JP2006245471A - Electronic component joining apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To certainly prevent the joining failure of an electronic component caused from the failed contact heating due to such as deflection of a circuit substrate, when the circuit substrate is partially (locally) heated by contact heating, thereby, the electronic component is joined by heat-melting a joining material located on the circuit substrate. <P>SOLUTION: A substrate transferring palett is supported, and while the area of its second surface corresponding to the component joining area is mounted on a mounting surface of a mounting member, the mounting member is elevated toward the circuit substrate supported by the substrate transferring palett through the opening, and the circuit substrate is released from the supporting by the substrate transferring palett, and the circuit substrate is pressed onto the mounting surface through its first surface to keep the mounting position of the circuit substrate. then, the circuit substrate is partially heated through the mounting member in a state that the mounting position is kept, thus, the joining member is melted by heating. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The second aspect of the present invention is a second surface that is a surface opposite to the first surface with respect to a circuit board on which a plurality of electronic components are mounted with a bonding material interposed in a component bonding region on the first surface. The present invention relates to an electronic component bonding apparatus and a bonding method for bonding each of the electronic components to the circuit board by heating and melting the bonding material by partial (local) heating from the surface, and then cooling and solidifying the bonding material.

  2. Description of the Related Art Conventionally, various types of electronic component joining apparatuses of this type are known (see, for example, Patent Document 1). An electronic component bonding method using a conventional electronic component bonding apparatus will be described below with reference to schematic explanatory views of FIGS.

  As shown in FIG. 21A, the electrode 1a of the electronic component 1 is mounted, that is, disposed on the first surface 2a, which is the upper surface of the circuit board 2, via the solder 3 that is a bonding material. Such a circuit board 2 has a weak heat-resistant electronic component (for example, a CCD, CMOS, or an optical pick component having a low heat-resistant temperature) mounted on a portion (not shown), for example. The circuit board is such that the electronic component 1 is joined by heating and melting the solder 3 without adversely affecting the electronic component 1.

  Further, such a circuit board 2 is supported by a pallet 4 which is a plate-like member on the peripheral portion of the second surface 2b which is the surface opposite to the first surface 2a. As the circuit board 2 is supported by the pallet 4 in this way, for example, even when the circuit board 2 is formed of a soft material (for example, a flexible board), Transport can be performed reliably.

  Further, as shown in FIG. 21A, the pallet 4 has a second surface 2b corresponding to a region (component bonding region) to which the electronic component 1 is bonded on the first surface 2a of the circuit board 2. An opening 4a is formed so as to be exposed in the support state. By using the opening 4a of the pallet 4 and bringing the heating member 505 heated by a heating device (not shown) into contact with the second surface 2b of the circuit board 2 through the opening 4a of the pallet 4, Heat can be transmitted from the heating member 505 to each solder 3 via the circuit board 2, whereby each solder 3 can be heated and melted.

  Further, such heating by contact heat transfer can be performed locally to some extent by bringing the heating member 505 into partial contact with the circuit board 2 at or near the location to be heated. It is possible to reliably prevent thermal influence on the electronic component.

JP 2004-111901 A

  However, in the joining of the electronic component 1, for example, a flexible circuit board or a circuit board in which a so-called backing layer is formed as a reinforcing material layer on the second surface 2 b is used as the circuit board 2. In many cases, such a circuit board 2 is accompanied by the occurrence of warping as shown in FIG. In particular, in a circuit board in which the backing layer is formed, the occurrence of the warp becomes more remarkable due to the difference in thermal expansion coefficient between the base material layer, which is the main material of the circuit board 2, and the backing layer. Tend to be.

  In addition, the pallet 4 is often formed in a thin plate shape with a metal material (for example, aluminum, etc.) or a resin material in consideration of handling at the time of its transportation. There may be a case where the pallet 4 itself is deformed such as warping or bending. Even when there is no warping or bending in the conveyance process, when the circuit board 2 is heated by the heating member 505, indirect heat transfer via the circuit board 2 or direct from the heating member 505 is performed. In some cases, the pallet 4 may be heated by the general radiation. In such a case, as shown in FIG. 21 (c), the pallet 4 is warped by the heat, and particularly when the circuit board 2 is a flexible board, it is flat. For example, the circuit board 2 may be supported in a warped state.

  Thus, in the state where the circuit board 2 is warped, the contact between the second surface 2b of the circuit board 2 and the heating member 505 is insufficient, and the electronic component 1 is poorly bonded due to insufficient heating. There is a problem that may occur.

  Accordingly, an object of the present invention is to solve the above-mentioned problem, and by heating the circuit board partially (locally) by contact heat transfer, the bonding material disposed on the circuit board is heated and melted. The present invention provides an electronic component bonding apparatus and a bonding method that can surely prevent a bonding failure of an electronic component due to a defect in contact heat transfer due to a warp of a circuit board or the like. .

  In order to achieve the above object, the present invention is configured as follows.

According to the first aspect of the present invention, the circuit board on which the plurality of electronic components are mounted with the bonding material interposed in the component bonding region on the first surface is opposite to the first surface. In the electronic component bonding apparatus for bonding the respective electronic components to the circuit board by heating and melting the bonding material by partially heating from the second surface, which is a surface, and then cooling and solidifying the bonding material,
The second surface of the circuit board is disposed on the upper surface, and an opening that exposes a region in the second surface corresponding to the component bonding region in the disposed state, and a periphery of the region of the second surface A pallet support posture holding device for supporting the substrate transport pallet having a support portion for supporting the circuit board at a top surface and a bottom surface, and releasably holding the support posture;
The second surface region corresponding to the component joining region can be placed on the circuit board supported by the substrate transport pallet in a state where the support posture is held by the pallet support posture holding device. The mounting member and the mounting member can be moved up and down, and the circuit board is mounted on the mounting member by raising the mounting member through the opening, and the circuit board by the substrate transport pallet A substrate heating apparatus comprising: a mounting member lifting / lowering unit that releases support; and a heating unit that heats the mounting member and heats the circuit board in a state of being mounted on the mounting member;
When the circuit board placed on the placement member and supported by the board transport pallet is released by the heating unit, the circuit board is placed on the placement member from the first surface. There is provided an electronic component bonding apparatus including a substrate mounting posture holding device that presses and holds a mounting posture of the circuit board.

  According to the second aspect of the present invention, the mounting height position of the circuit board by the mounting member of the substrate heating device is determined by the circuit board by the substrate transport pallet in a state of being supported by the pallet support posture holding device. The electronic component joining apparatus according to the first aspect is provided above the support height position.

According to the third aspect of the present invention, the substrate mounting posture holding device comprises:
A pressing member capable of pressing the circuit board in a region on the first surface corresponding to the mounting region on the mounting member on the second surface of the circuit board;
In the first aspect or the second aspect, the pressing member can be moved up and down, and includes a pressing member lifting and lowering unit that presses the circuit board against the placement unit by the pressing member by lowering the pressing member. An electronic component joining apparatus is provided.

  According to the fourth aspect of the present invention, the pressing member is a plurality of pressing pins that are rod-shaped members, and the plurality of pressing pins in the respective pressing pins are on the first surface of the circuit board. The electronic component joining apparatus according to the third aspect is capable of pressing a corner portion of the region excluding the component joining region or the vicinity of the corner portion in a region corresponding to the placement region.

