of terminals provided on the object to be inspected. Can be improved.

The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned can be clearly understood by those skilled in the art from the description of the claims.

1 is a perspective view showing a structure of a probe apparatus according to an embodiment of the present invention.
2 and 3 are exploded perspective views illustrating a structure of a probe apparatus according to an embodiment of the present invention.
FIG. 4 is a side view illustrating a probe block and an elastic block included in a probe apparatus according to an exemplary embodiment of the present invention. Referring to FIG.
5 is a perspective view showing a structure of a bump film provided in the probe apparatus according to the first embodiment of the present invention.
6 is a flowchart showing a method of manufacturing a bump film provided in a probe apparatus according to a first embodiment of the present invention.
FIG. 7 is a perspective view illustrating a shape of a bump film included in a probe apparatus according to a first embodiment of the present invention. Referring to FIG.
8 is a flowchart illustrating a method of manufacturing a bump film provided in a probe apparatus according to a second embodiment of the present invention.
FIG. 9 is a perspective view illustrating a shape of a bump film in a probe device according to a second embodiment of the present invention. Referring to FIG.
10 is a flowchart showing a method of manufacturing a bump film provided in a probe apparatus according to a third embodiment of the present invention.
11 is a perspective view illustrating a shape of a bump film provided in a probe apparatus according to a third embodiment of the present invention.
12 is a flowchart showing a method of manufacturing a bump film provided in a probe apparatus according to a fourth embodiment of the present invention.
13 is a perspective view illustrating a shape of a bump film provided in a probe apparatus according to a fourth embodiment of the present invention.
FIG. 14 is a vertical cross-sectional view showing a specific process of forming a pattern layer in a process of manufacturing a bump film provided in a probe apparatus according to a fourth embodiment of the present invention; FIG.
15 is a longitudinal sectional view showing a specific process of forming a bump layer and a passivation layer in a manufacturing process of a bump film provided in a probe apparatus according to a fourth embodiment of the present invention.
16 is a perspective view showing another example of forming a passivation layer in a manufacturing process of a bump film provided in a probe apparatus according to a fourth embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, so that those skilled in the art can easily carry out the present invention.

In the following description of the embodiments of the present invention, descriptions of techniques which are well known in the technical field of the present invention and are not directly related to the present invention will be omitted. This is for the sake of clarity of the present invention without omitting the unnecessary explanation.

For the same reason, some of the components in the drawings are exaggerated, omitted, or schematically illustrated. Also, the size of each component does not entirely reflect the actual size. In the drawings, the same or corresponding components are denoted by the same reference numerals.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described with reference to the drawings for explaining a probe device including a bump film, a bump film manufacturing method, and a bump film according to an embodiment of the present invention.

FIG. 1 is a perspective view showing a structure of a probe apparatus according to an embodiment of the present invention, and FIGS. 2 and 3 are exploded perspective views illustrating a structure of a probe apparatus according to an embodiment of the present invention.

1 to 3, a probe device 1 according to an embodiment of the present invention includes a bump film 100, an elastic block 200, a probe block 300, a driving film 400, A block 500 and a flexible film 600.

The probe apparatus 1 according to an embodiment of the present invention can transmit a test signal transmitted from a tester (not shown) to a subject to check the state of the subject (not shown). An object to be inspected is a comprehensive concept that means various types of electric / electronic parts to be subjected to an inspection process using a test signal. For example, the object to be inspected may be a flat panel display (FPD) such as a liquid crystal display (LCD), a plasma display panel (PDP), or the like. According to an embodiment of the present invention The probe device 1 is connected to a plurality of terminals provided on the panel to check the pixel error mode of the panel, that is, color, resolution, brightness, the panel can be inspected by applying a test signal composed of a signal and a gate signal

The bump film 100 may have a plurality of wirings electrically connected to a plurality of terminals (not shown) provided on the inspection surface of the inspection object. That is, the bump film 100 can be inspected by transmitting a test signal transmitted through the flexible film 600 and the driving film 400, which will be described later, to a plurality of terminals provided on the subject. As shown in FIG. 2, the bump film 100 is realized in the form of a thin film, and one end of the bump film 100 which contacts the plurality of terminals provided on the object to be inspected may have a bent shape at a certain angle.

