JP2005047123A - Screen printing equipment and screen printing method - Google Patents

Screen printing equipment and screen printing method Download PDF

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JP2005047123A
JP2005047123A JP2003280728A JP2003280728A JP2005047123A JP 2005047123 A JP2005047123 A JP 2005047123A JP 2003280728 A JP2003280728 A JP 2003280728A JP 2003280728 A JP2003280728 A JP 2003280728A JP 2005047123 A JP2005047123 A JP 2005047123A
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substrate
carrier
screen printing
wafer
held
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JP4013860B2 (en
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Takaaki Sakagami
隆昭 坂上
Masayuki Mantani
正幸 萬谷
Kunihiko Tokita
邦彦 時田
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide screen printing equipment which enables a thin substrate to be stably held by a carrier, and a screen printing method. <P>SOLUTION: In screen printing, a mask plate abuts on a wafer 9 held by the plate-like carrier 8, so that cream solder can be printed on a semiconductor device 9a. In a conveyance process for conveying the wafer 9 with the carrier 8, a holding member 10 is placed on the wafer 9, and the wafer 9 is pressed against the carrier 8 by self-weight of the holding member 10, so that warping deformation of the wafer 9 can be corrected. This enables the thin easy-to-bend wafer 9 to be stably held by the carrier 8. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、半導体ウェハなどの薄型の基板にクリーム半田や導電性ペーストなどのペーストを印刷するスクリーン印刷装置およびスクリーン印刷方法に関するものである。   The present invention relates to a screen printing apparatus and a screen printing method for printing paste such as cream solder or conductive paste on a thin substrate such as a semiconductor wafer.

電子部品製造分野においては、基板上にクリーム半田や導電性ペーストなどのペーストを印刷する方法としてスクリーン印刷が広く用いられている。このスクリーン印刷は、電子部品が実装される実装基板のみならず、複数の半導体素子が作り込まれた半導体ウェハなどの薄型の基板をも対象として行われる(例えば特許文献1参照)。
特開2000−103031号公報
In the electronic component manufacturing field, screen printing is widely used as a method for printing paste such as cream solder or conductive paste on a substrate. This screen printing is performed not only on a mounting substrate on which electronic components are mounted, but also on a thin substrate such as a semiconductor wafer in which a plurality of semiconductor elements are formed (see, for example, Patent Document 1).
JP 2000-103031 A

ところで近年半導体ウェハは薄型化しており、キャリアに保持されて搬送される状態において反り変形を生じやすくなっている。この反り変形の度合いが大きくなると、キャリアに装着した状態において半導体ウェハがキャリア上面から部分的に浮き上がる現象が発生する。そしてこのように半導体ウェハが浮き上がったままキャリアがスクリーン印刷装置内に搬入されると、半導体ウェハがキャリアから外れたり、マスクプレートの下面と接触して破損するなどの不具合が生じる場合がある。   By the way, in recent years, semiconductor wafers have been made thinner, and are likely to be warped and deformed while being held by a carrier and transported. When the degree of warpage deformation increases, a phenomenon occurs in which the semiconductor wafer partially floats from the upper surface of the carrier when mounted on the carrier. If the carrier is carried into the screen printing apparatus while the semiconductor wafer is lifted in this way, there may be a problem that the semiconductor wafer is detached from the carrier or is damaged by being in contact with the lower surface of the mask plate.

そこで本発明は、薄型の基板をキャリアに安定して保持させることができるスクリーン印刷装置およびスクリーン印刷方法を提供することを目的とする。   Accordingly, an object of the present invention is to provide a screen printing apparatus and a screen printing method that can stably hold a thin substrate on a carrier.