  According to the fifth aspect of the present invention, at least one of the pressing pins is in a region corresponding to the placement region on the first surface of the circuit board, and approximately near the center of the region excluding the component joining region. An electronic component joining apparatus according to the fourth aspect is provided.

  According to the sixth aspect of the present invention, each of the pressing pins is supported by the pressing member elevating part via the elastic member, and the variation in the pressing height position of the circuit board in each of the pressing pins is described above. The electronic component joining apparatus according to the fourth aspect or the fifth aspect, which can be absorbed by the elastic member.

  According to the seventh aspect of the present invention, the substrate mounting posture holding device is configured so that the pressing member suppresses the occurrence of warpage due to heat transfer when the circuit board is partially heated by the heating unit. The electronic component joining apparatus according to any one of the third to sixth aspects, in which the circuit board is pressed by the above.

  According to an eighth aspect of the present invention, any one of the first to seventh aspects, further comprising a suction device that is connected to the placement member and sucks and holds the circuit board that is placed on the placement member. An electronic component joining apparatus according to claim 1 is provided.

According to the ninth aspect of the present invention, the circuit board is formed of a base material layer on which a circuit pattern or a terminal is formed, and a material having a coefficient of thermal expansion different from that of the base material layer. A circuit board comprising a reinforcing material layer for structural reinforcement,
Along with the heat transfer to the circuit board, the board mounting posture holding device suppresses the occurrence of warpage caused by the difference in coefficient of thermal expansion between the base material layer and the reinforcing material layer. An electronic component joining apparatus according to any one of the first to eighth aspects is provided that retains the mounting posture.

According to the tenth aspect of the present invention, with respect to the circuit board on which the plurality of electronic components are mounted with the bonding material interposed in the component bonding region on the first surface, the circuit board is opposite to the first surface. In the electronic component bonding method of bonding each of the electronic components to the circuit board by heating and melting the bonding material by heating from the second surface, which is a surface, and then cooling and solidifying the bonding material,
The second surface of the circuit board is disposed on the upper surface, and an opening that exposes a region in the second surface corresponding to the component bonding region in the disposed state, and a periphery of the region of the second surface For the substrate transport pallet having a support part for supporting the circuit board at, the support posture is held from the upper surface and the lower surface so that the support posture can be released,
With respect to the circuit board supported by the board transport pallet, the placement member is placed through the opening while placing the second surface area corresponding to the component joining area on the placement surface of the placement member. To release the support of the circuit board by the board transport pallet and press the circuit board against the mounting surface from the first surface to maintain the mounting posture of the circuit board. And
The circuit board is partially heated through the mounting member in a state where the mounting posture is maintained, whereby the joining member is heated and melted, and the respective electronic components are attached to the circuit board. Provided is an electronic component joining method characterized by joining.

  According to the eleventh aspect of the present invention, the mounting height position of the circuit board by the mounting member is higher than the supporting height position of the circuit board by the substrate transport pallet in the state where the supporting posture is held. The electronic component joining method according to the tenth aspect positioned above is provided.

  According to a twelfth aspect of the present invention, the pressing against the first surface of the circuit board corresponds to the first region corresponding to the placement area on the placement portion on the second surface of the circuit board. The electronic component joining method according to the tenth aspect or the eleventh aspect, which is performed by pressing a plurality of positions including the corners of the region excluding the component joining region or the vicinity of the corners in the region on the surface.

  According to the above aspect of the present invention, in the circuit board, when the component mounting area is partially heated to join the electronic components mounted in the area, the component mounting area of the circuit board is used. The area of the second surface corresponding to is placed on the circuit board so as to contact the placement member, and the circuit board is pressed against the placement member above the first surface, The circuit board can be partially heated by contact heat transfer through the mounting member while holding the mounting posture. By heating the circuit board while maintaining the mounting posture in this manner, even if heat is partially transmitted to the circuit board by the heating, the occurrence of warping or bending is ensured. Therefore, it is possible to realize a reliable and highly accurate joining.

  In addition, the circuit board is transported in a state of being supported by being placed on the substrate transport pallet. The circuit board is placed on the mounting member, and the circuit board is moved by the substrate transport pallet. Since the support of the circuit board is released, the circuit board can be opened to the board transport pallet in the placement state. Even if the circuit board is stretched due to the heat generated by heating the circuit board in such a state, the support is released between the circuit board and the pallet. Since it is in the state, it is possible to effectively suppress the occurrence of slack or the like due to the elongation on the circuit board.

  In addition, when performing the heating and melting, first, the substrate transport pallet itself is held so as to be sandwiched from the upper surface and the lower surface, so that the substrate transport pallet is bent or warped in the process of transport or the like. Even in such a case, the bending and warping can be held in a state where the bending and warping have been corrected to some extent. By performing such holding, it is possible to reduce the influence on the holding of the circuit board due to the bending or warping of the board carrying pallet itself, and holding (mounting) the circuit board while maintaining higher flatness. (Holding posture) can be realized.

  Further, the pressing of the circuit board is performed by a plurality of pressing pins and is performed by pressing a plurality of locations on the first surface of the circuit board, so that the mounting posture on the mounting member is changed. The holding can be performed while maintaining a higher flatness.

  Embodiments according to the present invention will be described below in detail with reference to the drawings.

  FIG. 1 is a schematic cross-sectional view schematically showing the configuration of an electronic component bonding apparatus 101 according to an embodiment of the present invention. A schematic perspective view of the circuit board 2 handled in the electronic component bonding apparatus 101 is shown in FIG. First, the configuration of the circuit board 2 handled by the electronic component bonding apparatus 101 and the configuration related to the circuit board 2 will be described with reference to FIG.

  As shown in FIG. 2, a plurality of electronic components 1 are mounted on a substantially plate-like circuit board 2 on a first surface 2a, which is the upper surface in the drawing, that is, a plurality of electronic components 1 interpose a bonding material. It arrange | positions at the 1st surface 2a. In addition, for example, four circuit boards 2 are arranged and arranged on the upper surface of the pallet 4 as an example of a board transport pallet having a plate shape. By arranging the plurality of circuit boards 2 on the pallet 4 in this way, the circuit boards 2 can be transported integrally using the pallet 4.

  Here, a schematic cross-sectional view taken along line AA in the schematic perspective view of FIG. 2 is shown in FIG. As shown in FIGS. 2 and 3, the pallet 4 is formed with a plurality of openings 4a corresponding to the number of circuit boards 2 arranged, and in the peripheral part 4b of the openings 4a (an example of a support part). Each circuit board 2 is supported. Specifically, as shown in FIG. 2, on the first surface 2a of the circuit board 2, each electronic component 1 is mounted via solder 3 which is an example of a bonding material. These mounted electronic components 1 are bonded to the circuit board 2 by heating and melting each solder 3 and then cooling and solidifying as described later. As described above, the region where each electronic component 1 is bonded on the first surface 2a of the circuit board 2 is a component bonding region R1. In this component bonding region R1, the electronic component 1 is interposed via each solder 3. Is installed. A region on the second surface 2b corresponding to the component bonding region R1 on the first surface 2a of the circuit board 2 (this region becomes a heating region) is disposed on the opening 4a. Each circuit board 2 is supported by a pallet 4. In addition, such a pallet 4 is formed to have a thickness of about 1 mm, for example, with aluminum or resin.