A plurality of wirings provided on the bump film 100 of the probe device 1 according to an embodiment of the present invention includes a pattern layer 120, a bump layer 130, and a passivation layer 140). A pattern layer 120 is formed on one side of the film 110 and is made of at least one conductive material and a bump layer 130 is formed on one side of the pattern layer 120, The passivation layer 140 may be formed on at least one side of the pattern layer 120 and may protect and support the pattern layer 120. The specific structure and manufacturing method of the various embodiments of the bump film 100 will be described later in detail with reference to FIGS. 5 to 15. FIG.

The elastic block 200 is formed with an inclined surface 220 facing a plurality of terminals at a lower portion thereof and the bump film 100 can be bonded to the inclined surface 220. The elastic block 200 can provide a buffering force to one end of the bump film 100 when a plurality of wirings contact a plurality of terminals through one end of the bump film 100. Preferably, the elastic block 200 may be made of a urethane. The elastic block 200 may be bonded to the fixing groove 310 of the probe block 300, which will be described later, using an epoxy resin.

The probe block 300 may have a fixing groove 310 to which the elastic block 200 is coupled at the lower end of the front end. As shown in FIGS. 2 and 3, the bump film 100 may have a hexahedron shape having a substantially trapezoidal cross section so that the bump film 100 can be inclined toward a plurality of terminals provided on the test object. The probe block 300 may have a coupling groove 320 for coupling the fixing block 500 to be described later. The specific structure of the elastic block 200 and the probe block 300 and the coupling method thereof will be described later in detail with reference to FIG.

The driving film 400 may be electrically connected to a plurality of wirings through the other end of the bump film 100 at one end. The driving film 400 may include a driving IC 420 for applying a test signal for inspecting an object to be inspected to a plurality of wirings on a film-shaped body 410. The other end of the driving film 400 may be electrically connected to one end of a flexible film 600 to be described later.

The fixed block 500 is coupled to the lower portion of the probe block 300 and may fix the other end of the bump film 100 and the driving film 400 to the probe block 300. The fixed block 500 includes a block body 510 directly coupled to the lower portion of the probe block 300 by a fastening member and fixing the driving film 400 and a flexible film 600 to be described later, (Not shown) to be fixed to the coupling groove 320 formed in the probe block 300 so as to stably contact the connection portion of the driving film 400 with the other end of the first pressing block 100, A second press block 520 and a second press block 530. [ The structure of the fixed block 500 shown in FIGS. 2 and 3 is illustrative and not restrictive, and can be changed by a person skilled in the art.

The flexible film 600 is electrically connected at one end to the other end of the driving film 400 and can transmit a test signal transmitted through the other end to the driving film 400. Preferably, the flexible film 600 may be a flexible printed circuit (FPC). Although not shown, the other end of the flexible film 600 may be electrically connected to a tester (not shown) that generates and transmits a test signal. A tester for generating a test signal for inspecting an object is well known, and a detailed description thereof will be omitted.

Hereinafter, the structure of the elastic block 200 provided in the probe apparatus 1 according to the embodiment of the present invention will be described in detail with reference to FIG.

FIG. 4 is a side view illustrating a probe block and an elastic block included in a probe apparatus according to an exemplary embodiment of the present invention. Referring to FIG.

4, the elastic block 200 has an inclined surface 220 inclined in a direction toward a plurality of terminals provided on an object to be inspected at a lower portion thereof, Can be bonded. The elastic block 200 may be coupled to the fixing groove 310 formed at the lower end of the front end of the probe block 300.