本発明のスクリーン印刷装置は、パターン孔が設けられたマスクプレートを板状のキャリアに保持された薄型の基板に当接させ、マスクプレート上にペーストを供給してスキージを摺動させることにより、前記パターン孔を介して前記基板にペーストを印刷するスクリーン印刷装置であって、前記マスクプレートの下方に配設された基板位置決め部と、この基板位置決め部に設けられ前記キャリアに保持された基板を下受けして吸着保持する基板保持部と、この基板保持部に前記基板を前記キャリアとともに搬入しまた基板保持部から前記基板を前記キャリアとともに搬出する基板搬送手段と、この基板搬送手段による搬送過程において前記基板上に錘部材を載置して当該基板を前記キャリアに錘部材の自重により押し付けて基板の反り変形を矯正する変形矯正手段と、前記錘部材を前記キャリア上から除去しまた載置キャリア上に載置する錘移載手段とを備えた。   In the screen printing apparatus of the present invention, a mask plate provided with a pattern hole is brought into contact with a thin substrate held by a plate-like carrier, a paste is supplied onto the mask plate, and a squeegee is slid. A screen printing apparatus for printing a paste on the substrate through the pattern hole, comprising: a substrate positioning portion disposed below the mask plate; and a substrate provided on the substrate positioning portion and held by the carrier A substrate holding unit that receives and holds the substrate by suction, a substrate transfer unit that carries the substrate into the substrate holding unit together with the carrier, and carries the substrate together with the carrier from the substrate holding unit, and a transfer process by the substrate transfer unit The substrate is warped and deformed by placing a weight member on the substrate and pressing the substrate against the carrier by its own weight. A deformation correcting means for correcting, and a weight transfer means for placing the weight member on removal and also placed carriers from the said carrier.

本発明のスクリーン印刷方法は、パターン孔が設けられたマスクプレートを板状のキャリアに保持された薄型の基板に当接させ、マスクプレート上にペーストを供給してスキージを摺動させることにより、前記パターン孔を介して前記基板にペーストを印刷するスクリーン印刷方法であって、前記マスクプレートの下方に配設された基板位置決め部に設けられた基板保持部に前記キャリアに保持された基板を下受けして吸着保持する基板保持工程と、前記基板を吸着保持した状態でスクリーン印刷を実行する印刷工程と、前記基板保持部に前記基板を前記キャリアとともに搬入しまた基板保持部から前記基板を前記キャリアとともに搬出する基板搬送工程とを含み、この基板搬送工程において前記基板上に錘部材を載置して当該基板を前記キャリアに錘部材の自重により押し付けて基板の反り変形を矯正する。   In the screen printing method of the present invention, a mask plate provided with a pattern hole is brought into contact with a thin substrate held by a plate-like carrier, a paste is supplied onto the mask plate, and a squeegee is slid. A screen printing method for printing a paste on the substrate through the pattern hole, wherein the substrate held by the carrier is placed on a substrate holding portion provided in a substrate positioning portion disposed below the mask plate. A substrate holding step for receiving and holding the substrate, a printing step for executing screen printing in a state where the substrate is held by suction, and carrying the substrate together with the carrier into the substrate holding unit and removing the substrate from the substrate holding unit. A substrate carrying step for carrying out the carrier together with the carrier. Against by the weight of the weight member to correct the warp of the substrate to the rear.

本発明によれば、キャリアに保持された基板を基板保持部によって下受けして吸着保持した状態で印刷を実行し、基板をキャリアとともに搬送する基板搬送工程において、基板上に錘部材を載置して当該基板をキャリアに錘部材の自重により押し付けて基板の反り変形を矯正することにより、薄型の基板をキャリアに安定して保持させることができる。   According to the present invention, printing is performed in a state where the substrate held by the carrier is received and held by the substrate holding unit, and the weight member is placed on the substrate in the substrate transfer step of transferring the substrate together with the carrier. Then, by pressing the substrate against the carrier by the weight of the weight member and correcting the warp deformation of the substrate, the thin substrate can be stably held on the carrier.

次に本発明の実施の形態を図面を参照して説明する。図1は本発明の一実施の形態のスクリーン印刷装置の正面図、図2は本発明の一実施の形態のスクリーン印刷装置の側面図、図3は本発明の一実施の形態のスクリーン印刷装置の平面図、図4は本発明の一実施の形態のスクリーン印刷装置の基板キャリアおよび下受け部の斜視図、図5,図6,図7,図8,図9は本発明の一実施の形態のスクリーン印刷方法の工程説明図である。   Next, embodiments of the present invention will be described with reference to the drawings. 1 is a front view of a screen printing apparatus according to an embodiment of the present invention, FIG. 2 is a side view of the screen printing apparatus according to an embodiment of the present invention, and FIG. 3 is a screen printing apparatus according to an embodiment of the present invention. FIG. 4 is a perspective view of a substrate carrier and a lower receiving portion of a screen printing apparatus according to an embodiment of the present invention, and FIGS. 5, 6, 7, 8, and 9 are embodiments of the present invention. It is process explanatory drawing of the screen printing method of form.

