JP4545017B2 - Electronic component fixing jig and electronic component processing method - Google Patents

Description

  The present invention relates to an electronic component fixing jig for mounting and fixing an electronic component that is difficult to handle, such as a flexible substrate, and fixing an electronic component for improving work efficiency, and an electronic component processing method.

A flexible substrate (also called FPC) is manufactured by laminating, for example, polyimide or copper foil, and a plurality of mounting parts are mounted through the same process as a hard printed circuit board, but it is thin and difficult to handle mechanically. Since there is a feature, it is fixed in advance on an electronic component fixing jig (also referred to as a work board) during work.
As shown in FIGS. 5 and 6, this type of electronic component fixing jig is formed by laminating an adhesion layer 3 that detachably holds a plurality of flexible substrates 10 on the surface of a flat substrate 1 (patent) Reference 1).

In the above, when mounting a mounting component on the flexible substrate 10, first, the flexible substrate 10 is held on the adhesion layer 3 of the electronic component fixing jig, and paste solder is applied to the surface thereof. Mount the mounting parts. Then, the flexible substrate 10 is set together with the electronic component fixing jig in the reflow furnace, heated to an appropriate temperature (for example, around 250 ° C.) through a method such as radiation or hot air, and the paste solder of the flexible substrate 10 is melted and soldered. A plurality of mounting components can be mounted on the flexible substrate 10.
JP 2002-338916 A

  The conventional electronic component fixing jig is configured as described above. When the temperature of the atmosphere becomes high due to hot air heating in a reflow furnace or the like, the adhesive force of the adhesive layer 3 is reduced, so that the flexible substrate 10 falls off. Or is blown away. In addition, since the flexible substrate 10 is manufactured in a multilayer structure with a plurality of materials made of polyimide, copper foil, or the like, a difference in linear expansion coefficient of each material is expressed as a warp as the reflow furnace is heated. As shown in FIG. 6, there is a high possibility that the peripheral edge is warped upward by 1 to 2 mm or deformed.

  As a means for solving such a problem, a method of improving the adhesion of the adhesion layer 3 at room temperature is conceivable. In this case, it is extremely difficult to remove the flexible substrate 10 from the electronic component fixing jig. In addition, a large problem arises that the flexible substrate 10 is warped at the time of peeling or the mounted components are dropped off.

  The present invention has been made in view of the above, and provides an electronic component fixing jig and a method for processing an electronic component that can prevent the electronic component from dropping, warping, deforming, or the like without increasing the adhesion of the adhesion layer. The purpose is that.

In the present invention, in order to solve the above-mentioned problems, a rigid base material, an adhesion layer laminated on the base material to removably hold the flexible substrate, and a mounting recess of the base material can be detachably inserted without any substantial gap. And an anti-deformation pin that locks and fixes the peripheral edge of the flexible substrate held by the adhesion layer, and is heated by being set in a reflow furnace with the flexible substrate held by the adhesion layer. ,
The deformation prevention pin is formed using a silicone rubber, fluorine rubber, or polyimide having a linear expansion coefficient larger than the linear expansion coefficient of the substrate, and the adhesion force of the deformation prevention pin to the mounting recess of the substrate is heated. It is characterized in that it is increased when the temperature of the atmosphere is high and decreased when the temperature of the heating atmosphere is low.

In addition, it can be set as the latching | locking part which extends the upper part of a deformation | transformation prevention pin to the width direction, and is hooked on a flexible substrate .

Further, in the present invention, in order to solve the above-described problem, a method of processing a flexible substrate using the electronic component fixing jig according to claim 1 or 2,
After the flexible substrate is held on the adhesive layer of the electronic component fixing jig, the deformation prevention pin is omitted in the mounting recess of the electronic component fixing jig before the flexible substrate is supplied together with the electronic component fixing jig to the heating device. The flexible board is positioned and fixed to the adhesion layer by inserting without gap.

Incidentally, by supplying solder to the flexible substrate is held by the adhesive layer of the electronic component fixture, with mounting the mounting component on the flexible substrate, the deformation preventing pin mounting recess of an electronic component fixing jig almost without gaps inserted Then, the flexible substrate is positioned and fixed to the adhesion layer, and then the flexible substrate is supplied together with the electronic component fixing jig to the heating device, and the solder of the flexible substrate can be melted and soldered.