  Moreover, as shown in FIG.2 and FIG.3, the illustration right-and-left both ends of the pallet 4 are supported by the two conveyance rails 5 with which the electronic component joining apparatus 101 was equipped, and these both ends are in a support state, The pallet 4 can be transported. In addition, as shown in FIG. 2, each conveyance rail 5 is arranged at a contact portion between the guide member 5a for restricting the traveling direction of the pallet 4 and guiding the conveyance and the pallet 4 in the guide member 5a. A transport chain 5b for driving the transport of the pallet 4 is provided. Each guide member 5a has a substantially C-shaped cross-sectional shape, and a transport chain 5b is disposed at the inner lower portion of the C-shape.

  As shown in FIG. 1, the electronic component bonding apparatus 101 heats the circuit board 2 while being in contact with the second surface 2 b of each circuit board 2, and each solder 3 passes through the circuit board 2. Is provided with a substrate heating apparatus 10 for heating and melting the substrate. Here, a schematic perspective view showing a schematic configuration of the substrate heating apparatus 10 is shown in FIG. 4, and the configuration of the substrate heating apparatus 10 will be described with reference to FIGS. 1 and 4.

  As shown in FIGS. 1 and 4, the substrate heating device 10 is mounted on the mounting surface on which the second surface 2 b of each circuit board 2 conveyed and supplied above the pallet 4 is supplied. A stage 11 which is an example of a mounting member having 11a, a heater 12 which is an example of a heating unit which is disposed so as to be in contact with the lower part of each stage 11 and heats the stage 11, and the stage 11 and the heater 12 And a stage elevating device 13 which is an example of a placement member elevating unit that raises or lowers in an integrated state. In the electronic component bonding apparatus 101, the position above the substrate heating apparatus 10 is a heat treatment position where the solder 3 for bonding each electronic component 1 to the circuit board 2 is heated and melted.

  Each stage 11 is formed in such a size that it can pass through the opening 4a of the pallet 4 and individually passes (or is inserted) through each opening 4a. The circuit board 2 can be mounted with the mounting surface 11a in contact with the second surface 2b. Further, as described above, in the pallet 4, the heating region on the second surface 2 b, which is the opposite surface corresponding to the component bonding region R 1 on the first surface 2 a of the circuit board 2, is on each opening 4 a. Since the respective circuit boards 2 are arranged so as to be disposed in each other, the placement surface 11a of the stage 11 inserted into each opening 4a is in contact with the circuit board 2 in the heating region. Become. In addition, each stage 11, that is, the four stages 11 are integrally connected at the lower part thereof, and by this connection, it is possible to realize the integral raising and lowering by the stage elevating device 13. It has become. These stages 11 are formed of a material having high thermal conductivity, for example, a metal material, in order to efficiently transmit the heat transmitted by the heater 12 to the circuit board 2. Moreover, the mounting surface 11a of the stage 11 is a flat surface, and is a plane substantially parallel to the conveyance direction of each circuit board 2.

  The heater 12 is formed and arranged so that the upper surface of the heater 12 is in contact with the connecting portion at the lower part of the four stages 11. As such a heater 12, a heater having a rapid heating characteristic, for example, a ceramic heater can be employed.

  The stage elevating device 13 has a function of moving up and down the four stages 11 and the heater 12 integrally. For example, the pallet 4 on which the respective circuit boards 2 are arranged is conveyed above the substrate heating device 10. When being supplied, each stage 11 is inserted into the pallet supply height position, which is a height position at which interference between the pallet 4 and each stage 11 is prevented, and each opening 4 a of the pallet 4. The stage 11 and the heater 12 can be moved up and down between the circuit board 2 placed on the placement surface 11 a and the heating height position that is the height position where the heater 12 is heated. It is possible. The stage elevating device 13 includes an elevating frame 13a that is a substantially plate-like member in which each stage 11 and heater 12 are arranged on the upper surface, and an elevating cylinder 13b that elevates and lowers the elevating frame 13a. .

  Further, as shown in FIGS. 1 and 4, the mounting surface 11 a of each stage 11 is formed with a plurality of suction hole portions 11 b, and these suction hole portions 11 b are formed inside the stage 11. Is communicated with one end of the suction passage 14 that passes through. The other ends of these adsorption passages 14 are formed so as to penetrate through the side wall portions of the stage 11 and are connected to a suction device (not shown) through the through portions of the side walls. Thereby, the suction pressure generated by the suction device can be transmitted to the respective suction hole portions 11b through the respective suction passages 14, and is placed on the respective placement surfaces 11a. By transmitting the transmitted suction pressure to the circuit board 2, suction holding can be performed.

  Moreover, as shown in FIG. 1, the electronic component joining apparatus 101 supports the pallet 4 transported to the heat treatment position from the upper surface and the lower surface and holds the support posture so that the support posture can be released. A pallet holding device 20 which is an example of a posture holding device is provided.

  The pallet holding device 20 is in contact with the pallet 4 that is transported to the heat treatment position while being supported by the transport rail 5 on the upper surface thereof, so that a plurality of pallet 4 support height positions are defined. By pushing up the pallet 4 in a state where it is partially in contact with the lower surface of the pallet 4 so as to press the pallet upper surface defining pin 21 and the upper surface of the pallet 4 against each pallet upper surface defining pin 21, the pallet 4 is A plurality of pallet push-up pins 22 that are defined at the support height position (that is, for positioning) are provided.

  The respective pallet upper surface defining pins 21 are arranged substantially evenly on the upper surface of the pallet 4 so that the pallet upper surface defining pins 21 can come into contact with a portion where the circuit board 2 is not arranged. Further, each pallet upper surface defining pin 21 is connected so as to be integrated with each other at an upper portion thereof by, for example, a substantially plate-like connection plate 23, and each pallet upper surface defining pin 21 is in contact with the upper surface of the pallet 4. It is formed so that the height position is the same height position.

  Further, each pallet push-up pin 22 can be brought into contact with a position corresponding to a contact position by the pallet upper surface defining pin 21 on the lower surface of the pallet 4 or a position in the vicinity of the peripheral portion of each opening 4a. The lower surface is substantially evenly arranged. Further, the lower part of each pallet push-up pin 22 is supported on the elevating frame 13a of the stage elevating device 13 with a spring portion 24 as an elastic member interposed therebetween. Since each pallet push-up pin 22 is supported in this manner, each pallet push-up pin 22 can be raised or lowered integrally by raising or lowering the lift frame 13a using the lift cylinder 13b. it can. Moreover, the lower surface of the pallet 4 can be brought into contact with the upper end of each pallet push-up pin 22 by such a rise, and the pallet 4 in the contacted state can be removed from the transport rail 5 by continuing the rise. It is possible to lift and bring the upper surface thereof into contact with the respective pallet upper surface defining pins 21 to define the support height position. When each pallet push-up pin 22 is raised or lowered, each stage 11 and heater 12 are also raised or lowered.

