CN201203631Y

CN201203631Y - Probe component

Info

Publication number: CN201203631Y
Application number: CNU2008201148307U
Authority: CN
Inventors: 安玧泰
Original assignee: AHAN GYONG-KWANG; AHAN GYONG KWANG
Current assignee: AHAN GYONG-KWANG; AHAN GYONG KWANG
Priority date: 2008-05-21
Filing date: 2008-05-21
Publication date: 2009-03-04
Anticipated expiration: 2018-05-21

Abstract

The utility model relates to a probe component, which comprises a chip and a plurality of probe slices, wherein the chip has a joint portion formed by etching, the probe slices are sequentially arranged in the joint portion, and the front ends of the probe slices are exposed to the chip. The probe component has simple manufacturing process, the probe slices are arranged by etching a single chip, reducing the step of binding two chips, therefore the manufacture is simple, and the manufacture cost is lowered. Since no adhesive is used for fixing, the case that the adhesive overflows and affects the stability of the probe slices is avoided, thus lowering the fraction defective of products. The front ends of the probe slices are open type, therefore operators can easily check the contact of the probe slices with a liquid crystal panel, ensuring the check efficiency of the probe component.

Description

Probe assembly

Technical field

The utility model relates to a kind of probe assembly, refers to a kind of probe assembly that utilizes etching mode to simplify yi word pattern probe assembling procedure especially.

Background technology

The image display of LCD TV, mobile computer and desk-top computer has generally used LCD (LCD), general LCD is provided with the contact terminal that high density is arranged on its panel side, be used to transmit signals such as image and form and aspect, therefore LCD can carry out the test of signal before being installed to product, and inspection panel has no adverse reaction.

The signal check device of LCD is a probe unit at present, which is provided with probe, as shown in Figure 1, probe includes a main support 90, these main support 90 belows are provided with substrate holder 91 and probe tile support 92, these probe tile support 92 below groups are provided with probe assembly, and these substrate holder 91 belows are provided with circuit substrate 95, this circuit substrate 95 electrically connects this probe assembly, this probe assembly includes a guide plate 93 and a plurality of probe tile 94, be laid with group connecting part on this guide plate 93, those probe tile 94 insert groups are provided, this guide plate 93 is to be engaged up and down by bonding agent by two chips to form, and bonding agent is in engaging process, and bonding agent can infiltrate in the group connecting part, cause the probe tile 94 of insert group on this guide plate 93 can not firmly insert fixing, and, the defective ratio of probe assembly is improved because of bonding agent makes probe tile 94 generations mobile, and can't survey the operation of inspection.

In addition, probe tile 94 in the probe assembly is not outstanding outward, so in the program of probe unit test, whether the contact jaw that can't judge and distinguish probe tile 94 easily is at correct position and touch panel, so need on the defective of probe tile 94 is judged to spend the long time, add the manufacturing course complexity of probe assembly, also improved manufacturing cost, and be easy to generate unacceptable product in the manufacture process again, thereby reduced the efficient of checking liquid crystal panel.

The utility model content

Fundamental purpose of the present utility model is to provide a kind of probe assembly, is used to solve the defective ratio and the higher shortcoming of manufacturing cost of existing probe.

For reaching above-mentioned purpose, the utility model provides a kind of probe assembly, comprising:

One chip, described chip is formed with a plurality of group connecting parts, and described group connecting part is by being spaced; And

A plurality of probe tile are mounted on respectively in the more described group connecting part, and described probe tile front end shows outward in described chip.

Described probe tile includes a plurality of first probe tile and a plurality of second probe tile, and first, second probe tile is arranged at intervals in a plurality of group connecting parts of described chip.

Described first and second probe tile is respectively equipped with a panel contact site and circuit contacts portion in its two side ends, and described panel contact site has one to lower prong, and described circuit contacts portion has one to upper prong, and described lamellar body root edge convexes with fixed part.