まず図1、図2,図3を参照してスクリーン印刷装置の構造を説明する。図1において、スクリーン印刷装置は、スクリーン印刷部11の下方に基板位置決め部1を配設して構成されている。基板位置決め部1は、Y軸テーブル2、X軸テーブル3およびθ軸テーブル4を段積みし、更にその上にZ軸テーブル5を載置して構成されている。Z軸テーブル5上には下受部6が配設されている。下受部6は、印刷対象の薄型の基板である半導体ウェハ9(以下、単に「ウェハ9」と略記する。)を、このウェハ9を保持したキャリア8とともに下受けする。キャリア8はクランパ7によって両端部を挟み込まれることによって水平方向の位置が保持される。   First, the structure of the screen printing apparatus will be described with reference to FIGS. In FIG. 1, the screen printing apparatus is configured by arranging a substrate positioning unit 1 below a screen printing unit 11. The substrate positioning unit 1 is configured by stacking a Y-axis table 2, an X-axis table 3, and a θ-axis table 4, and further placing a Z-axis table 5 thereon. A lower receiving part 6 is disposed on the Z-axis table 5. The receiving unit 6 receives a semiconductor wafer 9 (hereinafter simply abbreviated as “wafer 9”), which is a thin substrate to be printed, together with a carrier 8 holding the wafer 9. The carrier 8 is held in the horizontal position by sandwiching both ends thereof by the clamper 7.

ここで図4を参照して、ウェハ9、キャリア8および下受部6について説明する。ウェハ9には複数の半導体素子9aが格子状に作り込まれており、半導体素子9aの回路形成面に設けられた外部接続用の電極9bがスクリーン印刷によってクリーム半田を供給する印刷対象となる。   Here, with reference to FIG. 4, the wafer 9, the carrier 8, and the receiving part 6 are demonstrated. A plurality of semiconductor elements 9a are formed in a lattice shape on the wafer 9, and an external connection electrode 9b provided on the circuit forming surface of the semiconductor element 9a is a printing target to supply cream solder by screen printing.

キャリア8は矩形の板状部材であり、キャリア8の中央には断面が段付形状(図4(b)参照)の開口部8aが設けられている。開口部8aには上面側から円形のウェハ9が面一状態で嵌合し、下面側からは下受部6の上面に設けられた凸部6aが嵌合する形状となっている。   The carrier 8 is a rectangular plate-like member, and an opening 8 a having a stepped cross section (see FIG. 4B) is provided at the center of the carrier 8. A circular wafer 9 is fitted to the opening 8a from the upper surface side in a flush state, and a convex portion 6a provided on the upper surface of the receiving portion 6 is fitted from the lower surface side.

下受部6による下受け状態においては、図4(b)に示すように、凸部6aの上面がウェハ9の下面側に当接し、下受部6本体の上面がキャリア8の下面に当接する。凸部6a、下受部6本体のそれぞれの上面には吸着孔6b、6cが設けられており、吸着孔6b、6cは真空吸引手段6dに接続されている。真空吸引手段6dを駆動して吸着孔6b、6cから真空吸引することにより、ウェハ9,キャリア8は下受部6によって真空吸着により保持される。下受部6は、基板位置決め部1に設けられキャリア8に保持されたウェハ9を下受けして吸着保持する基板保持部となっている。   In the receiving state by the receiving portion 6, as shown in FIG. 4B, the upper surface of the convex portion 6 a abuts the lower surface side of the wafer 9, and the upper surface of the body of the receiving portion 6 contacts the lower surface of the carrier 8. Touch. Adsorption holes 6b and 6c are provided on the upper surfaces of the convex part 6a and the lower receiving part 6 main body, and the adsorption holes 6b and 6c are connected to the vacuum suction means 6d. By driving the vacuum suction means 6d and vacuum suction from the suction holes 6b, 6c, the wafer 9 and the carrier 8 are held by the lower portion 6 by vacuum suction. The receiving unit 6 is a substrate holding unit that is provided in the substrate positioning unit 1 and receives and holds the wafer 9 held by the carrier 8 by suction.