4, the upper surface 210 of the elastic block 200 and the lower surface of the fixing groove 310 may be formed parallel to the inspection surface (not shown) of the inspection object. Particularly, when the subject is horizontally positioned like the panel, the upper surface 210 of the elastic block 200 and the lower surface of the fixing groove 310 may be formed horizontally. The upper surface 210 of the elastic block 200 and the lower surface of the fixing groove 310 are formed in parallel with the inspection surface of the test object so that one end of the bump film 100 is provided with a plurality of The damping force against an external force transmitted from the bump film 100 when the terminal contacts the terminal can be effectively provided, and thus the durability of the plurality of terminals provided in the test object and the plurality of wirings provided in the bump film 100 can be improved have.

4, the inclined surface 220 formed at the lower portion of the elastic block 200 includes a first inclined surface 221 formed to have a first angle from a portion where one end of the bump film 100 is joined, And a second inclined surface 222 formed to have a second angle larger than the first angle from the first inclined surface 221.

Meanwhile, as described above, the elastic block 200 can use a Urethane having excellent elasticity and relatively low cost to effectively provide a buffering force to one end of the bump film 100. In order to couple the elastic block 200 made of a urethane material to the probe block 300, it is preferable to use an epoxy resin. That is, after the epoxy resin is applied to the upper surface 210 of the elastic block 200 or the lower surface of the fixing groove 310, the elastic block 200 may be bonded to the probe block 300.

Particularly, in the case of the probe device 1 according to an embodiment of the present invention, the upper surface 210 of the elastic block 200, or the lower surface of the fixing groove 310, The second area 232 excluding the first area 231 of the lower surface of the upper surface 210 of the elastic block 200 or the fixing groove 310 is softened by soft epoxy resin, An epoxy resin can be applied. That is, when one end of the bump film 100 of the joint surface 230 of the elastic block 200 and the fixing groove 310 contacts a plurality of terminals provided on the test object, 231) can be coated with a hard epoxy resin. The first area 231 at which one end of the bump film 100 is located is made of a hard epoxy resin so that a part of the elastic block 200 is transferred to the probe 200 by an external force transmitted through one end of the bump film 100. [ It is possible to prevent the probe 300 from falling off from the block 300, thereby improving the durability of the probe apparatus 1. [

Hereinafter, the structure and manufacturing method of the bump film 100 provided in the probe device 1 according to various embodiments of the present invention will be described in detail with reference to FIGS. 5 to 15. FIG.

5 is a perspective view showing a structure of a bump film provided in the probe apparatus according to the first embodiment of the present invention.

5, the bump film 100 has a plurality of wirings formed on one side of the film 110, each of which includes a pattern layer 120, a bump layer 130, and a passivation layer 140, As shown in FIG. The plurality of wirings included in the bump film 100 may be formed at intervals corresponding to a plurality of terminals provided on the object to be inspected.

The pattern layer 120 is formed on one side of the film 110 and may be made of at least one conductive material. Preferably, the pattern layer 120 may be made of copper (Cu) or a copper alloy. 5, the pattern layer 120 is formed from one end to the other end of the bump film 100, and is electrically connected to a plurality of terminals provided at one end of the bump film 100, And may be electrically connected to formed wirings (not shown).

The bump layer 130 is formed on one side of the pattern layer 120 and may be made of at least one conductive material. Preferably, the bump layer 130 may be made of gold (Au) or a gold alloy. As shown in FIG. 5, the bump layer 130 may have a shape protruding from one surface of the pattern layer 120 located at one end of the bump film 100. The bump layer 130 is a portion directly contacting a plurality of terminals provided on the object to be inspected.