  In addition, as each spring part 24, the load of the pallet 4 can be supported, and further, each pallet push-up pin 22 is raised in a state where the support height position of the pallet 4 is defined. In such a case, one having an elastic characteristic capable of contracting the spring portion 24 is employed. By installing such a spring portion 24, even if some warp or bend remains in the pallet 4 or the thickness itself is uneven, the respective spring portions 24 are floated. The variation of the contact height position of each pallet push-up pin 22 can be absorbed, and the support posture of the pallet 4 can be reliably held.

  Further, in a state where the support height position of the pallet 4 is defined by each pallet upper surface defining pin 21, the pallet supported by the transport chain 5 b at the inner lower portion of the C-shaped cross section of the guide member 5 a of the transport rail 5. The respective end portions of 4 are released from support by the respective transport chains 5b, and the respective end portions are brought into contact with the inner upper portion of the guide member 5a in the C-shaped cross section. Further, the height position of the inner upper portion is the same height position as the tip height position of each pallet upper surface defining pin 21, and each end portion of the pallet 4 is supported by each guide member 5a. The height position will be defined.

  As shown in FIG. 1, the electronic component bonding apparatus 101 has a first surface 2 a that is an upper surface of the circuit board 2 placed on the placement surface 11 a of each stage 11. By pressing, the second surface 2b of the circuit board 2 is brought into close contact with the mounting surface 11a of the stage 11, and the mounting posture of the circuit board 2 is set so that the circuit board 2 is substantially parallel to the mounting surface 11a. Is provided with a substrate holding device 30 which is an example of a substrate mounting posture holding device.

  The substrate holding device 30 includes a plurality of pressing pins 31 as pressing members that partially press the first surface 2a of the circuit board 2 against the mounting surface 11a, and pressing members that raise or lower each pressing pin 31. A pressing pin lifting / lowering device 32 which is an example of the lifting / lowering device is provided. Each presser pin 31 is mounted on the elevating plate 34 via a spring portion 33 that is an elastic member. The elevating plate 34 is moved up and down by the presser pin elevating device 32, whereby each presser pin 31. Can be moved up and down in an integrated state.

  Moreover, as shown in FIG. 1, the lower end of each holding | suppressing pin 31 becomes the contact edge part 31a contact | abutted to the 1st surface 2a in the circuit board 2, and each contact edge part 31a is In the first surface 2 a of the circuit board 2, the circuit board 2 is brought into contact with each other in a region other than the component bonding region R <b> 1 and corresponding to a region placed on the placement surface 11 a. It is arranged so that it can be pressed.

  Here, FIG. 5 is a schematic explanatory diagram for explaining a state in which the circuit board 2 placed on the placement surface 11a of the stage 11 is pressed by the contact end portions 31a of the respective pressing pins 31. Show. In the state shown in FIG. 5, the upper surface height position of the pallet 4 is defined by the pallet holding device 20. In such a state, the circuit board 2 can be placed on the placement surface 11a of the stage 11 by raising the stage 11 by inserting it through the opening 4a of the pallet 4 by the stage elevating device 13. it can. In addition, the placement surface 11a of the stage 11 is raised to a position (that is, a heating height position) that is higher than the height position of the upper surface of the pallet 4 in a state in which the height position is held by the height dimension D. It has become so. As the stage 11 is raised to the heating height position in this way, the support of the circuit board 2 by the pallet 4 is released, and the circuit board 2 is lifted from the top surface of the pallet 4 by the height dimension D. In this state, the support by placing the circuit board 2 is transferred to the stage 11.

  Further, as shown in FIG. 5, with the circuit board 2 placed on the stage 11 as described above, the contact end portions 31a of the respective pressing pins 31 are brought into contact with the first surface 2a of the circuit board 2. Thus, the pressing positions of the pressing pins 31 are determined so that the second surface 2 b of the circuit board 2 can be brought into close contact with the mounting surface 11 a of the stage 11. The presser pin lifting and lowering device 32 is configured so that each presser pin 31 is brought into contact with the circuit board 2 at a height position, the contact state is released, and the pallet 4 is loaded and unloaded. It is possible to move up and down between the contact release height position so that the interference between the pressing pin 31 and the pallet 4 can be surely prevented.

  As shown in FIG. 1, the spring portion 33 that supports each pressing pin 31 on the lifting plate 34 has the same function (that is, float) as the spring portion 24 provided on the pallet lifting pin 22 described above. The variation in the contact height position of the contact end portion 31 a of each pressing pin 31 can be absorbed by the elastic compression of the spring portion 33.

  Further, as shown in FIG. 1, the electronic component bonding apparatus 101 includes a cooling blow apparatus 40 that cools and solidifies the heated solder 3 by cooling and blowing the solder 3 from above. The cooling blow device 40 is provided with a cooling blow nozzle 41 that locally performs a cooling blow on each solder 3.

  Also, the electronic component bonding apparatus 101 includes a circuit board 2 mounting operation and heating operation by the substrate heating apparatus 10, a pallet 4 holding operation by the pallet holding apparatus 20, and a circuit board 2 mounting posture by the substrate holding apparatus 30. A control device 50 is provided that performs overall control of the holding operation and the cooling blow operation by the cooling blow device 40 in association with each other. In this control device 50, an operation program including temporal data for performing each operation is stored in advance so as to be able to be extracted, and operation control of each component device is performed based on this operation program. Then, each electronic component 1 is joined to the circuit board 2.

  Next, in the electronic component bonding apparatus 101 having such a configuration, a procedure for bonding the electronic component 1 to each circuit board 2 conveyed and supplied in a state of being arranged on the pallet 4 will be described with reference to FIG. 6 and FIG. 7 to FIG. 18, which are schematic explanatory diagrams showing states of the electronic component bonding apparatus 101 in the respective procedures in this flowchart, will be specifically described below. In each procedure described below, the operation of each component device in the electronic component bonding apparatus 101 is performed by being comprehensively controlled by the control device 50 while being associated with each other.

  First, in step S1 of FIG. 6, as shown in FIG. 7, the pallet 4 having four circuit boards 2 arranged on the upper surface thereof is transported in a state where both ends thereof are supported by the respective transport rails 5. Then, the heat treatment position in the electronic component bonding apparatus 101, that is, the position above the substrate heating apparatus 10 is supplied, and positioning in the transport direction is performed. In the state where the pallet 4 is carried in, the pressing pins 31 are positioned at the contact release height position by the pressing pin elevating device 32, and each stage is set by the pallet holding device 10. 11 and the pallet push-up pin 22 are positioned at the pallet supply height position. Accordingly, it is possible to reliably prevent interference between the pallet 4 that is carried in and each component of the electronic component bonding apparatus 101.

