JPH11201990A - Probe unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a probe unit, which prevents an object to be inspected from being damaged in an inspection, and which prevents adjacent probe elements from being damaged in the manufacture of the probe unit, by a method wherein bumps (protrusions) are installed at respective tip parts of a plurality of probe elements having the same length and the same size, and a bump (a protrusion) is installed at a specific probe element also at their inner side. SOLUTION: Bumps 30 which are used as contact makers used to press a terminal part of an integrated circuit in an electrification test are installed at tip parts of probe elements 26. On the other hand, bumps 30 of the same kind are installed at probe elements 28 in positions nearly identical to those of the bumps 30, and bumps 34 are installed in positions at their inner side. When a probe unit 10 is pressed to the integrated circuit, the bumps 30 are first brought into contact with corresponding pads at the integrated circuit, bumps 32 are brought into contact with the surface of the integrated circuit, and the bumps 34 are brought into contact with other pads sequentially. In this manner, the tip parts of the probe element 26, 28, especially their edge parts, are not brought directly into contact with the surface of the integrated circuit, and there is no fear that the integrated circuit is damaged. In addition, since the length and the size of the probe elements 26, 28 are set to be identical, there is no fear that their adjacent probe elements are damaged in the manufacture of the probe unit 10.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a film probe unit used for a probe card for conducting a current test on a flat test object such as an integrated circuit or a liquid crystal display panel.

[0002]

2. Description of the Related Art In general, a semiconductor integrated circuit is subjected to a conduction test to determine whether or not a device under test operates according to specifications. This type of energization test is performed by measuring electrical characteristics using a probe card. As one of such probe cards, there are a plurality of elastically deformable film-like probe units having a plurality of probe elements extending in a finger shape from a plate-like portion. (See, for example,
No. 63671).

[0003] This film probe unit 100
As shown in FIG. 9, a so-called wiring pattern is used for manufacturing an integrated circuit on an elastically deformable film-like substrate in which a metal layer 102 having a spring property and a resin layer 104 having an electrical insulation property are laminated. Formed by printed wiring technology,
A plurality of slits 108 are formed at one end of the film-shaped substrate to separate a region including one or more wiring portions 106 of the wiring pattern into a finger shape, and a part of each wiring portion 106 extends in a finger shape from the plate-like portion 110. The probe element 112 is used.

The tip of each probe element 112 (plate-like portion 1)
On the side opposite to 10) there is generally a projection or bump 1
14 is formed at an appropriate time by plating, bonding, or the like.
The bumps 114 are formed at the tip of the probe element 112 in a row so that they are located on the same straight line.

[0005] This type of film probe unit 10
Reference numeral 0 denotes the other end of the wiring section 106 (the end on the side of the plate-like section 110) soldered to the wiring section of the wiring board, and the probe element 1
The probe card is assembled by assembling the part on the side of 12 with the probe mounting plate mounted on the wiring board. The probe unit 100 includes each probe element 1
12 is mounted on the wiring board so as to have an angle with respect to the integrated circuit.

[0006] The probe card is provided with the same number of probe units as the number of side portions having pads so that one probe unit corresponds to one side portion having pads (electrode portions) of the integrated circuit. Each probe unit has a bump 114 so that each probe element 112 is curved in an arc.
Is pressed by the corresponding pad. The pressing of the bump on the pad is performed by moving the integrated circuit with respect to the probe card.

However, in the film-like probe unit 100 in which the bumps 114 are arranged in one row, as shown in FIG. 10, the integrated circuit 120 divides the pads 122 and 124 into a plurality of rows (two rows in the illustrated example) on the side portions. In the case of a chip having an arranged pad arrangement, there is a bump that does not contact the pad 122 or 124. For this reason, the conventional probe unit 100 cannot be used as a probe card for conducting a current test of the integrated circuit 120 having a plurality of rows of pad arrangements.

In order to solve the above-mentioned drawbacks, an integrated circuit 12 to be inspected, such as a probe unit 130 shown in FIG.
It is conceivable to arrange the bumps 132 and 134 in a plurality of rows (two rows in the illustrated example) corresponding to the pad arrangement of 0.