A passivation layer 140 is formed on at least one side of the pattern layer 120 and may protect and support the pattern layer 120. 5 illustrates an example in which the passivation layer 140 is formed on both sides of the pattern layer 120. However, the passivation layer 140 may be formed only on one side of the pattern layer 120. [ As described above, in the case of the bump film 100 provided in the probe apparatus 1 according to the first embodiment of the present invention, by forming the passivation layer 140 on at least one side of the pattern layer 120, Even when the bump layer 130 formed on one surface of the layer 120 is worn out, the pattern layer 120 can be directly brought into contact with a plurality of terminals provided on the test object, The cost can be reduced and at the same time the durability of the bump film 100 can be improved.

Hereinafter, a method for manufacturing the bump film 100 provided in the probe apparatus 1 according to the first embodiment of the present invention will be described with reference to FIGS. 6 and 7. FIG.

FIG. 6 is a flowchart illustrating a method of manufacturing a bump film provided in a probe apparatus according to a first embodiment of the present invention. FIG. 7 is a flowchart illustrating a method of manufacturing a bump film provided in a probe apparatus according to a first embodiment of the present invention. Fig.

First, a pattern layer 120 made of at least one conductive material may be formed on one side of the film 110 (S110, FIG. 7A). Preferably, the pattern layer 120 may be made of copper (Cu) or a copper alloy. A bump layer 130 made of at least one conductive material may be formed on one surface of the pattern layer 120 (S120, FIG. 7 (b)). Preferably, the bump layer 130 may be made of gold (Au) or a gold alloy. Finally, the passivation layer 140 may be formed on at least one side of the pattern layer 120 (S 130, FIG. 7 (c)). 7 illustrates an example in which the passivation layer 140 is formed on both sides of the pattern layer 120. However, the present invention is not limited thereto and can be changed by a person skilled in the art.

Hereinafter, a method of manufacturing the bump film 100 provided in the probe apparatus 1 according to the second embodiment of the present invention will be described with reference to FIGS. 8 and 9. FIG. For convenience of description, the same components as those of the first embodiment shown in FIGS. 5 to 7 will not be described, and the differences will be mainly described below.

FIG. 8 is a flow chart showing a method of manufacturing a bump film included in a probe apparatus according to a second embodiment of the present invention, FIG. 9 is a flowchart illustrating a method of manufacturing a bump film included in a probe apparatus according to a second embodiment of the present invention Fig.

8 and 9, the pattern layer 120 formed on one side of the film 110 is formed on the seed layer 121, and the pattern layer 120 is formed on the side of the seed layer 121. In the second embodiment shown in FIGS. 8 and 9, And the copper pattern layer 122 are shown.

8, a seed layer 121 made of titanium (Ti) or a titanium alloy can be formed on one side of the film 110 (S210, FIG. 9A) . A copper pattern layer 122 made of copper or a copper alloy can be formed on one side of the seed layer 121 (S220, FIG. 9 (b)). Then, a bump layer 130 made of at least one conductive material (for example, gold (Au) or gold alloy) is formed on one surface of the copper pattern layer 122 (S230, FIG. 9C) . The passivation layer 140 may be formed on at least one side of the pattern layer 120 (S240, FIG. 9 (d)).

Hereinafter, a method of manufacturing the bump film 100 provided in the probe apparatus 1 according to the third embodiment of the present invention will be described with reference to FIGS. 10 and 11. FIG.

FIG. 10 is a flowchart illustrating a method of manufacturing a bump film provided in a probe apparatus according to a third embodiment of the present invention. FIG. 11 is a flowchart illustrating a method of manufacturing a bump film in a probe apparatus according to a third embodiment of the present invention. Fig.

10 and 11, the bump layer 130 formed on one surface of the pattern layer 120 is divided into the first bump layer 131 and the second bump layer 130. In the third embodiment, And the bump layer 132 is formed.

