CN113848356B - Probe module and preparation method thereof - Google Patents
Probe module and preparation method thereof Download PDFInfo
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- CN113848356B CN113848356B CN202111238754.7A CN202111238754A CN113848356B CN 113848356 B CN113848356 B CN 113848356B CN 202111238754 A CN202111238754 A CN 202111238754A CN 113848356 B CN113848356 B CN 113848356B
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- 239000000523 sample Substances 0.000 title claims abstract description 264
- 238000002360 preparation method Methods 0.000 title abstract description 5
- 238000012360 testing method Methods 0.000 claims abstract description 23
- 238000000034 method Methods 0.000 claims description 12
- 238000002788 crimping Methods 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 238000005530 etching Methods 0.000 claims description 6
- 238000005452 bending Methods 0.000 claims description 4
- 238000007781 pre-processing Methods 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 3
- 238000000227 grinding Methods 0.000 claims description 3
- 241001136800 Anas acuta Species 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 241001409896 Hirundapus Species 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
The invention discloses a probe module and a preparation method thereof, and belongs to the technical field of probes. The probe module comprises a fixed seat and a plurality of probe sheets. In the plurality of probe sheet interval arrangement fixing seats, two ends of each probe sheet are respectively arranged in two parallel planes at intervals, and the interval between one end parts of any two adjacent probe sheets is larger than the interval between the other end parts of the two probe sheets. Each probe piece all includes probe piece board and a plurality of probe, and a plurality of probes interval arrangement in proper order is on the probe piece board, and probe piece board cartridge is in the fixing base, and all links together through the insulating part between probe piece board and the a plurality of probe, and the interval between the one end of arbitrary two adjacent probes is greater than the interval between the other end of two probes. The probe module provided by the embodiment of the invention can increase the arrangement interval between one ends of the probes, thereby realizing the conduction of test points on the PCB/FPC and further realizing the conduction of products.
Description
Technical Field
The invention belongs to the technical field of probes, and particularly relates to a probe module and a preparation method thereof.
Background
In order to ensure the quality of products, various tests are carried out in the production process, various crimping units are needed in the test processes, one ends of probe modules on the crimping units are contacted with test points of the products, the other ends of probe modules on the crimping units are contacted with test points on PCBs/FPCs and the like, and the PCBs/FPCs and the like are connected with other transmission units or test equipment, so that the products are conducted.
The current panel, integrated circuit, semiconductor and other products are more and more refined, the volume is smaller and smaller, the corresponding test point spacing on the panel is smaller and smaller, and the PCB/FPC and the like are large in processing difficulty due to the limitation of the processing and manufacturing process of the PCB/FPC and the like, so that the spacing of the test points on the PCB/FPC is larger, and the PCB/FPC cannot be matched with the test point spacing on the panel, the integrated circuit, the semiconductor and other products, so that the product conduction cannot be realized.
Disclosure of Invention
Aiming at the defects or improvement demands of the prior art, the invention provides a probe module and a preparation method thereof, and aims to increase the arrangement interval between one ends of probes, thereby realizing the conduction of test points on a PCB/FPC and further realizing the conduction of products.
In a first aspect, the present invention provides a probe module, the probe module including a fixing base and a plurality of probe tiles;
the plurality of probe sheets are arranged in the fixed seat at intervals, each probe sheet is of a Z-shaped structure, two ends of each probe sheet are respectively arranged in two parallel planes at intervals, and for the plurality of probe sheets, the interval between one end parts of any two adjacent probe sheets is larger than the interval between the other end parts of the two probe sheets;
Each probe sheet comprises a probe sheet plate and a plurality of probes, for any one probe sheet, the probes are sequentially arranged on the probe sheet plate at intervals, the probe sheet plate is inserted into the fixing seat, the probe sheet plate and the probes are connected together through insulating pieces, and the interval between one ends of any two adjacent probes is larger than the interval between the other ends of the two probes.