In the probe unit 130, FIG.
Since each probe element 136 and 138 has an angle θ with respect to the integrated circuit 120 as shown in FIG. 2, when the probe unit 130 is pressed against the integrated circuit 120, first, as shown in FIG. The bump 132 makes contact with the corresponding pad 122, and then the probe element 136 warps as shown in FIG.
The probe element 136 then warps further and the probe element 138 warps.

However, in the probe unit 130 having a bump arrangement as shown in FIG. 11, the probe element 138 having the inner bumps 134 is further deflected from the state shown in FIG. At this time, a rubbing action occurs between the tip of the probe element 138 and the surface of the integrated circuit 120, and as a result, the surface of the integrated circuit 120 is damaged at the probe element 136, particularly at the tip edge of the wiring portion 106. I cannot avoid doing it.

A probe unit 14 shown in FIG.
0, the bumps 132 and 134 are arranged in a plurality of rows (two rows in the illustrated example) corresponding to the pad arrangement of the integrated circuit 120 to be inspected, and the probe elements 14 are arranged.
It is conceivable that the length dimension of 2,144 corresponds to the pad arrangement of the integrated circuit 120 to be inspected. However, in such a probe unit 140, when the tip of the probe element 134 is cut by cutting means such as a laser in order to shorten the length dimension of the finger-shaped probe element 134, the side face of the adjacent long probe element 132 Is often damaged and the yield is poor.

[0012]

Therefore, in a film-shaped probe unit, an adjacent probe is not damaged during the manufacture of a flat-shaped test object having electrodes arranged in a plurality of rows. Preferably, the shape does not damage the element.

[0013]

A probe unit according to the present invention comprises a film-like plate-like portion and a plurality of first and second probe elements extending in a finger-like shape from the plate-like portion and having the same length. Is provided. Each of the first and second probe elements has a bump at a first location on the distal end side,
The probe element further includes a second
Has a bump at the position.

When the probe unit is pressed against the device under test, first, the bump at the first portion of the first probe element is pressed against the electrode portion, and the bump at the first portion of the second probe element is pressed. By being pressed by the test object,
The first and second probe elements are warped, and then the bump at the second location of the second probe element is pressed against the electrode portion, and the first and second probe elements are further warped.

Therefore, even if the length dimensions of the first and second probe elements are the same, the first and second probe elements do not directly contact the surface of the object to be inspected. Even if is warped in an arc shape, there is no danger of damaging the test object. Further, since the length dimensions of the probe elements are the same, there is no possibility that adjacent probe elements will be damaged when the probe unit is manufactured.

[0016] At least the surface of the bump formed at the first location of each second probe element can have electrical insulation. This allows the first probe element of each second
The electrical short-circuit of the electrode portion or the wiring portion of the device under test due to the bump formed at the position is prevented.

Further, a wiring portion extending from the plate portion to the first and second probe elements may be provided, and a bump may be formed on the wiring portion. Also, the bumps formed at the first location of the first probe element and the bumps formed at the second location of the second probe element can have the same shape. Further, the bumps formed on each second probe element may have the same shape or different shapes.

The bumps formed on each second probe element may be spaced apart in the longitudinal direction of the second probe element. However, the bumps formed on each second probe element may be at least partially continuous.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to FIGS. 1, 2 and 3, a film probe unit 10 includes a film probe substrate 12, a film connection substrate 14 coupled to the probe substrate 12, and A plate-shaped block 16 mounted on the connection board 14.

The probe board 12 has a metal layer 18 having a spring property laminated on one surface of an electrically insulating resin layer 20 such as polyimide, and a plurality of wiring portions (wiring patterns) 22 formed on the resin layer. 20 is formed on the other surface by a printed wiring technique. For this reason, the probe substrate 12 has some toughness and flexibility.

The probe substrate 12 has a first region having a substantially constant width dimension, a second region following the rear end of the first region, and having a width gradually increasing rearward. A third region following the rear end of the second region and having a substantially constant width dimension. The wiring section 22 extends continuously from the front end of the first area to the rear end of the third area via the second area. The distance between adjacent wiring portions 22 is substantially the same in the first region, but gradually increases in the second region, and is substantially the same in the third region.