First, as shown in FIG. 10, a pattern layer 120 made of at least one conductive material may be formed on one side of the film 110 (S310, FIG. 11A). A first bump layer 131 made of gold (Au) or a gold alloy can be formed on one surface of the pattern layer 120 (S320, FIG. 11B). A second bump layer 132 made of gold (Au) or a gold alloy can be formed on one surface of the first bump layer 131 (S330, FIG. 11 (c)). In this case, the first bump layer 131 may have a width equal to or smaller than the width of the pattern layer 120. The second bump layer 132 may be formed to have a width equal to or smaller than the width of the first bump layer 131. The first bump layer 131 is formed to have the same width as that of the pattern layer 120 and the second bump layer 132 is formed to have a width smaller than the width of the first bump layer 131 But the present invention is not limited thereto. 11, one second bump layer 132 is provided on one surface of the first bump layer 131. However, the number of the second bump layers 132 is not limited thereto, . The damping of the bump film 100 can be improved by configuring the bump layer 130 with the first bump layer 131 and the second bump layer 132 as described above. Preferably, the first bump layer 131 and the second bump layer 132 may be made of gold (Au) or a gold alloy. Finally, the passivation layer 140 may be formed on at least one side of the pattern layer 120 (S430, FIG. 11 (d)).

Hereinafter, a method of manufacturing the bump film 100 provided in the probe apparatus 1 according to the fourth embodiment of the present invention will be described with reference to FIGS. 12 and 13. FIG.

FIG. 12 is a flowchart illustrating a method of manufacturing a bump film provided in a probe apparatus according to a fourth embodiment of the present invention. FIG. 13 is a flowchart illustrating a method of manufacturing a bump film in a probe apparatus according to a fourth embodiment of the present invention Fig.

12 and 13, the pattern layer 120 formed on one side of the film 110 may be formed of a seed layer 121 and a copper pattern layer 122 And the bump layer 130 formed on one surface of the pattern layer 120 is constituted by the first bump layer 131 and the second bump layer 132. [

12, a seed layer 121 made of titanium (Ti) or a titanium alloy may be formed on one side of the film 110 (S410, FIG. 13A) . A copper pattern layer 122 made of copper or a copper alloy can be formed on one side of the seed layer 121 (S420, FIG. 13B). A first bump layer 131 made of gold (Au) or a gold alloy can be formed on one surface of the pattern layer 120 (S430, FIG. 13C). A second bump layer 132 made of gold (Au) or a gold alloy can be formed on one surface of the first bump layer 131 (S440, FIG. 13 (d)). Finally, the passivation layer 140 may be formed on at least one side of the pattern layer 120 (S450, FIG. 13 (e)).

On the other hand, each step of the manufacturing method of the bump film 100 shown in Figs. 6 to 13 may be performed using a photolithography process. Hereinafter, an example of manufacturing the bump film 100 of the fourth embodiment shown in Figs. 12 and 13 by using the photolithography process will be described with reference to Figs. 14 and 15. Fig.

FIG. 14 is a vertical cross-sectional view showing a specific process of forming a pattern layer in a process of manufacturing a bump film provided in a probe device according to a fourth embodiment of the present invention. FIG. FIG. 2 is a longitudinal sectional view showing a specific process of forming a bump layer and a passivation layer in a manufacturing process of a bump film provided in the device.

14 illustrates a process of forming the pattern layer 120 using a photolithography process. 14, titanium (Ti) or a titanium alloy (T) may be applied to the entire one surface of the film 110 (Fig. 14 (a)). Photoresist PR can be applied to one side of titanium (Ti) or titanium alloy (T) coated on one side of the film 110 (Fig. 14 (b)). The photoresist PR at the portion where the copper pattern layer 122 is to be formed can be removed through an exposure process and a development process using a photomask (Fig. 14 (c)). 14 (d)). After the remaining photoresist PR is removed, a desired copper pattern layer 122 is formed (FIG. 14 (Fig. 14 (e)). Finally, when titanium (Ti) or titanium alloy (T) is removed from the portion except for the formed copper pattern layer 122, a seed layer 121 is formed under the copper pattern layer 122, (Fig. 14 (f)).