Compared with prior art, the utlity model has following advantage:

The probe assembly that the utility model provides, organize and establish probe tile by carry out the formed group connecting part of etching by one chip, not only simplified the manufacturing process of probe assembly, also reduce manufacturing cost, and in manufacture process, do not need to utilize bonding agent to fix, produce mobilely so probe tile can not be subjected to the influence of bonding agent, can reduce the defective ratio of probe assembly product.In addition, the front end of this probe tile shows outward in this chip, because the probe tile of the utility model probe assembly belongs to Open architecture, therefore probe assembly is when testing liquid crystal panel, the contacting situation and this adjusted of easier each probe tile and the liquid crystal panel to observation of operator, thereby the time of saving contraposition greatly and being spent, also improve the detection efficiency of probe assembly.

Description of drawings

Fig. 1 is the side-looking diagrammatic cross-section of prior art probes card;

Fig. 2 is the schematic perspective view of a preferred embodiment of first probe tile of the utility model probe assembly;

Fig. 3 is the schematic perspective view of a preferred embodiment of second probe tile of the utility model probe assembly;

Fig. 4 is the schematic perspective view of a preferred embodiment of the utility model probe assembly;

Fig. 5 is the side-looking diagrammatic cross-section of a preferred embodiment of the utility model probe assembly;

Fig. 6 A is test and the partial schematic diagram that first of the utility model probe assembly is implemented state;

Fig. 6 B is the schematic perspective view that first of the utility model probe assembly is implemented state;

Fig. 7 A is test and the partial schematic diagram that second of the utility model probe assembly is implemented state;

Fig. 7 B is the schematic perspective view that second of the utility model probe assembly is implemented state.

The main element symbol description is as follows:

10 chips, 11 group connecting parts

20 first probe tile, 22 panel contact sites

23 circuit contacts portions 24 are towards lower prong

25 towards upper prong 26 fixed parts

30 second probe tile, 32 panel contact sites

33 circuit contacts portions 34 are towards lower prong

35 towards upper prong 36 fixed parts

40 probe, 41 main supports

42 fixtures, 43 films

44 drive integrated circults, 45 probe stationary parts

46 flexible circuit boards, 90 main supports

91 substrate holders, 92 probe tile supports

93 guide plates, 94 probe tile

95 circuit substrates

Embodiment

As Fig. 4, shown in Figure 5, be a preferred embodiment of the utility model probe assembly, it includes a chip 10 and a plurality of probe tile.

Be laid with a plurality of group connecting parts that are arranged parallel to each other 11 on this chip 10, this group connecting part 11 utilizes twice etching and processing technology to be shaped, and the shape that this group connecting part 11 etches is corresponding to those probe tile.

This probe tile is mounted in the group connecting part 11 of this chip 10, and its front end shows outward in this chip 10.In preferred embodiment of the present utility model, this probe tile includes two kinds of forms: first probe tile 20 (as shown in Figure 2) and second probe tile 30 (as shown in Figure 3), this first,

second probe tile

20,30 all belongs to the yi word pattern probe tile, and first, second probe tile the 20, the 30th, group is established in the group connecting part 11 of this chip 10 with being spaced, wherein, the material of this probe tile can be beallon (Be-Cu) or beryllium nickel alloy (Be-Ni).

Fig. 2 is the schematic perspective view of a preferred embodiment of first probe tile of the utility model probe assembly, the two ends of this first probe tile 20 are respectively equipped with a panel contact site 22 and a circuit contacts portion 23, this panel contact site 22 and this circuit contacts portion 23 are approximately perpendicular to this first probe tile 20, and this panel contact site 22 has lower prong 24 on one day, this circuit contacts portion 23 has upper prong 25 on one day, and these first probe tile, 20 root edges down convex with two fixed parts 26, can stretch into group connecting part 11 and be fixed in this chip 10, and after group is established, this protrudes from the upper surface of this chip 10 towards upper prong 25, and be positioned at the latter half of of this chip 10, and be somebody's turn to do the lower surface that stretch out this chip 10 towards lower prong 24, but and the surface of contact measured liquid crystal panel.