ウェハ9はキャリア8の開口部8a内に装着された状態で搬入コンベア17によって搬入され、印刷コンベア18に受け渡されて下受部6上に載置される。そして印刷後のキャリア8は搬出コンベア19によって搬出される。搬入コンベア17,印刷コンベア18および搬出コンベア19は、下受部6にウェハ9をキャリア8とともに搬入しまた下受部6からウェハ9をキャリア8とともに搬出する基板搬送手段を構成する。   The wafer 9 is loaded by the carry-in conveyor 17 in a state of being mounted in the opening 8 a of the carrier 8, transferred to the printing conveyor 18, and placed on the lower receiving unit 6. Then, the printed carrier 8 is carried out by the carry-out conveyor 19. The carry-in conveyor 17, the print conveyor 18, and the carry-out conveyor 19 constitute a substrate carrying means for carrying the wafer 9 into the receiving unit 6 together with the carrier 8 and carrying out the wafer 9 from the receiving unit 6 together with the carrier 8.

この基板搬送手段による搬送過程においては、錘部材であるリング状の押さえ部材10をキャリア8の上面に載置して、ウェハ9の外縁部を押さえ部材10の自重によってキャリア8に押し付ける。これにより、薄くて撓みやすいウェハ9の反り変形を矯正することができる。すなわち、錘部材である押さえ部材10は、基板搬送手段による搬送過程においてウェハ9をキャリア8に対して押し付けてウェハ9の反り変形を矯正する変形矯正手
段となっている。
In the transfer process by the substrate transfer means, the ring-shaped pressing member 10 that is a weight member is placed on the upper surface of the carrier 8, and the outer edge portion of the wafer 9 is pressed against the carrier 8 by the weight of the pressing member 10. Thereby, the warp deformation of the thin and easily bent wafer 9 can be corrected. That is, the pressing member 10 that is a weight member is a deformation correcting unit that presses the wafer 9 against the carrier 8 in the transfer process by the substrate transfer unit to correct the warp deformation of the wafer 9.

基板位置決め部1の上方には、スクリーン印刷部11が配設されている。スクリーン印刷部11は、ホルダ枠に展張されたマスクプレート12を備えている。マスクプレート12上にはスキージユニット13が配設されており、スキージユニット13は図示しない移動手段によりY方向に移動する。スキージユニット13のプレート14にはスキージ昇降機構15が設けられており、スキージ昇降機構15はスキージ16を上下動させる。   A screen printing unit 11 is disposed above the substrate positioning unit 1. The screen printing unit 11 includes a mask plate 12 extended on a holder frame. A squeegee unit 13 is disposed on the mask plate 12, and the squeegee unit 13 is moved in the Y direction by a moving means (not shown). The plate 14 of the squeegee unit 13 is provided with a squeegee lifting mechanism 15 that moves the squeegee 16 up and down.

キャリア8に保持されたウェハ9をマスクプレート12の下面に当接させた状態で、ペーストであるクリーム半田をマスクプレート12上に供給してスキージ16を摺動させることにより、図示しないパターン孔を介してウェハ9の各半導体素子9aに設けられた接続用電極9bにはクリーム半田が印刷される。   In a state where the wafer 9 held on the carrier 8 is in contact with the lower surface of the mask plate 12, cream solder as paste is supplied onto the mask plate 12 and the squeegee 16 is slid to form pattern holes (not shown). Then, cream solder is printed on the connection electrodes 9 b provided on the respective semiconductor elements 9 a of the wafer 9.

マスクプレート12の上方には、カメラ20が設けられている。図3に示すように、カメラ20はX軸テーブル21およびY軸テーブル22によってXY方向に水平移動する。カメラ20はウェハ9に設けられた認識マークを撮像する。そして撮像により得られた画像データに基づいて各認識マークの位置が検出される。この位置検出結果に基づいてウェハ9とマスクプレート12との位置合わせが行われる。   A camera 20 is provided above the mask plate 12. As shown in FIG. 3, the camera 20 is horizontally moved in the XY directions by the X-axis table 21 and the Y-axis table 22. The camera 20 images the recognition mark provided on the wafer 9. And the position of each recognition mark is detected based on the image data obtained by imaging. Based on the position detection result, the wafer 9 and the mask plate 12 are aligned.