15, a process of forming the bump layer 130 and the passivation layer 140 using a photolithography process is described. 15, a first bump layer 131 made of gold (Au) or a gold alloy can be formed on one side of the copper pattern layer 122 (Fig. 15 (g)). The first bump layer 131 may be formed in a similar manner to that shown in FIG. 14, and the first bump layer 131 may be formed using photoresist coating, photoresist removal using an exposure process and a development process, (Au) or gold alloy, and removing the remaining photoresist. The second bump layer 132 can be formed similarly to the process of forming the first bump layer 131 (Fig. 15 (h)).

Thereafter, the passivation P is applied so as to include the pattern layer 120 and the bump layer 130 formed on one surface of the film 110 (FIG. 15 (i)), A passivation layer 140 is formed by removing a portion of the passivation P so that the bump layer 130 and the pattern layer 120 that are in contact with the bump layer 130 and the pattern layer 120 are exposed, The passivation layer 140 can be obtained (Fig. 15 (j)). At this time, an ashing process or the like may be performed in order to remove a part of the paste P.

13E, the case where all the passivations P except for the passivation layer 140 are removed at the time of removing a portion of the passivation P in the step (j) of FIG. 15 is described as an example, But is not limited thereto.

16 is a perspective view showing another example of forming a passivation layer in a manufacturing process of a bump film provided in a probe apparatus according to a fourth embodiment of the present invention.

In FIG. 16, unlike FIG. 13E, a part of the passivation P is removed in the step (j) of FIG. 15, the bump layer 130 and the pattern layer 120 The passivation P is removed only to the extent that a part of the passivation P is exposed. That is, most of the passivation P applied in the step (i) of FIG. 15 except for the passivation layer 140 existing under the bump layer 130 may remain to protect the pattern layer 120 have.

As described above, according to the probe device 1 including the bump film 100, the bump film 110 manufacturing method, and the bump film 110 according to the embodiment of the present invention, Even when the bump layer 130 formed on one surface of the pattern layer 120 is worn out by forming the passivation layer 140 on the pattern layer 120 on at least one side of the pattern layer 120, It is possible to reduce the replacement period of the bump film 100 by reducing the maintenance cost, and at the same time, the durability of the bump film 100 can be improved. In addition, when the elastic block 200 is bonded to the probe block 300, regions where one end of the bump film 100 contacting the plurality of terminals provided on the object to be inspected are bonded by using a hard epoxy resin, It is possible to prevent a part of the block 200 from falling off the probe block 300, thereby improving the durability of the probe device 1. In addition, by forming the joint surface 230 of the elastic block 200 and the probe block 300 in parallel with the test surface of the test object, one end of the bump film 100 is in contact with a plurality of terminals provided on the test object Damping force against an external force transmitted from the bump film 100 can be effectively provided so that durability of a plurality of terminals provided in the test object and a plurality of wirings provided in the bump film 100 can be improved.

In the meantime, although the present invention is described with reference to a probe device 1 for inspecting a panel of a flat panel display (FPD), the scope of application of the present invention is not limited thereto, The present invention can be applied to various process and technology fields as long as it is an apparatus that performs an inspection process using an electric signal.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, And is not intended to limit the scope of the invention. It is to be understood by those skilled in the art that other modifications based on the technical idea of the present invention are possible in addition to the embodiments disclosed herein.