Optionally, each probe sheet plate comprises two plate bodies arranged at intervals, the plurality of probes are symmetrically arranged between the two plate bodies, and the two plate bodies and the plurality of probes are adhered together through insulating glue.
Optionally, both ends of each plate body are provided with limiting parts, the fixing seat is provided with a plurality of limiting grooves, the limiting parts and the limiting grooves are in one-to-one correspondence, and each limiting part is inserted into the corresponding limiting groove.
Optionally, the fixing seat is of a square structure, a square hole is formed in the fixing seat, and the limiting grooves are respectively arranged on two sides of the square hole.
Optionally, one end of each probe is sequentially connected with an elastic part and a needle tail, and the elastic part is of an elastic structure.
Optionally, the probe module further includes a cover plate, the cover plate is provided with a plurality of through holes, the through holes and the needle tails are in one-to-one correspondence, and each needle tail is inserted into the corresponding through hole and protrudes out of the cover plate.
In a second aspect, the present invention provides a crimping tool, which includes the probe module according to the first aspect.
In a third aspect, the present invention provides a crimp testing apparatus comprising a probe module according to the first aspect.
In a fourth aspect, the present invention provides a method for preparing a probe module, the method being based on the probe module of the first aspect, the method comprising:
Preprocessing a plurality of probe panels to obtain a plurality of primary probe sheets, wherein each primary probe sheet comprises a probe sheet plate, a plurality of probes and connecting ribs, and the probe sheet plates and the probes are connected together through the connecting ribs;
Inserting a plurality of primary probe sheets into the fixing seat, and connecting the probe sheet plates in the primary probe sheets and the probes together through insulating pieces;
And grinding the connecting ribs, and processing a plurality of primary probe sheets into a plurality of probe sheets so as to obtain the probe module.
Optionally, the preprocessing the plurality of probe tiles to obtain a plurality of primary probe tiles includes:
Etching the plurality of probe panels;
And bending the etched plurality of probe panels to obtain a plurality of primary probe sheets.
The technical scheme provided by the embodiment of the invention has the beneficial effects that:
For the probe module provided by the embodiment of the invention, the probe sheet plates of the probe sheets are all inserted in the fixing seat in parallel, so that a plurality of probe sheets are inserted in the fixing seat, and the spacing at the bottom of the probe sheets is ensured to be larger than the spacing at the top of the probe sheets (in the Y-axis direction). In addition, the bottom and the top of the probe of each probe sheet are respectively arranged in two spaced planes, wherein the top of the probe can be used for being communicated with a test point of a product, the bottom of the probe can be used for being connected with a PCB/FPC, and the insulating piece plays an insulating role on the probes.
For a plurality of probes in each probe sheet, the distance between the bottoms of the probes is larger than the distance between the tops of the probes (in the X-axis direction), so that the distance between the bottoms of the probes in the X-axis direction and the Y-axis direction in the plane is larger than the distance between the tops of the probes in the X-axis direction and the Y-axis direction in the plane, the distance between the bottoms of the probes can be increased, the requirement for setting the distance between test points on a PCB/FPC (printed Circuit Board) is reduced, the processing difficulty of the PCB/FPC is reduced, and the conduction of products is met.
That is, the probe module provided by the embodiment of the invention can increase the arrangement interval between one ends of the probes, thereby realizing the conduction of test points on the PCB/FPC and further realizing the conduction of products.
Drawings
FIG. 1 is a first view of a probe module according to an embodiment of the present invention;
FIG. 2 is a second view of a probe module according to an embodiment of the present invention;
FIG. 3 is a schematic view of a probe card according to an embodiment of the present invention;
FIG. 4 is an enlarged view of a portion of FIG. 1;
FIG. 5 is an enlarged view of a portion of FIG. 2;
FIG. 6 is a side view of a probe tile provided by an embodiment of the present invention;
FIG. 7 is an enlarged view of a portion of FIG. 3;
FIG. 8 is a flowchart of a method for manufacturing a probe module according to an embodiment of the present invention;
FIG. 9 is a schematic diagram of the structure of a primary probe tile provided by an embodiment of the present invention;
fig. 10 is a partial enlarged view of fig. 9.