図2において、スクリーン印刷部11の右側方には、押さえ部材移載機構23が配設されている。押さえ部材移載機構23は、押さえ部材10を吸着保持可能な吸着パッド26を備えた吸着ヘッド25を、昇降機構24によって昇降自在に保持した構成となっている。   In FIG. 2, a pressing member transfer mechanism 23 is disposed on the right side of the screen printing unit 11. The pressing member transfer mechanism 23 has a configuration in which a suction head 25 including a suction pad 26 capable of sucking and holding the pressing member 10 is held by a lifting mechanism 24 so as to be lifted and lowered.

ウェハ9を保持したキャリア8が押さえ部材移載機構23の下方に移動することにより、予め吸着パッド26に保持した押さえ部材10をキャリア8上に載置する。また、押さえ部材10が載置された状態のキャリア9を押さえ部材移載機構23の下方に移動させることにより、押さえ部材10をキャリア9から除去することができる。したがって、押さえ部材移載機構23は、錘部材である押さえ部材10をキャリア9上から除去しまたキャリア9上に載置する錘移載手段となっている。   The carrier 8 holding the wafer 9 moves below the holding member transfer mechanism 23, whereby the holding member 10 held in advance by the suction pad 26 is placed on the carrier 8. In addition, the holding member 10 can be removed from the carrier 9 by moving the carrier 9 on which the holding member 10 is placed below the holding member transfer mechanism 23. Therefore, the pressing member transfer mechanism 23 is a weight transfer means for removing the pressing member 10 that is a weight member from the carrier 9 and placing it on the carrier 9.

このスクリーン印刷装置は上記のように構成されており、以下スクリーン印刷方法について、図5〜図9を参照して説明する。まず印刷対象のウェハ9はキャリア8に装着され、次いでキャリア8上には押さえ部材10が載置される。これにより、薄くて撓みやすく反り変形状態にあったウェハ9の反り変形が矯正され、ウェハ9は正常な平面状態でキャリア8に装着される。   This screen printing apparatus is configured as described above. Hereinafter, a screen printing method will be described with reference to FIGS. First, the wafer 9 to be printed is mounted on the carrier 8, and then the pressing member 10 is placed on the carrier 8. As a result, the warp deformation of the wafer 9 which is thin and easy to bend and warped is corrected, and the wafer 9 is mounted on the carrier 8 in a normal flat state.

図5(a)は、ウェハ9が装着され上面に押さえ部材10が載置されたキャリア8が基板位置決め部1上に搬入され、下受部6によって下受けされた状態を示している。そしてこの状態で下受部6の吸着孔6b、6cから真空吸引することにより、ウェハ9およびキャリア8は下受部6によって吸着保持される。このとき、ウェハ9の反り変形を押さえ部材10によって矯正した状態で真空吸引することにより、ウェハ9を確実に下受け面にならわせて正しい平面度で吸着保持することができる。   FIG. 5A shows a state in which the carrier 8 having the wafer 9 mounted thereon and the pressing member 10 placed on the upper surface is loaded onto the substrate positioning unit 1 and received by the lower receiving unit 6. In this state, the wafer 9 and the carrier 8 are sucked and held by the lower receiving part 6 by vacuum suction from the suction holes 6 b and 6 c of the lower receiving part 6. At this time, vacuum suction is performed in a state where the warpage deformation of the wafer 9 is corrected by the pressing member 10, so that the wafer 9 can be reliably sucked and held at the correct flatness along the bearing surface.

次いで、基板位置決め部1のY軸テーブル2を駆動して、図5(b)に示すようにキャリア8を押さえ部材移載機構23の下方に移動させる。次いで図6(a)に示すように、昇降機構24を駆動して吸着ヘッド25を下降させ、吸着パッド26によって押さえ部材10を吸着したならば、図6(b)に示すように、吸着ヘッド25を上昇させて押さえ部材10をキャリア8から除去する。   Next, the Y-axis table 2 of the substrate positioning unit 1 is driven to move the carrier 8 below the pressing member transfer mechanism 23 as shown in FIG. Next, as shown in FIG. 6A, when the lifting mechanism 24 is driven to lower the suction head 25 and the holding member 10 is sucked by the suction pad 26, as shown in FIG. 25 is raised and the pressing member 10 is removed from the carrier 8.