Fig. 3 is the schematic perspective view of a preferred embodiment of second probe tile of the utility model probe assembly, these second probe tile, 30 forms are similar to this first probe tile 20, these second probe tile, 30 1 ends extend a panel contact site 32 downwards, the other end extends upward a circuit contacts portion 33, this panel contact site 32 has lower prong 34 on one day, this circuit contacts portion 33 has upper prong 35 on one day, and these second probe tile, 30 belows are provided with fixed part 36, this second probe tile 30 can stretch in the group connecting part 11 of this chip 10, and be fixed in this chip 10 by this fixed part 36, after group is established, this second probe tile 30 protrude out this chip 10 bottom surfaces towards lower prong 34, in addition protrude out this chip 10 end faces towards upper prong 35.

Shown in Fig. 6 A and 6B, for the utility model probe assembly is used in to cover crystal glass (chip-on-glass, COG) synoptic diagram on the made probe 40 of method, it includes a main support 41, these main support 41 belows are provided with a fixture 42 that is used for fixing drive integrated circult 44, these fixture 42 belows are provided with the film 43 (Pattern Film) that connects drive integrated circult 44, this film 43 1 sides connect protrude from this probe assembly towards

upper prong

25,35, opposite side connects flexible circuit board 46.

Shown in Fig. 7 A, 7B, Fig. 7 A, 7B are respectively another embodiment of probe assembly, and (chip-on-film, COF) method is made and is mounted on the probe 40 to adopt membrane of flip chip.This probe 40 has a main support 41, these main support 41 belows are provided with a fixture 42, these fixture 42 below groups are provided with the film 43 that connects drive integrated circult 44, this limit, film 43 two opposite sides connect respectively this probe assembly towards a

upper prong

25,35 and a flexible circuit board 46.

All be provided with probe stationary part 45 on the above-mentioned probe, and this main support 41 of can arranging in pairs or groups fixes this probe assembly and this film 43, just a plurality of probe 40 can be mounted on the probe unit, be contacted with the surface of liquid crystal panel to be measured towards

lower prong

24,34 on the probe assembly, because the probe tile in the probe assembly belongs to open structure, so the operator can observe each towards the contact situation of

lower prong

24,34 with liquid crystal panel, after affirmation contact situation is good, carry out signal testing again.

In sum, the utility model probe assembly is to carry out etching and processing by one chip 10 to form group connecting part 11, and then provide first,

second probe tile

20,30 to organize to establish wherein openly, in the manufacture process, need not use bonding agent to fix, probe tile can not be subjected to the influence of bonding agent and produce mobile, so what probe tile can be firm is arranged on the correct position, add it is to adopt one chip 10, thereby as long as the insertion that probe tile is correct, so comparatively easy and accurate in manufacturing process, and then reduce manufacturing cost.In addition, because probe tile adopts Open architecture, therefore the operator can be before detecting liquid crystal panel, checks the situation that contacts of probe tile and this liquid crystal panel easily, when occurring as if the situation that has probe tile to contact with liquid crystal panel, promptly represent the probe tile damage, then need to change probe 40 test of switching on again, therefore can save the time-histories of making assembling at the utility model probe assembly, and in use, improve the efficient of test fluid crystal panel, therefore have more practicality and marketability.

More than disclosed only be several specific embodiment of the present utility model, still, the utility model is not limited thereto, any those skilled in the art can think variation all should fall into protection domain of the present utility model.

Claims

1, a kind of probe assembly is characterized in that, comprising:

2, probe assembly according to claim 1 is characterized in that, described probe tile includes a plurality of first probe tile and a plurality of second probe tile, and first, second probe tile is arranged at intervals in a plurality of group connecting parts of described chip.

3, probe assembly according to claim 2, it is characterized in that, described first and second probe tile is respectively equipped with a panel contact site and circuit contacts portion in its two side ends, described panel contact site has one to lower prong, described circuit contacts portion has one to upper prong, and described lamellar body root edge convexes with fixed part.