Description of the Related Art
1: Probe device
100: bump film 200: elastic block
300: Probe block 400: Driving film
500: Fixing block 600: Flexible film

Claims (15)

film; And
And a plurality of wirings formed on one surface of the film,
Each of the plurality of wirings includes:
A pattern layer formed on one side of the film and made of at least one conductive material;
A bump layer formed on one surface of the pattern layer and made of at least one conductive material; And
A passivation layer formed on at least one side of the pattern layer and protecting and supporting the pattern layer,
The bump layer
A first bump layer formed on one surface of the pattern layer and made of gold (Au) or a gold alloy; And
And a second bump layer formed on one surface of the first bump layer and made of gold (Au) or a gold alloy. The method according to claim 1,
The pattern layer may be formed,
A seed layer formed on one side of the film and made of titanium (Ti) or a titanium alloy; And
And a copper pattern layer formed between the seed layer and the bump layer and made of copper (Cu) or a copper alloy. delete The method according to claim 1,
Wherein the first bump layer is formed to have a width equal to or smaller than the width of the pattern layer. 5. The method of claim 4,
Wherein the second bump layer is formed to have a width equal to or less than the width of the first bump layer. 1. A bump film manufacturing method for forming a plurality of wirings on one surface of a film,
Forming a pattern layer of at least one conductive material on one side of the film;
Forming a bump layer made of at least one conductive material on one side of the pattern layer; And
Forming a passivation layer on at least one side of the pattern layer,
Each of the above steps is performed using a photolithography process,
Wherein forming the bump layer on one surface of the pattern layer comprises:
Forming a first bump layer made of gold (Au) or a gold alloy on one surface of the pattern layer; And
And forming a second bump layer made of gold (Au) or a gold alloy on one surface of the first bump layer. The method according to claim 6,
Wherein forming the pattern layer on one side of the film comprises:
Forming a seed layer made of titanium (Ti) or a titanium alloy on one surface of the film; And
And forming a copper pattern layer made of copper (Cu) or a copper alloy on one side of the seed layer. delete The method according to claim 6,
Wherein the first bump layer is formed to have a width equal to or smaller than a width of the pattern layer. 10. The method of claim 9,
Wherein the second bump layer is formed to have a width equal to or less than the width of the first bump layer. A bump film having a plurality of wirings electrically connected to a plurality of terminals provided on an inspection surface of a test object;
Wherein the bump film is bonded to the inclined surface, and when the plurality of wirings contact the plurality of terminals through one end of the bump film, buffering force is applied to one end of the bump film An elastic block for providing the elastic block;
A probe block having a fixing groove to which the elastic block is coupled at a lower portion of a front end thereof;
A driver IC having a driving IC (driver IC) electrically connected to the plurality of wirings via a first end of the bump film and applying a test signal to the plurality of wirings to inspect the test object;
A fixing block coupled to a lower portion of the probe block and fixing the other end of the bump film and the driving film to the probe block; And
And a flexible film, one end of which is electrically connected to the other end of the driving film and transmits a test signal transmitted through the other end to the driving film,
Each of the plurality of wirings includes:
A pattern layer formed on one surface of the bump film and made of at least one conductive material;
A bump layer formed on one surface of the pattern layer and made of at least one conductive material; And
A passivation layer formed on at least one side of the pattern layer and protecting and supporting the pattern layer,
The bump layer
A first bump layer formed on one surface of the pattern layer and made of gold (Au) or a gold alloy; And
And a second bump layer formed on one surface of the first bump layer and made of gold (Au) or a gold alloy. 12. The method of claim 11,
Wherein the elastic block is made of a urethane and the upper surface of the elastic block and the lower surface of the fixing groove are joined by an epoxy resin. 13. The method of claim 12,
Wherein a first region of the upper surface of the elastic block or a lower surface of the fixing groove on which the one end of the bump film is located is coated with a hard epoxy resin and the upper surface of the elastic block or the lower surface of the fixing groove, And the second region except the region is coated with a soft epoxy resin. 12. The method of claim 11,
Wherein the upper surface of the elastic block and the lower surface of the fixing groove are formed parallel to the inspection surface of the inspection object. 12. The method of claim 11,
Wherein the inclined surface formed at the lower portion of the elastic block has a first inclined surface formed to have a first angle from a portion where one end of the bump film is joined and a second inclined surface formed so as to have a second angle larger than the first angle from the first inclined surface And a second inclined surface.

Images