この後、図7(a)に示すように、基板位置決め部1のY軸テーブル2を駆動して、押さえ部材10を除去した後のキャリア8をマスクプレート12の下方に移動させる。次いでクリーム半田をウェハ9に印刷する印刷動作が行われる。すなわち、図7(b)に示すようにZ軸テーブル5を駆動して、キャリア8とともにウェハ9をクリーム半田27が供給されたマスクプレート12の下面に当接させ、マスクプレート12の上面でスキージ16をY方向に摺動させる。これにより、マスクプレート12のパターン孔にクリーム半田が充填され、この後ウェハ9をキャリア8とともに下降させてマスクプレート12から離隔させることにより、ウェハ9へのクリーム半田の印刷が完了する。   Thereafter, as shown in FIG. 7A, the Y-axis table 2 of the substrate positioning unit 1 is driven, and the carrier 8 after the pressing member 10 is removed is moved below the mask plate 12. Next, a printing operation for printing the cream solder on the wafer 9 is performed. That is, as shown in FIG. 7B, the Z-axis table 5 is driven to bring the wafer 9 together with the carrier 8 into contact with the lower surface of the mask plate 12 to which the cream solder 27 is supplied. 16 is slid in the Y direction. As a result, the cream solder is filled in the pattern holes of the mask plate 12, and thereafter the wafer 9 is lowered together with the carrier 8 and separated from the mask plate 12, thereby completing the printing of the cream solder on the wafer 9.

そしてスクリーン印刷を終えたならば、図8(a)に示すように、基板位置決め部1のY軸テーブル2を駆動して、キャリア8を押さえ部材移載機構23の下方に移動させる。次いで昇降機構24を駆動して押さえ部材10を保持した吸着ヘッド25を下降させ、図8(b)に示すように、押さえ部材10をキャリア8上に再び載置する。   When the screen printing is finished, as shown in FIG. 8A, the Y-axis table 2 of the substrate positioning unit 1 is driven to move the carrier 8 below the pressing member transfer mechanism 23. Next, the lifting mechanism 24 is driven to lower the suction head 25 holding the pressing member 10, and the pressing member 10 is placed on the carrier 8 again as shown in FIG. 8B.

そしてこの後、図9に示すように、印刷後のウェハ9を保持したキャリア9は搬入・搬出位置に戻り、次いで下受部6による真空吸着が解除される。この吸着解除の状態においても、キャリア8上には押さえ部材10が載置されてウェハ9をキャリア8に押し付けていることから、ウェハが再び反り変形を生じることがなく、正しい平面状態を維持したまま、搬出コンベア19(図3)によって搬出される。   Then, as shown in FIG. 9, the carrier 9 holding the printed wafer 9 returns to the loading / unloading position, and the vacuum suction by the lower receiving portion 6 is then released. Even in this suction release state, since the pressing member 10 is placed on the carrier 8 and the wafer 9 is pressed against the carrier 8, the wafer is not warped and deformed again, and the correct plane state is maintained. It is carried out by the carry-out conveyor 19 (FIG. 3).

すなわち、上述のスクリーン印刷方法は、マスクプレート12の下方に配設された基板位置決め部1に設けられた下受部6にキャリア8に保持されたウェハ9を下受けして吸着保持する基板保持工程と、ウェハ9を吸着保持した状態でスクリーン印刷を実行する印刷工程と、下受部6にウェハ9をキャリア8とともに搬入しまた下受部6からウェハ9をキャリア8とともに搬出する基板搬送工程とを含み、この基板搬送工程においてウェハ9をキャリア8に対して押し付けてウェハ9の反り変形を矯正する形態となっている。そして、反り変形の矯正は、ウェハ9上に押さえ部材10を載置してこのウェハ9をキャリア8に自重により押し付けることにより行われる。   That is, in the above-described screen printing method, the substrate holding is performed such that the wafer 9 held by the carrier 8 is received and sucked and held by the receiving portion 6 provided in the substrate positioning portion 1 disposed below the mask plate 12. A step of carrying out screen printing with the wafer 9 being sucked and held, and a substrate transfer step of carrying the wafer 9 together with the carrier 8 into the receiving unit 6 and carrying out the wafer 9 together with the carrier 8 from the receiving unit 6 In this substrate transfer step, the wafer 9 is pressed against the carrier 8 to correct the warp deformation of the wafer 9. Then, the warp deformation is corrected by placing the pressing member 10 on the wafer 9 and pressing the wafer 9 against the carrier 8 by its own weight.