Here, the flexible substrate in the claims includes a high-density flexible substrate, and may be a single or plural. One or more adhesion layers are provided on the substrate. In addition, the mounting recess is formed of a notch, a hole that penetrates, a hole that does not penetrate, and the like, and may be formed in the adhesion layer as long as it is formed in the base material.

The shape of the deformation prevention pin is a bush shape, a rivet shape, a cylindrical shape, an inverted cone shape, an inverted truncated cone shape, a prismatic shape, an inverted pyramid shape, an inverted truncated pyramid shape, an approximately J-shaped section, an approximately L-shaped section, an approximately T-shaped section, etc. It is said. The low temperature includes normal temperatures other than the high temperature.

According to the present invention, even if the adhesion force of the adhesive layer by heating is decreased, the deformation preventing pin tightly attached to the mounting recess by using a friction or expansion or the like handling secure the hard flexible substrate, a flexible substrate Can be prevented from falling off from the adhesive layer. In addition, since the deformation prevention pin is not fixed to the base material and can be attached to and detached from the base material, there is little trouble when processing the flexible substrate with solder, an adhesive, or the like.

In addition, according to the present invention, a flexible substrate that is difficult to handle is held on the adhesion layer of the electronic component fixing jig, and then solder, an adhesive, or the like is applied to the flexible substrate , or various mounting components are mounted. After the processing, until the flexible substrate is supplied together with the electronic component fixing jig to the heating device, the deformation preventing pins are inserted into the mounting recesses without any substantial gap to fix the flexible substrate to the adhesion layer. Thus, the temperature closely force atmosphere deformation preventing pin for mounting recess is difficult to pull out the deformation preventing pin increases in the case of high temperature, even adhesion even adhesion layer by heating is lowered, the flexible substrate It can be prevented from being blown away or deformed.

According to the present invention, there is an effect that it is possible to prevent an electronic component made of a flexible substrate that is difficult to handle from dropping, warping, deformation, or the like without increasing the adhesion of the adhesion layer. That is, the intimate force of the deformation prevention pin with respect to the base material increases when the temperature of the heating atmosphere is high, and decreases when the temperature of the heating atmosphere is low, so that the deformation prevention pin can be easily removed. Even when the adhesion force of the adhesion layer is reduced by hot air heating or the like, it is possible to effectively prevent the electronic component made of the flexible substrate from being dropped or blown off with a simple configuration.
Further, even if the anti-brazing due to the difference in linear expansion coefficients of the flexible substrate material, it is possible to eliminate the risk of or the periphery like warps of the flexible substrate, deformed. Since it is not necessary to improve the adhesion of the adhesion layer, without work of peeling the flexible substrate from the electronic component fixture becomes difficult, warped flexible substrate upon peeling, causing detachment of mounted components Nor. In addition, since the deformation prevention pin is not fixed to the base material but is detachable from the base material, it is possible to suppress troubles when screen-printing paste solder on the flexible substrate .
Further, if the engaging portion caught by the flexible substrate stretched upper deformation preventing pin in the width direction, the contact area with respect to the flexible substrate deformation prevention pin is expanded, it can be more effectively prevented in the flexible substrate falling like Is possible.

  Hereinafter, a preferred embodiment of the present invention will be described with reference to the drawings. An electronic component fixing jig according to this embodiment includes a rigid substrate 1 and a substrate 1 as shown in FIGS. An adhesion layer 3 that is laminated on the surface and holds the flexible substrate 10 and a plurality of deformation prevention pins that are detachably press-fitted into the attachment holes 2 and 4 and that position and fix the flexible substrate 10 held in the adhesion layer 3. 20.

The substrate 1 is formed into a flat plate using aluminum, stainless steel, magnesium, ceramic, plastic, fiber reinforced plastic, glass or the like having a thickness of 0.5 to 10 mm, for example, and does not adversely affect the flexible substrate 10. A plurality of mounting holes 2 are perforated and drilled at locations, specifically at the peripheral edge. Although not shown, the substrate 1 is provided with a positioning pin for the flexible substrate 10, a pin for aligning with the work table, and the like. Here, for example, the linear expansion coefficients of aluminum (A5052) and glass epoxy are 3 × 10 ⁻⁶ / ° C. and 2 × 10 ⁻⁵ / ° C., respectively.