The symbols in the drawings are as follows:
1. A fixing seat; 11. square holes; 2. a probe sheet; 21. a probe card; 211. a plate body; 212. a limit part; 22. a probe; 221. an elastic part; 222. a needle tail; 23. a first end; 24. an intermediate portion; 25. a second end; 3. a cover plate; 31. a through hole; 4. a primary probe tile; 41. and (5) connecting ribs.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention. In addition, the technical features of the embodiments of the present invention described below may be combined with each other as long as they do not collide with each other.
Fig. 1 is a first view of a probe module provided by an embodiment of the present invention, and fig. 2 is a second view of a probe module provided by an embodiment of the present invention, as shown in fig. 1 and fig. 2, the probe module includes a fixing base 1 and a plurality of probe tiles 2.
Fig. 3 is a schematic structural diagram of a probe card according to an embodiment of the present invention, as shown in fig. 3, in a fixing seat 1 in which a plurality of probe cards 2 are arranged at intervals, each probe card 2 has a Z-shaped structure, two ends of each probe card 2 are respectively arranged in two parallel planes at intervals, and for a plurality of probe cards 2, the interval between one end of any two adjacent probe cards 2 is greater than the interval between the other ends of two probe cards 2.
Each probe sheet 2 includes a probe sheet plate 21 and a plurality of probes 22, and for any one probe sheet 2, the plurality of probes 22 are sequentially arranged on the probe sheet plate 21 at intervals, the probe sheet plate 21 is inserted into the fixing seat 1, and the probe sheet plate 21 and the plurality of probes 22 are all connected together through an insulating member, and the interval between one ends of any two adjacent probes 22 is larger than the interval between the other ends of the two probes 22.
For the probe module provided by the embodiment of the invention, the probe sheet plates 21 of the probe sheets 2 are all inserted in the fixing seat 1 in parallel, so that a plurality of probe sheets 2 are inserted in the fixing seat 1, and the distance M 2 at the bottom of the probe sheet 2 is ensured to be larger than the distance M 1 at the top of the probe sheet 2 (in the Y-axis direction). In addition, the bottom and top of the probes 22 of each probe sheet 2 are respectively arranged in two spaced planes, wherein the top of the probes 22 can be used for connecting with test points of products, the bottom of the probes 22 can be used for connecting with a PCB/FPC, and the insulating member plays an insulating role between the probes 22.
For the plurality of probes 22 in each probe sheet 2, the distance L 2 between the bottoms of the probes 22 is greater than the distance L 1 between the tops of the probes 22 (in the X-axis direction), so that the distance between the bottoms of the probes 22 in the X-axis and Y-axis directions in the plane is greater than the distance between the tops of the probes 22 in the X-axis and Y-axis directions in the plane (see fig. 4 and 5), and thus the distance increase between the bottoms of the probes 22 can be increased, the requirement for setting the distance between test points on the PCB/FPC is reduced, the processing difficulty of the PCB/FPC is reduced, and the conduction to the product is satisfied.
That is, the probe module provided by the embodiment of the invention can increase the arrangement interval between one ends of the probes 22, thereby realizing the conduction of test points on the PCB/FPC and further realizing the conduction of products.
The probe card 21 and the plurality of probes 22 are each arranged in a zigzag shape.
In addition, in the probe module, the number of the probe tiles 2 varies from several to several hundred, and the number of the probes 22 contained in each probe tile 2 varies from several to several hundred; the number of probe tiles 2 in each probe module and the number of probes 22 distributed in each probe tile 2 need to be designed according to the number and distribution of tested product test points.
It is easy to understand that, when assembling, assembling a probe sheet 2 means assembling a plurality of probes 22, and the structure of the probe sheet 2 greatly reduces the assembling difficulty and workload of the probes 22, and greatly improves the assembling efficiency.