The first region of the probe substrate 12 is separated by a slit 24 into a plurality of finger-like probe elements 26 and 28 including one or more wiring portions 22, and thus functions as a probe region. Probe board 12
Of these, the region other than the probe region acts as a plate-like portion. The probe elements 26, 28 have the same tip position and the same length dimension.

Each probe element 26 has at its tip a bump (projection) 30 which acts as a contact pressed against the terminal of the integrated circuit at the time of the conduction test. On the other hand, each probe element 28 has the same type of bumps 32 and 34 at the tip. The position of the bump 32 in the longitudinal direction of the probe element is substantially the same as the position of the bump 30. However, bump 34
Are formed at positions retreated inward (toward the second region) from the bumps 32.

In the probe unit 10 shown in the figure, since the pad arrangement (electrode arrangement) is used for the conduction test of the integrated circuit chip shown in FIG. 10 having two rows, the bump arrangement is two rows. The bump arrangement may be an arrangement corresponding to the pad arrangement of the device to be inspected.

The bumps 30, 32, and 34 are hemispherical protrusions of the same size, and are made of a conductive material such as nickel. However, it is preferable that the bump 32 be formed of an electrically insulating material or that an electrically insulating film be formed on at least the surface of the bump 32.

The probe substrate 12 is formed, for example, of the metal layer 1
8 is laminated on the resin layer 20 on one surface to form an elastically deformable film-like member (film-like laminate), and a wiring pattern is formed on the other surface of the film-like member by printed wiring technology. It can be formed by separating one region into a finger shape by a plurality of slits 24.
The bumps 30, 32, and 34 are formed at appropriate times by plating, bonding, coating, or the like.

The wiring of the connection board 14 is formed in a plurality of layers by an appropriate technique such as a printed wiring technique on a base made of an electrically insulating material such as polyimide so that the wiring portion 36 has a multilayer structure. . For this reason, the connection board 14
It has some toughness and flexibility.

The connection board 14 has a width dimension of the probe board 1.
2 and a substantially fan-shaped region formed by a rectangular region substantially the same as the third region and a fan-shaped region following the rear end of the rectangular region and gradually increasing in width toward the rear end. I have. The wiring portion 36 is formed continuously from the front end of the rectangular area to the rear end of the fan-shaped area. The intervals between adjacent wiring portions 36 are substantially the same in the rectangular region, but gradually increase toward the rear end in the fan-shaped region.

The connecting board 14 further has a plurality of connecting portions 38 at the rear end electrically connected to the rear end of each wiring portion 36. Each connection portion 38 is a conductive through hole. The connection portions 36 are formed in a plurality of rows (four rows in the illustrated example) at the rear end of the connection board 14.

Before connecting the probe board 12 and the connection board 14, the wiring section 22 of the probe board 12 is entirely exposed.
6 is exposed at one end (tip). The probe substrate 12 is stacked with the rear end thereof on the upper end of the connection substrate 14 with the anisotropic conductive film (not shown) therebetween with the wiring portion 22 being on the lower side, and is thermocompression-bonded. Thereby, the probe board 12 and the connection board 14 are respectively
At the leading and trailing ends they are joined together.

The anisotropic conductive film has conductivity in the thickness direction due to a large number of thin metal wires arranged in the thickness direction, but does not have conductivity in other directions. Therefore, the wiring section 22 of the probe board 12 and the wiring section 3 of the connection board 14
Numerals 6 are electrically connected in a one-to-one manner by an anisotropic conductive film at the rear end and the front end, respectively.

The block 16 has a substantially T-shape, and has two sets of holes 40 and 42 that open upward. One of the holes 40 is a threaded hole and is spaced longitudinally of the probe element 26. The other hole 42
This is a general hole formed on the tip side of the hole 40, and is spaced in the arrangement direction of the probe elements 26 and 28 (a direction perpendicular to the longitudinal direction of the probe element).

The block 16 is provided with an adhesive 44 on the upper side of the probe substrate 12 such that the hole 42 is on the front end side of the hole 40.
It is adhered by. The probe unit 10 can be assembled as shown in FIG. 1 by bonding the probe board 12 and the connection board 14 and then bonding the block 16 to the upper side of the probe board 12.