このように、ウェハ9の搬送過程において、反り変形を矯正することにより、変形を生じやすい薄型のウェハを対象とする場合にあっても、ウェハをキャリアに安定して保持することができる。したがって、キャリアに装着した状態においてウェハがキャリア上面から部分的に浮き上がったままスクリーン印刷部に搬入されることによって生じるウェハの外れや、浮き上がったウェハがマスクプレートと接触することのよって生じるウェハの破損などの不具合を防止することができる。   As described above, by correcting the warp deformation in the process of transporting the wafer 9, even when a thin wafer that is likely to be deformed is targeted, the wafer can be stably held on the carrier. Therefore, when the wafer is mounted on the carrier, the wafer is detached when the wafer is partially lifted from the upper surface of the carrier and is carried into the screen printing unit, or the wafer is damaged when the lifted wafer comes into contact with the mask plate. And other problems can be prevented.

本発明のスクリーン印刷装置およびスクリーン印刷方法は、薄型の基板をキャリアに安定して保持させることができるという効果を有し、半導体ウェハなどの薄型の基板にクリーム半田や導電性ペーストなどのペーストを印刷するスクリーン印刷の分野に利用できる。   INDUSTRIAL APPLICABILITY The screen printing apparatus and the screen printing method of the present invention have an effect that a thin substrate can be stably held on a carrier, and paste such as cream solder or conductive paste is applied to a thin substrate such as a semiconductor wafer. Available in the field of screen printing, printing.

本発明の一実施の形態のスクリーン印刷装置の正面図1 is a front view of a screen printing apparatus according to an embodiment of the present invention. 本発明の一実施の形態のスクリーン印刷装置の側面図The side view of the screen printing apparatus of one embodiment of this invention 本発明の一実施の形態のスクリーン印刷装置の平面図The top view of the screen printing apparatus of one embodiment of this invention (a)本発明の一実施の形態のスクリーン印刷装置の基板キャリアおよび下受け部の斜視図 (b)本発明の一実施の形態のスクリーン印刷装置の基板キャリアおよび下受け部の部分断面図(A) Perspective view of substrate carrier and lower receiving part of screen printing apparatus according to one embodiment of the present invention (b) Partial sectional view of the substrate carrier and lower receiving part of the screen printing apparatus of one embodiment of the present invention 本発明の一実施の形態のスクリーン印刷方法の工程説明図Process explanatory drawing of the screen printing method of one embodiment of this invention 本発明の一実施の形態のスクリーン印刷方法の工程説明図Process explanatory drawing of the screen printing method of one embodiment of this invention 本発明の一実施の形態のスクリーン印刷方法の工程説明図Process explanatory drawing of the screen printing method of one embodiment of this invention 本発明の一実施の形態のスクリーン印刷方法の工程説明図Process explanatory drawing of the screen printing method of one embodiment of this invention 本発明の一実施の形態のスクリーン印刷方法の工程説明図Process explanatory drawing of the screen printing method of one embodiment of this invention

符号の説明Explanation of symbols

1 基板位置決め部
6 下受け部
8 キャリア
9 ウェハ
10 押さえ部材
11 スクリーン印刷部
12 マスクプレート
13 スキージユニット
23 押さえ部材移載機構
DESCRIPTION OF SYMBOLS 1 Substrate positioning part 6 Bottom receiving part 8 Carrier 9 Wafer 10 Holding member 11 Screen printing part 12 Mask plate 13 Squeegee unit 23 Holding member transfer mechanism

Claims (2)