Illustratively, the probe tile 21 and each probe 22 include a first end 23, a middle 24, and a second end 25, the first end 23 and the second end 25 being vertically disposed, the middle 24 connecting the first end 23 and the second end 25, respectively, at both ends, the middle 24 being horizontally or obliquely disposed (see fig. 6).
Illustratively, the precision of the spacing between the bottoms of each probe 22 (M 2 and L 2) is 0.2mm, and the precision of the spacing between the tops of each probe 22 (M 1 and L 1) is 0.05mm.
Referring again to fig. 3, each probe card plate 21 includes two spaced apart plate bodies 211, a plurality of probes 22 are symmetrically arranged between the two plate bodies 211, and the two plate bodies 211 and the plurality of probes 22 are bonded together by insulating glue.
In the above embodiment, the two plate bodies 211 support the probes 22 more stably. The insulating member may be an insulating adhesive, so that each probe 22 becomes an independent body, is not connected to each other, and is transferred and conducted corresponding to different test points.
Illustratively, both ends of each plate 211 are provided with a limiting portion 212, the fixing base 1 is provided with a plurality of limiting grooves, the limiting portions 212 are in one-to-one correspondence with the limiting grooves, and each limiting portion 212 is inserted into the corresponding limiting groove.
In the above embodiment, the limiting groove plays a role in limiting the limiting portion 212, so that stable arrangement of each probe sheet 2 in the fixing base 1 is facilitated.
Specifically, the fixing seat 1 has a square structure, the fixing seat 1 is provided with square holes 11, and a plurality of limit grooves are respectively arranged on two sides of the square holes 11, so that the arrangement of the limit grooves is realized.
In this embodiment, the top diameter of each square hole 11 is smaller than the bottom diameter.
In other embodiments of the present invention, the fixing base 1 may also have a circular structure.
Fig. 7 is an enlarged view of a portion of fig. 3, and as shown in fig. 7, one end of each probe 22 is sequentially connected to an elastic portion 221 and a tail 222, and the elastic portion 221 has an elastic structure.
In the above embodiment, the elastic part 221 may be compressed to generate elastic force, so as to avoid hard contact between the tail 222 and the test point of the PCB/FPC.
In this embodiment, the probe module further includes a cover plate 3, where the cover plate 3 has a plurality of through holes 31, the plurality of through holes 31 and a plurality of tails 222 are in one-to-one correspondence, each of the tails 222 is inserted into a corresponding through hole 31, and the protruding cover plate 3 is disposed.
In the above embodiment, the conduction on the cover plate 3 may act as a guide for the tail 222, reducing the amount of shaking of the tail 222, so that the tail 222 is in full contact with the test point on the PCB/FPC.
The invention also provides a crimping jig, which comprises the probe module.
The invention also provides a crimping testing device, which comprises the probe module.
Fig. 8 is a flowchart of a method for preparing a probe module according to an embodiment of the present invention, where the method is based on the probe module, and the method includes:
S801, preprocessing a plurality of probe panels to obtain a plurality of primary probe tiles 4, wherein each primary probe tile 4 comprises a probe tile plate 21, a plurality of probes 22 and connecting ribs 41, and the probe tile plate 21 and the plurality of probes 22 are connected together through the connecting ribs 41 (see fig. 9 and 10).
Illustratively, the number of connecting ribs 41 is 2, connecting the top and bottom of each probe 22, respectively.
S802, inserting a plurality of primary probe sheets 4 into the fixed seat 1, and connecting the probe sheet plates 21 and the plurality of probes 22 in each primary probe sheet 4 together through insulating pieces.
S803, the connection rib 41 is ground off, and the plurality of primary probe sheets 4 are processed into a plurality of probe sheets 2, thereby obtaining a probe module.