The probe unit 10 includes the probe substrate 1
2 can be manufactured separately from the connection substrate 14,
Precise probe elements 26, 28 can be easily manufactured. However, the probe substrate 12 and the connection substrate 14 may be formed integrally.

Referring to FIG. 4 and FIG. 5, the probe card 50 has a plurality (in the illustrated example,
(4) probe units 10 are used. The probe card 50 includes, besides the four probe units 10, a disk-shaped wiring board 52, a rectangular probe mounting plate 54 mounted on the wiring substrate 52, and a plate-shaped spacer 56 mounted on the mounting plate 54. And

The wiring board 52 has a cross-shaped opening 58 at the center and a plurality of connecting portions 60 connected to the connecting portion 38 of the probe unit 10 around the opening 58, so that the tester is electrically connected. And a plurality of tester lands 62 around the connection part 60, and a wiring part (not shown) having a two-layer structure between the connection part 60 and the tester land 62.

The probe mounting plate 54 has a rectangular opening 66, and is mounted on the upper side of the wiring board 52 by screws 68 at each corner so that the opening 66 is coaxial with the opening 58. The mounting plate 54 also has three pairs of through holes 70, 72, 74 at each of the locations corresponding to each side of the square, and has screw holes 76 at each of the four corners.

The through hole 70 is formed at a position corresponding to the screw hole 40 of the block 16, and the through hole 72 is formed at a position corresponding to the through hole 42 of the block 16. The through holes 74 are spaced from each other with the arrangement position of the through holes 70 therebetween.

The spacer 56 is formed in the opening 58 of the wiring board 52.
It has a substantially cross shape similar to the above, and is disposed in the opening 58. The spacer 56 also has through holes 70 and 7
2, two to four pairs of through holes 78 and 80 respectively. Each through hole 72 of the mounting plate 54 and the spacer 56,
80 has a larger diameter dimension than the through hole 42 of the block 16.

The spacer 56 is also provided on the probe mounting plate 5.
4 has an opening 82 having substantially the same shape as the opening 66.
The opening 82 is coaxial with the opening 66 and the through holes 78, 80
Are substantially aligned with the through holes 70 and 72.
Are attached to the lower side of the mounting plate 54 by screws 84 passed through the respective through holes 74.

Each block 16 is provided with a spacer 56 such that the distal end of the probe element protrudes to the positions of the openings 66 and 82.
And through holes 7 in the mounting plate 54 and the spacer 56.
It is attached to the probe attachment plate 54 via the spacer 56 by a screw 86 which is passed through the screw hole 78 of the block 16 through 0,78.

The spacer 56 is connected to all the probe units 1
Instead of using a common value of 0, a spacer 56 may be provided for each probe unit 10. In this case, the shape of each spacer can be made similar to the shape of the block 16.

The probe card 50 is manufactured, for example, in a state where each probe unit 10 is manufactured in advance as described above, and the probe mounting plate 54 and the spacer 56 are previously mounted on the wiring board 52 as described above. Are fixed to the corresponding connection portions 60 of the wiring board 52 by pins, solder, or the like, and then the blocks 16 of each probe unit 10 are attached to the corresponding portions of the probe mounting plate 54 via the spacers 56 with screws 86. By doing so, it can be assembled.

The probe unit 10 is mounted on the wiring board 5 so that the probe elements 26 and 28 are located at the lower ends of the probe elements 26 and 28.
It is assembled in a state having an angle with respect to 2. When the block 16 is assembled to the mounting plate 54, the probe units 10 are aligned with each other so that the tips of the probe elements 26 and 28 are at predetermined positions with respect to the wiring board 52. Positioning of each probe unit 10 can be performed using a manipulator with the screw 86 loosened to such an extent that the block 16 can move with respect to the spacer 56.

When the probe units 10 are attached to the wiring board 52, each probe unit 10 can be curved on the connection board 14 as shown in FIG. When the connecting board 14 is hardly elastically deformed, the connecting board 14 is provided with a curved portion 46 extending over the entire width thereof as shown in FIG.
Is formed, the probe unit 10 is easily elastically deformed at its curved portion, and the assembling of the probe element to the wiring board 52 is facilitated.

In the probe unit 10 assembled on the probe card 50, the bumps 30, 34 are pressed against the pads of the integrated circuit, which is the object to be inspected, in the inspection apparatus, whereby the probe elements 26, 28 are curved in an arc.