  Next, in step S <b> 2 of FIG. 6, the loaded pallet 4 is held by the pallet holding device 20. Specifically, as shown in FIG. 8, by raising the elevating frame 13 a by the elevating cylinder 13 b of the stage elevating device 13, the pallet push-up pins 22 provided on the elevating frame 13 a are started to rise. The upper end portion of each pallet push-up pin 22 is brought into contact with the lower surface of the pallet 4 by the raising. By continuing the ascent, the both end portions of the pallet 4 are raised apart from the inner lower portion in the C-shaped cross section of each guide member 5a, and eventually the pallet 4 is placed at the tip of each pallet upper surface defining pin 21. Are brought into contact with each other, and the support height position of the pallet 4 is defined at the raised height position. Moreover, in the said state, the said both ends in the pallet 4 will contact | abut with the inner upper part of the C-shaped cross section of each guide member 5a, and will be in the state which the raise position was prescribed | regulated. If it will be in such a state, the raise by the stage raising / lowering apparatus 13 will be stopped, and it will be in the state by which the pallet 4 was hold | maintained by the pallet holding device. In this state, the placement surface 11a of each stage 11 is located at a height position between the heating height position and the pallet supply height position. The placement surface 11a and the second surface of the circuit board 2 are not yet in contact with each other.

  In the state in which the pallet holding device is held as described above, the holding of the pallet 4 by the respective transport rails 5 is released. The pallet 4 is held by supporting the pallet 4 so that the pallet 4 is sandwiched from the upper surface side and the lower surface side by the pallet upper surface defining pins 21 and the pallet push-up pins 22 that are distributed almost uniformly throughout the pallet 4. Therefore, it is possible to correct to some extent the warpage and bending existing in the pallet 4 itself.

  Thereafter, the circuit board 2 is held by the board holding device 30 in step S3 of FIG. Specifically, as shown in FIG. 9, the contact end portions 31 a of the pressing pins 31 against the circuit boards 2 arranged on the top surface of the pallet 4 held by the pallet holding device 20. The raising / lowering plate 34 starts to be lowered by the pressing pin raising / lowering device 32 so as to be close to each other.

  Due to the lowering, the contact end portions 31a of the respective pressing pins 31 are lowered from the contact release height position to the contact height position, and contact the first surface 2a of each circuit board 2. It is assumed that it was done. In this contact state, the lowering of the respective holding pins 31 by the holding pin lifting and lowering device 32 is stopped, and each circuit board 2 is moved closer to the periphery of the upper surface of each holding pin 31 and the pallet 4. It is supported and the support position is maintained. In such a state, the contact end portion 31 a of each pressing pin 31 is only in contact with the first surface 2 a of the circuit board 2. It is in a state where it is located at a height where almost no pressing force is applied.

  Next, in step S <b> 4 of FIG. 6, each stage 11 is raised by the stage elevating device 13, and the circuit board 2 is placed on the stage 11. Specifically, as shown in FIG. 10, each stage 11 is raised by the stage elevating device 13 and inserted into the opening 4 a of the pallet 4, and placed through the respective opening 4 a. The surface 11 a comes into contact with the second surface 2 b of the circuit board 2. In this raising operation, the elevating frame 13a equipped with the respective pallet push-up pins 22 is raised, but the height position of the pallet 4 has already been defined, Each pallet push-up pin 22 is not raised. In other words, the spring portions 24 having the push-up pins 22 mounted on the lift frame 13a are elastically compressed, so that the lift frames 13a can be lifted without the pallet push-up pins 22 being lifted. Configuration is realized.

  In the state where the second surface 2b of the circuit board 2 and the mounting surface 11a of the stage 11 are in contact with each other, the stage 11 is further lifted, and as shown in FIG. Is lifted, the support (holding) of the circuit board 2 by the pallet 4 is released, and the circuit board 2 is placed on the placement surface 11 a of the stage 11. As shown in FIG. 5, when the placement surface 11 a of the stage 11 is positioned at the position of the height dimension D from the upper surface of the pallet 4, that is, the heating height position, the ascending operation by the stage elevating device 13 is stopped. .

  In addition, the holding surface 11a of the stage 11 is positioned at a position higher than the height position of the upper surface of the pallet 4 in this way, so that each pressing member that is in contact with the first surface 2a of the circuit board 2 is placed. The abutting end portion 31a of the pin 31 is also lifted, but each spring portion 33 is elastically compressed by the amount corresponding to the rising height, so that the amount corresponding to the rising height is absorbed. Therefore, in the state shown in FIG. 10, each circuit board 2 is in a state of being pressed by each pressing pin 31 with a pressing force corresponding to the elastic compression of the spring portion 33. Each circuit board 2 is pressed against the mounting surface 11 a of the stage 11.

  In such a state, next, in step S5 of FIG. 6, the suction pressure is transmitted to the respective suction hole portions 11b through the suction passages 14 by a suction device (not shown), and is applied to the respective mounting surfaces 11a. The circuit board 2 in the pressed state is sucked and held (see FIG. 11). By this suction and holding, the circuit board 2 is not warped or bent on the placement surface 11a. Note that the timing of starting suction by each of the suction holes 11b is not limited to after the circuit board 2 is placed on the placement surface 11a of the stage 11, and for example, the above placement is performed. It may be a case where the suction has been started before it is released. This is because the circuit board 2 can be sucked and held almost simultaneously with the contact with the mounting surface 11a.

  Thereafter, in step S6 of FIG. 6, heating by the heater 12 is started, and heating of each circuit board 2 is performed via the placement surface 11 a of each stage 11. As shown in FIG. 11, the region (heating region) of the second surface 2b corresponding to the component bonding region R1 on the first surface 2a of the circuit board 2 is heated, and as a result, the component bonding region R1 is heated. Each solder 3 that mounts the electronic component 1 on the circuit board 2 is heated. By this heating, each solder 3 is melted (heated and melted). In the implementation of the heating and melting, the heating is performed for a predetermined heating time at a predetermined heating temperature based on a preset heating temperature profile. When the heating is performed, the heating area on the second surface 2b of the circuit board 2 is adsorbed and held in close contact with the mounting surface 11a of the stage 11, so that the heater 12 The heat can be efficiently transferred to the circuit board 2 via 11.

  Next, in step S7 of FIG. 6, the solder 3 in the heated and melted state is cooled and solidified. Specifically, as shown in FIG. 12, heating by the heater 12 of the substrate heating apparatus 10 is stopped, and cooling blow by the respective cooling blow nozzles 41 of the cooling blow apparatus 40 is started. By this cooling blow, each solder 3 in a molten state is cooled and solidified. As a result, each electronic component 1 is bonded to the circuit board 2 via the solder 3.

  Next, in step S8 of FIG. 6, the suction holding of the circuit board 2 by each stage 11 is released. Specifically, as shown in FIG. 13, the suction holding of the circuit board 2 is released by stopping the transmission of the suction pressure from the respective suction hole portions 11 b through the respective suction passages 14.

  Thereafter, in step S9 of FIG. 6, the stage 11 is lowered from the heating height position by lowering the elevating frame 13a by the elevating cylinder 13b of the substrate heating apparatus 10 (see FIG. 14). As a result of the lowering, each of the spring portions 24 in the elastic compression state in the pallet holding device 20 is released from the elastic compression state, but in the state in which the elastic compression state is released, the lifting frame 13a is released. Since the descent is stopped, the pallet holding device 20 continues to hold the pallet 4. In addition, by such lowering of the respective stages 11, the respective circuit boards 2 that have been placed on the placement surface 11 a of the stage 11 are supported by the pallet 4 at the periphery thereof. .

  The cooling blow by the respective cooling blow nozzles 41 is continuously performed until the stage 11 is lowered. That is, until the respective solders 3 in the molten state are surely cooled and solidified, the mounting posture by the suction holding by the mounting of the circuit board 2 by the respective stages 11 and the pressing of the respective pressing pins 31 is maintained. Since the holding is continuously performed, the respective electronic components 1 can be reliably bonded to the component bonding positions without causing the respective circuit boards 2 to be warped or bent.

  Next, in step S10 of FIG. 6, the pressing of the circuit board 2 by the respective pressing pins 31 is released. Specifically, as shown in FIG. 15, in the substrate holding device 30, the raising and lowering plate 34 starts to be lifted by the pressing pin lifting and lowering device 32, and the contact end portion 31 a of each pressing pin 31 has the above contact height. The position is raised to the contact release height position. By this rise, the pressing of the circuit board 2 by the respective pressing pins 31 is released.

  After that, in step S11 of FIG. 6, holding of the pallet 4 by the pallet holding device 20 is released. Specifically, as shown in FIG. 16, the pallet push-up pins 22 are lowered by further lowering the elevating frame 13 a by the elevating cylinder 13 b of the stage elevating device 13. As a result of the lowering, the support for the pallet 4 in a state where the support is performed in a state where the support height position is defined by each pallet upper surface defining pin 21 is released. By releasing the support, both ends of the pallet 4 are supported by the respective transport rails 5. Further, as the elevating frame 13a is lowered, the placement surface 11a of each stage 11 is lowered to the pallet supply height position.

  Thereafter, in step S12 of FIG. 6, the cooling blow by the respective cooling blow nozzles 41 is stopped (see FIG. 17). By continuing cooling blow until this step S12, it is ensured that the amount of heat transferred to the circuit board 2 is transferred to the electronic component 1 and that the electronic component 1 is thermally damaged. Can be prevented.

  After that, in step S13 in FIG. 6, each circuit board 2 in a state in which the electronic component 1 is bonded via the solder 3 is disposed on the pallet 4, and is heated by the respective transport rails 5. (See FIG. 18).

  Thereby, the heat treatment for joining the electronic component 1 to the circuit board 2 is completed. In addition, the electronic component 1 is continuously joined with respect to each circuit board 2 arrange | positioned at the said another pallet 4 by carrying in another pallet 4 and performing each above-mentioned step. Can do.

  In the above description, the case where the circuit board 2 is supported by the pallet 4 by arranging the peripheral part of the circuit board 2 on the upper surface of the peripheral part of the opening 4a of the pallet 4 has been described. The present embodiment is not limited only to such a case. Instead of such a case, for example, an adhesive sheet is disposed between the peripheral portion of the opening 4a of the pallet 4 and the peripheral portion of the circuit board 2, and with the adhesive force by the adhesive sheet, The case where the arrangement position of the circuit board 2 on the pallet 4 is held may be used. This is because by using the adhesive sheet in this manner, it is possible to reliably prevent the displacement of the arrangement position of the circuit board 2 when the pallet 4 is conveyed.

  Even when the adhesive sheet is used as described above, the placement surface 11a of the stage 11 is positioned above the upper surface of the pallet 4 by the height dimension D as shown in FIG. By performing the heat treatment in the state, the adhesive force between the circuit board 2 and the pallet 4 can be released or weakened. Therefore, even if the circuit board 2 is stretched due to heat, the circuit board 2 It is possible to reliably prevent wrinkles, slack, warping, etc. from occurring. However, as such an adhesive sheet, it is preferable to use a sheet having ease of peeling as much as possible. In addition, as such height dimension D, it can be set as the dimension of about 0.5 mm, for example. Further, since the height dimension D is provided in this way, even if the pallet 4 is warped or bent due to heat during the heat treatment, the influence is given to the circuit board 2. There is also an effect that this can be prevented.

  In the above description, the case where the electronic component 1 is mounted in advance in the component bonding region of the circuit board 2 has been described, but the present embodiment is not limited to such a case. Instead of such a case, for example, a weak heat-resistant electronic component in addition to the electronic component 1 may be mounted or bonded to the first surface 2a of the circuit board 2. Here, the weak heat-resistant electronic component is an electronic component having a heat resistance lower than that of the electronic component 1, and includes, for example, an electronic component such as a CCD, a CMOS, or an optical pick component.

  As described above, in the case where the electronic component 1 and the weak heat resistant electronic component are mixed in the circuit board 2, the mounting region (or joining region) of the weak heat resistant electronic component is an opening in the pallet 4. It is preferable to form each opening 4a in the pallet 4 so that the part 4a is disposed on the part where the part 4a is not formed and the component mounting region R1 of the electronic component 1 is disposed above the opening 4a.

  By using the pallet 4 formed in this way, when the contact heating by the stage 11 is performed, the contact heating can be surely performed on the component mounting region of the electronic component 1, while the weak heat resistance described above. It is possible to make it difficult to transfer heat due to the contact heat transfer to the mounting region of the electronic component. Therefore, the electronic component 1 can be reliably bonded to the circuit board 2 by heating and melting of the solder, and it is possible to reliably prevent the weak heat-resistant electronic component from being thermally affected during the bonding. can do.

  In the above description, each pressing pin 31 that presses the first surface 2a of the circuit board 2 has been described as having a pin-like shape. Can be applied.

  For example, the shape of the abutting end portion 31a of the pressing pin 31 can be a shape that planarly presses the circuit board 2 or a shape that presses the circuit board 2 at a point. For example, in the case of adopting a planar pressing shape, the pressure for pressing the circuit board 2 can be dispersed without concentrating on one point, and the surface of the circuit board 2 is damaged by the pressing. This can be surely prevented. On the other hand, for example, in the case of adopting a shape that presses at a point, the amount of heat that escapes from the circuit board 2 to the pressing pin 31 by the contact can be reduced, and efficient heating of the circuit board 2 can be achieved. Can be realized. Examples of the shape that can be pressed at such a point include a spherical shape and a sharp end shape.

  It is also preferable to arrange a heat insulating member at the contact end portion 31a of the pressing pin 31 so as to reduce the amount of heat that escapes from the circuit board 2 to the pressing pin 31 by contact. The conditions required for the contact end 31a of the pressing pin 31 include heat resistance, wear resistance, and solvent resistance.

  Here, some conditions will be described below in determining the place where the circuit board 2 is pressed by the respective pressing pins 31.

  First, as a general rule, it is important to hold down the place where the stage 11 is placed by the stage 11a. That is, the pressing by the pressing pins 31 is intended to reliably prevent the occurrence of warping or bending that may occur in the circuit board 2 by bringing the circuit board 2 into close contact with the mounting surface 11a when heating the circuit board 2. This is because

Next, on the surface where the circuit board 2 is in contact with the mounting surface 11 a of the stage 11, it is preferable to hold each corner portion, near the center, or the like, for example, 0.1 locations / cm ² or more with respect to the contact area. . This is because by pressing in this way, the circuit board 2 can be pressed more uniformly, which leads to prevention of warpage and the like.

  Moreover, it is preferable to hold down a location that is, for example, 1 mm or more away from the solder 3 that is the final heating target disposed in the component bonding region of the circuit board 2. This is because, when pressed close to the solder 3, a heat amount escapes from the circuit board 2 to the pressing pin 31, and sufficient and efficient heating may not be performed.

  Further, in the circuit board 2, it is preferable that the portion where the wiring pattern is formed is not pressed by the pressing pin 31. Such a wiring pattern is often formed of, for example, a copper foil. Since such a material is a material having a relatively high heat transfer coefficient, the amount of heat transferred to the circuit board 2 is suppressed and the pin 31 is pressed. It is because it is easy to escape.

  Here, the configuration of the circuit board 2 used in the present embodiment will be described. First, a schematic cross-sectional view of the circuit board 2 used in this embodiment is shown in FIG. As shown in FIG. 19, the circuit board 2 is formed of a base material layer 2A on which circuit patterns and terminal electrodes are formed, and a material having a thermal expansion coefficient different from that of the base material layer 2A. And a reinforcing material layer 2B that structurally reinforces the structure.

  The base material layer 2A is formed in a thin film shape by, for example, polyimide, and the reinforcing material layer 2B is formed of a resin material with a sufficiently large thickness dimension with respect to the base material layer 2A. The reinforcing material layer 2B is generally called a backing layer.

  Since the circuit board 2 having such a structure has such a laminated structure, when heated, the circuit board 2 is warped or bent due to the difference in thermal expansion coefficient between the two layers. Probability is high. Therefore, the circuit board 2 having such a structure can be bonded while suppressing the occurrence of the warpage and the bending by applying the electronic component bonding method of the present embodiment.

  Next, a circuit board 52 as shown in FIG. 20 can be used in the bonding method of the present embodiment. As shown in FIG. 20, the circuit board 52 has a laminated structure of a base material layer 52A and a reinforcing material layer 52B, similar to the laminated circuit board 2 shown in FIG. In that respect, the circuit board 2 has a different structure. As shown in FIG. 20, a portion from which the reinforcing material layer 52 </ b> B is partially removed is formed near the approximate center of the circuit board 52. This portion is a bent portion 53, and the base material layer 52 </ b> A is bent at the bent portion 53, so that the circuit board 52 can be bent. As the circuit board 52 having such a bent portion 53, for example, there is a circuit board to which an optical pick component or the like is bonded.

  In the case where the circuit board 52 having such characteristics is heated and melted by the stage 11, it is preferable that at least a portion where the bent portion 53 is formed is pressed by the pressing pin 31. . That is, since the reinforcing material layer 52B is not partially formed in the bent portion 53, the base material layer 52A is likely to be bent due to heat. Of course, instead of such a case, a plurality of locations such as the vicinity of the bent portion 53 may be pressed by the pressing pin 31.

  In the above description, a case where a plurality of circuit boards 2, for example, four circuit boards 2 are arranged and supported on the pallet 4 has been described. Even in the case where a single circuit board 2 is disposed, the bonding method of the present embodiment can be applied. In the pallet 4, the case where one opening 4 a is used for one circuit board 2 has been described. However, such an opening 4 a can be used for one circuit board 2. It may be a case where multiple places are used. Also, the shape of the opening 4a is not limited to the case where it is formed in a substantially square shape as described above, and various other shapes can be applied.

  In the above description, the state in which the contact end 31a of each pressing pin 31 is in contact with the first surface 2a of the circuit board 2 before the stage 11 is raised, that is, the stage 11 The case where almost no pressing force is applied to the circuit board 2 has been described before the rise, but the present embodiment is not limited to such a case. Instead of such a case, for example, there is a possibility that a pressing force is applied to the circuit board 2 by the contact end portions 31a of the respective pressing pins 31 before the stage 11 is lifted, and the circuit board 2 is generated. It may be a case where a certain warp or the like is corrected. This is because the circuit board 2 can be held in a state where the warp is corrected.

  According to the above embodiment, the following various effects can be obtained.

  First, in the circuit board 2, when only the component mounting region R <b> 1 is partially heated to join the electronic component 1 mounted in the region, this corresponds to the component mounting region R <b> 1 of the circuit board 2. The circuit board 2 is placed on the stage 11 so that the region of the second face 2b is in contact with the placement face 11a of the stage 11, and the circuit board 2 is placed on the stage 11 by a plurality of pressing pins 31. By performing contact heating through the stage 11 while being pressed against the mounting surface 11a, it is possible to reliably prevent the circuit board 2 from being warped or bent due to heat during the heating. it can.

  Further, such a circuit board 2 is arranged and supported on the pallet 4 and is transported. When the circuit board 2 is placed on the placement surface 11a of the stage 11, the pallet The circuit board 2 is lifted slightly above the upper surface of the circuit board 4 so that the circuit board 2 is lifted slightly above the upper surface, thereby releasing the support of the circuit board 2 by the pallet 4 (or being hardly supported). State). In such a state, when the circuit board 2 is heated while being pressed by the respective pressing pins 31, even if the circuit board 2 is stretched by heat, the end portion of the circuit board 2 supports the pallet 4. Therefore, it is possible to effectively prevent the circuit board 2 from being bent or the like.

  Further, in the electronic component joining apparatus 101, the pallet 4 carried into the heat treatment position is first held so as to be sandwiched from the upper surface and the lower surface thereof, so that the pallet 4 can be transferred in the process of conveyance or the like. Even in the case where the curve or the warp is generated in 4, it can be held so as to correct the curve or the like. Further, by holding the pallet 4 as described above, the subsequent holding of the circuit board 2 can be surely performed while maintaining higher flatness.

  Further, in the case where the circuit board 2 to be handled in the electronic component bonding apparatus 101 is a multilayer circuit board 2, such local heating is performed by the laminated structure, Although it is considered that the occurrence of warping or bending becomes a more prominent problem, the above-described heating is performed while holding the mounting posture on the mounting surface 11a with respect to the circuit board 2 as described above. Generation | occurrence | production of curvature etc. can be suppressed and the highly accurate electronic component 1 can be joined.

  Even in the case where the circuit board is a circuit board 52 having a bent portion 53, the circuit board 52 is warped by performing heat treatment while holding the bent portion 53 with the holding pin 31. And bending can be suppressed.

  It is to be noted that, by appropriately combining arbitrary embodiments of the various embodiments described above, the effects possessed by them can be produced.

1 is a schematic cross-sectional view illustrating a configuration of an electronic component bonding apparatus according to an embodiment of the present invention. It is a model perspective view which shows the pallet which conveys the circuit board handled in the said electronic component joining apparatus. It is AA sectional view taken on the line of the pallet in the conveyance state of FIG. It is a model perspective view of the board | substrate heating apparatus in the said electronic component joining apparatus. In the said electronic component joining apparatus, it is a partial schematic cross section which shows the mounting state to the stage of a circuit board. It is a flowchart which shows the procedure of the joining method of the electronic component in the said electronic component joining apparatus. It is a schematic cross section explaining the procedure of the joining method of the electronic component in the said electronic component joining apparatus, Comprising: It is a figure which shows a pallet carrying state. It is a schematic cross section explaining the procedure of the joining method, and is a view showing a state where the pallet is supported. It is a schematic cross section explaining the procedure of the above-mentioned joining method, and is a figure showing the state where the upper surface of a circuit board is pressed down. It is a schematic cross section explaining the procedure of the joining method, and is a diagram showing a state where the circuit board is placed by raising the stage. It is a schematic cross section explaining the procedure of the joining method, and is a view showing a state in which adsorption holding is performed on a mounted circuit board and heating and melting are started. It is a schematic cross section explaining the procedure of the above-mentioned joining method, and is a figure showing the state where cooling blow was started. It is a schematic cross section explaining the procedure of the above-mentioned joining method, and is a figure showing the state where adsorption holding to a circuit board was canceled. It is a schematic cross section explaining the procedure of the joining method, and is a view showing a state where the stage is lowered. It is a schematic cross-sectional view for explaining the procedure of the joining method, and is a view showing a state in which each pressing pin is raised and the pressing on the circuit board is released. It is a schematic cross section explaining the procedure of the joining method, and is a diagram showing a state in which the holding of the pallet is released. It is a schematic cross section explaining the procedure of the above-mentioned joining method, and is a figure showing the state where cooling blow was stopped. It is a schematic cross section explaining the procedure of the joining method, and is a view showing a state where the pallet is being carried out. It is a schematic cross section which shows the structure of the circuit board handled in the said electronic component joining apparatus. It is a schematic cross section which shows the structure of another kind of circuit board handled in the said electronic component joining apparatus. It is a schematic cross-sectional view for explaining a conventional method of joining electronic components, (a) is a diagram showing a state in which the electronic components are normally joined, (b) is a state in which the circuit board is bent (C) is a figure which shows the state which the curve produced in the pallet.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component 2 Circuit board 2a 1st surface 2b 2nd surface 2A Base material layer 2B Reinforcement material layer 3 Solder 4 Pallet 5 Conveying rail 10 Substrate heating device 11 Stage 11a Mounting surface 11b Suction hole 12 Heater 13 Stage raising / lowering Device 20 Pallet holding device 21 Pallet upper surface defining pin 22 Pallet pushing pin 30 Substrate holding device 31 Holding pin 32 Holding pin lifting device 30 Cooling blow device R1 Component bonding area D Height dimension 101 Electronic component bonding device

Claims (12)

The circuit board on which the plurality of electronic components are mounted in the component bonding region on the first surface with the bonding material interposed therebetween is partially from the second surface which is the surface opposite to the first surface. In the electronic component bonding apparatus for bonding the respective electronic components to the circuit board by heating and melting the bonding material by heating, and then cooling and solidifying,
The second surface of the circuit board is disposed on the upper surface, and an opening that exposes a region in the second surface corresponding to the component bonding region in the disposed state, and a periphery of the region of the second surface A pallet support posture holding device for supporting the substrate transport pallet having a support portion for supporting the circuit board at a top surface and a bottom surface, and releasably holding the support posture;
The second surface region corresponding to the component joining region can be placed on the circuit board supported by the substrate transport pallet in a state where the support posture is held by the pallet support posture holding device. The mounting member and the mounting member can be moved up and down, and the circuit board is mounted on the mounting member by raising the mounting member through the opening, and the circuit board by the substrate transport pallet A substrate heating apparatus comprising: a mounting member lifting / lowering unit that releases support; and a heating unit that heats the mounting member and heats the circuit board in a state of being mounted on the mounting member;
When the circuit board placed on the placement member and supported by the board transport pallet is released by the heating unit, the circuit board is placed on the placement member from the first surface. An electronic component bonding apparatus comprising: a substrate mounting posture holding device that presses and holds the mounting posture of the circuit board.   The mounting height position of the circuit board by the mounting member of the substrate heating device is higher than the supporting height position of the circuit board by the substrate transport pallet in a state of being supported by the pallet support posture holding device. The electronic component joining apparatus according to claim 1, which is positioned. The substrate mounting posture holding device is
A pressing member capable of pressing the circuit board in a region on the first surface corresponding to the mounting region on the mounting member on the second surface of the circuit board;
3. The electronic device according to claim 1, further comprising: a pressing member elevating unit that can move up and down the pressing member and presses the circuit board against the placement unit by the pressing member by lowering the pressing member. Component joining device.   The pressing member is a plurality of pressing pins that are rod-shaped members, and the plurality of pressing pins in the respective pressing pins are in a region corresponding to the placement region on the first surface of the circuit board, The electronic component bonding apparatus according to claim 3, wherein a corner of the region excluding the component bonding region or the vicinity of the corner can be pressed.   5. The at least one pressing pin is capable of pressing substantially the vicinity of the region excluding the component joining region in a region corresponding to the placement region on the first surface of the circuit board. Electronic component joining device.   Each of the pressing pins is supported by a pressing member elevating part via an elastic member, and variation in the pressing height position of the circuit board in each pressing pin can be absorbed by each of the elastic members. The electronic component joining apparatus according to 4 or 5.   The said board | substrate mounting attitude | position holding apparatus presses the said circuit board by the said press member so that generation | occurrence | production of the curvature by heat transfer may be suppressed in the case of the partial heating of the said circuit board by the said heating part. The electronic component joining apparatus according to any one of 3 to 6.   The electronic component joining apparatus according to claim 1, further comprising a suction device that is connected to the placement member and sucks and holds the circuit board that is placed on the placement member. The circuit board includes a base material layer on which a circuit pattern or a terminal is formed, and a reinforcing material layer that is formed of a material having a coefficient of thermal expansion different from that of the base material layer and structurally reinforces the base material layer. A circuit board comprising:
Along with the heat transfer to the circuit board, the board mounting posture holding device suppresses the occurrence of warpage caused by the difference in coefficient of thermal expansion between the base material layer and the reinforcing material layer. The electronic component bonding apparatus according to claim 1, wherein the mounting posture is maintained. In the component bonding region on the first surface, the circuit board on which a plurality of electronic components are mounted with the bonding material interposed therebetween is heated from the second surface, which is the surface opposite to the first surface. In the electronic component bonding method for bonding each of the electronic components to the circuit board by heating and melting the bonding material, and then cooling and solidifying the bonding material,
The second surface of the circuit board is disposed on the upper surface, and an opening that exposes a region in the second surface corresponding to the component bonding region in the disposed state, and a periphery of the region of the second surface For the substrate transport pallet having a support part for supporting the circuit board at, the support posture is held from the upper surface and the lower surface so that the support posture can be released,
With respect to the circuit board supported by the board transport pallet, the placement member is placed through the opening while placing the second surface area corresponding to the component joining area on the placement surface of the placement member. To release the support of the circuit board by the board transport pallet and press the circuit board against the mounting surface from the first surface to maintain the mounting posture of the circuit board. And
The circuit board is partially heated through the mounting member in a state where the mounting posture is maintained, whereby the joining member is heated and melted, and the respective electronic components are attached to the circuit board. An electronic component joining method comprising joining.   The mounting height position of the circuit board by the mounting member is positioned higher than the supporting height position of the circuit board by the substrate transport pallet in the state where the supporting posture is maintained. The electronic component joining method described. The pressing against the first surface of the circuit board causes the component bonding region to be moved in the region on the first surface corresponding to the mounting region on the mounting portion on the second surface of the circuit board. The electronic component joining method according to claim 10 or 11, wherein the electronic component joining method is performed by pressing a plurality of positions including a corner of a region to be excluded or the vicinity of the corner.

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