TW200508617A - Probe unit and its manufacturing method - Google Patents

Probe unit and its manufacturing method

Info

Publication number
TW200508617A
TW200508617A TW093112700A TW93112700A TW200508617A TW 200508617 A TW200508617 A TW 200508617A TW 093112700 A TW093112700 A TW 093112700A TW 93112700 A TW93112700 A TW 93112700A TW 200508617 A TW200508617 A TW 200508617A
Authority
TW
Taiwan
Prior art keywords
probes
tips
base
probe unit
probe
Prior art date
Application number
TW093112700A
Other languages
Chinese (zh)
Other versions
TWI236535B (en
Inventor
Atsuo Hattori
Shuichi Sawada
Original Assignee
Yamaha Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaha Corp filed Critical Yamaha Corp
Publication of TW200508617A publication Critical patent/TW200508617A/en
Application granted granted Critical
Publication of TWI236535B publication Critical patent/TWI236535B/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

A probe unit comprises a comb-shaped probe sheet having a base 20 and a plurality of probes 10, each probe 10 having a tip 12 wider than a projection base 14 that are connected with other projection bases 14 by the base 20. By widening the tips 12 of the probes 10, it is prevented that the probes are left out from top surfaces of electrodes of a sample. Further, by making the tips 12 anomalous in a direction of the arrangement of the probes 10, the tips 12 can be widened without enlarging a pitch of central axes of the probes 10. Therefore, a minimum distance between the probes 10 adjacent in the direction of the arrangement can be shortened, and usage to a sample having a plurality of long and narrow electrodes aligned in parallel can be improved without narrowing the pitch of the probes 10.
TW093112700A 2003-05-08 2004-05-05 Probe unit and its manufacturing method TWI236535B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003130529A JP2004333332A (en) 2003-05-08 2003-05-08 Probe unit and its manufacturing method

Publications (2)

Publication Number Publication Date
TW200508617A true TW200508617A (en) 2005-03-01
TWI236535B TWI236535B (en) 2005-07-21

Family

ID=33506027

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093112700A TWI236535B (en) 2003-05-08 2004-05-05 Probe unit and its manufacturing method

Country Status (4)

Country Link
JP (1) JP2004333332A (en)
KR (1) KR100593778B1 (en)
CN (2) CN1296716C (en)
TW (1) TWI236535B (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100748393B1 (en) * 2007-02-27 2007-08-10 주식회사 파이컴 Substrate structure and probe card having the same
KR101074167B1 (en) * 2008-11-18 2011-10-17 주식회사 코디에스 Probe assembly
TWI392872B (en) * 2009-04-10 2013-04-11 Chipmos Technologies Inc Probe card assembly and probe holder thereof
JP5193934B2 (en) * 2009-04-28 2013-05-08 株式会社日本マイクロニクス Inspection method of electrical parts
JPWO2011024303A1 (en) * 2009-08-31 2013-01-24 株式会社アドバンテスト Probe, probe card and electronic component testing apparatus
US10410768B2 (en) * 2017-02-28 2019-09-10 Greganna Unlimited Company Probe assembly having cable assembly with wire pairs
CN106959381A (en) * 2017-03-22 2017-07-18 京东方科技集团股份有限公司 A kind of panel tester
CN107131974B (en) * 2017-05-08 2019-08-23 北京航空航天大学 A kind of temperature probe comb with air-breathing branching rod structure
CN112730925B (en) * 2019-10-14 2024-03-19 台湾中华精测科技股份有限公司 Staggered probe card
TWI712802B (en) * 2020-01-21 2020-12-11 中華精測科技股份有限公司 Probe card device and neck-like probe thereof
CN113848356B (en) * 2021-10-25 2024-05-03 武汉精毅通电子技术有限公司 Probe module and preparation method thereof
JP2023064802A (en) * 2021-10-27 2023-05-12 株式会社ヨコオ Flexible substrates and inspection jig
CN116430088B (en) * 2023-06-13 2023-11-24 南方科技大学 Probe and preparation method thereof

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100212169B1 (en) * 1996-02-13 1999-08-02 오쿠보 마사오 Probe, manufacture of same, and vertically operative type probe card assembly employing the same
JP2001056346A (en) * 1999-08-19 2001-02-27 Fujitsu Ltd Probe card and method for testing wafer on which a plurality of semiconductor device are formed
JP3440243B2 (en) * 2000-09-26 2003-08-25 株式会社アドバンストシステムズジャパン Spiral contactor

Also Published As

Publication number Publication date
TWI236535B (en) 2005-07-21
KR20040095693A (en) 2004-11-15
CN1296716C (en) 2007-01-24
KR100593778B1 (en) 2006-06-30
CN2802510Y (en) 2006-08-02
CN1550785A (en) 2004-12-01
JP2004333332A (en) 2004-11-25

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees