JP2001223446A - Fpc circuit board, method for mounting chip component on fpc board and method of manufacturing fpc board - Google Patents
Fpc circuit board, method for mounting chip component on fpc board and method of manufacturing fpc boardInfo
- Publication number
- JP2001223446A JP2001223446A JP2000038123A JP2000038123A JP2001223446A JP 2001223446 A JP2001223446 A JP 2001223446A JP 2000038123 A JP2000038123 A JP 2000038123A JP 2000038123 A JP2000038123 A JP 2000038123A JP 2001223446 A JP2001223446 A JP 2001223446A
- Authority
- JP
- Japan
- Prior art keywords
- fpc board
- mounting
- fpc
- product
- chip component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明はＦＰＣ回路基板、Ｆ
ＰＣ基板へのチップ部品の実装方法及びＦＰＣ基板の製
造方法に係わり、特に、補強板付きＦＰＣ基板へのチッ
プ部品実装技術の改良関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an FPC circuit board,
The present invention relates to a method for mounting a chip component on a PC board and a method for manufacturing an FPC board, and more particularly to an improvement in a technique for mounting a chip component on an FPC board with a reinforcing plate.
【０００２】[0002]
【従来の技術】ＦＰＣ基板（Ｆｌｅｘｂｌｅ Ｐｒｉｎ
ｔｅｄ Ｃｉｒｃｕｉｔ基板）は紙フェノール基板やガ
ラエポ（ガラス・エポキシ）基板と比較して、非常に厚
みが薄く、柔軟性に富んでいる為に近年、小型電子機器
の回路を構成する基材として中心的役割を果たす様にな
ってきた。しかしながら、ＦＰＣ基板単品では強度、平
坦度、熱伸縮性等の特性により、チップ部品の実装に関
しては紙フェノール基板やガラエポ基板と同様に取り扱
う事ができない。2. Description of the Related Art FPC boards (Flexible Principles)
In recent years, the ted circuit substrate is very thin and flexible compared to the paper phenol substrate and the glass epoxy (glass epoxy) substrate. It has come to play a role. However, the mounting of chip components cannot be handled in the same manner as a paper phenol substrate or a glass epoxy substrate due to characteristics such as strength, flatness, and thermal expansion and contraction of an FPC substrate alone.
【０００３】そこで、チップ部品の実装を実現する方法
の一つとして、ステンレス材等で作成された搬送パレッ
トの上に、ＦＰＣ基板を接着テープにて固定して位置決
めし、ステンレス板を補強板として使用することによっ
て、チップ部品の搭載を行う方法が採用されている。こ
のような技術に関しては、例えば特開平１１−６７８２
２号公報に記載されている。Therefore, as one of the methods for realizing the mounting of chip parts, an FPC board is fixed and positioned with an adhesive tape on a transport pallet made of stainless steel or the like, and a stainless steel plate is used as a reinforcing plate. A method of mounting a chip component by using it is adopted. Regarding such a technique, for example, Japanese Patent Application Laid-Open No. 11-6782
No. 2 discloses this.
【０００４】[0004]
【発明が解決しようとする課題】上記従来技術では、搬
送パレットへの接着テープによる固定が可能なもの、た
とえば、搭載部品の少ない製品については比較的対応可
能である。しかしながら高密度実装に対応しようとする
と次の様な問題が発生する。すなわち、基板に搭載され
る部品数が多い為に、チップ部品実装部分を裏面から補
強する範囲が広範囲にわたり、その全ての範囲で平坦度
を満足する様にＦＰＣ基板を搬送パレットに位置決めし
て貼る必要があるが、その位置決めバラツキ、および搬
送パレットやＦＰＣ基板に反り等が存在するとチップ部
品の搭載不良、搭載位置ずれ等の不良が発生する。ま
た、ＦＰＣ基板を搬送パレットに位置決めして接着テー
プで貼るという作業が高密度実装という条件の元では、
接着テープを貼る箇所にチップ部品が存在しては不可能
な為、作業は手作業になり、位置ずれが起こる可能性が
ある。よって、前述の不良を誘発する可能性が高く、不
向きである。The above-mentioned prior art is relatively compatible with products that can be fixed to a transport pallet with an adhesive tape, for example, products with few mounted components. However, the following problems occur when trying to cope with high-density mounting. In other words, since the number of components mounted on the substrate is large, the range in which the chip component mounting portion is reinforced from the back surface is wide, and the FPC substrate is positioned and adhered to the transport pallet so as to satisfy the flatness in the entire range. It is necessary, but if the positioning variation and the warpage of the transport pallet or the FPC board are present, defects such as defective mounting of chip components and displacement of mounting position occur. Also, under the condition of high-density mounting, the work of positioning the FPC board on the transport pallet and attaching it with adhesive tape,
Since it is impossible if there is a chip component at the position where the adhesive tape is applied, the operation is manual, and there is a possibility that displacement occurs. Therefore, the possibility of inducing the above-mentioned failure is high and is not suitable.
【０００５】別の技術としては、ＦＰＣ基板の部品実装
部の裏面にガラエポ材等を使用した補強板を貼り付け、
ＦＰＣ基板の強度を増し、紙フェノール基板やガラエポ
基板と同じ扱いのチップ実装を適用する技術が存在す
る。しかしながら、その為には補強材の厚みを０．８ｍ
ｍ〜１．０ｍｍにする必要があり、ＦＰＣ基板の特徴で
ある厚みと柔軟性に対して相反する形態を取ることにな
る。As another technique, a reinforcing plate using a glass epoxy material or the like is attached to the back surface of the component mounting portion of the FPC board,
There is a technique for increasing the strength of an FPC board and applying chip mounting that is handled in the same manner as a paper phenol board or a glass epoxy board. However, for that purpose the thickness of the reinforcing material must be 0.8m
It is necessary to set the thickness to m to 1.0 mm, which is a contradiction to the thickness and flexibility, which are characteristics of the FPC board.
【０００６】本発明の目的はＦＰＣ基板へのチップ部品
実装時において、ＦＰＣ基板の強度、平坦度を確保し、
確実なチップ部品実装ができ、しかもＦＰＣ基板の特徴
を損なわない様にしたチップ部品の実装技術を提供する
ことにある。An object of the present invention is to secure the strength and flatness of an FPC board when mounting chip components on the FPC board,
It is an object of the present invention to provide a chip component mounting technique that can surely mount a chip component and does not impair the characteristics of an FPC board.
【０００７】[0007]
【課題を解決するための手段】本発明においては、ＦＰ
Ｃ基板の製品部分範囲とそれ以外の全ての範囲に厚み
０．３ｍｍの補強板を貼り、重ねて製品外部分に厚み
０．５ｍｍの補強板を貼る２層構造とした。１層目に
０．３ｍｍ厚の補強板を貼ることにより、製品部分を単
品にした時にでも、ある程度の強度を持たせることが可
能となり、さらに０．５ｍｍの補強板を貼り合わせるこ
とで、チップ部品実装時の基板強度を紙フェノール基板
やガラエポ基板と同等の強度まで高めることができる
為、チップ部品の確実な実装が可能となり、しかも加熱
した際に生じるＦＰＣ基板の反りも防止することができ
る。According to the present invention, an FP is provided.
A two-layer structure in which a 0.3 mm-thick reinforcing plate is stuck on the product part area of the C substrate and all other areas, and a 0.5 mm-thick reinforcing plate is stuck on the outer part of the product. By attaching a 0.3 mm thick reinforcing plate to the first layer, it is possible to have a certain level of strength even when the product part is made as a single item. Since the board strength at the time of component mounting can be increased to the same strength as a paper phenol board or a glass epoxy board, chip components can be reliably mounted, and the warpage of the FPC board that occurs when heated can be prevented. .
【０００８】また、前述の発明のＦＰＣ基板に対応した
搭載ステージとする為に、搭載ステージに補強板０．３
ｍｍ厚の範囲と０．５ｍｍ厚の範囲に合致する様に凹凸
形状とした。この形状を採用する事により、ＦＰＣ基板
を搭載ステージに配置した時のＦＰＣ基板平坦度が確保
され、チップ部品の確実な実装が可能となる。また、搭
載ステージにＦＰＣ基板を配置する時の位置決めを行う
為に、搭載ステージにガイド突部を設け、そのガイド突
部に対応するガイド穴をＦＰＣ基板にあけて、ＦＰＣ基
板のガイド穴をそのガイド突部に合わせて配置すること
によって、位置決めが完了するように構成した。この方
法を採用したこにより、従来、ＦＰＣ基板の位置決めを
するために行っていたテープ貼りの作業は不要となる。Further, in order to provide a mounting stage corresponding to the FPC board of the invention described above, a reinforcing plate 0.3 is provided on the mounting stage.
The projections and recesses were formed so as to conform to the range of 0.5 mm thickness and the range of 0.5 mm thickness. By adopting this shape, the flatness of the FPC board when the FPC board is arranged on the mounting stage is ensured, and the chip components can be reliably mounted. Further, in order to perform positioning when the FPC board is arranged on the mounting stage, a guide projection is provided on the mounting stage, and a guide hole corresponding to the guide projection is formed on the FPC board, and the guide hole of the FPC board is formed. The positioning is completed by arranging it in accordance with the guide projection. By adopting this method, the tape attaching operation conventionally performed for positioning the FPC board becomes unnecessary.
【０００９】以下、本発明を更に詳細に説明する。本発
明の目的を達成するために、第１の発明では、ＦＰＣ回
路基板は、ＦＰＣ基板に製品部分と製品外部分とを設
け、前記製品部分と前記製品外部分に第１の補強板を設
け、前記製品外部分に第２の補強板を設け、前記製品部
分に部品を搭載するように構成される。第１の発明にお
いて、部品搭載後、前記製品外部分を切り離すように構
成される。Hereinafter, the present invention will be described in more detail. In order to achieve the object of the present invention, in the first invention, the FPC circuit board has a product part and an external part provided on the FPC board, and a first reinforcing plate provided on the product part and the external part. A second reinforcing plate is provided on the outer portion of the product, and a component is mounted on the product portion. In the first invention, after the components are mounted, the outer part of the product is separated.
【００１０】第２の発明では、 ＦＰＣ基板へのチップ
部品実装方法は、ＦＰＣ基板に製品部分と製品外部分と
を設け、前記製品部分と前記製品外部分に第１の補強板
を設け、前記製品外部分に第２の補強板を設け、前記製
品部分にチップ部品を実装する。第２の発明において、
前記ＦＰＣ基板にチップ部品を実装する場合に、前記Ｆ
ＰＣ基板の前記製品外部分と前記製品部分の段差を補正
するように形成された搭載ステージに前記ＦＰＣ基板を
搭載して、前記ＦＰＣ基板を装着した際の平坦度を確保
してチップ部品を実装する。また、この発明において、
前記搭載ステージの前記ＦＰＣ基板の前記製品部分が搭
載される部分に、前記ＦＰＣ基板の前記製品外部分と前
記製品部分の段差に応じた高さの突起を設けてもよい。
また、第２の発明において、前記搭載ステージにガイド
突起を設け、前記ＦＰＣ基板にガイド穴を設け、前記ガ
イド突起に前記ガイド穴を挿入して、前記ＦＰＣ基板を
前記搭載ステージに位置決めした後、前記ＦＰＣ基板に
チップ部品を実装する。In a second aspect of the present invention, a method for mounting a chip component on an FPC board includes providing a product section and an external section on the FPC board, providing a first reinforcing plate on the product section and the external section, A second reinforcing plate is provided on an outer part of the product, and a chip component is mounted on the product part. In the second invention,
When mounting chip components on the FPC board, the FPC
The FPC board is mounted on a mounting stage formed so as to correct a step between the outer part of the PC board and the product part, and a chip component is mounted while ensuring flatness when the FPC board is mounted. I do. In the present invention,
A projection having a height corresponding to a step between the outer part of the FPC board and the product part may be provided on a part of the mounting stage on which the product part of the FPC board is mounted.
Further, in the second invention, a guide projection is provided on the mounting stage, a guide hole is provided on the FPC board, the guide hole is inserted into the guide projection, and the FPC board is positioned on the mounting stage. A chip component is mounted on the FPC board.
【００１１】第３の発明では、ＦＰＣ基板へのチップ部
品実装方法は、ＦＰＣ基板へのチップ部品実装方法製品
部分と製品外部分とから構成され、前記製品部分と前記
製品外部分に第１の補強板を設け、前記製品外部分に第
２の補強板を設けたＦＰＣ基板を、前記ＦＰＣ基板の前
記製品外部分と前記製品部分の段差を補正するように形
成された搭載ステージに位置決め搭載し、前記ＦＰＣ基
板単体の前記製品部分に半田ペーストによってチップ部
品を装着し、前記チップ部品が装着された前記ＦＰＣ基
板単体を加熱しすることによって、前記チップ部品を実
装する。第３の発明において、前記チップ部品が搭載さ
れた前記製品部分を前記製品外部分から切り離す。According to a third aspect of the present invention, a method for mounting a chip component on an FPC board includes a method for mounting a chip component on an FPC board, comprising a product part and an external part. An FPC board provided with a reinforcing plate and a second reinforcing plate provided on the outer part of the product is positioned and mounted on a mounting stage formed so as to correct a step between the outer part and the product part of the FPC board. The chip component is mounted on the product portion of the FPC board unit by solder paste, and the FPC board unit on which the chip component is mounted is heated to mount the chip component. In a third aspect, the product part on which the chip component is mounted is separated from the external part.
【００１２】第４の発明では、 ＦＰＣ基板の製造方法
は、窓を設けた補強板を、前記補強板と略同寸法の基板
に取付け、前記補強板の窓に対応する前記基板部分をチ
ップ部品の実装領域とし、前記実装領域にチップ部品を
実装し、前記実装領域を他の部分から分離することによ
ってＦＰＣ基板を製造する。第４の発明において、前記
基板は、フィルムと、銅箔部と、前記補強板より薄い他
の補強板から構成される。According to a fourth aspect of the present invention, in the method for manufacturing an FPC board, a reinforcing plate provided with a window is attached to a substrate having substantially the same size as the reinforcing plate, and the substrate portion corresponding to the window of the reinforcing plate is attached to a chip component. Then, a chip component is mounted in the mounting area, and the mounting area is separated from other parts to manufacture an FPC board. In a fourth aspect, the substrate includes a film, a copper foil portion, and another reinforcing plate thinner than the reinforcing plate.
【００１３】[0013]
【発明の実施の形態】以下、本発明の実施の形態につい
て、実施例を用い、図を参照して説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings using examples.
【００１４】図１は本発明によるＦＰＣ基板の一実施例
を示す断面図である。ＦＰＣ基板の基本的な構造はポリ
イミド材で形成されたベースフィルム部１に銅箔部２が
接着剤１７ａで接着され、その上からベースフィルム部
１と同じくポリイミド材のカバーフィルム部３が接着剤
１７ｂで接着された構造になっている。ＦＰＣ基板上に
チップ部品４を実装する部分である実装領域について
は、カバーフィルム部３がチップ部品４の電極５の大き
さに応じて切り抜かれおり、その部分は銅箔露出部６と
なっている。この銅箔露出部６にチップ部品４の電極５
を半田付けするには、銅箔露出部６にペースト状の半田
を塗布し、このペースト状半田の上にチップ部品４の電
極５を押圧して取付けた後、ＦＰＣキバン全体を加熱す
る。FIG. 1 is a sectional view showing an embodiment of an FPC board according to the present invention. The basic structure of the FPC board is such that a copper foil portion 2 is bonded to a base film portion 1 made of a polyimide material with an adhesive 17a, and a cover film portion 3 made of a polyimide material like the base film portion 1 is bonded thereto from above. The structure is bonded by 17b. In a mounting area where the chip component 4 is mounted on the FPC board, the cover film portion 3 is cut out according to the size of the electrode 5 of the chip component 4, and the portion becomes a copper foil exposed portion 6. I have. The electrode 5 of the chip component 4 is
Is soldered to the exposed portion 6 of the copper foil, the electrode 5 of the chip component 4 is pressed onto the solder paste, and then the entire FPC kiban is heated.
【００１５】このように、銅箔露出部６の部分にチップ
部品４を実装する為には、補強板をチップ部品４搭載面
とは反対側に設けてやる必要がある。このために、図１
に示す実施例においては、厚み０．３ｍｍの第１の補強
板７がベースフィルムに接着剤１７ｃで接着されてい
る。この状態でのＦＰＣ基板全体の厚みは第１の補強板
７と合わせて約０．４ｍｍ程しかない為、部品を実装す
るにはまだ強度的に不足しており、また加熱した後にＦ
ＰＣ基板に反りが発生する可能性が高い。そこで、製品
部分以外の範囲に第２の補強板８を設ける。このため
に、第２補強板８の実装領域に相当する部分に窓、又は
穴を設ける。この第２の補強板８は、たとえば、ガラス
エポキシ、金属板、紙フェノール等で形成され、０．５
ｍｍ厚程度の厚さを持っている。第２の補強板８は第１
の補強板７に重ねられ接着剤１７ｄで接着される。これ
によって、製品部分の範囲の補強板の厚みは０．３ｍｍ
程度となり、製品部分以外の範囲の補強板の厚みは約
０．８ｍｍとなる。As described above, in order to mount the chip component 4 on the exposed portion 6 of the copper foil, it is necessary to provide a reinforcing plate on the side opposite to the chip component 4 mounting surface. For this purpose, FIG.
In the embodiment shown in (1), a first reinforcing plate 7 having a thickness of 0.3 mm is bonded to a base film with an adhesive 17c. Since the total thickness of the FPC board in this state is only about 0.4 mm in total with the first reinforcing plate 7, it is still insufficient in strength to mount components,
It is highly possible that the PC board is warped. Therefore, the second reinforcing plate 8 is provided in a range other than the product portion. For this purpose, a window or a hole is provided in a portion corresponding to a mounting area of the second reinforcing plate 8. The second reinforcing plate 8 is formed of, for example, glass epoxy, a metal plate, paper phenol, or the like, and has a thickness of 0.5 mm.
It has a thickness of about mm. The second reinforcing plate 8 is a first reinforcing plate.
And is adhered with an adhesive 17d. Thereby, the thickness of the reinforcing plate in the range of the product part is 0.3 mm.
And the thickness of the reinforcing plate in the area other than the product part is about 0.8 mm.
【００１６】次に、図２を用いてＦＰＣ基板の全体につ
いて説明する。図２（ａ）は本発明によるＦＰＣ基板の
正面図、図２（ｂ）、（ｃ）は側面図である。図１の実
施例に基づいて説明すると、図２において、製品部分９
は０．３ｍｍ厚の補強板、製品外部分１０が０．８ｍｍ
厚の補強板という構成となる。次いで、ＦＰＣ基板の製
品外部分１０には、後述する搭載ステージ１３との位置
決めに使用するガイド穴１２が２箇所設けてある。製品
部分９はチップ部品実装後、製品外部分１０と接続され
ている数カ所のミシン目部分１１を専用の治具で切断
し、製品の形状とする。Next, the entire FPC board will be described with reference to FIG. FIG. 2A is a front view of an FPC board according to the present invention, and FIGS. 2B and 2C are side views. Referring to the embodiment of FIG. 1, in FIG.
Is a 0.3 mm thick reinforcing plate, and the outer part 10 of the product is 0.8 mm
The structure is a thick reinforcing plate. Next, two guide holes 12 are provided in the outer part 10 of the FPC board for use in positioning with a mounting stage 13 described later. After mounting the chip parts on the product part 9, several perforated parts 11 connected to the external part 10 are cut with a special jig to obtain a product shape.
【００１７】図３（ａ）は本発明によるＦＰＣ基板にチ
ップ部品を実装する際に使用する搭載ステージの一実施
例を示す正面図、図３（ｂ）、（ｃ）は側面図である。
搭載ステージ１３には２ヶ所に直径３．０ｍｍ程度のガ
イド突部１４が設けてあり、ＦＰＣ基板が搭載ステージ
１３へ載置される時の位置決めとしての役目を果たす。
ＦＰＣ基板に設けられた２ヶ所のガイド穴１２を搭載ス
テージ１３のガイド突部１４に嵌合させて配置すること
により、ＦＰＣ基板の位置決めが完了する。また、搭載
ステージ１３のＦＰＣ基板が配置される所定の位置の
内、製品部分が位置する部分には前述のＦＰＣ基板の製
品部分９の凹みの厚み（略第２の補強板の厚さ）と同等
な高さを有する支え突部１５を複数有し、ＦＰＣ基板の
製品部分を十分に保持可能な様に配置してある。以上の
様な搭載ステージ１３の形態を採用することによってＦ
ＰＣ基板の平坦度を確保、位置決めも確実に行うことが
できる為、確実なチップ部品の実装を行うことが可能と
なるのである。FIG. 3A is a front view showing an embodiment of a mounting stage used when mounting a chip component on an FPC board according to the present invention, and FIGS. 3B and 3C are side views.
The mounting stage 13 is provided with guide projections 14 having a diameter of about 3.0 mm at two places, and serves as a positioning when the FPC board is mounted on the mounting stage 13.
The positioning of the FPC board is completed by fitting and arranging the two guide holes 12 provided on the FPC board with the guide projections 14 of the mounting stage 13. Further, among the predetermined positions of the mounting stage 13 where the FPC board is arranged, the part where the product part is located has the thickness of the recess (about the thickness of the second reinforcing plate) of the product part 9 of the FPC board described above. It has a plurality of support protrusions 15 having the same height, and is arranged so as to sufficiently hold the product portion of the FPC board. By adopting the form of the mounting stage 13 as described above, F
Since the flatness of the PC board can be ensured and the positioning can be performed reliably, it is possible to mount the chip components reliably.
【００１８】本実施例においては、一例として、第１の
補強板７の厚みを約０．３ｍｍとし、第２の補強板８の
厚みを約０．５ｍｍとしたが、これら補強板７、８の厚
さはこれに拘泥されない。第１の補強板７はなるべく薄
いほうがよいが、あまり薄いと強度不十分になるため、
要はチップ部品４を搭載する時に、チップ部品４をＦＰ
Ｃ基板に押し付けるが、このとき、ＦＰＣ基板が大きく
撓まない程度の強度が保たれていればよい。すなわち、
チップ部品４を搭載した時、チップ部品４の搭載位置が
狂わなければよい。チップ部品４が搭載されたＦＰＣ基
板は搬送され、加熱室で加熱されるが、第２の補強板８
を設けることによって、チップ部品４が搭載されたＦＰ
Ｃ基板を加熱して半田付けを行う最のＦＰＣ基板の反り
を防止することが出来る。すなわち、ＦＰＣ基板を加熱
すると、ＦＰＣ基板を構成する各種材料によって、熱膨
張率が異なるため、ＦＰＣ基板は一方の面に凸に反る。
このＦＰＣ基板を冷却すると、今度は反対の面に凸に反
りが生じる。第２の補強板によりこのそりを防止するこ
とが出来る。したがって、第２の補強板８は冷却した時
のＦＰＣ基板に許容以上のそりが生じない程度の厚さ又
は強度があればよい。また、この第２の補強板８によっ
て、ＦＰＣ基板搬送時のＦＰＣ基板の変形が防止され、
それによる破損を防止することができる。In this embodiment, as an example, the thickness of the first reinforcing plate 7 is about 0.3 mm and the thickness of the second reinforcing plate 8 is about 0.5 mm. The thickness is not limited to this. The first reinforcing plate 7 is preferably as thin as possible, but if it is too thin, the strength becomes insufficient.
In short, when mounting the chip component 4, the chip component 4
The substrate is pressed against the C substrate. At this time, it is sufficient that the strength is maintained so that the FPC substrate is not largely bent. That is,
When the chip component 4 is mounted, it is sufficient that the mounting position of the chip component 4 does not change. The FPC board on which the chip components 4 are mounted is transported and heated in a heating chamber.
To provide an FP on which the chip component 4 is mounted.
It is possible to prevent the warp of the FPC board at the time of soldering by heating the C board. That is, when the FPC board is heated, the coefficient of thermal expansion differs depending on various materials constituting the FPC board, so that the FPC board is warped convexly on one surface.
When the FPC board is cooled, the opposite surface is convexly warped. This warping can be prevented by the second reinforcing plate. Therefore, the second reinforcing plate 8 only needs to have a thickness or strength that does not cause unacceptable warpage of the FPC board when cooled. Further, the deformation of the FPC board at the time of transporting the FPC board is prevented by the second reinforcing plate 8,
Damage due to this can be prevented.
【００１９】本発明によれば、チップ部品の実装時に搭
載ステージに設けた突起部に対応したＦＰＣ基板の穴を
合わせて、ＦＰＣ基板を載置することによって、ＦＰＣ
基板の位置決めを簡単に行うことができる。また、ＦＰ
Ｃ基板の製品部分には第１の補強板を取付け、それ以外
の製品外部分には第１及び第２の補強板を取付けた２層
構造にしたこにより、ＦＰＣ基板の強度、平坦度を確保
し、確実なチップ部品の実装を可能にした。しかも、加
熱時のＦＰＣ基板の反りを防止することが可能となる。According to the present invention, by mounting the FPC board by aligning the holes of the FPC board corresponding to the projections provided on the mounting stage when mounting the chip component,
The substrate can be easily positioned. Also, FP
The strength and flatness of the FPC board are reduced by forming a two-layer structure in which the first reinforcing board is attached to the product part of the C board and the first and second reinforcing boards are attached to the other outer parts of the product. And ensured mounting of chip components. In addition, it is possible to prevent the FPC board from warping during heating.
【００２０】[0020]
【発明の効果】本発明によれば、ＦＰＣ基板の強度、平
坦度を確保し、確実にチップ部品を実装することが出来
る。また、加熱時のＦＰＣ基板の反りを防止するこがで
きる。According to the present invention, the strength and flatness of the FPC board can be ensured, and chip components can be mounted reliably. In addition, warpage of the FPC board during heating can be prevented.
【図１】本発明によるＦＰＣ基板の一実施例を示す断面
図である。FIG. 1 is a sectional view showing an embodiment of an FPC board according to the present invention.
【図２】本発明によるＦＰＣ基板の正面図及び側面図で
ある。FIG. 2 is a front view and a side view of an FPC board according to the present invention.
【図３】本発明によるＦＰＣ基板にチップ部品を実装す
る際に使用する搭載ステージの一実施例を示す正面図及
び側面図であるFIG. 3 is a front view and a side view showing one embodiment of a mounting stage used when mounting a chip component on an FPC board according to the present invention.
１…ベースフィルム、２…銅箔部、３…カバーフィル
ム、４…チップ部品、５…電極、６…銅箔露出部、７…
第１の補強板、８…第２の補強板、９…製品部分、１０
…製品外部分、１１…ミシン目、１２…ガイド穴、１３
…搭載ステージ、１４…ガイド突部、１５…支え突部。DESCRIPTION OF SYMBOLS 1 ... Base film, 2 ... Copper foil part, 3 ... Cover film, 4 ... Chip parts, 5 ... Electrode, 6 ... Copper foil exposed part, 7 ...
1st reinforcing plate, 8 ... second reinforcing plate, 9 ... product part, 10
... Outside part of product, 11 ... Perforation, 12 ... Guide hole, 13
... Mounting stage, 14 ... Guide projection, 15 ... Support projection.
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 5E336 AA04 BB01 BB12 BC01 CC31 DD24 DD32 DD37 DD40 EE03 EE07 GG01 GG06 GG09 GG16 5E338 AA12 BB02 BB13 BB31 BB72 BB75 CC01 EE01 EE26 EE33 EE51 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5E336 AA04 BB01 BB12 BC01 CC31 DD24 DD32 DD37 DD40 EE03 EE07 GG01 GG06 GG09 GG16 5E338 AA12 BB02 BB13 BB31 BB72 BB75 CC01 EE01 EE26 EE33 EE51
Claims (10)
け、前記製品部分と前記製品外部分に第１の補強板を設
け、前記製品外部分に第２の補強板を設け、前記製品部
分に部品を搭載することを特徴とするＦＰＣ回路基板。1. A product part and an external part are provided on an FPC board, a first reinforcing plate is provided on the product part and the external part, and a second reinforcing plate is provided on the external part. An FPC circuit board characterized by mounting components on a part.
部品搭載後、前記製品外部分を切り離すことを特徴とす
るＦＰＣ回路基板。2. The FPC circuit board according to claim 1,
An FPC circuit board, wherein after the parts are mounted, the outer part of the product is cut off.
け、前記製品部分と前記製品外部分に第１の補強板を設
け、前記製品外部分に第２の補強板を設け、前記製品部
分にチップ部品を実装することを特徴とするＦＰＣ基板
へのチップ部品実装方法。3. A product part and an external part are provided on an FPC board, a first reinforcing plate is provided on the product part and the external part, and a second reinforcing plate is provided on the external part. A method for mounting a chip component on an FPC board, wherein the chip component is mounted on a portion.
実装方法において、前記ＦＰＣ基板にチップ部品を実装
する場合に、前記ＦＰＣ基板の前記製品外部分と前記製
品部分の段差を補正するように形成された搭載ステージ
に前記ＦＰＣ基板を搭載して、前記ＦＰＣ基板を装着し
た際の平坦度を確保してチップ部品を実装することを特
徴とするＦＰＣ基板へのチップ部品実装方法。4. A method for mounting a chip component on an FPC board according to claim 3, wherein when mounting the chip component on the FPC board, a step between the outer part and the product part of the FPC board is corrected. Mounting the FPC board on a mounting stage formed on the FPC board, and mounting the chip component while securing flatness when the FPC board is mounted.
実装方法において、前記搭載ステージの前記ＦＰＣ基板
の前記製品部分が搭載される部分に、前記ＦＰＣ基板の
前記製品外部分と前記製品部分の段差に応じた高さの突
起を設けることを特徴とするＦＰＣ基板へのチップ部品
実装方法。5. The method for mounting a chip component on an FPC board according to claim 4, wherein the outer portion and the product portion of the FPC board are mounted on a portion of the mounting stage where the product portion of the FPC board is mounted. A method for mounting a chip component on an FPC board, comprising: providing a projection having a height corresponding to a step of the FPC board.
実装方法において、前記搭載ステージにガイド突起を設
け、前記ＦＰＣ基板にガイド穴を設け、前記ガイド突起
に前記ガイド穴を挿入して、前記ＦＰＣ基板を前記搭載
ステージに位置決めした後、前記ＦＰＣ基板にチップ部
品を実装することを特徴とするＦＰＣ基板へのチップ部
品実装方法。6. The method of mounting a chip component on an FPC board according to claim 3, wherein a guide projection is provided on the mounting stage, a guide hole is provided on the FPC board, and the guide hole is inserted into the guide projection. A method for mounting a chip component on an FPC board, comprising positioning the FPC board on the mounting stage and then mounting a chip component on the FPC board.
記製品部分と前記製品外部分に第１の補強板を設け、前
記製品外部分に第２の補強板を設けたＦＰＣ基板を、前
記ＦＰＣ基板の前記製品外部分と前記製品部分の段差を
補正するように形成された搭載ステージに位置決め搭載
し、前記ＦＰＣ基板単体の前記製品部分に半田ペースト
によってチップ部品を装着し、前記チップ部品が装着さ
れた前記ＦＰＣ基板単体を加熱しすることによって、前
記チップ部品を実装することを特徴とするＦＰＣ基板へ
のチップ部品実装方法。7. An FPC board comprising a product part and a product outside part, wherein the product part and the product outside part are provided with a first reinforcing plate, and the product outside part is provided with a second reinforcing plate. The FPC board is positioned and mounted on a mounting stage formed so as to correct a step between the outer part and the product part of the FPC board, and a chip part is mounted on the product part of the FPC board alone by solder paste, and the chip part is mounted. And mounting the chip component by heating the FPC substrate alone on which the FPC board is mounted.
実装方法において、前記チップ部品が搭載された前記製
品部分を前記製品外部分から切り離すことを特徴とする
ＦＰＣ基板へのチップ部品実装方法。8. The method of mounting a chip component on an FPC board according to claim 7, wherein the product part on which the chip component is mounted is separated from an external part of the product.
法の基板に取付け、前記補強板の窓に対応する前記基板
部分をチップ部品の実装領域とし、前記実装領域にチッ
プ部品を実装し、前記実装領域を他の部分から分離する
ことによってＦＰＣ基板を製造することを特徴とするＦ
ＰＣ基板の製造方法。9. A reinforcing plate provided with a window is mounted on a substrate having substantially the same dimensions as the reinforcing plate, and the substrate portion corresponding to the window of the reinforcing plate is used as a mounting area for chip components. And mounting the FPC board by separating the mounting area from other parts.
A method for manufacturing a PC board.
おいて、前記基板は、フィルムと、銅箔部と、前記補強
板より薄い他の補強板からなることを特徴とするＦＰＣ
基板の製造方法。10. The method of manufacturing an FPC board according to claim 9, wherein said board comprises a film, a copper foil portion, and another reinforcing plate thinner than said reinforcing plate.
Substrate manufacturing method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000038123A JP2001223446A (en) | 2000-02-09 | 2000-02-09 | Fpc circuit board, method for mounting chip component on fpc board and method of manufacturing fpc board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000038123A JP2001223446A (en) | 2000-02-09 | 2000-02-09 | Fpc circuit board, method for mounting chip component on fpc board and method of manufacturing fpc board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001223446A true JP2001223446A (en) | 2001-08-17 |
Family
ID=18561910
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000038123A Pending JP2001223446A (en) | 2000-02-09 | 2000-02-09 | Fpc circuit board, method for mounting chip component on fpc board and method of manufacturing fpc board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001223446A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101369150B1 (en) | 2013-10-15 | 2014-03-04 | 주식회사 에스아이 플렉스 | Method of printing using a step jig |
| US9907163B2 (en) | 2016-03-18 | 2018-02-27 | Japan Display Inc. | Flexible circuit board and display device |
| CN112911792A (en) * | 2021-01-27 | 2021-06-04 | 惠州Tcl移动通信有限公司 | FPC assembly and surface mounting method |
-
2000
- 2000-02-09 JP JP2000038123A patent/JP2001223446A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101369150B1 (en) | 2013-10-15 | 2014-03-04 | 주식회사 에스아이 플렉스 | Method of printing using a step jig |
| US9907163B2 (en) | 2016-03-18 | 2018-02-27 | Japan Display Inc. | Flexible circuit board and display device |
| CN112911792A (en) * | 2021-01-27 | 2021-06-04 | 惠州Tcl移动通信有限公司 | FPC assembly and surface mounting method |
| CN112911792B (en) * | 2021-01-27 | 2022-04-22 | 惠州Tcl移动通信有限公司 | FPC assembly and surface mounting method |
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