In the above embodiment, the assembly of the primary probe tile 4 is achieved by the connection ribs 41, thereby facilitating the rapid assembly of each probe 22 into the holder 1. The insulator serves to connect and insulate the plurality of probes 22 and support can be achieved by the insulator as well after the connection bars 41 are ground away.
The connection rib 41 can communicate with each probe 22, and therefore should be worn out after the assembly.
Optionally, the plurality of probe tiles are pre-processed to obtain a plurality of primary probe tiles 4, including:
a. etching the plurality of probe panels.
B. and bending the etched plurality of probe panels to obtain a plurality of primary probe sheets 4.
In the above embodiment, the probe panel can be directly manufactured to obtain the primary probe sheet 4 by etching and bending, so that the connection of the probe sheet plate 21, the plurality of probes 22 and the connection ribs 41 by soldering is avoided, and the manufacturing efficiency of the primary probe sheet 4 is improved.
The probe card 21, the plurality of probes 22, and the connection ribs 41 (see fig. 9) can be obtained by etching the probe card to form a gap.
In addition, the probe module of the probe 22 of the invention adopts etching equipment, grinding machine and other equipment which are widely used in China at present, and the technology is mature, so that the manufacturing cost can be greatly reduced, and the production period can be shortened.
It will be readily appreciated by those skilled in the art that the foregoing description is merely a preferred embodiment of the invention and is not intended to limit the invention, but any modifications, equivalents, improvements or alternatives falling within the spirit and principles of the invention are intended to be included within the scope of the invention.
Claims (10)
1. The probe module is characterized by comprising a fixed seat (1) and a plurality of probe sheets (2);
the plurality of probe sheets (2) are arranged in the fixed seat (1) at intervals, each probe sheet (2) is of a Z-shaped structure, two ends of each probe sheet (2) are respectively arranged in two parallel planes at intervals, and for the plurality of probe sheets (2), the interval between one end parts of any two adjacent probe sheets (2) is larger than the interval between the other end parts of the two probe sheets (2);
each probe sheet (2) comprises a probe sheet plate (21) and a plurality of probes (22), for any one probe sheet (2), the probes (22) are sequentially arranged on the probe sheet plate (21) at intervals, the probe sheet plate (21) is inserted into the fixing seat (1), the probe sheet plate (21) and the probes (22) are connected together through insulating pieces, and the interval between one ends of any two adjacent probes (22) is larger than the interval between the other ends of the two probes (22).
2. A probe module according to claim 1, wherein each of the probe sheet plates (21) comprises two plate bodies (211) arranged at intervals, a plurality of the probes (22) are symmetrically arranged between the two plate bodies (211), and the two plate bodies (211) and the plurality of the probes (22) are bonded together through insulating glue.
3. The probe module according to claim 2, wherein each of the two end portions of the plate body (211) is provided with a limiting portion (212), the fixing base (1) is provided with a plurality of limiting grooves, the limiting portions (212) and the limiting grooves are in one-to-one correspondence, and each of the limiting portions (212) is inserted into the corresponding limiting groove.
4. A probe module according to claim 3, wherein the fixing seat (1) has a square structure, the fixing seat (1) has a square hole (11), and the plurality of limiting grooves are respectively arranged at two sides of the square hole (11).
5. A probe module according to claim 1, wherein one end of each probe (22) is sequentially connected to an elastic portion (221) and a tail (222), and the elastic portion (221) has an elastic structure.
6. A probe module according to claim 5, further comprising a cover plate (3), wherein the cover plate (3) has a plurality of through holes (31), the plurality of through holes (31) and the plurality of pin tails (222) are in one-to-one correspondence, and each pin tail (222) is inserted into the corresponding through hole (31) and protrudes out of the cover plate (3).
7. A crimping jig, characterized in that the crimping jig comprises the probe module according to any one of claims 1 to 6.