パターン孔が設けられたマスクプレートを板状のキャリアに保持された薄型の基板に当接させ、マスクプレート上にペーストを供給してスキージを摺動させることにより、前記パターン孔を介して前記基板にペーストを印刷するスクリーン印刷装置であって、前記マスクプレートの下方に配設された基板位置決め部と、この基板位置決め部に設けられ前記キャリアに保持された基板を下受けして吸着保持する基板保持部と、この基板保持部に前記基板を前記キャリアとともに搬入しまた基板保持部から前記基板を前記キャリアとともに搬出する基板搬送手段と、この基板搬送手段による搬送過程において前記基板上に錘部材を載置して当該基板を前記キャリアに錘部材の自重により押し付けて基板の反り変形を矯正する変形矯正手段と、前記錘部材を前記キャリア上から除去しまた載置キャリア上に載置する錘移載手段とを備えたことを特徴とするスクリーン印刷装置。   A mask plate provided with a pattern hole is brought into contact with a thin substrate held by a plate-like carrier, and a paste is supplied onto the mask plate to slide a squeegee so that the substrate is inserted through the pattern hole. A screen printing apparatus for printing a paste on a substrate, a substrate positioning portion disposed below the mask plate, and a substrate that is provided on the substrate positioning portion and is held by the carrier and sucked and held A holding unit; substrate transfer means for carrying the substrate into the substrate holding unit together with the carrier; and unloading the substrate from the substrate holding unit together with the carrier; and a weight member on the substrate in the transfer process by the substrate transfer means. Deformation correcting means for correcting the warp deformation of the substrate by placing and pressing the substrate against the carrier by the weight of the weight member; Screen printing apparatus, wherein a member provided with a weight transfer means for mounting on removing also placed carriers from the said carrier. パターン孔が設けられたマスクプレートを板状のキャリアに保持された薄型の基板に当接させ、マスクプレート上にペーストを供給してスキージを摺動させることにより、前記パターン孔を介して前記基板にペーストを印刷するスクリーン印刷方法であって、前記マスクプレートの下方に配設された基板位置決め部に設けられた基板保持部に前記キャリアに保持された基板を下受けして吸着保持する基板保持工程と、前記基板を吸着保持した状態でスクリーン印刷を実行する印刷工程と、前記基板保持部に前記基板を前記キャリアとともに搬入しまた基板保持部から前記基板を前記キャリアとともに搬出する基板搬送工程とを含み、この基板搬送工程において前記基板上に錘部材を載置して当該基板を前記キャリアに錘部材の自重により押し付けて基板の反り変形を矯正することを特徴とするスクリーン印刷方法。   A mask plate provided with a pattern hole is brought into contact with a thin substrate held by a plate-like carrier, and a paste is supplied onto the mask plate to slide a squeegee so that the substrate is inserted through the pattern hole. A screen printing method for printing paste on a substrate, wherein the substrate held by the substrate is held by a substrate holding portion provided in a substrate positioning portion disposed below the mask plate, and held by suction A step of performing screen printing in a state where the substrate is sucked and held, and a substrate transporting step of carrying the substrate together with the carrier into the substrate holding unit and carrying out the substrate together with the carrier from the substrate holding unit. In this substrate transfer step, a weight member is placed on the substrate, and the substrate is pushed onto the carrier by its own weight. Only by screen printing method characterized by correcting the warp deformation of the substrate.
JP2003280728A 2003-07-28 2003-07-28 Screen printing apparatus and screen printing method Expired - Fee Related JP4013860B2 (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009154354A (en) * 2007-12-26 2009-07-16 Panasonic Corp Screen printing device/method and substrate retaining device/method
JP2013173294A (en) * 2012-02-27 2013-09-05 Dainippon Screen Mfg Co Ltd Pattern transferring apparatus
KR101449363B1 (en) * 2014-02-10 2014-10-10 (주)육일씨엔에쓰 Method for printing on touch window glass of smart phone and device therefor
WO2018051495A1 (en) * 2016-09-16 2018-03-22 富士機械製造株式会社 Substrate correction method and substrate correction system

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009154354A (en) * 2007-12-26 2009-07-16 Panasonic Corp Screen printing device/method and substrate retaining device/method
JP2013173294A (en) * 2012-02-27 2013-09-05 Dainippon Screen Mfg Co Ltd Pattern transferring apparatus
KR101449363B1 (en) * 2014-02-10 2014-10-10 (주)육일씨엔에쓰 Method for printing on touch window glass of smart phone and device therefor
WO2018051495A1 (en) * 2016-09-16 2018-03-22 富士機械製造株式会社 Substrate correction method and substrate correction system
JPWO2018051495A1 (en) * 2016-09-16 2019-06-27 株式会社Fuji Substrate correction method, substrate correction system

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