  The adhesion layer 3 is formed in a substantially planar band shape having a predetermined thickness using, for example, an elastomer such as heat-resistant silicone rubber or fluorine rubber, and detachably adheres and fixes the plurality of flexible substrates 10. The adhesion layer 3 is formed to a thickness of 5 to 1000 μm, because when the thickness is less than 5 μm, the adhesion force is reduced and it is difficult to adhere the flexible substrate 10. Conversely, when the thickness exceeds 1000 μm, it is difficult to maintain the accuracy of the thickness. In addition, a mounting hole 4 communicating with the mounting hole 2 directly below is perforated through the peripheral edge of the adhesion layer 3.

  Each flexible substrate 10 is manufactured to be bendable by multilayering such as polyimide, polyester, copper foil, tin plating, adhesive layer, etc., and through holes are formed as necessary, and generally a plurality of surroundings are formed. A positioning hole (not shown) is penetrated and a notch is formed.

  Each deformation preventing pin 20 is formed into an inflatable rivet shape using a material having a linear expansion coefficient larger than the linear expansion coefficient of the substrate 1, and the head protruding outward in the radial direction is positioned around the flexible substrate 10. It is made into the latching | locking part 21 latched to a hole, and it expands as the temperature of a heating atmosphere becomes high temperature.

Examples of the material of the deformation prevention pin 20 include silicone rubber, fluorine rubber, and polyimide. Such a deformation prevention pin 20 passes through the positioning hole of the flexible substrate 10 held by the adhesion layer 3 and the attachment hole 4 of the adhesion layer 3 in order and is detachably tightly fitted into the attachment hole 2 of the substrate 1 so as to be flexible. The substrate 10 is pressed and fixed by the locking portion 21. Here, for example, the linear expansion coefficient in the range from room temperature to 250 ° C. of silicone rubber or fluorine rubber is 1 to 5 × 10 ⁻⁴ / ° C.

  In the above, when mounting a mounting component on the flexible substrate 10 having a multilayer structure, first, the plurality of flexible substrates 10 are pressed and held in close contact with the adhesion layer 3 of the electronic component fixing jig, and the surface of the flexible substrate 10 is fixed. Paste solder is screen printed through a metal mask. When the paste solder is screen-printed in this way, a plurality of mounting components are mounted on the surface of each flexible substrate 10 at room temperature by a mounter, and the deformation prevention pins 20 are mounted on the mounting holes 2 and 4 of the electronic component fixing jig. Thus, the plurality of flexible substrates 10 are positioned and fixed to the adhesion layer 3.

  Then, a plurality of flexible boards 10 are set together with electronic component fixing jigs in a reflow furnace, which is a heating device, and heated to an appropriate temperature through a method such as far-infrared rays, convection, hot air, etc., and the solder paste of the flexible board 10 is melted. If it is ringed, a plurality of mounting parts can be mounted on the flexible substrate 10.

  Since the deformation prevention pin 20 has a larger linear expansion coefficient than the linear expansion coefficient of the substrate 1, the deformation prevention pin 20 expands with heating and comes into tight contact with the mounting holes 2 and 4, thereby firmly fixing the plurality of flexible substrates 10 to the adhesion layer 3. Therefore, it effectively prevents warping, deformation, dropout and blow-off. When the soldering is completed and the temperature is lowered, the original dimensions are restored and the mounting holes 2 can be easily removed from below. The soldered flexible substrate 10 is packed after being cooled, washed, inspected, and the like.

  According to the above configuration, the close contact force of the deformation prevention pin 20 with respect to the mounting holes 2 and 4 increases when the temperature of the heating atmosphere is high, and decreases when the temperature of the heating atmosphere is low, and decreases when the temperature of the heating atmosphere is low. Therefore, even if the adhesion force of the adhesion layer 3 is reduced due to, for example, hot air heating in a reflow furnace, it is possible to prevent the flexible substrate 10 from being dropped or blown off with a simple configuration. Moreover, even if the flexible substrate 10 is warped due to the difference in the linear expansion coefficient of the material, the possibility that the peripheral portion of the flexible substrate 10 is warped or deformed can be effectively eliminated.

  In addition, since it is not necessary to improve the adhesion of the adhesion layer 3, it is not difficult to remove the flexible substrate 10 from the electronic component fixing jig. Will not be invited. Furthermore, since the deformation prevention pins 20 are not fixed to the substrate 1 in advance but are detachable from the substrate 1, it is possible to suppress and prevent troubles when screen-printing paste solder on the flexible substrate 10. .

  In the above embodiment, the mounting hole 2 is simply drilled in the substrate 1, but the present invention is not limited to this. For example, unevenness may be formed on the inner surface of the mounting hole 2 to make it difficult for the deformation prevention pin 20 to be pulled out, or the contact surfaces of the mounting holes 2 and 4 and the deformation prevention pin 20 may be made rough to make it difficult to come off. Further, the adhesion layer 3 may or may not be a slightly adhesive layer.

  Further, as shown in FIG. 3, the deformation prevention pin 20 is formed into a substantially inverted L-shaped cross section, or is formed into a substantially inverted truncated cone shape using a metal as shown in FIG. The surface may be covered with heat resistant rubber 22. Further, instead of paste solder, a paste adhesive or the like may be applied to the surface of the flexible substrate 10.

It is a section explanatory view showing an embodiment of an electronic parts fixing jig concerning the present invention. It is a section explanatory view showing the state before attachment of a deformation prevention pin in an embodiment of an electronic parts fixing jig concerning the present invention. It is a cross-sectional explanatory drawing which shows the deformation | transformation prevention pin in other embodiment of the electronic component fixing jig which concerns on this invention. It is a cross-sectional explanatory drawing which shows the deformation | transformation prevention pin in other embodiment of the electronic component fixing jig which concerns on this invention. It is sectional explanatory drawing which shows the conventional electronic component fixing jig. It is sectional explanatory drawing which shows the problem of the conventional electronic component fixing jig.

Explanation of symbols

1 Substrate (base material)
2 Mounting hole (Mounting recess)
3 Adhesion layer 4 Mounting hole 10 Flexible substrate (electronic component)
20 Deformation prevention pin 21 Locking portion 22 Heat resistant rubber (heat resistant elastomer)

Claims (4)

A substrate having rigidity, and a contact layer for holding the flexible substrate is laminated on the substrate removably, removably inserted substantially without clearance into the mounting recess of the substrate, the flexible substrate held by the adhesive layer An electronic component fixing jig which is provided with a deformation prevention pin that is locked and positioned at the peripheral edge, and is heated in a reflow furnace in a state where the flexible substrate is held in the adhesion layer,
The deformation prevention pin is formed using a silicone rubber, fluorine rubber, or polyimide having a linear expansion coefficient larger than the linear expansion coefficient of the substrate, and the adhesion force of the deformation prevention pin to the mounting recess of the substrate is heated. An electronic component fixing jig characterized by being increased when the temperature of the atmosphere is high and decreasing when the temperature of the heating atmosphere is low. The electronic component fixing jig according to claim 1, wherein an upper portion of the deformation prevention pin is extended in the width direction to be a locking portion that is hooked on the flexible substrate . An electronic component processing method for processing a flexible substrate using the electronic component fixing jig according to claim 1,
After the flexible substrate is held on the adhesive layer of the electronic component fixing jig, the deformation prevention pin is omitted in the mounting recess of the electronic component fixing jig before the flexible substrate is supplied together with the electronic component fixing jig to the heating device. A method of processing an electronic component, wherein the flexible substrate is positioned and fixed to the adhesion layer by inserting without gaps. Solder is supplied to the flexible substrate is held by the adhesive layer of the electronic component fixture, with mounting the mounting component on a flexible substrate, the adhesion preventing deformation pin mounting recess of an electronic component fixing jig almost without gaps inserted to 4. The method of processing an electronic component according to claim 3, wherein the flexible substrate is positioned and fixed to the layer, and then the flexible substrate is supplied to the heating device together with the electronic component fixing jig, and the solder of the flexible substrate is melted and soldered.

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