8. A crimp testing apparatus comprising a probe module according to any one of claims 1 to 6.
9. A method for manufacturing a probe module, characterized in that the method is based on the probe module according to any one of claims 1-6, the method comprising:
Pretreating a plurality of probe panels to obtain a plurality of primary probe sheets (4), wherein each primary probe sheet (4) comprises a probe sheet plate (21), a plurality of probes (22) and connecting ribs (41), and the probe sheet plates (21) and the probes (22) are connected together through the connecting ribs (41);
Inserting a plurality of primary probe sheets (4) into the fixing seat (1), and connecting the probe sheet plates (21) in the primary probe sheets (4) and the probes (22) together through insulating pieces;
And grinding the connecting ribs (41), and processing the plurality of primary probe sheets (4) into a plurality of probe sheets (2) so as to obtain the probe module.
10. The method for manufacturing a probe module according to claim 9, wherein the preprocessing the plurality of probe tiles to obtain a plurality of the primary probe tiles (4) comprises:
Etching the plurality of probe panels;
And bending the etched plurality of probe panels to obtain a plurality of primary probe sheets (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111238754.7A CN113848356B (en) | 2021-10-25 | 2021-10-25 | Probe module and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111238754.7A CN113848356B (en) | 2021-10-25 | 2021-10-25 | Probe module and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113848356A CN113848356A (en) | 2021-12-28 |
| CN113848356B true CN113848356B (en) | 2024-05-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111238754.7A Active CN113848356B (en) | 2021-10-25 | 2021-10-25 | Probe module and preparation method thereof |
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| Country | Link |
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| CN (1) | CN113848356B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW533309B (en) * | 1999-06-22 | 2003-05-21 | Nihon Micronics Kk | Probe device |
| CN2802510Y (en) * | 2003-05-08 | 2006-08-02 | 雅马哈株式会社 | Probe device |
| TW200700733A (en) * | 2005-06-21 | 2007-01-01 | Kodi S Co Ltd | Flat-type probe apparatus for inspecting flat panel display device |
| TWI285269B (en) * | 2005-06-21 | 2007-08-11 | Kodi S Co Ltd | Pin typed probe apparatus for inspecting FPD |
| CN201203631Y (en) * | 2008-05-21 | 2009-03-04 | 安玧泰 | Probe component |
| CN212622729U (en) * | 2020-08-07 | 2021-02-26 | 深圳市瑞能创新科技有限公司 | Probe fixing mechanism and test needle bed |
| CN214201560U (en) * | 2021-08-19 | 2021-09-14 | 武汉精毅通电子技术有限公司 | Crimping tool and crimping testing arrangement |
| CN216209350U (en) * | 2021-10-25 | 2022-04-05 | 武汉精毅通电子技术有限公司 | Probe module, crimping tool and crimping testing arrangement |
-
2021
- 2021-10-25 CN CN202111238754.7A patent/CN113848356B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW533309B (en) * | 1999-06-22 | 2003-05-21 | Nihon Micronics Kk | Probe device |
| CN2802510Y (en) * | 2003-05-08 | 2006-08-02 | 雅马哈株式会社 | Probe device |
| TW200700733A (en) * | 2005-06-21 | 2007-01-01 | Kodi S Co Ltd | Flat-type probe apparatus for inspecting flat panel display device |
| TWI285269B (en) * | 2005-06-21 | 2007-08-11 | Kodi S Co Ltd | Pin typed probe apparatus for inspecting FPD |
| CN201203631Y (en) * | 2008-05-21 | 2009-03-04 | 安玧泰 | Probe component |
| CN212622729U (en) * | 2020-08-07 | 2021-02-26 | 深圳市瑞能创新科技有限公司 | Probe fixing mechanism and test needle bed |
| CN214201560U (en) * | 2021-08-19 | 2021-09-14 | 武汉精毅通电子技术有限公司 | Crimping tool and crimping testing arrangement |
| CN216209350U (en) * | 2021-10-25 | 2022-04-05 | 武汉精毅通电子技术有限公司 | Probe module, crimping tool and crimping testing arrangement |
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| Publication number | Publication date |
|---|---|
| CN113848356A (en) | 2021-12-28 |
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