When the probe unit 10 is pressed against the integrated circuit 120, first, the bump 30 on the tip side contacts the corresponding pad 122 of the integrated circuit 120 as shown in FIG. Probe element 2 as shown
6 are slightly warped, and the bumps 32 are
Then, as shown in FIG. 6C, the probe element 26 further warps, and the bump 34 contacts the pad 124 to warp the probe element 28 as shown in FIG.

As described above, according to the probe unit 10, although the lengths of the probe elements 26 and 28 are the same, the tips, particularly the edges, of the probe elements 26 and 28 are formed on the surface of the integrated circuit 120. Therefore, there is no danger of damaging the integrated circuit 120 even if the probe elements 26 and 28 warp in an arc shape. Also, probe element 2
Since the lengths of 6, 28 are the same, there is no possibility that adjacent probe elements will be damaged when the probe unit is manufactured.

The dummy bumps 32 that do not come into contact with the pads have the same shapes as the bumps 30 and 34 that come into contact with the pads. Instead of the dummy bumps 32 that do not come into contact with the pads, as shown in FIGS. The shape may be different from 30 and 34. Further, a dummy bump which does not contact the pad may be provided on the probe element 26 side. Further, when a plurality of bumps are formed on each of the probe elements 26 and 28, the bumps may be connected to each other. In this case, the height of the bump contacting the pad should be larger than that of the dummy bump not contacting the pad. Can be.

The present invention is not limited to the above embodiment. For example, the present invention is suitable as a probe unit and a probe card for use in an energization test of an integrated circuit, particularly a circuit chip, but a probe unit and a probe used for an energization test of another flat test object such as a liquid crystal display panel. It can be applied to cards.

[Brief description of the drawings]

FIG. 1 is a plan view showing one embodiment of a probe unit according to the present invention.

FIG. 2 is a side view of the probe unit shown in FIG.

FIG. 3 is an enlarged perspective view of a probe element portion of the probe unit shown in FIG.

FIG. 4 is a plan view showing one embodiment of a probe card using the probe unit shown in FIG.

FIG. 5 is a sectional view taken along the line 5-5 in FIG. 4;

FIG. 6 is a view for explaining an operation state of a probe element of the probe unit shown in FIG. 1;

FIG. 7 is a sectional view showing another embodiment of the probe element.

8 is a bottom view of the probe element shown in FIG.

FIG. 9 is a perspective view showing an example of a conventional probe unit.

FIG. 10 is a plan view showing an example of a pad arrangement of an integrated circuit chip to be inspected.

FIG. 11 is a perspective view showing another example of a conventional probe unit.

FIG. 12 is a diagram for explaining the operation of the probe unit shown in FIG.

FIG. 13 is a perspective view showing still another example of a conventional probe unit.

DESCRIPTION OF SYMBOLS 10 Probe unit 12 Probe board 14 Connection board 16 Probe block 18 Metal layer 20 Resin layer 22 Wiring part of probe unit 24 Slit 26, 28 Probe element 30, 32, 34 Bump

Claims (7)

[Claims] 1. A film-like plate-like portion, and a plurality of first plates extending in a finger-like shape from the plate-like portion and having the same length.
And a second probe element, wherein each of the first and second probe elements has a bump at a first location on the distal end side, and the second probe element further has a bump from the first location. A film-like probe unit having a bump at a second location on the plate-like portion side. 2. The probe unit according to claim 1, wherein at least a surface of the bump formed at the first location of each second probe element has an electrical insulating property. 3. The probe according to claim 1, further comprising a wiring portion extending from the plate portion to the first and second probe elements, wherein the bump is formed on the wiring portion. unit. 4. The bump formed at a first location of the first probe element and a bump formed at a second location of the second probe element have the same shape.
4. The probe unit according to 2 or 3. 5. The probe unit according to claim 1, wherein the bumps formed on each second probe element have different shapes. 6. The probe unit according to claim 1, wherein the bumps formed on each second probe element are spaced from each other in a longitudinal direction of the second probe element. 7. The bump formed on each second probe element is at least partially continuous.
The probe unit according to any one of the above.